Narrow space high-density temperature point cloud measurement method and system

By using two-time measurement method to eliminate cross-coupling of the flexible array temperature sensing circuit in a narrow space, the accuracy and real-time problems of signal detection are solved, and efficient detection of high-density temperature point cloud measurement is achieved.

CN119321824APending Publication Date: 2025-01-17SHANDONG UNIV
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Patent Information

Application Number
CN202411362787.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-27
Publication Date
2025-01-17

AI Technical Summary

Technical Problem

In a narrow space, it is difficult for the flexible array temperature sensing circuit to detect the output of a large number of sensing sensitive points at the same time, and signal detection faces cross-coupling problems, affecting the accuracy and real-timeness of the detection.

Method used

The driving voltage is output to the flexible array temperature sensing circuit by two-time measurement method through the column gate switch and the row gate switch respectively. The cross-coupling of the array resistor is eliminated through two scans, and the measured driving voltage and output voltage are combined to obtain the result. The resistance value to be measured for the target temperature sensor.

Benefits of technology

It improves the accuracy of the detection results, simplifies the calculation process, realizes fast scanning and high sampling rate, meets the accuracy, real-time and convenience requirements of the sensor signal detection method, and is suitable for the measurement of large-scale resistor networks.

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Abstract

The invention provides a narrow space high-density temperature point cloud measurement method and system, a flexible array temperature sensing circuit outputs a driving voltage to each column line in sequence through a column gating switch, the driving voltage is output by gating the column lines through a row gating switch, and the driving voltage comprises a first voltage state and a second voltage state; the driving voltage of the row where the target temperature sensor is located is in a first voltage state, and the voltage of the column where the target temperature sensor is located is in a second voltage state; the driving voltage of the row where the target temperature sensor is located is in the second voltage state, and the voltage of the column where the target temperature sensor is located is in the first voltage state; cross coupling of array resistors is eliminated through two times of scanning, and a to-be-measured resistance value of the target temperature sensor is obtained through joint solving according to driving voltage measured twice and output voltage of the target temperature sensor. According to the invention, the cross coupling problem of signal detection of the flexible array temperature sensing circuit can be effectively solved.
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Description

Technical Field

[0001] The present invention belongs to the technical field of sensors, and in particular relates to a method and system for measuring high-density temperature point clouds in a narrow space. Background Art

[0002] The statements in this section merely provide background information related to the present invention and do not necessarily constitute prior art.

[0003] Flexible array temperature sensing circuits have attracted much attention due to their high spatial resolution and wide range of applications. However, in practical applications, how to simultaneously detect the output of a large number of sensing points in a narrow space and ensure a high sampling frequency has become a technical challenge. In addition, signal detection of flexible array temperature sensing circuits also faces problems such as cross-coupling, and effective solutions need to be found. Summary of the invention

[0004] In order to solve the above problems, the present invention proposes a method and system for measuring high-density temperature point cloud in a narrow space. The present invention can effectively solve the cross-coupling problem of signal detection in a flexible array temperature sensor circuit, and can realize simultaneous detection of the outputs of multiple sensor sensitive points, thereby meeting the requirements of accuracy, real-time and convenience of signal detection.

[0005] According to some embodiments, the present invention adopts the following technical solutions:

[0006] A method for measuring high-density temperature point cloud in a narrow space, comprising the following steps:

[0007] The flexible array temperature sensing circuit sequentially outputs a driving voltage to each column line through a column selection switch, and selects the row line through a row selection switch to output a driving voltage, and the driving voltage includes two states of a first voltage and a second voltage;

[0008] Performing a first measurement, during which the driving voltage of the row where the target temperature sensor is located is in a first voltage state, and the voltage of the column where the target temperature sensor is located is in a second voltage state;

[0009] Performing a second measurement, during which the driving voltage of the row where the target temperature sensor is located is in the second voltage state, and the voltage of the column where the target temperature sensor is located is in the first voltage state;

[0010] The cross coupling of the array resistors is eliminated by scanning twice, and the resistance value to be measured of the target temperature sensor is obtained by jointly solving the driving voltages measured twice and the output voltage of the target temperature sensor.

[0011] As an alternative implementation, the target sensor is selected by using a column-select switch and a row-select switch.

