Stretchable device
By connecting the first and second cover layers in the discontinuous region of the telescopic device, forming a laminated structure covering the inner side of the substrate, the moisture entry problem caused by the exposure of the adhesive layer in the prior art is solved, and the breathability and Connection reliability.
Patent Information
- Application Number
- CN202380045075.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-06-08
- Filing Date
- 2023-05-31
- Publication Date
- 2025-01-14
AI Technical Summary
When the adhesive layer is exposed through the opening, existing telescopic devices lead to increased breathability but moisture may enter the wiring, resulting in unstable connections and short circuits.
Using a telescopic substrate having a first main surface and a second main surface, a telescopic wiring provided on the first main surface is covered by the first and second cover layers, and is connected to each other in at least a discontinuous region to form a The laminated structure covers the inner side of the substrate to prevent moisture from entering.
Improves breathability and prevents moisture from entering the wiring, enhances connection reliability and avoids the occurrence of short circuits.
Smart Images

Figure CN119318210A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a stretchable device. Background Art
[0002] Conventionally, there is known a stretchable device in which a stretchable wiring is mounted on a stretchable substrate. The stretchable device can be worn on a human body for use.
[0003] A stretchable device includes a stretchable substrate, a stretchable wiring disposed on one main surface of the stretchable substrate, a stretchable cover covering one main surface of the stretchable substrate and the stretchable wiring, and an adhesive layer provided between the stretchable substrate and the stretchable cover. Patent document 1 discloses a form in which a portion of the stretchable substrate has an opening, and at least a portion of the adhesive layer is exposed through the opening.
[0004] Prior art literature
[0005] Patent Literature
[0006] Patent Document 1: Japanese Patent Application Publication No. 2019-75500 Summary of the invention
[0007] Problem that the invention aims to solve
[0008] However, when at least a portion of the adhesive layer is exposed through the opening of the stretchable substrate, the adhesive layer is present on one side of the opening of the substrate, but not on the other side. Therefore, a portion (specifically, the inner side surface) of the stretchable substrate forming the opening of the stretchable substrate is exposed. Therefore, although the air permeability can be improved by using the opening of the stretchable substrate, moisture may enter the wiring through the exposed portion of the stretchable substrate.
[0009] Therefore, an object of the present invention is to provide a stretchable device capable of improving air permeability and preventing moisture from entering wiring.
[0010] Solutions for solving problems
[0011] To achieve the above object, in one embodiment of the present invention, there is provided a stretchable device, comprising a stretchable substrate having a first main surface and a second main surface, a stretchable wiring provided on the first main surface, a first covering layer covering the first main surface and the stretchable wiring, and a second covering layer covering the second main surface.
[0012] A discontinuous region is provided at least on the stretchable substrate, and the first covering layer and the second covering layer are connected to each other in the discontinuous region.
[0013] Effects of the Invention
[0014] According to the stretchable device of one embodiment of the present invention, it is possible to improve air permeability and prevent moisture from entering the inside of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a plan view schematically showing the stretchable device according to the first embodiment of the present invention.
[0016] Figure 2 is a partial cross-sectional view schematically showing a stretchable device according to a first embodiment of the present invention (equivalent to Figure 1 Cross-sectional view between line segment II-II).
[0017] Figure 3 It is a partial cross-sectional view schematically showing a stretchable device according to a second embodiment of the present invention.
[0018] Figure 4 It is a partial cross-sectional view schematically showing Modification 1 of the stretchable device according to the second embodiment of the present invention.
[0019] Figure 5 It is a partial cross-sectional view schematically showing a second modification of the stretchable device according to the second embodiment of the present invention.
[0020] Figure 6 It is a partial cross-sectional view schematically showing a stretchable device according to a third embodiment of the present invention.
[0021] Figure 7 This is a partial cross-sectional view schematically showing another example of the stretchable device according to the third embodiment of the present invention.
[0022] Figure 8 It is a partial cross-sectional view schematically showing Modification 1 of the stretchable device according to the third embodiment of the present invention.
[0023] Fig. 9 yes Figure 8 A partial enlarged cross-sectional view of .
[0024] Fig.10 It is a partial cross-sectional view schematically showing a second modification of the stretchable device according to the third embodiment of the present invention.
[0025] Fig.11 yes Fig.10 A partial enlarged cross-sectional view of .
[0026] Fig.12 It is a plane schematically showing a stretchable device according to a fourth embodiment of the present invention.
[0027] Fig.13It is a schematic plan view of the method for producing a stretchable device according to the first embodiment of the present invention (substrate preparation step).
[0028] Fig.14 It is a schematic plan view of the method for manufacturing the stretchable device (wiring forming step) according to the first embodiment of the present invention.
[0029] Fig.15 It is a schematic plan view of the method for manufacturing a stretchable device according to the first embodiment of the present invention (through-hole forming step performed on a substrate).
[0030] Fig.16 It is a schematic plan view of the method for manufacturing the stretchable device according to the first embodiment of the present invention (the step of arranging the cover layer). DETAILED DESCRIPTION
[0031] The following is a detailed description of the embodiments of the present invention using the accompanying drawings. In each embodiment, the aspects that are different from the aspects described before the embodiment are mainly described. In particular, the same effects achieved by the same structure are not mentioned one by one for each embodiment. Among the constituent elements of the following embodiments, the constituent elements that are not described in the independent claims are described as arbitrary constituent elements. In addition, the sizes and size ratios of the constituent elements shown in the drawings are not necessarily strict. In addition, sometimes the same figure marks are marked on substantially the same structures in each figure, and repeated descriptions are omitted or simplified.
[0032] [First embodiment]
[0033] The following reference Figure 1 and Figure 2 The structure of the stretchable device 100 according to the first embodiment will be described.
