Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device, and relates to the technical field of display. The display panel is provided with a frame area, the frame area comprises a near display area, a bending area and a dam area which are connected in sequence, the frame area is bent towards the backlight side of the display panel, and the bending position of the frame area is the bending area; the display panel comprises: a substrate; the packaging layer is located on one side of the substrate and comprises a first organic packaging layer and a second organic packaging layer, the first organic packaging layer and the second organic packaging layer are arranged in the direction parallel to the substrate, the second organic packaging layer is located in the bending area, and the elastic modulus of the second organic packaging layer is smaller than that of the first organic packaging layer; the dam is located in the dam area, and the second organic packaging layer is located between the dam and the first organic packaging layer. The purpose of reducing the width of the frame area in a bending mode can be achieved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] In an organic light-emitting diode (OLED) display panel, the display panel can be composed of two parts: a display area AA and a border area NA. In order to pursue better visual effects, the display panel is developing in the direction of reducing the border. Therefore, it is necessary to reduce the width of the border area while ensuring the packaging effect of the border area. This demand brings more severe challenges to the packaging technology. Summary of the invention

[0003] In view of this, the embodiments of the present application provide a display panel and a method for manufacturing the same, and a display device, so as to reduce the size of the border area while ensuring the packaging effect of the border area.

[0004] The present application provides a display panel, which has a frame area, wherein the frame area includes a near-display area, a bending area and a dam area connected in sequence, the frame area is bent toward the backlight side of the display panel, and the bending position of the frame area is the bending area; wherein the display panel includes: a substrate; an encapsulation layer, located on one side of the substrate, the encapsulation layer includes a first organic encapsulation layer and a second organic encapsulation layer, the first organic encapsulation layer and the second organic encapsulation layer are arranged in a direction parallel to the substrate, the second organic encapsulation layer is located in the bending area, and the elastic modulus of the second organic encapsulation layer is less than the film elastic modulus of the first organic layer; a dam, located in the dam area, and the second organic layer encapsulation is located between the dam and the first organic encapsulation layer.

[0005] According to one embodiment of the present application, the border area includes an arc-angle bending portion located at a corner point of the display panel and a straight bending portion connecting adjacent arc-angle bending portions, and the straight bending portion and the arc-angle bending portion are located in the bending area and the dam area; wherein the arc-angle bending portion has at least one seam, and the arc-angle bending portion is spliced ​​at the seam position.

[0006] According to one embodiment of the present application, there are multiple seams in the arc angle bending portion, and the multiple seams are arranged at intervals around the arc angle center of the arc angle bending portion; preferably, the multiple seams are evenly arranged around the arc angle center of the arc angle bending portion; preferably, the number of the seams in the multiple arc angle bending portions is the same.

[0007] According to one embodiment of the present application, the arc-angle bending portion is bonded and fixed at the seam position.

[0008] According to one embodiment of the present application, the encapsulation layer also includes a first inorganic encapsulation layer and a second inorganic encapsulation layer, the first organic encapsulation layer and the second organic encapsulation layer are located on the side of the first inorganic encapsulation layer away from the substrate, and the second inorganic encapsulation layer is located on the side of the first organic encapsulation layer, the second organic encapsulation layer and the first inorganic encapsulation layer away from the substrate; preferably, at least part of the first organic encapsulation layer is located in the near display area; preferably, the dam includes a first dam arranged in an annular manner; preferably, the dam also includes a second dam, and the second dam is arranged on the outside of the first dam; preferably, the substrate, the first inorganic encapsulation layer, the second inorganic encapsulation layer, the second organic encapsulation layer and the parts of the dam located on both sides of the seam are spliced ​​at the seam position.

[0009] According to an embodiment of the present application, a retaining groove is provided on a side of the second organic encapsulation layer facing the first organic encapsulation layer, and the retaining groove extends along an extension direction of the second organic encapsulation layer; preferably, a cross-sectional shape of the retaining groove includes an arc shape.

[0010] According to one embodiment of the present application, it further includes: a packaging deposition layer, wherein the packaging deposition layer covers and wraps the substrate, the packaging layer and the dam.

