Automatic quartz wafer arrangement method and system

Abstract

The invention relates to the field of machine vision, in particular to an automatic arrangement method and system for quartz wafers, and the method comprises the steps: collecting a tray image of a quartz wafer tray, and then extracting contour features and quartz wafer data in the tray image, thereby calculating the overlapping degree of the quartz wafers of a plurality of partitions. And if the overlapping degree of any partition is relatively high, controlling the corresponding vibration motor to vibrate for a target duration, thereby separating and paving the overlapped quartz wafers. And then collecting the tray image again and calculating the partition overlapping degree. And circulating the process until the overlapping degrees of the quartz wafers in all the partitions are not greater than a preset threshold value. And then collecting the position and posture characteristics of each quartz wafer at the moment, and finally executing grabbing and wafer arrangement by utilizing the position and posture characteristics of the quartz wafers. The stacking condition of the quartz wafers in the tray can be automatically judged, wafer arrangement is executed under the condition that the quartz wafers are kept flat, and compared with manual shaking, the efficiency is higher, and the wafer arrangement effect is better.

Description

Technical Field

[0001] The invention relates to the field of machine vision, and in particular to an automatic quartz wafer arrangement method and system. Background Art

[0002] In the production process of crystal oscillators, quartz needs to be cut into wafers, and then the wafers need to undergo a series of processing, such as arranging, cleaning, dehydrating, heating, electrode plating, etc., to finally obtain a crystal oscillator. In this process, the messy quartz wafers need to be arranged so that the quartz wafers can be neatly stacked on a fixed tray for subsequent processing.

[0003] The quartz wafers that are placed in a disorderly manner on the tray will be placed on the fixed tray under the grip of the robot. During this process, the quartz wafers may be stacked, and the stacked wafer structure is unstable, which may cause the robot to fail to grab. In this case, manual vibration of the tray is generally used to make the overlapping quartz wafers flat. However, the effect of manual vibration of the tray is not good, and it will also cause the wafer arrangement process to be suspended, reducing the efficiency of wafer arrangement. Summary of the invention

[0004] In view of this, an object of the present invention is to provide a method and system for automatically arranging quartz wafers to solve the problems in the background technology.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: An automatic quartz wafer arrangement method of the present invention comprises the following steps: S11, acquiring a tray image of a first tray for storing quartz wafers, wherein the first tray is used to store quartz wafers before wafer arrangement; S12, performing feature extraction on the quartz wafers in the plurality of partitions in the tray image to obtain contour features and the number of quartz wafers in each partition in the tray image; S13, calculating the overlap of each partition based on the contour features of each partition and the number of quartz wafers, and when there is a target partition with an overlap greater than a preset overlap threshold, controlling the vibration motor corresponding to the target partition to vibrate for a target duration, and returning to step S12 until the overlap of all partitions is not greater than the preset overlap threshold, wherein a plurality of vibration motors are preset at the bottom of the first tray, and each vibration motor is used to vibrate a partition; S14, when the overlap of all partitions is not greater than a preset overlap threshold, constructing the position and posture features of each quartz wafer based on the contour features of the tray image; S15, based on the position and posture characteristics of each quartz wafer, controlling the robot arm to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement, wherein the second tray is used to store the quartz wafers after wafer arrangement.

[0006] In one embodiment of the present application, feature extraction is performed on the quartz wafers of the multiple partitions in the tray image to obtain the contour features and the number of quartz wafers of each partition in the tray image, including: Converting the tray image into a grayscale image; Performing threshold segmentation on the grayscale image to obtain a binary image; Extracting contour features from the binary image, and extracting convex right-angle features from the contour features, wherein the convex right-angle features are composed of two perpendicular straight line contours, and the inner side of the convex right-angle features is a quartz wafer area; All the convex right-angle features are traversed, and all the convex right-angle features are classified based on the reference size of the pre-built quartz wafer outline template to obtain the number of quartz wafers.

