3D uniform temperature plate

Abstract

The invention discloses a 3D uniform temperature plate which comprises an upper cover and a lower cover. A lower cover; a plurality of condensation pipes; the capillary structure columns are arranged on the side, close to the upper cover, of the lower cover; a plurality of mounting holes are formed in the upper cover, and the mounting holes, the condensation pipes and the capillary structure columns are in one-to-one correspondence; and the end part of the condensation pipe penetrates through the mounting hole and is arranged on the capillary structure column in a sleeving manner. According to the condenser, the capillary structure column is arranged on the lower cover, the one-to-one correspondence relation is formed among the capillary structure column, the installation hole and the condensation pipe, and one part of the condensation pipe penetrates through the installation hole and is arranged on the capillary structure column in a sleeving mode. Therefore, a capillary connection relation between the condensation pipe and the lower cover is established, effective connection between the condensation pipe and the capillary structure on the lower cover plate is ensured, liquid backflow is improved, and the purpose of improving the heat conduction efficiency of the 3D uniform temperature plate is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature averaging plates, and in particular to a 3D temperature averaging plate. Background Art

[0002] As server computing power increases, the heat flux density of server CPUs is also increasing, and traditional heat spreaders and heat pipes cannot meet the heat dissipation requirements. Compared with traditional heat spreaders, 3D heat spreaders change the heat dissipation of the heat spreader from two-dimensional surface to three-dimensional heat conduction, greatly improving the heat dissipation capacity of electronic components. However, due to process limitations, the lower cover plate in existing 3D heat spreaders is usually a planar structure, making it difficult to effectively connect the capillary at the condenser tube and the capillary at the lower cover plate, thereby limiting the return water of the 3D heat spreader and reducing the thermal conductivity of the 3D heat spreader.

[0003] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0004] The technical problem to be solved by the present invention is that, in view of the above-mentioned defects of the prior art, a 3D temperature equalizing plate is provided to improve the thermal conductivity efficiency.

[0005] The technical solution adopted by the present invention to solve the technical problem is as follows:

[0006] A 3D temperature homogenizing plate, comprising an upper cover and a lower cover, and further comprising:

[0007] Multiple condenser tubes;

[0008] A plurality of capillary structure columns are arranged on a side of the lower cover close to the upper cover;

[0009] The upper cover is provided with a plurality of mounting holes, and the mounting holes, the condenser tubes and the capillary structure columns are all in one-to-one correspondence; the ends of the condenser tubes pass through the mounting holes and are sleeved on the capillary structure columns.

[0010] The 3D temperature homogenizing plate, wherein the capillary structure column is in a truncated cone shape, the small diameter end of the capillary structure column is arranged toward the upper cover, and the capillary structure column and the condenser tube are interference fit.

[0011] The 3D temperature homogenizing plate, wherein the capillary structure column comprises:

[0012] First column;

[0013] A second column is located between the first column and the lower cover and is coaxially arranged with the first column;

[0014] The outer diameter of the first column is smaller than the outer diameter of the second column; the condenser tube is sleeved outside the first column and fits with the axial end surface of the second column close to the first column.

[0015] The 3D temperature homogenizing plate further comprises:

[0016] A plurality of water-guiding ribs are arranged on a side of the lower cover close to the upper cover; one end of the water-guiding rib extends into the evaporation area of ​​the lower cover, and the other end is located outside the evaporation area of ​​the lower cover;

[0017] At least one condensation water channel is arranged on the outer circumferential surface of the capillary structure column outside the evaporation area of ​​the lower cover and is extended along the axial direction of the capillary structure column; the condensation water channel is respectively connected to the condensation tube and the water guide rib.

[0018] The 3D temperature homogenizing plate further comprises:

[0019] At least one steam channel is arranged on the outer circumferential surface of the capillary structure column and extends along the axial direction of the capillary structure column; the steam channel is communicated with the condenser.

[0020] The 3D temperature homogenizing plate, wherein the number of the condensation water channels is less than the number of the steam channels.

[0021] The 3D temperature homogenizing plate further comprises:

[0022] The capillary structure plate is arranged between the upper cover and the lower cover and is located on a side of the capillary structure column close to the upper cover.

[0023] The 3D temperature homogenizing plate further comprises:

[0024] A plurality of support columns are arranged on a side of the lower cover close to the upper cover and support the capillary structure plate.

