Buffer device for multilayer uniform pressing of circuit board

Abstract

The invention relates to the related technical field of circuit board manufacturing, in particular to a circuit board multilayer uniform pressing buffer device which comprises a fixing frame, a pressing assembly is arranged on the upper surface of a top plate, a mold assembly is arranged on the inner side surface of the pressing assembly, and a buffer assembly is arranged on the outer side surface of the mold assembly. And a typesetting assembly is arranged on the upper surface of the buffer assembly. According to the buffer device for multilayer uniform pressing of the circuit board, through the arrangement of the buffer assembly and the typesetting assembly, the circuit board needs to be arranged, new kraft paper is used for preventing skid, a high-expansion steel plate is used for buffering pressure, a prepreg is heated and melted to bond and fix the circuit board, during pressing, a pressing plate drives an upper mold, and the pressure passes through a buffer pad, a sliding plate and a connecting block to compress a buffer spring; the damper converts and consumes energy, and the high-expansion steel plate, the prepreg and the new kraft paper act together to uniformly distribute pressure, so that multi-layer uniform lamination is realized, the plate thickness balance and the adhesive uniformity are ensured, and the damage to the circuit board is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field related to circuit board manufacturing, and in particular to a buffer device for uniformly pressing multiple layers of a circuit board. Background Art

[0002] Circuit boards are an indispensable component of electronic devices. They provide a mechanical platform for fixing and connecting electronic components and transmitting electronic signals through conductive paths. Circuit boards make the layout and connection of electronic components more orderly, stable and reliable. The manufacturing process of circuit boards includes multiple steps such as design, manufacturing document preparation, material selection, image transfer, etching, lamination, drilling, electroplating, solder mask, surface treatment, component assembly and welding. As electronic devices develop towards miniaturization and high performance, circuit board manufacturing technology is also constantly improving, such as the use of thinner substrates, finer line widths, and higher density assembly technology. The design and manufacture of circuit boards is an important link in the field of electronic engineering. It directly affects the performance, reliability and cost of electronic products. In the manufacture of multi-layer circuit boards, multi-layer circuit boards need to be pressed together. Therefore, a buffer device for uniformly pressing multiple layers of circuit boards is particularly needed.

[0003] However, in the existing circuit board production process, uniform adhesive distribution and balanced board thickness during the lamination stage are crucial. However, traditional lamination technology has shortcomings in terms of pressure uniformity and buffering capacity, which may cause fluctuations and instability in the quality of the final circuit board. Summary of the invention

[0004] The purpose of the present invention is to provide a buffer device for uniformly pressing multiple layers of a circuit board, so as to solve the problem that in the production process of the existing circuit board proposed in the above background technology, uniform distribution of adhesive and balance of board thickness in the pressing stage are crucial, however, the traditional pressing technology has deficiencies in the two aspects of pressure uniformity and buffering capacity, which may cause fluctuations and instability in the quality of the final circuit board.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a buffer device for uniformly pressing multiple layers of a circuit board, comprising a fixing frame, the inner surface of the fixing frame is fixedly connected to a control center, one side surface of the fixing frame is fixedly connected to a side plate, the upper surface of the side plate is threadedly connected to a support rod, the upper surface of the fixing frame is fixedly connected to a panel, the upper surface of the panel is fixedly connected to a vertical plate, the upper surface of the vertical plate is fixedly connected to a top plate, a pressing assembly is arranged on the upper surface of the top plate, a mold assembly is arranged on the inner surface of the pressing assembly, the mold assembly comprises a limiting groove, a limiting block, a sliding block, a positioning groove, a positioning block, a lower mold, a guide column, an upper mold and a guide groove, a buffer assembly is arranged on the outer surface of the mold assembly, and a typesetting assembly is arranged on the upper surface of the buffer assembly;

[0006] The buffer assembly includes a sliding plate, a sliding hole, a buffer pad, a connecting block, a buffer spring and a damper. The outer surface of the guide column is slidably connected to the sliding plate, the upper surface of the sliding plate is provided with a sliding hole, the upper surface of the sliding plate is fixedly connected to the buffer pad, the lower surface of the sliding plate is fixedly connected to the connecting block, the lower surface of the connecting block is fixedly connected to the buffer spring, and the lower surface of the buffer spring is fixedly connected to the damper.

[0007] Preferably, the side panels are arranged in multiple groups on the outer surface of the fixing frame, and the vertical panels are symmetrically arranged about the central axis of the top panel.

[0008] Preferably, the sliding holes are arranged in a plurality of groups on the surface of the sliding plate, and the inner dimensions of the sliding holes match the outer dimensions of the guide posts.

