Bandwidth testing device and method

Abstract

The invention discloses a bandwidth testing device and method. The bandwidth testing device comprises a control module, an emission analysis module, a direct current power supply module, a photoelectric conversion module and a probe module. The control module is used for sending output signals to the emission analysis module and the direct-current power supply module; the direct-current power supply module is used for controlling the n direct-current output ends to output direct-current signals to the emission analysis module; the emission analysis module is used for outputting a test signal and sending the test signal and the DC signal to the probe module; the probe module is used for transmitting the test signal and the direct current signal to n to-be-tested chips in the to-be-tested optical emission assembly electrically connected with the probe module; the photoelectric conversion module is used for receiving optical signals output when the to-be-tested chips receive the test signals and the direct current signals, converting the optical signals into corresponding electric signals and then sending the electric signals to the emission analysis module. According to the invention, the testing time of the to-be-tested optical emission assembly can be reduced, and the testing efficiency of the to-be-tested optical emission assembly is improved.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to a bandwidth testing device and method. Background Art

[0002] Optical transmitter components are used to output optical signals and are important components in optical fiber communications and optical fiber sensing. 3dB bandwidth is the core technical indicator of optical transmitter components and requires strict testing during product development and production.

[0003] However, the existing bandwidth testing device can only perform bandwidth testing on one chip to be tested in the optical transmission component at a time, and has the disadvantages of complex testing method and low testing efficiency. Summary of the invention

[0004] The present invention provides a bandwidth testing device and method, which can reduce the testing time of an optical emission component to be tested and improve the testing efficiency of the optical emission component to be tested.

[0005] According to one aspect of the present invention, a bandwidth test device is provided, the bandwidth test device comprising: a control module, an emission analysis module, a DC power supply module, a photoelectric conversion module and a probe module;

[0006] The control module is electrically connected to the emission analysis module and the DC power supply module, and the control module is used to send output signals to the emission analysis module and the DC power supply module;

[0007] The DC power supply module includes n DC output terminals, and the n DC output terminals are electrically connected to the emission analysis module. The DC power supply module is used to control the n DC output terminals to output DC signals to the emission analysis module when receiving the output signal; wherein n is greater than 1 and is an integer;

[0008] The emission analysis module is electrically connected to the probe module, and the emission analysis module is used to output a test signal when receiving the output signal, and send the test signal and the DC signal to the probe module;

[0009] The probe module includes n pins, which correspond to n chips to be tested in the optical emission component to be tested and are electrically connected to the n chips to be tested in the optical emission component to be tested; the probe module is used to transmit the test signal and the DC signal to the n chips to be tested in the optical emission component to be tested which are electrically connected to the probe module;

[0010] The photoelectric conversion module is electrically connected to the emission analysis module, and the photoelectric conversion module is used to receive the optical signal output by each chip under test when it receives the test signal and the DC signal, and convert the optical signal into a corresponding electrical signal and then send the electrical signal to the emission analysis module;

[0011] The transmission analysis module is also used to determine the modulation bandwidth of each chip under test according to the electrical signal corresponding to each chip under test.

[0012] Optionally, the bandwidth test device provided in this embodiment further includes an optical attenuation module and a test bench module;

[0013] The optical attenuation module is used to receive the optical signal output by each chip under test, and transmit the light intensity in the optical signal to the photoelectric conversion module after attenuation;

[0014] The test bench module is used to carry and fix the light emitting component to be tested;

[0015] The control module is electrically connected to the test bench module, and the control module is used to control the moving direction of the test bench module.

[0016] Optionally, the bandwidth testing device provided in this embodiment further includes an n-channel array optical fiber;

[0017] The emission analysis module includes an n-channel vector network analyzer and n bias devices; the photoelectric conversion module includes n photoelectric conversion units; the optical attenuation module includes n input terminals and n output terminals;

[0018] The n-channel vector network analyzer comprises a control terminal, n output terminals and n input terminals;

[0019] The control end of the n-channel vector network analyzer is electrically connected to the control module, the n output ends of the n-channel vector network analyzer are electrically connected to the signal input ends of the n bias devices in a one-to-one correspondence, and the n input ends of the n-channel vector network analyzer are electrically connected to the n photoelectric conversion units in a one-to-one correspondence;

[0020] The DC input ends of the n bias devices are electrically connected to the n DC output ends in a one-to-one correspondence; the signal output ends of the n bias devices are electrically connected to the probe module;

[0021] The n-channel optical fiber array is electrically connected to the n input ends of the optical attenuation module, and the n-channel optical fiber array is used to receive the optical signals output by the n chips to be tested, and transmit the optical signals output by the n chips to be tested to the n input ends of the optical attenuation module;

[0022] The n output ends of the light attenuation module are electrically connected to the input ends of the n photoelectric conversion units in a one-to-one correspondence.