[0025] The 3D temperature homogenizing plate, wherein the condenser tube comprises:

[0026] A tube body; one end of the tube body has an opening; the opening cooperates with the capillary structure column;

[0027] The capillary layer is arranged on the inner wall of the tube body and fits with the capillary structure column.

[0028] The 3D temperature homogenizing plate further comprises:

[0029] A plurality of sealing rings are arranged on a side of the upper cover away from the lower cover and correspond one to one with the mounting holes; the sealing rings are coaxially arranged with the mounting holes and sleeved on the periphery of the condenser tube.

[0030] Beneficial effect: In the present application, the upper cover is used to buckle onto the lower cover, so as to enclose a closed space between the upper cover and the lower cover. A portion of the condenser is located outside the closed space, and a portion passes through the mounting hole and extends into the closed space; the capillary structure column is arranged on the lower cover, and a one-to-one correspondence is formed between the capillary structure column, the mounting hole and the condenser, then one end of the condenser extending into the closed space is sleeved on the capillary structure column, thereby establishing a capillary connection relationship between the condenser and the lower cover, ensuring the effective connection between the condenser and the capillary structure in the closed space, improving liquid reflux, and thus achieving the purpose of improving the thermal conductivity of the 3D temperature equalizing plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the overall structure of the 3D temperature homogenizing plate described in this application;

[0032] Figure 2 It is a schematic diagram of the exploded structure of the upper cover, the capillary structure plate and the lower cover described in the present application;

[0033] Figure 3 It is a schematic diagram of the assembly structure of the condenser and the capillary structure column described in the present application;

[0034] Figure 4 It is a schematic diagram of the matching structure of the capillary structure column and the water-conducting rib described in the present application;

[0035] Figure 5 It is a schematic diagram of the distribution structure of the water-conducting ribs, the capillary structure columns and the condenser tubes on the lower cover in the present application;

[0036] Figure 6 is a cross-sectional view of the assembly structure of the condenser and the capillary structure column described in the present application;

[0037] Figure 7 yes Figure 6 A local enlarged schematic diagram of point A in the middle. DETAILED DESCRIPTION

[0038] The following will describe the embodiments of the present invention with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be understood that the preferred embodiments are only for illustrating the present invention, not for limiting the scope of protection of the present invention.

[0039] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0040] The present invention provides a 3D temperature balancing plate, such as Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, the 3D temperature equalizing plate includes an upper cover 1, a lower cover 2, a plurality of condensing tubes 3 and a plurality of capillary structure columns 4; the plurality of capillary structure columns 4 are arranged on the side of the lower cover 2 close to the upper cover 1; the upper cover 1 is provided with a plurality of mounting holes 100, and the mounting holes 100, the condensing tubes 3 and the capillary structure columns 4 all correspond one to one; the end of the condensing tube 3 passes through the mounting hole 100 and is sleeved on the capillary structure column 4.

[0041] Specifically, the upper cover 1 is used to buckle onto the lower cover 2, so as to enclose a closed space between the upper cover 1 and the lower cover 2. A portion of the condenser 3 is located outside the closed space, and a portion passes through the mounting hole 100 and extends into the closed space; the capillary structure column 4 is arranged on the lower cover 2, and a one-to-one correspondence is formed between the capillary structure column 4, the mounting hole 100 and the condenser 3, then one end of the condenser 3 extending into the closed space is sleeved on the capillary structure column 4, so as to establish a capillary connection relationship between the condenser 3 and the lower cover 2, ensure the effective connection between the condenser 3 and the capillary structure in the closed space, improve the liquid reflux, and thus achieve the purpose of improving the thermal conductivity of the 3D temperature equalizing plate.

[0042] In the present application, the capillary structure column 4 is arranged on the lower cover 2, and the condenser tube 3 is sleeved on the capillary structure column 4, so that the condenser tube 3 is effectively connected with the capillary structure on the lower cover 2 during assembly, thereby improving the water return of the 3D temperature equalizing plate, thereby improving the thermal conductivity of the 3D temperature equalizing plate. The capillary structure column 4 is not only a part of the capillary structure on the lower cover 2, but also a key design element of the capillary system, which can effectively ensure the reflux of condensed water.