[0034] Figure 1 It is a plan view schematically showing the stretchable device according to the first embodiment of the present invention. Figure 2 is a partial cross-sectional view schematically showing a stretchable device according to a first embodiment of the present invention (equivalent to Figure 1 In the cross-sectional views in this specification, the thickness direction of the stretchable substrate described later is indicated by a double arrow X.
[0035] The stretchable device 100 according to the first embodiment of the present invention includes a stretchable substrate 10, a stretchable wiring 20, a first cover layer 30, and a second cover layer 40. Specifically, the stretchable substrate 10 has a first main surface 11 and a second main surface 12. The stretchable wiring 20 is provided on the first main surface 11 of the stretchable substrate 10. The first cover layer 30 covers the first main surface 11 of the stretchable substrate 10 and the stretchable wiring 20. The second cover layer 40 covers the second main surface 12 of the stretchable substrate 10.
[0036] In addition, the term "above" in this specification includes a state of being located above a certain element separated from the certain element, that is, being located on the upper side of the certain element through other objects, a state of being located on the upper side of the certain element with a gap, and a state of being located directly above the certain element in contact with the certain element. Therefore, in this specification, "the stretchable wiring 20 provided on the first main surface 11 of the stretchable base 10" includes the stretchable wiring 20 in a state of being in contact with the first main surface 11 of the stretchable base 10 and the stretchable wiring 20 in a state of not being in direct contact with the first main surface 11 of the stretchable base 10 but being isolated from the first main surface 11 through other members (for example, a resin layer described later).
[0037] Hereinafter, main components of the stretchable device 100 according to the first embodiment will be described. After describing each component, the characteristic parts of the first embodiment will be described.
[0038] (Stretchable substrate 10)
[0039] The stretchable substrate 10 is a sheet-like or film-like stretchable substrate, for example, made of a stretchable resin material. Examples of the resin material of the stretchable substrate 10 include thermoplastic polyurethane (TPU), polyethylene (PE), polystyrene (PS), polyethylene terephthalate (PET), etc. The thickness of the stretchable substrate 10 is not particularly limited, but from the perspective of not hindering the stretching of the surface of the organism when attached to the organism, it is preferably 100 μm or less, and more preferably 50 μm or less. In addition, from the perspective of ensuring a predetermined strength, the thickness of the stretchable substrate 1 is preferably 20 μm or more.
[0040] (Flexible wiring 20)
[0041] The stretchable wiring 20 includes conductive particles and a resin. For example, the stretchable wiring 20 may be a mixture of metal powders such as Ag, Cu, and Ni as conductive particles and an elastic resin such as a silicone resin. The average particle size of the conductive particles is not particularly limited, but is preferably 0.01 μm or more and 10 μm or less. In addition, the shape of the conductive particles is preferably spherical.
[0042] The thickness of the stretchable wiring 20 is not particularly limited, but is preferably 100 μm or less, and more preferably 50 μm or less. In addition, the thickness of the stretchable wiring 20 is preferably 0.01 μm or more. The line width of the stretchable wiring 20 is not particularly limited, but is preferably 0.1 μm or more, and more preferably 10 mm or less. In addition, the shape and number of the stretchable wiring 2 are not particularly limited.
[0043] (First covering layer 30 / Second covering layer 40)
[0044] The first covering layer 30 and the second covering layer 40 can be formed of a resin material having elasticity. For example, the first covering layer 30 and the second covering layer 40 are formed of ionomer resin, polyester resin, styrene resin, olefin resin, epoxy resin, polyurethane resin, acrylic resin or silicone resin, preferably of polyurethane resin. As polyurethane resin, thermoplastic polyurethane (TPU) can be cited. As styrene resin, styrene-butadiene-styrene copolymer resin (SBS) can be cited. The first covering layer 30 and the second covering layer 40 can also be formed of different materials, but are preferably formed of the same material. By making the first covering layer 30 and the second covering layer 40 formed of the same material, there is no difference in expansion and contraction caused by tension, heat, etc. between the first covering layer 30 and the second covering layer 40, and the reliability reduction caused by the deviation of strain can be suppressed. In addition, since the bonding of the same type of materials, the fusion between the layers is better, and the stronger bonding force is improved.
[0045] In addition, the first covering layer 30 does not necessarily need to be in contact with the stretchable wiring 2 and the first main surface 11 of the stretchable base 10 . The second covering layer 40 does not necessarily need to be in contact with the second main surface 12 of the stretchable base 10 .
[0046] (Characteristics of the first embodiment)
[0047] The characteristic part of the first embodiment is described below based on the contents of the main components of the above-mentioned stretchable device 100. In the first embodiment, it is premised that a discontinuous region 60 is provided on the substrate 10. That is, the substrate 10 forms the discontinuous region 60. In this case, the first embodiment is characterized in that, in the discontinuous region 60, the first covering layer 30 and the second covering layer 40 are connected to each other.
[0048] According to this feature, the connecting portion 50 of the first covering layer 30 and the second covering layer 40 connected to each other covers the contour portion 61 of the discontinuous region 60. Specifically, the connecting portion 50 of the first covering layer 30 and the second covering layer 40 forming a stacked structure covers the inner side surface 14 of the substrate 10 where the discontinuous region 60 is formed.
[0049] In the first embodiment, the stretchable wiring 20 is continuous on the first main surface 11. The connection portion 50 of the first cover layer 30 and the second cover layer 40 is positioned between the first portion 21 of the stretchable wiring 20 and the second portion 22 spaced apart from the first portion 21 (see Figure 1 and Figure 2 ).
[0050] In this embodiment, if Figure 1 and Figure 2As shown, the single connection portion 50 composed of the first covering layer 30 and the second covering layer 40 is in a continuous and circumferential shape, but it is not limited thereto, and two or more of the connection portions 50 can be positioned adjacent to each other. That is, two or more of the discontinuous regions 60 provided in the substrate 10 can be positioned adjacent to each other.
