Crack expansion method and laser fragmentation method of solid material

Abstract

The invention relates to a crack propagation method and a laser fragmentation method of a solid material, and the crack propagation method comprises the following steps: a pre-fixing process: respectively arranging fixed areas on two sides of a modified layer of the solid material obtained by laser modification; and applying force to at least one fixed area, and introducing mechanical stress into the crack expansion process of the modified layer, the laser fragmentation method comprises the following steps: a stripping process of forming a modified layer in a solid material by using laser; a crack propagation process of stripping the solid material with the modified layer by using the crack propagation method; and the residual solid is treated through grinding, laser and crack propagation in sequence. According to the crack propagation method, the two sides of the modified layer are mechanically controlled to generate relative movement, so that the crack is promoted to expand according to the preset mode, the stripping force is reduced, and the crack propagation method has the advantages of simple steps and convenience in subsequent stripping and is suitable for automatic continuous production; the laser fragmentation method has the advantage of high stripping efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, and in particular to a crack extension method and a laser slicing method for solid materials. Background Art

[0002] At present, there are two commonly used methods for producing wafers, namely diamond wire saw slicing technology and laser slicing technology. Although diamond wire saw slicing technology can obtain high-yield wafers, for expensive materials such as silicon carbide, each diamond wire causes a material cut loss thickness of more than 180μm, and the diamond wire is seriously damaged. In addition, the mechanical vibration and stress generated during the diamond wire saw process will cause a large number of scratches and cracks on the surface of the wafer. Mechanical damage such as mechanical damage needs to be further removed. The surface layer with a total thickness of about 150μm needs to be further removed to eliminate the impact of the process. Laser slicing technology uses laser slicing technology to focus the pulsed laser on the cutting surface parallel to the base surface. Local transient high temperature produces high-density dislocations, forming a very thin (<50μm) modified layer mixed with amorphous silicon, amorphous carbon and amorphous silicon carbide, and then separates the wafer from the ingot with the help of external force. Therefore, compared with diamond wire saw slicing technology, laser modified slicing technology has the advantages of high efficiency and low loss, but a reliable separation method is required to ensure the efficiency of wafer separation.

[0003] A Chinese patent with authorization announcement number CN109570783B discloses a method and device for laser processing wafers, the method comprising the following steps: shaping a first laser beam to form a sheet-like explosion point in a preset area inside the wafer, moving a workbench on which the wafer is placed and evenly covering the sheet-like explosion point on a preset plane of the wafer to form a whole plane explosion point, at a corresponding height of the preset plane, cutting a peeling area generated after the whole plane explosion point along the side surface of the wafer by a second laser beam, applying a tangential pulling force to both ends of the entire wafer along the peeling area to separate the wafer; the device uses a suction cup evenly provided with small suction nozzles as a separation system so that it can evenly apply a tangential pulling force to the wafer surface, so that it can match the best spot combination array with a preset pattern according to the characteristics of the third-generation semiconductor material, and then separate the semiconductor substrate into multiple pieces by the action of the laser inside the wafer.

[0004] Since the bonding force between the existing suction cup and the surface of the wafer is relatively small, the force generated by its vacuum adsorption is much smaller than the tensile force required for actual wafer peeling, which results in the above method being unable to directly separate the wafer processed by the first laser beam. It is necessary to use the second laser beam to cut the peeling area first, and then use the suction cup to separate it. For laser modification and cutting, the thickness of the peeling area after damage is usually within 100μm, and it is difficult to align and cut on the side of the wafer, which increases the time cost of the early processing and seriously affects the processing efficiency. Therefore, the existing wafer peeling process usually uses an adhesive material with stronger connecting force instead of a suction cup for bonding and fixing, or reduces the strength of the modified layer through auxiliary means, so that the adsorption force on the wafer is compatible with the tensile force required for actual wafer peeling, thereby reducing the difficulty of peeling.

[0005] A Chinese patent with publication number CN111106032A discloses a chip generating device, comprising an ingot grinding unit, a laser irradiation unit, a chip stripping unit, a tray, a conveyor unit and an ingot storage device; the chip stripping unit comprises a third holding workbench and a chip stripping component, the third holding workbench holds the ingot, the chip stripping component holds the upper surface of the ingot held by the third holding workbench and strips the chip from the modified layer; and, in the chip stripping component, an arm moving component is used to lower the arm so that the lower end of the side wall is in close contact with the upper surface of the third holding workbench holding the ingot with the modified layer formed thereon, and the piston rod of the cylinder is lowered so that the adsorption sheet is adsorbed on the upper surface of the ingot, and then after the liquid is stored in the liquid storage space, the ultrasonic vibration generating component is operated to impart ultrasonic vibration to the ingot, thereby further reducing the strength of the modified layer.

[0006] Although the above method also uses an adsorption sheet to adsorb the wafer to fix it, it places the entire ingot in a liquid environment, applies ultrasonic action to reduce the strength of the modified layer as an auxiliary means to reduce the difficulty of stripping, and then controls the adsorption sheet to rise through a cylinder to directly separate the wafer processed by the first laser beam. In the process of applying ultrasonic action, since the premise of reducing the difficulty of stripping is that the strength of the modified layer needs to be reduced to below the adsorption force through ultrasonic action, if the internal cracks of the modified layer obtained by laser modification are not uniform and smooth, the ultrasonic time needs to be adaptively extended. The above method lacks the relationship between the ultrasonic parameters and the strength of the modified layer, and also lacks the standard for evaluating whether the stripping strength is lower than the adsorption force, which limits the processing efficiency and consistency of the processing quality of the stripping process. In addition, the method of applying ultrasonic action in a liquid environment will increase the complexity of the stripping device and there is a risk of liquid leakage, which needs to be improved. Summary of the invention

[0007] In view of the shortcomings of the prior art, the first purpose of the present invention is to provide a crack extension method for solid materials, which mechanically controls the relative movement of the two sides of the modified layer to promote the crack to expand in a predetermined manner and reduce the peeling force. It solves the problems of complex processing methods and low peeling efficiency caused by the original secondary laser processing or ultrasonic-assisted reduction of peeling force. It has the advantages of simple steps and easy subsequent peeling, and is suitable for automated continuous production.