[0007] In one embodiment of the present application, all convex right-angle features are classified based on the reference size of the pre-constructed quartz wafer outline template to obtain the number of quartz wafers, including: S21, extracting the vertex of each convex right-angle feature; S22, take one of the undivided vertices as the reference point ; When there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the long side of the rectangle; when there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the short side of the rectangle; when there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the diagonal of the rectangle, where is the reference length of the long side of the quartz wafer outline template, is the reference length of the short side of the quartz wafer outline template, is the diagonal reference length of the quartz wafer outline template, is the distance threshold; S23, aligning the target point and the reference point with a pre-constructed quartz wafer outline template, and dividing the reference point where the corresponding convex right-angle feature overlaps with the pre-constructed quartz wafer outline template into the same quartz wafer outline as the target point; S24, return to step S22, until all vertices are divided, and the division results and the number of quartz wafers are obtained.

[0008] In one embodiment of the present application, the overlap of each partition is calculated based on the contour features of each partition and the number of quartz wafers, including: Calculate the number of pixels within the outline feature to obtain the total projection area of ​​the quartz wafer in each partition ,in, is the partition number; The total projected area of ​​the quartz wafer based on each partition And the number of quartz crystals in each partition Calculate the overlap of each partition , where the overlap of each partition is The mathematical expression is:

[0009] In the formula, Reference area for the pre-built quartz wafer outline template.

[0010] In one embodiment of the present application, the position and posture features of each quartz wafer are constructed based on the contour features of the tray image, including: Segmenting the contour of each quartz wafer based on the division result when the overlap of all partitions is not greater than a preset overlap threshold; For the outline of the quartz wafer obtained by segmentation and having complete vertices, determine its diagonal line and the diagonal vertex; For the contour of the quartz wafer obtained by segmentation and having incomplete vertices, the diagonal line and the diagonal vertex thereof are determined by referring to the pre-built quartz wafer contour template; The diagonal vertex is used as the position of the quartz wafer, and the diagonal line is used as the posture feature of the quartz wafer.

[0011] In one embodiment of the present application, based on the position and posture characteristics of each quartz wafer, the robot arm is controlled to grab the quartz wafers from the first tray to the second tray one by one for wafer arrangement, including: Determine the position coordinates of each quartz crystal, and select the quartz crystal of the current position according to the set order; Control the robot arm to move to the horizontal position of the position coordinates of the quartz wafer at the current position, and then control the robot arm to move downward to a first target height so that the suction cup at the end of the robot arm is directly opposite to the quartz wafer at the current position; Control the suction cup at the end of the robotic arm to suck up the quartz wafer at the current position, then control the robotic arm to move upward to a first target height, and then control the robotic arm to move to the target position coordinates of the second tray; Rotating the mechanical arm to rotate the quartz wafer to a target posture, and then controlling the mechanical arm to move downward to a second target height until the quartz wafer is placed in the groove of the second tray; Return the robot arm to its original position and return to select the quartz wafer in the current position according to the set order.

[0012] In one embodiment of the present application, before controlling the robot arm to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement based on the position and posture characteristics of each quartz wafer, the method further includes: constructing a coordinate system of the first pallet and a coordinate system of the second pallet; The coordinate system of the first pallet and the coordinate system of the second pallet are coordinated based on the robot arm.

[0013] In one embodiment of the present application, a unified coordinate system is constructed based on the coordinate system of the first pallet and the coordinate system of the second pallet, including: Taking the coordinate system of the first pallet as a reference coordinate system, and controlling the robot arm to align with the origin of the reference coordinate system; Control the robot arm to move horizontally to the origin of the coordinate system of the second pallet, and record the horizontal axis displacement and the vertical axis displacement; The horizontal axis displacement and the vertical axis displacement are compensated to the coordinate system of the second pallet to unify the coordinate system.

[0014] In one embodiment of the present application, it also includes: An image of the second pallet is acquired, and the image of the second pallet is synchronized to the monitoring display.

