Cushioning component of electronic equipment, preparation method of cushioning component, electronic equipment and rear cover assembly of electronic equipment

Abstract

The invention provides a cushioning component of electronic equipment, a preparation method of the cushioning component, the electronic equipment and a rear cover assembly of the electronic equipment, and the cushioning component of the electronic equipment comprises a zeolite porous layer and a viscoelastic high polymer material barrier layer from inside to outside, the zeolite porous layer comprises a viscoelastic high polymer material matrix and zeolite powder dispersed in the viscoelastic high polymer material matrix, and the zeolite porous layer comprises macroporous channels. According to the cushioning component combination of the electronic equipment, the viscoelastic high polymer material and the zeolite powder are used and arranged in the gap between the rear cover of the electronic equipment and the base body of the electronic equipment, a good damping effect is achieved, shell vibration of the electronic equipment is almost eliminated, and the acoustic low-frequency performance is improved to a certain extent.

Description

Technical Field

[0001] The present invention relates to a shock absorbing component of an electronic device and a preparation method thereof, the electronic device and a back cover assembly of the electronic device, belonging to the technical field of terminal equipment. Background Art

[0002] With the development of science and technology, people have higher and higher requirements for speakers, especially mobile phone speakers. The requirements are not only small in size and loud, but also need to provide good sound quality. The quality of sound is related to every aspect of speaker design and manufacturing process, especially the size of the speaker back cavity design. Generally speaking, the reduction of the speaker back cavity will significantly reduce the response of the low frequency band, resulting in poor sound quality, so it is difficult to provide good sound quality under the condition of a very small back cavity.

[0003] To resolve the above contradiction, those skilled in the art have proposed various methods, such as:

[0004] 1. Use gas with better acoustic compliance instead of air as the back cavity atmosphere;

[0005] 2. Fill the rear cavity with foam such as melamine to increase acoustic compliance;

[0006] 3. Filling with porous materials such as activated carbon, zeolite, and silica to increase the volume of the virtual back cavity and improve acoustic compliance;

[0007] 4. Adopt an open speaker design (see CN113364898A for details), which connects the rear cavity of the speaker to the gap in the mobile phone, and uses the slit of the mobile phone as a supplementary rear cavity to further improve the speaker performance, especially the low-frequency performance. However, doing so, on the one hand, puts forward relatively stringent requirements on the sound membrane material; on the other hand, the controllability of the sound field deteriorates significantly; and causes vibration of the mobile phone case. To this end, CN113364898A achieves a shock-absorbing effect by filling a three-layer structure of auxiliary materials (a weak bonding layer, a foam layer, and a strong bonding layer). Although the auxiliary materials filling the three-layer structure can reduce vibration, there is still obvious vibration (the amplitude fluctuation is about 1.5μm).

[0008] Therefore, providing a new type of shock-absorbing component of an electronic device and a preparation method thereof, an electronic device and a back cover assembly of the electronic device has become a technical problem that urgently needs to be solved in the art. Summary of the invention

[0009] In order to solve the above-mentioned shortcomings and deficiencies, an object of the present invention is to provide a shock absorbing component for an electronic device.

[0010] Another object of the present invention is to provide a method for preparing the shock absorbing component of the electronic device mentioned above.

[0011] Another object of the present invention is to provide an electronic device comprising the shock absorbing component of the electronic device described above.

[0012] Another object of the present invention is to provide a back cover assembly of an electronic device, which includes the shock absorbing component of the electronic device described above.

[0013] In order to achieve the above objectives, on the one hand, the present invention provides a shock-absorbing component of an electronic device, wherein the shock-absorbing component of the electronic device includes two parts from the inside to the outside: a zeolite porous layer (inner layer) and a viscoelastic polymer material barrier layer (outer layer), and the zeolite porous layer includes a single layer of zeolite powder.

[0014] In the present invention, "inside" and "outside" refer to the direction relative to the back cover of the electronic device, wherein the direction close to the back cover is "outside" and the direction away from the back cover is "inside".

[0015] As a specific embodiment of the shock absorbing component of the electronic device described above in the present invention, the particle size of the zeolite powder is 5-100 nm.

