Resin composition for fixing easy dispensing rotor and method for dispensing rotor

Abstract

A resin composition for fixing an easily detachable rotor, which is used to form a fixing member (130) in a rotor (100), the rotor (100) is provided with a rotor core (110) which is fixedly arranged on a rotating shaft and is provided with a plurality of hole parts arranged along the peripheral edge part of the rotating shaft, a magnet (120) which is inserted into the hole part (150), and the fixing part (130) which is arranged at the separation part of the hole part (150) and the magnet (120), and the resin composition for fixing the rotor contains a thermosetting component. A cured body obtained by thermally curing the resin composition for fixing the rotor has a structure represented by formula (1). Wi is equal to '152.4' / gt; (In formula (1), R1 and R2 each independently represent any one of a hydrogen atom, a C1-30 hydrocarbon group or aromatic group, a hydroxyl group, and a C1-30 alkoxy group. > # imgabs0 #

Description

Technical Field

[0001] The present invention relates to an easily disassembleable rotor fixing resin composition and a rotor disassembly method. More specifically, it relates to an easily disassembleable rotor fixing resin composition, a rotor having a cured product of the easily disassembleable rotor fixing resin composition, a method for disassembling the cured product of the easily disassembleable rotor fixing resin composition, and a method for recovering materials constituting the rotor. Background Art

[0002] In recent years, the automotive industry has been actively promoting the electrification of vehicles in order to respond to global climate change and achieve a carbon-neutral society. The neodymium magnets used in the motors of these electric vehicles mostly contain rare elements called rare earths, such as neodymium and dysprosium.

[0003] On the other hand, there are concerns about the uneven distribution of rare earth resources and price fluctuations caused by the balance of supply and demand. In addition, mining and smelting also put a burden on the ecosystem, so reducing their use has become an issue.

[0004] Therefore, in the automotive industry, rare earth recycling technology has attracted much attention as an effective use of resources.

[0005] For example, it is known that magnets are removed from electric motors that do not meet factory standards and cannot be installed in automobiles, and then disassembled and reused. Also, for example, Patent Document 1 discloses a method in which a rotor is heated to a high temperature of either the Curie temperature or the ashing temperature of the adhesive, and then vibration is applied to the metal plate on the end surface of the rotor to cause the metal plate to resonate, thereby separating the adhesive and the magnet from the hole.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2015-216777 Summary of the invention

[0009] Technical issues to be solved by the invention

[0010] However, in the prior art disclosed in Patent Document 1, in the process of removing rare earth from the magnet of the motor, the magnet needs to be manually decomposed and removed, so there is room for improvement in simplifying the process and reducing the recycling cost. In addition, if the magnet is removed by heating at high temperature (about 600-700°C) to incinerate the adhesive, carbon dioxide will be generated unless the heat energy is clean. In addition, the magnet may be demagnetized due to high temperature treatment, making it difficult to reuse.

[0011] The inventors of the present invention have conducted intensive research to solve this problem, and have found that it is effective for the cured product of the rotor-fixing resin composition to have a specific structure. That is, it is believed that when the rotor using the specific rotor-fixing resin composition is subjected to solution treatment, the specific structure portion is easily detached, so that the network in the cured product of the rotor-fixing resin composition is broken, and the cured product can be disassembled. As a result, the permanent magnet of the rotor can be easily removed.

[0012] Technical means to solve technical problems

[0013] The present invention relates to the following easily disassembleable rotor fixing resin composition and rotor disassembly method. More specifically, the present invention provides an easily disassembleable rotor fixing resin composition, a rotor having a cured product of the easily disassembleable rotor fixing resin composition, a method for disassembling the cured product of the easily disassembleable rotor fixing resin composition, and a method for recovering materials constituting the rotor.

[0014] [1] An easily disassembled rotor fixing resin composition for forming a fixing member in a rotor,

[0015] The rotor comprises a rotor core fixedly mounted on a rotating shaft and provided with a plurality of holes arranged along a peripheral edge of the rotating shaft, magnets inserted into the holes, and the fixing member provided at a separation portion between the holes and the magnets.

[0016] The rotor fixing resin composition contains a thermosetting component.

[0017] A cured product obtained by thermally curing the rotor-fixing resin composition has a structure represented by the following formula (1).

[0018]

[0019] (In formula (1), R1 and R2 each independently represent any one of a hydrogen atom, a hydrocarbon group or an aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms.)

[0020] [2] The easily disassembleable rotor fixing resin composition according to [1], wherein the thermosetting component has a -Si-O- structure.

[0021] [3] The easily disassembled thermosetting resin composition according to [1] or [2], wherein the thermosetting component comprises a thermosetting resin and a curing agent, and both the thermosetting component and the curing agent have a -Si-O- structure.

[0022] [4] The easily disassembleable rotor fixing resin composition according to [1] or [2], wherein the thermosetting component comprises a thermosetting resin and a curing agent, and the curing agent has a -Si-O- structure.

[0023] [5] The easily disassembleable rotor fixing resin composition according to [1] or [2], wherein the thermosetting component comprises a thermosetting resin and a curing agent, and the thermosetting resin has a -Si-O- structure.

[0024] [6] The easily disassembleable rotor-fixing resin composition according to any one of [3] to [5], wherein the curing agent includes a phenolic curing agent.

[0025] [7] The resin composition for easily disassembled rotor fixing according to any one of [3] to [6], wherein the thermosetting resin comprises one or more selected from epoxy resins, phenoxy resins, polyimide resins, benzoxazine resins, unsaturated polyester resins, phenolic resins, melamine resins, silicone resins, cyanate resins, bismaleimide resins and acrylic resins.

[0026] [8] The easily disassembleable rotor fixing resin composition according to any one of [3] to [7], wherein the thermosetting resin includes an epoxy resin.

[0027] [9] The easily dismantlable rotor fixing resin composition according to any one of [1] to [7], further comprising an inorganic filler, wherein the content of the inorganic filler is 10 to 98% by mass based on the total amount of the easily dismantlable rotor fixing resin composition.

[0028]

[10] The easily disassembleable rotor fixing resin composition according to any one of [1] to [9], comprising a silyl ether-modified novolac resin.

[0029]

[11] The easily disassembleable rotor-fixing resin composition according to any one of [1] to

[10] , comprising a phenolic resin having a weight average molecular weight (Mw) of 500 to 10,000.

[0030]

[12] The easily dismantlable rotor fixing resin composition according to any one of [1] to

[11] , wherein the easily dismantlable rotor fixing resin composition is in a powdery, granular or ingot form.

[0031]

[13] A rotor comprising a cured product of the easily disassembleable rotor-fixing resin composition according to any one of [1] to

[12] .

[0032]

[14] A method for disassembling a rotor, which is the method for disassembling a rotor according to

[13] , comprising the step of immersing the rotor in a solvent to disassemble the cured product of the easily disassembleable rotor fixing resin composition.

[0033]

[15] The rotor disassembly method according to

[14] , wherein the solvent is a solvent containing fluoride ions.

[0034]

[16] The rotor disassembly method according to

[14] or

[15] , wherein the immersion is performed at -20 to 200°C.

[0035]

[17] The rotor disassembly method according to any one of

[14] to

[16] , wherein the immersion is performed at 5 to 30°C.

[0036]

[18] A recycling method for a material constituting the rotor described in

[13] , the recycling method comprising: immersing the rotor in a solvent to disassemble the cured product of the easily disassembleable rotor-fixing resin composition; and

[0037] A step of recovering the material from the rotor.

[0038] Effects of the Invention

[0039] According to the present invention, the easy disassembly property of the cured product of the rotor-fixing resin composition can be utilized to improve the resource recyclability. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a plan view showing the rotor according to the present embodiment.

[0041] Figure 2 Yes means Figure 1 A cross-sectional view of the rotor is shown.

[0042] Figure 3 Yes means Figure 1 An enlarged cross-sectional view of the rotor is shown. DETAILED DESCRIPTION

[0043] In this specification, the expression "a to b" in the description of a numerical range means a or more and b or less unless otherwise specified. For example, "1 to 5 mass %" means "1 mass % or more and 5 mass % or less". In addition, the lower limit and upper limit of a numerical range can be arbitrarily combined with the lower limit and upper limit of other numerical ranges, respectively.

[0044] Unless otherwise specified, each component and material exemplified in the present specification may be used alone or in combination of two or more.

[0045] In the description of the group (atomic group) in this specification, the description without substitution or unsubstituted includes both the case of having no substituent and the case of having a substituent. For example, "alkyl" includes not only alkyl without substituent (unsubstituted alkyl) but also alkyl with substituent (substituted alkyl).

[0046] Furthermore, in the description of groups (atomic groups) in the present specification, those not describing linear, branched, or cyclic may be any of linear, branched, or cyclic.

[0047] Unless otherwise specified, the term "organic group" in this specification refers to an atomic group obtained by removing one or more hydrogen atoms from an organic compound. For example, a "monovalent organic group" refers to an atomic group obtained by removing one hydrogen atom from any organic compound.

[0048] Hereinafter, embodiments of the present invention will be described in detail.

[0049] 1. Resin composition for easily disassembled rotor fixing

[0050] The easily disassembleable rotor fixing resin composition (hereinafter also referred to as "resin composition") of this embodiment contains a thermosetting component, and the cured product obtained by thermally curing the resin composition has a structure represented by the following formula (1). The thermal curing conditions may be 175°C and 2 minutes.

[0051]

[0052] (In formula (1), R1 and R2 each independently represent any one of a hydrogen atom, a hydrocarbon group or an aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms.)

[0053] Thus, when the cured product of the resin composition of this embodiment is subjected to solution treatment, the structure of formula (1) is released, and the crosslinked structure in the cured product collapses, thereby achieving easy disassembly. The structure of formula (1) may be generated by a thermal curing reaction of a thermosetting component.

[0054] In the present embodiment, “easy disintegrability” means that when the solidified material is subjected to solution treatment, the solidified material undergoes gel decomposition and becomes soluble.

[0055] And, whether there is the structure shown in formula (1) in the solidified material can be confirmed by conventional analytical methods such as gas chromatography, high performance liquid chromatography, thin layer chromatography, NMR, IR. The analysis object when confirming can be the state of the solidified material, or it can be the decomposition liquid after the solidified material decomposes. From the viewpoint that can be confirmed according to the state of the solidified material, preferably gas chromatography mass spectrometry (GC-MS). In addition, from the viewpoints such as being easy to distinguish with the structure based on coupling agent described later, the analysis object can also be made into the decomposition treatment liquid of the solidified material.

[0056] Furthermore, the cured product of the present embodiment preferably has a structure of formula (1) as a repeating unit. The number of repeating units is not particularly limited, and the average number of repeating units may be 5 to 1,500.

[0057] In formula (1), R1 and R2 each independently represent any one of a hydrogen atom, a hydrocarbon group or an aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms.

[0058] The hydrocarbon group having 1 to 30 carbon atoms may be linear, branched or cyclic, and may or may not have a substituent.

[0059] The hydrocarbon group having 1 to 30 carbon atoms is preferably a linear alkyl group, alkenyl group or alkynyl group having 1 to 20 carbon atoms, and more preferably a linear alkyl group, alkenyl group or alkynyl group having 1 to 10 carbon atoms.