[0012] As an optional implementation, during the first measurement, the row selection switch selects the row line of the row where the target sensor is located, and the driving voltage is the power supply voltage; the column selection switch selects the column line of the column where the target sensor is located, and the driving voltage is the ground voltage.

[0013] As an optional implementation, during the second measurement, the row selection switch selects the row line of the row where the target sensor is located, and the driving voltage is the ground voltage; the column selection switch selects the column line of the column where the target sensor is located, and the driving voltage is the power supply voltage.

[0014] As an optional implementation, during the two measurements, the measurement point of the target sensor output voltage is set at the front end of the row enable switch.

[0015] As an optional implementation, the process of jointly solving the resistance value of the target temperature sensor to be measured according to the twice measured driving voltage and the output voltage of the target temperature sensor includes: the output measurement voltage of the first measurement is Vout1, the output measurement voltage of the second measurement is Vout2, the reference resistance is R0, and the target resistance value is:

[0016] A narrow space high-density temperature point cloud measurement system, comprising:

[0017] A flexible array temperature sensing circuit, comprising a plurality of flexible temperature sensors arranged in an array;

[0018] A column gating switch for selecting a connected column line of the flexible array temperature sensing circuit to output a driving voltage;

[0019] A row selection switch, used for selecting a connected row line of the flexible array temperature sensing circuit to output a driving voltage;

[0020] A voltage selection switch, used to select the corresponding driving voltage to be a first voltage state or a second voltage state;

[0021] A voltage measurement module, used to obtain, when the first measurement is performed, the driving voltage of the row where the target temperature sensor is located is in the first voltage state, and the voltage of the column where the target temperature sensor is located is in the second voltage state; and when the second measurement is performed, the driving voltage of the row where the target temperature sensor is located is in the second voltage state, and the voltage of the column where the target temperature sensor is located is in the first voltage state;

[0022] The calculation module is used to eliminate the cross coupling of the array resistors through two scans, and jointly solve the resistance value to be measured of the target temperature sensor according to the driving voltages measured twice and the output voltage of the target temperature sensor.

[0023] As an optional implementation, the flexible array temperature sensing circuit is disposed on a flexible printed circuit board.

[0024] As an optional implementation, the spacing and number of sensors in the flexible array temperature sensing circuit are determined according to the dot matrix density.

[0025] As an optional implementation, the voltage measurement module is connected to the calculation module via an ADC conversion circuit, and the calculation module is a micro control unit.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] The present invention utilizes a two-measurement method to eliminate the cross-coupling of array resistors, and does not need to patrol once or multiple times for detection, or remove coupling factors during the calculation process as in the prior art, thereby improving the accuracy of the detection result and simplifying the calculation process.

[0028] The present invention can realize rapid scanning of each sensing point in the flexible array by designing an embedded program. With the help of a high sampling rate ADC, the entire detection process can be completed in a short time, ensuring that the output data of all sensitive points are accurately captured, ensuring a certain sampling frequency, and meeting the accuracy, real-time and convenience requirements of the sensor signal detection method.

[0029] The present invention is applicable to the problem of measuring the resistance of each node in a large-scale resistance network, including technical difficulties such as gating isolation control of power supply and detection circuit, complex decoupling operation of mutual coupling of node outputs, and decoupling of high-speed switching switch resistance.

[0030] The method of the present invention can simplify the scanning circuit, does not require a negative power supply, has low power consumption, can eliminate cross coupling, and improves measurement accuracy.

[0031] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0033] Figure 1 is a schematic diagram of a detection process of an embodiment;

[0034] Figure 2 The diagram is a schematic diagram of a two-measurement process of an embodiment. DETAILED DESCRIPTION

[0035] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0036] It should be noted that the following detailed descriptions are all illustrative and intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs.

[0037] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0038] In the absence of conflict, the embodiments in this application and the features in the embodiments may be combined with each other.

[0039] Embodiment 1

[0040] A method for measuring high-density temperature point clouds in narrow spaces is based on a flexible array temperature sensing circuit using a flexible printed circuit (FPC) board, such as Figure 1 As shown, the flexible array temperature sensing circuit includes a plurality of temperature sensors (or temperature sensitive units) distributed in a grid structure. The temperature sensors are arranged on or near the temperature sensitive points, and the dot density is determined by the array structure.

