Welding leg structure, glass assembly and vehicle

Abstract

The invention provides a weld leg structure, a glass assembly and a vehicle. The weld leg structure comprises a welding part, soldering tin and a limiting protrusion. The welding part is provided with a welding face used for being close to glass and has a first heat conductivity coefficient, and the soldering tin is fixed to the welding face. The limiting protrusion is at least partially fixed to the welding face, the limiting protrusion and the welding part are of a split structure, the limiting protrusion has a second heat conductivity coefficient, and the second heat conductivity coefficient is smaller than the first heat conductivity coefficient. According to the welding leg structure, the limiting protrusions are additionally arranged, the distance between the welding face and the glass in the welding process is guaranteed, it is guaranteed that the welding part does not make direct contact with the glass in the welding process, meanwhile, the thickness of soldering tin is guaranteed, and the welding strength is improved; the influence of sudden temperature change on the glass is reduced, and the problem of sheet cracking caused by welding is reduced.

Description

Technical Field

[0001] The present application belongs to the field of welding technology, and specifically relates to a welding foot structure, a glass component, and a vehicle. Background Art

[0002] At present, it is usually necessary to weld the solder foot structure to the conductive circuit in the glass, and energize the conductive circuit in the glass through the solder foot structure, so as to realize the integration of a series of electronic functions on the glass, such as heating and defogging, antenna, rupture alarm, etc. The welding part in the solder foot structure is usually provided with solder. During the welding process, the solder melts, and the welding part is close to the glass. After the solder cools down, it is welded to the glass. However, the current solder foot structure makes it difficult to ensure the distance between the welding surface and the glass, and therefore it is difficult to ensure the thickness of the solder. At the same time, during the welding process, the welding surface is easy to contact the glass. The huge temperature difference at the moment of contact causes the stress layer of the glass to be damaged and surface microcracks to be generated, which leads to the subsequent glass cracks. Summary of the invention

[0003] In view of this, the first aspect of the present application provides a solder foot structure, the solder foot structure comprising:

[0004] A welding portion having a welding surface for being close to the glass, wherein the welding portion has a first thermal conductivity;

[0005] Solder, fixed on the welding surface;

[0006] The limiting protrusion is at least partially fixed to the welding surface, the limiting protrusion and the welding part are a split structure, the limiting protrusion has a second thermal conductivity, and the second thermal conductivity is smaller than the first thermal conductivity.

[0007] The first aspect of the present application provides a soldering foot structure, firstly, a limiting protrusion is added to the soldering part of the soldering foot structure, so as to avoid the solder overflowing from the soldering surface being too close to the glass under the action of pressure. The limiting protrusion is arranged on the contact surface between the soldering part and the glass, i.e., the soldering surface, to ensure the distance between the soldering part and the glass during the soldering process, so as to ensure that the soldering part will not directly contact the glass during the soldering process. At the same time, the thickness of the solder is ensured, making the soldering more solid.

[0008] Secondly, on the basis of setting the limiting protrusion, the present application makes the limiting protrusion and the welding part a split design, that is, the welding part and the limiting protrusion can have different thermal conductivities. The present application can make the thermal conductivity of the limiting protrusion the second thermal conductivity, and make the second thermal conductivity smaller than the first thermal conductivity. Since the second thermal conductivity is smaller than the first thermal conductivity, compared with the limiting protrusion in the related art, the limiting protrusion in the present application has a lower thermal conductivity and a slower temperature rise. Therefore, when the limiting protrusion in the present application contacts the glass during the welding process, it will not cause a sudden change in the glass temperature at the contact position, thereby reducing the risk of glass cracking during the welding process.

[0009] From another perspective, when high temperature is transferred to the welding part with higher thermal conductivity, since the thermal conductivity of the limiting protrusion is smaller than that of the welding part, the heat transferred from the welding part to the limiting protrusion is reduced, resulting in a slower temperature rise of the limiting protrusion. Therefore, when the limiting protrusion transfers high temperature to the glass, the glass also heats up more slowly, which will not cause a sudden change in the glass temperature, thereby reducing the risk of glass cracking during the welding process.

[0010] In summary, the welding foot structure provided in the present application adds a limiting protrusion to ensure the distance between the welding surface and the glass during the welding process, so as to ensure that the welding part does not directly contact the glass during the welding process, while ensuring the thickness of the solder and improving the welding strength. In addition, the limiting protrusion with low thermal conductivity is selected to reduce the impact of sudden temperature changes on the glass and reduce the problem of cracks caused by welding.

[0011] Wherein, the limiting protrusion is sleeved on the welding portion.

[0012] Wherein, the welding portion is provided with a limiting groove, and the limiting protrusion is arranged in the limiting groove.

[0013] Wherein, the limiting protrusion satisfies at least one of the following properties:

[0014] The tensile strength of the limiting protrusion is not less than 1MPa;

[0015] The breaking elongation of the limiting protrusion is not less than 50%.

[0016] Wherein, the limiting protrusion is bonded to the welding surface.

[0017] Wherein, the welding portion is provided with a through hole, and the limiting protrusion passes through the through hole so that one end of the limiting protrusion is arranged on the welding surface.

[0018] Among them, the limiting protrusion includes a limiting portion, a penetrating portion, and a clamping portion in sequence along its axial direction, the penetrating portion is arranged in the through hole, the limiting portion is arranged on the welding surface, and the clamping portion is clamped on the surface of the welding portion away from the welding surface; the outer diameter of the limiting portion and the outer diameter of the clamping portion are both larger than the aperture of the through hole.

[0019] Wherein, the limiting protrusion is elastic, the welding portion has a first hardness, the limiting protrusion has a second hardness, and the second hardness is smaller than the first hardness.

[0020] Wherein, the limiting protrusion satisfies at least one of the following properties:

[0021] The softening temperature of the limiting protrusion is not less than 300°C;

[0022] The hardness of the limiting protrusion is greater than 30 Shore A.

[0023] Wherein, the friction coefficient between the limiting protrusion and the glass is not less than 0.4.

[0024] Wherein, the thickness of the limiting protrusion is 0.1mm-0.8mm.

[0025] The thickness of the solder is greater than the thickness of the limiting protrusion, so that the surface of the solder close to the glass is closer to the glass than the surface of the limiting protrusion close to the glass.

[0026] Wherein, along the arrangement direction of the limiting protrusion and the solder, the width of the limiting protrusion is 1mm-4mm.

[0027] Wherein, along the arrangement direction of the limiting protrusion and the solder, the width of the limiting protrusion is 2mm-5mm.

[0028] Wherein, along the arrangement direction of the limiting protrusion and the solder, there is a gap between the limiting protrusion and the solder.

[0029] Wherein, a positioning mark is provided on the surface of the welding portion facing away from the welding surface, and the positioning mark is used to position and abut the welding device.

[0030] Wherein, along the arrangement direction of the limiting protrusion and the solder, the limiting protrusion is arranged on one side or two opposite sides of the solder.

[0031] Among them, the solder foot structure includes a connecting part for connecting the wire, and two soldering parts, the two soldering parts are connected to opposite sides of the connecting part, and the two limiting protrusions in the two soldering parts are closer to or farther away from each other than the two solders.

[0032] A second aspect of the present application provides a glass assembly, which includes glass and a welding foot structure as provided in the first aspect of the present application, wherein the welding foot structure is welded to the glass.

[0033] The glass assembly provided in the second aspect of the present application, by adopting the welding foot structure provided in the first aspect of the present application, ensures the distance between the welding surface and the glass during the welding process, so as to ensure that the welding part does not directly contact the glass during the welding process, while ensuring the thickness of the solder and improving the welding strength. In addition, the use of limiting protrusions with low thermal conductivity reduces the impact of sudden temperature changes on the glass, reduces the problem of cracks caused by welding, and improves the yield rate.