[0016] As a specific embodiment of the shock absorbing component of the electronic device described above in the present invention, the zeolite powder can be a zeolite powder with acoustic enhancement commonly used in the art for preparing sound-absorbing particles, including but not limited to one or a combination of MFI structure molecular sieve, FER structure molecular sieve, CHA structure molecular sieve, MEL structure molecular sieve, MOR structure molecular sieve, FAU structure molecular sieve, BEA molecular sieve and LTA molecular sieve, etc. The zeolite powder used in the present invention can be a directly synthesized zeolite raw powder, or it can be formed into particles of 5-100nm by molding.

[0017] As a specific embodiment of the shock absorbing component of the electronic device described above in the present invention, the viscoelastic polymer material includes various polymer materials with viscoelasticity such as thermoplastic polyurethane elastomer (TPU), thermoplastic polyester elastomer (TPEE), polydimethylsiloxane (PDMS), silicone rubber, polyisobutylene rubber, brominated butyl rubber or polybutadiene rubber, and a mixed polymer material formed by mixing at least two monomers corresponding to the above substances. For example, in a specific embodiment of the present invention, the material of the viscoelastic polymer material matrix can be a mixed polymer material after polyisobutylene PIB45000 and brominated butyl rubber 2030 are vulcanized. Among them, the method of mixing at least two monomers to form a mixed polymer material is an existing conventional method.

[0018] In addition, the silicone rubber, polyisobutylene rubber and polybutadiene rubber may be vulcanized silicone rubber, polyisobutylene rubber and polybutadiene rubber, or may be unvulcanized silicone rubber, polyisobutylene rubber and polybutadiene rubber.

[0019] As a specific embodiment of the shock absorbing component of the electronic device described above in the present invention, the shape of the shock absorbing component of the electronic device can be changed according to the cavity of the electronic device, and the thickness is 50-1000 μm.

[0020] In the shock-absorbing component of the electronic device provided by the present invention, the respective proportions of the zeolite porous layer and the dense viscoelastic polymer material barrier layer can be adjusted, and adjustments can be made to different parts according to the differences in the installation cavity layout within the electronic device. It is preferred to increase the proportion of the zeolite porous layer on the basis of eliminating shell vibration.

[0021] As a specific embodiment of the shock absorbing component of the electronic device described above, the thickness ratio of the zeolite porous layer to the viscoelastic polymer barrier layer is 5x10 -6 :1 to 2x10 -3 :1.

[0022] On the other hand, the present invention also provides a method for preparing the above-mentioned shock absorbing component of the electronic device, wherein the preparation method comprises:

[0023] Step (1): evenly spread the viscoelastic polymer material slurry on the operating board;

[0024] Step (2): laying an excess amount of zeolite powder on the surface of the viscoelastic polymer material slurry, and solidifying and shaping to obtain a solid sheet;

[0025] Step (3): removing the solid sheet and vibrating and blowing away the excess zeolite powder to obtain the shock absorbing component of the electronic device.

[0026] As a specific embodiment of the preparation method described above in the present invention, the preparation method further comprises: pre-treating the zeolite powder before step (2), wherein the pre-treatment comprises surface modification and / or immersing the zeolite powder in an organic small molecule solvent.

[0027] As a specific embodiment of the preparation method described above of the present invention, the surface modification agent used for the surface modification includes trimethylchlorosilane and / or vinyltrimethoxysilane;

[0028] The organic small molecule solvent includes one or a combination of n-heptane, toluene, xylene, ethylbenzene, gasoline and petroleum ether.

[0029] Among them, the present invention does not make specific requirements for the surface modification and soaking operations and the process parameters involved, and can be reasonably adjusted and selected according to the actual needs of the on-site operation. The surface modification of the zeolite powder by the present invention can make the zeolite powder better contact with the viscoelastic polymer material, improve the mechanical strength of the bonding surface between the two, and obtain better acoustic performance; and soaking the zeolite powder in an organic small molecule solvent can make the pores of the zeolite powder (mainly micropores and mesopores, and may also include a small amount of macropores) occupied by organic small molecules in advance, preventing these pores from being blocked by the viscoelastic polymer material when the zeolite powder contacts the viscoelastic polymer material, thereby obtaining better acoustic performance.