[0015] The present application also provides an automatic quartz wafer arrangement system, comprising: An acquisition module, used to acquire a tray image of a first tray for storing quartz wafers, wherein the first tray is used to store quartz wafers before wafer arrangement; A first feature extraction module is used to extract features of the quartz wafers in the plurality of partitions in the tray image to obtain contour features and the number of quartz wafers in each partition in the tray image; A vibration control module, configured to calculate the overlap of each partition based on the contour features of each partition and the number of quartz wafers, and when there is a target partition whose overlap is greater than a preset overlap threshold, control the vibration motor corresponding to the target partition to vibrate for a target duration, and return to the first feature extraction module until the overlap of all partitions is no greater than the preset overlap threshold, wherein a plurality of vibration motors are preset at the bottom of the first tray, and each vibration motor is used to vibrate one partition; A second feature extraction module is used to construct the position and posture features of each quartz wafer based on the contour features of the tray image when the overlap of all partitions is not greater than a preset overlap threshold; The wafer arrangement control module is used to control the robot arm to grab the quartz wafers from the first tray one by one and arrange them in the second tray based on the position and posture characteristics of each quartz wafer, wherein the second tray is used to store the quartz wafers after arrangement.

[0016] The beneficial effects of the present invention are as follows: an automatic quartz wafer arrangement method and system of the present invention collects a tray image of a quartz wafer tray, and then extracts contour features and quartz wafer data in the tray image, thereby calculating the overlap of quartz wafers in multiple partitions. If the overlap of any partition is high, the corresponding vibration motor is controlled to vibrate the target duration, thereby separating and flattening the overlapping quartz wafers. Then the tray image is collected again and the partition overlap is calculated. The above process is repeated until the overlap of the quartz wafers in all partitions is no greater than a preset threshold. Then the position and posture features of each quartz wafer are collected at this time, and finally the position and posture features of the quartz wafer are used to perform grabbing and arrangement. The present application can automatically determine the stacking of quartz wafers in the tray, and perform arrangement while keeping the quartz wafers flat. Compared with manual jitter, it is more efficient and has a better arrangement effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be further described below in conjunction with the accompanying drawings and embodiments: Figure 1 It is an application scenario diagram shown in an embodiment of the present application; Figure 2 This is a schematic diagram of the film arrangement results in this application; Figure 3 It is a flow chart of an automatic quartz wafer arrangement method shown in one embodiment of the present application; Figure 4 is a schematic diagram of the outline of overlapping quartz wafers in one embodiment of the present application; Figure 5 It is a structural diagram of an automatic wafer arrangement system for quartz wafers shown in one embodiment of the present application. DETAILED DESCRIPTION

[0018] The following describes the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0019] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show the layers related to the present invention rather than being drawn according to the number, shape and size of the layers in actual implementation. In actual implementation, the type, quantity and proportion of each layer may be changed arbitrarily, and the layer layout may also be more complicated.

[0020] In the following description, numerous details are discussed to provide a more thorough explanation of embodiments of the present invention; however, it is apparent to one skilled in the art that embodiments of the present invention may be practiced without these specific details.

[0021] Figure 1 is an application scenario diagram shown in an embodiment of the present application, such as Figure 1 As shown in the figure, the crystal oscillator production process needs to go through the wafer arrangement process, which is to arrange the cut quartz wafers from a disordered state to an ordered state. Figure 2 This is a schematic diagram of the film arrangement results in this application, such as Figure 2 As shown, the quartz wafers after arranging are neatly stacked in a tray or fixed tooling to facilitate the subsequent cleaning, dehydration, heating, electrode plating and other processes.

[0022] like Figure 1 As shown, in this application, a robot arm 11 is used to complete the wafer arrangement work. A CCD industrial camera 12 is provided on the robot arm 11, and the CCD industrial camera 12 takes pictures of the wafers in the first tray 14. The CCD industrial camera 12 sends the captured images to the background host. After feature extraction and overlap calculation, the background host controls the patch vibration motor 16 at the bottom of the first tray 14 to vibrate and break up the stacked wafers in the first tray 14. Under the action of gravity, the wafers are laid flat in the first tray 14. After the vibration is completed, the suction cup 13 at the bottom of the robot arm 11 is used to grab the wafers in the first tray 14 and place them in the second tray 15 for wafer arrangement. The specific control process is described as follows.

[0023] Figure 3 FIG. 1 is a flow chart of an automatic quartz wafer arrangement method shown in an embodiment of the present application. Figure 3 As shown, an automatic quartz wafer arrangement method of this embodiment may include the following steps: S11, acquiring a tray image of a first tray for storing quartz wafers, wherein the first tray is used to store quartz wafers before wafer arrangement; First, use a CCD industrial camera to photograph the quartz wafer in the first tray. It is worth noting that since the quartz wafer itself is a translucent crystal, there is a large reflection under direct light. In order to avoid the influence of the reflective light spot on the subsequent image processing, this application tries to use heat dissipation light for irradiation and then collect images.