[0034] A third aspect of the present application provides a vehicle, comprising a vehicle body panel and a glass assembly as provided in the second aspect of the present application, wherein the glass assembly is mounted on the vehicle body panel.

[0035] The vehicle provided in the third aspect of the present application reduces the risk of glass breakage, reduces customer complaints, increases the life of the glass, and improves driving safety by adopting the glass assembly provided in the second aspect of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the implementation modes of the present application will be described below.

[0037] Figure 1 Schematic diagram of the three-dimensional structure of the welding foot structure in one embodiment of the present application.

[0038] Figure 2 for Figure 1 A front view of the solder foot structure is shown.

[0039] Figure 3 for Figure 2 A partial enlarged front view of the weld foot structure is shown.

[0040] Figure 4 for Figure 1 A front view of the soldering foot structure when it is soldered to the glass.

[0041] Figure 5 It is a front view of a welding foot structure in another embodiment of the present application.

[0042] Figure 6 for Figure 1 A bottom view of the weld foot structure is shown.

[0043] Figure 7 for Figure 1 The bottom view of the solder foot structure is shown with the limiting protrusion removed.

[0044] Figure 8It is a schematic diagram of the three-dimensional structure of the welding foot structure in another embodiment of the present application.

[0045] Fig. 9 for Figure 8 A front view of the solder foot structure is shown.

[0046] Fig.10 for Figure 8 A bottom view of the weld foot structure is shown.

[0047] Fig.11 This is a schematic diagram of the three-dimensional structure of the welding foot structure in another embodiment of the present application.

[0048] Fig.12 for Fig.11 A front view of the solder foot structure is shown.

[0049] Fig.13 for Fig.11 A bottom view of the weld foot structure is shown.

[0050] Fig.14 for Fig.11 A partial cross-sectional schematic diagram of the weld foot structure is shown.

[0051] Fig.15 for Figure 6 A bottom view of another embodiment of a solder foot structure is shown.

[0052] Fig.16 for Figure 2 A front view of another embodiment of a solder foot structure is shown.

[0053] Fig.17 This is a schematic diagram of a glass component in one embodiment of the present application.

[0054] Fig.18 It is a schematic diagram of a vehicle in one embodiment of the present application.

[0055] Description of labels:

[0056] Welding foot structure-1, glass assembly-2, vehicle-3, welding part 10, welding surface-11, limiting groove-12, through hole-13, gap-14, positioning mark-15, solder-20, limiting protrusion-30, limiting part-31, through part 32, clamping part-33, connecting part-40, glass-50, vehicle body panel-60. DETAILED DESCRIPTION

[0057] The following are preferred implementations of the present application. It should be noted that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

[0058] Before introducing the technical solutions provided by this application, the technical problems in the related technologies are introduced in detail.

[0059] With the rapid development of the automobile industry, the demand for automobile glass is also increasing. For example, a series of electronic functions need to be integrated into the windshield and rear windshield of the car, such as heating and defogger, antenna, and rupture alarm. Therefore, in recent years, glass with a series of electronic functions has entered people's lives more. However, when the glass needs to realize a series of electronic functions, such as when the glass needs to realize local or full-surface heating functions, it is usually necessary to print conductive silver paste on the surface of the glass body. The conductive silver paste can form a conductive circuit, and then the wire is electrically connected to the conductive circuit. At present, a soldering foot structure is usually first welded to the conductive circuit of the glass, and then the wire is fixedly connected to the soldering foot structure, so that the wire can energize the conductive circuit in the glass through the soldering foot structure.

[0060] In the current welding methods, such as the welding foot structure used in antennas and the welding foot structure used in explosion-proof joints, solder is usually provided at the bottom of the welding part in the welding foot structure. During the welding process, the welding foot structure is first positioned at the welding position, and then the welding part is supported and heated by the welding needle. At this time, the solder melts and the welding foot structure is forced close to the glass surface. After the solder cools, the welding foot structure can be welded to the glass. Therefore, it is difficult to ensure the distance between the welding surface and the glass when welding such welding foot structures, and thus it is difficult to ensure the thickness of the solder. At the same time, the welding surface is easy to contact the glass during the welding process. Since the welding foot structure is usually made of a material with good thermal conductivity, the temperature of the welding part rises to more than 100°C during this process. Therefore, during the welding process, the heat and temperature are also transmitted to the glass in direct contact with the welding part. The huge temperature difference at the moment of contact causes the stress layer of the glass to be damaged and surface microcracks to be generated, which leads to the subsequent appearance of glass cracks.

[0061] In addition, other types of solder foot structures, such as bridge solder foot structures, are usually provided with a limiting protrusion formed by stamping on the contact surface with the glass, that is, the welding surface, which is used to ensure the distance between the welding surface and the glass, so as to ensure that the welding part does not directly contact the glass during the welding process, thereby ensuring the thickness of the solder and achieving the solder height limit. However, during the welding process, the limiting protrusion of the welding part will be in direct contact with the glass, and the position of the solder foot structure will not continue to drop. However, the heat and temperature at the welding part will also be transmitted to the glass through the integrated limiting protrusion formed by stamping, which will cause changes in the internal stress of the glass and generate microcracks at the bottom of the limiting protrusion, reducing the strength of the glass, thereby increasing the risk of fragmentation. If you want to ensure that the welding part does not directly contact the glass during the welding process, special tooling is required, which increases the cycle time.

[0062] In view of this, in order to solve the above problems, this application provides a solder foot structure. Please refer to Figure 1-Figure 5 , Figure 1 Schematic diagram of the three-dimensional structure of the welding foot structure in one embodiment of the present application. Figure 2 for Figure 1 A front view of the solder foot structure is shown. Figure 3 for Figure 2 A partial enlarged front view of the weld foot structure is shown. Figure 4 for Figure 1 A front view of the soldering foot structure when it is soldered to the glass. Figure 5 It is a front view of a welding foot structure in another embodiment of the present application.

[0063] The solder foot structure 1 provided in this embodiment includes a soldering portion 10, a solder 20, and a limiting protrusion 30. The soldering portion 10 has a soldering surface 11 for approaching the glass 50, the soldering portion 10 has a first thermal conductivity, and the solder 20 is fixed to the soldering surface 11. The limiting protrusion 30 is at least partially fixed to the soldering surface 11, and the limiting protrusion 30 and the soldering portion 10 are a separate structure, and the limiting protrusion 30 has a second thermal conductivity, and the second thermal conductivity is less than the first thermal conductivity.

[0064] The solder foot structure 1 provided in this embodiment is mainly used for the electrical connection between the circuit and the glass 50. In this case, the solder foot structure 1 can also be called a solder terminal. The solder foot structure 1 is soldered at the conductive circuit position in the glass 50. For example, the conductive circuit is a conductive silver paste printed on the glass 50 body. Then, the solder foot structure 1 is connected to an external wire, so that the glass 50 can realize a series of electronic functions.

[0065] The solder foot structure 1 mainly includes a soldering part 10, solder 20, and a limiting protrusion 30. The soldering part 10 is the part where the solder foot structure 1 contacts the solder pin in the welding machine during the welding process. The surface of the soldering part 10 close to the glass 50 can be called a soldering surface 11, that is, the lower surface of the soldering part 10 is the soldering surface 11, and the soldering part 10 is subsequently welded to the glass 50 using the soldering surface 11. Since the solder 20 arranged on the soldering surface 11 needs to be evenly heated, the soldering part 10 generally uses a material with good thermal conductivity. Specifically, the thermal conductivity of the soldering part 10 is a first thermal conductivity. Optionally, the first thermal conductivity of the soldering part 10 is generally greater than 200W / mk. Further optionally, the material of the soldering part 10 includes but is not limited to copper, aluminum, etc. Solder 20 is a commonly used material in the welding process. The solder 20 in this embodiment is fixed on the soldering surface 11 of the soldering part 10 facing the glass 50. During the welding process, the welding needle of the welding machine heats the welding foot structure 1, and the heat is transferred to the solder 20 to melt the solder 20. After the solder 20 solidifies, the welding foot structure 1 can be welded to the conductive circuit in the glass 50.

