Electroplating system for copper plating

Abstract

The invention discloses an electroplating system for copper plating, and belongs to the technical field of electroplating, the electroplating system comprises an electroplating tank, supporting frames are fixedly connected to the two sides of the electroplating tank, hydraulic push rods are fixedly connected to the upper surfaces of the supporting frames, a mounting plate is fixedly connected to the output ends of the hydraulic push rods, and two vertical plates are fixedly connected to the lower surface of the mounting plate; electrode holders are fixedly connected to the two sides of the inner surface of the electroplating pool, an electrode is fixedly connected to one side of each electrode holder, a shaking assembly used for shaking is connected to the middle of the lower surface of the mounting plate, and electrode cleaning assemblies are connected to the two sides of the bottom in the electroplating pool. According to the electroplating device, a screen frame can drive parts to swing back and forth in electroplating liquid in an electroplating pool, so that the parts in the screen frame are continuously turned over in the screen frame, all the surfaces of the parts can make full contact with the electroplating liquid, the copper plating effect of the parts is guaranteed, part areas on the parts are prevented from being missed during electroplating, and the electroplating quality is improved. Therefore, the probability of defective rate is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating, and more particularly to an electroplating system for copper plating. Background Art

[0002] Electroplating is the process of using the principle of electrolysis to plate a thin layer of other metals on certain metal surfaces, such as copper, palladium, zinc, cadmium, gold, etc. It is a process that uses electrolysis to adhere a layer of metal film to the surface of metal or other material parts, thereby preventing metal oxidation such as rust, improving wear resistance, conductivity, reflectivity, corrosion resistance and enhancing aesthetics. The outer layer of many coins is also electroplated, and the electroplating operation is carried out through an electroplating device.

[0003] Existing copper plating devices usually clamp components before placing them into the electroplating solution for electroplating. During the electroplating process, the clamped parts will be missed, making it impossible to electroplate the clamped position of the workpiece, and thus it is difficult to electroplate the entire component uniformly, resulting in a decrease in the electroplating quality of the component. In addition, the electroplating effect of component parts far away from the electrode area is worse than that of the area close to the electrode, which will result in different electroplating positions and different electroplating effects, further reducing the electroplating quality of the component, causing copper plating failure, and increasing the probability of defective finished products. Summary of the invention

[0004] In view of the problems existing in the prior art, an object of the present invention is to provide a copper electroplating system.

[0005] To solve the above problems, the present invention adopts the following technical solutions.

[0006] A copper electroplating system comprises an electroplating pool, support frames are fixedly connected to both sides of the electroplating pool, a hydraulic push rod is fixedly connected to the upper surface of the support frame, a mounting plate is fixedly connected to the output end of the hydraulic push rod, two vertical plates are fixedly connected to the lower surface of the mounting plate, electrode seats are fixedly connected to both sides of the inner surface of the electroplating pool, an electrode is fixedly connected to one side of the electrode seat, a shaking component for shaking is connected to the middle of the lower surface of the mounting plate, and electrode cleaning components are connected to both sides of the bottom of the electroplating pool.

[0007] The shaking assembly includes a first driving motor fixed on the lower surface of the mounting plate and a sliding plate sliding inside the vertical plate, the output end of the first driving motor is fixedly connected to a rotating plate, the lower surface of the rotating plate is fixedly connected to a driving shaft, the lower surface of the sliding plate is fixedly connected to a screen frame, and the upper surface of the screen frame is fixedly connected to a rectangular frame.

[0008] Furthermore, a horizontal stirring assembly is fixedly connected to one side of the lower surface of the mesh frame, a discharge baffle is hinged to one side of the lower surface of the mesh frame, and the discharge baffle is fixed to the mesh frame by a lock, the bottom of the drive shaft extends to the interior of the rectangular frame and slides and fits with each other, and a vertical stirring assembly is fixedly connected to the front and rear sides of the inner surface of the electroplating pool.

[0009] Furthermore, the lateral stirring assembly includes a rack fixed on the lower surface of the mesh frame and a rotating shaft rotatably connected to the bottom of the electroplating tank. The upper surface of the first stirring blade is fixedly connected to a first annular rack near the top, and the outer surface of the rotating shaft is evenly fixedly connected to three first stirring blades near the bottom.