[0043] It should be noted that the capillary structure column 4 is sintered from copper powder and is porous, and can generate a strong capillary force to guide the flow of condensed water. Specifically, the capillary structure column 4 is interconnected with the capillary structure inside the condenser tube 3 to form a continuous capillary channel, which can drain the condensed water through capillary action, thereby achieving thermal circulation.

[0044] like Figure 5 and Figure 6 As shown, the condenser 3 includes a tube body 31 and a capillary layer 32 . One end of the tube body 31 has an opening, and the opening cooperates with the capillary structure column 4 . The capillary layer 32 is arranged on the inner wall of the tube body 31 and fits with the capillary structure column 4 .

[0045] Specifically, the capillary layer 32 is also made of copper powder or other porous materials; the capillary layer 32 is used to form a capillary structure inside the tube body 31, so when the condenser 3 is sleeved outside the capillary structure column 4, a capillary structure connection relationship between the condenser 3 and the lower cover 2 plate can be established, thereby realizing an effective connection between the condenser 3 and the capillary structure on the lower cover 2 during assembly.

[0046] In one embodiment of the present application, the capillary structure column 4 is in a truncated cone shape, the small diameter end of the capillary structure column 4 is arranged toward the upper cover 1, and the capillary structure column 4 and the condenser tube 3 are interference fit.

[0047] Specifically, if the capillary structure column 4 is directly designed to be cylindrical, the condenser 3 may compress the capillary structure on the surface of the capillary structure column 4 during assembly, causing deformation or blockage of the capillary structure, thereby affecting the transmission effect of the capillary force. Especially for the design of 3D temperature equalizing plate, the capillary force needs to rely on the integrity of the capillary channel, and excessive compression may reduce the reflux efficiency of the condensed water. Based on this, in this embodiment, the diameter of the capillary structure column 4 gradually changes along the axial direction; and, from the lower cover 2 to the upper cover 1, the diameter of the capillary structure column 4 gradually decreases, so that the small diameter end of the capillary structure column 4 is close to the upper cover 1, and the large diameter end of the capillary structure column 4 is in contact with the lower cover 2.

[0048] The small diameter end of the capillary structure column 4 is installed in cooperation with the condenser 3, and when the condenser 3 is sleeved on the small diameter end of the capillary structure column 4, a part of the outer circumference of the capillary structure column 4 is interference fit with the condenser 3. A certain draft angle is formed on the capillary structure column 4, and when the condenser 3 is assembled, the capillaries inside the condenser 3 can form a certain amount of interference with the capillary structure column 4, providing a certain buffer, which can effectively prevent the condenser 3 from loosening or displacement due to thermal expansion and contraction, vibration and other factors during operation, thereby maintaining a stable liquid reflux path, thereby ensuring that the capillaries of the two are effectively connected together, further improving the assembly stability between the condenser 3 and the capillary structure column 4, avoiding gaps or poor contact between the condenser 3 and the capillary structure column 4 at the contact point, thereby optimizing the liquid reflux inside the 3D temperature equalizing plate.

[0049] At the same time, the setting of the draft angle can play a certain guiding role in the installation of the condenser 3 on the capillary structure column 4, guiding the condenser 3 to gradually approach the capillary structure column 4, reducing the misalignment and asymmetry during the assembly process, and ensuring uniform contact between the condenser 3 and the capillary structure column 4.

[0050] In one embodiment of the present application, Figure 4 and Figure 7 As shown, the capillary structure column 4 includes a first column 41 and a second column 42; the second column 42 is located between the first column 41 and the lower cover 2, and is coaxially arranged with the first column 41; the outer diameter of the first column 41 is smaller than the outer diameter of the second column 42; the condenser tube 3 is sleeved outside the first column 41 and is close to the axial end face 421 of the first column 41 (as shown in FIG. Figure 4 as shown).

[0051] Specifically, the second column 42 is fitted with the lower cover 2; the first column 41 is coaxially arranged with the second column 42 and is located on the side of the second column 42 close to the upper cover 1. The first column 41 and the second column 42 are both truncated cone-shaped, and the end surface of the large diameter end of the first column 41 is aligned with the end surface 421 of the small diameter end of the second column 42 (such as Figure 4 The maximum outer diameter of the first column 41 is smaller than the minimum outer diameter of the second column 42, so that a step is formed at the junction between the first column 41 and the second column 42, and the step is used to accommodate the condenser 3.

