Novel packaging method for LGA semiconductor chip

Abstract

The invention relates to an electronic component packaging technology, and discloses a novel packaging method for an LGA semiconductor chip, which comprises the following steps: S1, preselecting a substrate, and digging a groove in the substrate in advance; s2, preselecting an upper chip and a bonding wire; and S3, the interior of the upper chip is directly filled with glue for treatment, the upper chip is bonded with the substrate, and then the upper chip is put into a drying oven to be dried so that the upper chip and the substrate can be stably bonded. The substrate is cleaned and dried, and is kept in a clean state. The number of the grooves formed in the base plate is set according to the actual situation, and chippings need to be removed after the grooves are formed. The upper chip and the bonding wire are in a connection state, and the upper chip is obtained through wafer grinding. And the size of the upper chip is smaller than that of the substrate. According to the packaging method, the number of working procedures can be reduced, the labor cost can be saved, meanwhile, the material cost can be reduced, the qualified rate of products can be effectively increased, and the performance of the products is more stable.

Description

Technical Field

[0001] The invention relates to the technical field of electronic component packaging, and in particular to a novel packaging method for LGA semiconductor chips. Background Art

[0002] Packaging technology is crucial for chips. At present, semiconductor chip packaging technology covers a variety of forms such as FilpChip, COB and LGA. Among them, LGA packaging technology has received more and more attention and application due to its good performance in terms of interface richness, mechanical stability and heat dissipation. The full name of LGA is Land Grid Array, or planar grid array packaging, which belongs to the surface mounting technology of integrated circuits (ICs). Chips using this packaging form are often connected or directly soldered to printed circuit boards (PCB substrates).

[0003] LGA packaging is an electronic component packaging technology that is based on the design principle of Land Grid Array (LGA) connector and is used to connect integrated circuit chips to printed circuit boards (PCBs). LGA packaging has many advantages, such as high reliability, good heat dissipation performance, and low insertion and extraction force.

[0004] This new LGA package form of sensor is applied in smart wearable devices. The main functions include health and medical monitoring, entertainment, etc., such as smart watches, smart headphones, smart bracelets, and medical care. It can sense changes in external conditions, such as cold and warm, fast and slow, and respond accordingly. Just like our skin, biosensors are sensitive to biomass and convert its concentration into electrical signals for detection. They have the functions of receivers and converters. Wearable devices are computing devices that can be installed on people, animals and objects and can sense, transmit and process information. Sensors are the core components of wearable devices. Sensors in wearable devices are extensions of human senses and enhance the human "sixth sense" function. With the development of biotechnology, and the miniaturization and intelligence of sensors, wearable devices may evolve into smart devices implanted in the human body. In various refreshing wearable devices, there is a key device - sensors. The emergence of wearable smart devices has brought us a new lifestyle. The various functions of wearable smart devices rely on the functional integration of various sensors to achieve various innovations. Therefore, it is necessary to develop more accurate, miniaturized, and integrated sensors to meet the needs. In the future, with the continuous advancement of modern electronic-sensor technology, wearable devices will continue to develop.

[0005] However, the traditional LGA packaging form requires the application of glue + cover + glass after DB (chip mounting) & WB (wire bonding) to complete the packaging. The product uses glass to filter light, the process is complicated and the scrap rate is extremely high.

[0006] Therefore, we proposed a new LGA semiconductor chip packaging method to solve the problem. Summary of the invention

[0007] 1. Technical issues to be resolved In view of the deficiencies in the prior art, the present invention provides a novel packaging method for LGA semiconductor chips, which solves the problems in the above-mentioned background technology.

[0008] (II) Technical solution To achieve the above object, the present invention provides the following technical solution: a novel LGA semiconductor chip packaging method, comprising the following steps: S1: preselect a substrate and pre-dig a groove on the substrate; S2: pre-select a chip and wire bonding; S3: Fill the inside of the upper chip with glue directly to bond it to the substrate, and then put it into an oven for drying to ensure a firm bond.

[0009] Preferably, the substrate is cleaned and dried to keep it clean.

[0010] Preferably, the number of grooves on the substrate is set according to actual conditions, and debris cleaning is required after the grooves are completed.

[0011] Preferably, the upper chip and the bonding wires are in a connected state, and the upper chip is obtained by wafer grinding.

[0012] Preferably, the size of the upper chip is smaller than that of the substrate.

[0013] Preferably, the glue filling method of step S3 is as follows: glue is applied to the inside of the upper chip by using a glue dispenser, and then the upper chip and the substrate are aligned and bonded by using a suction tool.

[0014] Preferably, the glue is solder paste.

[0015] (III) Beneficial effects Compared with the prior art, the present invention provides a novel packaging method for LGA semiconductor chips, which has the following beneficial effects: The packaging method of the present invention can reduce the number of working steps, save labor costs, and also reduce material costs. In addition, the packaging method of the present invention can effectively improve the qualified rate of products, make the performance of products more stable, effectively reduce the size of products, and have wider applications. DETAILED DESCRIPTION

[0016] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] A novel packaging method for LGA semiconductor chips comprises the following steps: S1: preselecting a substrate that has been cleaned, dried and kept clean, and pre-digging grooves on the substrate, wherein the number of grooves on the substrate is set according to actual conditions, and debris cleaning is required after the grooves are dug; S2: preselecting an upper chip and a bonding wire, wherein the upper chip and the bonding wire are in a connected state, and the upper chip is obtained by wafer grinding and scribing, and the size of the upper chip used is smaller than the size of the substrate; S3: Fill the inside of the upper chip with glue directly and bond it to the substrate. Specifically, use a glue dispenser to stick glue to the inside of the upper chip, then use a suction tool to align the upper chip and the substrate for bonding, and finally put it in an oven for drying to ensure a firm bond.

[0018] Here, solder paste is used as glue.

[0019] Beneficial effects: Compared with the old packaging form, the new packaging form provided by the present invention has the following advantages: (1) Reduce work processes and save labor costs; (2) Reduce material costs; (3) Effectively improve the product qualification rate; (4) Make the product performance more stable; (5) It can effectively reduce product size and has a wider range of applications.

[0020] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A novel packaging method for LGA semiconductor chips, characterized in that: The following steps are involved: S1: preselect a substrate and pre-dig a groove on the substrate; S2: pre-select a chip and wire bonding; S3: Fill the inside of the upper chip with glue directly to bond it to the substrate, and then put it into an oven for drying to ensure a firm bond.

2. A novel LGA semiconductor chip packaging method according to claim 1, characterized in that: The substrate is cleaned and dried to keep it clean.

3. A novel LGA semiconductor chip packaging method according to claim 1, characterized in that: The number of grooves on the substrate is set according to actual conditions, and debris cleaning is required after the grooves are completed.

4. A novel LGA semiconductor chip packaging method according to claim 1, characterized in that: The upper chip and the bonding wire are in a connected state, and the upper chip is obtained by grinding a wafer.

5. A novel LGA semiconductor chip packaging method according to claim 1, characterized in that: The size of the upper chip is smaller than that of the substrate.

6. A novel LGA semiconductor chip packaging method according to claim 1, characterized in that: The specific method of filling glue in step S3 is: using a glue dispenser to stick glue inside the upper chip, and then using a suction tool to align the upper chip and the substrate for bonding.

7. A novel LGA semiconductor chip packaging method according to claim 1, characterized in that: The glue is solder paste.