[0010] Furthermore, the rotating shaft is connected to the electroplating tank via a bearing, and the first annular rack is meshed with the rack.

[0011] Furthermore, the vertical stirring assembly includes two fixed plates fixed on the front and rear sides of the inner surface of the electroplating pool and a driving rod fixed in the middle of the outer surface of the rotating shaft, the interior of the fixed plate is slidably connected with a telescopic shaft, the bottom of the telescopic shaft is fixedly connected with a triangular block, the outer surface of the telescopic shaft is fixedly connected with two second stirring blades, the driving rod is located between the first annular rack and the first stirring blade, and the driving rod and the triangular block slide with each other.

[0012] Furthermore, the electrode cleaning assembly includes a support plate fixed on both sides of the bottom of the electroplating pool, the support plate is rotatably connected to a rotating sleeve inside, a second annular rack is fixedly connected to one side of the outer surface of the rotating sleeve, a second drive motor is fixedly connected to one side of the support plate, a gear is fixedly connected to the output end of the second drive motor, a spray assembly is fixedly connected to the outer surface of the rotating sleeve, and four cleaning brushes are evenly slidably connected to the inner surface of the rotating sleeve.

[0013] Furthermore, the output end of the second driving motor passes through the interior of the supporting plate, the gear and the second annular rack are meshed with each other, and the cleaning brush and the outer surface of the electrode are in contact with each other.

[0014] Furthermore, the spray assembly includes a liquid inlet pipe fixed on one side of the electroplating pool, one side of the liquid inlet pipe extends to the interior of the electroplating pool, one side of the liquid inlet pipe is fixedly connected to a first annular cavity, one side of the first annular cavity is slidably connected to a second annular cavity, and four groups of liquid outlets are evenly opened on the inner surface of the second annular cavity.

[0015] Furthermore, the second annular cavity is fixed on the outer surface of the rotating sleeve, the liquid outlet passes through the interior of the rotating sleeve, each group of the liquid outlets and the cleaning brushes are arranged alternately, the outer surface of the first annular cavity is provided with a drain port, and a rubber plug is provided inside the drain port, and a swing component is fixedly connected to one side of the first annular cavity.

[0016] Furthermore, the swing assembly includes a fixed cylinder fixed on one side of the first annular cavity, a wave groove is opened inside the fixed cylinder, two driving protrusions are slidably connected inside the wave groove, one side of the two driving protrusions is fixedly connected to a connecting plate, one side of the two connecting plates is fixedly connected to a circular ring, one side of the circular ring is evenly fixedly connected to a shielding plate, closed holes are opened inside the shielding plate, and the number of the closed holes corresponds one-to-one to the liquid outlet, and one side of the cleaning brush is fixedly connected to the circular ring.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. This solution sets a shaking component, and the mesh frame drives the parts to swing back and forth in the plating liquid inside the plating tank, so that the parts inside the mesh frame are constantly turned over inside the mesh frame, so that all surfaces of the parts can fully contact the plating liquid, thereby ensuring the copper plating effect of the parts, preventing some areas on the parts from being missed during electroplating, causing copper plating failure, and reducing the probability of defective rate.

[0019] 2. This solution sets a horizontal stirring component to drive the three first stirring blades to stir back and forth inside the electroplating tank, fully stir the electroplating solution, promote the flow of the electroplating solution, and make the metal ions in the electroplating solution more evenly distributed on the electrode surface, thereby increasing the electroplating rate.

[0020] 3. This solution sets up a vertical stirring component, and the second stirring blade stirs up and down inside the electroplating tank, so that the upper and lower layers of the electroplating solution are fully stirred and flowed. In conjunction with the first stirring blade, the electroplating solution is fully stirred horizontally and vertically, further increasing the flow rate of the electroplating solution.