[0066] As can be seen from the above content, the welding portion 10 of the welding foot structure 1 in the related art is not provided with a limiting protrusion 30, which makes it difficult to ensure the distance between the welding surface 11 and the glass 50 during the welding process, and thus it is difficult to ensure the thickness of the solder 20. At the same time, the welding surface 11 is easy to contact the glass 50 during the welding process, which causes the stress layer of the glass 50 to be damaged due to the huge temperature difference, and produces surface microcracks, which leads to the subsequent occurrence of glass 50 fragments. Based on this, the present embodiment adds a limiting protrusion 30 to the welding portion 10 of the welding foot structure 1. The limiting protrusion 30 is used to ensure the distance between the welding foot and the glass 50 during the welding process, so as to avoid the welding surface 11 and the glass 50 being too close under the action of pressure, resulting in the overflow of the solder 20. The limiting protrusion 30 is set on the contact surface between the welding portion 10 and the glass 50, that is, the welding surface 11, to ensure the distance between the welding portion 10 and the glass 50 during the welding process, so as to ensure that the welding portion 10 will not directly contact the glass 50 during the welding process. At the same time, the layer height of the solder 20 is guaranteed, that is, the thickness of the solder 20 is guaranteed, making the welding more firm.

[0067] In the related art, some welding foot structures 1, such as bridge welding foot structures, are also provided with limiting protrusions 30. However, whether the welding surface 11 directly contacts the glass 50, or the limiting protrusion 30 integrated with the welding part 10 directly contacts the glass 50, the problem of cracking will occur due to the huge temperature difference. Specifically, in the existing welding foot structure 1, the limiting protrusion 30 and the welding part 10 are designed as an integrated whole, and the limiting protrusion 30 and the welding part 10 have the same first thermal conductivity coefficient, that is, the limiting protrusion 30 is also made of a material with high thermal conductivity, and the temperature can also be transferred to the glass 50 through the limiting protrusion 30. During the welding process, the huge temperature difference at the moment when the high-temperature limiting protrusion 30 contacts the glass 50 causes the stress layer of the glass 50 to be damaged and surface microcracks to be generated, thereby causing the subsequent cracking of the glass 50.

[0068] In this embodiment, on the basis of setting the limiting protrusion 30, the limiting protrusion 30 and the welding part 10 can also be designed as a split type, that is, the limiting protrusion 30 and the welding part 10 are two separate parts, and then at least part of the limiting protrusion 30 is fixed to the welding surface 11 by various methods, that is, the limiting protrusion 30 can be completely fixed on the welding surface 11, or only part of it can be set on the welding surface 11, and the rest of it can be set elsewhere. As for the specific fixing method of the limiting protrusion 30, this application will be described in detail later.

[0069] Due to the separate arrangement of the limiting protrusion 30 and the welding part 10, the welding part 10 and the limiting protrusion 30 can be made of different materials and manufactured separately, that is, the welding part 10 and the limiting protrusion 30 can have different thermal conductivities. In this embodiment, the thermal conductivity of the limiting protrusion 30 can be the second thermal conductivity, and the second thermal conductivity is smaller than the first thermal conductivity, that is, the limiting protrusion 30 with a lower thermal conductivity is used in this embodiment. Since the second thermal conductivity is smaller than the first thermal conductivity, compared with the limiting protrusion 30 in the related art, the limiting protrusion 30 in this embodiment has a lower thermal conductivity and a slower temperature rise. Therefore, when the limiting protrusion 30 in this embodiment contacts the glass 50 during the welding process, it will not cause a sudden change in the temperature of the glass 50 at the contact position, thereby reducing the risk of glass 50 cracking during the welding process.

[0070] From another perspective, when high temperature is transferred to the welding part 10 with a higher thermal conductivity, since the thermal conductivity of the limiting protrusion 30 is smaller than that of the welding part 10, the heat transferred from the welding part 10 to the limiting protrusion 30 is reduced, resulting in a slower temperature rise of the limiting protrusion 30. Therefore, when the limiting protrusion 30 is transferred to the glass 50, the glass 50 is also heated more slowly, which will not cause a sudden change in the temperature of the glass 50, thereby reducing the risk of glass 50 cracking during the welding process.

[0071] In summary, the welding foot structure 1 provided in this embodiment is provided with a limiting protrusion 30, which ensures the distance between the welding surface 11 and the glass 50 during the welding process, so as to ensure that the welding part 10 does not directly contact the glass 50 during the welding process, and at the same time ensures the thickness of the solder 20, thereby improving the welding strength. In addition, the limiting protrusion 30 with low thermal conductivity is selected to reduce the influence of sudden temperature changes on the glass 50 and reduce the problem of cracks caused by welding.

[0072] Optionally, the second thermal conductivity of the limiting protrusion 30 is not greater than 0.3W / mK. Further optionally, the material of the limiting protrusion 30 includes but is not limited to rubber, high temperature resistant tape, etc. Specifically, this embodiment is only schematically described with the welding part 10 being copper and the limiting protrusion 30 being rubber. The thermal conductivity of copper is about 400W / mk, while the thermal conductivity of rubber is about 0.01-0.5W / mk. Adding a rubber limiting protrusion 30 or replacing the limiting protrusion 30 from copper to rubber will greatly reduce the transfer of heat and temperature to the glass 50, and reduce the huge temperature difference between the direct contact positions between the welding foot structure 1 and the glass 50.

[0073] Further optionally, when the limiting protrusion 30 is made of rubber material, the sulfur content of the rubber material is less than 2% by weight, for example, the sulfur content of the rubber material can be less than 2%, 1.8%, 1.6%, 1.4%, 1.2%, 1.0%, 0.8%, 0.6%, 0.4%, 0.2%, etc. Since the limiting protrusion 30 made of rubber material contacts the conductive layer, i.e., the conductive circuit, in the glass 50 during the subsequent welding process, the limiting protrusion 30 can avoid the sulfurization reaction between the limiting protrusion 30 and the conductive circuit by controlling the sulfur content in the rubber material to be less than 2%, thereby causing hot spots.

[0074] Further optionally, the sulfur content of the rubber material is less than 0.1% by weight, for example, the sulfur content of the rubber material may be less than 0.1%, 0.09%, 0.08%, 0.07%, 0.06%, 0.05%, 0.04%, 0.03%, 0.02%, 0.01%, etc.

[0075] Optionally, the solder foot structure 1 may include a connecting portion 40 in addition to the soldering portion 10, and the function of the connecting portion 40 is to connect to the wire outside the solder foot structure 1. Further optionally, the connecting portion 40 may be a short rod type, in which case one end of the connecting portion 40 is connected to the soldering portion 10, and the other end is inclined to extend in a direction away from the glass 50 for connecting the wire, and the solder foot structure 1 of the connecting portion 40 and one soldering portion 10 may be referred to as a single-sided solder foot structure, and in this case the solder foot structure 1 may also be referred to as a single-sided solder terminal, which is mainly used in the solder foot structure 1 of the antenna and the solder foot structure 1 of the explosion-proof joint.