[0011] The present application also provides a method for preparing a display panel, comprising: providing a substrate; preparing a dam on one side of the substrate; preparing a second organic encapsulation layer on one side of the substrate; and bending the display panel at the position of the second organic encapsulation layer.

[0012] According to an embodiment of the present application, after the step of preparing the second organic encapsulation layer on one side of the substrate, the step further includes: etching a side wall of the second organic encapsulation layer away from the dam to form a stop groove; preferably, part of the first organic encapsulation layer is located in the stop groove; preferably, before the step of preparing the second organic encapsulation layer on one side of the substrate, the step further includes: preparing a first inorganic encapsulation layer on the substrate and the dam; preferably, preparing the second organic encapsulation layer on one side of the substrate includes: preparing the second organic encapsulation layer on the first inorganic encapsulation layer; preparing the first organic encapsulation layer on the side of the second organic encapsulation layer away from the dam includes: preparing the first organic encapsulation layer on the first inorganic encapsulation layer; preferably, before bending the display panel at the position of the second organic encapsulation layer, the step further includes: preparing the second inorganic encapsulation layer on the side of the first inorganic encapsulation layer, the first organic encapsulation layer and the second organic encapsulation layer away from the substrate layer; preferably, before bending the display panel at the position of the second organic encapsulation layer, it also includes: etching a lateral groove on the arc-angle bending portion of the display panel, the arc-angle bending portion is located at the corner point of the display panel, and the lateral groove penetrates the substrate, the first inorganic encapsulation layer, the second inorganic encapsulation layer and the dam in a direction perpendicular to the substrate; the bending of the display panel at the position of the second organic encapsulation layer includes: bending the display panel at the position of the second organic encapsulation layer so that the arc-angle bending portion is spliced ​​at the position of the lateral groove to form a seam; preferably, it also includes: performing glue injection and fixing at the seam position; preferably, it also includes: performing encapsulation deposition to form the encapsulation deposition layer, the encapsulation deposition layer covers part of the seam; preferably, the encapsulation deposition layer completely covers the seam; preferably, performing encapsulation deposition to form the encapsulation deposition layer includes: performing encapsulation deposition using an atomic layer to form the encapsulation deposition layer.

[0013] The present application also provides a display device, including the display panel of the above embodiment; or, including a display panel prepared by the above display panel preparation method.

[0014] According to the display panel, preparation method thereof and display device provided by the embodiments of the present application, a second organic encapsulation layer is provided in the bending area, and the elastic modulus of the second organic encapsulation layer is smaller than the elastic modulus of the first organic encapsulation layer. During the bending process of the bending area of ​​the display panel, the second organic encapsulation layer can produce adaptive changes to always ensure the encapsulation effect. It can be seen that the present application can achieve the purpose of reducing the width of the border area by bending. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0016] Figure 1 It is a top view of a display panel.

[0017] Figure 2 It is a schematic diagram of the cross-sectional structure of a display panel.

[0018] Figure 3 Schematic diagram of the cross-sectional structure of a display panel in an unbent state provided by an embodiment of the present application.

[0019] Figure 4 FIG. 4 is a top view of a display panel provided in an embodiment of the present application in an unbent state.

[0020] Figure 5 It is a schematic diagram of the lateral groove structure of a display panel provided in one embodiment of the present application.

[0021] Figure 6 Schematic diagram of the corner point positions of a display panel in a bent state provided by an embodiment of the present application.

[0022] Figure 7 It is a schematic diagram of the lateral groove structure of a display panel provided in another embodiment of the present application.

[0023] Figure 8 It is a schematic diagram of the cross-sectional structure of a display panel in an unbent state provided by another embodiment of the present application.

[0024] Fig. 9 This is one of the flow charts of a method for preparing a display panel provided in one embodiment of the present application.

[0025] Fig.10 This is the second flow chart of the method for preparing a display panel provided in one embodiment of the present application.