[0024] S12, performing feature extraction on the quartz wafers in the plurality of partitions in the tray image to obtain contour features and the number of quartz wafers in each partition in the tray image; The acquired images are sent to the background host where feature extraction is performed.

[0025] Since this application uses a patch vibration motor to vibrate and break up the quartz wafers stacked in the tray, but the tray area is large, a low-power patch vibration motor is difficult to cover the entire tray, and a high-power patch vibration motor has a large vibration amplitude, which is easy to cause minor damage to the quartz wafers. Therefore, this application adopts a partition + multiple low-power vibration motors solution.

[0026] The purpose of feature extraction is to perform contour segmentation to obtain quartz wafer data and the internal area of ​​the contour, and then calculate the overlap. Therefore, this application mainly extracts contour features and then performs a quantity extraction algorithm on the contour features. The specific algorithm process is as follows: S121, the tray image Convert to grayscale image ; S122, the grayscale image Perform threshold segmentation to obtain a binary image ;Threshold segmentation can effectively filter out background information and retain only the quartz wafer to facilitate subsequent contour extraction.

[0027] S123, extracting contour features in the binary image, and extracting convex right-angle features in the contour features, wherein the convex right-angle features are composed of two perpendicular straight line contours, and the inner side of the convex right-angle features is a quartz wafer area; This application uses a contour detection algorithm to extract contour features, such as the canny operator. Figure 4 FIG. 1 is a schematic diagram of the outline of the overlapping quartz wafers in one embodiment of the present application. Figure 4As shown, since the quartz wafer in this application is rectangular, if the quartz wafers are overlapped, it is difficult to segment the outline of the overlapping quartz wafers in the binary image. The solution of this application is to first extract the convex right angle feature and use the convex right angle feature as the recognition feature of the rectangular outline.

[0028] S124, traverse all the convex right-angle features, and classify all the convex right-angle features based on the reference size of the pre-built quartz wafer outline template to obtain the number of quartz wafers.

[0029] After obtaining the convex right-angle features, all the convex right-angle features are verified using the reference size of the pre-built quartz wafer outline template. It is determined whether the convex right-angle features meet the rectangular distribution of a specific size. If so, they are divided into the same rectangular outline. If not, they are determined to belong to different rectangular outlines. The specific process includes: S1241, extracting the vertex of each convex right-angle feature; In the present application, each convex right-angle feature is constructed by two perpendicular straight lines, which is also one of the criteria for determining the convex right-angle feature. The intersection of the two perpendicular straight lines is the vertex of the convex right-angle feature.

[0030] S1242, take one of the undivided vertices as the reference point ; When there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the long side of the rectangle; when there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the short side of the rectangle; when there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the diagonal of the rectangle, where is the reference length of the long side of the quartz wafer outline template, is the reference length of the short side of the quartz wafer outline template, is the diagonal reference length of the quartz wafer outline template; First, in order to save calculation process, it is also necessary to lock the target point at the distance reference point The distance is not too far from the diagonal line, which is about to be close to the reference point. Distance exceeds Then for the vertices in the range, if they satisfy , it means that the distance between the vertex and the reference point is exactly the length of the long side of the rectangular contour template. Similarly, the target point Distance from the reference point satisfy , it means that the distance between the vertex and the reference point is exactly the length of the short side of the rectangular contour template, and the target point Distance from the reference point satisfy When , it means that the distance between the vertex and the reference point is exactly the diagonal length of the rectangular contour template. is the distance threshold; The above filtering process selects out vertices that meet the length requirement as target points for further contour matching.

[0031] S1243, aligning the target point, the reference point and the pre-constructed quartz wafer outline template, and dividing the reference point whose corresponding convex right-angle feature overlaps with the pre-constructed quartz wafer outline template into the same quartz wafer outline as the target point; Since the selection is based on distance only, it is possible to find vertices that do not belong to the same rectangular contour but whose distance just meets the above conditions. Therefore, the quartz wafer contour template is used for selection.