[0023] Optionally, the probe module includes a probe unit; the probe unit includes n pins;

[0024] The signal output ends of the n bias devices are all electrically connected to the input end of the probe unit in the probe module.

[0025] Optionally, the bandwidth testing device provided in this embodiment further includes n optical fibers and n lenses;

[0026] The transmission analysis module includes a single-channel vector network analyzer, a signal conversion unit and n bias devices;

[0027] The single-channel vector network analyzer includes a control end, an output end and an input end;

[0028] The signal conversion unit includes a control end, an input end and n output ends;

[0029] The optical attenuation module includes n input terminals and one output terminal;

[0030] The control end of the single-channel vector network analyzer is electrically connected to the control module, the output end of the single-channel vector network analyzer is electrically connected to the input end of the signal conversion unit; the input end of the single-channel vector network analyzer is electrically connected to the photoelectric conversion module;

[0031] The n output terminals of the signal conversion unit are electrically connected to the n signal input terminals of the bias devices in a one-to-one correspondence;

[0032] The DC input ends of the n bias devices are electrically connected to the n DC output ends in a one-to-one correspondence; the signal output ends of the n bias devices are electrically connected to the probe module;

[0033] The control module is electrically connected to the control end of the signal conversion unit. The control module is used to control the input end of the signal conversion unit to be connected to the i-th output end of the signal conversion unit. When the single-channel vector network analyzer receives the electrical signal corresponding to the chip to be tested, the control module controls the input end of the signal conversion unit to switch from being connected to the i-th output end of the signal conversion unit to being connected to the i+1-th output end of the signal conversion unit, where i is less than n and i is a positive integer.

[0034] Optionally, the probe module includes n probe units;

[0035] Each of the probe units includes a pin;

[0036] The signal output ends of the n bias devices are electrically connected to the input ends of the n probe units in a one-to-one correspondence.

[0037] Optionally, the control module includes a signal control unit and a test bench control unit;

[0038] The test bench control unit is electrically connected to the test bench module and the signal control unit, and the test bench control unit is used to control the moving direction of the test bench module and send a working signal to the signal control unit after moving the direction of the test bench module;

[0039] The signal control unit is electrically connected to the emission analysis module and the DC power supply module, and is used to send an output signal to the emission analysis module and the DC power supply module when receiving the working signal.

[0040] Optionally, the bandwidth testing device provided in this embodiment further includes a plurality of radio frequency cables;

[0041] The output end of the n-channel vector network analyzer is electrically connected to the signal input end of the bias device through the radio frequency cable;

[0042] The signal output end of the bias device is electrically connected to the probe module through the radio frequency cable;

[0043] The input end of the n-channel vector network analyzer is electrically connected to the photoelectric conversion unit through the radio frequency cable.

[0044] Optionally, the bandwidth testing device provided in this embodiment further includes a plurality of radio frequency cables;

[0045] The output end of the single-channel vector network analyzer is electrically connected to the input end of the signal conversion unit through the radio frequency cable;

[0046] The output end of the signal conversion unit is electrically connected to the signal input end of the bias device through the radio frequency cable;

[0047] The signal output end of the bias device is electrically connected to the probe module through the radio frequency cable;

[0048] The input end of the single-channel vector network analyzer is electrically connected to the photoelectric conversion module through the radio frequency cable.

[0049] According to another aspect of the present invention, a bandwidth testing method is provided, and the bandwidth testing method is applied to the bandwidth testing device provided in any embodiment of the present invention;

[0050] The bandwidth testing method comprises:

[0051] The control module sends an output signal to the emission analysis module and the DC power supply module;

[0052] When receiving the output signal, the DC power supply module controls the n DC output terminals to output DC signals to the emission analysis module; wherein n is greater than 1 and is an integer;

[0053] The transmission analysis module outputs a test signal upon receiving the output signal, and sends the test signal and the DC signal to the probe module;

[0054] The probe module transmits the test signal and the DC signal to n chips to be tested in the optical emission assembly to be tested which is electrically connected to the probe module;

[0055] The photoelectric conversion module receives the optical signal output by each chip under test when it receives the test signal and the DC signal, converts the optical signal into a corresponding electrical signal, and then sends the electrical signal to the emission analysis module;

[0056] The transmission analysis module determines the modulation bandwidth of each chip under test according to the electrical signal corresponding to each chip under test.