[0021] 4. This scheme sets a swing component. While the rotating sleeve drives the cleaning brush to perform circular motion, the four cleaning brushes drive the circular ring to perform circular motion. The connecting plate drives the driving protrusion to move inside the wave groove. Due to the special shape of the wave groove, the driving protrusion moves back and forth in the horizontal direction during the circular motion, driving the circular ring to move back and forth synchronously, and at the same time drives the four cleaning brushes to move back and forth inside the rotating sleeve, so that the cleaning brushes swing left and right at the same time during the circular motion, making the cleaning direction more comprehensive. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of the present invention;

[0023] Figure 2 It is a schematic diagram of the structure of the shaking component of the present invention;

[0024] Figure 3 It is a schematic diagram of the structure of the horizontal stirring assembly of the present invention;

[0025] Figure 4 It is a schematic structural diagram of a vertical stirring assembly of the present invention;

[0026] Figure 5 It is a schematic diagram of the structure of the electrode cleaning assembly of the present invention;

[0027] Figure 6 It is a schematic diagram of the structure of the spray assembly of the present invention;

[0028] Figure 7 It is a schematic diagram of the cross-sectional structure of the rotary sleeve of the present invention;

[0029] Figure 8 It is a schematic diagram of the structure of the swing assembly of the present invention;

[0030] Fig. 9 It is a schematic diagram of the fixed tube structure of the present invention.

[0031] Description of the numbers in the figure:

[0032] 1. Electroplating tank; 2. Support frame; 3. Hydraulic push rod;

[0033] 4. shaking assembly; 41. first driving motor; 42. screen frame; 43. sliding plate;

[0034] 44, horizontal stirring assembly; 441, rack; 442, first stirring blade; 443, rotating shaft; 444, first annular rack;

[0035] 45. vertical stirring assembly; 451. driving rod; 452. fixing plate; 453. telescopic shaft; 454. second stirring blade; 455. triangular block;

[0036] 46. ​​rectangular frame; 47. driving shaft; 48. rotating plate;

[0037] 5. Mounting plate; 6. Vertical plate;

[0038] 7. Electrode cleaning assembly; 71. Cleaning brush; 72. Second drive motor; 73. Support plate; 74. Gear;

[0039] 75, spray assembly; 751, first annular cavity; 752, liquid inlet pipe; 753, second annular cavity; 754, liquid outlet;

[0040] 76. second annular rack; 77. rotating sleeve;

[0041] 78. Swing assembly;

[0042] 781, fixed cylinder; 782, driving protrusion; 783, circular ring; 784, connecting plate; 785, shielding plate; 786, closing hole; 787, wave groove;

[0043] 8. Electrode holder; 9. Electrode. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making creative work are within the scope of protection of the present invention.

[0045] See also Figures 1 to 9 A copper electroplating system includes an electroplating pool 1, support frames 2 are fixedly connected to both sides of the electroplating pool 1, a hydraulic push rod 3 is fixedly connected to the upper surface of the support frame 2, a mounting plate 5 is fixedly connected to the output end of the hydraulic push rod 3, two vertical plates 6 are fixedly connected to the lower surface of the mounting plate 5, electrode seats 8 are fixedly connected to both sides of the inner surface of the electroplating pool 1, an electrode 9 is fixedly connected to one side of the electrode seat 8, a shaking component 4 for shaking is connected in the middle of the lower surface of the mounting plate 5, and electrode cleaning components 7 are connected to both sides of the bottom of the electroplating pool 1.

[0046] like Figure 2 - Figure 3 As shown, the shaking assembly 4 includes a first driving motor 41 fixed on the lower surface of the mounting plate 5 and a sliding plate 43 sliding inside the vertical plate 6, the output end of the first driving motor 41 is fixedly connected to a rotating plate 48, the lower surface of the rotating plate 48 is fixedly connected to a driving shaft 47, the lower surface of the sliding plate 43 is fixedly connected to a screen frame 42, and the upper surface of the screen frame 42 is fixedly connected to a rectangular frame 46.

[0047] A horizontal stirring assembly 44 is fixedly connected to one side of the lower surface of the mesh frame 42, a discharge baffle is hingedly connected to one side of the lower surface of the mesh frame 42, and the discharge baffle is fixed to the mesh frame 42 by a lock, the bottom of the drive shaft 47 extends to the interior of the rectangular frame 46 and slides and fits with each other, and a vertical stirring assembly 45 is fixedly connected to the front and back sides of the inner surface of the electroplating pool 1.