[0008] A second object of the present invention is to provide a laser slicing method for solid materials, which has the advantage of high stripping efficiency.

[0009] To achieve the above first object, the present invention provides the following technical solutions: A method for crack propagation of a solid material, comprising: A pre-fixing process of setting fixing areas on both sides of the modified layer of the solid material obtained by laser modification; and A force is applied to at least one fixed area and mechanical stress is introduced into the crack propagation process of the modified layer.

[0010] Specifically, in the crack extension method of the present invention, the specific meaning of "laser modification" refers to the use of a laser beam of a specific wavelength to focus on the inside of a solid material to produce a local deformation layer, i.e., a modified layer; the modified layer is mainly composed of a high dislocation density layer and cracks, and the modified layer is the starting point for subsequent crack extension. The modified layer can be confined to the inside of the solid material by optimizing the laser and optical path system, without causing thermal damage to the surface of the solid material, and then the crack is guided toward the peripheral surface and / or end surface of the solid material by external force, thereby separating the solid material into required sizes; The specific meaning of "solid material" refers to a combination of one or more of single crystal, polycrystalline and amorphous materials, preferably a material containing at least one element of Group IIIA elements, Group IVA elements, Group VA elements and Group IIB elements of the periodic table, and can be, for example, silicon Si, silicon carbide SiC, silicon nitride Si3N4, silicon oxide SiO2, silicon germanium SiGe, germanium Ge, gallium arsenide GaAs, gallium nitride GaN, indium phosphide InP, indium arsenic antimony InAlSb, zinc oxide ZnO, aluminum nitride AlN, gallium trioxide Ga2O3, aluminum oxide Al2O3, gallium phosphide GaP, indium arsenide InAs, indium nitride InN, aluminum arsenide AlAs, diamond, cubic boron nitride CBN , magnesium silicate Mg2SiO4, lead titanate PbTiO3, barium titanate BaTiO3, lithium niobate LiNbO3, Al2O3CrNd glass, cadmium telluride CdTe, tungsten oxide WO3, zinc ferrite ZnFe2O, gamma iron oxide γ-Fe2O3, strontium ferrite SrO·6Fe2O3, cadmium sulfide CdS, calcium polysulfide Ca2Sx, vanadium oxide VO2, nickel oxide NiO, lanthanum boride LaB6, barium oxide BaO, lead magnesium niobate PMN, barium titanate BaTiO3, lithium titanate LiTiO3, yttrium aluminum garnet YAG, lithium niobate LiNbO3, gallium phosphate GaPO4, calcium titanate CaTiO3, rare earth ketoate YBa2Cu3O7, and / or metal materials, etc.; The specific meaning of "fixed area" refers to the area formed by the conflicting part on the surface of the solid material by installing the solid material by fastener fixation, welding fixation, crimping fixation (interference fit), riveting fixation, shrink sleeve fixation, cold expansion fixation, clamping fixation, bonding fixation, magnetic adsorption, and / or vacuum adsorption. The conflicting part of this area can be a whole area of ​​continuous conflict or a dispersed area of ​​intermittent conflict. The size and shape of this area and other factors will affect the interaction force between objects in the subsequent crack propagation process; The specific meaning of "force application" refers to the pulling force, tension, pressure, thrust, supporting force, power, resistance, centripetal force, restoring force, gravity, elastic force, magnetic force, nuclear force, friction force, and / or shear force applied to the solid material through the above-mentioned fixed area, wherein the force application method is not limited, for example, it can be continuous force application, or intermittent force application, etc., the force application size is not limited, for example, it can be constant, regularly changing, or irregularly changing, etc., and the force application direction is not limited, for example, it can be a straight line direction, a broken line direction, a circular direction, a curved line direction, and / or a spiral direction that is approximately parallel, perpendicular and / or intersecting with the plane where the modified layer is located; The specific meaning of "mechanical stress" is that when an object is deformed due to the above-mentioned force, an internal force of interaction is generated between the various parts of the fixed material to resist the action of the above-mentioned force and try to restore the fixed material from the position after deformation to the position before deformation, so that based on the laser modified points of the modified layer, an extended crack can be formed that is approximately perpendicular to the plane where the modified layer is located and connects adjacent laser modified points.

[0011] Furthermore, the pre-fixing process includes installing the end of the solid material obtained by laser modification away from the modified layer on the fixed surface of the positioning fixture; moving the stripping fixture forward along the first direction until the fixed surface of the stripping fixture contacts the end of the solid material close to the modified layer; wherein the first direction is approximately perpendicular to the plane where the modified layer is located.

[0012] Furthermore, during the pre-fixing process, the positioning fixture and the stripping fixture collide with each other on the surface of the solid material to form a fixing area, and the edge of the fixing area is controlled to exceed the edge of the solid material by more than 0.1 mm.

[0013] Furthermore, in the pre-fixing process, the fixing surfaces of the positioning fixture and the stripping fixture are independently provided with one or a combination of fixing parts selected from the group consisting of clamping parts, bonding parts, magnetic adsorption parts, and vacuum adsorption parts.