[0026] Reference numerals:

[0027] AA, display area; NA, frame area; NA1, near display area; NA2, bending area; NA3, dam area; NA4, straight bending portion; NA5, arc-angle bending portion; B, backlight side; 100, substrate; 200, encapsulation layer; 210, first inorganic encapsulation layer; 220, first organic encapsulation layer; 230, second organic encapsulation layer; 231, retaining groove; 240, second inorganic encapsulation layer; 300, dam; 400, lateral groove; 410, seam. DETAILED DESCRIPTION

[0028] In pursuit of better visual effects, mobile phone screens are moving towards reducing the borders. With the development of narrow border technology, it is necessary to ensure a large area opening ratio of the screen display area and a narrow border packaging effect. This demand brings more severe challenges to packaging technology.

[0029] Combination Figure 1 and Figure 2 In an organic light-emitting diode (OLED) display panel, the panel may be composed of a display area AA and a border area NA. The current packaging structure adopts an inorganic / organic / inorganic laminated structure, and the border area NA is mainly composed of a dam 300 (Dam) and an inorganic layer edge overlap area. In order to pursue a better visual effect, the display panel is developing in the direction of reducing the border. Therefore, it is necessary to reduce the width of the border area NA while ensuring the packaging effect of the border area NA. This demand brings more severe challenges to the packaging technology.

[0030] Normally, in order to avoid overflow of the organic layer, two dams 300 need to be set, which will result in a larger border width. If a narrow border is to be achieved, the package edge size needs to be further narrowed, and the width of the dam area NA3 needs to be reduced. However, narrowing the package edge size and reducing the width of the dam area NA3 are prone to organic layer leakage.

[0031] In view of this, the present application provides a display panel, a preparation method thereof and a display device, wherein the bending area NA2 of the display panel is provided with a second organic encapsulation layer 230, and the material of the second organic encapsulation layer 230 is a flexible organic material. During the bending process of the bending area NA2 of the display panel, the second organic encapsulation layer 230 can produce adaptive changes to always ensure the encapsulation effect. It can be seen that the present application can achieve the purpose of reducing the width of the border area NA by bending.

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0033] In addition, in order to better illustrate the present application, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods and means well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0035] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0036] Figure 3 is a schematic diagram of a cross-sectional structure of a display panel provided in an embodiment of the present application in an unbent state, Figure 4 1 is a top view of a display panel provided in an embodiment of the present application in an unbent state. The unbent state refers to the state of the display panel of this embodiment before the frame area NA is bent during the processing.

[0037] like Figure 3 and Figure 4 As shown, the display panel of this embodiment has a display area AA and a frame area NA surrounding the display area AA, the frame area NA includes a near display area NA1, a bending area NA2 and a dam area NA3 connected in sequence, the near display area NA1 is located between the display area AA and the bending area NA2, the dam area NA3 connects the side of the bending area NA2 away from the near display area NA1, the frame area NA is bent toward the backlight side B of the display panel, and the bending position of the frame area NA is the bending area NA2. By arranging the bending area NA2 in the frame area NA, a display panel structure in which the frame area NA is bent toward the backlight side B can be formed, which can meet the user's small frame requirements.

[0038] The display panel includes a substrate 100, an encapsulation layer 200 and a dam 300. The encapsulation layer 200 is located on one side of the substrate 100, and includes a first organic encapsulation layer 220 and a second organic encapsulation layer 230. The first organic encapsulation layer 220 and the second organic encapsulation layer 230 are arranged in a direction parallel to the substrate, at least part of the first organic encapsulation layer 220 is located near the display area NA1, and the elastic modulus of the second organic encapsulation layer 230 is smaller than that of the first organic encapsulation layer 220; the dam 300 is located in the dam area NA3, and the second organic encapsulation layer 230 is located on the side of the first organic encapsulation layer 220 facing the dam 300. In the display panel of this embodiment, the elastic modulus of the second organic encapsulation layer 230 is smaller than that of the first organic encapsulation layer 220, and the second organic encapsulation layer 230 is located in the bending area NA2, which can effectively reduce the stress of the bending area NA2, so that the display panel is easy to bend in the bending area NA2.