[0030] In step (2) of the preparation method described above, the purpose of curing and shaping is to make the viscoelastic polymer material undergo certain reaction crosslinking or curing, and finally make the viscoelastic polymer material slurry into an elastic and stable solid form. The present invention does not make specific requirements on the specific operation of curing and shaping and the process parameters used, and the specific curing and shaping method and process parameters can be reasonably selected according to the actual operation needs on site.

[0031] As a specific embodiment of the preparation method described above in the present invention, the preparation method further comprises: after step (3), post-processing the shock absorbing component of the electronic device to remove residual organic small molecule solvents. The organic small molecule solvents removed by post-processing in the present invention can fully expose the pores of the zeolite powder to facilitate the entry and exit of sound waves. The present invention does not make specific requirements on the specific operations of post-processing and the process parameters used. The specific method of post-processing can be reasonably selected and the process parameters can be adjusted according to the actual needs of the on-site operation, as long as the purpose of removing the residual organic small molecule solvents can be achieved.

[0032] On the other hand, the present invention also provides an electronic device, wherein the electronic device includes a back cover, an electronic device base, an open speaker and the shock-absorbing component of the electronic device mentioned above, the back cover is used to cover the electronic device base and form an installation cavity therewith, the open speaker and the shock-absorbing component of the electronic device are both arranged in the installation cavity, and the viscoelastic polymer material barrier layer in the shock-absorbing component of the electronic device is bonded to the inner layer of the back cover.

[0033] Before the shock-absorbing component of the electronic device is arranged in the installation cavity, the shock-absorbing component of the electronic device is first cut into a corresponding shape according to the specific structure of the installation cavity in the electronic device, and then it is arranged in the installation cavity, and the viscoelastic polymer material barrier layer in the shock-absorbing component of the electronic device is tightly fitted with the inner layer of the back cover, and the zeolite porous layer in the shock-absorbing component of the electronic device can be in contact with the air inside the installation cavity, and can also be in contact with other hardware inside the installation cavity of the electronic device except the speaker (for example, when the electronic device is a mobile phone, the other hardware includes a circuit board, a battery and a lens module, etc.).

[0034] As a specific embodiment of the electronic device described above in the present invention, the electronic device includes a smart phone, TWS earphones, headphones, smart glasses, smart watches, VR devices, AR devices, tablet computers or thin and light laptops, etc.

[0035] On the other hand, the present invention also provides a back cover assembly of an electronic device, wherein the electronic device includes an electronic device base and an open speaker, wherein the back cover assembly includes a back cover and the shock-absorbing component of the electronic device described above, the back cover is used to cover the electronic device base and form an installation cavity therewith, the open speaker and the shock-absorbing component of the electronic device are both arranged in the installation cavity, and the viscoelastic polymer material barrier layer in the shock-absorbing component of the electronic device is bonded to the inner layer of the back cover.

[0036] On the other hand, the present invention also provides a back cover assembly of an electronic device, wherein the electronic device includes an electronic device base and an open speaker, wherein the back cover assembly includes a back cover and the shock-absorbing component of the electronic device described above, the back cover is used to cover the electronic device base and form an installation cavity therewith, the open speaker and the shock-absorbing component of the electronic device are both arranged in the installation cavity, and the viscoelastic polymer material barrier layer in the shock-absorbing component of the electronic device is bonded to the inner layer of the back cover.

[0037] Compared with the prior art, the beneficial technical effects that can be achieved by the present invention include:

[0038] The shock absorbing component of the electronic device provided by the present invention uses a combination of viscoelastic polymer material and zeolite powder, wherein the zeolite powder itself has a large number of micropores, which can absorb the sound wave energy through adsorption and desorption; the viscoelastic polymer material itself also has a significant shock absorbing effect, which can dissipate the sound wave energy. Combining the two, on the one hand, the absorption of sound wave energy can be achieved, and on the other hand, the dissipation of sound wave energy can be achieved, and the zeolite powder can also significantly reduce the acoustic low frequency f0 after absorbing the sound wave energy, thereby obtaining a better acoustic low frequency effect. In addition, the size of the zeolite molecular sieve powder is relatively small, which is conducive to the rapid adsorption and desorption of air molecules, and the powder is concentrated on the surface of the component. Compared with the technical solution of the zeolite molecular sieve distributed inside the component, its application efficiency is higher, and the thickness can be significantly reduced while the shock absorbing effect of the component is equivalent, which is convenient for application in different electronic equipment environments.