[0060] The branched hydrocarbon group having 3 to 20 carbon atoms is preferably a branched alkyl group, alkenyl group or alkynyl group having 3 to 20 carbon atoms, more preferably a branched alkyl group, alkenyl group or alkynyl group having 3 to 10 carbon atoms, and further preferably a branched alkyl group, alkenyl group or alkynyl group having 3 to 6 carbon atoms.

[0061] The cyclic hydrocarbon group having 3 to 20 carbon atoms is preferably a cycloalkyl group, cycloalkenyl group or cycloalkynyl group having 3 to 20 carbon atoms, and more preferably a cycloalkenyl group or cycloalkynyl group having 5 to 10 carbon atoms. Specific examples thereof include cyclopropyl group, cyclobutyl group, cyclopentyl group and cyclohexyl group.

[0062] The aromatic group may have a substituent, and examples of the substituent include a hydrocarbon group, a hydroxyl group, a halogen atom, and an amino group.

[0063] The alkoxy group having 1 to 30 carbon atoms is preferably an alkoxy group having 1 to 10 carbon atoms, and more preferably an alkoxy group having 1 to 6 carbon atoms. Specific examples thereof include a methoxy group, an ethoxy group, and an isopropoxy group.

[0064] The resin composition of the present embodiment contains a thermosetting component. The thermosetting component generally includes a group that is polymerized / crosslinked by active chemical species such as free radicals, and can be specifically any one of a thermosetting resin or a curing agent. The resin composition of the present embodiment may contain only one thermosetting component, or may contain two or more.

[0065] The resin composition of the present embodiment preferably contains a thermosetting resin and a curing agent. In this case, it is preferred that at least one of the thermosetting resin and the curing agent has a -Si-O- structure. Thus, the cured product of the resin composition of the present embodiment can have a structure shown in formula (1), and the cured product is soluble in a solvent to obtain easy disassembly.

[0066] The resin composition of the present embodiment may combine various components so that the cured product has a structure represented by formula (1), and specifically, for example, the following resin compositions may be mentioned.

[0067] <1> A resin composition comprising a phenolic resin (P) having a -Si-O- structure.

[0068] <2> A resin composition comprising a thermosetting resin and a phenolic resin (P) having a -Si-O- structure as a curing agent.

[0069] <3> A resin composition comprising an epoxy resin (A) having a -Si-O- structure.

[0070] <4> A resin composition comprising a silicone resin (organopolysiloxane) (C1) having two or more alkenyl groups bonded to silicon atoms in one molecule as a thermosetting resin, and an organohydrogenpolysiloxane (C2) having two or more hydrogen atoms bonded to silicon atoms in one molecule as a curing agent.

[0071] <5> A resin composition comprising an acrylic / vinyl resin obtained by reacting an unsaturated bond having a -Si-O- structure in the main chain.

[0072] Hereinafter, each embodiment will be described in detail.

[0073] <First embodiment>

[0074] In the first embodiment, a resin composition containing a phenolic resin (P) having a -Si-O- structure is described. In this case, as a curing agent, a curing agent not having a -Si-O- structure may be used, and a known curing agent may be used. The known curing agent will be described later.

[0075] As the phenol resin (P) having a -Si-O- structure, a phenol resin modified with a silyl ether having a phenolic hydroxyl group can be used. Specifically, for example, a silyl ether-modified novolac represented by the following formula (P1) can be mentioned.

[0076]

[0077] In the formula (P1), x and y are both integers, and x+y is 2 to 200.

[0078] Furthermore, in formula (P1), from the viewpoint of obtaining good disassembly properties and moldability, x:y=1:99 to 99:1 is preferred, x:y=2:98 to 75:25 is more preferred, and x:y=5:95 to 50:50 is further preferred.

[0079] Furthermore, in the formula (P1), D has a structure represented by the following formula (P1-1).

[0080]

[0081] In the formula (P1-1), R9 represents a divalent hydrocarbon group having 2 to 10 carbon atoms. 10 Each independently represents any one of a hydrogen atom, a monovalent hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms. z is an integer of 0-10.

[0082] Among them, R9 is preferably a divalent hydrocarbon group having 2 to 5 carbon atoms, more preferably a divalent hydrocarbon group having 2 to 4 carbon atoms, and still more preferably a propenyl group. 10 Each independently is preferably a monovalent hydrocarbon group having 1 to 20 carbon atoms, more preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms, and may be an alkyl group, more preferably an alkyl group having 1 to 5 carbon atoms, and further preferably a methyl group.

[0083] The weight average molecular weight (Mw) of the phenolic resin (P1) is not particularly limited, but is preferably 500 to 10,000, more preferably 1,000 to 8,000, and even more preferably 1,500 to 5,000. The number average molecular weight of the phenolic resin (P1) is not particularly limited, but is preferably 100 to 5,000, more preferably 300 to 3,000, and even more preferably 600 to 1,000.

[0084] In the present embodiment, Mw and Mn can be calculated by gel permeation chromatography (GPC).

[0085] The phenol resin (P) can be obtained by reacting silyl ethers, phenols and aldehydes in the presence of an acid catalyst.

[0086] As the silyl ethers, compounds having a phenolic hydroxyl group are preferred, and examples thereof include compounds represented by the following formula (P1-2).

[0087]

[0088] In the formula (P1-2), R9 represents a divalent hydrocarbon group having 2 to 10 carbon atoms. 10 Each independently represents any one of a hydrogen atom, a monovalent hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms. z is an integer of 0-10.

[0089] Among them, R9 is preferably a divalent hydrocarbon group having 2 to 5 carbon atoms, more preferably a divalent hydrocarbon group having 2 to 4 carbon atoms, and still more preferably a propenyl group. 10 Each independently is preferably a monovalent hydrocarbon group having 1 to 20 carbon atoms, more preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms. Also, an alkyl group is preferred, an alkyl group having 1 to 5 carbon atoms is more preferred, and a methyl group is further preferred.

[0090] Examples of phenols include, but are not particularly limited to, phenol; cresols such as o-cresol, m-cresol, and p-cresol; xylenols such as 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, and 3,5-xylenol; 2,3,5-trimethylphenol, 2-ethylphenol, 4-ethylphenol, 2-isopropylphenol, 4-isopropylphenol, n-butylphenol, isobutylphenol, tert-butylphenol, hexylphenol, octylphenol, nonylphenol, phenylphenol, benzylphenol, Alkylphenols such as phenol, cumylphenol, allylphenol, cardanol, urushiol, urushiol, and urushiol; naphthols such as 1-naphthol and 2-naphthol; halogenated phenols such as fluorophenol, chlorophenol, bromophenol, and iodophenol; monovalent phenol substitutions such as p-phenylphenol, aminophenol, nitrophenol, dinitrophenol, and trinitrophenol; polyphenols such as resorcinol, alkylresorcinol, pyrogallol, catechol, alkylcatechol, hydroquinone, alkylhydroquinone, phloroglucinol, bisphenol A, bisphenol F, bisphenol S, dihydroxynaphthalene, and naphthalene. They can be used alone or in combination of two or more. Among these, phenols can contain one or more selected from phenol, cresol, xylenol, and alkylphenol. From the perspective of low price, phenol can be used.

[0091] As aldehydes, it is not particularly limited, for example, formaldehyde such as formalin and paraformaldehyde can be cited; trioxane, acetaldehyde, propionaldehyde, polyoxymethylene, chloral, hexamethylenetetramine, furfural, glyoxal, n-butyraldehyde, hexanal, allyl aldehyde, benzaldehyde, crotonaldehyde, acrolein, tetraoxymethylene, phenylacetaldehyde, o-tolualdehyde, salicylaldehyde, etc. These aldehydes can be used alone or in combination of two or more. Among them, aldehydes can include formaldehyde or acetaldehyde, and from the viewpoint of low productivity and price, formalin or paraformaldehyde can be used.

[0092] The catalyst used in the synthesis of the phenolic resin (P) may be non-catalyst, but from the viewpoint of producing a novolac type phenolic resin, an acidic catalyst may be used. The acidic catalyst is not particularly limited, and examples thereof include acids such as oxalic acid, hydrochloric acid, sulfuric acid, diethylsulfuric acid, and p-toluenesulfonic acid, and metal salts such as zinc acetate, and these may be used alone or in combination of two or more.

[0093] As the reaction solvent used when synthesizing the phenolic resin (P), water or an organic solvent can be used. As the organic solvent, a non-aqueous system can be used using a non-polar solvent. As an example of an organic solvent, for example, alcohols, ketones, and aromatics can be cited. As alcohols, methanol, ethanol, propanol, ethylene glycol, diethylene glycol, triethylene glycol, glycerol, etc. can be cited. As ketones, acetone, methyl ethyl ketone, etc. can be cited. As aromatics, toluene, xylene, etc. can be cited. They can be used alone or in combination of two or more.

[0094] In addition, the molar ratio of phenols (P) to aldehydes (F) (F / P molar ratio) may be, for example, 0.2 to 1.0 mol of aldehydes per 1 mol of phenols, preferably 0.3 to 0.9 mol. By setting the aldehydes within the above range, the amount of unreacted phenols can be reduced, and the yield can be improved.

[0095] The reaction temperature can be, for example, 40° C. to 120° C., preferably 60° C. to 110° C. The reaction time is not particularly limited and can be appropriately determined depending on the type of starting materials, blending molar ratio, amount and type of catalyst used, and reaction conditions.

[0096] As described above, the phenol resin (P) can be obtained.

[0097] <Second embodiment>

[0098] In the second embodiment, a case where a phenolic resin (P) having a -Si-O- structure is used as a curing agent is described. In this case, the thermosetting resin may or may not have a -Si-O- structure, but in the second embodiment, a case where the thermosetting resin does not have a -Si-O- structure is described. The thermosetting resin is not particularly limited, and a known epoxy resin can be used. The known epoxy resin will be described later.

[0099] In addition, regarding the phenolic resin (P) and the epoxy resin as the curing agent, the equivalent ratio (EP) / (OH) of the number of epoxy groups (EP) in the total thermosetting resin to the number of phenolic hydroxyl groups (OH) in the total phenolic resin is preferably adjusted to 0.8 or more and 1.6 or less, more preferably 0.9 or more and 1.3 or less, and further preferably 1.0 or more and 1.2 or less. If the equivalent ratio is within the above range, the curing characteristics of the resin composition of the present embodiment obtained can be made good.

[0100] Other components contained in the resin composition of the second embodiment will be described later.

[0101] <Third embodiment>

[0102] In the third embodiment, a resin composition containing an epoxy resin (A) having a -Si-O- structure is described. In this case, the curing agent may or may not have a -Si-O- structure, but in the third embodiment, the case of not having a -Si-O- structure is described. The curing agent is not particularly limited, and a known curing agent can be used. The known curing agent will be described later.

[0103] As the epoxy resin (A) having a -Si-O- structure, specifically, for example, there can be mentioned an epoxy resin (A1) having a -Si-O- structure obtained by epoxidizing the phenolic resin (P1) having a -Si-O- structure described in the first embodiment, a bifunctional or higher-functional epoxy compound (A2) having a structure represented by the following formula (A2), an organosiloxane-type epoxy compound (A3) having a structure represented by the following formula (A3), and the like.