[0009] Preferably, the connection blocks are provided in multiple groups on the lower surface of the sliding plate, and the damper is fixedly connected to the lower mold.

[0010] Preferably, the pressing assembly includes a hydraulic cylinder, a limiting column, a base plate, a pressing plate and a through hole, the upper surface of the top plate is fixedly connected to the hydraulic cylinder, the lower surface of the top plate is fixedly connected to the limiting column, the lower surface of the limiting column is fixedly connected to the base plate, the lower surface of the hydraulic cylinder is fixedly connected to the pressing plate, and the upper surface of the pressing plate is provided with a through hole.

[0011] Preferably, a plurality of groups of the limiting columns are arranged on the upper surface of the top plate, and the outer dimensions of the limiting columns match the inner dimensions of the through holes.

[0012] Preferably, a limiting groove is provided on the inner surface of the bottom plate, the inner surface of the limiting groove is slidably connected to the limiting block, one side surface of the limiting block is fixedly connected to the sliding block, the upper surface of the sliding block is provided with a positioning groove, the upper surface of the positioning groove is slidably connected to the positioning block, the upper surface of the positioning block is fixedly connected to the lower mold, the upper surface of the lower mold is fixedly connected to a guide column, the outer surface of the guide column is slidably connected to the upper mold, and the lower surface of the upper mold is provided with a guide groove.

[0013] Preferably, the inner dimension of the positioning groove matches the outer dimension of the positioning block, and a plurality of groups of positioning grooves are provided on the surface of the sliding block.

[0014] Preferably, the upper mold is fixedly connected to the pressing plate, the outer dimensions of the guide posts are consistent with the inner wall dimensions of the guide grooves, and the guide posts are provided in multiple groups.

[0015] Preferably, the typesetting component includes a first new kraft paper, a first high expansion steel plate, a first layer of circuit board, a first semi-cured sheet, a second semi-cured sheet, a second layer of circuit board, a third semi-cured sheet, a fourth semi-cured sheet, a third layer of circuit board, a second high expansion steel plate and a second new kraft paper, the first new kraft paper is placed on the upper surface of the buffer pad, the first high expansion steel plate is placed on the upper surface of the first new kraft paper, the first layer of circuit board is placed on the upper surface of the first high expansion steel plate, the first semi-cured sheet is placed on the upper surface of the first layer of circuit board, the second semi-cured sheet is placed on the upper surface of the first semi-cured sheet, the second layer of circuit board is placed on the upper surface of the second semi-cured sheet, the third semi-cured sheet is placed on the upper surface of the second layer of circuit board, the fourth semi-cured sheet is placed on the upper surface of the third semi-cured sheet, the third layer of circuit board is placed on the upper surface of the fourth semi-cured sheet, the second high expansion steel plate is placed on the upper surface of the third layer of circuit board, and the second new kraft paper is placed on the upper surface of the second high expansion steel plate.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: the buffer device for uniformly pressing multiple layers of a circuit board, through the arrangement of a buffer component and a layout component, requires reasonable layout before the circuit board pressing operation. First, a first new kraft paper is placed on the surface above the buffer pad. The new kraft paper has an anti-slip effect and can prevent the sliding and dislocation of the layers of materials during subsequent operations. Then, a first high-expansion steel plate is placed above the first new kraft paper. The high-expansion steel plate can play a role in buffering pressure during the pressing process. When subjected to the pressure applied by the pressing component, the high-expansion steel plate can deform to a certain extent according to the size of the pressure, thereby dispersing the pressure. The pressure is more evenly transmitted to each layer of circuit boards and prepregs. The first layer of circuit boards is placed on the first high expansion steel plate, and then the first prepreg, the second prepreg, the second layer of circuit boards, the third prepreg, the fourth prepreg, and the third layer of circuit boards are placed on the first layer of circuit boards in sequence. The prepregs will melt due to heat during the lamination process and fill in the gaps between the circuit boards to bond and fix the circuit boards. Different prepregs can be selected according to the requirements of the circuit boards and process parameters to ensure good bonding effect and electrical performance. The second high expansion steel plate is placed on the third layer of circuit boards to further enhance the buffering effect. Finally, on the second A second new kraft paper is placed above the high expansion steel plate, which also plays an anti-skid role and ensures the stability of the entire layout structure during the lamination process. When the lamination assembly starts working, the lamination plate moves downward and transmits the pressure to the layout assembly through the upper mold. At this time, the high expansion steel plate, prepreg and new kraft paper work together to evenly distribute the pressure, achieve multi-layer uniform lamination of the circuit board, and ensure the balance of the board layer thickness and uniform distribution of the adhesive. When the circuit board is pressed, the upper mold presses the lower mold, and the guide column plays a guiding role. The sliding plate can slide along the outer surface of the guide column. When the pressure is transmitted, it first contacts the buffer pad on the upper surface of the sliding plate, which buffers the pressure. The pad initially absorbs and relieves part of the pressure, and then the pressure continues to be transmitted downward, causing the sliding plate to move downward, and the connecting block under the sliding plate moves with the sliding plate, and the buffer spring connected under the connecting block begins to be compressed. During the compression process, the buffer spring further absorbs the pressure through its own elastic deformation to play a buffering role. At the same time, the damper connected to the buffer spring also begins to play a role. The damper converts the energy generated by the pressure into other forms of energy such as heat energy through its internal damping mechanism and gradually consumes it, thereby reducing the impact of pressure and ensuring that the entire device can smoothly buffer when under pressure, protecting the circuit board and reducing damage to the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the side appearance structure of the present invention;

