Semiconductor equipment data monitoring method and device, equipment, storage medium and product

Abstract

The invention relates to the technical field of data monitoring, in particular to a semiconductor equipment data monitoring method and device, equipment, a storage medium and a product. A corresponding to-be-operated monitoring component is allocated to a data monitoring request, so that simultaneous execution of multi-thread tasks is achieved, the data monitoring efficiency is improved, and the data monitoring efficiency is improved by calling a target program interface. According to the method and the device, the to-be-operated monitoring component is driven to obtain the original monitoring data of the to-be-monitored semiconductor device, and finally the original monitoring data is converted into the target monitoring data, so that the monitoring data meeting the data transmission requirement can be obtained, and the data monitoring efficiency of the semiconductor device is improved; the technical problem of low data monitoring efficiency of the semiconductor device in the prior art is avoided.

Description

Technical Field

[0001] The present invention relates to the field of data monitoring technology, and in particular to a method, apparatus, device, storage medium and product for monitoring data of semiconductor devices. Background Art

[0002] Chip manufacturing is a high-tech industry, and various semiconductor devices are an important part of the chip. Monitoring the data of the equipment processing process is an indispensable system in chip manufacturing plants. Different semiconductor process equipment requires corresponding driver software and drivers to run the driver. Traditional driver software and drivers can only process data in a single thread. Faced with increasingly complex production line environments, the driver operation efficiency is low. In particular, for the business direction of real-time communication and data collection on the production line, a large number of data monitoring tasks need to be run simultaneously. However, the data monitoring technology of existing semiconductor equipment cannot meet user needs.

[0003] The above content is only used to assist in understanding the technical solution of the present invention and does not constitute an admission that the above content is prior art. Summary of the Invention

[0004] The main purpose of the present invention is to provide a semiconductor device data monitoring method, device, equipment, storage medium and product, aiming to solve the technical problem of low data monitoring efficiency of semiconductor devices in the prior art.

[0005] To achieve the above object, the present invention provides a method for monitoring semiconductor device data, the method comprising the following steps: Upon receiving a data monitoring request, determining a monitoring component to be executed based on the data monitoring request; Calling a target program interface to drive the monitoring component to be run to obtain original monitoring data of the semiconductor device to be monitored, wherein the data format of the original monitoring data complies with the data format requirements of the semiconductor communication standard protocol; Target monitoring data is generated according to the original monitoring data.

[0006] Optionally, determining a monitoring component to be run based on the data monitoring request includes: Send data monitoring request to the driver module; The driving module performs message encoding on the data monitoring request to obtain a target data monitoring request; Establishing a communication connection between the driver module and the semiconductor device based on a semiconductor communication standard protocol and the target data monitoring request; The corresponding monitoring component to be run is allocated through the communication connection.

[0007] Optionally, allocating a corresponding monitoring component to be run through the communication connection includes: determining the type of the local operating system through the communication connection; Based on the local operating system category, a to-be-running monitoring component corresponding to the data monitoring request is allocated through a message scheduler.

[0008] Optionally, generating target monitoring data according to the original monitoring data includes: Performing message decoding on the original monitoring data to obtain decoded monitoring data; Extracting key monitoring data from the decoded monitoring data; Target monitoring data is generated based on the key monitoring data.

[0009] Optionally, the performing message decoding on the original monitoring data includes: Reading the message flow and function information of the original monitoring data; Decode various types of data items in the message stream to obtain target data items in a unified format.

[0010] Optionally, the performing message decoding on the original monitored data further includes: extracting at least one message block and an application format identifier of each message block from a message stream; The target message block is reassembled based on the application format identifier.

[0011] In addition, to achieve the above-mentioned purpose, the present invention further provides a semiconductor device data monitoring device, the semiconductor device data monitoring device comprising: a determination module, configured to, upon receiving a data monitoring request, determine a monitoring component to be run based on the data monitoring request; A monitoring module, configured to call a target program interface to drive the monitoring component to be run to obtain original monitoring data of the semiconductor device to be monitored, wherein the data format of the original monitoring data complies with the data format requirements of the semiconductor communication standard protocol; A generating module is used to generate target monitoring data according to the original monitoring data.

[0012] In addition, to achieve the above-mentioned purpose, the present invention also proposes a semiconductor device data monitoring device, which includes: a memory, a processor, and a semiconductor device data monitoring program stored on the memory and runnable on the processor, and the semiconductor device data monitoring program is configured to implement the steps of the semiconductor device data monitoring method described above.