[0057] The present embodiment provides a bandwidth test device, which includes a control module, an emission analysis module, a DC power supply module, a photoelectric conversion module and a probe module. The probe module includes n pins, and the n pins correspond to and are electrically connected to the n chips to be tested in the optical emission component to be tested. The control module can send an output signal to the emission analysis module and the DC power supply module, and the DC power supply module is used to control the n DC output terminals to output a DC signal to the emission analysis module when receiving the output signal. The emission analysis module is used to output a test signal when receiving the output signal, and couple the DC signal sent by the DC power supply module with the test signal and send it to the n chips to be tested through the n pins in the probe module at the same time, or send it to the n chips to be tested through the n pins in the probe module in sequence. Under the condition that the relative position of the probe module and the optical emission component to be tested remains unchanged, the emission analysis module can perform a bandwidth test on the n chips to be tested after outputting a test signal once, and there is no need to send n test signals when performing a bandwidth test on the n chips to be tested, and there is no need to change the relative position of the probe module and the optical emission component to be tested n times when performing a bandwidth test on the n chips to be tested. In summary, the bandwidth testing device provided in this embodiment can reduce the testing time of the optical transmission component to be tested and improve the testing efficiency of the optical transmission component to be tested.

[0058] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0060] Figure 1 is a schematic structural diagram of a bandwidth testing device provided according to an embodiment of the present invention;

[0061] Figure 2 is a structural schematic diagram of another bandwidth testing device provided according to an embodiment of the present invention;

[0062] Figure 3 is a structural schematic diagram of another bandwidth testing device provided according to an embodiment of the present invention;

[0063] Figure 4 is a schematic structural diagram of a probe module provided according to an embodiment of the present invention;

[0064] Figure 5 is a structural schematic diagram of another bandwidth testing device provided according to an embodiment of the present invention;

[0065] Figure 6 The figure is a flow chart of a bandwidth testing method provided according to an embodiment of the present invention. DETAILED DESCRIPTION

[0066] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0067] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0068] Figure 1 is a schematic diagram of a bandwidth testing device provided according to an embodiment of the present invention, with reference to Figure 1 The bandwidth test device 100 provided in this embodiment includes: a control module 110, an emission analysis module 120, a DC power supply module 130, a photoelectric conversion module 140 and a probe module 150; the control module 110 is electrically connected to the emission analysis module 120 and the DC power supply module 130, and the control module 110 is used to send an output signal to the emission analysis module 120 and the DC power supply module 130; the DC power supply module 130 includes n DC output terminals S1, and the n DC output terminals S1 are electrically connected to the emission analysis module 120, and the DC power supply module 130 is used to control the n DC output terminals S1 to output a DC signal to the emission analysis module 120 when receiving the output signal; wherein n is greater than 1 and n is an integer; the emission analysis module 120 is electrically connected to the probe module 150, and the emission analysis Module 120 is used to output a test signal when receiving an output signal, and send the test signal and the DC signal to the probe module 150; the probe module 150 includes n pins, and the n pins correspond one-to-one to the n chips to be tested in the optical emission component 200 to be tested and are electrically connected at the same time; the probe module 150 is used to transmit the test signal and the DC signal to the n chips to be tested that are electrically connected to the probe module 150; the photoelectric conversion module 140 is electrically connected to the emission analysis module 120, and the photoelectric conversion module 140 is used to receive the optical signal output by each chip to be tested when receiving the test signal and the DC signal, and convert the optical signal into a corresponding electrical signal and then send the electrical signal to the emission analysis module 120; the emission analysis module 120 is also used to determine the modulation bandwidth of each chip to be tested according to the electrical signal corresponding to each chip to be tested.

[0069] Specifically, the optical emission component to be tested 200 includes a plurality of chips to be tested, and the probe module 150 is electrically connected to n chips to be tested in the optical emission component to be tested 200 at the same time. The optical emission component to be tested may be a wafer. The chip to be tested may be a laser chip. n may be 2, 3, 4 or 5, etc.

[0070] The emission analysis module 120 is used to receive the DC signal output by the n DC output terminals S1, that is, the n input terminals in the emission analysis module 120 correspond to the n DC output terminals S1 one by one and receive the DC signal output by the corresponding DC output terminals S1. The emission analysis module 120 is used to output a test signal when receiving the output signal output by the control module 110, and couple the test signal and the DC signal and send them to the n chips to be tested through the probe module 150. The DC signal in the test signal and the DC signal received by the chip to be tested can make the chip to be tested emit light. The test signal can be a small AC signal, which can detect the modulation bandwidth of the chip to be tested and has little effect on the chip to be tested. The modulation bandwidth can be a 3dB bandwidth.