[0018] Figure 2This is a schematic diagram of the structure of the side panels and support rods cooperating with each other in the present invention;

[0019] Figure 3 This is a schematic diagram of the structure of the panel and the vertical plate cooperating with each other in the present invention;

[0020] Figure 4 This is a schematic diagram of the structure of the limit block and the sliding block cooperating with each other in the present invention;

[0021] Figure 5 It is a schematic diagram of the structure of the cooperation between the pressing plate and the upper mold of the present invention;

[0022] Figure 6 This is a schematic diagram of the structure of the sliding plate and the buffer pad cooperating with each other in the present invention;

[0023] Figure 7 This is a schematic diagram of the structure of the lower mold and the guide column cooperating with each other in the present invention;

[0024] Figure 8 For the present invention Figure 1 The enlarged structural diagram at A in the middle;

[0025] Fig. 9 For the present invention Figure 7 Enlarged structural diagram at B in the middle.

[0026] In the figure: 1, fixed frame; 2, control center; 3, side plate; 4, support rod; 5, panel; 6, vertical plate; 7, top plate; 8, pressing assembly; 801, hydraulic cylinder; 802, limit column; 803, bottom plate; 804, pressing plate; 805, through hole; 9, mold assembly; 901, limit groove; 902, limit block; 903, sliding block; 904, positioning groove; 905, positioning block; 906, lower mold; 907, guide column; 908, upper mold; 909, guide groove; 10, buffer assembly; 1001, sliding plate; 10 02, sliding hole; 1003, buffer pad; 1004, connecting block; 1005, buffer spring; 1006, damper; 11, typesetting component; 1101, first new kraft paper; 1102, first high expansion steel plate; 1103, first layer of circuit board; 1104, first semi-cured sheet; 1105, second semi-cured sheet; 1106, second layer of circuit board; 1107, third semi-cured sheet; 1108, fourth semi-cured sheet; 1109, third layer of circuit board; 1110, second high expansion steel plate; 1111, second new kraft paper. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0028] See also Figure 1-9 The present invention provides a technical solution: a buffer device for uniformly pressing multiple layers of a circuit board, comprising a fixing frame 1, a control center 2 is fixedly connected to the inner surface of the fixing frame 1, a side panel 3 is fixedly connected to the one side surface of the fixing frame 1, a support rod 4 is threadedly connected to the upper surface of the side panel 3, a panel 5 is fixedly connected to the upper surface of the fixing frame 1, a vertical plate 6 is fixedly connected to the upper surface of the panel 5, a top plate 7 is fixedly connected to the upper surface of the vertical plate 6, a pressing assembly 8 is arranged on the upper surface of the top plate 7, a mold assembly 9 is arranged on the inner surface of the pressing assembly 8, the mold assembly 9 comprises a limiting groove 901, a limiting block 902, a sliding block 903, a positioning groove 904, a positioning block 905, a lower mold 906, a guide column 907, an upper mold 908 and a guide groove 909, a buffer assembly 10 is arranged on the outer surface of the mold assembly 9, and a typesetting assembly 11 is arranged on the upper surface of the buffer assembly 10;