[0013] In addition, to achieve the above objectives, the present invention also proposes a storage medium, which stores a semiconductor device data monitoring program. When the semiconductor device data monitoring program is executed by a processor, the steps of the semiconductor device data monitoring method described above are implemented.

[0014] In addition, to achieve the above-mentioned purpose, the present application also provides a computer program product, which includes a computer program. When the computer program is executed by a processor, it implements the steps of the semiconductor device data monitoring method as described above.

[0015] One or more technical solutions proposed in the present invention have at least the following technical effects: The present invention discloses a data monitoring method for semiconductor devices, and the data monitoring method for semiconductor devices includes: when receiving a data monitoring request, determining a monitoring component to be run based on the data monitoring request; calling a target program interface to drive the monitoring component to be run to obtain original monitoring data of the semiconductor device to be monitored; generating target monitoring data based on the original monitoring data. Compared with the prior art, the present invention assigns a corresponding monitoring component to be run to the data monitoring request to achieve simultaneous execution of multi-threaded tasks, thereby improving data monitoring efficiency, and drives the monitoring component to be run by calling the target program interface to obtain the original monitoring data of the semiconductor device to be monitored. Finally, by converting the original monitoring data into target monitoring data, monitoring data that meets the data transmission requirements can be obtained, thereby improving the data monitoring efficiency of the semiconductor device and avoiding the technical problem of low data monitoring efficiency of the semiconductor device in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 This is a flow chart of a first embodiment of a method for monitoring semiconductor device data according to the present invention; Figure 2 A schematic diagram of a data monitoring architecture of an embodiment of a semiconductor device data monitoring method of the present invention; Figure 3 This is a flow chart of a second embodiment of a method for monitoring semiconductor device data according to the present invention; Figure 41. A schematic flow chart of a third embodiment of a method for monitoring semiconductor device data according to the present invention; Figure 5 This is a structural block diagram of a first embodiment of a semiconductor device data monitoring device according to the present invention; Figure 6 It is a structural diagram of a semiconductor device data monitoring device in a hardware operating environment involved in an embodiment of the present invention.

[0019] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0020] It should be understood that the specific embodiments described herein are merely used to explain the technical solutions of the present application and are not intended to limit the present application.

[0021] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0022] Based on this, an embodiment of the present invention provides a semiconductor device data monitoring method, referring to Figure 1 , Figure 1 FIG. 1 is a flow chart of a first embodiment of a method for monitoring semiconductor device data according to the present invention.

[0023] In this embodiment, the semiconductor device data monitoring method includes: Step S10: upon receiving a data monitoring request, determining a monitoring component to be run based on the data monitoring request.

[0024] It should be noted that the execution subject of this embodiment can be a computing service device with data processing, network communication and program running functions, such as a tablet computer, a personal computer, a mobile phone, etc., or an electronic device that can realize the above functions, a control computer on a semiconductor process production line, etc. The following takes the control computer on a semiconductor process production line as an example to illustrate this embodiment and the following embodiments.

[0025] It should be understood that data monitoring requests are used to drive communication between software and semiconductor equipment to collect data from semiconductor process production line equipment. Due to different versions of driver software and different operating systems, data monitoring requests may also have different forms. For example, in the Linux operating system, the data monitoring request is a fixed string of codes, while in the Microsoft operating system, the data monitoring request may be a trigger operation, etc. This embodiment does not impose specific restrictions on this.

[0026] In the specific implementation, refer to Figure 2 , Figure 2This is a schematic diagram of the data monitoring architecture of this embodiment. In the data monitoring architecture given in this embodiment, a monitoring driver layer is set up, and when a data monitoring request is received, a monitoring component to be run is assigned to each data monitoring request, so that when faced with a large number of data monitoring tasks, data monitoring tasks of multiple threads can be executed simultaneously.

[0027] In the data monitoring architecture of this embodiment, a driver layer is set between the business layer of the software and the semiconductor process equipment, wherein the driver layer includes at least a connection module, an encoding module, a decoding module, a message receiving module, a message scheduler and multiple monitoring component modules, wherein the link module is used to create and manage the connection channel of the semiconductor equipment, the receiving module is used to receive data monitoring requests or data processing messages from the business layer, the encoding module is used to encode the data monitoring requests or data processing messages received by the receiving module, and the decoding module is used to decode the data or messages of the semiconductor equipment; the message scheduler is used to assign corresponding monitoring components to each business requirement according to the decoded business requirements, so as to realize multi-threaded data monitoring and high-throughput message processing while maintaining low latency.