[0052] When the condenser 3 is assembled with the capillary structure column 4, the first column 41 is located inside the condenser 3, and the axial end face 421 of the small diameter end of the second column 42 (that is, the axial end face of the second column 42 close to the first column 41) forms the bottom of the step, and fits and supports the condenser 3, and the outer circumferential surface of the large diameter end of the first column 41 fits with the inner wall of the condenser 3.

[0053] In this embodiment, the two-stage design of the first column 41 and the second column 42 forms a step on the outer circumferential surface of the capillary structure column 4 to accommodate the condenser 3, thereby increasing the positioning accuracy and mechanical stability between the condenser 3 and the capillary structure column 4; the step can act as a guide and support, so that the condenser 3 can be accurately sleeved on the capillary structure column 4, preventing the condenser 3 from sliding or deflecting during assembly or operation, thereby ensuring that the capillary structure of the condenser 3 and the capillary structure column 4 can always maintain effective contact, which helps to maintain the normal operation of the capillary action.

[0054] At the same time, the step design can make the condenser 3 form a more uniform contact with the surface of the capillary structure column 4 when it is sleeved, thereby ensuring that the connection area of ​​the capillary structure is large enough and the capillary force can fully play its role, which helps the condensed water formed by the steam in the condenser 3 to flow smoothly back to the inside of the capillary structure column 4 and the 3D temperature equalizing plate through capillary action, thereby improving the thermal cycle efficiency of the 3D temperature equalizing plate. The step design can also effectively disperse the stress concentration at the contact point between the condenser 3 and the capillary structure column 4, avoiding deformation or damage of the capillary structure column 4 or the condenser 3 due to excessive local stress, and improving the mechanical strength and long-term reliability of the overall structure.

[0055] In one implementation of this embodiment, the first column 41 and the second column 42 are an integrally formed structure.

[0056] After research, it was found that the condensed water generated in the condenser tube in the prior art is difficult to flow back to the evaporation area of ​​the lower cover, resulting in the overall characteristics of the temperature equalizer not being brought into play; based on this, in one embodiment of the present application, the 3D temperature equalizer further includes a plurality of water guide ribs 7, at least one condensed water channel 5 and at least one steam channel 6; the water guide rib 7 is arranged on a side of the lower cover 2 close to the upper cover 1; one end of the water guide rib 7 extends to the evaporation area 21 of the lower cover 2 (such as Figure 2 and Figure 5 The condensation water channel 5 is arranged on the outer circumference of the capillary structure column 4 outside the evaporation area 21 of the lower cover 2, and the other end is located outside the evaporation area 21 of the lower cover 2; the condensation water channel 5 is arranged on the outer circumference of the capillary structure column 4 outside the evaporation area 21 of the lower cover 2, and is arranged along the axial extension of the capillary structure column 4; the condensation water channel 5 is respectively connected with the condensation tube 3 and the water guide rib 7. The steam channel 6 is arranged on the outer circumference of the capillary structure column 4, and is arranged along the axial extension of the capillary structure column 4; the steam channel 6 is connected with the condensation tube 3.

[0057] Specifically, Figure 4 As shown, at least one condensation water channel 5 and at least one steam channel 6 are provided on the outer circumferential surface of the capillary structure column 4, and the condensation water channel 5 and the steam channel 6 are arranged along the circumferential direction of the capillary structure column 4. The condensation water is connected with the water guide ribs 7 and the condensation tube 3 respectively, so that the internal space of the condensation tube 3 is connected with the water guide ribs 7; and the water guide ribs 7 extend to the evaporation area 21 of the lower cover 2, so that the condensation water generated in the condensation tube 3 can be guided to the evaporation area 21 of the lower cover 2 after passing through the condensation water channel 5 and the water guide ribs 7.

[0058] like Figure 4 and Figure 5 ( Figure 5As shown in the figure, the double arrows in the middle indicate the steam flow direction, and the single arrow indicates the condensed water flow direction), the steam channel 6 connects the internal space of the condenser 3 with the external space, so that the steam in the enclosed space formed by the upper cover 1 and the lower cover 2 can quickly pass through the steam channel 6 into the inside of the condenser 3. After the condenser 3 is cooled, the internal water vapor is converted into condensed water, and then flows back to the capillary structure column 4 through the capillary inside the tube wall, and then passes through the condensed water channel 5 and the water guide rib 7 structure in turn, extending from the capillary structure column 4 to the evaporation area 21 of the lower cover 2, so that the condensed water can quickly flow back to the evaporation area 21 of the lower cover 2, effectively solving the water return from the condenser 3 to the evaporation area 21 of the lower cover 2, and can also exert its due characteristics when used in a reverse gravity environment.