[0029] The buffer assembly 10 includes a sliding plate 1001, a sliding hole 1002, a buffer pad 1003, a connecting block 1004, a buffer spring 1005 and a damper 1006. The outer surface of the guide column 907 is slidably connected to the sliding plate 1001, the upper surface of the sliding plate 1001 is provided with a sliding hole 1002, the upper surface of the sliding plate 1001 is fixedly connected to the buffer pad 1003, the lower surface of the sliding plate 1001 is fixedly connected to the connecting block 1004, and the connecting The lower surface of the block 1004 is fixedly connected with a buffer spring 1005, and the lower surface of the buffer spring 1005 is fixedly connected with a damper 1006. Through the arrangement of the sliding plate 1001, the sliding hole 1002, the buffer pad 1003, the connecting block 1004, the buffer spring 1005 and the damper 1006, when the circuit board is pressed, the upper mold 908 presses the lower mold 906, and the guide column 907 plays a guiding role, and the sliding plate 1001 can move along the guide column The outer surface of 907 slides, and when the pressure is transmitted, it first contacts the buffer pad 1003 on the upper surface of the sliding plate 1001, and the buffer pad 1003 initially absorbs and relieves part of the pressure. Then, the pressure continues to be transmitted downward, causing the sliding plate 1001 to move downward, and the connecting block 1004 under the sliding plate 1001 moves together with the sliding plate 1001, and the buffer spring 1005 connected under the connecting block 1004 begins to be compressed. During the compression process, the buffer spring 1005 further absorbs the pressure through its own elastic deformation to play a buffering role. At the same time, the damper 1006 connected to the buffer spring 1005 also begins to play a role. The damper 1006 converts the energy generated by the pressure into other forms of energy such as heat energy through its internal damping mechanism and gradually consumes it, thereby reducing the impact of the pressure and ensuring that the entire device can smoothly buffer when subjected to pressure, protecting the circuit board and reducing damage to the circuit board.

[0030] Furthermore, multiple groups of side panels 3 are arranged on the outer surface of the fixing frame 1, and the vertical panels 6 are symmetrically arranged with respect to the central axis of the top panel 7. Through the arrangement of the side panels 3, when in use, the surface of the side panels 3 is threadedly connected with the support rods 4. The multiple groups of side panels 3 and the support rods 4 can support and reinforce the fixing frame 1 from different directions, thereby improving the stability and anti-deformation ability of the fixing frame 1.

[0031] Furthermore, multiple groups of sliding holes 1002 are arranged on the surface of the sliding plate 1001, and the inner size of the sliding holes 1002 is consistent with the outer size of the guide column 907. Through the arrangement of the sliding holes 1002, when in use, the multiple groups of sliding holes 1002 cooperate with the guide column 907, which increases the stability of the sliding plate 1001 sliding on the guide column 907. When external pressure acts on the entire device, the sliding plate 1001 is subjected to forces in different directions, and the multiple groups of sliding holes 1002 work together to ensure that the sliding plate 1001 always slides smoothly along the established direction of the guide column 907 without deviation or shaking.

[0032] Furthermore, the connecting block 1004 is provided with multiple groups on the lower surface of the sliding plate 1001, and the damper 1006 is fixedly connected to the lower mold 906. Through the setting of the damper 1006, when in use, the damper 1006 is fixedly connected to the lower mold 906. When the external force causes the sliding plate 1001 to move downward, the connecting block 1004 transmits the force to the buffer spring 1005. While the buffer spring 1005 is compressed, a part of the force is also transmitted to the damper 1006 through the connecting block 1004. Since the damper 1006 is fixedly connected to the lower mold 906, it can transmit the force to the lower mold 906, and at the same time, through its own damping effect, it converts the energy generated by the pressure into other forms of energy such as heat energy and consumes it, thereby reducing the impact of the pressure.

[0033] Furthermore, the pressing assembly 8 includes a hydraulic cylinder 801, a limiting column 802, a bottom plate 803, a pressing plate 804 and a through hole 805. The upper surface of the top plate 7 is fixedly connected with the hydraulic cylinder 801, the lower surface of the top plate 7 is fixedly connected with the limiting column 802, the lower surface of the limiting column 802 is fixedly connected with the bottom plate 803, the lower surface of the hydraulic cylinder 801 is fixedly connected with the pressing plate 804, and the upper surface of the pressing plate 804 is provided with a through hole 805. By setting the hydraulic cylinder 801, the limiting column 802, the bottom plate 803, the pressing plate 804 and the through hole 805, When in use, the hydraulic cylinder 801 is started to generate a downward thrust, which is transmitted to the pressing plate 804 fixedly connected thereto below, pushing the pressing plate 804 downward and driving the upper mold 908 to move at the same time. The limiting column 802 fixedly connected below the top plate 7 guides the entire pressing process. When the pressing plate 804 moves downward under the push of the hydraulic cylinder 801, the limiting column 802 passes through the through hole 805 to ensure that the pressing plate 804 can only move in the vertical direction, preventing it from shifting in the horizontal direction, thereby ensuring the accuracy and stability of the pressing.

[0034] Furthermore, multiple groups of limiting columns 802 are arranged on the upper surface of the top plate 7, and the outer dimensions of the limiting columns 802 are consistent with the inner dimensions of the through holes 805. Through the arrangement of the limiting columns 802 and the through holes 805, when in use, the through holes 805 on the surface of the pressing plate 804 slide on the limiting columns 802 to prevent them from shifting in the horizontal direction, thereby ensuring the accuracy and stability of the pressing.