[0104] [Epoxy resin (A1)]

[0105] Examples of the epoxy resin (A1) having a -Si-O- structure obtained by epoxidizing the phenol resin (P1) having a Si-O- structure include resins represented by the following formula (A1).

[0106]

[0107] In formula (A1), x and y are both integers, and x+y is 2-200.

[0108] In formula (A1), from the viewpoint of obtaining good disassembly properties and moldability, x:y=1:99 to 99:1 is preferred, x:y=2:98 to 75:25 is more preferred, and x:y=5:95 to 50:50 is further preferred.

[0109] Furthermore, in the formula (A1), D has a structure represented by the following formula (A1-1).

[0110]

[0111] In the formula (A1-1), R9 represents a divalent hydrocarbon group having 2 to 10 carbon atoms. 10 Each independently represents any one of a hydrogen atom, a monovalent hydrocarbon group or aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms. z is an integer of 0-10.

[0112] Among them, R9 is preferably a divalent hydrocarbon group having 2 to 5 carbon atoms, more preferably a divalent hydrocarbon group having 2 to 4 carbon atoms, and still more preferably a propenyl group. 10Each independently is preferably a monovalent hydrocarbon group having 1 to 20 carbon atoms, more preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms. Also, an alkyl group is preferred, an alkyl group having 1 to 5 carbon atoms is more preferred, and a methyl group is further preferred.

[0113] The epoxy resin (A1) can be produced by epoxidizing the phenol resin (P1) by a known method.

[0114] [Epoxy compound (A2)]

[0115] The epoxy compound (A2) is a bifunctional or higher-functional epoxy compound having a structure represented by the following formula (A2).

[0116]

[0117] In formula (A2), m and n are integers, and m+n=4.

[0118] R3 is independently hydrogen, alkyl, alkenyl, alkynyl, cycloalkyl, cycloalkenyl, cycloalkynyl, aryl, heterocyclyl, heterocycloalkyl, cycloalkenyl, heteroaryl, alkoxyaryl, alkoxyalkyl.

[0119] B is independently arylene, arylene ether, alkylene-arylene, alkylene-arylene alkylene, alkenylene-arylene, alkenylene-arylene alkenylene, alkylene-arylene-alkenylene, alkynylene arylene, alkynylene-arylene-alkynylene, heteroarylene, alkylene-heteroarylene, alkylene-heteroarylene-alkylene, alkenylene-heteroarylene, alkenylene-heteroarylene-alkenylene, alkylene- heteroaryl-alkenylene, alkynylene heteroaryl, alkynylene-heteroaryl-alkynylene, alkylene, alkylene-hetero-alkylene, alkenylene, alkenylene-hetero-alkenylene, alkylene-hetero-alkenylene, alkynylene, cycloalkylene, alkylene-cycloalkylene, alkylene-cycloalkylene alkylene, alkenylene-cycloalkylene, alkenylene-cycloalkylene, alkenylene-cycloalkylene-alkenylene, alkylene-cycloalkylene alkenylene, alkynylene-cycloalkylene, alkynylene-cycloalkylene-alkynylene, heterocycloalkylene, alkylene heterocycloalkylene, alkylene-heterocycloalkylene alkylene, alkenylene-heterocycloalkylene, alkenylene heterocycloalkylene-alkenylene, alkylene heterocycloalkylene-alkenylene, alkynylene heterocycloalkylene, alkynylene-heterocycloalkylene alkynylene, cycloalkenylene, alkylene-cycloalkenylene, alkylene-cycloalkenylene-alkylene, alkenylene-cycloalkenylene, alkenyl-cycloalkenylene-alkenylene, alkylenecycloalkenylene-alkenylene, alkynylene-cycloalkenylene, alkynylene-cycloalkenylene-alkynylene, heterocycloalkenylene, alkylene-heterocycloalkenylene, alkylene-heterocycloalkenylene-alkylene, alkenylene-heterocycloalkenylene, alkenylene-heterocycloalkenylene-alkenylene, alkylene-heterocycloalkenylene-alkenylene, alkynylene-heterocycloalkenylene, alkynylene-heterocycloalkenylene or alkynylene.

[0120] Specific examples of the bifunctional or higher-functional epoxy compound (A2) include compounds represented by the following formulae (A2-1) to (A2-19), respectively.

[0121]

[0122]

[0123] The epoxy compound (A2) can be obtained, for example, as follows.

[0124] The method comprises the following steps: first, partially epoxidizing a polyol having one or more hydroxyl groups with an epihalohydrin in the presence of a base to obtain a partially epoxidized alcohol; and reacting the partially epoxidized alcohol with a compound having a structure represented by the following formulas (4-1) to (4-3) in the presence of an acidic catalyst. Thus, a mixture containing an epoxy compound (A2) having a -Si-O- structure can be obtained.

[0125]

[0126] (wherein, R5 to R8 are independently hydrogen, alkyl, alkenyl, alkynyl, methylene, cycloalkyl, cycloalkenyl, cycloalkynyl, aryl, heterocyclyl, heterocyclylalkyl, cycloalkenyl, heteroaryl, alkoxy, alkoxyaryl, alkoxyalkyl or aryloxy, R 11 is hydrogen, alkyl, aryl, aralkyl, alkenyl or alkynyl. )

[0127] [Epoxy compound (A3)]

[0128] The epoxy compound (A3) has a structure represented by the following formula (A3).

[0129]

[0130] In formula (A3), R1 and R2 each independently represent any one of a hydrogen atom, a hydrocarbon group or an aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms.

[0131] R 12 Each independently represents any one of a hydrogen atom and a hydrocarbon group having 1 to 30 carbon atoms.

[0132] w is an integer from 1 to 50.

[0133] As the epoxy compound (A3), commercially available products can be used, for example, dual-end epoxy-modified silicones "X-22-163", "X-22-163A", "X-22-163B", "X-22-163C" and "KF-105" (all manufactured by Shin-Etsu Chemical Co., Ltd.) can be mentioned.

[0134] Furthermore, specific examples of the epoxy compound (A3) include compounds represented by the following formula (A3-1).

[0135]

[0136] In formula (A3-1), R1 and R2 each independently represent any one of a hydrogen atom, a hydrocarbon group or an aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms.

[0137] Among them, R1 and R2 are preferably an alkyl group having 1 to 30 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and still more preferably a methyl group.

[0138] As the epoxy compound represented by the above formula (A3-1), a commercially available product can be used, and examples thereof include an alicyclic epoxy group-containing linear siloxane bifunctional oligomer "X-40-2669" (manufactured by Shin-Etsu Chemical Co., Ltd.).

[0139] Hereinafter, the physical properties of the epoxy resin (A) having a -Si-O- structure according to the present embodiment will be described.

[0140] The weight average molecular weight (Mw) of the epoxy resin (A) having a -Si-O- structure according to the present embodiment is not particularly limited, but is preferably 500 to 10,000, more preferably 1,000 to 7,000, and further preferably 2,000 to 6,000.

[0141] The number average molecular weight (Mn) of the epoxy resin (A) having a -Si-O- structure according to the present embodiment is not particularly limited, but is preferably 100 to 5,000, more preferably 300 to 3,000, and further preferably 600 to 1,000.

[0142] Furthermore, the viscosity of the epoxy resin (A) having a -Si-O- structure according to the present embodiment is preferably within a range of 1 to 40,000 mPa·s.

[0143] The epoxy resin (A) having a -Si-O- structure of the present embodiment preferably has an epoxy equivalent (EEW) in the range of 100 to 600 g / milli-equivalent. Here, the epoxy equivalent refers to the mass (gram) of a resin containing one equivalent of epoxy groups.

[0144] In the third embodiment, it is preferable to use a known phenolic curing agent for the resin composition.

[0145] In addition, regarding the phenolic curing agent and the epoxy resin (A) having a -Si-O- structure as a curing agent, the equivalent ratio (EP) / (OH) of the number of epoxy groups (EP) in all thermosetting resins to the number of phenolic hydroxyl groups (OH) in all phenolic resins is preferably adjusted to 0.8 or more and 1.6 or less, more preferably 0.9 or more and 1.3 or less, and further preferably 1.0 or more and 1.2 or less. If the equivalent ratio is within the above range, the curing characteristics of the resin composition of the present embodiment can be improved.

[0146] Other components contained in the resin composition of the third embodiment will be described later.

[0147] <Fourth embodiment>

[0148] In the fourth embodiment, a resin composition is described that contains an organopolysiloxane (organosilicone resin) (C1) having two or more alkenyl groups bonded to silicon atoms in one molecule as a thermosetting resin, and an organohydrogenpolysiloxane (C2) having two or more hydrogen atoms bonded to silicon atoms in one molecule as a curing agent (cross-linking agent).

[0149] (Organopolysiloxane (C1))

[0150] The organopolysiloxane (C1) having two or more alkenyl groups bonded to silicon atoms in one molecule is preferably a linear organopolysiloxane, and preferably has 2 to 8 alkenyl groups bonded to silicon atoms in one molecule. Specific examples include compounds having a structure represented by the following formula (C1-1).

[0151]

[0152] In formula (C1-1), R 13 They are the same or different types of substituted or unsubstituted alkyl groups having 1 to 10 carbon atoms, aryl groups having 6 to 12 carbon atoms or alkenyl groups having 2 to 10 carbon atoms.

[0153] As R 13 Specific examples include alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, and cyclohexyl, or fluorine-substituted alkyl groups such as trifluoromethyl and 3,3,3-trifluoropropyl in which a part or all of the hydrogen atoms bonded to the carbon atoms of these alkyl groups are substituted with halogen atoms such as chlorine atoms, fluorine atoms, and bromine atoms, for example, alkenyl groups such as vinyl, allyl, butenyl, pentenyl, hexenyl, and cyclohexenyl, and aryl groups such as phenyl.

[0154] Among these, an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 8 carbon atoms, and an alkenyl group having 2 to 6 carbon atoms are preferred.

[0155] s is an integer of 5 to 50,000, preferably an integer of 10 to 20,000.

[0156] The alkenyl group in the organopolysiloxane (C1) may be present at either the molecular chain terminal or the side chain, but preferably has the alkenyl group only at the terminal.

[0157] In the organopolysiloxane (C1), examples of the specific structure of the vinyl group-containing linear organopolysiloxane (C1-2) include a structure represented by the following formula (C1-2).

[0158]

[0159] In formula (C1-2), R 1 and R 2 Each is independently a methyl group or a vinyl group, and at least one of them is a vinyl group.

[0160] The vinyl-containing linear organopolysiloxane (C1-2) may contain a first vinyl-containing linear organopolysiloxane (C1-2') having two or more vinyl groups in the molecule and a vinyl content of 0.4 mol% or less. The vinyl content of the first vinyl-containing linear organopolysiloxane (C1-2') may be 0.1 mol% or less.

[0161] Furthermore, the vinyl-containing linear organopolysiloxane (C1-2) may contain a first vinyl-containing linear organopolysiloxane (C1-2′) and a second vinyl-containing linear organopolysiloxane (C1-2″) having a vinyl content of 0.5 to 15 mol%.