[0071] The emission analysis module 120 keeps outputting the test signal when receiving the output signal, and the DC power supply module 130 keeps outputting the DC signal when receiving the output signal. Since the n pins in the probe module 150 correspond to the n chips to be tested one by one and are electrically connected, under the condition that the relative position of the probe module 150 and the optical emission component 200 to be tested remains unchanged, the coupled test signal and the DC signal output by the emission analysis module 120 can be simultaneously sent to the n chips to be tested through the probe module 150. The emission analysis module 120 can also first send the coupled test signal and the DC signal to one chip to be tested through one pin in the probe module 150, and then send the coupled test signal and the DC signal to another chip to be tested through another pin in the probe module 150, until the n chips to be tested receive the test signal and the DC signal.

[0072] After receiving the test signal and the DC signal, the chip under test will emit light to generate an optical signal. After receiving the optical signal output by the chip under test, the photoelectric conversion module 140 can convert the optical signal into an electrical signal. When n chips under test output optical signals at the same time, the photoelectric conversion module 140 can simultaneously convert the optical signals corresponding to the n chips under test into electrical signals and send them to the emission analysis module 120. When the emission analysis module 120 simultaneously receives the electrical signals corresponding to the n chips under test, it can simultaneously determine the modulation bandwidths of the n chips under test.

[0073] The present embodiment provides a bandwidth test device, which includes a control module, an emission analysis module, a DC power supply module, a photoelectric conversion module and a probe module. The probe module includes n pins, and the n pins correspond to and are electrically connected to the n chips to be tested in the optical emission component to be tested. The control module can send an output signal to the emission analysis module and the DC power supply module, and the DC power supply module is used to control the n DC output terminals to output a DC signal to the emission analysis module when receiving the output signal. The emission analysis module is used to output a test signal when receiving the output signal, and couple the DC signal sent by the DC power supply module with the test signal and send it to the n chips to be tested through the n pins in the probe module at the same time, or send it to the n chips to be tested through the n pins in the probe module in sequence. Under the condition that the relative position of the probe module and the optical emission component to be tested remains unchanged, the emission analysis module can perform a bandwidth test on the n chips to be tested after outputting a test signal once, and there is no need to send n test signals when performing a bandwidth test on the n chips to be tested, and there is no need to change the relative position of the probe module and the optical emission component to be tested n times when performing a bandwidth test on the n chips to be tested. In summary, the bandwidth testing device provided in this embodiment can reduce the testing time of the optical transmission component to be tested and improve the testing efficiency of the optical transmission component to be tested.

[0074] Optional, Figure 2 is a schematic diagram of the structure of another bandwidth testing device provided according to an embodiment of the present invention, referring to Figure 2 The bandwidth testing device provided in this embodiment also includes an optical attenuation module 160 and a test bench module 170; the optical attenuation module 160 is used to receive the optical signal output by each chip to be tested, and transmit the light intensity in the optical signal to the photoelectric conversion module 140 after attenuation; the test bench module 170 is used to carry and fix the optical emitting component 200 to be tested; the control module 110 is electrically connected to the test bench module 170, and the control module 110 is used to control the moving direction of the test bench module 170.

[0075] Specifically, the control module 110 may also be electrically connected to the optical attenuation module 160, and the control module 110 may also be used to control the intensity of the optical signal attenuated by the optical attenuation module 160. The optical attenuation module 160 may reduce the light intensity in the optical signal output by the chip under test, and transmit the optical signal with the attenuated light intensity to the photoelectric conversion module 140, thereby preventing the photoelectric conversion module 140 from being saturated or damaged when a high-intensity optical signal directly enters the photoelectric conversion module 140.

[0076] When performing bandwidth testing, the optical emission component to be tested is fixed on the test bench module 170 to prevent the chip to be tested from moving during the test. After the modulation bandwidth test of the n chips to be tested is completed, the control module 110 can move the position of the test bench module 170 so that the relative position of the optical emission component to be tested 200 and the probe module 150 changes, and finally the n pins in the probe module 150 are electrically connected to the other n chips to be tested, so that the emission analysis module 120 can perform modulation bandwidth test on the other n chips to be tested.

[0077] Optional, Figure 3 is a schematic diagram of the structure of another bandwidth testing device provided according to an embodiment of the present invention, referring to Figure 3 The bandwidth test device further comprises an n-channel array optical fiber 180; the emission analysis module 120 comprises an n-channel vector network analyzer 121 and n bias devices 122; the photoelectric conversion module 140 comprises n photoelectric conversion units 141; the optical attenuation module 160 comprises n input terminals and n output terminals; the n-channel vector network analyzer 121 comprises a control terminal, n output terminals and n input terminals; the control terminal of the n-channel vector network analyzer 121 is electrically connected to the control module 110, the n output terminals of the n-channel vector network analyzer 121 are electrically connected to the signal input terminals of the n bias devices 122 in a one-to-one correspondence, and the n-channel vector network analyzer 1 The n input ends of the n-channel array optical fiber 180 are electrically connected to the n-photoelectric conversion units 141 in a one-to-one correspondence; the DC input ends of the n-channel bias devices 122 are electrically connected to the n-channel DC output ends S1 in a one-to-one correspondence; the signal output ends of the n-channel bias devices 122 are electrically connected to the probe module 150; the n-channel array optical fiber 180 is electrically connected to the n-channel input ends of the optical attenuation module 160, and the n-channel array optical fiber 180 is used to receive the optical signals output by the n-channel chips to be tested, and transmit the optical signals output by the n-channel chips to be tested to the n-channel input ends of the optical attenuation module 160, and the n-channel output ends of the optical attenuation module 160 are electrically connected to the input ends of the n-channel photoelectric conversion units 141 in a one-to-one correspondence.