[0039] The outer layer of the shock absorbing component of the electronic device provided by the present invention is a viscoelastic polymer material barrier layer, which is made of dense viscoelastic polymer material, can increase the structural strength and sealing, prevent air leakage and sound leakage, and absorb and eliminate the shell vibration to the maximum extent.

[0040] In summary, the shock-absorbing component of the electronic device provided by the present invention uses a combination of viscoelastic polymer materials and zeolite powder, and is arranged in the gap between the back cover of the electronic device and the electronic device substrate, which not only forms a good vibration reduction effect, almost eliminates the shell vibration of the electronic device, but also improves the acoustic low-frequency performance to a certain extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 A schematic structural diagram of a shock absorbing component of an electronic device provided by an embodiment of the present invention.

[0043] Figure 2 A schematic diagram of the fitting position of the shock absorbing component of the electronic device provided by an embodiment of the present invention within the installation cavity of a mobile phone.

[0044] Description of main figures:

[0045] 1. Zeolite porous layer;

[0046] 2. Viscoelastic polymer barrier layer;

[0047] 100. Shock-absorbing components of electronic equipment;

[0048] 200, back cover;

[0049] 300, open 1115 speakers;

[0050] 400, battery;

[0051] 500, screen;

[0052] 600. Other parts. DETAILED DESCRIPTION

[0053] It should be noted that the term "comprises" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0054] "Scope" disclosed in the present invention is given in the form of lower limit and upper limit. It can be one or more lower limits, and one or more upper limits respectively. A given range is defined by selecting a lower limit and an upper limit. The selected lower limit and upper limit define the boundaries of a particular range. All ranges defined in this way are combinable, i.e. any lower limit can be combined with any upper limit to form a range. For example, for a specific parameter, a range of 60-120 and 80-110 is listed, and it is understood that a range of 60-110 and 80-120 is also expected. In addition, if the minimum range values ​​listed are 1 and 2, and the maximum range values ​​listed are 3, 4 and 5, then the following ranges can all be expected: 1-3, 1-4, 1-5, 2-3, 2-4 and 2-5.

[0055] In the present invention, unless otherwise specified, the numerical range "ab" represents an abbreviation of any real number combination between a and b, where a and b are real numbers. For example, the numerical range "0-5" means that all real numbers between "0-5" have been listed in the present invention, and "0-5" is just an abbreviation of these numerical combinations.

[0056] In the present invention, unless otherwise specified, all embodiments and preferred embodiments mentioned in the present invention can be combined with each other to form a new technical solution.

[0057] In the present invention, unless otherwise specified, all technical features and preferred features mentioned in the present invention can be combined with each other to form a new technical solution.

[0058] In the present invention, unless otherwise specified, all steps mentioned herein may be performed sequentially or randomly, but are preferably performed sequentially. For example, the method includes steps (a) and (b), which means that the method may include steps (a) and (b) performed sequentially, or may include steps (b) and (a) performed sequentially. For example, the method may further include step (c), which means that step (c) may be added to the method in any order, for example, the method may include steps (a), (b) and (c), or may include steps (a), (c) and (b), or may include steps (c), (a) and (b), etc.

[0059] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the attached table, drawings and examples. The following described embodiments are some embodiments of the present invention, rather than all embodiments, and are only used to illustrate the present invention, and should not be regarded as limiting the scope of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present invention. If the specific conditions are not specified in the embodiments, they are carried out according to the normal conditions or the conditions recommended by the manufacturer. If the manufacturer is not specified in the reagents or instruments used, they are all conventional products that can be purchased commercially.