[0059] In this embodiment, the steam channel 6 and the condensed water channel 5 are arranged at intervals, so that the steam channel 6 and the condensed water channel 5 are independent of each other, and the flow paths of the steam flow and the condensed water can be separated to prevent the two from interfering in the same channel, thereby avoiding the accumulation of condensed water affecting the flow of steam, ensuring that the steam can quickly transfer heat, and the condensed water can smoothly flow back through the water guide ribs 7. In an environment of reverse gravity, the design of the independent steam channel 6 allows the condensed water to overcome gravity and flow back smoothly, thereby further improving the heat dissipation capacity of the 3D vapor chamber.

[0060] The steam channel 6 penetrates the capillary structure column 4 along the axial direction of the capillary structure column 4, that is, the steam channel 6 penetrates the first column 41 and the second column 42; since the condenser 3 is only sleeved on the first column 41, and the second column 42 is exposed relative to the condenser 3, the portion of the steam channel 6 located on the first column 41 can communicate with the internal space of the condenser 3, and the portion of the steam channel 6 located on the second column 42 connects the internal space of the condenser 3 with the outside, thereby forming a connection between the inside and the outside of the condenser 3. Similarly, the condensate channel 5 also penetrates the capillary structure column 4 along the axial direction of the capillary structure column 4, that is, the condensate channel 5 penetrates the first column 41 and the second column 42, thereby forming a channel connecting the inside and the outside of the condenser 3.

[0061] In one embodiment of the present application, the number of the condensate channels 5 is less than the number of the steam channels 6 .

[0062] Specifically, in the 3D heat spreader, steam is a medium that transfers heat through phase change (from liquid to gas); the steam flow rate is high and the heat transferred is large, so more steam channels 6 are needed to ensure that the steam can be quickly transferred from the evaporation end to the condensation end without obstruction; at the same time, if the number of steam channels 6 is small, the steam may flow through certain channels in a concentrated manner, resulting in uneven heat distribution and local overheating. Therefore, compared with the condensation water channel 5, the steam channel 6 needs to be set in a larger number to meet the transfer of steam, ensure uniform steam distribution, and ensure the overall temperature uniformity of the 3D heat spreader.

[0063] Compared with steam, the flow rate of condensed water is slower and the flow rate is relatively small; therefore, the condensed water channels 5 do not need too many to ensure their reflux, and a small number of condensed water channels 5 are sufficient to allow the condensed water to be discharged smoothly while avoiding too much interference with the steam flow. By reducing the number of condensed water channels 5, it is possible to effectively avoid interference of condensed water in a large number of the steam flow channels, ensuring that the flow of the steam channel 6 is smoother.

[0064] In one implementation of the present embodiment, condensed water mainly relies on capillary action or gravity to flow back to the evaporation end, which does not require a large number of reflux channels; designing a small number of effective condensed water reflux channels can meet the needs, while avoiding too many condensed water channels 5 occupying the space for steam flow. There is one condensed water channel 5 and three steam channels 6 on the capillary structure column 4.

[0065] It should be noted that the capillary structure column 4 is disposed in the evaporation zone 21 of the lower cover 2 , and the capillary structure column 4 is also disposed outside the evaporation zone 21 of the lower cover 2 , and each of the capillary structure columns 4 outside the evaporation zone 21 of the lower cover 2 corresponds to one of the water guide ribs 7 .

[0066] In one embodiment of the present application, the 3D temperature homogenizing plate further includes a capillary structure plate 8 , which is arranged between the upper cover 1 and the lower cover 2 and located on a side of the capillary structure column 4 close to the upper cover 1 .