[0039] In some embodiments, the encapsulation layer 200 further includes a first inorganic encapsulation layer 210 and a second inorganic encapsulation layer 240, wherein the first organic encapsulation layer 220 and the second organic encapsulation layer 230 are located on a side of the first inorganic encapsulation layer 210 away from the substrate 100. The second inorganic encapsulation layer 240 is located on a side of the first organic encapsulation layer 220, the second organic encapsulation layer 230 and the first inorganic encapsulation layer 210 away from the substrate 100, and the dam 300 is located on a side of the first inorganic encapsulation layer 210 close to the substrate 100.

[0040] The elastic modulus of the second organic encapsulation layer 230 is smaller than that of the first organic encapsulation layer 220, so that it is easy to bend the second organic encapsulation layer 230. In addition, the second organic encapsulation layer 230 can also block the first organic encapsulation layer 220, so that the anti-overflow effect can still be ensured after the display panel is bent.

[0041] Optionally, the flexible organic material used in the second organic encapsulation layer 230 is a low elastic modulus organic encapsulation material, which mainly refers to a low elastic modulus silicone sealant, which is a sealing material with high elasticity, low elastic modulus, high and low temperature resistance, chemical corrosion resistance, and UV resistance. Its main component is silicone resin. The low elastic modulus property of the low elastic modulus silicone sealant means that it has a small deformation under stress and has good resilience, and can maintain a long-term stable sealing effect. At the same time, it also has good adhesion and wear resistance, and can effectively protect the sealed object.

[0042] Combination Figure 4 and Figure 5 In one embodiment of the present application, the frame area NA includes an arc-angle bending portion NA5 located at a corner point of the display panel and a straight bending portion NA4 connecting adjacent arc-angle bending portions NA5, and the straight bending portion NA4 and the arc-angle bending portion NA5 are located in the bending area NA2 and the dam area NA3. The above-mentioned corner point position refers to the corner position, that is, the position where the adjacent sides of the display panel are connected. For example, if the display panel is a nearly rectangular panel with four rounded corners, the corner point position of the display panel is the four rounded corner positions, and the frame area NA of the display panel is annular as a whole, then the display panel includes four straight bending portions NA4 located at four side positions and arc-angle bending portions NA5 located at four corner points.

[0043] Combination Figure 6 The arc angle bending portion NA5 has at least one seam 410 , and the arc angle bending portion NA5 is spliced ​​at the position of the seam 410 .

[0044] During the preparation of the display panel, at least one lateral groove 400 can be etched in the arc-angle bending portion NA5, with the opening of the lateral groove 400 facing the outer edge of the arc-angle bending portion NA5 (the side away from the display area AA), and in the stacking direction of the first inorganic encapsulation layer 210, the second inorganic encapsulation layer 240 and the substrate 100, the lateral groove 400 passes through the frame area NA. After the arc-angle bending portion NA5 is bent, the side walls of the lateral groove 400 are abutted against each other to form a seam 410.

[0045] When the display panel is bent, the straight bending portion NA4 can be bent directly without wrinkles, thus not affecting the packaging effect and aesthetics, while the arc-angle bending portion NA5 will have wrinkles when bent, which can easily lead to packaging failure and overflow. In this embodiment, by providing a seam 410 structure at the arc-angle bending portion NA5, the arc-angle bending portion NA5 can be provided with a shortening space required for bending, thereby avoiding wrinkles and ensuring the packaging effect after bending.

[0046] Optionally, in one embodiment, the number of seams 410 in the arc angle bending portion NA5 is multiple, and the multiple seams 410 are arranged at intervals. Providing multiple seams 410 means etching multiple corresponding lateral grooves 400 during the preparation process, which has the following advantages: first, multiple lateral grooves 400 jointly provide the space required for shortening, which can reduce the width of a single lateral groove 400, thereby reducing the impact of the single lateral groove 400 structure on the packaging effect at the location; secondly, multiple lateral grooves 400 are arranged at intervals in sequence, which can make different positions of the arc angle bending portion NA5 easy to bend, avoid stress concentration, and prevent problems such as unsatisfactory bending effect at some positions.