[0060] Example 1

[0061] This embodiment provides a shock absorbing component of an electronic device, which is prepared by a preparation method comprising the following specific steps:

[0062] Step (1): 16 parts by weight of polydimethylsiloxane PDMS A component (Dow Corning 184), 20 parts by weight of n-heptane and 1.6 parts by weight of curing agent PDMS B component (Dow Corning 184, B component) are mixed to obtain a uniform blended slurry, and the blended slurry is laid in a metal sheet mold, the mold size is 0.5 mm thick;

[0063] Step (2): Select MFI zeolite powder (specifically ZSM-5) with a Si / Al molar ratio of 250 and a powder size of 5 nm, and lay 20 g of the MFI zeolite powder on the surface of the slurry in the aforementioned metal sheet mold;

[0064] Step (3): seal the metal sheet mold, heat cure for 6 hours to obtain a sheet with a thickness of 0.5 mm, remove the sheet and vibrate to blow away excess MFI zeolite powder to obtain a solid sheet;

[0065] Step (4): Cut the solid sheet into rectangles with a width of 80.0 mm and a length of 100.0 mm to obtain the shock-absorbing component of the electronic device.

[0066] The structural schematic diagram of the shock absorbing component of the electronic device obtained in this embodiment is as follows Figure 1 As shown, it includes a zeolite porous layer 1 and a viscoelastic polymer barrier layer 2 from the inside to the outside. The zeolite porous layer 1 is a single layer of MFI zeolite powder, the viscoelastic polymer barrier layer 2 is made of PDMS, the thickness of the shock absorbing component of the electronic device is 500 μm, and the thickness ratio of the zeolite porous layer to the viscoelastic polymer barrier layer is 1x10 -5 :1.

[0067] Example 2

[0068] This embodiment provides a shock absorbing component of an electronic device, which is prepared by a preparation method comprising the following specific steps:

[0069] Step (1): 24 parts by weight of polyisobutylene PIB45000 are mixed in an internal mixer for 30 minutes under the conditions of temperature 75° C., rotation speed 50 r / min and filling factor 0.8; then 0.2 parts by weight of sulfur are added in an open mixer to obtain a mixed rubber slurry, and the mixed rubber slurry is laid in a metal sheet mold, the mold size of which is 0.4 mm thick;

[0070] Step (2): selecting FER zeolite powder with a Si / Al molar ratio of 450 and a powder size of 10 nm; mixing 1000 g of the FER zeolite powder with 5000 g of toluene and dispersing them uniformly, then adding 20 g of vinyltrimethoxysilane, stirring at 40° C. for 4 h, filtering, and dispersing and washing with toluene twice to obtain a surface-modified FER zeolite powder; laying 20 g of the surface-modified FER zeolite powder on the surface of the slurry in the aforementioned metal sheet mold;

[0071] Step (3): solidifying the slurry at 165° C. for 10 min, pressing the vulcanized rubber to a thickness of 0.4 mm, removing the sheet and vibrating and blowing away excess FER zeolite powder to obtain a solid sheet;

[0072] Step (4): Cut the solid sheet into rectangles with a width of 80.0 mm and a length of 100.0 mm to obtain the shock-absorbing component of the electronic device.

[0073] The structural schematic diagram of the shock absorbing component of the electronic device obtained in this embodiment is as follows Figure 1 As shown, it includes a zeolite porous layer 1 and a viscoelastic polymer barrier layer 2 from the inside to the outside. The zeolite porous layer 1 is a single layer of FER zeolite powder, the viscoelastic polymer barrier layer 2 is made of vulcanized polyisobutylene rubber, the thickness of the shock absorbing component of the electronic device is 400 μm, and the thickness ratio of the zeolite porous layer to the viscoelastic polymer barrier layer is 2.5x10 -5:1.

[0074] Example 3

[0075] This embodiment provides a shock absorbing component of an electronic device, and the preparation method thereof is different from that of Embodiment 2 only in that:

[0076] The amount of polyisobutylene PIB45000 in Example 2 was reduced to 12 parts by weight, and the amount of sulfur was reduced to 0.1 parts by weight. The thickness of the obtained electronic device cushioning component was 0.2 mm, wherein the thickness ratio of the zeolite porous layer to the thickness of the viscoelastic polymer barrier layer was 5×10 -5 :1.