[0067] Specifically, the capillary structure plate 8 also adopts a capillary structure, and the capillary structure plate 8 uses capillary force to return condensed water from the condensation area (cold end) to the evaporation area 21 (heat source end); when the working fluid evaporates in the 3D temperature plate, the steam will move to the condensation area and condense into liquid. Through the capillary action of the capillary structure plate 8, the condensed liquid can quickly and stably return to the evaporation area 21 to ensure continuous circulation. In addition, the working fluid in the 3D temperature plate can be more evenly distributed throughout the internal structure. This uniform fluid distribution can prevent local heat sources from overheating, enhance the overall thermal conductivity of the 3D temperature plate, and ensure that heat is quickly transferred from the heat source end to the condensation end.

[0068] Since the capillary structure plate 8 is clamped between the upper cover 1 and the lower cover 2, this clamping structure enhances the overall structural strength of the 3D temperature-averaging plate to a certain extent, enabling it to withstand a certain external pressure or vibration. At the same time, this also improves the stability of the capillary structure inside the 3D temperature-averaging plate, preventing the capillary structure from failing due to thermal expansion and contraction of the material or external vibration during the thermal cycle.

[0069] In one implementation of the present embodiment, the 3D temperature homogenizing plate further includes a plurality of support columns 9 , which are disposed on a side of the lower cover 2 close to the upper cover 1 and support the capillary structure plate 8 .

[0070] Specifically, the support column 9 can provide mechanical support between the upper cover 1 and the lower cover 2 to prevent the 3D temperature-averaging board from deforming or collapsing under high pressure or external force. Since the interior of the 3D temperature-averaging board is usually a sealed vacuum environment with a working fluid, if there is no sufficient support structure, external pressure may cause the upper cover 1 and the lower cover 2 to approach each other, resulting in deformation or structural failure, and the design of the support column 9 effectively shares these forces and maintains the structural strength and stability of the entire 3D temperature-averaging board.

[0071] The support column 9 supports the capillary structure column 4, which can also help fix and maintain the position of the capillary structure to prevent the capillary structure from moving or failing under thermal expansion, contraction or external vibration. This ensures that the capillary structure always works effectively and promotes the reflux of condensed water and the flow of steam. At the same time, when the heat in the 3D temperature equalizing plate is transferred from the heat source end to the condensation area, the support column 9 can serve as an additional heat conduction path to help transfer heat between the upper cover 1 and the lower cover 2, thereby enhancing the thermal conductivity of the entire 3D temperature equalizing plate.

[0072] When the support column 9 is made of a material with good thermal conductivity (such as copper), the overall thermal conductivity efficiency of the 3D temperature homogenizing plate is significantly improved.

[0073] The support column 9 is provided with an assembly column 11 on the side close to the upper cover 1, the diameter of the assembly column 11 is smaller than the diameter of the support column 9, and the assembly column 11 is coaxially arranged with the support column 9; the capillary structure plate 8 is provided with an assembly hole 81 corresponding to the support column 9, the end of the assembly column 11 close to the upper cover 1 is located in the assembly hole 81, and the axial end surface of the support column 9 close to the upper cover 1 supports the capillary structure plate 8. The assembly column 11 is provided on the support column 9, and the assembly column 11 cooperates with the assembly hole 81, so as to further improve the stability of the assembly of the capillary structure plate 8 between the upper cover 1 and the lower cover 2.

[0074] It can be understood that the capillary structure plate 8 is also provided with a condenser through hole 82 for the condenser 3 to pass through.

[0075] In one embodiment of the present application, the 3D temperature equalizing plate further includes a plurality of sealing rings 10; the sealing rings 10 are arranged on the side of the upper cover 1 away from the lower cover 2, and correspond one-to-one with the mounting holes 100; the sealing rings 10 are coaxially arranged with the mounting holes 100, and are sleeved on the periphery of the condenser 3.

[0076] Specifically, the sealing ring 10 is sleeved on the periphery of the condenser 3 and is used to seal the assembly gap between the condenser 3 and the mounting hole 100 to ensure that after the condenser 3 is installed and the upper cover 1 and the lower cover 2 are buckled together, a closed environment can be formed between the upper cover 1 and the lower cover 2, thereby ensuring the thermal conductivity of the 3D temperature homogenizing plate.

[0077] In one implementation mode of the present embodiment, the sealing ring 10 is a silver welding ring, and the sealing ring 10 is brazed at high temperature to seal the joint between the condenser 3 and the mounting hole 100; after the upper cover 1 and the lower cover 2 are sealed, and the condenser 3 and the mounting hole 100 are sealed, a water injection pipe is inserted into the liquid injection port of the 3D temperature equalizing plate by high frequency, and deionized water is injected as the working medium. The entire temperature equalizing plate is evacuated through a small pipe port and sealed by argon arc welding, thereby obtaining a finished 3D temperature equalizing plate.