[0048] Add plating liquid to the inside of the electroplating tank 1, place the parts that need to be copper-plated inside the mesh frame 42, and then start the electrode holder 8 and the hydraulic push rod 3. The hydraulic push rod 3 drives the mounting plate 5 to move up and down. The mounting plate 5 drives the mesh frame 42 to move into the inside of the electroplating tank 1 through the two vertical plates 6, so that the plating liquid completely immerses the parts inside the mesh frame 42. The parts are copper-plated inside the electroplating tank 1. At this time, turn on the first drive motor 41 to drive the rotating plate 48 and the drive shaft 47 to move in a circle. The drive shaft 47 drives the rectangular frame 46 to swing left and right as a whole. At the same time, the driving shaft 47 moves back and forth inside the rectangular frame 46, and the rectangular frame 46 drives the screen frame 42 to swing left and right inside the vertical plate 6 through the sliding plate 43, so that the screen frame 42 drives the parts to swing back and forth inside the plating liquid inside the electroplating tank 1, so that the parts inside the screen frame 42 are constantly turned over inside the screen frame 42, so that all surfaces of the parts can fully contact the plating liquid, thereby ensuring the copper plating effect of the parts, preventing partial areas on the parts from being missed during electroplating, causing copper plating failure, and reducing the probability of defective rate.

[0049] like Figure 3 As shown, the lateral stirring assembly 44 includes a rack 441 fixed on the lower surface of the mesh frame 42 and a rotating shaft 443 rotatably connected to the bottom of the electroplating tank 1, a first annular rack 444 is fixedly connected to the upper surface of the first stirring blade 442 near the top, and three first stirring blades 442 are evenly fixedly connected to the outer surface of the rotating shaft 443 near the bottom.

[0050] The rotating shaft 443 is connected to the electroplating cell 1 via a bearing, and the first annular rack 444 is meshed with the rack 441 .

[0051] During electroplating, the plating solution is static, and the metal ions in the plating solution cannot fully contact the surface of the electrode 9. When the screen frame 42 moves down, the screen frame 42 drives the rack 441 to approach, and the screen frame 42 engages with the first annular rack 444. When the screen frame 42 swings left and right inside the plating tank 1, the rack 441 moves left and right synchronously, driving the first annular rack 444 to rotate back and forth. The first annular rack 444 drives the rotating shaft 443 to rotate synchronously, thereby driving the three first stirring blades 442 to stir back and forth inside the plating tank 1, fully stirring the plating solution, promoting the flow of the plating solution, and making the metal ions in the plating solution more evenly distributed on the surface of the electrode 9, thereby increasing the electroplating rate.

[0052] like Figure 4As shown, the vertical stirring assembly 45 includes two fixed plates 452 fixed on the front and rear sides of the inner surface of the electroplating tank 1 and a driving rod 451 fixed at the middle of the outer surface of the rotating shaft 443, the fixed plate 452 is internally slidably connected with a telescopic shaft 453, the bottom of the telescopic shaft 453 is fixedly connected with a triangular block 455, the outer surface of the telescopic shaft 453 is fixedly connected with two second stirring blades 454, the driving rod 451 is located between the first annular rack 444 and the first stirring blade 442, and the driving rod 451 and the triangular block 455 slide with each other.

[0053] When the three first stirring blades 442 are stirring, the stirring direction of the first stirring blades 442 is limited, and they can only stir the area around the first stirring blades 442. However, the flow rate of the plating solution at a high place is limited. Therefore, when the rotating shaft 443 rotates back and forth, it drives the driving rod 451 to rotate back and forth. While the driving rod 451 is rotating, the driving rod 451 slides with the hypotenuse of the triangular block 455, pushing the triangular block 455 upward, and driving the two second stirring blades 454 to move upward through the telescopic shaft 453. When the driving rod 451 moves to the other side of the triangular block 455, the triangular block 455 descends, and the two second stirring blades 454 descend synchronously, so that the second stirring blades 454 stir up and down inside the electroplating tank 1, so that the upper and lower layers of the plating solution are fully stirred and flowed, and cooperate with the first stirring blades 442 to fully stir the plating solution horizontally and vertically, thereby further improving the flow rate of the plating solution.