[0047] Preferably, multiple seams 410 are evenly arranged on the arc-angle bending portion NA5. For example, before the display panel is bent, a lateral groove 400 is provided at intervals of 20° with the arc center of the arc-angle bending portion as the center, so that after bending, a structure in which multiple seams 410 are evenly arranged on the arc-angle bending portion NA5 is formed. Different positions of the arc-angle bending portion NA5 are easy to bend, and after the bending is completed, the formed bending structure is more neat and smooth.

[0048] Preferably, the number of seams 410 in the plurality of arc-angle bending portions NA5 is the same, so that the four corners formed by the bending of the display panel have better symmetry, which is beneficial to the subsequent design and production of the display device.

[0049] Optionally, in one embodiment, the lateral groove 400 is a fan-shaped groove structure, and the width of the fan-shaped groove gradually decreases from one end close to the edge of the arc-angle bending portion NA5 to one end away from the edge of the arc-angle bending portion NA5. When the arc-angle bending portion NA5 is bent toward the backlight side B of the display panel, the size change amount of the position close to the edge of the arc-angle bending portion NA5 is large, and the size change amount of the position away from the edge of the arc-angle bending portion NA5 is small. The lateral groove 400 is set as a fan-shaped groove structure, which can better adapt to the difference in size change amount of different positions of the arc-angle bending portion NA5 in the direction from the edge of the arc-angle bending portion NA5 to the edge of the arc-angle bending portion NA5.

[0050] Optionally, the substrate 100, the first inorganic encapsulation layer 210, the second inorganic encapsulation layer 240, the second organic encapsulation layer 230 and the dam 300 are spliced ​​at the seam 410, thereby avoiding the presence of gaps at the seam 410 and connecting the dams 300 on both sides of the lateral groove 400, thereby achieving a better anti-overflow effect.

[0051] Preferably, the arc angle bending portion NA5 is bonded and fixed at the joint 410, so as to achieve the purpose of edge protection and shaping. Moreover, in actual use, if the first organic encapsulation layer 220 flows to the joint 410 through the second organic encapsulation layer 230, there will be no overflow from the joint 410.

[0052] In one embodiment, a retaining groove 231 is provided on one side of the second organic encapsulation layer 230 facing the first organic encapsulation layer 220, and the retaining groove 231 extends along the extension direction of the second organic encapsulation layer 230. When printing the first organic encapsulation layer 220, the retaining groove 231 on the second organic encapsulation layer 230 can play a buffering role for the first organic encapsulation layer 220, blocking the first organic encapsulation layer 220 to prevent overflow. Preferably, the shape of the cross section of the retaining groove 231 includes an arc shape that bends in a direction away from the first organic encapsulation layer 220, so as to achieve better buffering and anti-overflow effects.

[0053] Optionally, the dam 300 includes a first dam arranged in an annular manner. By blocking the first organic encapsulation layer 220 with the second organic encapsulation layer 230, a good encapsulation effect can be achieved, the bending requirement can be met, and overflow after bending can be avoided. Therefore, when the second organic encapsulation layer 230 is provided, only one circle of dams 300 (for example Figure 5 ), the packaging requirements can be met.

[0054] However, in order to achieve a better packaging effect, multiple circles of dams 300 may be provided, such as Figure 7 and Figure 8As shown, the dam 300 also includes a second dam, which is annular and arranged outside the first dam, that is, the second dam is located on the side of the first dam away from the second organic encapsulation layer 230. This solution should also be within the protection scope of this application.

[0055] In one embodiment, the display panel further includes an encapsulation deposition layer, which covers the encapsulation substrate 100, the encapsulation layer 200 and the dam 300. The encapsulation deposition layer is a layer structure formed by atomic layer deposition after the bending and fixing of the frame area NA is completed. The main purpose is to protect the encapsulation structure after the arc angle is patterned. Since the patterned arc angle edge is prone to encapsulation failure and water and oxygen erosion, the encapsulation deposition layer can well wrap the edge morphology to effectively block water and oxygen.