[0032] Exemplarily, based on the distribution characteristics of the target point and the reference point, the target point and the reference point are aligned with the pre-constructed quartz wafer outline template. If the corresponding convex right-angle feature happens to coincide with it, it can be said that the target point and the reference point are vertices of the same rectangular outline.

[0033] S1244, return to step S1242, until all vertices are divided, and the division results and the number of quartz wafers are obtained.

[0034] The present application segments all contour features by looping the above process, thereby obtaining the segmentation result and the number of quartz wafers. The above process can be quickly processed by the analysis host.

[0035] The number of quartz wafers can also be obtained when the quartz wafers are placed on the first tray, for example, the number of each quartz wafer is fixed. However, in the actual production process, it is often impossible to fix the number of quartz wafers, because the quartz wafers of the same batch cannot be exactly an integer multiple of the fixed number in a tray. Therefore, through the image counting in this application, the number can be verified and the contour can be segmented. Not only can the limitation of the number of wafers in the tray be eliminated, but also the position and posture feature basis of the single lens can be provided for the subsequent arrangement process.

[0036] S13, calculating the overlap of each partition based on the contour features of each partition and the number of quartz wafers, and when there is a target partition with an overlap greater than a preset overlap threshold, controlling the vibration motor corresponding to the target partition to vibrate for a target duration, and returning to step S12 until the overlap of all partitions is not greater than the preset overlap threshold, wherein a plurality of vibration motors are preset at the bottom of the first tray, and each vibration motor is used to vibrate a partition; After obtaining the number of quartz wafers, the overlap can be calculated using the number and the coverage area of ​​the contour features. The overlap calculation process for each partition is as follows: S131, calculating the number of pixels in the outline feature to obtain the total projection area of ​​the quartz wafer in each partition ,in, is the partition number; This application uses the number of pixels in the statistical contour feature as the total projected area of ​​the quartz wafer in each partition. Since the previous text has been binarized, the total projected area of ​​the quartz wafer in each partition can also be calculated by counting the number of black or white pixels. It is worth noting that since each partition is artificially delineated, there may be quartz wafers that belong to both partition A and partition B, but this situation does not affect the subsequent overlap calculation.

[0037] S132, total projected area of ​​quartz wafer based on each partition And the number of quartz crystals in each partition Calculate the overlap of each partition , where the overlap of each partition is The mathematical expression is:

[0038] In the formula, Reference area for the pre-built quartz wafer outline template.

[0039] in, is the theoretical area when all quartz wafers in the partition are laid flat, is the actual projection area, and the difference is the loss area of ​​the overlapping part. The larger the loss area, the corresponding overlap degree The bigger.

[0040] In calculating the overlap If the overlap exceeds n%, the vibration motor of the corresponding partition is started and stops automatically after the vibration time T. At this time, repeat the above steps and set the overlap of all partitions to n%. When it is controlled within n%, the subsequent film scheduling work can be started.

[0041] In actual production, if the number of wafers in the first tray is reasonable, the paving of most quartz wafers can be guaranteed after 1-2 vibration cycles.

[0042] S14, when the overlap of all partitions is not greater than a preset overlap threshold, constructing the position and posture features of each quartz wafer based on the contour features of the tray image; After ensuring that most of the quartz wafers are flat, the structure of the quartz wafer is relatively stable, and the upper surface is horizontal. When the suction cup is used for suction, it can be ensured that the sucked wafer can be consistent with the posture in the flat state. After selection and adjustment, it can be ensured that the wafer is placed in the second tray with the target posture.

[0043] In this application, the process of constructing the position and posture features of each quartz wafer based on the contour features of the tray image includes: S141, segmenting the outline of each quartz wafer based on the division result when the overlap degree of all partitions is not greater than a preset overlap threshold; The segmentation process has been described in the previous article, that is, segmentation is performed using convex right-angle features.

[0044] S142, for the contour of the quartz wafer obtained by segmentation and having complete vertices, determine the diagonal line and the diagonal vertex thereof; S143, for the contour of the quartz wafer obtained by segmentation and having incomplete vertices, determine the diagonal line and the diagonal vertex thereof with reference to a pre-constructed quartz wafer contour template; After vibration, the outlines of most quartz crystals are separated, so two diagonals can be extracted. The intersection of the two diagonals is the center of the quartz crystal, which is used as the position. If there is still occlusion, if the angle between the diagonal and the side is fixed, a virtual diagonal can be constructed using the side and the vertex. Then the position and posture features are obtained.