[0078] Specifically, the bias device 122 may be a T-type bias device. The n-channel optical fiber array 180 includes n optical fibers, which correspond to n chips under test one by one, and each optical fiber is used to transmit the optical signal output by the corresponding chip under test to the input end of the corresponding optical attenuation module 160 .

[0079] The control module 110 is used to send an output signal to the control end of the n-channel vector network analyzer 121. The n-channel vector network analyzer 121 is used to control the n output ends of the n-channel vector network analyzer 121 to output test signals to the corresponding electrically connected bias devices 122 when receiving the output signal. The n bias devices 122 are all used to receive DC signals and test signals. The n bias devices 122 can simultaneously send the DC signals and the test signals to the probe module 150. The n pins in the probe module 150 can simultaneously transmit the DC signals and the test signals to the n chips to be tested. The n-channel array optical fiber 180 can simultaneously receive the optical signals output by the n chips to be tested, and simultaneously transmit the optical signals output by the n chips to be tested to the optical attenuation module 160. The optical attenuation module 160 can simultaneously attenuate the optical intensity of the optical signals output by the n chips to be tested and simultaneously transmit them to the n photoelectric conversion units 141. The n photoelectric conversion units 141 convert the corresponding optical signals into n electrical signals and transmit them to the n-channel vector network analyzer 121. The n-channel vector network analyzer 121 can simultaneously determine the modulation bandwidths of the n chips to be tested based on the n electrical signals. It can be seen that the bandwidth testing device provided in this embodiment can simultaneously perform bandwidth testing on the n chips to be tested when the n-channel vector network analyzer 121 outputs a test signal, which can reduce the testing hours of the optical emitting components to be tested and improve the testing efficiency of the optical emitting components to be tested.

[0080] Optional, Figure 4 is a schematic diagram of the structure of a probe module provided according to an embodiment of the present invention, with reference to Figure 4 The probe module includes a probe unit 151; the probe unit 151 includes n pins 152; combined with reference Figure 3 The signal output ends of the n bias devices 122 are all electrically connected to the input ends of the probe units 151 in the probe module 150 .

[0081] Specifically, a probe unit 151 includes n pins 152. After the input end of the probe unit 151 receives the DC signal and the test signal transmitted by n bias devices 122, the n DC signals and the test signals are simultaneously transmitted to the n pins 152, so that the n pins 152 can simultaneously transmit the DC signal and the test signal to n chips to be tested.

[0082] Optional, Figure 5 is a schematic diagram of the structure of another bandwidth testing device provided according to an embodiment of the present invention, referring to Figure 5The bandwidth test device also includes n optical fibers 181 and n lenses 182; the emission analysis module 120 includes a single-channel vector network analyzer 123, a signal conversion unit 124 and n bias devices 122; the single-channel vector network analyzer 123 includes a control end, an output end and an input end; the signal conversion unit 124 includes a control end, an input end and n output ends; the optical attenuation module 160 includes n input ends and one output end; the control end of the single-channel vector network analyzer 123 is electrically connected to the control module 110, and the output end of the single-channel vector network analyzer 123 is electrically connected to the input end of the signal conversion unit 124; the input end of the single-channel vector network analyzer 123 is electrically connected to the photoelectric conversion module 140; the n output ends of the signal conversion unit 124 The ends are electrically connected to the signal input ends of the n bias devices 122 in a one-to-one correspondence; the DC input ends of the n bias devices 122 are electrically connected to the n DC output ends S1 in a one-to-one correspondence; the signal output ends of the n bias devices 122 are electrically connected to the probe module; the control module 110 is electrically connected to the control end of the signal conversion unit 124, and the control module 110 is used to control the input end of the signal conversion unit 124 to be connected to the i-th output end of the signal conversion unit 124, and is also used to control the input end of the signal conversion unit 124 to switch from being connected to the i-th output end of the signal conversion unit 124 to being connected to the i+1-th output end of the signal conversion unit 124 when the single-channel vector network analyzer 123 receives the electrical signal corresponding to the chip to be tested, wherein i is less than n and i is a positive integer.