[0077] Example 4

[0078] This embodiment provides a shock absorbing component of an electronic device, and the preparation method thereof is different from that of Embodiment 2 only in that:

[0079] The amount of polyisobutylene PIB45000 in Example 2 was reduced to 6 parts by weight, and 5 parts by weight of brominated butyl rubber 2030 were additionally added.

[0080] The structural schematic diagram of the shock absorbing component of the electronic device obtained in this embodiment is as follows Figure 1 As shown, it includes a zeolite porous layer 1 and a viscoelastic polymer barrier layer 2 from the inside to the outside. The zeolite porous layer 1 is a single layer of FER zeolite powder, and the viscoelastic polymer barrier layer 2 is a mixed polymer material after polyisobutylene PIB45000 and brominated butyl rubber 2030 are vulcanized. The thickness of the shock absorbing component of the electronic device is 300 μm, and the ratio of the thickness of the zeolite porous layer to the thickness of the viscoelastic polymer barrier layer is 3x10 -5 :1.

[0081] Comparative Example 1

[0082] This comparative example provides a shock-absorbing component of an electronic device, which is a PDMS film with a thickness of 0.5 mm.

[0083] Comparative Example 2

[0084] This comparative example provides a shock-absorbing component of an electronic device, which is a 0.5 mm thick foam.

[0085] Performance Test Example 1

[0086] This performance test example performs acoustic tests on the shock absorbing components of the electronic devices provided in Examples 1 to 4 and Comparative Examples 1 and 2 of the present invention, respectively, including:

[0087] Take a commercially available 1115 loudspeaker, remove the sealing film of the leakage port, and enlarge the leakage port to a rectangular opening with a size of 4.0 mm*10.0 mm to form an open 1115 loudspeaker.

[0088] In order to ensure the reliability of mobile phone assembly (to prevent repeated removal of the back cover of the mobile phone and the difference in sealant adhesion), the structural diagram is selected as follows Figure 2 The mobile phone mold shown is evaluated as a mobile phone tooling: the mobile phone tooling weighs 200g, and its dimensions are 17mm long*85mm wide*9mm thick. There are structures and screws for fixing the speaker inside to fix the open 1115 speaker mentioned above; the gap between the back cover and the body is 0.5-1.0mm (the narrowest part is 0.5mm, and the widest part is 1.0mm). According to the internal gap of the mobile phone, the excess parts of the shock absorbing components of the electronic devices provided in Examples 1 to 4 of the present invention and Comparative Examples 1 and 2 are cut off respectively, so that the shock absorbing components are closely fitted to the back cover of the mobile phone, as shown in FIG. Figure 2 As shown, from Figure 2 It can be seen that the mobile phone tooling includes a body, a shock absorbing component 100 of an electronic device, a back cover 200, an open 1115 speaker 300, a battery 400, a screen 500 and other components 600. The back cover 200 is used to cover the body and form an installation cavity with it. The open 1115 speaker 300, the battery 400, other components 600 and the shock absorbing component 100 of the electronic device are all arranged in the installation cavity, and the viscoelastic polymer material barrier layer in the shock absorbing component 100 of the electronic device is tightly attached to the inner layer of the back cover 200, and the zeolite porous layer is in contact with the air inside the installation cavity;

[0089] The open-type 1115 speaker is matched with the back cover and fixed to the body by screws, and there are sealing rings around the body and the back cover for sealing.

[0090] The acoustic performance tests were conducted using conventional methods in the art on commercially available 1115 speaker units, 1115 speakers with added rear cavities, open-type 1115 speakers, mobile phone tooling equipped with open-type 1115 speakers and the shock-absorbing components of the electronic devices provided in Examples 1 to 4 and Comparative Examples 1 to 2 of the present invention, and a mobile phone tooling (blank) equipped with only an open-type 1115 speaker. The obtained f0 data are shown in Table 1 below.