[0076] Further optionally, the connection part 40 may also be an arch bridge type, in which case a welding part 10 is connected to each of the two ends of the connection part 40, and the two welding parts 10 are of the same size and arranged on opposite sides of the connection part 40. The arch bridge protrusion direction of the connection part 40 is away from the glass 50, and a gap 14 is generated between the glass 50 to avoid contact between the connection part 40 and the conductive path of the glass 50, and to facilitate the connection of the wire to the connection part 40. The welding foot structure 1 of the connection part 40 and the two welding parts 10 can be called a bridge welding foot structure, and the welding foot structure 1 can also be called a bridge welding terminal, which is mainly used for the welding foot structure 1 with heating function. The bridge welding foot structure can make both welding surfaces 11 welded to the glass 50, so that the glass 50 is heated at two positions, avoiding local heat sources. Further optionally, the connection part 40 and the welding part 10 are an integrated structure.

[0077] Optionally, the glass 50 includes but is not limited to tempered glass 50 or laminated glass 50. Most windshields 50 adopt the laminated glass 50 solution. Laminated glass 50 is usually composed of two single sheets with a thickness of 1.8 mm or 2.1 mm, and its strength is weaker than that of tempered glass 50. When the welding foot structure 1 in the related art is welded on the laminated glass 50, it is more likely to cause the glass 50 to crack, thereby causing a series of problems, such as reduced yield, customer complaints, driving safety, etc. However, whether it is tempered glass 50 or laminated glass 50, the welding foot structure 1 provided in this embodiment can directly and effectively reduce the risk of tempered glass 50 or even laminated glass 50 cracking due to welding. It can also be understood that the welding foot structure 1 provided in this embodiment is not only suitable for tempered glass 50, but also more suitable for laminated glass 50.

[0078] As can be seen from the above, the limiting protrusion 30 and the welding part 10 are separate structures, and the limiting protrusion 30 can be fixed on the welding surface 11 of the welding part 10. This application provides three fixing methods of the limiting protrusion 30 and the welding part 10, which will be described in detail below.

[0079] Please refer again Figure 1-Figure 3 In this embodiment, the limiting protrusion 30 is sleeved on the welding portion 10.

[0080] In the first embodiment, the limiting protrusion 30 can be directly sleeved on the outside of the welding part 10 in a sleeve manner, so part of the limiting protrusion 30 must be arranged on the welding surface 11, that is, the lower end of the limiting protrusion 30 is arranged on the welding surface 11. The limiting protrusion 30 can avoid direct contact between the welding part 10 and the glass 50 during the welding process, and avoid the glass 50 from being cracked due to instantaneous high temperature. At the same time, the distance between the welding part 10 and the glass 50 can be ensured during the welding process, thereby ensuring a stable thickness of the solder 20.

[0081] Specifically, the limiting protrusion 30 can be annular, and the limiting protrusion 30 is an annular rubber sleeve. During installation, the rubber sleeve is stretched to increase its diameter, and then the stretched rubber sleeve is placed on the upper, lower, front and rear four surfaces of the welding part 10. Then, the stretching of the rubber sleeve is stopped, and the rubber sleeve can be tightened on the welding part 10 by itself, so that the rubber sleeve is fixed on the welding part 10. The above content can be understood as the limiting protrusion 30 can be interference fit with the welding part 10, so as to fix the limiting protrusion 30 on the welding surface 11 of the welding part 10. Optionally, the rubber sleeve is a high-temperature resistant rubber sleeve, that is, a rubber sleeve with poor thermal conductivity. A high-temperature resistant rubber sleeve is added next to the solder 20 of the welding part 10, and the rubber sleeve is made of a material with poor thermal conductivity to ensure that during the welding process, the heated welding part 10 will not directly contact the glass 50, causing damage to the stress layer on the surface of the glass 50 and forming microcracks.

[0082] In this embodiment, the limiting protrusion 30 is sleeved on the welding part 10 so that the lower end of the annular limiting protrusion 30 is fixed to the welding surface 11 of the welding part 10, thereby preventing the limiting protrusion 30 from moving at will, thereby improving the fixing effect of the limiting protrusion 30. At the same time, the sleeved manner makes the installation of the limiting protrusion 30 simpler.

[0083] Please refer to Figure 6-Figure 7 , Figure 6 for Figure 1 A bottom view of the weld foot structure is shown. Figure 7 for Figure 1 The bottom view of the welding foot structure shown is shown after the limiting protrusion is removed. In this embodiment, the welding portion 10 is provided with a limiting groove 12, and part of the limiting protrusion 30 is disposed in the limiting groove 12.

[0084] On the basis that the limiting protrusion 30 is sleeved on the welding part 10, in this embodiment, a limiting groove 12 can be provided on the limiting part 31, and a part of the limiting protrusion 30 can be accommodated in the limiting groove 12, that is, a groove can be processed on the limiting part 31 by various processing means, so that a certain surface or a certain part of the limiting protrusion 30 is set in the groove. For example, a limiting groove 12 can be provided on the side of the welding part 10, which passes through the welding surface 11 and the surface of the welding part 10 away from the welding surface 11, that is, the limiting groove 12 passes through the upper and lower surfaces of the welding part 10, and the limiting protrusion 30 can be sleeved in the limiting groove 12 when sleeved on the welding part 10, that is, the side of the limiting protrusion 30 is set in the limiting groove 12.

[0085] In this embodiment, the limiting groove 12 can be provided to fix the limiting protrusion 30 in the horizontal direction by using the groove wall of the limiting groove 12, so that the limiting protrusion 30 will not fall off due to random movement to the left and right. In addition, while preventing the limiting protrusion 30 from falling off, the position of the limiting protrusion 30 can also be limited to ensure the relative distance between the limiting protrusion 30 and the solder 20.

[0086] In this embodiment, the limiting protrusion 30 satisfies at least one of the following properties: the tensile strength of the limiting protrusion 30 is not less than 1 MPa, and the elongation at break of the limiting protrusion 30 is not less than 50%.

[0087] On the basis that the limiting protrusion 30 is sleeved on the welding portion 10, the present embodiment can make the tensile strength of the limiting protrusion 30 not less than 1MPa and the elongation at break not less than 50%, that is, the limiting protrusion 30 has a certain tensile strength or elongation at break, thereby improving the comprehensive performance of the limiting protrusion 30. Specifically, when the limiting protrusion 30 is sleeved and installed, by making the tensile strength of the limiting protrusion 30 not less than 1MPa and the elongation at break not less than 50%, the limiting protrusion 30 is not easy to break when stretched, and at the same time, it is avoided that the limiting protrusion 30 will break and fall off after a period of time after installation.

[0088] It is worth noting that the limiting protrusion 30 in this embodiment may only meet the tensile strength of not less than 1 MPa, or the limiting protrusion 30 may only meet the tear elongation of not less than 50%, or the limiting protrusion 30 may simultaneously meet the tensile strength of not less than 1 MPa and the tear elongation of not less than 50%.

[0089] Please refer to Figure 8-Figure 10 , Figure 8 It is a schematic diagram of the three-dimensional structure of the welding foot structure in another embodiment of the present application. Fig. 9 for Figure 8 A front view of the solder foot structure is shown. Fig.10 for Figure 8 The bottom view of the welding foot structure is shown. In this embodiment, the limiting protrusion 30 is bonded to the welding surface 11.

[0090] In the second embodiment, the limiting protrusion 30 can be pasted on the welding surface 11, for example, glue can be applied on the rubber cut to a predetermined size, and the rubber can be directly pasted on the welding surface 11 of the welding part 10 through the glue to ensure that the rubber will not fall off the welding surface 11. It is also possible to directly use a high-temperature resistant tape with its own glue, cut the high-temperature resistant tape into a suitable size and directly paste it on the welding surface 11, and fix the high-temperature resistant tape on the welding surface 11 through its own viscosity.