[0035] Furthermore, a limiting groove 901 is provided on the inner surface of the bottom plate 803, and a limiting block 902 is slidably connected to the inner surface of the limiting groove 901, and a sliding block 903 is fixedly connected to one side surface of the limiting block 902, and a positioning groove 904 is provided on the upper surface of the sliding block 903, and a positioning block 905 is slidably connected to the upper surface of the positioning groove 904, and a lower mold 906 is fixedly connected to the upper surface of the positioning block 905, and a guide column 907 is fixedly connected to the upper surface of the lower mold 906, and the outer side of the guide column 907 The upper mold 908 is slidably connected to the surface, and a guide groove 909 is provided on the lower surface of the upper mold 908. Through the arrangement of the limit groove 901, the limit block 902, the sliding block 903, the positioning groove 904, the positioning block 905, the lower mold 906, the guide column 907, the upper mold 908 and the guide groove 909, when in use, the limit groove 901 provided on the inner surface of the bottom plate 803 cooperates with the limit block 902. When the position of the lower mold 906 needs to be adjusted, the limit block 902 can slide in the limit groove 901. The lower mold 906 is moved, thereby driving the sliding block 903 fixedly connected thereto to move. The positioning groove 904 on the upper surface of the sliding block 903 is used to cooperate with the positioning block 905. The positioning block 905 is fixedly connected to the lower mold 906, so that the lower mold 906 can be stably placed on the sliding block 903. When it is necessary to press workpieces of different sizes or types, the position of the lower mold 906 can be adjusted by moving the sliding block 903 in the limiting groove 901 to adapt to different production needs. The guide column 907 fixedly connected to the upper surface of the lower mold 906 cooperates with the guide groove 909 provided on the lower surface of the upper mold 908. During the pressing operation, when the upper mold 908 moves downward under the push of the hydraulic cylinder 801, the guide groove 909 slides along the guide column 907 to ensure that the upper mold 908 can be accurately aligned with the lower mold 906, thereby ensuring the accuracy and stability of the pressing. At the same time, the cooperation between the guide column 907 and the guide groove 909 can also prevent the upper mold 908 from offsetting or shaking during the pressing process, thereby improving the pressing quality.

[0036] Furthermore, the inner dimension of the positioning groove 904 is consistent with the outer dimension of the positioning block 905, and multiple groups of positioning grooves 904 are arranged on the surface of the sliding block 903. Through the arrangement of the positioning grooves 904 and the positioning blocks 905, when in use, the lower mold 906 will be subjected to pressure from the upper mold 908 and various impact forces that may be generated, and the positioning grooves 904 and the positioning blocks 905 with consistent dimensions can effectively prevent the lower mold 906 from displacement or shaking, which can ensure the accuracy and stability of the pressing operation, ensure that all parts of the circuit board are subjected to uniform pressure during the pressing process, thereby improving product quality.

[0037] Furthermore, the upper mold 908 is fixedly connected to the pressing plate 804, the outer size of the guide column 907 is consistent with the inner wall size of the guide groove 909, and multiple groups of guide columns 907 are arranged. Through the arrangement of the guide columns 907, when in use, when the pressing plate 804 drives the upper mold 908 to move downward, the guide groove 909 of the upper mold 908 slides along the guide column 907, which can prevent the upper mold 908 from offsetting or shaking in the vertical direction, ensure that the upper mold 908 can be accurately aligned with the lower mold 906, avoid lateral movement of the upper mold 908 during the pressing process, and further enhance the accuracy and reliability of the pressing operation.