[0091] Performance Test Example 2

[0092] This performance test example uses an amplitude measuring instrument (piezoelectric acceleration sensor) to perform amplitude tests on the mobile phone tooling obtained in performance test example 1, which is respectively equipped with an open 1115 speaker and the shock absorbing components of the electronic device provided by Examples 1 to 4 of the present invention and Comparative Examples 1 to 2, and the mobile phone tooling (blank) only equipped with an open 1115 speaker, including:

[0093] Use tape to tightly bond the bottom of the vibration sensor, i.e. the piezoelectric acceleration sensor, to the back cover of the mobile phone tooling; then place it on the sponge to prevent direct hard contact with the desktop from affecting the test results; there are two options for test signal input: one is to use the pink noise test signal of CF 2.2, and the pink noise voltage is 1.65V; the other is to directly use the test mobile phone, i.e. the mobile phone tooling to play, and adjust the volume of the test mobile phone to the maximum for testing;

[0094] Play the pink noise test signal in a loop and start the test using an amplitude meter. Do not read the test value for the first 3 seconds, then continue for 20 seconds. Read the maximum value of the test data within 20 seconds and record it as the value of the test point.

[0095] Change the fixed position of the back cover of the mobile phone mold and the vibration sensor, retest the next fixed position, and record the value of the test point; in this performance test example, the back cover of the mobile phone mold is divided into 9 grids, and the vibration amplitude of 9 points is measured; the maximum vibration distance range is recorded, as shown in Table 1 below.

[0096] Performance Test Example 3

[0097] This performance test example uses an amplitude measuring instrument (piezoelectric acceleration sensor) to perform a tactile test on the mobile phone tooling obtained in performance test example 1, which is respectively equipped with an open 1115 speaker and the shock absorbing components of the electronic device provided by Examples 1 to 4 of the present invention and Comparative Examples 1 to 2, and the mobile phone tooling (blank) only equipped with an open 1115 speaker, including:

[0098] The mobile phone tooling was placed in the hands of ten testers, and then a pink noise test signal of CF 2.2 was given to the speaker. The testers made a qualitative evaluation based on their subjective touch. The evaluation results are shown in Table 1 below.

[0099] Table 1

[0100]

[0101]

[0102] It can be seen from Table 1 above that the f0 of the 1115 speaker unit itself is around 440Hz. After adding the back cavity, the f0 of the 1115 speaker increases to around 860Hz. After opening the leakage port of the 1115 speaker and drilling a larger leakage hole, its f0 is measured to be reduced to around 530Hz in an open environment.

[0103] The blank mobile phone tooling corresponds to a mobile phone tooling with only an open 1115 speaker installed. Its f0 is measured to be around 640Hz in a closed environment.

[0104] Compared with a blank mobile phone tooling, the mobile phone tooling to which the shock-absorbing components of the electronic device provided by Examples 1 to 4 of the present invention and the open 1115 speakers are respectively installed, not only greatly reduces the vibration of the mobile phone, but also significantly reduces the acoustic f0. The reduction in f0 indicates that these mobile phone toolings have better low-frequency effects.

[0105] Compared with the blank mobile phone tooling, the vibration of the mobile phone tooling equipped with the shock-absorbing components of the electronic device provided in Comparative Example 1 and the open 1115 speakers is also greatly reduced, but its acoustic f0 is significantly increased compared with the blank mobile phone tooling and the mobile phone tooling equipped with the shock-absorbing components of the electronic device provided in Example 1 of the present invention and the open 1115 speakers. This is because compared with Comparative Example 1, the shock-absorbing components of the electronic device provided in Example 1 of the present invention add a single layer of MFI zeolite powder as a zeolite porous layer, wherein the MFI zeolite powder itself has a large number of micropores, which can absorb sound wave energy through adsorption and desorption, thereby significantly reducing the acoustic low-frequency f0, thereby obtaining a better acoustic low-frequency effect.

[0106] Compared with the mobile phone tooling equipped with the shock-absorbing components of the electronic device provided in Examples 1 to 4 of the present invention and the open 1115 speakers, although the acoustic f0 of the mobile phone tooling equipped with 0.5 mm thick foam and the open 1115 speakers does not deteriorate significantly, its vibration reduction effect is extremely limited.