[0162] By combining the raw rubber as the raw material of the silicone rubber with the first vinyl-containing linear organopolysiloxane (C1-2') and the second vinyl-containing linear organopolysiloxane (C1-2") having a high vinyl content, the vinyl groups can be localized, and the crosslinking density can be more effectively formed in the crosslinking network of the silicone rubber. As a result, the tear strength of the release film can be more effectively improved, and the dimensional stability and transferability can be easily controlled.

[0163] Specifically, as the vinyl group-containing linear organopolysiloxane (C1-2), for example, one having two or more R in the above formula (C1-2) in the molecule is preferably used. 1 The vinyl unit and / or R 2 A first vinyl-containing linear organopolysiloxane (C1-2′) containing vinyl units and a content of these units of 0.4 mol % or less, and 0.5 to 15 mol % of R1 The vinyl unit and / or R 2 The second vinyl-containing linear organopolysiloxane (C1-2") having a vinyl unit.

[0164] The first vinyl-containing linear organopolysiloxane (C1-2') preferably has a vinyl content of 0.01 to 0.2 mol%. The second vinyl-containing linear organopolysiloxane (C1-2") preferably has a vinyl content of 0.8 to 12 mol%.

[0165] Moreover, when the first vinyl-containing straight-chain organopolysiloxane (C1-2') and the second vinyl-containing straight-chain organopolysiloxane (C1-2") are combined, the ratio of (C1-2') to (C1-2") is not particularly limited. For example, in terms of weight ratio, (C1-2'):(C1-2") is preferably 50:50 to 95:5, and more preferably 80:20 to 90:10.

[0166] The first vinyl-containing linear organopolysiloxane (C1-2′) and the second vinyl-containing linear organopolysiloxane (C1-2″) may be used alone or in combination of two or more.

[0167] Furthermore, the organopolysiloxane (C1) may contain a vinyl group-containing branched organopolysiloxane having a branched structure.

[0168] (Organohydrogenpolysiloxane (C2))

[0169] Examples of the organohydrogenpolysiloxane (C2) having two or more hydrogen atoms bonded to silicon atoms in one molecule include compounds having a structure represented by the following formula (C2).

[0170]

[0171] In formula (C2), R 14 Each of them is independently an alkyl group such as methyl, ethyl, propyl, butyl, a cycloalkyl group such as cyclohexyl, an aryl group such as phenyl, tolyl, or a group in which a part or all of the hydrogen atoms bonded to the carbon atoms of these groups are substituted by hydroxyl, cyano, halogen atoms, etc. It is preferably a monovalent hydrocarbon group having 1 to 10 carbon atoms, and may be an alkyl group or an aryl group. t is an integer greater than 2, preferably 2 to 50, and more preferably 3 to 30.

[0172] The amount of the organohydrogenpolysiloxane (C2) can be appropriately set according to the molar number of alkenyl groups in the organopolysiloxane (C1) having two or more alkenyl groups in one molecule. It is preferably adjusted so that the molar number of SiH groups in the organohydrogenpolysiloxane (C2) is within the range of 0.5 to 20, more preferably 0.8 to 5, of the alkenyl groups in the silicone resin (C1).

[0173] The organohydrogenpolysiloxane (C2) can be divided into a linear organohydrogenpolysiloxane (C2-1) having a linear structure and a branched organohydrogenpolysiloxane (C2-2) having a branched structure, and any one or both of these may be contained.

[0174] The straight-chain organohydrogenpolysiloxane (C2-1) is a polymer having a straight-chain structure and a structure in which hydrogen and Si are directly bonded (≡Si—H). In addition to undergoing a hydrosilylation reaction with the vinyl groups of the vinyl-containing organopolysiloxane (C1-2), it also undergoes a hydrosilylation reaction with the vinyl groups of the components contained in the raw materials of the release layer 1, thereby crosslinking these components.

[0175] The molecular weight of the linear organohydrogenpolysiloxane (C2-1) is not particularly limited, but for example, the weight average molecular weight is preferably 20,000 or less, and more preferably 1,000 or more and 10,000 or less.

[0176] The weight average molecular weight of the linear organohydrogenpolysiloxane (C2-1) can be measured, for example, in terms of polystyrene by GPC (gel permeation chromatography) using chloroform as a developing solvent.

[0177] Furthermore, it is generally preferred that the linear organohydrogenpolysiloxane (C2-1) does not have a vinyl group. This can reliably prevent a crosslinking reaction from proceeding within the molecule of the linear organohydrogenpolysiloxane (C2-1).

[0178] As the above-mentioned linear organohydrogenpolysiloxane (C2-1), for example, a compound having a structure represented by the following formula (C2-1) is preferably used.

[0179]

[0180] In formula (C2-1), R 4 It is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, hydrocarbon group or hydride group having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include methyl group, ethyl group, propyl group, etc., among which methyl group is preferred. Examples of the alkenyl group having 1 to 10 carbon atoms include vinyl group, allyl group, butenyl group, etc. Examples of the aryl group having 1 to 10 carbon atoms include phenyl group.

[0181] And, R 5It is a substituted or unsubstituted alkyl group, alkenyl group, aryl group, hydrocarbon group or hydride group having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include methyl group, ethyl group and propyl group, among which methyl group is preferred. Examples of the alkenyl group having 1 to 10 carbon atoms include vinyl group, allyl group and butenyl group. Examples of the aryl group having 1 to 10 carbon atoms include phenyl group.

[0182] In formula (C2-1), a plurality of R 4 Independent of each other, can be different or the same. 5 The same is true. Among them, multiple R 4 and R 5 At least two of them are hydride groups.

[0183] And, R 6 is a substituted or unsubstituted alkyl group, aryl group or a hydrocarbon group composed of a combination of 1 to 8 carbon atoms. Examples of the alkyl group having 1 to 8 carbon atoms include methyl, ethyl, propyl, etc., among which methyl is preferred. Examples of the aryl group having 1 to 8 carbon atoms include phenyl. 6 Independent of each other, they can be different or the same.

[0184] In addition, as R in formula (C2-1), 4 , R 5 , R 6 Examples of the substituent include a methyl group and a vinyl group. From the viewpoint of preventing a cross-linking reaction within the molecule, a methyl group is preferred.

[0185] Furthermore, m and n are the numbers of repeating units constituting the linear organohydrogenpolysiloxane (C2-1) represented by formula (C2-1), m is an integer of 2 to 150, and n is an integer of 2 to 150. Preferably, m is an integer of 2 to 100, and n is an integer of 2 to 100.

[0186] The linear organohydrogenpolysiloxane (C2-1) may be used alone or in combination of two or more.

[0187] The branched organohydrogenpolysiloxane (C2-2) forms a region with a high crosslinking density due to its branched structure, and is a component that greatly contributes to the formation of a sparse and dense structure of the crosslinking density in the silicone rubber system. In addition, similar to the above-mentioned straight-chain organohydrogenpolysiloxane (C2-1), it is a polymer having a structure in which hydrogen and Si are directly bonded (≡Si-H), and in addition to undergoing a hydrosilylation reaction with the vinyl group of the vinyl-containing organopolysiloxane (C1-2), it also undergoes a hydrosilylation reaction with the vinyl group of the component contained in the raw material of the release layer 1, thereby crosslinking these components.

[0188] Furthermore, the specific gravity of the branched organohydrogenpolysiloxane (C2-2) is within a range of 0.9 to 0.95.

[0189] Furthermore, it is generally preferred that the branched organohydrogenpolysiloxane (C2-2) does not have a vinyl group. This can reliably prevent the occurrence of a crosslinking reaction within the molecule of the branched organohydrogenpolysiloxane (C2-2).

[0190] Furthermore, as the branched organohydrogenpolysiloxane (C2-2), a compound represented by the following average composition formula (c) is preferred.

[0191] Average composition formula (c)

[0192] (Ha(R 7 )3-aSiO 1 / 2 )m(SiO 4 / 2 )

[0193] (In formula (c), R 7 is a monovalent organic group, a is an integer in the range of 1 to 3, and m is Ha(R 7 )3-aSiO 1 / 2 Unit number, n is SiO 4 / 2 Number of units. )

[0194] In formula (c), R 7 It is a monovalent organic group, preferably a substituted or unsubstituted alkyl group, aryl group or a hydrocarbon group composed of a combination thereof having 1 to 10 carbon atoms. Examples of the alkyl group having 1 to 10 carbon atoms include methyl, ethyl, propyl, etc., among which methyl is preferred. Examples of the aryl group having 1 to 10 carbon atoms include phenyl.

[0195] In formula (c), a represents the number of hydride groups (hydrogen atoms directly bonded to Si), and is an integer in the range of 1 to 3, and is preferably 1.

[0196] Furthermore, in formula (c), m is Ha(R 7 )3-aSiO 1 / 2 Unit number, n is SiO 4 / 2 Number of units.

[0197] The branched organohydrogenpolysiloxane (C2-2) has a branched structure. The linear organohydrogenpolysiloxane (C2-1) and the branched organohydrogenpolysiloxane (C2-2) differ in whether their structures are linear or branched, and when the number of Si is 1, the number of alkyl groups R bonded to Si (R / Si) is in the range of 1.8 to 2.1 in the linear organohydrogenpolysiloxane (C2-1), and in the range of 0.8 to 1.7 in the branched organohydrogenpolysiloxane (C2-2).

[0198] In addition, the branched organohydrogenpolysiloxane (C2-2) has a branched structure, and therefore, for example, the amount of residue when heated to 1000° C. at a heating rate of 10° C. / min in a nitrogen atmosphere is 5% or more. In contrast, the linear organohydrogenpolysiloxane (C2-1) is linear, and therefore the amount of residue after heating under the above conditions is almost zero.

[0199] Moreover, as a specific example of the branched organohydrogenpolysiloxane (C2-2), the compound which has the structure represented by the following formula (C2-2) is mentioned.

[0200]

[0201] In formula (C2-2), R 7 is a substituted or unsubstituted alkyl group, aryl group, or a hydrocarbon group composed of a combination of these groups having 1 to 8 carbon atoms, or a hydrogen atom. Examples of the alkyl group having 1 to 8 carbon atoms include methyl, ethyl, and propyl groups, among which methyl groups are preferred. Examples of the aryl group having 1 to 8 carbon atoms include phenyl groups. 7 The substituent group thereof includes, for example, a methyl group.

[0202] In formula (C2-2), a plurality of R 7 Independent of each other, they can be different or the same.

[0203] Furthermore, in the formula (C2-2), "-O-Si≡" indicates that Si has a three-dimensionally extended branched structure.

[0204] The branched organohydrogenpolysiloxane (C2-2) may be used alone or in combination of two or more.

[0205] Furthermore, in the linear organohydrogenpolysiloxane (C2-1) and the branched organohydrogenpolysiloxane (C2-2), the amount of hydrogen atoms (hydride groups) directly bonded to Si is not particularly limited.

[0206] However, in the release layer 1, the total amount of hydride groups of the linear organohydrogenpolysiloxane (C2-1) and the branched organohydrogenpolysiloxane (C2-2) is preferably 0.5 to 5 mol, more preferably 1 to 3.5 mol, per 1 mol of the vinyl group in the vinyl-containing linear organopolysiloxane (C1-1). This ensures that a crosslinking network can be formed between the linear organohydrogenpolysiloxane (C2-1) and the branched organohydrogenpolysiloxane (C2-2) and the vinyl-containing linear organopolysiloxane (C1-1).