[0083] Specifically, when the control end of the single-channel vector network analyzer 123 receives the output signal, it outputs the test signal to the signal conversion unit 124. Under the control of the control module 110, only one output end of the signal conversion unit 124 outputs the test signal to the corresponding biaser 122 at a time. The biaser 122 is used to transmit the received DC signal and the test signal to the probe module. One pin in the probe module outputs the DC signal and the test signal to the corresponding chip to be tested. The chip to be tested outputs an optical signal to the corresponding lens 182. The lens 182 converges the optical signal and transmits it to the optical fiber 181 connected to the lens 182. The optical signal is transmitted to the optical attenuation module 160 through the optical fiber 181. The optical attenuation module 160 attenuates the light intensity of the optical signal and sends it to the photoelectric conversion module 140. The photoelectric conversion module 140 converts the attenuated optical signal into an electrical signal and transmits it to the single-channel vector network analyzer 123. When the single-channel vector network analyzer 123 receives the electrical signal, the control module 110 controls the input end of the signal conversion unit 124 to be connected to the other output end of the signal conversion unit 124. The signal conversion unit 124 can control the output direction of the test signal, that is, the signal conversion unit 124 can control the output of the test signal from the output terminal of the signal conversion unit 124. The control module 110 controls the input terminal of the signal conversion unit 124 to be connected with one of the n output terminals of the signal conversion unit 124. When the control module detects that the single-channel vector network analyzer 123 receives the electrical signal, the input terminal of the signal conversion unit 124 is controlled to be connected with another output terminal of the n output terminals of the signal conversion unit 124. At this time, the modulation bandwidth time of a chip under test can be calculated by the single-channel vector network analyzer 123 to send the test signal and the DC signal to another chip under test, without waiting for the single-channel vector network analyzer 123 to determine the modulation bandwidth of one chip under test before performing bandwidth test on another chip under test. It can be seen that in this embodiment, when the single-channel vector network analyzer 123 outputs a test signal once, the bandwidth test can be performed on n chips under test, which reduces the test time of the optical transmission component under test and improves the test efficiency of the optical transmission component under test.

[0084] Optional, continue to refer to Figure 5 The probe module includes n probe units 151 ; each probe unit 151 includes a pin; the signal output ends of the n bias devices 122 are electrically connected to the input ends of the n probe units 151 in a one-to-one correspondence.

[0085] Specifically, the signal conversion unit 124 has only one output terminal to output the test signal, only one bias device 122 among the n bias devices 122 can output the test signal and the DC signal, and only one pin among the n pins can output the test signal and the DC signal. In the bandwidth test device provided by this embodiment, only one chip under test receives the test signal and the DC signal at a time, but when the single-channel vector network analyzer 123 calculates the modulation bandwidth of one chip under test, it does not affect the reception of the test signal and the DC signal by another chip under test, thereby shortening the test time of the optical transmission component under test and improving the test efficiency of the optical transmission component under test.

[0086] Optional, continue to refer to Figure 3 or Figure 5 The control module 110 includes a signal control unit 111 and a test bench control unit 112; the test bench control unit 112 is electrically connected to the test bench module 170 and the signal control unit 111, and the test bench control unit 112 is used to control the moving direction of the test bench module 170, and send a working signal to the signal control unit 111 after moving in the direction of the test bench module 170; the signal control unit 111 is electrically connected to the emission analysis module 120 and the DC power supply module 130, and the signal control unit 111 is used to send an output signal to the emission analysis module 120 and the DC power supply module 130 when receiving the working signal.

[0087] Specifically, after the modulation bandwidth test of n chips to be tested is completed, the signal control unit 111 may send a moving signal to the test bench control unit 112. The test bench control unit 112 is used to control the test bench module 170 to move after receiving the moving signal so that the other n chips to be tested are electrically connected to the n pins in the probe module. When the other n chips to be tested are electrically connected to the n pins in the probe module, the test bench control unit 112 sends a working signal to the signal control unit 111. When the signal control unit 111 receives the working signal, it sends an output signal to the emission analysis module 120 and the DC power supply module 130, thereby starting to perform bandwidth testing on the other n chips to be tested. The signal control unit 111 is also electrically connected to the optical attenuation module 160. The signal control unit 111 is also used to control the intensity of the optical signal attenuated by the optical attenuation module 160.

[0088] Optional, continue to refer to Figure 3 The bandwidth test device further includes a plurality of radio frequency cables 191; the output end of the n-channel vector network analyzer 121 is electrically connected to the signal input end of the bias device 122 through the radio frequency cable 191; the signal output end of the bias device 122 is electrically connected to the probe module 150 through the radio frequency cable 191; the input end of the n-channel vector network analyzer 121 is electrically connected to the photoelectric conversion unit 141 through the radio frequency cable 191. The radio frequency cable can increase the transmission rate of the signal and reduce the transmission loss of the signal.