[0014] Furthermore, during the pre-fixing process, the fixing member includes a plurality of medium channels opened in the positioning fixture or the stripping fixture, and a plurality of suction ports opened on the fixing surface of the positioning fixture or the stripping fixture and connected to the medium channels. Preferably, the fixing surface of the positioning fixture or the stripping fixture is composed of a flexible material, such as, but not limited to, a plasticized rubber-coated material such as rubber or sponge, so that the fixing surface of the positioning fixture or the stripping fixture directly contacts the surface of the solid material and performs vacuum adsorption fixation; or, a suction cup is provided on the suction port so that the suction cup directly contacts the surface of the solid material and performs vacuum adsorption fixation.

[0015] Alternatively, during the pre-fixing process, the fixing member includes a plurality of medium channels opened in the positioning fixture or the stripping fixture, and a bonding member opened on the fixing surface. Preferably, the bonding member can be, for example, a hot melt bonding sheet, a thermoplastic glue coating, a resin adhesive layer, etc., so as to directly contact the surface of the solid material through the suction cup and perform temperature-controlled bonding and fixing.

[0016] Specifically, the medium channel includes a plurality of mutually connected concentric circular channels, and a medium inlet and a medium outlet connected to the concentric circular channels, wherein the medium channels are mutually nested and are in the shape of mutually disconnected concentric circles. The concentric circles may be an annular channel structure with a smooth inner wall, or may be an annular channel structure formed by a plurality of dispersedly arranged cavities connected to each other.

[0017] More specifically, for the vacuum adsorption fixation method, the negative pressure medium of the medium channel is air; the medium inlet of the medium channel is connected to an air compressor, and a control valve is provided on the medium inlet of the medium channel; the medium outlet of the medium channel is connected to a vacuum pump and / or a vacuum generator, and a control valve is provided on the medium outlet of the medium channel.

[0018] Alternatively, for the temperature-controlled bonding and fixing method, the heating medium of the medium channel is hot water, hot oil or hot air, the emptying medium is compressed air, and the cooling medium is cold water or cold air; the three medium inlets of the medium channel are respectively connected to containers with heating medium, emptying medium and cooling medium, and control valves are respectively provided on the three medium inlets of the medium channel; the two medium outlets of the medium channel are respectively connected to containers with heating medium and cooling medium, and the two medium inlets of the medium channel are respectively provided with the control valves.

[0019] Specifically, the two ends of the solid material are respectively mounted on these fixing parts to form the above-mentioned fixed area by abutting against each other, and the fixed partitions can be divided according to the medium channel. The fixing parts can be, for example, non-limitingly, modified coatings, clamps, quick clamps, clamps, cylinders, hydraulic cylinders, water-soluble medium coatings, hot-melt adhesive sheets, thermoplastic glue coatings, resin adhesive layers, light-curing resin coatings, electromagnets, magnetic seats, vacuum suction cups, etc., which are used to increase the friction and / or deformation of the fixed surface. In addition, for the positioning fixture, a limit fixture can be further set on its fixed surface to ensure that the solid material is coaxially aligned with the axis of the positioning fixture and the stripping fixture, so as to control the installation accuracy of the solid material on the positioning fixture to be within 0.1mm.

[0020] Furthermore, in the pre-fixing process, each fixed area independently includes a plurality of fixed partitions, and two adjacent fixed partitions are controlled in parallel or in series.

[0021] Furthermore, during the pre-fixing process, the orthographic projections of these fixed partitions on the plane where the modified layer is located independently present one or a combination of circular, semicircular, fan-shaped, annular, curved, straight, broken line and polygonal shapes.

[0022] Furthermore, during the pre-fixing process, the connection lines between the fixed partitions on both sides of the modified layer are independently in the shape of one or a combination of parallel lines, grid lines, concentric circles and spiral lines.

[0023] Specifically, the parallel control or series control is implemented by independently or in conjunction with adjusting the friction force, deformation, clamping force of the clamping member, adhesion of the bonding member (condensation, thermal curing, or light curing, etc.), magnetism of the magnetic adsorption member (electromagnetic, magnetization / demagnetization, etc.), and vacuum degree of the vacuum adsorption member, so that after the fixed member contacts the surface of the solid material, it can drive the two ends of the solid material to move relative to each other. This movement mode can be a situation where the two sides of the modified layer are driven to move relative to each other by fixed contact such as clamping, bonding, and adsorption, and / or a situation where the two sides of the modified layer are driven to move relative to each other by non-fixed contact such as friction, pulling force, tension, pressure, and thrust, that is, during the crack propagation process, the fixed area and the fixed material surface can be relatively static or relatively moving.

[0024] Furthermore, the crack expansion process includes applying force to the positioning fixture and / or the stripping fixture along a first direction, around the first direction, and / or along a second direction until the crack on the modified layer expands and connects two adjacent laser modified points; wherein the first direction is approximately perpendicular to the plane where the modified layer is located, and the second direction is approximately parallel to the plane where the modified layer is located.

[0025] Specifically, in the process of extending the crack, the force application method for the positioning fixture and / or the stripping fixture includes one or more of the following force application methods: driving the positioning fixture or the stripping fixture to move unidirectionally or reciprocatingly along the first direction, driving the positioning fixture and the stripping fixture to move unidirectionally or reciprocatingly in the opposite direction along the first direction, driving the positioning fixture or the stripping fixture to rotate unidirectionally or reciprocatingly around the first direction, driving the positioning fixture and the stripping fixture to rotate unidirectionally or reciprocatingly in the opposite direction around the first direction, driving the positioning fixture or the stripping fixture to move unidirectionally or reciprocatingly along the first direction, and driving the positioning fixture and the stripping fixture to move unidirectionally or reciprocatingly in the opposite direction along the first direction. That is to say, in the process of extending the crack, the crack in the modified layer can be forced to extend by applying force in a unidirectional manner, reciprocatingly, twisting after applying a resistance pressure, twisting while applying a resistance pressure, or twisting the solid material while moving.