[0078] In summary, the present application provides a 3D temperature equalizing plate, which includes an upper cover and a lower cover; a plurality of condensing tubes; a plurality of capillary structure columns, which are arranged on a side of the lower cover close to the upper cover; a plurality of mounting holes are arranged on the upper cover, and the mounting holes, the condensing tubes and the capillary structure columns correspond to each other one by one; the ends of the condensing tubes pass through the mounting holes and are sleeved on the capillary structure columns. In the present application, the upper cover is used to buckle onto the lower cover, so as to enclose a closed space between the upper cover and the lower cover. A portion of the condenser is located outside the enclosed space, and a portion passes through the mounting hole and extends into the enclosed space; the capillary structure column is arranged on the lower cover, and a one-to-one correspondence is formed between the capillary structure column, the mounting hole and the condenser. The end of the condenser extending into the enclosed space is sleeved on the capillary structure column, thereby establishing a capillary connection relationship between the condenser and the lower cover, ensuring an effective connection between the condenser and the capillary structure in the enclosed space, improving liquid reflux, and thereby achieving the purpose of improving the thermal conductivity efficiency of the 3D temperature spreader.

[0079] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A 3D temperature homogenizing plate, comprising an upper cover and a lower cover, characterized in that: It also includes: Multiple condenser tubes; A plurality of capillary structure columns are arranged on a side of the lower cover close to the upper cover; The upper cover is provided with a plurality of mounting holes, and the mounting holes, the condenser tubes and the capillary structure columns are all in one-to-one correspondence; the ends of the condenser tubes pass through the mounting holes and are sleeved on the capillary structure columns.

2. The 3D temperature homogenizing plate according to claim 1, characterized in that: The capillary structure column is in a truncated cone shape, the small diameter end of the capillary structure column is arranged toward the upper cover, and the capillary structure column and the condenser tube are interference fit.

3. The 3D temperature homogenizing plate according to claim 1, characterized in that: The capillary structure column comprises: First column; A second column is located between the first column and the lower cover and is coaxially arranged with the first column; The outer diameter of the first column is smaller than the outer diameter of the second column; the condenser tube is sleeved outside the first column and fits with the axial end surface of the second column close to the first column.

4. The 3D temperature homogenizing plate according to claim 1, characterized in that: It also includes: A plurality of water-guiding ribs are arranged on a side of the lower cover close to the upper cover; one end of the water-guiding rib extends into the evaporation area of ​​the lower cover, and the other end is located outside the evaporation area of ​​the lower cover; At least one condensation water channel is arranged on the outer circumferential surface of the capillary structure column outside the evaporation area of ​​the lower cover and is extended along the axial direction of the capillary structure column; the condensation water channel is respectively connected to the condensation tube and the water guide rib.

5. The 3D temperature homogenizing plate according to claim 4, characterized in that: It also includes: At least one steam channel is arranged on the outer circumferential surface of the capillary structure column and extends along the axial direction of the capillary structure column; the steam channel is communicated with the condenser.

6. The 3D temperature homogenizing plate according to claim 5, characterized in that: The number of the condensed water channels is smaller than the number of the steam channels.

7. The 3D temperature homogenizing plate according to claim 1, characterized in that: It also includes: The capillary structure plate is arranged between the upper cover and the lower cover and is located on a side of the capillary structure column close to the upper cover.

8. The 3D temperature homogenizing plate according to claim 7, characterized in that: It also includes: A plurality of support columns are arranged on a side of the lower cover close to the upper cover and support the capillary structure plate.

9. The 3D temperature homogenizing plate according to claim 1, characterized in that: The condenser comprises: A tube body; one end of the tube body has an opening; the opening cooperates with the capillary structure column; The capillary layer is arranged on the inner wall of the tube body and fits with the capillary structure column.

10. The 3D temperature homogenizing plate according to claim 1, characterized in that: It also includes: A plurality of sealing rings are arranged on a side of the upper cover away from the lower cover and correspond to the mounting holes one by one; the sealing rings are coaxially arranged with the mounting holes and sleeved on the periphery of the condenser tube.

Images