[0207] (Catalyst, curing accelerator)

[0208] In the fourth embodiment, the resin composition preferably further contains a catalyst, which can promote the curing of the organopolysiloxane (C1) and the organohydrogenpolysiloxane (C2).

[0209] Examples of the catalyst include platinum-based catalysts, rhodium-based catalysts, and palladium-based catalysts, and among them, platinum is preferred.

[0210] Specific examples of the platinum-based catalyst include platinum fine powder, chloroplatinic acid, alcohol solutions of chloroplatinic acid, platinum-alkenylsiloxane complexes, platinum-olefin complexes, platinum-carbonyl complexes, and catalysts obtained by dispersing or encapsulating these platinum-based catalysts using thermoplastic resins.

[0211] The amount of the catalyst added is preferably 0.01 to 5% by mass, more preferably 0.02 to 2% by mass, and even more preferably 0.05 to 1% by mass, based on the total amount of the resin composition.

[0212] Other components contained in the resin composition of the fourth embodiment will be described later.

[0213] As mentioned above, although an example of embodiment of the resin composition of this invention was demonstrated, the resin composition of this invention is not limited to this.

[0214] Furthermore, the resin composition of each embodiment described above may contain a known thermosetting resin and a known curing agent in addition to the above-mentioned thermosetting component, and may contain other components depending on the application and the like.

[0215] Hereinafter, other components which may be contained in the resin composition of the present invention will be described.

[0216] [Thermosetting resin]

[0217] As the thermosetting resin of the present embodiment, for example, one or more selected from phenolic resin, epoxy resin, phenoxy resin, polyimide resin, benzoxazine resin, unsaturated polyester resin, melamine resin, silicone resin, cyanate resin, maleimide resin, cyanate resin and acrylic resin can be cited. These thermosetting resins can use all monomers, oligomers and polymers having two or more reactive functional groups in one molecule, and their molecular weight and molecular structure are not particularly limited.

[0218] As the epoxy resin, any monomer, oligomer, or polymer having two or more epoxy groups in one molecule may be used, and the molecular weight and molecular structure thereof are not particularly limited.

[0219] Specifically, the epoxy resin may be selected from: novolac epoxy resins such as phenol novolac epoxy resins and cresol novolac epoxy resins; bisphenol-A epoxy resins, bisphenol-F epoxy resins and other bisphenol-type epoxy resins; aromatic glycidylamine epoxy resins such as N,N-diglycidylaniline, N,N-diglycidyltoluidine, diaminodiphenylmethane glycidylamine, and aminophenol glycidylamine; hydroquinone epoxy resins; biphenyl epoxy resins; stilbene epoxy resins; trisphenolmethane epoxy resins; trisphenolpropane epoxy resins ; alkyl-modified trisphenol methane type epoxy resin; epoxy resin containing a triazine core; dicyclopentadiene-modified phenol type epoxy resin; naphthol type epoxy resin; naphthalene type epoxy resin; naphthylene ether type epoxy resin; phenol aralkyl type epoxy resin having a phenylene skeleton and / or a biphenylene skeleton, naphthol aralkyl type epoxy resin having a phenylene skeleton and / or a biphenylene skeleton, etc., or one or more of aliphatic epoxy resins such as alicyclic epoxies such as vinyl cyclohexene dioxide, dicyclopentadiene oxide, and alicyclic diepoxy-adipic acid esters.

[0220] The content of the thermosetting resin is preferably 1% by mass to 50% by mass, more preferably 2% by mass to 30% by mass, and even more preferably 5% by mass to 20% by mass, based on the total amount of the resin composition.

[0221] By setting the content of the thermosetting resin to be greater than the above lower limit, the fluidity and moldability of the resin composition can be more effectively improved. In addition, by setting the content of the thermosetting resin to be less than the above upper limit, the curability can be improved to obtain a good cured product.

[0222] [Curing agent]

[0223] The curing agent of the present embodiment can be selected according to the type of thermosetting resin, and is not particularly limited as long as it reacts with the thermosetting resin. Specific examples of the curing agent include polyaddition curing agents, catalytic curing agents, and condensation curing agents.

[0224] Specific examples of the curing agent include phenolic curing agents, amines, polyhydroxystyrenes such as polyparahydroxystyrene, alicyclic anhydrides including hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA), aromatic anhydrides such as trimellitic anhydride (TMA), pyromellitic dianhydride (PMDA) and benzophenonetetracarboxylic acid (BTDA), polythiol compounds such as polysulfides, thioesters and thioethers, isocyanate prepolymers, isocyanate compounds such as blocked isocyanates, and organic acids such as carboxylic acid-containing polyester resins.

[0225] The phenolic curing agent specifically includes one or more selected from: phenol novolac resin, cresol novolac resin, naphthol novolac resin, aminotriazine novolac resin, novolac resin, triphenylmethane phenol novolac resin and other novolac phenolic resins; terpene modified phenolic resin, dicyclopentadiene modified phenolic resin and other modified phenolic resins; aralkyl resins such as phenol aralkyl resins having a phenylene skeleton and / or a biphenylene skeleton, naphthol aralkyl resins having a phenylene skeleton and / or a biphenylene skeleton; bisphenol compounds such as bisphenol A and bisphenol F; resol type phenolic resins, etc. In addition, from the viewpoint of curability, the hydroxyl equivalent of the phenolic resin curing agent is preferably set to 90 g / eq or more and 250 g / eq or less.

[0226] As the above-mentioned amines, specifically, for example, one or more of the anhydrides selected from aliphatic polyamines such as diethylenetriamine (DETA), triethylenetetramine (TETA), and meta-xylylenediamine (MXDA), aromatic polyamines such as diaminodiphenylmethane (DDM), meta-phenylenediamine (MPDA), and diaminodiphenyl sulfone (DDS), and polyamine compounds including dicyandiamide (DICY) and organic acid dihydrazides, and alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA), and aromatic acid anhydrides such as trimellitic anhydride (TMA), pyromellitic dianhydride (PMDA), and benzophenonetetracarboxylic acid (BTDA).

[0227] The content of the curing agent is preferably 5 to 50 parts by mass, more preferably 10 to 30 parts by mass, based on 100 parts by mass of the thermosetting resin.

[0228] And, the content of thermosetting resin and curing agent can be appropriately set according to thermosetting resin and curing agent.For example, about the phenolic curing agent as curing agent and the epoxy resin as thermosetting resin, it is preferred that the equivalent ratio (EP) / (OH) of the number of epoxy groups (EP) in all thermosetting resins and the number of phenolic hydroxyl groups (OH) of all phenolic resins is adjusted to 0.8 or more and 1.6 or less, more preferably adjusted to 0.9 or more and 1.3 or less, and further preferably adjusted to 1.0 or more and 1.2 or less.If the equivalent ratio is within the above range, the curing characteristics of the resin composition of the present embodiment obtained can be made good.

[0229] The resin composition of the present embodiment may further contain the following components.

[0230] [Inorganic filler]

[0231] The resin composition of the present embodiment may contain an inorganic filler.

[0232] The inorganic filler can be used to improve the mechanical strength or impart heat resistance, flame retardancy, etc., depending on the application of the cured product or the rotor.

[0233] As inorganic fillers, specifically, silicates such as talc, fired clay, unfired clay, mica, and glass can be cited; oxides such as titanium oxide, aluminum oxide, boehmite, and silicon dioxide; carbonates such as calcium carbonate, magnesium carbonate, and hydrotalcite; hydroxides such as aluminum hydroxide, magnesium hydroxide, and calcium hydroxide; sulfates or sulfites such as barium sulfate, calcium sulfate, and calcium sulfite; borates such as zinc borate, barium metaborate, aluminum borate, calcium borate, and sodium borate; nitrides such as aluminum nitride, boron nitride, silicon nitride, and carbon nitride; titanates such as strontium titanate and barium titanate, etc. They can be used alone or in combination of two or more.

[0234] The average particle size D50 of the inorganic filler is preferably 0.01 μm to 75 μm, and more preferably 0.05 μm to 50 μm. By setting the average particle size of the inorganic filler within the above range, the filling property is improved. The average particle size D50 can be the volume conversion (cumulative 50%) average particle size measured by a commercially available laser particle size distribution meter.

[0235] The content of the inorganic filler can be appropriately set depending on the application, and is preferably 10 to 98% by mass, more preferably 20 to 95% by mass, and even more preferably 40 to 95% by mass based on the total amount of the resin composition.

[0236] By setting the content of the inorganic filler to be greater than the above lower limit, the storage stability and curability of the cured product can be improved. In addition, by setting the content of the inorganic filler to be less than the above upper limit, good fluidity of the resin composition can be obtained, and moldability can be effectively improved.

[0237] [Coupling agent]

[0238] The resin composition of the present embodiment may contain a coupling agent when containing an inorganic filler, thereby suppressing aggregation of the inorganic filler and obtaining good fluidity.

[0239] As the coupling agent, for example, known coupling agents such as various silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, and vinylsilane, titanium compounds, aluminum chelates, and aluminum / zirconium compounds can be used.

[0240] More specifically, vinyl trichlorosilane, vinyl trimethoxysilane, vinyl triethoxysilane, vinyl tri(β-methoxyethoxy)silane, γ-methacryloxypropyl trimethoxysilane, β-(3,4-epoxycyclohexyl)ethyl trimethoxysilane, γ-glycidoxypropyl trimethoxysilane, γ-glycidoxypropyl triethoxysilane, γ-glycidoxypropyl methyl dimethoxysilane, γ-methacryloxypropyl methyl diethoxysilane, γ-methacryloxypropyl triethoxysilane, vinyl triacetoxysilane, γ-mercaptopropyl trimethoxysilane, γ-aminopropyl triethoxysilane, Silane, γ-anilinopropyl trimethoxysilane, γ-anilinopropyl methyl dimethoxysilane, γ-[bis(β-hydroxyethyl)]aminopropyl triethoxysilane, N-β-(aminoethyl)-γ-aminopropyl trimethoxysilane, N-β-(aminoethyl)-γ-aminopropyl triethoxysilane, N-β-(aminoethyl)-γ-aminopropyl methyl dimethoxysilane, N-phenyl-γ-aminopropyl trimethoxysilane, γ-(β-aminoethyl) aminopropyl dimethoxymethyl silane, N-(trimethoxysilylpropyl)ethylenediamine, N-(dimethoxymethylsilylisopropyl)ethylenediamine, methyl trimethoxy Silane coupling agents such as silane, dimethyldimethoxysilane, methyltriethoxysilane, N-β-(N-vinylbenzylaminoethyl)-γ-aminopropyltrimethoxysilane, γ-chloropropyltrimethoxysilane, hexamethyldisilane, vinyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, 3-isocyanatepropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, and hydrolyzate of N-(1,3-dimethylbutenyl)-3-(triethoxysilyl)propylamine; isopropyl triisostearate titanate, isopropyl tri(dioctyl pyrophosphate) titanate, isopropyl tri(N-aminoethyl-aminoethyl) titanate Titanate coupling agents include bis(di-tridecylphosphite) titanate, tetraoctylbis(di-tridecylphosphite) titanate, tetra(2,2-diallyloxymethyl-1-butyl)bis(di-tridecyl)phosphite titanate, bis(dioctyl pyrophosphite)oxyacetate titanate, bis(dioctyl pyrophosphite)ethylene titanate, isopropyl trioctanoyl titanate, isopropyl dimethacrylate isostearyl titanate, isopropyl tri-dodecylbenzenesulfonyl titanate, isopropyl isostearyl diacrylate titanate, isopropyl tri(dioctylphosphite) titanate, isopropyl tricumylphenyl titanate, and tetraisopropyl bis(dioctylphosphite) titanate. These may be used alone or in combination of two or more.