[0051] In addition, from another point of view, Figure 1 and Figure 2 As shown, with the position of the contour portion 61 of the discontinuous region 60 as a reference, the connection portion 50 of the first covering layer 30 and the second covering layer 40 can be located at a position inside the contour portion 61. Specifically, with the position of the contour portion 61 as a reference, the end surface 51 of the connection portion 50 is located inside the contour portion 61. In other words, with the position of the connection portion 50 as a reference, the contour portion 61 of the discontinuous region 60 is located outside the end surface 51 of the connection portion 50.
[0052] From another point of view, when viewed from the thickness direction X of the stretchable substrate 10, the first cover layer 30 and the second cover layer 40 overlap in a portion of the above-mentioned discontinuous region 60. Specifically, when viewed from the thickness direction X of the stretchable substrate 10, the first cover layer 30 and the second cover layer 40 overlap along the contour portion 61 of the above-mentioned discontinuous region 60, specifically, along the contour forming surface of the contour portion 61.
[0053] According to the above, since the connection portion 50 exists in the discontinuous region 60, it is possible to suppress the exposure of the contour portion 61 of the discontinuous region 60 of the stretchable base 10, specifically, the inner side surface 14 of the base 10 forming the discontinuous region 60. Thus, it is possible to suppress the entry of moisture into the stretchable wiring 20 from the outside.
[0054] By suppressing the entry of moisture into the wiring, the occurrence of ion migration in the stretchable wiring 20 can be suppressed, and short circuits in the wiring can be suppressed. As a result, the connection reliability of the stretchable wiring 20 can be improved.
[0055] Furthermore, since the substrate 10 is not present in the discontinuous region 60, the air permeability of the discontinuous flow domain 60 can be improved compared to other continuous regions of the substrate 10. Thus, the air permeability of the stretchable device 100 can be improved as a whole.
[0056] As described above, according to the stretchable device 100 of the first embodiment, it is possible to achieve both improvement in air permeability and prevention of entry of moisture from the outside into the stretchable wiring 20 as a whole.
[0057] In the first embodiment, as described above, the first cover layer 30 and the second cover layer 40 overlap in a portion of the discontinuous region 60 when viewed in the thickness direction X of the stretchable substrate 10. That is, the connection portion 50 between the first cover layer 30 and the second cover layer 40 is located in a portion of the discontinuous region 60.
[0058] In this case, the connecting portion 50 does not exist in the remaining portion of the discontinuous region 60, but a through hole 55 penetrating the first cover layer 30 and the second cover layer 40 is positioned. Since the through hole 55 is a physical void, the air permeability of the stretchable device 100 can be further improved.
[0059] It is also preferred that Figure 2 As shown in the figure, in the thickness direction X of the stretchable base 10, the connection surface 52 (or contact surface) where the first cover layer 30 and the second cover layer 40 are connected to each other overlaps with the inner side of the discontinuous region 60, that is, is located in the discontinuous region 60. According to this structure, the inner side surface 14 of the stretchable base 10 forming the discontinuous region 60 can be used to suppress the connection surface 52 from moving from the discontinuous region 60 to other regions. As a result, the reliability of the connection can be improved.
[0060] More preferably, the connection surface 52 can be arranged between the two main surfaces of the stretchable substrate 10 when viewed in cross section. It is conceivable that the stretchable device 100 will stretch left and right when in use. At this time, if the connection surface 52 does not exist between the two main surfaces of the stretchable substrate 10 in the thickness direction X of the stretchable substrate 10, the connection surface will move left and right, and there is a possibility that the reliability of the connection surface 52 will decrease. In addition, when the connection surface 52 and the upper main surface of the stretchable substrate 10 are the same surface, the movement of the second covering layer 40 on the lower side can be suppressed, but it is difficult to suppress the movement of the first covering layer 30 on the upper side, and there is also a possibility that it is difficult to seek to improve the connection reliability. According to the above-mentioned more preferred structure, the inner side surface 14 of the stretchable substrate can be used to further suppress the connection surface 52 from moving from the discontinuous area 60 to other areas. As a result, the reliability of the connection can be further improved.
[0061] In addition, from the perspective of further improving the air permeability of the stretchable device 100, it is preferred that the above-mentioned first covering layer 30 and the second covering layer 40 each have a higher moisture permeability (equivalent to water vapor permeability) than the stretchable substrate 10 alone or the stretchable wiring substrate having the stretchable substrate 10 and the stretchable wiring 20.
[0062] Based on JIS Z0208 (Moisture permeability test method for moisture-proof packaging materials (Karp method)), the moisture permeability of each of the first cover layer 30 and the second cover layer 40 is greater than 100 g / (m 2 ·24h), can be 150g / (m2 24h) or more, 200g / (m 2 24h) or more, 250g / (m 2 24h) or more, 300g / (m 2 24h) or more, 350g / (m 2 24h) or more or 400g / (m 2 For example, the first cover layer 30 and the second cover layer 40 can each have a moisture permeability of 250 g / (m 2 ·24h).
[0063] Preferably, the elastic modulus of each of the first cover layer 30 and the second cover layer 40 is smaller than the elastic modulus of the stretchable base 1. Since the stretchable device 100 stretches and contracts when in use, if a cover layer with a high elastic modulus is used, discomfort may be caused to the human body during stretching and contraction. By making the elastic modulus of these cover layers smaller than the elastic modulus of the stretchable base 10, the discomfort felt by the user when using the stretchable device 100 can be reduced.