[0026] Furthermore, during the crack extension process, the resistance pressure on the fixed area is controlled not to exceed 10000 N. Part of the resistance pressure on the fixed area comes from the gravity of the positioning fixture and / or the stripping fixture, and the other part comes from the pressure applied by moving the stripping fixture in the first direction. Specifically, the stripping fixture can be fed by mechanical drive such as electric drive, magnetic drive, pneumatic drive, and / or hydraulic drive, or by a single machine manual auxiliary drive.

[0027] Furthermore, the crack extension process also includes applying vibration to the positioning fixture and / or the stripping fixture while applying force to the positioning fixture and / or the stripping fixture. This method can assist the twisting operation to extend the crack, and the vibration source is an ultrasonic vibrator, a vibration motor, etc.

[0028] Furthermore, the crack extension method also includes a peeling process of separating the solid part from the solid material along the crack extending along the modified layer.

[0029] Furthermore, the stripping process includes moving the stripping clamp in the opposite direction along the first direction until the modified layer of the solid material is separated, and after the stripping is completed, post-processing is performed to obtain a solid part and a remaining solid; wherein the first direction is approximately perpendicular to the plane where the modified layer is located.

[0030] Preferably, the crack extension method comprises the following steps: S1 pre-fixation, first open the positioning fixture, and install the end of the solid material obtained by laser modification away from the modified layer on the fixed surface of the positioning fixture by vacuum adsorption, and then move the stripping fixture forward along the first direction until the fixed surface of the stripping fixture contacts the end of the solid material close to the modified layer; S2: Crack expansion, firstly, the stripping fixture is moved forward along the first direction, so that the stripping fixture contacts the surface of the solid material to form a fixed area with a contact pressure of 100-10000N, and then the stripping fixture is reciprocated around the first direction, and a torque of 10-100N·m is applied each time, and maintained for 1-10s, and reciprocated 2-20 times, until the crack on the modified layer is expanded and connects two adjacent laser modified points; S3 peeling, first open the peeling fixture, and install the end of the solid material close to the modified layer on the fixed surface of the peeling fixture by vacuum adsorption, then move the peeling fixture in the opposite direction along the first direction, and control the moving speed of the peeling fixture to be 0.01-0.50 mm / s until the modified layer of the solid material is separated, and after the peeling is completed, post-processing is performed to obtain the solid part and the remaining solid; The first direction is approximately perpendicular to the plane where the modified layer is located, and the second direction is approximately parallel to the plane where the modified layer is located.

[0031] In the specific crack propagation process, the displacement parameter of the stripping fixture relative to the solid material is related to the line spacing between two adjacent laser modified points on the modified layer, and the maximum is about 1 / 2 of the line spacing value. In order to ensure the maximum displacement, the positioning fixture and / or the stripping fixture can be further provided with a limit fixture on its fixed surface. In addition, when the relative displacement reaches about 1 / 2 of the spacing between the modified points, it can be regarded that the peeling strength has been lower than the maximum adsorption force of the vacuum adsorption part. At the same time, the concrete standard for the crack to expand to the predetermined crack is the disappearance of the color pattern of the modified layer obtained by laser modification.

[0032] To achieve the above second purpose, the present invention provides the following technical solutions: A laser slicing method for solid materials, comprising: The exfoliation process using lasers to form modified layers within solid materials; The crack extension process of the solid material with the modified layer is peeled off by the above-mentioned crack extension method to obtain a solid part and a remaining solid; The remaining solid is processed sequentially through grinding, laser and crack extension processes, which are cycled multiple times to obtain multiple solid parts.

[0033] Furthermore, the specific implementation of the method is: The first laser focuses the laser beam to a position inside the solid material at a predetermined separation thickness from the surface, and forms a modified layer for crack extension by scanning; In the first crack extension, the solid material with the modified layer is subjected to pre-fixation, crack extension and stripping treatments in sequence to obtain a solid part and a remaining solid; The N-1th grinding is to grind the remaining solid obtained by the N-1th crack expansion to obtain the remaining solid after removing the surface modification layer; wherein N is an integer ≥ 2; The Nth laser focuses the laser beam to a position inside the remaining solid obtained by the N-1th grinding at a predetermined separation thickness from the surface, and forms a modified layer for crack extension by scanning; After the Nth crack extension, the remaining solid obtained by the Nth laser treatment is placed between a positioning fixture and a stripping fixture, and then subjected to pre-fixation, crack extension and stripping treatments in sequence to obtain a solid part and a remaining solid.

[0034] In summary, the beneficial technical effects of the present invention are: 1. The crack extension method of the present invention utilizes the friction force on the fixed area to drive the two sides of the modified layer of the solid material to move relative to each other, so as to generate axial and / or tangential stress in the modified layer, and force the cracks on the modified layer to extend to connect adjacent modified points, thereby reducing the bonding force of the modified layer to below the adsorption force required by the original vacuum suction cup, and then directly performing mechanical stretching and peeling, which solves the problems of complex processing methods and low peeling efficiency caused by the original secondary laser processing or ultrasonic-assisted reduction of peeling force, has the advantages of simple steps and convenience for subsequent peeling, and is suitable for automated continuous production; 2. The crack propagation method of the present invention uses the relevant clamping parts and limiting fixtures in the fixed area to limit the position, which can avoid the problem of the crystal ingot bumping due to the vibration of the positioning fixture or the stripping fixture during the stripping process; 3. The crack extension method of the present invention is to set a plasticized rubber coating treatment material such as rubber or sponge on the fixed surface of the positioning fixture or the stripping fixture. This flexible material has a certain deformation amount, which can ensure the safety and leveling effect during adsorption; 4. The crack extension method of the present invention extends the crack by combining the screwing and moving operations, eliminating the complex ultrasonic auxiliary mechanism and laser auxiliary cutting device, making the system simpler and more conducive to automation; 5. The laser slicing method of the present invention has the advantage of high stripping efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a flow chart of the crack propagation method provided in Example 1 of the present invention.