[0041] For example, a grid structure consisting of 100 identical PT100 temperature sensors can be used, arranged in ten rows and ten columns, and in some embodiments, there is about one sensor sensitive point per square centimeter. This regular layout enables an automated placement machine to accurately and efficiently place components.

[0042] A key advantage of using such an array is its flexibility to implement a variety of temperature measurement and control functions. For example, individual sensors can be connected in series or parallel to create a custom temperature range suitable for a specific application. In addition, the entire array can act as a distributed temperature sensing system, where each sensor contributes to the overall temperature monitoring capability.

[0043] Compared with traditional rigid PCB, flexible printed circuit (FPC) offers many advantages such as flexibility, light weight and compactness, making it an ideal choice for temperature measurement in narrow spaces.

[0044] According to the temperature resistance sensitive mechanism, the resistance value of the temperature sensor (or temperature sensitive unit) changes with the change of temperature to measure the resistance value of each sensitive point.

[0045] A method for measuring high-density temperature point clouds in a narrow space specifically comprises the following steps: single-point measurement of array resistors is achieved through column-select switches and row-select switches, and cross-coupling of array resistors is eliminated using a double-measurement method.

[0046] like Figure 2 As shown, each temperature sensor (or temperature sensitive unit) is equivalent to a variable resistor. The voltage input port is connected to the GPIO port of the MCU, and the voltage output port is connected to the ADC conversion channel of the MCU.

[0047] In this embodiment, the cross resistor R 22 Explain the measurement principle of the secondary measurement method to the measurement object, such as Figure 2 Assume that the output voltage of the first measurement is Vout1, the output voltage of the second measurement is Vout2, the power supply voltage is Vcc, the reference resistance is R0, and the equivalent resistance of the other parts (except the resistance to be measured) is R h2 .

[0048] First measurement:

[0049]

[0050] Second measurement:

[0051]

[0052] Solving the two equations together, we can get:

[0053]

[0054] It can be seen that the resistance value to be measured is related to the two measured voltage values, the power supply voltage and the reference resistance value R0, and has nothing to do with the equivalent resistance of other branches, thereby eliminating the cross-coupling effect between the array resistors.

[0055] In the two-scan method, the measurement point is placed at the front end of the row selection switch, so that the method is not limited by the number of rows of the flexible array temperature sensor. The resistance is calculated using the MCU, and the MCU is connected to the ADC conversion circuit, and the test point can be directly connected to the ADC conversion circuit.

[0056] Embodiment 2

[0057] A narrow space high-density temperature point cloud measurement system, comprising:

[0058] A flexible array temperature sensing circuit, comprising a plurality of flexible temperature sensors arranged in an array;

[0059] A column gating switch for selecting a connected column line of the flexible array temperature sensing circuit to output a driving voltage;

[0060] A row selection switch, used for selecting a connected row line of the flexible array temperature sensing circuit to output a driving voltage;

[0061] A voltage selection switch, used to select the corresponding driving voltage to be a first voltage state or a second voltage state;

[0062] A voltage measurement module, used to obtain, when the first measurement is performed, the driving voltage of the row where the target temperature sensor is located is in the first voltage state, and the voltage of the column where the target temperature sensor is located is in the second voltage state; and when the second measurement is performed, the driving voltage of the row where the target temperature sensor is located is in the second voltage state, and the voltage of the column where the target temperature sensor is located is in the first voltage state;

[0063] The calculation module is used to eliminate the cross coupling of the array resistors through two scans, and jointly solve the resistance value to be measured of the target temperature sensor according to the driving voltages measured twice and the output voltage of the target temperature sensor.

[0064] In this embodiment, the flexible array temperature sensor circuit is arranged on a flexible printed circuit board.

[0065] In this embodiment, the spacing and quantity of the sensors in the flexible array temperature sensing circuit are determined according to the dot matrix density.

[0066] In this embodiment, the voltage measurement module is connected to the calculation module via an ADC conversion circuit, and the calculation module is a micro control unit.

[0067] During the first measurement, the row selection switch selects the row line of the row where the target sensor is located, and the driving voltage is the power supply voltage Vcc; the column selection switch selects the column line of the column where the target sensor is located, and the driving voltage is the ground voltage GND.