[0056] An embodiment of the present application further provides a display device, which includes the display panel provided in the above embodiment. The display device has an image display function and can be widely used in different scenarios. Optionally, the display device can present static images, such as pictures or photos, to provide users with visual information display. At the same time, it can also play dynamic images, such as video content, to bring users a more vivid and rich visual experience.

[0057] In practical applications, the display device can be presented in various forms, including but not limited to laptops, mobile phones, handheld or portable computers, cameras, camcorders and other portable devices. In addition, the display device can also be used as a core display component of devices such as vehicle-mounted intelligent central control screens, calculators, smart watches, GPS navigators, etc. In the advertising and commercial fields, it can also be used as an electronic billboard or signboard. When combined with a projector, it can also display content on the screen.

[0058] It is worth mentioning that in addition to the basic image display function, the display device can also have a variety of other practical functions. For example, it can integrate photo taking and video recording functions. At the same time, in order to enhance security and convenience, it can also be equipped with biometric technologies such as fingerprint recognition and face recognition to provide users with a safer and more convenient user experience. In order to achieve these functions, the display device can integrate corresponding functional modules, such as under-screen cameras and under-screen fingerprint recognition sensors.

[0059] The display device provided according to any embodiment of the present application and the display panel provided in the embodiment of the present application belong to the same inventive concept, and have corresponding film layer structures and beneficial effects. Details not fully described in the embodiment of the display device can be found in the embodiment of the display panel, and will not be repeated here.

[0060] This embodiment further provides a method for manufacturing a display panel. The method for manufacturing the display panel of this embodiment can be referred to in conjunction with the display panel of the above embodiment.

[0061] Combination Fig. 9 , the method for preparing the display panel comprises the following steps:

[0062] S100: providing a substrate 100.

[0063] S200 : preparing a bank 300 on one side of the substrate 100 .

[0064] Alternatively, in one embodiment, the material of the dam 300 may be an organic material.

[0065] S300: preparing a second organic encapsulation layer 230 on one side of the substrate 100;

[0066] S320 , preparing a first organic encapsulation layer 220 on a side of the second organic encapsulation layer 230 away from the dam 300 , wherein the elastic modulus of the second organic encapsulation layer 230 is smaller than that of the first organic encapsulation layer 220 .

[0067] Optionally, the material of the first organic encapsulation layer 220 is a fiber material, a resin material, or a material for a laminated multilayer board, etc. The first organic encapsulation layer 220 can be a single layer, a multilayer, a composite layer, etc.

[0068] Optionally, the first organic encapsulation layer 220 is printed.

[0069] S400 : bending the display panel at the position of the second organic encapsulation layer 230 .

[0070] Combination Fig.10 In some embodiments, before step S320, the method further includes:

[0071] S310 , forming a retaining groove 231 by etching the sidewall of the second organic encapsulation layer 230 away from the bank 300 .

[0072] Preferably, step S320 of preparing the first organic encapsulation layer 220 on a side of the second organic encapsulation layer 230 away from the dam 300 includes:

[0073] The first organic encapsulation layer 220 is formed on a side of the second organic encapsulation layer 230 facing away from the bank 300 , and at least a portion of the first organic encapsulation layer 220 is located in the stop groove 231 .

[0074] In some embodiments, before step S300, the method further includes:

[0075] S210, preparing a first inorganic encapsulation layer 210 on the substrate 100 and the dam 300. Optionally, the material of the first inorganic encapsulation layer 210 is silicon oxide, silicon oxynitride or silicon nitride, etc. The first inorganic encapsulation layer 210 can be a single layer, a multi-layer, a composite layer, etc.