[0241] The content of the coupling agent is not particularly limited, and is preferably 0.05% by mass or more and 3% by mass or less relative to the entire resin composition, and more preferably 0.1% by mass or more and 2% by mass or less. By setting the content of the coupling agent to above the above lower limit, the dispersibility of the inorganic filler in the resin composition can be made good. In addition, by setting the content of the coupling agent to below the above upper limit, the fluidity of the resin composition can be made good, thereby achieving an improvement in formability.

[0242] [Curing accelerator]

[0243] The resin composition of the present embodiment may contain a curing accelerator.

[0244] Cure accelerators typically accelerate the reaction of thermosetting resins with curing agents.

[0245] Specific examples of curing accelerators include phosphorus atom-containing compounds such as organic phosphines, tetrasubstituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, or adducts of phosphonium compounds and silane compounds; amidine compounds such as 1,8-diazabicyclo(5,4,0)undecene-7 and imidazole; nitrogen atom-containing compounds such as tertiary amines such as benzyldimethylamine, amidine salts or ammonium salts; phenol compounds such as phenol, bisphenol A, nonylphenol, and 2,3-dihydroxynaphthalene; and the like.

[0246] Examples of the organic phosphine include triphenylphosphine, tri-p-tolylphosphine, tetraphenylphosphonium-tetraphenylborate, triphenylphosphine-triphenylborane, 1,2-bis-(diphenylphosphino)ethane, etc. These may be used alone or in combination of two or more.

[0247] The content of the curing accelerator can be appropriately set depending on the application, and is preferably 0.1 to 5% by mass, more preferably 0.2 to 3% by mass, based on the total amount of the resin composition.

[0248] By setting the content of the curing accelerator to be equal to or greater than the above lower limit, the resin composition can be easily cured appropriately. On the other hand, by setting the content of the curing accelerator to be equal to or less than the above upper limit, the molten state can be prolonged and the low viscosity state can be further prolonged.

[0249] [Hydroxy-containing cyclic compounds]

[0250] The resin composition of the present embodiment may contain a compound having hydroxyl groups bonded to two or more adjacent carbon atoms constituting an aromatic ring (hereinafter also referred to as a "cyclic compound containing hydroxyl groups") when containing a curing accelerator. Thus, even when a curing accelerator containing phosphorus atoms without potential is used as a curing accelerator, the reaction of the resin composition during melt kneading can be suppressed, and the resin composition can be obtained stably. In addition, the cyclic compound containing hydroxyl groups also has the effect of reducing the melt viscosity of the resin composition and improving fluidity.

[0251] As the cyclic compound containing a hydroxyl group, a monocyclic compound represented by the following general formula (5) or a polycyclic compound represented by the following general formula (6) can be used. These compounds may have a substituent other than a hydroxyl group.

[0252]

[0253] In the general formula (5), one of R15 and R19 is a hydroxyl group, and the other is a hydrogen atom, a hydroxyl group, or a substituent other than a hydroxyl group. Furthermore, R16, R17, and R18 are a hydrogen atom, a hydroxyl group, or a substituent other than a hydroxyl group.

[0254]

[0255] In the general formula (6), either R20 or R26 is a hydroxyl group, and the other is a hydrogen atom, a hydroxyl group, or a substituent other than a hydroxyl group. Furthermore, R21, R22, R23, R24, and R25 are a hydrogen atom, a hydroxyl group, or a substituent other than a hydroxyl group.

[0256] Specific examples of the monocyclic compound represented by the general formula (5) include catechol, pyrogallol, gallic acid, gallic acid esters, and derivatives thereof.

[0257] In addition, as specific examples of polycyclic compounds represented by general formula (6), for example, 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene and their derivatives can be cited. Among these, from the viewpoint of easy control of fluidity and curability, compounds in which hydroxyl groups are respectively bonded to two adjacent carbon atoms constituting the aromatic ring are preferred. Moreover, considering the volatilization in the kneading process, compounds in which the parent core is a naphthalene ring with low volatility and high weighing stability are more preferred. In this case, specifically, the hydroxyl-containing cyclic compound can be, for example, a compound having a naphthalene ring such as 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene and its derivatives. These hydroxyl-containing cyclic compounds can be used alone or in combination of two or more.

[0258] The content of the hydroxyl-containing cyclic compound is preferably 0.01% by mass or more relative to the total value of 100% by mass of the resin composition, more preferably 0.03% by mass or more, and further preferably 0.05% by mass or more. If the content of the hydroxyl-containing cyclic compound is within the above range, the resin composition can be sufficiently low in viscosity and fluidity. The content of the hydroxyl-containing cyclic compound is preferably 2% by mass or less relative to the total value of 100% by mass of the resin composition, more preferably 0.8% by mass or less, and further preferably 0.5% by mass or less. If the content of the hydroxyl-containing cyclic compound is within the above range, the risk of causing the curability of the resin composition to decrease or the physical properties of the cured product to decrease is small.

[0259] Moreover, the resin composition of this embodiment may also contain colorants such as carbon black; release agents such as natural wax, synthetic wax, higher fatty acid or its metal salt, paraffin, oxidized polyethylene, etc.; low stress agents such as silicone oil, silicone rubber, etc.; flame retardants such as aluminum hydroxide; ion scavengers such as hydrotalcite or hydrated oxides of elements selected from magnesium, aluminum, bismuth, titanium, and zirconium; various additives such as thiazoline, diazole, triazole, triazine, pyrimidine, etc., and antioxidants.

[0260] Next, the method for producing the resin composition according to the present embodiment will be described.

[0261] The method for manufacturing the resin composition of the present embodiment is not particularly limited. For example, a thermosetting component and any other components are mixed using a mixer, and then melt-heated and kneaded at about 90 to 120° C. using a heating kneader, a hot roller or an extruder. Then, the obtained kneaded product is cooled and crushed to obtain a powdery or granular resin composition. The resin composition can be pressed into a tablet shape after crushing as needed, or it can be crushed into a sheet shape, for example, by vacuum lamination or compression molding.

[0262] Furthermore, for example, various mixers such as ultrasonic dispersion, high-pressure impact dispersion, high-speed rotation dispersion, bead mill, high-speed shear dispersion, or rotation-revolution dispersion can be used to dissolve, mix, and stir the thermosetting component and other arbitrary components in a solvent to prepare a varnish-like resin composition.

[0263] Specific examples of the solvent include acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, heptane, cyclohexane, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethyl sulfoxide, ethylene glycol, cellosolves, carbitols, anisole, and N-methylpyrrolidone. The solvent may be used alone or in combination of two or more.

[0264] 2. Rotor

[0265] The rotor of the present embodiment has a cured product of the above-mentioned easily disassembleable rotor-fixing resin composition. The cured product is obtained by thermally curing the resin composition of the present embodiment at 100 to 200° C. for 10 to 900 seconds.

[0266] Hereinafter, an example of the rotor according to the present embodiment will be described.

[0267] Figure 1 1 is a plan view showing the rotor 100 according to the present embodiment. Figure 2 Yes means Figure 1 The cross-sectional view of the rotor 100 is shown. In addition, Figure 1 and Figure 2 is a schematic diagram showing the rotor 100. The structure of the rotor 100 involved in this embodiment is not limited to Figure 1 and Figure 2 The structure shown.

[0268] The rotor 100 includes a rotor core 110, a magnet 120, and a fixing member 130. The rotor core 110 is provided with a hole 150. The magnet 120 is inserted into the hole 150. The fixing member 130 is provided at a separation portion 140 between the hole 150 and the magnet 120.

[0269] The fixing member 130 is formed using the above-mentioned easily disassembleable rotor fixing resin composition.

[0270] The rotor 100 according to the present embodiment constitutes, for example, a motor mounted on a car, etc. The motor includes the rotor 100 and a stator (not shown) provided around the rotor 100. The stator is constituted by a stator core and a coil wound around the stator core.

[0271] like Figure 2 As shown, the rotor 100 is mounted on the rotating shaft 170. The rotation generated by the rotor 100 is transmitted to the outside via the rotating shaft 170.

[0272] The rotor core 110 is provided with a through hole for inserting the rotating shaft 170. The rotor core 110 is fixed to the rotating shaft 170 inserted into the through hole. The shape of the rotor core 110 is not particularly limited, and may be, for example, circular or polygonal in plan view.

[0273] like Figure 2 As shown, the rotor core 110 is formed by laminating a plurality of electromagnetic steel sheets 112, which are thin plate-shaped magnetic bodies. The electromagnetic steel sheets 112 are made of, for example, iron or an iron alloy.

[0274] And, if Figure 2As shown, end plates 118a and 118b are provided at both ends of the rotor core 110 in the axial direction. That is, end plates 118a are provided on the stacked electromagnetic steel sheets 112. And end plates 118b are provided under the stacked electromagnetic steel sheets 112. End plates 118a and 118b are fixed to the rotating shaft 170 by welding, for example.

[0275] Figure 3 Yes means Figure 1 FIG. 1 is an enlarged cross-sectional view of the rotor 100 shown in FIG. Figure 3 As shown, caulking portions 160 are formed on the plurality of electromagnetic steel sheets 112. The caulking portions 160 are constituted by, for example, protrusions formed on the electromagnetic steel sheets 112. The electromagnetic steel sheets 112 are connected to each other by the caulking portions 160.

[0276] Furthermore, the end plate 118a is provided with a groove 116 for avoiding interference with, for example, a rivet portion 160 protruding from the electromagnetic steel sheet 112 or a fixing member 130 protruding from the electromagnetic steel sheet 112. The fixing member 130 protruding from the electromagnetic steel sheet 112 is a portion formed by curing the fixing resin composition remaining on the electromagnetic steel sheet 112 when the fixing resin composition is injected into the separation portion 140.

[0277] like Figure 1 As shown, a plurality of holes 150 are provided in the rotor core 110. The plurality of holes 150 are arranged in the rotor core 110 in a point-symmetrical manner with the axis of the rotating shaft 170 as the center.

[0278] like Figure 1 As shown, in the rotor 100 of the present embodiment, for example, a plurality of hole groups formed by two adjacent hole portions 150 are arranged along the peripheral portion of the rotating shaft 170. The plurality of hole groups are arranged, for example, in a manner separated from each other. The two hole portions 150 constituting one hole group are arranged, for example, in a V-shape when viewed from above. In this case, the two hole portions 150 constituting one hole group are arranged, for example, in a manner such that each end portion facing each other is located on the rotating shaft 170 side. Furthermore, the two hole portions 150 constituting one hole group are arranged, for example, in a manner separated from each other.