[0091] At this time, the limiting protrusions 30 are all arranged in the welding surface 11, and the installation and fixation of the limiting protrusions 30 are realized by the limiting protrusions 30 of the welding surface 11. Optionally, the pasted limiting protrusions 30 are low thermal conductivity sheets, such as rubber or high temperature resistant tape. By installing and fixing the limiting protrusions 30 on the welding surface 11 by pasting, the operation is convenient and the production difficulty is reduced.

[0092] Please refer to Figure 11-Figure 14 , Fig.11 This is a schematic diagram of the three-dimensional structure of the welding foot structure in another embodiment of the present application. Fig.12 for Fig.11 A front view of the solder foot structure is shown. Fig.13 for Fig.11 A bottom view of the weld foot structure is shown. Fig.14 for Fig.11 In this embodiment, the welding portion 10 is provided with a through hole 13 , and the limiting protrusion 30 passes through the through hole 13 so that one end of the limiting protrusion 30 is disposed on the welding surface 11 .

[0093] In the third embodiment, the installation method of the limiting protrusion 30 can be to open a through hole 13 on the welding surface 11 that passes through the welding surface 11 and the surface away from the welding surface 11, that is, to form a through hole 13 that passes through the upper and lower surfaces of the welding portion 10, and the limiting protrusion 30 passes through the through hole 13, so that one end of the limiting protrusion 30 is fixed to the welding surface 11. In other words, the position of the limiting protrusion 30 in the related art can be changed to a through hole 13 structure, and then the limiting protrusion 30 is added to the through hole 13 structure, and the limiting protrusion 30 is passed through. By opening a through hole 13 on the welding surface 11 that passes through the upper and lower surfaces of the welding portion 10, the limiting protrusion 30 can be inserted into the through hole 13 and then fixed on the welding surface 11, which simplifies the installation steps of the limiting protrusion 30 and facilitates the installation of the limiting protrusion 30.

[0094] Optionally, the limiting protrusion 30 may be made of a low thermal conductivity material, such as rubber or some thermal insulation material.

[0095] Optionally, after the limiting protrusion 30 passes through the through hole 13 , it can be assembled and fixed together with the welding part 10 in various ways, such as secondary injection molding, post-assembly, etc.

[0096] Optionally, two through holes 13 can be set in the welding part 10, and two limiting protrusions 30 pass through the two through holes 13 respectively and fix the two limiting protrusions 30 on the welding surface 11 respectively. The arrangement direction of the two through holes 13 is perpendicular to the arrangement direction of the limiting protrusions 30 and the solder 20 and is symmetrically distributed on the welding surface 11. The distribution positions are evenly arranged at two corners of the welding surface 11.

[0097] Please refer again Fig.14 In this embodiment, the limiting protrusion 30 includes a limiting portion 31, a penetration portion 32, and a clamping portion 33 in sequence along its axial direction, the penetration portion 32 is arranged in the through hole 13, the limiting portion 31 is arranged on the welding surface 11, and the clamping portion 33 is clamped on the surface of the welding portion 10 away from the welding surface 11; the outer diameter of the limiting portion 31 and the outer diameter of the clamping portion 33 are both larger than the aperture of the through hole 13.

[0098] On the basis that the limiting protrusion 30 penetrates the through hole 13 of the welding part 10 and fixes one end on the welding surface 11, the limiting protrusion 30 can be divided into three parts along its axial direction, that is, along the length direction of the limiting protrusion 30: the limiting part 31, the penetrating part 32, and the clamping part 33. When the limiting protrusion 30 penetrates the welding part 10 through the through hole 13, the part protruding from the welding surface 11 is the limiting part 31, the part located in the through hole 13 is the penetrating part 32, and the part of the welding part 10 that is not penetrated by the through hole 13 and is located away from the welding surface 11 is the clamping part 33. The limiting part 31 can be regarded as the limiting protrusion 30 in the related art. The limiting part 31 can be used to avoid direct contact between the welding part 10 and the glass 50 during the welding process, thereby avoiding the glass 50 from being cracked due to instantaneous high temperature. At the same time, the distance between the welding part 10 and the glass 50 can be guaranteed during the welding process, thereby ensuring a stable thickness of the solder 20.

[0099] In this embodiment, the outer diameter of the limiting portion 31 and the outer diameter of the clamping portion 33 can be larger than the aperture of the through hole 13. In other words, the sizes of the limiting portion 31 and the clamping portion 33 are larger than the aperture of the through hole 13. During the installation process, the limiting portion 31 can reduce its size by using its own elasticity when passing through the through hole 13, and the limiting portion 31 restores its size after passing through the through hole 13. After the installation is completed, the limiting portion 31 and the clamping portion 33 can be clamped on the welding portion 10, the limiting portion 31 is clamped on the welding surface 11, and the clamping portion 33 is clamped on the surface of the welding portion 10 away from the welding surface 11. To prevent the limiting protrusion 30 from falling along its axial direction, it can prevent the limiting protrusion 30 from falling from below, and it can also prevent the limiting protrusion 30 from falling from above, so as to achieve the fixing of the limiting protrusion 30 on the limiting portion 31.

[0100] Optionally, the cross-sectional shape of the limiting portion 31 is arc-shaped. The arc-shaped limiting portion 31 can further reduce the contact area with the glass 50, thereby reducing the heat transferred to the glass 50 and further reducing the risk of fragmentation. In this case, the limiting protrusion 30 can be called a thumbtack column.

[0101] The above content introduces in detail the three specific fixing methods of the limiting protrusion 30 of the present application to the welding part 10. In addition to their own unique structures, the three fixing methods also have some common structural, performance and other characteristics, which will be introduced in detail one by one in the following of the present application.

[0102] In this embodiment, the limiting protrusion 30 is elastic, the welding portion 10 has a first hardness, and the limiting protrusion 30 has a second hardness, and the second hardness is smaller than the first hardness.

[0103] From the above content, it can be seen that in the related art, the limiting protrusion 30 made of metal with high thermal conductivity will directly contact the glass 50. At this time, the limiting protrusion 30 and the glass 50 are both hard materials, and the two are in hard contact. Therefore, the glass 50 will be subjected to a large external pressure during the welding process. At the same time, combined with the instantaneous change in temperature, the combined effect of the two will cause the stress at the contact position between the glass 50 and the limiting protrusion 30 to change, thereby damaging the glass 50 and increasing the risk of microcracks or even splits in the glass 50.

[0104] The welding part 10 still has its original high thermal conductivity and high hardness, and the hardness of the welding part 10 is the first hardness. However, the limiting protrusion 30 separated from the welding part 10 in this embodiment not only has a smaller thermal conductivity, but also has elasticity. This means that the hardness of the limiting protrusion 30 is lower and softer, and the limiting protrusion 30 can recover after being squeezed and deformed. Therefore, the limiting protrusion 30 of this embodiment has a second hardness, and this embodiment makes the second hardness less than the first hardness, that is, the hardness of the limiting protrusion 30 is less than the hardness of the welding part 10.

[0105] The limiting protrusion 30 and the welding part 10 in the related art are an integrated structure, so the hardness of the limiting protrusion 30 in the related art is also the first hardness. Therefore, the hardness of the limiting protrusion 30 in this embodiment is less than the hardness of the limiting protrusion 30 in the related art, such as the limiting protrusion 30 of rubber material in this embodiment and the limiting protrusion 30 of metal material in the related art. Compared with the related art, a softer and more elastic limiting protrusion 30 is used in this embodiment. During the welding process, the solder 20 melts, and the limiting protrusion 30 contacts the glass 50. At this time, the limiting protrusion 30 and the glass 50 are in soft and hard contact. Even if an external force is applied to the welding part 10 during welding, the glass 50 will not be damaged, and the stress layer on the surface of the glass 50 will not be destroyed. This method of avoiding hard contact also directly reduces the risk of microcracks or even cracks in the glass 50.