[0076] Step S300 of preparing the second organic encapsulation layer 230 on one side of the substrate 100 includes:

[0077] S301, preparing a second organic encapsulation layer 230 on the first inorganic encapsulation layer 210;

[0078] Step S320 of preparing the first organic encapsulation layer 220 on the side of the second organic encapsulation layer 230 away from the bank 300 includes:

[0079] Preparing a first organic encapsulation layer 220 on the first inorganic encapsulation layer 210;

[0080] In some embodiments, before step S400, the method further includes:

[0081] S330, preparing a second inorganic encapsulation layer 240 on the side of the first inorganic encapsulation layer 210, the first organic encapsulation layer 220 and the second organic encapsulation layer 230 away from the substrate 100. Optionally, the material of the second inorganic encapsulation layer 240 is silicon oxide, silicon oxynitride or silicon nitride, etc. The second inorganic encapsulation layer 240 can be a single layer, a multi-layer, a composite layer, etc.

[0082] In some embodiments, before step S300, the method for preparing a display panel further includes:

[0083] S340, etching a lateral groove 400 at the arc angle bending portion NA5 of the display panel, the arc angle bending portion NA5 is located at the corner point of the display panel. The lateral groove 400 penetrates the substrate 100, the first inorganic encapsulation layer 210, the second organic encapsulation layer 230, the dam 300 and the second inorganic encapsulation layer 240 in a direction perpendicular to the substrate 100.

[0084] The step S400 of bending the display panel at the position of the second organic encapsulation layer 230 includes:

[0085] S401 , bend the display panel at the position of the second organic encapsulation layer 230 so that the arc-angle bending portion NA5 is spliced ​​at the position of the lateral groove 400 to form a seam 410 .

[0086] Since the gap between the dams 300 at the lateral grooves 400 is small, the organic encapsulation material of the second organic encapsulation layer 230 can be confined within the dams 300 under the action of surface tension, thereby preventing the organic encapsulation material of the second organic encapsulation layer 230 from overflowing during the preparation process.

[0087] In some embodiments, the method for preparing a display panel further includes:

[0088] S500, inject glue and fix at the joint 410 position.

[0089] In some embodiments, the method for preparing a display panel further includes:

[0090] S600 , performing packaging deposition to form a packaging deposition layer, wherein the packaging deposition layer covers a portion of the joint 410 .

[0091] Optionally, the encapsulation deposited layer completely covers the seam 410 .

[0092] Optionally, performing encapsulation deposition to form an encapsulation deposition layer includes:

[0093] Atomic layer deposition is used to form a packaging deposition layer.

[0094] Specifically, the substrate 100 , the encapsulation layer 200 and the dam 300 that have been fixed by glue injection are subjected to an overall atomic layer deposition process to form an encapsulation precipitation layer.

[0095] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0096] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A display panel, characterized in that: The display panel has a frame area, the frame area includes a near display area, a bending area and a dam area connected in sequence, the frame area is bent toward the backlight side of the display panel, and the bending position of the frame area is the bending area; Wherein, the display panel comprises: substrate; an encapsulation layer, located on one side of the substrate, the encapsulation layer comprising a first organic encapsulation layer and a second organic encapsulation layer, the first organic encapsulation layer and the second organic encapsulation layer are arranged in a direction parallel to the substrate, the second organic encapsulation layer is located in the bending region, and an elastic modulus of the second organic encapsulation layer is smaller than an elastic modulus of the first organic encapsulation layer; The dam is located in the dam area, and the second organic encapsulation layer is located between the dam and the first organic encapsulation layer.

2. The display panel according to claim 1, characterized in that: The frame area includes an arc-angle bending portion located at a corner point of the display panel and a straight bending portion connecting adjacent arc-angle bending portions, and the straight bending portion and the arc-angle bending portion are located in the bending area and the dam area; Wherein, the arc-angle bending portion has at least one seam, and the arc-angle bending portion is spliced ​​at the seam position.

3. The display panel according to claim 2, characterized in that: There are multiple seams in the arc-angle bending portion, and the multiple seams are arranged at intervals around the arc center of the arc-angle bending portion; Preferably, the plurality of seams are evenly arranged around the arc center of the arc bending portion; Preferably, the number of the seams in the plurality of arc-angle bends is the same.

4. The display panel according to claim 2 or 3, characterized in that: The arc-angle bent portion is bonded at the seam position.