[0279] 3. Dismantling method

[0280] The disassembly method of this embodiment is performed by immersing the cured product of the easily disassemblyable rotor fixing resin composition in a solvent, thereby breaking crosslinks in the cured product and decomposing the cured product, making the cured product soluble, or partially soluble or gelling, thereby enabling disassembly.

[0281] The immersion temperature of the solidified product can be appropriately set according to the application, and is preferably -20 to 200°C, and more preferably 0 to 150°C, for example.

[0282] Furthermore, from the viewpoint of disassembly by a simple method, the immersion of the solidified material can also be performed under ambient temperature conditions, that is, at room temperature. Thus, no special operation such as cooling or heating treatment is required. For example, the liquid temperature of the solvent can be set to 5 to 30°C.

[0283] On the other hand, from the viewpoint of promoting disintegration, etc., when the solidified material is impregnated, a temperature increase or a heating treatment may be applied.

[0284] The method of impregnating the solidified product is not particularly limited as long as a part or the whole of the solidified product is in contact with the solvent. Furthermore, the impregnation time can be appropriately adjusted according to the size of the solidified product and the like.

[0285] Furthermore, the solvent may be allowed to flow into the container containing the solidified material, or the solidified material may be immersed in the solvent in the container and stirred.

[0286] The solvent may be any solvent as long as it can release the -Si-O- structure from the cured product, and is preferably a solvent containing fluoride ions. The solvent containing fluoride ions may be a solvent that generates fluoride ions.

[0287] The solvent of the present embodiment may be prepared, for example, as follows.

[0288] (i) A solvent obtained by reacting a fluorine compound such as tetra-n-butylammonium fluoride (n-Bu4NF) with an organic solvent such as tetrahydrofuran.

[0289] The fluorine compound may include, for example, ammonium, organic amine or organic ammonium fluoride salt, specifically, one or more selected from ammonium fluoride, hydrofluoric acid, acidic ammonium fluoride, methylamine hydrogen fluoride salt, ethylamine hydrogen fluoride salt, propylamine hydrogen fluoride salt, tetramethylammonium fluoride, tetraethylammonium fluoride, ethanolamine hydrogen fluoride salt, methylethanolamine hydrogen fluoride salt, dimethylethanolamine hydrogen fluoride salt, hydroxylamine hydrogen fluoride salt, dimethylhydroxylamine hydrogen fluoride salt, triethylenediamine hydrogen fluoride salt, etc. Among them, ammonium fluoride and tetra-n-butylammonium fluoride are preferred, and tetra-n-butylammonium fluoride is more preferred.

[0290] (ii) A solvent obtained by allowing an inorganic acid or an organic strong acid to act in an anhydrous organic solvent such as acetonitrile or a water-containing organic solvent.

[0291] (iii) A solvent obtained by allowing N-bromosuccinimide (NBS) to act in dimethyl sulfoxide (DMSO).

[0292] (iv) A solvent obtained by allowing an alkali metal hydrogen sulfate to act in a solvent such as water or alcohol.

[0293] As the hydrogen sulfate salt, alkali metal salts such as lithium hydrogen sulfate, potassium hydrogen sulfate, and sodium hydrogen sulfate can be used, and potassium salts and sodium salts are preferred.

[0294] (v) A solvent obtained by allowing an acetic acid aqueous solution to act on it.

[0295] (vi) A solvent obtained by reacting an excess of potassium fluoride dihydrate with an excess of tetrabutylammonium chloride in acetonitrile.

[0296] Among these solvents, the solvent (i) is preferably used from the viewpoint of decomposition rate and waste liquid treatment.

[0297] 4. Recycling methods

[0298] The recycling method of the present embodiment is a method for recycling materials constituting the rotor, comprising: immersing the structure in a solvent to disassemble the cured product of the easily disassembleable rotor-fixing resin composition; and recovering the material from the rotor.

[0299] This allows the material used for the rotor to be reused. The process of disassembling the solidified object is the same as that described in the above disassembly method.

[0300] In addition, the method of recovering materials from the rotor is not particularly limited as long as the quality of the material is not reduced. For example, there can be a method of precipitating the material in a solvent that disintegrates the solidified material and recovering only the material by filtration, etc.; after removing the structure from the solvent, the structure is destroyed together with the solidified material that has become brittle due to the disintegration to recover the material, etc.

[0301] The material is not particularly limited as long as it is a material that is insoluble in the above-mentioned solvent and does not undergo chemical reaction, and examples thereof include metals (electromagnetic steel plates) and permanent magnets.

[0302] As mentioned above, although embodiment of this invention was described, these are only illustrations of this invention, and various structures other than the above-mentioned can also be adopted.

[0303] Example

[0304] Next, the present invention will be described in detail by way of examples, but the contents of the present invention are not limited to the examples.

[0305] 1. Synthesis method

[0306] Each silyl ether type phenolic resin was synthesized according to the following steps.

[0307] [Synthesis Example 1] (Synthesis method of silyl ether type phenol monomer)

[0308] In a flask equipped with a thermometer, a stirrer, and a reflux cooling tube, 56.1 g of 2-allylphenol, 80 g of toluene, and 10 μL of Custer catalyst were placed and heated to 80°C. Then, 28.0 g of 1,1,3,3-tetramethyldisiloxane was added dropwise. After reacting at 80°C for 2 hours, toluene was distilled off from the reaction solution. By the above operation, 89.3 g of a silyl ether-type phenol monomer (1) represented by the following formula (S1) was obtained.

[0309]

[0310] [Synthesis Example 2] (Synthesis method of silyl ether type phenol novolac resin (1))

[0311] In a flask equipped with a thermometer, a stirring device, and a reflux cooling tube, 25.0 g of the obtained silyl ether type phenol monomer (1) and 0.11 g of oxalic acid were placed, and the temperature was gradually raised. Then, 4.5 g of a 37% formalin solution was added dropwise, and the reaction was carried out at an internal temperature of 100°C for 5 hours. Then, the temperature was raised to an internal temperature of 120°C, and dehydration was performed at normal pressure to remove water. Through the above operation, 27.4 g of a silyl ether type phenol novolac resin (1) represented by the following formula (S2) was obtained.

[0312] The silyl ether novolac resin (1) had Mn=780, Mw=2,800, and a hydroxyl equivalent of 237 g / eq.

[0313]

[0314] [Synthesis Example 3] (Synthesis method of silyl ether type phenol novolac resin (2))

[0315] In a flask equipped with a thermometer, a stirring device, and a reflux cooling tube, 25.0 g of silyl ether type phenol monomer (1), 5.8 g of phenol, and 0.22 g of oxalic acid were placed, and the temperature was gradually raised. Then, 9.0 g of a 37% formalin solution was added dropwise, and the reaction was carried out at an internal temperature of 100°C for 5 hours. Then, the temperature was raised to an internal temperature of 120°C, and dehydration was carried out at normal pressure to remove water. The dehydration reaction was then carried out under reduced pressure to obtain 29.5 g of a silyl ether type phenol novolac resin (2) represented by the following formula (S3).

[0316] The silyl ether novolac resin (2) had Mn=800, Mw=2,300, and a hydroxyl equivalent of 198 g / eq.

[0317]

[0318] (In formula (S3), x:y represents approximately 45:55.)

[0319] 2. Preparation of resin composition

[0320] <Comparative Examples 1 and 2 and Examples 1 to 4>

[0321] Using the raw material I shown below, each component was mixed at the solid content ratio shown in Table 1 to obtain a mixture. The mixture was mixed using a Henschel mixer at room temperature. Then, the obtained mixture was roll-kneaded at 90 to 120° C. to obtain a kneaded product. The obtained kneaded product was cooled and pulverized to obtain each resin composition of Comparative Examples 1 and 2 and Examples 1 to 4.

[0322] [Raw Materials I]

[0323] (Thermosetting resin)

[0324] Epoxy resin 1: o-cresol novolac type epoxy resin (manufactured by DIC Corporation, EPICRON N-670)

[0325] Epoxy resin 2: BPA bisphenol A type resin (manufactured by Mitsubishi Chemical Corporation, YL6810)

[0326] (Curing agent)

[0327] Curing agent 1: Novolac type phenol compound (manufactured by Sumitomo Bakelite Co., Ltd., PR-51470)

[0328] Curing agent 2: Silyl ether type phenolic novolac resin (1) obtained in Synthesis Example 2

[0329] Curing agent 3: Silyl ether type phenolic novolac resin (2) obtained in Synthesis Example 3

[0330] (Curing accelerator)

[0331] Curing accelerator 1: triphenylphosphine

[0332] (Inorganic filler)

[0333] Inorganic filler 1: fused spherical silica (manufactured by Denka Co., Ltd., FB-60)

[0334] (other)

[0335] Colorant 1: Carbon black (manufactured by Mitsubishi Chemical Corporation, Carbon Black #5)

[0336] Coupling agent 1: N-phenyl-3-aminopropyltrimethoxysilane (manufactured by Dow Corning Toray Co., Ltd., CF-4083)

[0337] Release agent 1: Carnauba wax

[0338] Additives: low stress agents, ion scavengers and flame retardants

[0339] <Example 5>

[0340] A silicone rubber-based curable composition was prepared using the raw material II shown below.

[0341] First, a mixture of silicone rubber 1 (80 parts by mass), silicone rubber 2 (20 parts by mass), coupling agent 2 (10 parts by mass), coupling agent 3 (0.5 parts by mass) and water (5.25 parts by mass) was pre-mixed, and then inorganic filler 2 (25 parts by mass) was added to the mixture and further mixed to obtain a mixed product (silicone rubber composite).

[0342] Here, the kneading after adding the inorganic filler 2 is carried out through a first step of kneading at 60 to 90° C. for 1 hour in a nitrogen atmosphere for the coupling reaction and a second step of kneading at 160 to 180° C. for 2 hours in a reduced pressure atmosphere for removing by-products (ammonia), followed by cooling and kneading for 20 minutes.

[0343] Next, silicone rubber 3 and curing accelerator 2 were added to the obtained kneaded product (silicone rubber compound) in the ratios (mass %) shown in Table 1, and kneaded with a roll to obtain a silicone rubber-based curable composition of Example 5.

[0344] [Raw Materials II]

[0345] (Silicone rubber, organopolysiloxane (C1))

[0346] Silicone rubber 1 (linear organopolysiloxane with low vinyl content (C1-2'): synthesized according to Synthesis Scheme 1. In the structure represented by formula (C1-2), only R1 (terminal) is a vinyl group)

[0347] Silicone rubber 2 (linear organopolysiloxane with a high vinyl content (C1-2"): synthesized according to Synthesis Scheme 2. In the structure represented by formula (C1-2), R1 and R2 are vinyl groups)

[0348] Silicone rubber 3 (organohydrogen polysiloxane (C2)), manufactured by Momentive Inc., "TC-25D"

[0349] (Inorganic filler)

[0350] Inorganic filler 2: Silica particles (particle size 7nm, specific surface area 300m 2 / g), manufactured by NIPPON AEROSILCO.,Ltd., "AEROSIL300"

[0351] (Catalyst, curing accelerator)

[0352] Curing accelerator 2: Platinum compound, manufactured by Momentive Inc.: "TC-25A"

[0353] (other)

[0354] Silane coupling agent 2: Hexamethyldisilazane (HMDZ), manufactured by Gelest, “HEXAMETHYLDISILAZANE (SIH6110.1)”

[0355] Silane coupling agent 3: divinyltetramethyldisilazane, manufactured by Gelest, "1,3-DIVINYLTETRAMETHYLDISILAZANE (SID4612.0)"

[0356] <Synthesis of vinyl-containing organopolysiloxane (C1)>

[0357] [Synthesis Scheme 1: Synthesis of Linear Organopolysiloxane (C1-2') with Low Vinyl Content]

[0358] According to the following formula (7), a linear organopolysiloxane (C1-2') having a low vinyl content was synthesized.