[0106] In this embodiment, the limiting protrusion 30 satisfies at least one of the following properties: the softening temperature of the limiting protrusion 30 is not less than 300° C., and the hardness of the limiting protrusion 30 is greater than 30 Shore A.

[0107] During the welding process, the welding needle of the welding machine conducts heat to the welding part 10, so that the temperature of the welding part 10 rises to above 100°C, and then the heat is conducted to the limiting protrusion 30. Although the thermal conductivity of the limiting protrusion 30 is lower than that of the welding part 10, so that the temperature of the limiting protrusion 30 is lower than that of the welding part 10, the limiting protrusion 30 will also be at a higher temperature. Therefore, the softening temperature of the limiting protrusion 30 can be no less than 300°C in this embodiment, and the hardness of the limiting protrusion 30 is greater than 30ShoreA, thereby improving the softening resistance of the limiting protrusion 30 at high temperatures and improving the hardness of the limiting protrusion 30 itself.

[0108] Therefore, the limiting protrusion 30 can maintain its original shape when the temperature rises and it is squeezed, and will not become soft and deformed, so as to avoid the spacing between the welding surface 11 and the glass 50 being reduced due to the deformation of the limiting protrusion 30, so as to avoid the solder 20 being squeezed out of the welding surface 11. It also avoids the welding surface 11 and the glass 50 being directly in contact, so that the solder 20 is completely squeezed out of the welding surface 11 to cause a cold solder joint, and at the same time avoids the temperature of the glass 50 suddenly changing and the glass 50 cracking due to the high-temperature welding surface 11 directly contacting the glass 50.

[0109] It is worth noting that the limiting protrusion 30 in this embodiment may only meet the softening temperature of not less than 300°C, or the limiting protrusion 30 may only meet the hardness greater than 30Shore A, or the limiting protrusion 30 may simultaneously meet the softening temperature of not less than 300°C and the hardness greater than 30Shore A.

[0110] In this embodiment, the friction coefficient between the limiting protrusion 30 and the glass 50 is not less than 0.4.

[0111] During the welding process, the limiting protrusion 30 will be pressed against the glass 50. At this time, the present embodiment can make the friction coefficient between the limiting protrusion 30 and the glass 50 not less than 0.4. In other words, the limiting protrusion 30 and the glass 50 have a larger friction coefficient, which can improve the friction between the limiting protrusion 30 and the glass 50 during the welding process. The limiting protrusion 30 will not easily slide on the glass 50 to cause the welding foot structure 1 to shift, so that the welding foot structure 1 can be stably and accurately welded to the conductive circuit, ensuring the stability of the welding position during the welding process.

[0112] Please refer again Figure 3 In this embodiment, the thickness of the limiting protrusion 30 is 0.1mm-0.8mm.

[0113] During the welding process, the welding needle of the welding machine applies pressure to the welding part 10, so that the limiting protrusion 30 is pressed against the glass 50, and the limiting protrusion 30 will be deformed to a certain extent. When the thickness of the limiting protrusion 30 is less than 0.1mm, it is easy to make it difficult to ensure the distance between the welding surface 11 and the glass 50 after the limiting protrusion 30 is deformed. Even if the thickness of the solder 20 is reduced, the solder 20 will be squeezed out of the welding surface 11, and the welding surface 11 may contact the glass 50, resulting in damage to the stress layer of the glass 50 and surface microcracks. When the thickness of the limiting protrusion 30 is greater than 0.8mm, the thickness of the limiting protrusion 30 is too large, resulting in too thin solder 20, resulting in insufficient solder 20 and cold soldering, or the thickness of the solder 20 is also increased, which requires more solder 20, thereby increasing the cost.

[0114] Therefore, in this embodiment, the thickness of the limiting protrusion 30 (such as Figure 3 In other words, the limiting protrusion 30 has a suitable thickness, and after being deformed to a certain extent under pressure during the welding process, the limiting protrusion 30 can still maintain a sufficient thickness, which not only ensures the thickness of the solder 20, but also prevents the welding surface 11 from contacting the glass 50 during the welding process, and does not make the limiting protrusion 30 too thick, thereby requiring more solder 20.

[0115] Specifically, the thickness of the limiting protrusion 30 can be 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, or 0.8 mm.

[0116] Please refer again Figure 3 In this embodiment, the thickness of the solder 20 is greater than the thickness of the limiting protrusion 30, so that the surface of the solder 20 used to approach the glass 50 is closer to the glass 50 than the surface of the limiting protrusion 30 used to approach the glass 50.

[0117] During the welding process, the solder 20 melts so that the limiting protrusion 30 abuts against the glass 50, and the solder 20 is welded to the glass 50 after cooling. Figure 3 T2 in the figure) is greater than the thickness of the limiting protrusion 30 (as shown in Figure 3 In other words, the thickness of the limiting protrusion 30 is smaller than the thickness of the solder 20 before melting (as shown in FIG. Figure 3In the figure, T1 is smaller than T2. ​​In this way, the solder 20 can contact the glass 50 before the limiting protrusion 30 during welding. When the limiting protrusion 30 is pressed against the glass 50 after the solder 20 is melted, the melted solder 20 contacts the welding surface 11 and the glass 50 at the same time, ensuring that there is enough solder 20 so that the solder 20 can firmly fix the welding surface 11 and the glass 50 after cooling, ensuring a more solid welding and avoiding the situation of a cold welding where the solder 20 fails to contact the glass 50.

[0118] Optionally, the height difference (T2-T1) between the solder 20 and the limiting protrusion 30 can be controlled within 0.3 mm, that is, the thickness of the solder 20 is 0.4 mm-1.1 mm. Specifically, the thickness of the solder 20 can be 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm.

[0119] In this embodiment, the solder 20 is spaced apart from the periphery of the welding surface 11. In other words, the solder 20 does not cover the entire welding surface 11, but a certain distance is reserved from the periphery of the welding surface 11 to prevent the solder 20 from overflowing the welding surface 11 when it melts.

[0120] Please refer again Figure 3 In this embodiment, along the arrangement direction of the limiting protrusion 30 and the solder 20, the width of the limiting protrusion 30 is 1mm-4mm.

[0121] When the limiting protrusion 30 is fixed to the welding surface 11 of the welding portion 10 by various means such as sleeve or perforation, the width of the limiting protrusion 30 (eg Figure 3 It is worth noting that the width direction of the limiting protrusion 30 can be understood as the arrangement direction of the limiting protrusion 30 and the solder 20, that is, Figure 3 As shown in the D direction.

[0122] When the width of the limiting protrusion 30 is less than 1 mm, the limiting protrusion 30 is too narrow, which will result in the limiting protrusion 30 having too low a tensile strength and being easily broken. In addition, the limiting protrusion 30 with too small a size is difficult to install, and is not convenient for assembling the solder foot structure 1. When the width of the limiting protrusion 30 is greater than 4 mm, if the width of the solder 20 remains unchanged, the area of ​​the welding surface 11 will become larger, thereby causing the overall size of the solder foot structure 1 to be too large.

[0123] Therefore, in this embodiment, the width of the limiting protrusion 30 can be 1mm-4mm, which not only ensures that the limiting protrusion 30 is not too narrow, not easy to break, and is easy to install, but also does not make the area of ​​the welding surface 11 larger, thereby causing the overall size of the welding foot structure 1 to be too large. Therefore, the limiting protrusion 30 in this embodiment can be applied to the above-mentioned solution of the limiting protrusion 30 sleeved on the welding part 10 and the solution of the limiting protrusion 30 passing through the welding part 10 through the through hole 13.

[0124] Specifically, the width of the limiting protrusion 30 can be 1 mm, 2 mm, 3 mm, or 4 mm.