[0107] The above is only a specific embodiment of the present invention, and cannot be used to limit the scope of the invention. Therefore, the replacement of equivalent components, or equivalent changes and modifications made according to the protection scope of the patent of the present invention, should still fall within the scope of this patent. In addition, the technical features of the present invention can be freely combined with each other, with each other and with each other, and with each other.

Claims

1. A shock absorbing component of an electronic device, characterized in that: The shock absorbing component of the electronic device comprises a zeolite porous layer and a viscoelastic polymer material barrier layer from the inside to the outside, and the zeolite porous layer comprises a single layer of zeolite powder.

2. The shock absorbing component of the electronic device according to claim 1, characterized in that: The particle size of the zeolite powder is 5-100 nm.

3. The shock absorbing component of an electronic device according to claim 1 or 2, characterized in that: The zeolite powder includes one or a combination of MFI structure molecular sieve, FER structure molecular sieve, CHA structure molecular sieve, MEL structure molecular sieve, MOR structure molecular sieve, FAU structure molecular sieve, BEA molecular sieve and LTA molecular sieve.

4. The shock absorbing component of an electronic device according to claim 1 or 2, characterized in that: The viscoelastic polymer material includes thermoplastic polyurethane elastomer, thermoplastic polyester elastomer, polydimethylsiloxane, silicone rubber, polyisobutylene rubber, brominated butyl rubber or polybutadiene rubber, and a mixed polymer material formed by mixing at least two monomers corresponding to the above substances.

5. The shock absorbing component of an electronic device according to claim 1 or 2, characterized in that: The thickness of the shock absorbing component of the electronic device is 50-1000 μm.

6. The shock absorbing component of an electronic device according to claim 1 or 2, characterized in that: The thickness ratio of the zeolite porous layer to the viscoelastic polymer barrier layer is 5x10 -6 :1 to 2x10 -3 :

1.

7. The method for preparing a shock absorbing component of an electronic device according to any one of claims 1 to 6, characterized in that: The preparation method comprises: Step (1): evenly spread the viscoelastic polymer material slurry on the operating board; Step (2): laying an excess amount of zeolite powder on the surface of the viscoelastic polymer material slurry, and solidifying and shaping to obtain a solid sheet; Step (3): removing the solid sheet and vibrating and blowing away the excess zeolite powder to obtain the shock absorbing component of the electronic device.

8. The preparation method according to claim 7, characterized in that: The preparation method further comprises: performing pretreatment on the zeolite powder before step (2), wherein the pretreatment comprises surface modification and / or immersing the zeolite powder in an organic small molecule solvent.

9. The preparation method according to claim 8, characterized in that: The surface modification agent used in the surface modification includes trimethylchlorosilane and / or vinyltrimethoxysilane; The organic small molecule solvent includes one or a combination of n-heptane, toluene, xylene, ethylbenzene, gasoline and petroleum ether.

10. The preparation method according to claim 8 or 9, characterized in that: The preparation method further comprises: after step (3), post-processing the shock absorbing component of the electronic device to remove residual organic small molecule solvent.

11. An electronic device, characterized in that: The electronic device comprises a back cover, an electronic device base, an open speaker and the shock-absorbing component of the electronic device according to any one of claims 1 to 6, wherein the back cover is used to cover the electronic device base and form an installation cavity therewith, the open speaker and the shock-absorbing component of the electronic device are both arranged in the installation cavity, and the viscoelastic polymer material barrier layer in the shock-absorbing component of the electronic device is bonded to the inner layer of the back cover.

12. The electronic device according to claim 11, characterized in that: The electronic device includes a smart phone, a TWS headset, a head-mounted headset, smart glasses, a smart watch, a VR device, an AR device, a tablet computer or a thin and light laptop computer.

13. A back cover assembly of an electronic device, the electronic device comprising an electronic device base and an open speaker, characterized in that: The back cover assembly includes a back cover and the shock-absorbing component of the electronic device as described in any one of claims 1-6, the back cover is used to cover the electronic device base and form an installation cavity therewith, the open speaker and the shock-absorbing component of the electronic device are both arranged in the installation cavity, and the viscoelastic polymer material barrier layer in the shock-absorbing component of the electronic device is bonded to the inner layer of the back cover.

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