[0038] Furthermore, the typesetting component 11 includes a first new kraft paper 1101, a first high expansion steel plate 1102, a first circuit board 1103, a first prepreg 1104, a second prepreg 1105, a second circuit board 1106, a third prepreg 1107, a fourth prepreg 1108, a third circuit board 1109, a second high expansion steel plate 1110 and a second new kraft paper 1111, the first new kraft paper 1101 is placed on the upper surface of the buffer pad 1003, the first high expansion steel plate 1102 is placed on the upper surface of the first new kraft paper 1101, the first circuit board 1103 is placed on the upper surface of the first high expansion steel plate 1102, and the first prepreg 1104 is placed on the upper surface of the first circuit board 1103. 104, a second prepreg 1105 is placed on the upper surface of the first prepreg 1104, a second circuit board 1106 is placed on the upper surface of the second prepreg 1105, a third prepreg 1107 is placed on the upper surface of the second circuit board 1106, a fourth prepreg 1108 is placed on the upper surface of the third prepreg 1107, a third circuit board 1109 is placed on the upper surface of the fourth prepreg 1108, a second high expansion steel plate 1110 is placed on the upper surface of the third circuit board 1109, a second new kraft paper 1111 is placed on the upper surface of the second high expansion steel plate 1110, and the first new kraft paper 1101, the first high expansion steel plate 1102, the first circuit board 1103, the first semi-cured sheet 1107, the fourth prepreg 1108, the third circuit board 1109, the second high expansion steel plate 1110, the second new kraft paper 1111 are placed on the upper surface of the second high expansion steel plate 1110, and the first circuit board 1103 are connected to the first prepreg 1104. The setting of the curing sheet 1104, the second semi-curing sheet 1105, the second layer of circuit board 1106, the third semi-curing sheet 1107, the fourth semi-curing sheet 1108, the third layer of circuit board 1109, the second high expansion steel plate 1110 and the second new kraft paper 1111, before the circuit board pressing operation, needs to be reasonably arranged. First, the first new kraft paper 1101 is placed on the surface above the buffer pad 1003. The new kraft paper has an anti-slip effect and can prevent the sliding and dislocation of the layers of materials during the subsequent operation. Then, the first high expansion steel plate 1102 is placed on the first new kraft paper 1101. The high expansion steel plate can play a role in buffering pressure during the pressing process. When subjected to the pressure applied by the pressing component 8, the high expansion steel The board can be deformed to a certain extent according to the size of the pressure, so as to disperse the pressure and transfer the pressure to each layer of circuit boards and prepregs more evenly. The first layer of circuit board 1103 is placed on the first high expansion steel plate 1102, and then the first prepreg 1104, the second prepreg 1105, the second layer of circuit board 1106, the third prepreg 1107, the fourth prepreg 1108, and the third layer of circuit board 1109 are placed on the first layer of circuit board 1103 in sequence. The prepregs will melt due to heat during the lamination process and fill in the gaps between the circuit boards to play the role of bonding and fixing the circuit boards. Different prepregs can be selected according to the requirements of the circuit boards and process parameters to ensure good bonding effect and electrical performance.A second high expansion steel plate 1110 is placed above the third layer of circuit board 1109 to further enhance the buffering effect. Finally, a second new kraft paper 1111 is placed above the second high expansion steel plate 1110 to also play an anti-slip role, ensuring the stability of the entire layout structure during the lamination process. When the lamination component 8 starts working, the lamination plate 804 moves downward and transmits the pressure to the layout component 11 through the upper mold 908. At this time, the high expansion steel plate, prepreg and new kraft paper work together to evenly distribute the pressure, realize the multi-layer uniform lamination of the circuit board, and ensure the balance of the board thickness and the uniform distribution of the adhesive.