[0054] like Figure 5 As shown, the electrode cleaning assembly 7 includes a support plate 73 fixed on both sides of the bottom of the electroplating tank 1, the support plate 73 is internally rotatably connected to a rotating sleeve 77, one side of the outer surface of the rotating sleeve 77 is fixedly connected to a second annular rack 76, one side of the support plate 73 is fixedly connected to a second drive motor 72, the output end of the second drive motor 72 is fixedly connected to a gear 74, the outer surface of the rotating sleeve 77 is fixedly connected to a spray assembly 75, and the inner surface of the rotating sleeve 77 is evenly slidably connected to four cleaning brushes 71.

[0055] The output end of the second driving motor 72 passes through the interior of the supporting plate 73 , the gear 74 and the second annular rack 76 are meshed with each other, and the cleaning brush 71 and the outer surface of the electrode 9 are in contact with each other.

[0056] After the electroplating is completed, the electroplating liquid, impurities and pollutants will remain on the surface of the electrode 9, which needs to be cleaned. The second drive motor 72 is turned on to drive the gear 74 to rotate. The gear 74 drives the rotating sleeve 77 to rotate inside the support plate 73 through the second annular rack 76. The support plate 73 drives the four cleaning brushes 71 to rotate and wipe the outer surface of the electrode 9. The electroplating liquid on the outer surface of the electrode 9 can be fully cleaned by rinsing with clean water to ensure that the adverse factors of the next electroplating are reduced when the subsequent electrode 9 is working.

[0057] like Figure 6 As shown, the spray assembly 75 includes a liquid inlet pipe 752 fixed on one side of the electroplating pool 1, one side of the liquid inlet pipe 752 extends to the interior of the electroplating pool 1, one side of the liquid inlet pipe 752 is fixedly connected to a first annular cavity 751, one side of the first annular cavity 751 is slidably connected to a second annular cavity 753, and four groups of liquid outlets 754 are evenly opened on the inner surface of the second annular cavity 753.

[0058] The second annular cavity 753 is fixed on the outer surface of the rotating sleeve 77, and the liquid outlet 754 runs through the interior of the rotating sleeve 77. Each group of liquid outlets 754 and the cleaning brush 71 are arranged alternately. A liquid discharge port is arranged on the outer surface of the first annular cavity 751, and a rubber plug is arranged inside the liquid discharge port. A swing assembly 78 is fixedly connected to one side of the first annular cavity 751.

[0059] However, some oxide layers and plating layers will be produced on the surface of the electrode 9, which cannot be processed by simply wiping with the cleaning brush 71. At this time, some special solvents need to be added during cleaning, and the solution is transported to the interior of the liquid inlet pipe 752 through an external water pump. The solution enters the interior of the first annular cavity 751 and continues to enter the interior of the second annular cavity 753, and is sprayed out through the liquid outlet 754 on the second annular cavity 753 to rinse the surface of the electrode 9. In conjunction with the rotating cleaning brush 71, the rate of processing the plating and oxide layers on the surface of the electrode 9 is accelerated. Although the plating liquid will enter the interior of the second annular cavity 753 and the first annular cavity 751 through the liquid outlet 754, it can be discharged from the drain port under the spray assembly 75.

[0060] like Figure 7 - Fig. 9 As shown, the swing assembly 78 includes a fixed cylinder 781 fixed on one side of the first annular cavity 751, a wave groove 787 is opened inside the fixed cylinder 781, and two driving protrusions 782 are slidably connected inside the wave groove 787, one side of the two driving protrusions 782 is fixedly connected with a connecting plate 784, one side of the two connecting plates 784 is fixedly connected with a ring 783, one side of the ring 783 is evenly fixedly connected with a shielding plate 785, and the shielding plate 785 is opened inside the inner part of the shielding plate 785. The number of the closed holes 786 corresponds one-to-one to the liquid outlet 754, and one side of the cleaning brush 71 is fixedly connected to the ring 783.