[0028] Step S20: calling the target program interface to drive the monitoring component to be run to obtain the original monitoring data of the semiconductor device to be monitored, where the data format of the original monitoring data complies with the data format requirements of the semiconductor communication standard protocol.

[0029] The target program interface can be used to call each monitoring component, so that after determining the monitoring component to be run corresponding to the business layer, the monitoring component to be run can be called to establish a communication connection with the semiconductor device to be monitored, and obtain the original monitoring data of the semiconductor device to be monitored, where the original monitoring data includes at least: equipment status, process parameters, production data, equipment failure information, equipment maintenance records, raw material status, environmental monitoring data, process procedures, wafer detection data, and equipment utilization, etc.

[0030] Among them, the equipment status is used to monitor the operating status of the equipment, such as power on, power off, standby, alarm and other states; process parameters are used to record key process parameters in the semiconductor manufacturing process, such as temperature, pressure, humidity, voltage, current, etc.; production data is used to include information such as the processing quantity, qualified rate, output, batch number, production date, etc. of wafers; equipment failure information is used to record the type of equipment failure, occurrence time, failure description, failure handling measures, etc.; equipment maintenance records are used to include maintenance activity records such as regular maintenance, cleaning, calibration, and replacement of parts of equipment; raw material status is used to monitor the status of raw materials used in semiconductor production, such as inventory, usage, raw material quality, etc.; environmental monitoring data is used to record factors in the production environment that may affect production, such as the cleanliness level, temperature and humidity of the clean room; process procedures are used to monitor the process procedures being executed by the equipment, as well as the execution progress of the procedures; wafer inspection data is used to include data such as wafer defect detection, key dimension measurement, and film thickness measurement; equipment utilization is used to record the ratio of the actual operating time of the equipment to the total time, reflecting the equipment utilization efficiency.

[0031] Step S30: generating target monitoring data according to the original monitoring data.

[0032] In the specific implementation, since the monitoring component obtains data from semiconductor devices that comply with the semiconductor communication standard protocol, its original monitoring data cannot be directly identified and understood. Therefore, in this embodiment, the original monitoring data also needs to be decoded so that it can adapt to control devices with different operating systems and realize cross-dimensional data communication.

[0033] This embodiment allocates corresponding monitoring components to be run to data monitoring requests to achieve simultaneous execution of multi-threaded tasks, thereby improving data monitoring efficiency. The monitoring components to be run are driven by calling a target program interface to obtain original monitoring data of the semiconductor device to be monitored. Finally, the original monitoring data is converted into target monitoring data to obtain monitoring data that meets data transmission requirements, thereby improving the data monitoring efficiency of the semiconductor device and avoiding the technical problem of low data monitoring efficiency of the semiconductor device in the prior art.

[0034] Based on the first embodiment of the present application, in the second embodiment of the present application, the same or similar contents as those in the above embodiment 1 can be referred to the above introduction and will not be described in detail later. Figure 3 , step S10, comprising: Step S101: Sending a data monitoring request to a driver module.

[0035] Step S102: the driving module performs message encoding on the data monitoring request to obtain a target data monitoring request.

[0036] Step S103: establishing a communication connection between the driving module and the semiconductor device based on a semiconductor communication standard protocol and the target data monitoring request.

[0037] Step S104: allocating corresponding monitoring components to be run through the communication connection.

[0038] It should be noted that the data monitoring request is a data monitoring task issued by the business layer, which is used to establish a communication connection between the driver layer and the semiconductor device layer, thereby driving the monitoring component to monitor data on the semiconductor device.

[0039] In specific implementations, message encoding can define the message layout according to the SECS-II standard, then encode each data item into the specified format and assemble them into a complete message. The message may need to be split into multiple blocks for transmission, and each block needs to comply with the requirements of the SECS-I protocol. The encoding and transmission of the message need to take into account the transaction protocol to ensure that the exchange and block division of the message comply with the standard.

[0040] Furthermore, the allocating the corresponding monitoring component to be run through the communication connection includes: determining the type of the local operating system through the communication connection; Based on the local operating system category, a to-be-running monitoring component corresponding to the data monitoring request is allocated through a message scheduler.