[0039] Working principle: The limiting groove 901 provided on the inner surface of the bottom plate 803 cooperates with the limiting block 902. When the position of the lower mold 906 needs to be adjusted, the limiting block 902 can slide in the limiting groove 901, thereby driving the sliding block 903 fixedly connected thereto to move. The positioning groove 904 on the upper surface of the sliding block 903 is used to cooperate with the positioning block 905. The positioning block 905 is fixedly connected to the lower mold 906, so that the lower mold 906 can be stably placed on the sliding block 903. When workpieces of different sizes or types need to be pressed together, the position of the lower mold 906 can be adjusted by moving the sliding block 903 in the limiting groove 901 to meet different production needs. The guide column 907 fixedly connected to the upper surface of the lower mold 906 is connected to the upper mold The guide grooves 909 provided on the lower surface of 908 cooperate with each other. During the pressing operation, when the upper mold 908 moves downward under the push of the hydraulic cylinder 801, the guide grooves 909 slide along the guide posts 907 to ensure that the upper mold 908 can be accurately aligned with the lower mold 906, thereby ensuring the accuracy and stability of the pressing. At the same time, the cooperation between the guide posts 907 and the guide grooves 909 can also prevent the upper mold 908 from deflecting or shaking during the pressing process, thereby improving the pressing quality. Before the circuit board pressing operation is performed, reasonable board arrangement is required. First, the first new kraft paper 1101 is placed on the upper surface of the buffer pad 1003. The new kraft paper has an anti-slip effect and can prevent the sliding and dislocation of the layers of materials during the subsequent operation. Then, A first high expansion steel plate 1102 is placed above the new kraft paper 1101. The high expansion steel plate can buffer the pressure during the lamination process. When subjected to the pressure applied by the lamination component 8, the high expansion steel plate can deform to a certain extent according to the size of the pressure, thereby dispersing the pressure and transferring the pressure more evenly to each layer of circuit boards and semi-cured sheets. A first layer of circuit boards 1103 is placed above the first high expansion steel plate 1102, and then a first semi-cured sheet 1104, a second semi-cured sheet 1105, a second layer of circuit boards 1106, a third semi-cured sheet 1107, a fourth semi-cured sheet 1108, and a third layer of circuit boards 1109 are placed above the first layer of circuit boards 1103 in sequence. The semi-cured sheets will melt due to the heat during the lamination process and fill the circuit boards. The gap between the two layers plays the role of bonding and fixing the circuit board. Different semi-cured sheets can be selected according to the requirements and process parameters of the circuit board to ensure good bonding effect and electrical performance. A second high expansion steel plate 1110 is placed above the third layer of circuit board 1109 to further enhance the buffering effect. Finally, a second new kraft paper 1111 is placed above the second high expansion steel plate 1110 to also play an anti-slip role, ensuring the stability of the entire layout structure during the lamination process. When the lamination component 8 starts to work, the lamination plate 804 moves downward and transfers the pressure to the layout component 11 through the upper mold 908. At this time, the high expansion steel plate, semi-cured sheet and new kraft paper work together to evenly distribute the pressure, thereby achieving multi-layer uniform lamination of the circuit board.At the same time, to ensure the balance of the board thickness and the uniform distribution of the adhesive, the hydraulic cylinder 801 is started to generate a downward thrust, which is transmitted to the pressing plate 804 fixedly connected thereto below, pushing the pressing plate 804 to move downward, and at the same time driving the upper mold 908 to move. The limiting column 802 fixedly connected below the top plate 7 plays a guiding role in the entire pressing process. When the pressing plate 804 moves downward under the push of the hydraulic cylinder 801, the limiting column 802 passes through the through hole 805 to ensure that the pressing plate 804 can only move in the vertical direction to prevent it from shifting in the horizontal direction, thereby ensuring the accuracy and stability of the pressing. When the circuit board is pressed, the upper mold 908 presses the lower mold 906, and the guide column 907 plays a guiding role. The sliding plate 1001 can slide along the outer surface of the guide column 907. When the pressure is transmitted, it first contacts the sliding plate 1001. The buffer pad 1003 on the upper surface of the plate 1001 initially absorbs and relieves part of the pressure, and then the pressure continues to be transmitted downward, causing the sliding plate 1001 to move downward, and the connecting block 1004 below the sliding plate 1001 moves together with the sliding plate 1001, and the buffer spring 1005 connected below the connecting block 1004 begins to be compressed. During the compression process, the buffer spring 1005 further absorbs the pressure through its own elastic deformation, playing a buffering role. At the same time, the damper 1006 connected to the buffer spring 1005 also begins to play a role. The damper 1006 converts the energy generated by the pressure into other forms of energy such as heat energy through its internal damping mechanism and gradually consumes it, thereby reducing the impact of the pressure and ensuring that the entire device can smoothly buffer when under pressure, protecting the circuit board and reducing damage to the circuit board.

[0040] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A buffer device for uniformly pressing multiple layers of a circuit board, comprising a fixing frame (1), characterized in that: The inner surface of the fixing frame (1) is fixedly connected to a control center (2); a side surface of the fixing frame (1) is fixedly connected to a side panel (3); the upper surface of the side panel (3) is threadedly connected to a support rod (4); the upper surface of the fixing frame (1) is fixedly connected to a panel (5); the upper surface of the panel (5) is fixedly connected to a vertical panel (6); the upper surface of the vertical panel (6) is fixedly connected to a top panel (7); the upper surface of the top panel (7) is provided with a pressing assembly (8); The inner surface of the pressing assembly (8) is provided with a mold assembly (9), and the mold assembly (9) comprises a limiting groove (901), a limiting block (902), a sliding block (903), a positioning groove (904), a positioning block (905), a lower mold (906), a guide column (907), an upper mold (908) and a guide groove (909); the outer surface of the mold assembly (9) is provided with a buffer assembly (10), and the upper surface of the buffer assembly (10) is provided with a typesetting assembly (11); The buffer assembly (10) comprises a sliding plate (1001), a sliding hole (1002), a buffer pad (1003), a connecting block (1004), a buffer spring (1005) and a damper (1006); the outer surface of the guide column (907) is slidably connected to the sliding plate (1001); the upper surface of the sliding plate (1001) is provided with a sliding hole (1002); the upper surface of the sliding plate (1001) is fixedly connected to the buffer pad (1003); the lower surface of the sliding plate (1001) is fixedly connected to the connecting block (1004); the lower surface of the connecting block (1004) is fixedly connected to the buffer spring (1005); and the lower surface of the buffer spring (1005) is fixedly connected to the damper (1006).