[0064] For example, from the viewpoint of preventing expansion and contraction hindrance during expansion and contraction, the elastic modulus of each of the first covering layer 30 and the second covering layer 40 is preferably 1.0×10^6Pa or more, and from the viewpoint of suppressing deformation, the elastic modulus of each of the first covering layer 30 and the second covering layer 40 is preferably 1.0×10^8Pa or less. The method for measuring the elastic modulus is not particularly limited, and for example, dynamic viscoelasticity measurement can be cited. In the case where each covering layer 30, 40 can be composed of a plurality of components, the elastic modulus can be calculated by measuring in the same manner and comparing the average values.
[0065] From the perspective of inhibiting water intrusion, i.e., waterproofing, the thickness of each of the first covering layer 30 and the second covering layer 40 is preferably 30 μm or more, and from the perspective of preventing expansion and contraction hindrance during expansion and contraction, the thickness of each of the first covering layer 30 and the second covering layer 40 is preferably 200 μm or less.
[0066] From the viewpoint of better prevention of peeling of the two cover layers 30 and 40, the thickness of the connecting portion 50 composed of the two cover layers 30 and 40 is preferably greater than the thickness of the stretchable base 10. Alternatively, from the viewpoint of improving the air permeability of the stretchable device 100, the thickness of the connecting portion 50 composed of the two cover layers 30 and 40 may be smaller than the thickness of the stretchable base 10.
[0067] Regarding the discontinuous region 60 of the substrate 10 (or the laminate of the substrate 10 and the resin layer after the second embodiment) that can provide the above-mentioned connecting portion 50, when viewed in the thickness direction X of the stretchable substrate 10, from the viewpoint of ensuring air permeability, the entire plane size of the discontinuous region 60 can be 10% or more of the plane size of the stretchable substrate 10, and from the viewpoint of ensuring the predetermined strength of the stretchable device, the entire plane size of the discontinuous region 60 can be 90% or less of the plane size of the stretchable substrate 10. In addition, the entire plane size of the discontinuous region 60 is preferably 20% or more and 80% or less of the plane size of the stretchable substrate 10, and more preferably 30% or more and 70% or less.
[0068] In addition, from the perspective of good coverage of the inner side surface 14 of the substrate 10, the ratio of the width dimension W of the connecting portion 50 in cross-sectional view to the thickness dimension of the inner side surface 14 of the substrate 10 can be 1:1. In addition, from the perspective of good coverage of the inner side surface 14 of the substrate 10, the width dimension W of the connecting portion 50 in cross-sectional view can be 0.1 mm or more, preferably 0.5 mm or more, and more preferably 1 mm or more.
[0069] In other embodiments described later, there is a case where an adhesive layer is arranged in the interface region between the first cover layer 30 and the target member (stretchable wiring 20, second cover layer 40, etc.) connected to the first cover layer 30. In addition, there is a case where an adhesive layer is arranged in the interface region between the second cover layer 40 and the target member (stretchable base 10, first cover layer 30, etc.) connected to the second cover layer 40.
[0070] However, the adhesive layer is not necessarily required, and in the present embodiment, the surface of each cover layer 30, 40 on the interface region side with the target member (flexible wiring 20, second cover layer 40, etc.) can be configured to have adhesiveness. Figure 2 As shown, a structure can be adopted in which the first covering layer 30 and the second covering layer 40 are in contact with each other in the discontinuous region 60 of the stretchable base 10 in the thickness direction X of the stretchable base 10 .
[0071] Below, refer to Figure 13 to Figure 16 A method for manufacturing the stretchable device 100 according to the first embodiment (corresponding to the basic embodiment) will be described.
[0072] First, prepare a substrate 10 (see Fig.13 After the substrate 10 is prepared, a continuous stretchable wiring 20 is formed on the first main surface 11 of the substrate 10 (see Fig.14After the stretchable wiring 20 is formed, a through hole 60X (also referred to as an opening) is formed in a predetermined portion of the substrate 20 between the first portion 21 of the stretchable wiring 20 in a continuous form and the second portion 22 isolated from and facing the first portion 21 (see Fig.15 ).
[0073] The through hole 60X can be formed by punching, laser processing, etc. From the perspective of processing implementation, the opening diameter of the through hole 60X can be 0.1 mm or more, and from the perspective of layout constraints of the obtained stretchable device 100 and avoiding an increase in device size, the opening diameter of the through hole 60X can be 10 mm or less. The planar shape of the through hole 60X can be, for example, a perfect circle, an ellipse, a polygon, etc.
[0074] After the through hole 60X is formed, the first covering layer 30 is arranged to cover the first main surface 11 of the substrate 10 with the through hole 60X and the stretchable wiring 20, and the second covering layer is arranged to cover the second main surface of the substrate 10 with the through hole 60X. Then, in the first embodiment, a through hole 55 is further formed in the connection portion between the first covering layer 30 and the second covering layer 40 arranged so as to block the through hole 60X of the substrate.
[0075] Based on the above, the stretchable device 100 of the first embodiment (corresponding to the basic embodiment) can be manufactured.
[0076] When manufacturing a stretchable device according to a third embodiment described later, the through hole 55 is not further formed in the connection portion between the first cover layer 30 and the second cover layer 40 as described above.
[0077] [Second embodiment]
[0078] Below, refer to Figure 3 The structure of a stretchable device 101 according to the second embodiment will be described. The second embodiment is different from the first embodiment in that the stretchable device 101 further includes a resin layer 70 .
[0079] Figure 3 It is a partial cross-sectional view schematically showing a stretchable device according to a second embodiment of the present invention.
[0080] like Figure 3 As shown, the resin layer 70 can be located between the first main surface 11 of the stretchable base 10 and the stretchable wiring 20. In this case, by locating the resin layer 70 between the first main surface 11 of the stretchable base 10 and the stretchable wiring 20, the surface of the stretchable wiring 2 that is closest to the stretchable base 1 can be in contact with the resin layer 70.