[0036] Figure 2 It is a schematic diagram of the connection relationship between the positioning fixture, the limiting tooling, the solid material and the stripping fixture of Example 1 of the present invention.

[0037] Figure 3 Schematic diagram of the connection relationship between the stripping clamp and the medium channel of Example 2 of the present invention.

[0038] Figure 4 It is a schematic diagram of the connection relationship between the peeling clamp and the suction port of Example 3 of the present invention.

[0039] Figure 5 It is a schematic diagram of the structure of the solid material during the crack extension process of Example 4 of the present invention.

[0040] In the figure, 1. screw drive device; 2. stripping fixture; 3. solid part; 4. modified layer; 41. laser modified point; 5. remaining solid; 6. limit tooling; 7. positioning fixture; 8. fixing part; 81. medium channel; 811. concentric circle channel; 812. medium inlet; 813. medium outlet; 82. adsorption port. DETAILED DESCRIPTION

[0041] In order to make the technical means, creative features, objectives and functions achieved by the present invention clearer and easier to understand, the present invention is further explained below in conjunction with the accompanying drawings and specific implementation methods.

[0042] Embodiment 1: A laser slicing method for solid materials disclosed in the present invention, comprising: The first laser focuses the laser beam to a position inside the solid material at a predetermined separation thickness from the surface, and forms a modified layer 4 for crack extension by scanning; In the first crack extension, the solid material with the modified layer 4 is subjected to pre-fixation, crack extension and peeling treatments in sequence to obtain a solid part 3 and a remaining solid 5; The N-1th grinding is to grind the remaining solid 5 obtained by the N-1th crack extension to obtain the remaining solid 5 with the surface modified layer 4 removed; wherein N is an integer ≥ 2; The Nth laser focuses the laser beam to a position inside the remaining solid 5 obtained by the N-1th grinding at a predetermined separation thickness from the surface, and forms a modified layer 4 for crack extension by scanning; After the Nth crack expansion, the remaining solid 5 obtained by the Nth laser is placed between the positioning fixture 7 and the stripping fixture 2, and then undergoes pre-fixation, crack expansion and stripping processes in sequence to obtain the solid part 3 and the remaining solid 5.

[0043] Reference Figure 1 and Figure 2 The present invention also discloses a crack propagation method for a solid material, comprising: S1 is a pre-fixing process of setting a fixing area on both sides of the modified layer 4 of the solid material obtained by laser modification; wherein, The end of the solid material obtained by laser modification away from the modified layer 4 is mounted on the fixed surface of the positioning fixture 7; The stripping clamp 2 is moved forwardly along the first direction by screwing the driving device 1 until the fixed surface of the stripping clamp 2 contacts the end of the solid material close to the modified layer 4; The positioning fixture 7 and the stripping fixture 2 collide with each other on the surface of the solid material to form a fixed area, and the edge of the fixed area is controlled to exceed the edge of the solid material by more than 0.1 mm; The fixing surfaces of the positioning fixture 7 and the peeling fixture 2 are independently provided with a fixing member 8 which is one or a combination of a clamping member, a bonding member, a magnetic adsorption member, and a vacuum adsorption member. In this embodiment, a vacuum suction cup is preferably used as the fixing member 8 for fixing; For the positioning fixture 7, a limit fixture 6 can be further provided on its fixed surface to ensure that the solid material is coaxially aligned with the axis of the positioning fixture 7 and the stripping fixture 2, so as to control the installation accuracy of the solid material on the positioning fixture 7 to be within 0.1 mm; S2 applies force to at least one fixed area and introduces mechanical stress into the crack expansion process of the modified layer 4; wherein, Apply force to the positioning fixture 7 and / or the stripping fixture 2 along the first direction, around the first direction, and / or along the second direction by the screwing driving device 1 until the crack on the modified layer 4 expands and connects two adjacent laser modified points 41; Control the resistance pressure on the fixed area not to exceed 10000N; According to the above force application method, the screw drive device 1 is a combination device of a linear module and a rotary module; While applying force to the positioning fixture 7 and / or the stripping fixture 2, the screwing drive device 1 can apply vibration to the positioning fixture 7 and / or the stripping fixture 2 through an ultrasonic generator; S3 is a peeling process of separating the solid part 3 from the solid material along the cracks extending along the modified layer 4; wherein, The stripping fixture 2 is moved in the reverse direction along the first direction until the modified layer 4 of the solid material is separated, and after stripping, a solid part 3 and a remaining solid 5 are obtained through post-processing; The first direction is approximately perpendicular to the plane where the modified layer 4 is located, and the second direction is approximately parallel to the plane where the modified layer 4 is located.