[0125] Please refer again Fig. 9 In this embodiment, along the arrangement direction of the limiting protrusion 30 and the solder 20, the width of the limiting protrusion 30 is 2mm-5mm.

[0126] When the limiting protrusion 30 is fixed to the welding portion 10 by bonding, the width of the limiting protrusion 30 (eg Fig. 9 In the figure, W2 is 2 mm to 5 mm. At this time, the width direction of the limiting protrusion 30 can also be understood as the arrangement direction of the limiting protrusion 30 and the solder 20, that is, Fig. 9 As shown in the D direction.

[0127] When the width of the limiting protrusion 30 is less than 2 mm, the limiting protrusion 30 is too narrow, that is, the bonding area is too small, which will lead to insufficient bonding force and easy to fall off, and the too narrow limiting protrusion 30 is not convenient for pasting and installation, and the installation is difficult. When the width of the limiting protrusion 30 is greater than 5 mm, if the width of the solder 20 remains unchanged, the area of ​​the welding surface 11 will become larger, and then the overall size of the solder foot structure 1 will be too large.

[0128] Therefore, in this embodiment, the width of the limiting protrusion 30 can be 2mm-5mm, which not only ensures that the limiting protrusion 30 is not too narrow, does not make the bonding unstable and easy to fall off, and is easy to install, but also does not make the area of ​​the welding surface 11 larger, thereby causing the overall size of the welding foot structure 1 to be too large. Therefore, the limiting protrusion 30 in this embodiment can be applied to the above-mentioned bonding welding part 10. It is worth noting that the width of the limiting protrusion 30 in this embodiment is slightly wider than the width of the limiting protrusion 30 in the previous embodiment, mainly because the limiting protrusion 30 needs to be bonded to the welding surface 11. In order to ensure that the adhesive tape is bonded stably and does not fall off, and to ensure the bonding area, the required width is wider than that of the sleeve and penetration schemes.

[0129] Please refer again Figure 3 In this embodiment, along the arrangement direction of the limiting protrusion 30 and the solder 20 , there is a gap 14 between the limiting protrusion 30 and the solder 20 .

[0130] When the limiting protrusion 30 is fixed to the welding portion 10, the limiting protrusion 30 and the solder 20 can be arranged in the direction, that is, Figure 3 As shown in the direction D in the middle, a certain gap 14 (such as Figure 3 H in the figure). During welding, the solder 20 will diffuse around after melting, so the setting of the gap 14 can prevent the solder 20 from overflowing outside the welding surface 11 and affecting the electrical connection of the external circuit. In addition, when the solder foot structure 1 is a bridge solder foot structure, that is, it includes a connection part 40 and two welding parts 10 on opposite sides of the connection part 40, the existence of the gap 14 can ensure that the solder 20 has a planar expansion space when the thickness is reduced after being pressed after being heated and melted, and does not overflow to the bottom of the limiting protrusion 30, resulting in inconsistent heights of the welding points at both ends, affecting the welding strength, and even causing the solder 20 to overflow outside the welding surface 11, affecting the electrical connection of the external circuit.

[0131] Optionally, the gap 14 between the limiting protrusion 30 and the solder 20 is 0.3mm-1mm. When the gap 14 between the limiting protrusion 30 and the solder 20 is less than 0.3mm, during the welding process, the gap 14 is too small, the thickness of the solder 20 after melting becomes smaller, and the solder 20 has no expansion space on the plane, and then overflows to the lower surface of the limiting protrusion 30, resulting in inconsistent heights of the limiting protrusions 30 on both sides, which in turn causes the solder foot structure 1 to tilt, affecting the welding strength, and even causing the solder 20 to overflow outside the welding surface 11, affecting the electrical connection of the external circuit. When the gap 14 between the limiting protrusion 30 and the solder 20 is greater than 1mm, the gap 14 between the solder 20 and the limiting protrusion 30 is too large, resulting in too little solder 20, making the welding unstable.

[0132] Therefore, in this embodiment, the gap 14 between the limiting protrusion 30 and the solder 20 can be 0.3 mm-1 mm, which not only prevents the solder 20 from overflowing outside the welding surface 11, but also prevents the welding from being unstable due to the excessive gap 14. Specifically, the gap 14 between the limiting protrusion 30 and the solder 20 can be 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, or 1 mm.

[0133] Please refer again Figure 1 , Figure 8 , Fig.11 In this embodiment, a positioning mark 15 is provided on the surface of the welding portion 10 away from the welding surface 11, and the positioning mark 15 is used to position and support the welding device.

[0134] During the welding process, the welding needle of the welding machine needs to be pressed against the surface of the welding part 10 away from the welding surface 11 to heat the welding part 10. In this embodiment, a positioning mark 15 can be set on the surface of the welding part 10 away from the welding surface 11, that is, the upper surface of the welding part 10. The positioning mark 15 is used to indicate the position where the welding needle is pressed, and is used as a mark for positioning the tooling during welding. It is used to position the welding needle of the welding machine, making the welding process more accurate, that is, the welding needle is accurately positioned on the upper surface of the position where the solder 20 is located, reducing the difficulty of positioning the welding needle.

[0135] Optionally, the positioning mark 15 is a groove formed by shallow stamping, and the groove is the positioning mark 15. Further optionally, the depth of the groove is small so as to avoid forming an obvious convex point on the welding surface 11, and avoid the convex point contacting the glass 50 to increase the risk of glass 50 breaking.

[0136] Please refer to Figure 2 and Fig.16 , Fig.16 for Figure 2 The front view of another embodiment of the solder foot structure is shown. In this embodiment, along the arrangement direction of the limiting protrusion 30 and the solder 20, the limiting protrusion 30 is arranged on one side or two opposite sides of the solder 20.

[0137] When the limiting protrusion 30 is installed on the welding part 10, the number of the limiting protrusion 30 can be one, two, or even more than two. When the number of the limiting protrusion 30 is one, the limiting protrusion 30 can be arranged on one side of the solder 20. When the number of the limiting protrusion 30 is two or more, multiple limiting protrusions 30 can be arranged on opposite sides of the solder 20. This embodiment is only schematically described with one limiting protrusion 30 and two limiting protrusions 30 on each welding part 10. Two limiting protrusions 30 can be arranged on opposite sides of the solder 20.

[0138] In the present embodiment, the limiting protrusion 30 is arranged on one side of the solder 20 or on both sides of the solder 20 at the same time. On the basis of ensuring that the welding part 10 and the glass 50 are prevented from contacting, ensuring the thickness of the solder 20, and reducing the risk of cracking, the stability of the welding part 10 and the glass 50 during welding can be further increased. For example, even in a single-sided solder foot structure, the limiting protrusion 30 can be arranged on both sides of the solder 20 at the same time so that the solder foot structure 1 will not tilt.

[0139] Please refer to Figure 6 and Fig.15 , Fig.15 for Figure 6A bottom view of another embodiment of the solder foot structure is shown. In this embodiment, the solder foot structure 1 includes a connecting portion 40 for connecting a wire, and two soldering portions 10, the two soldering portions 10 are connected to opposite sides of the connecting portion 40, and the two limiting protrusions 30 in the two soldering portions 10 are closer to or farther away from each other than the two solders 20.

[0140] When the solder foot structure 1 includes a connecting portion 40 and two soldering portions 10, the solder foot structure 1 can be referred to as a bridge solder foot structure. The specific structure of the bridge solder foot structure, such as the connecting portion 40 and the two soldering portions 10, has been described in detail above in this application, and will not be repeated in this embodiment.