[0061] The cleaning brush 71 rotates in one direction to wipe the outer surface of the electrode 9, but the wiping effect is relatively limited, and stubborn stains cannot be removed well. Therefore, while the rotating sleeve 77 drives the cleaning brush 71 to perform a circular motion, the four cleaning brushes 71 drive the ring 783 to perform a circular motion, and drive the driving protrusion 782 to move inside the wave groove 787 through the connecting plate 784. Due to the special shape of the wave groove 787, the driving protrusion 782 moves back and forth in the horizontal direction during the circular motion, driving the ring 783 to move back and forth synchronously, and at the same time drives the four cleaning brushes 71 to move back and forth inside the rotating sleeve 77, so that the cleaning brush 71 swings left and right at the same time during the circular motion, making the cleaning direction more comprehensive. At the same time, the shielding plate 785 drives the closing hole 786 to move, and the closing hole 786 and the liquid outlet 754 are constantly overlapped and staggered, so that the liquid inside the second annular cavity 753 intermittently flows to the electrode 9, which not only continuously replenishes the cleaning liquid, but also saves the use of the cleaning liquid.

[0062] Method of use: First, place the parts to be electroplated inside the mesh frame 42, start the first drive motor 41 to drive the mesh frame 42 to swing back and forth through transmission, so that the parts are fully in contact with the electroplating solution, and at the same time, the various components of the horizontal stirring assembly 44 cooperate with each other, so that the three first stirring blades 442 stir the electroplating solution to accelerate the flow rate of the electroplating solution and fully contact with the electrode 9, and at the same time, the vertical stirring assembly 45 can stir up and down inside the electroplating tank 1 to further increase the flow rate of the electroplating solution;

[0063] Then, after the electroplating is completed, the impurities and electroplating liquid on the surface of the electrode 9 can be cleaned by the rotating cleaning brush 71 and clean water. The solution is sprayed on the surface of the electrode 9 by the spraying component 75, so that the oxide layer and the plating layer generated during the electroplating of the electrode 9 can be processed. Through the action of the swinging component 78, the cleaning brush 71 can move in a circle and swing left and right at the same time, which has a better cleaning effect on the electrode 9.

[0064] The above is only a preferred specific implementation of the present invention; however, the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and its improved conception within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A copper plating system, comprising an electroplating pool (1), wherein support frames (2) are fixedly connected on both sides of the electroplating pool (1), a hydraulic push rod (3) is fixedly connected to the upper surface of the support frame (2), an output end of the hydraulic push rod (3) is fixedly connected to a mounting plate (5), and two vertical plates (6) are fixedly connected to the lower surface of the mounting plate (5), electrode seats (8) are fixedly connected to both sides of the inner surface of the electroplating pool (1), and an electrode (9) is fixedly connected to one side of the electrode seat (8); Features: A shaking component (4) for shaking is connected to the middle of the lower surface of the mounting plate (5), and electrode cleaning components (7) are connected to both sides of the bottom of the electroplating tank (1); The shaking assembly (4) includes a first driving motor (41) fixed on the lower surface of the mounting plate (5) and a sliding plate (43) sliding inside the vertical plate (6), the output end of the first driving motor (41) is fixedly connected to a rotating plate (48), the lower surface of the rotating plate (48) is fixedly connected to a driving shaft (47), the lower surface of the sliding plate (43) is fixedly connected to a screen frame (42), and the upper surface of the screen frame (42) is fixedly connected to a rectangular frame (46).

2. A copper plating system according to claim 1, characterized in that: A horizontal stirring assembly (44) is fixedly connected to one side of the lower surface of the screen frame (42), a discharge baffle is hingedly connected to one side of the lower surface of the screen frame (42), and the discharge baffle is fixed to the screen frame (42) by a lock, the bottom of the drive shaft (47) extends to the inside of the rectangular frame (46) and is slidably fitted with each other, and a vertical stirring assembly (45) is fixedly connected to the front and rear sides of the inner surface of the electroplating pool (1).