[0359] Specifically, 74.7 g (252 mmol) of octamethylcyclotetrasiloxane and 0.1 g of potassium silicate were added to a 300 mL separable flask equipped with a cooling tube and stirring blades and purged with Ar gas, and the mixture was heated and stirred at 120° C. for 30 minutes. At this time, an increase in viscosity was observed.

[0360] Then, the temperature was raised to 155° C. and stirring was continued for 3 hours. Then, 0.1 g (0.6 mmol) of 1,3-divinyltetramethyldisiloxane was added 3 hours later, and stirring was further continued at 155° C. for 4 hours.

[0361] Then, after 4 hours, it was diluted with 250 mL of toluene and washed with water 3 times. The washed organic layer was washed several times with 1.5 L of methanol for reprecipitation and purification to separate the oligomer from the polymer. The obtained polymer was dried under reduced pressure at 60°C overnight to obtain a linear organic polysiloxane (C1-2') with a low vinyl content (Mn = 2,2 × 105, Mw = 4,8 × 105). In addition, the vinyl content calculated by H-NMR spectroscopy was 0.04 mol%.

[0362]

[0363] [Synthesis Scheme 2: Synthesis of Linear Organopolysiloxane (C1-2") with High Vinyl Content]

[0364] In the synthesis process of the above-mentioned (C1-2'), in addition to 74.7 g (252 mmol) of octamethylcyclotetrasiloxane, 0.86 g (2.5 mmol) of 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane was used. In the same manner as the synthesis process of (C1-2'), a straight-chain organopolysiloxane (C1-2") with a high vinyl content was synthesized as shown in the following formula (8). (Mn = 2,3×105, Mw = 5,0×105). The vinyl content calculated by H-NMR spectroscopy was 0.93 mol%.

[0365]

[0366] 3. Confirmation of the structure of the cured product of the resin composition

[0367] In Comparative Examples 1 and 2 and Examples 1 to 4, the obtained resin compositions were molded under the conditions of a mold temperature of 175° C. and a curing time of 2 minutes to obtain a cured product. In Example 5, the obtained resin composition was pressurized at 160° C. and 10 MPa for 20 minutes to be molded into a sheet, and primary curing was performed at the same time, and then heated at 200° C. for 4 hours for secondary curing, thereby obtaining a sheet-like silicone rubber cured product.

[0368] The following resin composition analysis was performed on each cured product using pyrolysis GC-MS. GC-MS measurement used an FT-NMR device (manufactured by JEOL Ltd., JNM-ECA400).

[0369] First, the solidified material was heated at 600°C for 1 minute in a helium atmosphere, and all the generated components were introduced into the separation column of GC and trapped with liquid nitrogen. After the heating was completed, the trap was removed and GC-MS measurement was immediately started.

[0370] The -Si-O- structure was identified based on the respective mass spectra and retention times and judged according to the following criteria. The results are shown in Table 1.

[0371] (Benchmark)

[0372] OK: The -Si-O- structure can be identified

[0373] N / A: -Si-O- structure could not be identified

[0374] 4. Evaluation of disassembly

[0375] The disassembly properties were evaluated using the following solvents.

[0376] Solvent: Tetrabutylammonium fluoride (0.5 mol / L, THF solution)

[0377] First, in Comparative Examples 1 and 2 and Examples 1 to 4, each of the obtained resin compositions was molded under the conditions of a mold temperature of 175° C. and a curing time of 2 minutes to obtain a cured product (width 10 mm, thickness 4 mm, length 20 mm). In Example 5, the obtained resin composition was pressurized at 160° C. and 10 MPa for 20 minutes to be molded into a sheet, and a primary cure was performed at the same time, and then heated at 200° C. for 4 hours for secondary cure, thereby obtaining a sheet-like silicone rubber cured product (width 10 mm, thickness 4 mm, length 20 mm).

[0378] Next, the obtained solidified product was immersed in 25 ml of a solvent in a container and allowed to stand at 23° C. for 24 hours.

[0379] Then, use a vibrator (about 200 reciprocating times / minute) to vibrate the container together for 1 minute, and then filter all the solutions in the container with a 212μm mesh filter (JIS standard sieve 212μm diameter 100mm). Observe whether it can be filtered (whether the filter is blocked) and the residue on the filter, and evaluate according to the following criteria. The lower the degree of filter blockage and the less residue, the more soluble the solid is in the solvent and the better the disintegration. The results are shown in Table 1.

[0380] (Benchmark)

[0381] A: The filter is not clogged, and there is no solidified residue or only a small amount of solidified residue on the filter.

[0382] B: The filter is not clogged, but there is obvious solid residue on the filter

[0383] C: The filter is immediately clogged and filtering is impossible

[0384] 5. Recovering materials from the rotor

[0385] In Comparative Examples 1 and 2 and Examples 1 to 4, a metal sheet (width 19 mm, thickness 3.85 mm, length 29 mm) regarded as a magnet was inserted into a mold (hole width 24 mm, thickness 4 mm, depth 30 mm) regarded as an electromagnetic steel sheet, and the obtained object was installed in a molding machine, and the upper mold was pressed against the upper surface of the mold. When the mold reached 175°C, each of the resin compositions obtained above was injected for molding, and after the curing time was 120 seconds, the mold was removed from the molding machine.

[0386] In Example 5, a metal sheet (width 19 mm, thickness 3.85 mm, length 29 mm) regarded as a magnet is inserted into a mold (width 24 mm, thickness 4 mm, depth 30 mm of the hole portion) regarded as an electromagnetic steel plate. After the obtained object is installed in a molding machine, the above-obtained silicone rubber-based curable composition is compression molded when the mold reaches 175°C. After the curing time is 300 seconds, the mold is taken out of the molding machine, and then secondary curing is carried out at 200°C for 4 hours.

[0387] Next, the mold was immersed in a solvent, and then the recovery of the metal piece was evaluated. Specifically, tetrabutylammonium fluoride (0.5 mol / L, THF solution) was used as the solvent, and the immersion was performed by standing at 23° C. for 24 hours.

[0388] After the immersion treatment, the mold was taken out from the solvent, and it was confirmed whether the metal piece could be pulled out from the mold, and the evaluation was performed according to the following criteria.

[0389] (Benchmark)

[0390] OK: The metal sheet can be pulled out of the mold and can be recycled.

[0391] N / A: The metal piece cannot be pulled out of the mold and cannot be recovered.

[0392]

[0393] This application claims the benefit of priority based on Japanese patent application No. 2022-088809, filed on May 31, 2022, and all the disclosed contents are incorporated herein.

[0394] Description of Reference Numerals

[0395] 100-rotor, 110-rotor core, 112-electromagnetic steel plate, 112-each electromagnetic steel plate, 112-electromagnetic steel plate, 116-groove portion, 118a-end plate, 118b-end plate, 120-magnet, 130-fixing member, 140-separating portion, 150-hole portion, 160-riveted portion, 170-rotating shaft.

Claims

1. An easily disassembleable rotor fixing resin composition, characterized in that: For forming a fixed part in the rotor, The rotor has: a rotor core fixedly mounted on the rotating shaft and provided with a plurality of holes arranged along the peripheral edge of the rotating shaft; a magnet inserted into the hole; and The fixing member is provided at a separation portion between the hole and the magnet, The rotor fixing resin composition contains a thermosetting component. The cured product obtained by thermally curing the rotor-fixing resin composition has a structure represented by the following formula (1): In formula (1), R1 and R2 each independently represent any one of a hydrogen atom, a hydrocarbon group or an aromatic group having 1 to 30 carbon atoms, a hydroxyl group, and an alkoxy group having 1 to 30 carbon atoms.

2. The easily disassembleable rotor fixing resin composition according to claim 1, characterized in that: The thermosetting component has a -Si-O- structure.

3. The easily disassembled thermosetting resin composition according to claim 1 or 2, characterized in that: The thermosetting component comprises a thermosetting resin and a curing agent, and both the thermosetting component and the curing agent have a -Si-O- structure.

4. The easily disassembleable rotor fixing resin composition according to claim 1 or 2, characterized in that: The thermosetting component includes a thermosetting resin and a curing agent, and the curing agent has a -Si-O- structure.

5. The easily disassembleable rotor fixing resin composition according to claim 3, characterized in that: The curing agent includes a phenolic curing agent.

6. The easily disassembleable rotor fixing resin composition according to claim 1 or 2, characterized in that: The thermosetting component includes a thermosetting resin and a curing agent, wherein the thermosetting resin has a -Si-O- structure.

7. The easily disassembleable rotor fixing resin composition according to claim 5, characterized in that: The thermosetting resin comprises one or more selected from epoxy resin, phenoxy resin, polyimide resin, benzoxazine resin, unsaturated polyester resin, phenolic resin, melamine resin, silicone resin, cyanate resin, bismaleimide resin and acrylic resin.

8. The easily disassembleable rotor fixing resin composition according to claim 7, characterized in that: The thermosetting resin includes an epoxy resin.

9. The easily disassembleable rotor fixing resin composition according to claim 1 or 2, characterized in that: The composition further contains an inorganic filler, and the content of the inorganic filler is 10 to 98% by mass based on the total amount of the easily disassembleable rotor-fixing resin composition.

10. The easily disassembleable rotor fixing resin composition according to claim 1 or 2, characterized in that: Contains silyl ether modified novolac resin.

11. The easily disassembleable rotor fixing resin composition according to claim 1 or 2, characterized in that: Contains a phenolic resin having a weight average molecular weight (Mw) of 500 to 10,000.

12. The easily disassembleable rotor fixing resin composition according to claim 1 or 2, characterized in that: The easily disassembleable rotor fixing resin composition is in the form of powder, granules or ingots.

13. A rotor, characterized in that: A cured product of the easily disassembleable rotor fixing resin composition according to claim 1 or 2.

14. A method for disassembling a rotor, which is the method for disassembling a rotor according to claim 13, wherein the method for disassembling a rotor is characterized in that: The method includes immersing the rotor in a solvent to disassemble the cured product of the easily disassembleable rotor-fixing resin composition.

15. The method for disassembling a rotor according to claim 14, characterized in that: The solvent is a solvent containing fluoride ions.

16. The method for disassembling a rotor according to claim 14, characterized in that: The impregnation is carried out at -20 to 200°C.

17. The method for disassembling a rotor according to claim 14, characterized in that: The immersion is performed at 5-30°C.

18. A recycling method, which is a method for recycling the material constituting the rotor according to claim 12, the recycling method comprising: The step of immersing the rotor in a solvent to disassemble the cured product of the easily disassembleable rotor-fixing resin composition; and The step of recovering the material from the rotor.

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