[0081] In addition, since the resin layer 70 can constitute the contour portion 61 of the discontinuous region 60 in addition to the stretchable base 10, the inner side surface 71 of the resin layer 70 is covered by the connection portion 50 of the first cover layer 30 and the second cover layer 40 forming the stacked structure. In addition, the resin layer 70 covers the first main surface 11 of the stretchable base 10 so as to be in continuous contact with the first main surface 11 of the stretchable base 10.
[0082] According to the above, compared with the first embodiment which does not include the resin layer 70 , it is possible to more effectively suppress the entry of moisture into the stretchable wiring 20 .
[0083] [Variation 1 of the Second Embodiment]
[0084] Below, refer to Figure 4 The structure of the modified example 1 of the stretchable device 102 of the second embodiment will be described. Figure 3 The illustrated embodiment is different in that the stretchable device 102 further includes an adhesive layer 80 .
[0085] Figure 4 It is a partial cross-sectional view schematically showing Modification 1 of the stretchable device according to the second embodiment of the present invention.
[0086] like Figure 4 As shown, in the thickness direction X of the stretchable base 10, the adhesive layer 80 can be arranged in the interface region between the first cover layer 30 and the target member (stretchable wiring 20, second cover layer 40, etc.) connected to the first cover layer 30. In addition, in the thickness direction X of the stretchable base 10, the adhesive layer 80 can be arranged in the interface region between the second cover layer 40 and the target member (stretchable base 10, first cover layer 30, etc.) connected to the second cover layer 40.
[0087] This arrangement can suppress the peeling of the first cover layer 30 and the second cover layer 40 and suppress the displacement of the cover layers 30 and 40. As a result, the air permeability of the stretchable device 102 described in the first embodiment can be improved and the entry of moisture into the wiring can be prevented more effectively.
[0088] The adhesive layer 80 can be composed of a pressure-sensitive adhesive or the like. As the pressure-sensitive adhesive, there is no particular limitation as long as it can be laminated on the stretchable substrate 10 and generally used. For example, as the pressure-sensitive adhesive, a rubber-based, acrylic-based, or silicone-based adhesive can be used. When a pressure-sensitive adhesive is used, since each cover layer 30, 40 and the object member can be bonded at a relatively low temperature, it is possible to prevent the stretchable substrate 10 from being deteriorated or deformed due to the use of excessive heat or UV energy.
[0089] [Variation 2 of the Second Embodiment]
[0090] Below, refer to Figure 5 The structure of Modification 2 of the stretchable device 103 of the second embodiment will be described. Modification 2 of the second embodiment is different from the first embodiment in that the stretchable device 103 further includes a resin layer 70a.
[0091] Figure 5 It is a partial cross-sectional view schematically showing a second modification of the stretchable device according to the second embodiment of the present invention.
[0092] like Figure 5 As shown, the resin layer 70a can be located at a position covering the first main surface 11 of the stretchable base 10 and the stretchable wiring 20 provided on the first main surface 11. In this case, the resin layer 70a can be arranged to cover the entire outer surface of the stretchable wiring 20.
[0093] In addition, the resin layer 70a can also constitute the contour portion 61 of the discontinuous region 60 in addition to the stretchable base 10, so the inner side surface 71a of the resin layer 70a is also covered by the connection portion 50 of the first cover layer 30 and the second cover layer 40 forming the stacked structure. In addition, the resin layer 70a is in contact with the first main surface 11 of the stretchable base 10 except for the arrangement portion of the wiring 20. According to the above, compared with the first embodiment without the resin layer 70a, the entry of moisture into the stretchable wiring 20 can be more effectively suppressed.
[0094] In the second embodiment, the resin layers 70 and 70 a can be formed by printing a resin material or a mixture of a resin material and an inorganic material.
[0095] As the resin material, for example, polyurethane, styrene, olefin, silicone, fluorine, nitrile rubber, latex rubber, vinyl chloride, ester, amide and other elastic resins, epoxy, phenolic, acrylic, polyester, imide, rosin, cellulose, polyethylene terephthalate, polyethylene naphthalate, polycarbonate resins can be listed. In addition, the resin layer 70 may not be a single material. In addition, the resin layer 70 may also be composed of a plurality of layers.
[0096] The thickness of the resin layer 70 is not particularly limited, but is preferably 100 μm or less, more preferably 50 μm or less, from the perspective of not hindering the expansion and contraction of the biological surface when attached to the biological body. In addition, from the perspective of ensuring a predetermined strength, the thickness of the resin layer 70 is preferably 10 μm or more.
[0097] That is, the total thickness of the substrate 10 and the resin layer 70 is preferably 200 μm or less, more preferably 100 μm or less. In order to ensure a predetermined strength, the total thickness of the substrate 10 and the resin layer 70 is preferably 30 μm or more.
[0098] [Third Embodiment]
[0099] Below, refer to Figure 6 and Figure 7 The structures of the stretchable devices 104 and 105 according to the third embodiment will be described.
[0100] Figure 6 It is a partial cross-sectional view schematically showing a stretchable device according to a third embodiment of the present invention. Figure 7 This is a partial cross-sectional view schematically showing another example of the stretchable device according to the third embodiment of the present invention.
[0101] The third embodiment is different from the second embodiment in that the connection portion 50 between the first covering layer 30 and the second covering layer 40 is located in the entire discontinuous region 60 when viewed in the thickness direction X of the stretchable base 10 .
[0102] According to the structure of the third embodiment, the entire discontinuous region 60 can be filled with the connection portion 50 of the first cover layer 30 and the second cover layer 40. As a result, compared with the first and second embodiments, there is no physically-defined void in the discontinuous region 60, so that the contour portion 61 of the discontinuous region 60 of the stretchable substrate 10, specifically, the inner side surface 14 of the substrate 10 forming the discontinuous region 60 and the inner side surfaces 71 and 71a of the resin layer 70 can be more effectively suppressed from being exposed. Therefore, it is possible to more effectively suppress the entry of moisture from the outside of the stretchable devices 104 and 105 into the wiring, and it is possible to more effectively suppress the occurrence of ion migration in the stretchable wiring 20.