3. A copper plating system according to claim 2, characterized in that: The lateral stirring assembly (44) comprises a rack (441) fixed to the lower surface of the mesh frame (42) and a rotating shaft (443) rotatably connected to the bottom of the electroplating tank (1); the outer circumferential surface of the rotating shaft (443) is fixedly mounted with uniformly distributed first stirring blades (442); the upper surface of the first stirring blade (442) is fixedly connected with a first annular rack (444) near the top; and the outer surface of the rotating shaft (443) is evenly fixedly connected with three first stirring blades (442) near the bottom.

4. A copper plating system according to claim 3, characterized in that: The rotating shaft (443) is connected to the electroplating tank (1) via a bearing, and the first annular rack (444) and the rack (441) are meshed with each other.

5. The copper electroplating system according to claim 2, characterized in that: The vertical stirring assembly (45) comprises two fixed plates (452) fixed to the front and rear sides of the inner surface of the electroplating tank (1) and a driving rod (451) fixed to the middle of the outer surface of the rotating shaft (443); the interior of the fixed plate (452) is slidably connected to a telescopic shaft (453); the bottom of the telescopic shaft (453) is fixedly connected to a triangular block (455); the outer surface of the telescopic shaft (453) is fixedly connected to two second stirring blades (454); the driving rod (451) is located between the first annular rack (444) and the first stirring blade (442); the driving rod (451) and the triangular block (455) slide relative to each other.

6. The copper electroplating system according to claim 1, characterized in that: The electrode cleaning assembly (7) comprises a support plate (73) fixed on both sides of the bottom of the electroplating tank (1); the support plate (73) is rotatably connected to a rotating sleeve (77) inside; one side of the outer surface of the rotating sleeve (77) is fixedly connected to a second annular rack (76); one side of the support plate (73) is fixedly connected to a second drive motor (72); the output end of the second drive motor (72) is fixedly connected to a gear (74); the outer surface of the rotating sleeve (77) is fixedly connected to a spray assembly (75); and the inner surface of the rotating sleeve (77) is evenly slidably connected to four cleaning brushes (71).

7. A copper electroplating system according to claim 6, characterized in that: The output end of the second driving motor (72) passes through the interior of the supporting plate (73), the gear (74) and the second annular rack (76) are meshed with each other, and the cleaning brush (71) and the outer surface of the electrode (9) are in contact with each other.

8. The copper electroplating system according to claim 7, characterized in that: The spray assembly (75) comprises a liquid inlet pipe (752) fixed on one side of the electroplating tank (1), one side of the liquid inlet pipe (752) extends to the interior of the electroplating tank (1), one side of the liquid inlet pipe (752) is fixedly connected to a first annular cavity (751), one side of the first annular cavity (751) is slidably connected to a second annular cavity (753), and four groups of liquid outlets (754) are evenly arranged on the inner surface of the second annular cavity (753).

9. A copper plating system according to claim 8, characterized in that: The second annular cavity (753) is fixed on the outer surface of the rotating sleeve (77), the liquid outlet (754) passes through the interior of the rotating sleeve (77), each group of the liquid outlet (754) and the cleaning brush (71) are arranged alternately, the outer surface of the first annular cavity (751) is provided with a liquid discharge port, and a rubber plug is provided inside the liquid discharge port, and one side of the first annular cavity (751) is fixedly connected to a swing assembly (78).

10. The copper electroplating system according to claim 9, characterized in that: The swing assembly (78) comprises a fixed cylinder (781) fixed to one side of the first annular cavity (751), a wave groove (787) is provided inside the fixed cylinder (781), two driving protrusions (782) are slidably connected inside the wave groove (787), one side of the two driving protrusions (782) is fixedly connected to a connecting plate (784), one side of the two connecting plates (784) is fixedly connected to a circular ring (783), one side of the circular ring (783) is evenly fixedly connected to a shielding plate (785), the shielding plate (785) is provided inside with a closed hole (786), the number of the closed holes (786) corresponds one to one with the liquid outlet (754), and one side of the cleaning brush (71) is fixedly connected to the circular ring (783).

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