[0041] It is understandable that since the operating systems of the control computers that control semiconductor process production line equipment may be different, when allocating specific monitoring components to be run through the message scheduler, the monitoring components to be run that can be directly run can be allocated according to the local operating system category to improve data monitoring efficiency.

[0042] This embodiment sends a data monitoring request to a driver module; the driver module performs message encoding on the data monitoring request to obtain a target data monitoring request; establishes a communication connection between the driver module and the semiconductor device based on a semiconductor communication standard protocol and the target data monitoring request; allocates corresponding monitoring components to be run through the communication connection, is compatible with data monitoring tasks of different operating systems, and allocates corresponding monitoring components to each data monitoring task to improve monitoring efficiency.

[0043] Based on the second embodiment of the present application, in the third embodiment of the present application, the same or similar contents as those in the above-mentioned embodiment 1 can be referred to the above introduction and will not be described in detail later. Figure 4 Step S30 includes: Step S301: performing message decoding on the original monitoring data to obtain decoded monitoring data.

[0044] Step S302: extracting key monitoring data from the decoded monitoring data.

[0045] Step S303: generating target monitoring data based on the key monitoring data.

[0046] It should be noted that since the original monitoring data is obtained through monitoring under the semiconductor communication standard protocol, it cannot be directly identified and understood. The original monitoring data is generally coded data or files formed by binary data. In order to better manage the equipment on the semiconductor process production line in the future, the monitored original monitoring data needs to be decoded for subsequent storage and reading, which can also improve communication efficiency.

[0047] Key monitoring data at least includes data structure, data items, variable items, object dictionary and information details.

[0048] Furthermore, the message decoding of the original monitoring data includes: Reading the message flow and function information of the original monitoring data; Decode various types of data items in the message stream to obtain target data items in a unified format.

[0049] As you can understand, a message stream consists of data items and lists. Each data item contains a header and a body. The item header contains a format code and length information. The format code identifies the type of the data item (such as ASCII, binary, integer, etc.), and the length information indicates the length of the data item body. The header length can be 2 to 4 bytes, depending on the length of the data item body. The data item body contains the actual data value, and its length is specified by the length information in the header. The list is an ordered set of data items or lists. The length of the list header indicates the number of elements contained in the list.

[0050] The information recorded in the data items is different. To facilitate the subsequent management of production line equipment, this embodiment improves the efficiency of subsequent processing by converting various types of data items into target data items in a unified format.

[0051] Furthermore, the message decoding of the original monitoring data further includes: extracting at least one message block and an application format identifier of each message block from a message stream; The target message block is reassembled based on the application format identifier.

[0052] In the specific implementation, since during the encoding process, for messages that exceed the size of a single SECS-I transaction, these larger message blocks need to be split and transmitted in multiple message blocks, during decoding, these blocks need to be correctly reassembled to restore the complete message, thereby obtaining a complete message stream.

[0053] This embodiment obtains decoded monitoring data by performing message decoding on the original monitoring data; extracts key monitoring data from the decoded monitoring data; and generates target monitoring data based on the key monitoring data, thereby ensuring both the security of information transmission and the efficiency of communication between the device and the application system.

[0054] This application also provides a semiconductor device data monitoring device, please refer to Figure 5 , the semiconductor device data monitoring device includes: The determination module 10 is configured to determine a monitoring component to be executed based on a data monitoring request when the data monitoring request is received.

[0055] The monitoring module 20 is used to call the target program interface to drive the monitoring component to be run to obtain the original monitoring data of the semiconductor device to be monitored. The data format of the original monitoring data complies with the data format requirements of the semiconductor communication standard protocol.

[0056] The generating module 30 is configured to generate target monitoring data according to the original monitoring data.

[0057] This embodiment allocates corresponding monitoring components to be run to data monitoring requests to achieve simultaneous execution of multi-threaded tasks, thereby improving data monitoring efficiency. The monitoring components to be run are driven by calling a target program interface to obtain original monitoring data of the semiconductor device to be monitored. Finally, the original monitoring data is converted into target monitoring data to obtain monitoring data that meets data transmission requirements, thereby improving the data monitoring efficiency of the semiconductor device and avoiding the technical problem of low data monitoring efficiency of the semiconductor device in the prior art.

[0058] In one embodiment, the determination module 10 is further used to determine the monitoring component to be run based on the data monitoring request when receiving the data monitoring request; call the target program interface to drive the monitoring component to be run to obtain the original monitoring data of the semiconductor device to be monitored, and the data format of the original monitoring data complies with the data format requirements of the semiconductor communication standard protocol; and generate target monitoring data based on the original monitoring data.