[0103] In addition, as described above, the first cover layer 30 and the second cover layer 40 have a predetermined water vapor permeability. Therefore, even if the connection portion 50 of the first cover layer 30 and the second cover layer 40 fills the entire discontinuous region 60 (corresponding to the opening of the stretchable substrate 10), the air permeability can be improved compared to the case where there is no discontinuous region 60, that is, the case where there is no opening in the stretchable substrate 10. Compared with the case where the cover layer has an opening, the adhesion between the upper and lower cover layers is improved, so the reliability of the stretchable device is improved.
[0104] Preferably, as described above, in the thickness direction X of the stretchable substrate 10, the connecting surface 52 (or contact surface) where the first cover layer 30 and the second cover layer 40 contact each other overlaps with the inner side of the discontinuous region 60. Figure 6In this way, when the inner side surface 14 of the stretchable base 10 and the inner side surface 71 of the resin layer 70 are flush with each other, the connection surface 52 and the upper main surface of the stretchable base 10 can be arranged at the same position in the thickness direction X of the stretchable base 10. The inner side surface 71 of the resin layer 70 can suppress the connection surface 52 from moving greatly from the discontinuous region 60 to other regions. In addition, if the upper main surface of the resin layer 70 and the connection surface 52 are flush with each other, the effect of improving the connection reliability is weakened. Therefore, it is preferable that the connection surface 52 overlaps with the resin layer 70 in addition to the inner side of the discontinuous region 60 in the thickness direction X of the stretchable base 10.
[0105] [Variation 1 of the third embodiment]
[0106] Below, refer to Figure 8 and Fig. 9 The structure of Modification 1 of the stretchable device 106 according to the third embodiment will be described.
[0107] Figure 8 It is a partial cross-sectional view schematically showing Modification 1 of the stretchable device according to the third embodiment of the present invention. Fig. 9 yes Figure 8 A partial enlarged cross-sectional view of .
[0108] like Figure 8 and Fig. 9 As shown, a step structure is provided by the inner side surface 14 (equivalent to the end surface) of the stretchable base 10 and the inner side surface 71 (equivalent to the end surface) of the resin layer 70. Specifically, when viewed in cross section, the inner side surface of the stretchable base 10 can be located inward of the inner side surface of the resin layer 70 with reference to the position of the inner side surface of the resin layer 70. In other words, the region of the stretchable base 10 that does not overlap with the resin layer 70 when viewed in the thickness direction is in contact with the first cover layer 30 and / or the second cover layer 40 that are components of the connection portion 50.
[0109] In this case, as described above, the materials of the stretchable base 10, the resin layer 70 and the covering layers 30 and 40 are different from each other. Therefore, when the stretchable device 106 is used, the stretchability of the laminated portion of the stretchable base 10, the resin layer 70 and the covering layers 30 and 40, the laminated portion of the stretchable base 10 and the covering layers 30 and 40, and the portion where only the covering layers 30 and 40 exist will increase in sequence.
[0110] Thus, by intentionally arranging the laminated portion of the stretchable base 10 and the cover layers 30 and 40, it is possible to arrange a portion with an intermediate degree of stretchability. As a result, compared with a case where there is no laminated portion of the stretchable base 10 and the cover layer 30, that is, a case where the inner side surface 14 of the stretchable base 10 and the inner side surface 71 of the resin layer 70 are substantially flush with each other, it is possible to alleviate the concentration of stress that would otherwise occur when the stretchable device 106 is used. As described above, it is possible to improve the strength of the stretchable device 106.
[0111] [Variation 2 of the third embodiment]
[0112] Below, refer to Fig.10 and Fig.11 The structure of Modification 2 of the stretchable device 107 according to the third embodiment will be described.
[0113] Fig.10 It is a partial cross-sectional view schematically showing a second modification of the stretchable device according to the third embodiment of the present invention. Fig.11 yes Fig.10 A partial enlarged cross-sectional view of .
[0114] like Fig.10 and Fig.11 As shown, in the discontinuous region of the stretchable base 10 and the resin layer 70, the inner side surface of the stretchable base 10 can be located outside the inner side surface of the resin layer 70, based on the position of the inner side surface of the resin layer 70. In other words, the region of the resin layer 70 that does not overlap with the stretchable base 10 when viewed in the thickness direction is in contact with the first covering layer 30 and / or the second covering layer 40 that are components of the connecting portion 50.
[0115] In this case, as described above, the materials of the stretchable substrate 10, the resin layer 70, and the covering layers 30 and 40 are different from each other. Therefore, when the stretchable device 106 is used, the stretchability of the laminated portion of the stretchable substrate 10, the resin layer 70 and the covering layers 30 and 40, the laminated portion of the resin layer 70 and the covering layers 30 and 40, and the portion where only the covering layers 30 and 40 exist will increase in sequence.
[0116] Thus, by intentionally arranging the laminated portion of the resin layer 70 and the cover layers 30 and 40, it is possible to arrange a portion with an intermediate degree of expansion and contraction. As a result, compared with a case where there is no laminated portion of the resin layer 70 and the cover layers 30 and 40, that is, a case where the inner side surface 14 of the stretchable base 10 and the inner side surface of the resin layer 70 are substantially flush with each other, it is possible to alleviate the concentration of stress that would otherwise occur when the stretchable device 106 is used. As described above, it is possible to improve the strength of the stretchable device 107.