2. A buffer device for uniformly pressing multiple layers of a circuit board according to claim 1, characterized in that: The side panels (3) are arranged in multiple groups on the outer surface of the fixing frame (1), and the vertical panels (6) are arranged symmetrically about the central axis of the top panel (7).

3. The buffer device for uniformly pressing multiple layers of a circuit board according to claim 1, characterized in that: The sliding holes (1002) are arranged in multiple groups on the surface of the sliding plate (1001), and the inner dimensions of the sliding holes (1002) match the outer dimensions of the guide pillars (907).

4. The buffer device for uniformly pressing multiple layers of a circuit board according to claim 1, characterized in that: The connection blocks (1004) are arranged in multiple groups on the lower surface of the sliding plate (1001), and the damper (1006) is fixedly connected to the lower mold (906).

5. The buffer device for uniformly pressing multiple layers of a circuit board according to claim 1, characterized in that: The pressing assembly (8) comprises a hydraulic cylinder (801), a limiting column (802), a bottom plate (803), a pressing plate (804) and a through hole (805); the upper surface of the top plate (7) is fixedly connected to the hydraulic cylinder (801); the lower surface of the top plate (7) is fixedly connected to the limiting column (802); the lower surface of the limiting column (802) is fixedly connected to the bottom plate (803); the lower surface of the hydraulic cylinder (801) is fixedly connected to the pressing plate (804); and the upper surface of the pressing plate (804) is provided with a through hole (805).

6. A buffer device for uniformly pressing multiple layers of a circuit board according to claim 5, characterized in that: The limiting columns (802) are arranged in multiple groups on the upper surface of the top plate (7), and the outer dimensions of the limiting columns (802) match the inner dimensions of the through holes (805).

7. The buffer device for uniformly pressing multiple layers of a circuit board according to claim 1, characterized in that: A limiting groove (901) is provided on the inner surface of the bottom plate (803), the inner surface of the limiting groove (901) is slidably connected to a limiting block (902), one side surface of the limiting block (902) is fixedly connected to a sliding block (903), a positioning groove (904) is provided on the upper surface of the sliding block (903), a positioning block (905) is slidably connected to the upper surface of the positioning groove (904), a lower mold (906) is fixedly connected to the upper surface of the positioning block (905), a guide column (907) is fixedly connected to the upper surface of the lower mold (906), an upper surface of the guide column (907) is slidably connected to an upper mold (908), and a guide groove (909) is provided on the lower surface of the upper mold (908).

8. The buffer device for uniformly pressing multiple layers of a circuit board according to claim 7, characterized in that: The inner dimensions of the positioning grooves (904) match the outer dimensions of the positioning block (905), and a plurality of groups of positioning grooves (904) are provided on the surface of the sliding block (903).

9. The buffer device for uniformly pressing multiple layers of a circuit board according to claim 7, characterized in that: The upper mold (908) is fixedly connected to the pressing plate (804), the outer dimensions of the guide pillars (907) are consistent with the inner wall dimensions of the guide grooves (909), and the guide pillars (907) are provided in multiple groups.

10. The buffer device for uniformly pressing multiple layers of a circuit board according to claim 1, characterized in that: The typesetting component (11) comprises a first new kraft paper (1101), a first high expansion steel plate (1102), a first layer of circuit board (1103), a first prepreg (1104), a second prepreg (1105), a second layer of circuit board (1106), a third prepreg (1107), a fourth prepreg (1108), a third layer of circuit board (1109), a second high expansion steel plate (1110) and a second new kraft paper (1111); the first new kraft paper (1101) is placed on the upper surface of the buffer pad (1003); the first high expansion steel plate (1102) is placed on the upper surface of the first new kraft paper (1101); the first layer of circuit board (1103) is placed on the upper surface of the first high expansion steel plate (1102); the first layer of circuit board (1111) is placed on the upper surface of the first high expansion steel plate (1102); 103), a first semi-cured sheet (1104) is placed on the upper surface of the first semi-cured sheet (1104), a second semi-cured sheet (1105) is placed on the upper surface of the first semi-cured sheet (1104), a second layer of circuit board (1106) is placed on the upper surface of the second semi-cured sheet (1105), a third semi-cured sheet (1107) is placed on the upper surface of the second layer of circuit board (1106), a fourth semi-cured sheet (1108) is placed on the upper surface of the third semi-cured sheet (1107), a third layer of circuit board (1109) is placed on the upper surface of the fourth semi-cured sheet (1108), a second high expansion steel plate (1110) is placed on the upper surface of the third layer of circuit board (1109), and a second new kraft paper (1111) is placed on the upper surface of the second high expansion steel plate (1110).

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