[0059] In one embodiment, the determination module 10 is further used to send a data monitoring request to a driving module; the driving module performs message encoding on the data monitoring request to obtain a target data monitoring request; establishes a communication connection between the driving module and the semiconductor device based on a semiconductor communication standard protocol and the target data monitoring request; and allocates a corresponding monitoring component to be run through the communication connection.

[0060] In one embodiment, the generating module 30 is further configured to determine the local operating system category through the communication connection; and allocate a monitoring component to be run corresponding to the data monitoring request through a message scheduler based on the local operating system category.

[0061] In one embodiment, the generating module 30 is further configured to perform message decoding on the original monitoring data to obtain decoded monitoring data; extract key monitoring data from the decoded monitoring data; and generate target monitoring data based on the key monitoring data.

[0062] In one embodiment, the generating module 30 is further configured to read the message stream and function information of the original monitoring data; and decode various types of data items in the message stream to obtain target data items in a unified format.

[0063] The present application provides a semiconductor device data monitoring device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the semiconductor device data monitoring method in the above-mentioned embodiment one.

[0064] Reference below Figure 6 , which shows a schematic diagram of the structure of a semiconductor device data monitoring device suitable for implementing the embodiments of the present application. The semiconductor device data monitoring device in the embodiments of the present application may include, but is not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), in-vehicle terminals (such as in-vehicle navigation terminals), and fixed terminals such as digital TVs and desktop computers. Figure 6 The semiconductor device data monitoring device shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0065] like Figure 6As shown, the semiconductor device data monitoring device may include a processing device 1001 (e.g., a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes based on programs stored in a read-only memory (ROM) 1002 or programs loaded from a storage device 1003 into a random access memory (RAM) 1004. RAM 1004 also stores various programs and data required for the operation of the semiconductor device data monitoring device. Processing device 1001, ROM 1002, and RAM 1004 are interconnected via a bus 1005. An input / output (I / O) interface 1006 is also connected to the bus. Typically, the following systems may be connected to I / O interface 1006: input devices 1007 including, for example, a touchscreen, touchpad, keyboard, mouse, image sensor, microphone, accelerometer, gyroscope, etc.; output devices 1008 including, for example, a liquid crystal display (LCD), speaker, vibrator, etc.; storage device 1003 including, for example, a magnetic tape or hard disk; and communication devices 1009. The communication device 1009 can allow the semiconductor device data monitoring device to communicate with other devices wirelessly or by wire to exchange data. Although the figure shows a semiconductor device data monitoring device with various systems, it should be understood that it is not required to implement or have all of the systems shown. More or fewer systems may be implemented or have alternatively.

[0066] In particular, according to the embodiments disclosed in the present application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, the embodiments disclosed in the present application include a computer program product comprising a computer program carried on a computer-readable medium, the computer program comprising program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network via a communication device, or installed from a storage device 1003, or installed from a ROM 1002. When the computer program is executed by the processing device 1001, the above-mentioned functions defined in the method of the embodiment disclosed in the present application are executed.

[0067] The semiconductor device data monitoring device provided in this application utilizes the semiconductor device data monitoring method described in the aforementioned embodiment to solve the technical problem of semiconductor device data monitoring. Compared to the prior art, the beneficial effects of the semiconductor device data monitoring device provided in this application are the same as those of the semiconductor device data monitoring method described in the aforementioned embodiment. Other technical features of the semiconductor device data monitoring device are the same as those disclosed in the aforementioned embodiment and are not further elaborated here.

[0068] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0069] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

[0070] The present application provides a computer-readable storage medium having computer-readable program instructions (ie, a computer program) stored thereon, wherein the computer-readable program instructions are used to execute the semiconductor device data monitoring method in the above-mentioned embodiment.

[0071] The computer-readable storage medium provided herein may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, systems, or devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to, an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, system, or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including, but not limited to, wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0072] The computer-readable storage medium may be included in the semiconductor device data monitoring device; or may exist independently without being assembled into the semiconductor device data monitoring device.

[0073] The computer-readable storage medium carries one or more programs. When the one or more programs are executed by the semiconductor device data monitoring device, the semiconductor device data monitoring device performs semiconductor device data monitoring.