[0117] In addition, when the position of the inner side surface of the resin layer 70 is used as a reference and the inner side surface of the stretchable base 10 can be located outside the inner side surface of the resin layer 70, the resin layer 70 can be located above the stretchable base 10 and inside the inner side surface of the stretchable base 10. Therefore, in the stage of manufacturing the stretchable device, the portion corresponding to the inner side surface 71b of the resin layer 70 can be drooped downward.
[0118] Thus, the inner side surface 71b of the finally formed resin layer 70 can cover at least a portion of the inner side surface 14 of the stretchable base 10. As a result, it is possible to better suppress the entry of moisture from the outside of the stretchable device 107 into the stretchable wiring 20, and it is possible to better suppress the occurrence of ion migration in the stretchable wiring 20.
[0119] In addition, in the case of the above-mentioned structure, it is clear that the inner side surface 71b of the resin layer can be used to suppress the connection surface 52 from moving to other areas to a large extent from the non-continuous area 60. In addition, even if the inner side surface of the resin layer does not hang down, the inner side surface can provide the same effect of suppressing the movement of the connection surface 52.
[0120] [Fourth embodiment]
[0121] Below, refer to Fig.12 The structures of the stretchable devices 104 and 105 according to the fourth embodiment will be described.
[0122] Fig.12 It is a plane schematically showing a stretchable device according to a fourth embodiment of the present invention.
[0123] The fourth embodiment is different from the first embodiment in that a plurality of stretchable wirings are used. Specifically, in the fourth embodiment, the plurality of stretchable wirings 20A to 20D are isolated from each other and face each other, and a connection portion 50 between the first covering layer 30 and the second covering layer can be positioned in a predetermined region (corresponding to the first main surface 11 of the substrate 10 or a resin layer formed on the first main surface 11) between adjacent stretchable wirings.
[0124] Preferably, from the viewpoint of achieving both "improvement of air permeability" of the stretchable device 108 and "prevention of entry of moisture from the outside into each of the plurality of stretchable wirings 20A to 20D", the connection portions 50 between the stretchable wirings and the first covering layer 30 and the second covering layer can be alternately arranged.
[0125] In addition, each embodiment and modification example are illustrative, and the present invention is not limited to each embodiment and modification example. In addition, each drawing is an illustration of a constituent element, and does not limit the shape. In addition, partial replacement or combination of the structures shown in different embodiments and modification examples can be performed.
[0126] In addition, in each embodiment, it is preferable to provide a gap between the cover layer (first cover layer 30 / second cover layer 40) and the stretchable substrate 10 and / or the wiring 20. For example, it is preferable to provide a gap between the first cover layer 30 and the stretchable substrate 10, between the first cover layer 30 and the wiring 20, and between the second cover layer 40 and the stretchable substrate 10. The gap functions as a buffer when the stretchable device is stretched. By providing the gap, it is possible to achieve improved air permeability while ensuring reliability during stretching.
[0127] Furthermore, the aspects of the stretchable device of the present invention are as follows.
[0128] <1>
[0129] A stretchable device comprising a stretchable substrate having a first main surface and a second main surface, a stretchable wiring provided on the first main surface, a first covering layer covering the first main surface and the stretchable wiring, and a second covering layer covering the second main surface,
[0130] A discontinuous region is provided at least on the stretchable substrate, and the first covering layer and the second covering layer are connected to each other in the discontinuous region.
[0131] <2>
[0132] The stretchable device according to <1>, wherein a connection portion of the first cover layer and the second cover layer that are connected to each other covers an outline portion of the discontinuous region.
[0133] <3>
[0134] The stretchable device according to <1> or <2>, wherein in the discontinuous region, the first covering layer and the second covering layer form a stacked structure.
[0135] <4>
[0136] The stretchable device according to any one of <1> to <3>, wherein a connection portion of the first covering layer and the second covering layer connected to each other is located inside a contour portion of the discontinuous region.
[0137] <5>
[0138] The stretchable device according to any one of <1> to <4>, wherein the first covering layer and the second covering layer overlap in at least a portion of the discontinuous region when viewed in the thickness direction of the stretchable substrate.
[0139] <6>
[0140] The stretchable device according to any one of <1> to <5>, wherein the first covering layer and the second covering layer partially overlap along the contour of the discontinuous region.
[0141] <7>
[0142] The stretchable device according to any one of <1> to <5>, wherein a connection portion between the first covering layer and the second covering layer is located throughout the discontinuous region when viewed in the thickness direction of the stretchable substrate.
[0143] <8>
[0144] The stretchable device according to any one of <1> to <6>, wherein a through hole penetrating the first covering layer and the second covering layer is positioned in the discontinuous region.
[0145] <9>
[0146] A stretchable device according to any one of <1> to <8>, wherein the stretchable device further comprises a resin layer located between the first main surface of the stretchable substrate and the stretchable wiring or covering the first main surface and the stretchable wiring, and the discontinuous region is provided by means of the stretchable substrate and the resin layer.
[0147] <10>
[0148] The stretchable device according to any one of <1> to <9>, wherein a step structure is provided by an inner side surface of the stretchable base and an inner side surface of the resin layer.
[0149] <11>
[0150] The stretchable device according to <10>, wherein the inner side surface of the stretchable base is located inner than the inner side surface of the resin layer.
[0151] <12>
[0152] The stretchable device according to <10>, wherein the inner side surface of the stretchable base is located outside the inner side surface of the resin layer.
[0153] <13>
[0154] The stretchable device according to any one of <1> to <12>, wherein the first covering layer and the second covering layer are connected to each other via an adhesive layer in the discontinuous region in the thickness direction of the stretchable substrate.
[0155] <14>
[0156] The stretchable device according to any one of <1> to <12>, wherein the first covering layer and the second covering layer are in contact with each other in the discontinuous region in the thickness direction of the stretchable base.