[0089] Optional, continue to refer to Figure 5 The bandwidth testing device also includes multiple RF cables; the output end of the single-channel vector network analyzer 123 is electrically connected to the input end of the signal conversion unit 124 through the RF cable 191; the output end of the signal conversion unit 124 is electrically connected to the signal input end of the bias device 122 through the RF cable 191; the signal output end of the bias device 122 is electrically connected to the probe module through the RF cable 191; the input end of the single-channel vector network analyzer 123 is electrically connected to the photoelectric conversion module 140 through the RF cable 191.

[0090] Optionally, the input end of the single-channel vector network analyzer 123 is electrically connected to the photoelectric conversion module through an adapter.

[0091] This embodiment also provides a bandwidth testing method, which is applied to the bandwidth testing device provided by any embodiment of the present invention.

[0092] Figure 6 is a flow chart of a bandwidth testing method provided according to an embodiment of the present invention, referring to Figure 6 The bandwidth testing method provided in this embodiment includes the following steps:

[0093] S110. The control module sends an output signal to the emission analysis module and the DC power supply module.

[0094] S120. When receiving the output signal, the DC power supply module controls n DC output terminals to output DC signals to the transmission analysis module; wherein n is greater than 1 and is an integer.

[0095] S130. The transmission analysis module outputs a test signal when receiving the output signal, and sends the test signal and the DC signal to the probe module.

[0096] S140, the probe module transmits the test signal and the DC signal to n chips to be tested in the optical emission assembly to be tested which is electrically connected to the probe module.

[0097] S150, the photoelectric conversion module receives the optical signal output by each chip under test when receiving the test signal and the DC signal, converts the optical signal into a corresponding electrical signal, and then sends the electrical signal to the emission analysis module.

[0098] S160 , the transmission analysis module determines the modulation bandwidth of each chip under test according to the electrical signal corresponding to each chip under test.

[0099] The bandwidth testing method provided in this embodiment has corresponding beneficial effects as the bandwidth testing device provided in any embodiment of the present invention. For technical details not detailed in this embodiment, please refer to the bandwidth testing device provided in any embodiment of the present invention.

[0100] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0101] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A bandwidth testing device, characterized in that: include: Control module, emission analysis module, DC power supply module, photoelectric conversion module and probe module; The control module is electrically connected to the emission analysis module and the DC power supply module, and the control module is used to send output signals to the emission analysis module and the DC power supply module; The DC power supply module includes n DC output terminals, and the n DC output terminals are electrically connected to the emission analysis module. The DC power supply module is used to control the n DC output terminals to output DC signals to the emission analysis module when receiving the output signal; wherein n is greater than 1 and is an integer; The emission analysis module is electrically connected to the probe module, and the emission analysis module is used to output a test signal when receiving the output signal, and send the test signal and the DC signal to the probe module; The probe module includes n pins, which correspond to n chips to be tested in the optical emission component to be tested and are electrically connected to the n chips to be tested in the optical emission component to be tested; the probe module is used to transmit the test signal and the DC signal to the n chips to be tested in the optical emission component to be tested which are electrically connected to the probe module; The photoelectric conversion module is electrically connected to the emission analysis module, and the photoelectric conversion module is used to receive the optical signal output by each chip under test when it receives the test signal and the DC signal, and convert the optical signal into a corresponding electrical signal and then send the electrical signal to the emission analysis module; The transmission analysis module is also used to determine the modulation bandwidth of each chip under test according to the electrical signal corresponding to each chip under test.

2. The bandwidth testing device according to claim 1, characterized in that: Also included are an optical attenuation module and a test bench module; The optical attenuation module is used to receive the optical signal output by each chip under test, and transmit the light intensity in the optical signal to the photoelectric conversion module after attenuation; The test bench module is used to carry and fix the light emitting component to be tested; The control module is electrically connected to the test bench module, and the control module is used to control the moving direction of the test bench module.