[0044] Example 2: Reference Figure 3 , which is a crack extension method for solid materials disclosed in the present invention, and is different from Example 1 in that, in the positioning fixture 7 and the stripping fixture 2, the fixing member 8 includes two medium channels 81 opened in the positioning fixture 7 or the stripping fixture 2, and a plurality of adsorption ports 82 opened on the fixing surface of the positioning fixture 7 or the stripping fixture 2 and connected to the medium channels 81. Among them, the fixing surfaces of the positioning fixture 7 and the stripping fixture 2 are made of flat rubber material; the medium channel 81 includes 2 to 3 mutually connected concentric circular channels 811, and a medium inlet 812 and a medium outlet 813 connected to these concentric circular channels 811, and the two medium channels 81 are mutually nested, and the orthographic projections on the modified layer 4 are in the shape of mutually disconnected concentric circles; the orthographic projections of the adsorption ports 82 on the modified layer 4 are circular, and these adsorption ports 82 are evenly distributed along the circumferential direction of the concentric circular channels 811.

[0045] For the vacuum adsorption fixation method, the negative pressure medium of the medium channel 81 is air; the medium inlet 812 of the medium channel 81 is connected to the air compressor, and a control valve is provided on the medium inlet 812 of the medium channel 81; the medium outlet 813 of the medium channel 81 is connected to the vacuum pump and / or the vacuum generator, and a control valve is provided on the medium outlet 813 of the medium channel 81.

[0046] Example 3: Reference Figure 4, which is a crack propagation method for solid materials disclosed in the present invention. The difference from Example 2 is that, in the positioning fixture 7 and the stripping fixture 2, the fixing part 8 includes three medium channels 81 opened in the positioning fixture 7 or the stripping fixture 2, and a plurality of adsorption ports 82 opened on the fixing surface of the positioning fixture 7 or the stripping fixture 2 and connected to the medium channels 81. Among them, the fixing surfaces of the positioning clamp 7 and the stripping clamp 2 are made of flat rubber material; the medium channel 81 includes a concentric channel 811, and a medium inlet 812 and a medium outlet 813 connected to these concentric channels 811, and the three medium channels 81 are mutually nested, and their orthographic projections on the modified layer 4 are in the shape of concentric circles that are not connected to each other; the orthographic projection of the adsorption port 82 on the innermost medium channel 81 on the modified layer 4 is circular, the orthographic projection of the adsorption port 82 on the middle layer of the medium channel 81 on the modified layer 4 is circular, and the orthographic projection of the adsorption port 82 on the outermost medium channel 81 on the modified layer 4 are parallelogram, trapezoid, cross, star, semicircle, triangle, rhombus, hexagon, respectively, and these adsorption ports 82 are evenly distributed along the circumferential direction of the concentric channels 811.

[0047] Example 4: Reference Figure 5 , is a crack propagation method for solid materials disclosed in the present invention, which is different from Example 2 in that: S1 pre-fixation, first open the positioning fixture 7, and install the end of the solid material obtained by laser modification away from the modified layer 4 on the fixed surface of the positioning fixture 7 by vacuum adsorption, and then move the stripping fixture 2 forward along the first direction until the fixed surface of the stripping fixture 2 contacts the end of the solid material close to the modified layer 4; S2: Crack expansion, firstly, the stripping fixture 2 is moved forward along the first direction, so that the stripping fixture 2 contacts the surface of the solid material to form a fixed area with a contact pressure of 500N, and then the stripping fixture 2 is reciprocated around the first direction, and a torque of 20N·m is applied in each forward rotation and maintained for 3s, and a torque of 30N·m is applied in each reverse rotation and maintained for 3s, and this is repeated 10 times until the crack on the modified layer 4 is expanded and connects two adjacent laser modified points 41; S3 peeling, first open the peeling fixture 2, and install the end of the solid material close to the modified layer 4 on the fixed surface of the peeling fixture 2 by vacuum adsorption, then move the peeling fixture 2 in the opposite direction along the first direction, and control the moving speed of the peeling fixture 2 to be 0.05mm / s until the modified layer 4 of the solid material is separated. After the peeling is completed, the solid part 3 and the remaining solid 5 are obtained by post-processing; The first direction is approximately perpendicular to the plane where the modified layer 4 is located, and the second direction is approximately parallel to the plane where the modified layer 4 is located.

[0048] Embodiment 5 is a crack propagation method for a solid material disclosed in the present invention, which is different from Embodiment 2 in that: S1 pre-fixation, first open the positioning fixture 7, and install the end of the solid material obtained by laser modification away from the modified layer 4 on the fixed surface of the positioning fixture 7 by vacuum adsorption, and then move the stripping fixture 2 forward along the first direction until the fixed surface of the stripping fixture 2 contacts the end of the solid material close to the modified layer 4; S2 expands the crack, firstly moves the stripping fixture 2 forward along the first direction, so that the stripping fixture 2 contacts the surface of the solid material to form a contact pressure of 10000N on the fixed area, and then reciprocates the stripping fixture 2 around the first direction, applies a torque of 80N·m for each forward rotation and keeps it for 1s, applies a torque of 30N·m for each reverse rotation and keeps it for 3s, repeats 10 times, until the crack on the modified layer 4 expands and connects two adjacent laser modified points 41; S3 peeling, first open the peeling fixture 2, and install the end of the solid material close to the modified layer 4 on the fixed surface of the peeling fixture 2 by vacuum adsorption, then move the peeling fixture 2 in the opposite direction along the first direction, and control the moving speed of the peeling fixture 2 to be 0.10mm / s until the modified layer 4 of the solid material is separated. After the peeling is completed, the solid part 3 and the remaining solid 5 are obtained by post-processing; The first direction is approximately perpendicular to the plane where the modified layer 4 is located, and the second direction is approximately parallel to the plane where the modified layer 4 is located.