[0157] <15>
[0158] The stretchable device according to any one of <1> to <14>, wherein there are a plurality of the stretchable wirings, the plurality of the stretchable wirings are isolated and opposed to each other, and a connection portion between the first covering layer and the second covering layer is positioned between one adjacent stretchable wiring and another adjacent stretchable wiring.
[0159] <16>
[0160] The stretchable device according to <15>, wherein the stretchable wiring and the connection portion between the first covering layer and the second covering layer are arranged alternately.
[0161] <17>
[0162] The stretchable device according to any one of <1> to <16>, wherein the entire planar size of the discontinuous region is 10% to 90% of the planar size of the stretchable substrate when viewed in the thickness direction of the stretchable substrate.
[0163] <18>
[0164] The stretchable device according to any one of <1> to <17>, wherein the elastic modulus of the first covering layer and the second covering layer is smaller than the elastic modulus of the stretchable base.
[0165] <19>
[0166] The stretchable device according to any one of <1> to <18>, wherein a connection surface between the first covering layer and the second covering layer overlaps with an inner side of the discontinuous region in a thickness direction of the stretchable substrate.
[0167] <20>
[0168] The stretchable device according to any one of <1> to <19>, wherein the connection surface is disposed between both main surfaces of the stretchable base in cross-sectional view.
[0169] Description of Reference Numerals
[0170] 100, 101-108, stretchable device; 10, stretchable substrate; 11, first main surface; 12, second main surface; 14, inner side surface; 20, stretchable wiring; 30, first covering layer; 40, second covering layer; 50, connecting portion between first covering layer and second covering layer; 51, end surface of connecting portion; 52, connecting surface (or contact surface); 55, through hole; 60, discontinuous region; 61, contour portion of discontinuous region; 70, 70a, resin layer; 71, 71a, inner side surface; 80, adhesive layer; W, width dimension of connecting portion 50; X, thickness direction of stretchable substrate.
Claims
1. A stretchable device, wherein: The stretchable device includes a stretchable substrate having a first main surface and a second main surface, a stretchable wiring provided on the first main surface, a first covering layer covering the first main surface and the stretchable wiring, and a second covering layer covering the second main surface. A discontinuous region is provided at least on the stretchable substrate, and the first covering layer and the second covering layer are connected to each other in the discontinuous region.
2. The stretchable device according to claim 1, wherein: A connecting portion of the first covering layer and the second covering layer connected to each other covers a contour portion of the discontinuous region.
3. The stretchable device according to claim 1 or 2, wherein: In the discontinuous region, the first covering layer and the second covering layer form a stacked structure.
4. The stretchable device according to any one of claims 1 to 3, wherein A connection portion of the first covering layer and the second covering layer connected to each other is located inside the contour portion of the discontinuous region.
5. The stretchable device according to any one of claims 1 to 4, wherein When viewed in the thickness direction of the stretchable substrate, the first covering layer and the second covering layer overlap in at least a portion of the discontinuous region.
6. The stretchable device according to claim 5, wherein: The first covering layer and the second covering layer partially overlap along the contour of the discontinuous region.
7. The stretchable device according to any one of claims 1 to 5, wherein: When viewed in the thickness direction of the stretchable substrate, a connection portion between the first covering layer and the second covering layer is located in the entire discontinuous region.
8. The stretchable device according to any one of claims 1 to 6, wherein A through hole penetrating the first covering layer and the second covering layer is positioned in the discontinuous region.
9. The stretchable device according to any one of claims 1 to 8, wherein The stretchable device further includes a resin layer located between the first main surface of the stretchable base and the stretchable wiring or covering the first main surface and the stretchable wiring, and the discontinuous region is provided by the stretchable base and the resin layer.
10. The stretchable device according to any one of claims 1 to 9, wherein The inner side surface of the stretchable substrate and the inner side surface of the resin layer provide a step structure.
11. The stretchable device according to claim 10, wherein: The inner side surface of the stretchable substrate is located inside of the inner side surface of the resin layer.
12. The stretchable device according to claim 10, wherein: The inner side surface of the stretchable substrate is located outside the inner side surface of the resin layer.
13. The stretchable device according to any one of claims 1 to 12, wherein: In the discontinuous region in the thickness direction of the stretchable substrate, the first covering layer and the second covering layer are connected to each other via an adhesive layer.
14. The stretchable device according to any one of claims 1 to 12, wherein: The first covering layer and the second covering layer are in contact with each other in the discontinuous region in the thickness direction of the stretchable substrate.
15. The stretchable device according to any one of claims 1 to 14, wherein There are a plurality of the stretchable wirings, and the plurality of stretchable wirings are spaced apart from each other and face each other, and a connection portion between the first covering layer and the second covering layer is positioned between one adjacent stretchable wiring and another adjacent stretchable wiring.
16. The stretchable device according to claim 15, wherein: The stretchable wiring is arranged alternately with connection portions between the first covering layer and the second covering layer.
17. The stretchable device according to any one of claims 1 to 16, wherein: When viewed in the thickness direction of the stretchable substrate, the entire planar size of the discontinuous region is 10% to 90% of the planar size of the stretchable substrate.
18. The stretchable device according to any one of claims 1 to 17, wherein The elastic modulus of the first cover layer and the second cover layer is smaller than the elastic modulus of the stretchable base.
19. The stretchable device according to any one of claims 1 to 18, wherein In the thickness direction of the stretchable substrate, a connection surface between the first covering layer and the second covering layer overlaps with an inner side of the discontinuous region.
20. The stretchable device according to any one of claims 1 to 19, wherein In cross-sectional view, the connecting surface is arranged between the two main surfaces of the stretchable base.
Citation Information
Patent Citations
Stretchable wiring board, manufacturing method of stretchable wiring board, and stretchable wiring board with electronic component
JP2019075500A