3. The bandwidth testing device according to claim 2, characterized in that: Also included is an n-channel array optical fiber; The emission analysis module includes an n-channel vector network analyzer and n bias devices; the photoelectric conversion module includes n photoelectric conversion units; the optical attenuation module includes n input terminals and n output terminals; The n-channel vector network analyzer comprises a control terminal, n output terminals and n input terminals; The control end of the n-channel vector network analyzer is electrically connected to the control module, the n output ends of the n-channel vector network analyzer are electrically connected to the signal input ends of the n bias devices in a one-to-one correspondence, and the n input ends of the n-channel vector network analyzer are electrically connected to the n photoelectric conversion units in a one-to-one correspondence; The DC input ends of the n bias devices are electrically connected to the n DC output ends in a one-to-one correspondence; the signal output ends of the n bias devices are electrically connected to the probe module; The n-channel optical fiber array is electrically connected to the n input ends of the optical attenuation module, and the n-channel optical fiber array is used to receive the optical signals output by the n chips to be tested, and transmit the optical signals output by the n chips to be tested to the n input ends of the optical attenuation module; The n output ends of the light attenuation module are electrically connected to the input ends of the n photoelectric conversion units in a one-to-one correspondence.

4. The bandwidth testing device according to claim 3, characterized in that: The probe module includes a probe unit; the probe unit includes n pins; The signal output ends of the n bias devices are all electrically connected to the input end of the probe unit in the probe module.

5. The bandwidth testing device according to claim 2, characterized in that: Also includes n optical fibers and n lenses; The transmission analysis module includes a single-channel vector network analyzer, a signal conversion unit and n bias devices; The single-channel vector network analyzer includes a control end, an output end and an input end; The signal conversion unit includes a control end, an input end and n output ends; The optical attenuation module includes n input terminals and one output terminal; The control end of the single-channel vector network analyzer is electrically connected to the control module, the output end of the single-channel vector network analyzer is electrically connected to the input end of the signal conversion unit; the input end of the single-channel vector network analyzer is electrically connected to the photoelectric conversion module; The n output terminals of the signal conversion unit are electrically connected to the n signal input terminals of the bias devices in a one-to-one correspondence; The DC input ends of the n bias devices are electrically connected to the n DC output ends in a one-to-one correspondence; the signal output ends of the n bias devices are electrically connected to the probe module; The control module is electrically connected to the control end of the signal conversion unit. The control module is used to control the input end of the signal conversion unit to be connected to the i-th output end of the signal conversion unit. When the single-channel vector network analyzer receives the electrical signal corresponding to the chip to be tested, the control module controls the input end of the signal conversion unit to switch from being connected to the i-th output end of the signal conversion unit to being connected to the i+1-th output end of the signal conversion unit, where i is less than n and i is a positive integer.

6. The bandwidth testing device according to claim 5, characterized in that: The probe module includes n probe units; Each of the probe units includes a pin; The signal output ends of the n bias devices are electrically connected to the input ends of the n probe units in a one-to-one correspondence.

7. The bandwidth testing device according to claim 2, characterized in that: The control module includes a signal control unit and a test bench control unit; The test bench control unit is electrically connected to the test bench module and the signal control unit, and the test bench control unit is used to control the moving direction of the test bench module and send a working signal to the signal control unit after moving the direction of the test bench module; The signal control unit is electrically connected to the emission analysis module and the DC power supply module, and is used to send an output signal to the emission analysis module and the DC power supply module when receiving the working signal.

8. The bandwidth testing device according to claim 3, characterized in that: Also included are multiple RF cables; The output end of the n-channel vector network analyzer is electrically connected to the signal input end of the bias device through the radio frequency cable; The signal output end of the bias device is electrically connected to the probe module through the radio frequency cable; The input end of the n-channel vector network analyzer is electrically connected to the photoelectric conversion unit through the radio frequency cable.

9. The bandwidth testing device according to claim 5, characterized in that: Also included are multiple RF cables; The output end of the single-channel vector network analyzer is electrically connected to the input end of the signal conversion unit through the radio frequency cable; The output end of the signal conversion unit is electrically connected to the signal input end of the bias device through the radio frequency cable; The signal output end of the bias device is electrically connected to the probe module through the radio frequency cable; The input end of the single-channel vector network analyzer is electrically connected to the photoelectric conversion module through the radio frequency cable.

10. A bandwidth testing method, characterized in that: Applicable to the bandwidth testing device according to any one of claims 1 to 9; The bandwidth testing method comprises: The control module sends an output signal to the emission analysis module and the DC power supply module; When receiving the output signal, the DC power supply module controls the n DC output terminals to output DC signals to the emission analysis module; wherein n is greater than 1 and is an integer; The transmission analysis module outputs a test signal upon receiving the output signal, and sends the test signal and the DC signal to the probe module; The probe module transmits the test signal and the DC signal to n chips to be tested in the optical emission assembly to be tested which is electrically connected to the probe module; The photoelectric conversion module receives the optical signal output by each chip under test when it receives the test signal and the DC signal, converts the optical signal into a corresponding electrical signal, and then sends the electrical signal to the emission analysis module; The transmission analysis module determines the modulation bandwidth of each chip under test according to the electrical signal corresponding to each chip under test.

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