[0049] Embodiment 6: A crack propagation method for a solid material disclosed in the present invention, which is different from Embodiment 2 in that: S1 pre-fixation, first open the positioning fixture 7, and install the end of the solid material obtained by laser modification away from the modified layer 4 on the fixed surface of the positioning fixture 7 by vacuum adsorption, and then move the stripping fixture 2 forward along the first direction until the fixed surface of the stripping fixture 2 contacts the end of the solid material close to the modified layer 4; S2 expands the crack, firstly moves the stripping fixture 2 forward along the first direction, so that the stripping fixture 2 contacts the surface of the solid material to form a fixed area with a contact pressure of 1500N, then reciprocates the stripping fixture 2 around the first direction, applies a torque of 40N·m each time in the forward direction and keeps it for 6s, applies a torque of 60N·m each time in the reverse direction and keeps it for 1s, repeats 5 times, until the crack on the modified layer 4 expands and connects two adjacent laser modified points 41; S3 peeling, first open the peeling fixture 2, and install the end of the solid material close to the modified layer 4 on the fixed surface of the peeling fixture 2 by vacuum adsorption, then move the peeling fixture 2 in the opposite direction along the first direction, and control the moving speed of the peeling fixture 2 to be 0.05mm / s until the modified layer 4 of the solid material is separated. After the peeling is completed, the solid part 3 and the remaining solid 5 are obtained by post-processing; The first direction is approximately perpendicular to the plane where the modified layer 4 is located, and the second direction is approximately parallel to the plane where the modified layer 4 is located.

[0050] Embodiment 7 is a crack propagation method for a solid material disclosed in the present invention, which is different from Embodiment 2 in that: S1 pre-fixation, first open the positioning fixture 7, and install the end of the solid material obtained by laser modification away from the modified layer 4 on the fixed surface of the positioning fixture 7 by vacuum adsorption, and then move the stripping fixture 2 forward along the first direction until the fixed surface of the stripping fixture 2 contacts the end of the solid material close to the modified layer 4; S2 expands the crack, firstly moves the stripping fixture 2 forward along the first direction, so that the stripping fixture 2 contacts the surface of the solid material to form a contact pressure of 3000N on the fixed area, and then reciprocates the stripping fixture 2 around the first direction, applies a torque of 20N·m each time in the forward direction and keeps it for 2s, applies a torque of 10N·m each time in the reverse direction and keeps it for 2s, repeats twice, until the crack on the modified layer 4 expands and connects two adjacent laser modified points 41; S3 peeling, first open the peeling fixture 2, and install the end of the solid material close to the modified layer 4 on the fixed surface of the peeling fixture 2 by vacuum adsorption, then move the peeling fixture 2 in the opposite direction along the first direction, and control the moving speed of the peeling fixture 2 to be 0.50 mm / s until the modified layer 4 of the solid material is separated. After the peeling is completed, the solid part 3 and the remaining solid 5 are obtained by post-processing; The first direction is approximately perpendicular to the plane where the modified layer 4 is located, and the second direction is approximately parallel to the plane where the modified layer 4 is located.

[0051] Embodiment 8 is a crack propagation method for a solid material disclosed in the present invention, which is different from Embodiment 2 in that: S1 pre-fixation, first open the positioning fixture 7, and install the end of the solid material obtained by laser modification away from the modified layer 4 on the fixed surface of the positioning fixture 7 by vacuum adsorption, and then move the stripping fixture 2 forward along the first direction until the fixed surface of the stripping fixture 2 contacts the end of the solid material close to the modified layer 4; S2 expands the crack, firstly moves the stripping fixture 2 forward along the first direction, so that the stripping fixture 2 contacts the surface of the solid material to form a contact pressure of 1500N on the fixed area, and then reciprocates the stripping fixture 2 around the first direction, applies a torque of 10N·m each time in the forward direction and keeps it for 4s, applies a torque of 30N·m each time in the reverse direction and keeps it for 4s, repeats 5 times, until the crack on the modified layer 4 expands and connects two adjacent laser modified points 41; S3 peeling, first open the peeling fixture 2, and install the end of the solid material close to the modified layer 4 on the fixed surface of the peeling fixture 2 by vacuum adsorption, then move the peeling fixture 2 in the opposite direction along the first direction, and control the moving speed of the peeling fixture 2 to be 0.01mm / s until the modified layer 4 of the solid material is separated. After the peeling is completed, the solid part 3 and the remaining solid 5 are obtained by post-processing; The first direction is approximately perpendicular to the plane where the modified layer 4 is located, and the second direction is approximately parallel to the plane where the modified layer 4 is located.

[0052] Embodiment 9 is a crack propagation method for a solid material disclosed in the present invention, which is different from Embodiment 2 in that: S1 pre-fixation, first open the positioning fixture 7, and install the end of the solid material obtained by laser modification away from the modified layer 4 on the fixed surface of the positioning fixture 7 by vacuum adsorption, and then move the stripping fixture 2 forward along the first direction until the fixed surface of the stripping fixture 2 contacts the end of the solid material close to the modified layer 4; S2: Crack expansion, firstly, the stripping fixture 2 is moved forward along the first direction, so that the stripping fixture 2 contacts the surface of the solid material to form a fixed area with a contact pressure of 1000N, and then the stripping fixture 2 is reciprocated around the first direction, and a torque of 60N·m is applied each time in the forward direction and maintained for 5s, and a torque of 80N·m is applied each time in the reverse direction and maintained for 5s, and this is repeated 5 times until the crack on the modified layer 4 is expanded and connects two adjacent laser modified points 41; S3 peeling, first open the peeling fixture 2, and install the end of the solid material close to the modified layer 4 on the fixed surface of the peeling fixture 2 by vacuum adsorption, then move the peeling fixture 2 in the opposite direction along the first direction, and control the moving speed of the peeling fixture 2 to be 0.02mm / s until the modified layer 4 of the solid material is separated. After the peeling is completed, the solid part 3 and the remaining solid 5 are obtained by post-processing; The first direction is approximately perpendicular to the plane where the modified layer 4 is located, and the second direction is approximately parallel to the plane where the modified layer 4 is located.