[0074] Computer program code for performing the operations of the present application may be written in one or more programming languages, or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a stand-alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0075] The flow charts and block diagrams in the accompanying drawings illustrate the possible architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, program segment or a part of code, and the module, program segment or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order than that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented by a dedicated hardware-based system that performs the specified function or operation, or can be implemented by a combination of dedicated hardware and computer instructions.

[0076] The modules described in the embodiments of the present application may be implemented in software or hardware, wherein the name of a module does not necessarily limit the unit itself.

[0077] The computer-readable storage medium provided in this application stores computer-readable program instructions (i.e., a computer program) for executing the aforementioned semiconductor device data monitoring method, thereby resolving the technical issues surrounding semiconductor device data monitoring. Compared to the prior art, the computer-readable storage medium provided in this application offers the same beneficial effects as the semiconductor device data monitoring method provided in the aforementioned embodiments, and therefore will not be further elaborated upon here.

[0078] The present application also provides a computer program product, including a computer program, which implements the steps of the semiconductor device data monitoring method as described above when the computer program is executed by a processor.

[0079] The computer program product provided in this application can solve the technical problem of semiconductor device data monitoring. Compared with the prior art, the beneficial effects of the computer program product provided in this application are the same as the beneficial effects of the semiconductor device data monitoring method provided in the above embodiment, and will not be repeated here.

[0080] The above description is only part of the embodiments of the present application and does not limit the patent scope of the present application. All equivalent structural transformations made by using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A semiconductor device data monitoring method, characterized in that: The semiconductor device data monitoring method comprises: Upon receiving a data monitoring request, determining a monitoring component to be executed based on the data monitoring request; Calling the target program interface to drive the monitoring component to be run to obtain the original monitoring data of the semiconductor device to be monitored, wherein the data format of the original monitoring data complies with the data format requirements of the semiconductor communication standard protocol; The target monitoring data is generated according to the original monitoring data.

2. The semiconductor device data monitoring method according to claim 1, characterized in that: The determining the monitoring component to be executed based on the data monitoring request includes: Send data monitoring request to the driver module; The driving module performs message encoding on the data monitoring request to obtain a target data monitoring request; Establishing a communication connection between the driving module and the semiconductor device based on a semiconductor communication standard protocol and the target data monitoring request; The corresponding monitoring component to be run is allocated through the communication connection.

3. The semiconductor device data monitoring method according to claim 2, characterized in that: The allocating the corresponding monitoring component to be run through the communication connection includes: determining the type of the local operating system through the communication connection; Based on the local operating system category, a to-be-running monitoring component corresponding to the data monitoring request is allocated through a message scheduler.

4. The semiconductor device data monitoring method according to claim 1, wherein: The generating target monitoring data according to the original monitoring data comprises: Performing message decoding on the original monitoring data to obtain decoded monitoring data; Extracting key monitoring data from the decoded monitoring data; Target monitoring data is generated based on the key monitoring data.

5. The semiconductor device data monitoring method according to claim 4, characterized in that: The message decoding of the original monitoring data includes: Reading the message flow and function information of the original monitoring data; Decode various types of data items in the message stream to obtain target data items in a unified format.

6. The semiconductor device data monitoring method according to claim 5, characterized in that: The message decoding of the original monitoring data further includes: Extracting at least one message block and an application format identifier of the message block from the message stream; The target message block is reassembled based on the application format identifier.

7. A semiconductor device data monitoring device, characterized in that: The semiconductor device data monitoring device comprises: A determination module, configured to determine a monitoring component to be executed based on the data monitoring request when receiving the data monitoring request; A monitoring module, used for calling a target program interface to drive the monitoring component to be run to obtain original monitoring data of the semiconductor device to be monitored, wherein the data format of the original monitoring data complies with the data format requirements of the semiconductor communication standard protocol; A generating module is used to generate target monitoring data according to the original monitoring data.

8. A semiconductor device data monitoring device, characterized in that: The semiconductor device data monitoring device comprises: a memory, a processor, and a semiconductor device data monitoring program stored in the memory and executable on the processor, wherein the semiconductor device data monitoring program is configured to implement the semiconductor device data monitoring method according to any one of claims 1 to 6.

9. A storage medium, characterized in that: The storage medium stores a semiconductor device data monitoring program, and when the semiconductor device data monitoring program is executed by the processor, the semiconductor device data monitoring method according to any one of claims 1 to 6 is implemented.

10. A computer program product, characterized in that The computer program product comprises a computer program, and when the computer program is executed by a processor, the steps of the semiconductor device data monitoring method according to any one of claims 1 to 6 are implemented.

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