[0141] Since there are two soldering parts 10, and each soldering part 10 is provided with a limiting protrusion 30 and a solder 20, there are two limiting protrusions 30 and two solders 20 in total. In this embodiment, the two limiting protrusions 30 can be closer to each other or farther away from each other than the two solders 20. In other words, the two limiting protrusions 30 are arranged symmetrically, and are divided into balanced positions, arranged inwardly at the same time, or arranged outwardly at the same time. It can also be understood that the two limiting protrusions 30 will not be arranged in a way of one inside and one outside.

[0142] Such a symmetrical layout can maintain the balance of the solder foot structure 1, so that the solder foot structure 1 will not tilt to one side, causing the soldering surface 11 of the soldering portion 10 to directly contact the glass 50, or cause one side of the solder foot to be lifted up, so that one side of the solder foot is not soldered or the soldering is not firm, resulting in solder 20 overflow or cold soldering, affecting the connection performance.

[0143] Please refer to Fig.17 , Fig.17 Schematic diagram of a glass assembly in one embodiment of the present application. This embodiment provides a glass assembly 2, the glass assembly 2 comprises a glass 50 and a soldering foot structure 1 as provided in the above embodiment of the present application, the soldering foot structure 1 being soldered to the glass 50.

[0144] The glass components 2 provided in this embodiment include but are not limited to electric heating glass 50, antenna glass 50, breakage alarm glass 50, etc. As long as the glass components 2 that can integrate electronic functions on the glass 50 are the glass components 2 referred to in this embodiment.

[0145] The glass assembly 2 includes a glass 50 and a solder foot structure 1. The solder foot structure 1 is soldered to the conductive circuit in the glass 50, so that the external wire can be electrically connected to the conductive circuit in the glass 50, thereby enabling the glass assembly 2 to achieve a series of electronic functions. By using the solder foot structure 1 in this embodiment, the distance between the welding surface 11 and the glass 50 during the welding process is guaranteed to ensure that the welding portion 10 does not directly contact the glass 50 during the welding process, while ensuring the thickness of the solder 20 and improving the welding strength. In addition, the selection of the limiting protrusion 30 with a low thermal conductivity coefficient reduces the influence of the sudden temperature change on the glass 50, reduces the problem of cracks caused by welding, and improves the yield rate.

[0146] Please refer to Fig.18 , Fig.18 Schematic diagram of a vehicle in one embodiment of the present application. This embodiment provides a vehicle 3 , the vehicle 3 comprising a body panel 60 and a glass assembly 2 as provided in the above embodiment of the present application, the glass assembly 2 being mounted on the body panel 60 .

[0147] The vehicle 3 referred to in this embodiment is a vehicle 3 with electronic functions integrated on the vehicle glass 50. As for the specific type of the vehicle 3, this embodiment does not limit it here, for example, it can be a sedan, SUV, jeep, truck, etc. During assembly, the glass assembly 2 is installed on the body panel 60 and fixed, and then the glass assembly 2 is electrically connected to the wire inside the vehicle 3 so that the vehicle 3 can realize a series of electronic functions on the vehicle glass 50, such as heating and defogging, antenna, and crack alarm. By using the glass assembly 2 of this embodiment, the risk of glass 50 cracking is reduced, customer complaints are reduced, the life of the glass 50 is increased, and driving safety is improved.

[0148] In the description of the present application, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0149] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0150] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated. It can be mechanically connected or electrically connected. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0151] The above describes the contents provided by the implementation methods of the present application in detail, and describes and illustrates the principles and implementation methods of the present application. These descriptions are only used to help understand the method and its core ideas of the present application. However, the contents of this specification should not be construed as limiting the present application, and those skilled in the art may make various changes and modifications to the present application without departing from the spirit and scope of the present application. These modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents.

Claims

1. A welding foot structure, characterized in that: The solder foot structure comprises: A welding portion having a welding surface for being close to the glass, wherein the welding portion has a first thermal conductivity; Solder, fixed on the welding surface; The limiting protrusion is at least partially fixed to the welding surface, the limiting protrusion and the welding part are a split structure, the limiting protrusion has a second thermal conductivity, and the second thermal conductivity is smaller than the first thermal conductivity.

2. The solder foot structure according to claim 1, characterized in that: The limiting protrusion is sleeved on the welding portion.

3. The solder foot structure according to claim 2, characterized in that: The welding portion is provided with a limiting groove, and the limiting protrusion is arranged in the limiting groove.

4. The solder foot structure according to claim 2, characterized in that: The limiting protrusion satisfies at least one of the following properties: The tensile strength of the limiting protrusion is not less than 1MPa; The breaking elongation of the limiting protrusion is not less than 50%.

5. The solder foot structure according to claim 1, characterized in that: The limiting protrusion is bonded to the welding surface.

6. The solder foot structure according to claim 1, characterized in that: The welding portion is provided with a through hole, and the limiting protrusion passes through the through hole so that one end of the limiting protrusion is arranged on the welding surface.

7. The solder foot structure according to claim 6, characterized in that: The limiting protrusion includes a limiting portion, a penetration portion, and a clamping portion in sequence along its axial direction, the penetration portion is arranged in the through hole, the limiting portion is arranged on the welding surface, and the clamping portion is clamped on the surface of the welding portion away from the welding surface; the outer diameter of the limiting portion and the outer diameter of the clamping portion are both larger than the aperture of the through hole.

8. The solder foot structure according to any one of claims 1 to 7, characterized in that: The limiting protrusion has elasticity, the welding portion has a first hardness, and the limiting protrusion has a second hardness, and the second hardness is smaller than the first hardness.

9. The solder foot structure according to any one of claims 1 to 7, characterized in that: The limiting protrusion satisfies at least one of the following properties: The softening temperature of the limiting protrusion is not less than 300°C; The hardness of the limiting protrusion is greater than 30 Shore A.

10. The solder foot structure according to any one of claims 1 to 7, characterized in that: The friction coefficient between the limiting protrusion and the glass is not less than 0.

4.

11. The solder foot structure according to any one of claims 1 to 7, characterized in that: The thickness of the limiting protrusion is 0.1mm-0.8mm.

12. The solder foot structure according to claim 11, characterized in that: The thickness of the solder is greater than the thickness of the limiting protrusion, so that the surface of the solder used to be close to the glass is closer to the glass than the surface of the limiting protrusion used to be close to the glass.

13. The solder foot structure according to claim 2 or 6, characterized in that: Along the arrangement direction of the limiting protrusion and the solder, the width of the limiting protrusion is 1mm-4mm.

14. The solder foot structure according to claim 5, characterized in that: Along the arrangement direction of the limiting protrusion and the solder, the width of the limiting protrusion is 2mm-5mm.

15. The solder foot structure according to any one of claims 1 to 7, characterized in that: Along the arrangement direction of the limiting protrusion and the solder, there is a gap between the limiting protrusion and the solder.

16. The solder foot structure according to any one of claims 1 to 7, characterized in that: A surface of the welding portion facing away from the welding surface is provided with a positioning mark, and the positioning mark is used to position and abut the welding device.

17. The solder foot structure according to any one of claims 1 to 7, characterized in that: Along the arrangement direction of the limiting protrusion and the solder, the limiting protrusion is arranged on one side or two opposite sides of the solder.

18. The solder foot structure according to any one of claims 1 to 7, characterized in that: The solder foot structure includes a connecting portion for connecting a wire and two soldering portions, wherein the two soldering portions are connected to opposite sides of the connecting portion, and the two limiting protrusions in the two soldering portions are closer to or farther away from each other than the two solders.

19. A glass assembly, characterized in that: The glass assembly comprises glass and a welding foot structure as described in any one of claims 1 to 18, wherein the welding foot structure is welded to the glass.

20. A vehicle, characterized in that: The vehicle comprises a vehicle body panel, and the glass assembly as claimed in claim 19, wherein the glass assembly is mounted on the vehicle body panel.

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