5. The display panel according to any one of claims 2 to 3, characterized in that: The encapsulation layer further comprises a first inorganic encapsulation layer and a second inorganic encapsulation layer, the first organic encapsulation layer and the second organic encapsulation layer are located on a side of the first inorganic encapsulation layer away from the substrate, and the second inorganic encapsulation layer is located on a side of the first organic encapsulation layer, the second organic encapsulation layer and the first inorganic encapsulation layer away from the substrate; Preferably, at least a portion of the first organic encapsulation layer is located in the near display area; Preferably, the dam comprises a first dam arranged in an annular manner; Preferably, the dam further comprises a second dam, and the second dam is arranged outside the first dam; Preferably, the substrate, the first inorganic encapsulation layer, the second inorganic encapsulation layer, the second organic encapsulation layer and portions of the dam located on both sides of the seam are spliced ​​at the seam position.

6. The display panel according to claim 5, characterized in that: A retaining groove is provided on a side of the second organic encapsulation layer facing the first organic encapsulation layer, and the retaining groove extends along an extension direction of the second organic encapsulation layer; Preferably, the cross-section of the retaining groove includes an arc shape.

7. The display panel according to any one of claims 1 to 3, characterized in that: Also includes: A packaging deposition layer covers and wraps the substrate, the packaging layer and the dam.

8. A method for preparing a display panel, characterized in that: include: providing a substrate; preparing a dam on one side of the substrate; preparing a second organic encapsulation layer on one side of the substrate; preparing a first organic encapsulation layer on a side of the second organic encapsulation layer away from the dam, wherein the elastic modulus of the second organic encapsulation layer is smaller than the elastic modulus of the first organic encapsulation layer; The display panel is bent at the position of the second organic encapsulation layer.

9. The method for preparing a display panel according to claim 8, characterized in that: Before preparing the first organic encapsulation layer on the side of the second organic encapsulation layer away from the dam, the method further comprises: Etching a side wall of the second organic encapsulation layer away from the dam to form a stop groove; Preferably, part of the first organic encapsulation layer is located in the blocking groove; Preferably, before the step of preparing the second organic encapsulation layer on one side of the substrate, the method further comprises: preparing a first inorganic encapsulation layer on the substrate and the dam; Preferably, the step of preparing a second organic encapsulation layer on one side of the substrate comprises: preparing a second organic encapsulation layer on the first inorganic encapsulation layer; Preferably, the step of preparing the first organic encapsulation layer on a side of the second organic encapsulation layer away from the dam comprises: preparing a first organic encapsulation layer on the first inorganic encapsulation layer; Preferably, before bending the display panel at the position of the second organic encapsulation layer, the method further comprises: preparing a second inorganic encapsulation layer on a side of the first inorganic encapsulation layer, the first organic encapsulation layer, and the second organic encapsulation layer away from the substrate; Preferably, before bending the display panel at the position of the second organic encapsulation layer, the method further comprises: Etching a lateral groove at an arc-angle bending portion of the display panel, wherein the arc-angle bending portion is located at a corner point of the display panel, and the lateral groove penetrates the substrate, the first inorganic encapsulation layer, the second inorganic encapsulation layer and the dam in a direction perpendicular to the substrate; The step of bending the display panel at the position of the second organic encapsulation layer comprises: The display panel is bent at the position of the second organic encapsulation layer so that the arc-angle bent portions are spliced ​​at the position of the lateral groove to form a seam; Preferably, it also includes: Inject glue and fix at the joint position; Preferably, it also includes: Performing packaging deposition to form the packaging deposition layer, wherein the packaging deposition layer covers a portion of the joint; Preferably, the encapsulation deposition layer completely covers the seam; Preferably, performing encapsulation deposition to form the encapsulation deposition layer includes: Atomic layer deposition is performed to form the packaging deposition layer.

10. A display device, characterized in that: A display panel comprising any one of claims 1 to 7; Alternatively, it comprises a display panel prepared by the method for preparing a display panel according to claim 8 or 9.

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