[0068] As an optional implementation, during the second measurement, the row selection switch selects the row line of the row where the target sensor is located, and the driving voltage is the ground voltage GND; the column selection switch selects the column line of the column where the target sensor is located, and the driving voltage is the power supply voltage Vcc.

[0069] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made by those skilled in the art within the spirit and principle of the present invention without creative labor shall be included in the protection scope of the present invention.

Claims

1. A method for measuring high-density temperature point cloud in a narrow space, characterized in that: The following steps are involved: The flexible array temperature sensing circuit sequentially outputs a driving voltage to each column line through a column selection switch, and selects the row line through a row selection switch to output a driving voltage, and the driving voltage includes two states of a first voltage and a second voltage; Performing a first measurement, during which the driving voltage of the row where the target temperature sensor is located is in a first voltage state, and the voltage of the column where the target temperature sensor is located is in a second voltage state; Performing a second measurement, during which the driving voltage of the row where the target temperature sensor is located is in the second voltage state, and the voltage of the column where the target temperature sensor is located is in the first voltage state; The cross coupling of the array resistors is eliminated by scanning twice, and the resistance value to be measured of the target temperature sensor is obtained by jointly solving the driving voltages measured twice and the output voltage of the target temperature sensor.

2. A method for measuring high-density temperature point cloud in a narrow space as claimed in claim 1, characterized in that: The target sensor is selected by column-select switches and row-select switches.

3. A method for measuring high-density temperature point cloud in a narrow space as claimed in claim 1, characterized in that: During the first measurement, the row selection switch selects the row line of the row where the target sensor is located, and the driving voltage is the power supply voltage; the column selection switch selects the column line of the column where the target sensor is located, and the driving voltage is the ground voltage.

4. A method for measuring high-density temperature point cloud in a narrow space as claimed in claim 1, characterized in that: During the second measurement, the row selection switch selects the row line of the row where the target sensor is located, and the driving voltage is the ground voltage; the column selection switch selects the column line of the column where the target sensor is located, and the driving voltage is the power supply voltage.

5. The method for measuring high-density temperature point cloud in a narrow space as claimed in claim 1, characterized in that: During the two measurements, the measuring point of the target sensor output voltage is set at the front end of the row enable switch.

6. A method for measuring high-density temperature point cloud in a narrow space as claimed in claim 1, characterized in that: According to the two measured driving voltages and the output voltage of the target temperature sensor, the process of jointly solving the resistance value of the target temperature sensor includes: the output measurement voltage of the first measurement is Vout1, the output measurement voltage of the second measurement is Vout2, the reference resistance is R0, and the target resistance value is:

7. A high-density temperature point cloud measurement system in a narrow space, characterized in that: include: A flexible array temperature sensing circuit, comprising a plurality of flexible temperature sensors arranged in an array; A column gating switch for selecting a connected column line of the flexible array temperature sensing circuit to output a driving voltage; A row selection switch, used for selecting a connected row line of the flexible array temperature sensing circuit to output a driving voltage; A voltage selection switch, used to select the corresponding driving voltage to be a first voltage state or a second voltage state; A voltage measurement module, used to obtain, when the first measurement is performed, the driving voltage of the row where the target temperature sensor is located is in the first voltage state, and the voltage of the column where the target temperature sensor is located is in the second voltage state; and when the second measurement is performed, the driving voltage of the row where the target temperature sensor is located is in the second voltage state, and the voltage of the column where the target temperature sensor is located is in the first voltage state; The calculation module is used to eliminate the cross coupling of the array resistors through two scans, and jointly solve the resistance value to be measured of the target temperature sensor according to the driving voltages measured twice and the output voltage of the target temperature sensor.

8. A narrow space high-density temperature point cloud measurement system as claimed in claim 7, characterized in that: The flexible array temperature sensing circuit is arranged on a flexible circuit board.

9. A narrow space high-density temperature point cloud measurement system as claimed in claim 7, characterized in that: The spacing and quantity of the sensors in the flexible array temperature sensing circuit are determined according to the dot matrix density.

10. A narrow space high-density temperature point cloud measurement system as claimed in claim 7, characterized in that: The voltage measurement module is connected to the calculation module via an ADC conversion circuit, and the calculation module is a micro control unit.