[0053] Embodiment 10 is a crack propagation method for a solid material disclosed in the present invention, which is different from Embodiment 2 in that: S1 pre-fixation, first open the positioning fixture 7, and install the end of the solid material obtained by laser modification away from the modified layer 4 on the fixed surface of the positioning fixture 7 by vacuum adsorption, and then move the stripping fixture 2 forward along the first direction until the fixed surface of the stripping fixture 2 contacts the end of the solid material close to the modified layer 4; S2 expands the crack, firstly moves the stripping fixture 2 forward along the first direction, so that the stripping fixture 2 contacts the surface of the solid material to form a fixed area with a contact pressure of 100N, then reciprocates the stripping fixture 2 around the first direction, applies a torque of 100N·m each time in the forward direction, and keeps it for 10s, applies a torque of 100N·m each time in the reverse direction, and keeps it for 10s, repeats 10 times, until the crack on the modified layer 4 expands and connects two adjacent laser modified points 41; S3 peeling, first open the peeling fixture 2, and install the end of the solid material close to the modified layer 4 on the fixed surface of the peeling fixture 2 by vacuum adsorption, then move the peeling fixture 2 in the opposite direction along the first direction, and control the moving speed of the peeling fixture 2 to be 0.10mm / s until the modified layer 4 of the solid material is separated. After the peeling is completed, the solid part 3 and the remaining solid 5 are obtained by post-processing; The first direction is approximately perpendicular to the plane where the modified layer 4 is located, and the second direction is approximately parallel to the plane where the modified layer 4 is located.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the present invention, which should be included in the scope of the claims of the present invention.

Claims

1. A method for crack propagation of solid materials, characterized in that: include, A pre-fixing process of setting fixing areas on both sides of the modified layer of the solid material obtained by laser modification; as well as, A force is applied to at least one fixed area and mechanical stress is introduced into the crack propagation process of the modified layer.

2. A crack propagation method for a solid material according to claim 1, characterized in that: The pre-fixing process includes installing the end of the solid material obtained by laser modification away from the modified layer on the fixed surface of the positioning fixture; moving the stripping fixture forward along the first direction until the fixed surface of the stripping fixture contacts the end of the solid material close to the modified layer; wherein the first direction is approximately perpendicular to the plane where the modified layer is located.

3. A crack propagation method for a solid material according to claim 2, characterized in that: In the pre-fixing process, the fixing surfaces of the positioning fixture and the stripping fixture are independently provided with one or a combination of fixing parts selected from the group consisting of clamping parts, bonding parts, magnetic adsorption parts, and vacuum adsorption parts.

4. The method for crack propagation of a solid material according to claim 1, characterized in that: In the pre-fixing process, each fixed area independently includes a plurality of fixed partitions, and two adjacent fixed partitions are controlled in parallel or in series.

5. The method for crack propagation of a solid material according to claim 1, characterized in that: The crack expansion process includes applying force to the positioning fixture and / or the stripping fixture along a first direction, around the first direction, and / or along a second direction until the crack on the modified layer expands and connects two adjacent laser modified points; wherein the first direction is approximately perpendicular to the plane where the modified layer is located, and the second direction is approximately parallel to the plane where the modified layer is located.

6. A method for crack propagation of solid materials according to claim 5, characterized in that: During the crack extension process, the resistance pressure on the fixed area is controlled not to exceed 10000N.

7. The crack propagation method of a solid material according to claim 1, characterized in that: It also includes a peeling process of separating the solid part from the solid material along the cracks extending along the modified layer.

8. A method for crack propagation of solid materials according to claim 7, characterized in that: The stripping process includes moving the stripping fixture in the opposite direction along a first direction until the modified layer of the solid material is separated, and after stripping, post-processing is performed to obtain a solid part and a remaining solid; wherein the first direction is approximately perpendicular to the plane where the modified layer is located.

9. The method for crack propagation of a solid material according to claim 1, characterized in that: The following steps are included: S1 pre-fixation, first open the positioning fixture, and install the end of the solid material obtained by laser modification away from the modified layer on the fixed surface of the positioning fixture by vacuum adsorption, and then move the stripping fixture forward along the first direction until the fixed surface of the stripping fixture contacts the end of the solid material close to the modified layer; S2: Crack expansion, firstly, the stripping fixture is moved forward along the first direction, so that the stripping fixture contacts the surface of the solid material to form a fixed area with a contact pressure of 100-10000N, and then the stripping fixture is reciprocated around the first direction, and a torque of 10-100N·m is applied each time, and maintained for 1-10s, and reciprocated 2-20 times, until the crack on the modified layer is expanded and connects two adjacent laser modified points; S3 peeling, first open the peeling fixture, and install the end of the solid material close to the modified layer on the fixed surface of the peeling fixture by vacuum adsorption, then move the peeling fixture in the opposite direction along the first direction, and control the moving speed of the peeling fixture to be 0.01-0.50 mm / s until the modified layer of the solid material is separated, and after the peeling is completed, post-processing is performed to obtain the solid part and the remaining solid; The first direction is approximately perpendicular to the plane where the modified layer is located, and the second direction is approximately parallel to the plane where the modified layer is located.

10. A laser slicing method for solid materials, characterized in that: include, The exfoliation process using lasers to form modified layers within solid materials; The crack extension process of the solid material with the modified layer is peeled off by the crack extension method according to any one of claims 1 to 9 to obtain a solid part and a remaining solid; The remaining solid is processed sequentially through grinding, laser and crack extension processes, which are cycled multiple times to obtain multiple solid parts.

Images