[0045] S144, taking the diagonal vertex as the position of the quartz wafer, and taking the diagonal as the posture feature of the quartz wafer.

[0046] S15, based on the position and posture characteristics of each quartz wafer, controlling the robot arm to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement, wherein the second tray is used to store the quartz wafers after wafer arrangement.

[0047] The specific control process is as follows: S151, determining the position coordinates of each quartz wafer, and selecting the quartz wafer at the current position according to the set order; The coordinates of the first tray, the second tray and the suction cup are unified in advance, so the current position coordinates of each quartz wafer and the target position coordinates of each quartz wafer can be determined in the same coordinate system. The specific unification process includes: (1) Construct the coordinate system of the first pallet and the coordinate system of the second pallet '; (2) Using the coordinate system of the first pallet As a reference coordinate system, the robot arm is controlled to align with the origin of the reference coordinate system ; Among them, a cross mark for position alignment is preset on the first tray, and a CCD industrial camera is provided on the robot arm, so it is only necessary to align the specific position in the CCD industrial camera screen with the cross mark. At this time, the position of the suction cup in the robot arm is also set to (0,0).

[0048] (3) Control the robot arm to move horizontally to the origin of the coordinate system of the second pallet, and record the horizontal axis displacement and the vertical axis displacement; since the suction cup in the robot arm has been positioned at this time, the horizontal axis displacement of the origin of the coordinate system of the second pallet can be directly recorded. and longitudinal displacement The principle of aligning the suction cup with the origin of the coordinate system of the second tray is consistent with the previous article, so it will not be repeated here.

[0049] (4) Compensating the horizontal axis displacement and the vertical axis displacement to the coordinate system of the second pallet to unify the coordinate system.

[0050] Among them, the coordinate system of the second pallet is expressed as , .

[0051] S152, controlling the robot arm to move to a horizontal position of the position coordinates of the quartz wafer at the current position, and then controlling the robot arm to move downward to a first target height so that the suction cup at the end of the robot arm is directly opposite to the quartz wafer at the current position; After alignment, the suction cup will drop to a certain height and reach the entire top of the quartz wafer. The height of the tray is fixed, so there is no need to introduce the z-axis coordinate.

[0052] S153, controlling the suction cup at the end of the robot arm to suck up the quartz wafer at the current position, then controlling the robot arm to move upward to a first target height, and then controlling the robot arm to move to the target position coordinates of the second tray; S154, rotating the mechanical arm to rotate the quartz wafer to a target posture, and then controlling the mechanical arm to move downward to a second target height until the quartz wafer is placed in the groove of the second tray; In the present application, a groove is provided in the second tray to fix the quartz wafer. When installing, it can be pressed by the edge of the suction cup.

[0053] S155, returning the robot arm to its original position, and returning to select the quartz wafer at the current position according to the set order.

[0054] In addition, the present application also sets a camera to collect the image of the second tray in real time, and synchronizes the image of the second tray to the monitoring display, so that the film arrangement can be monitored in real time, and any abnormal film arrangement can be discovered in time.

[0055] The present invention discloses an automatic quartz wafer arrangement method, which collects a tray image of a quartz wafer tray, extracts contour features and quartz wafer data in the tray image, and calculates the overlap of quartz wafers in multiple partitions. If the overlap of any partition is high, the corresponding vibration motor is controlled to vibrate the target duration, so as to separate and flatten the overlapping quartz wafers. Then the tray image is collected again and the partition overlap is calculated. The above process is repeated until the overlap of the quartz wafers in all partitions is no greater than a preset threshold. The position and posture features of each quartz wafer are collected at this time, and finally the position and posture features of the quartz wafer are used to perform grabbing and arrangement. The present application can automatically determine the stacking of quartz wafers in the tray, and perform arrangement while keeping the quartz wafers flat. Compared with manual jitter, it is more efficient and has a better arrangement effect.

[0056] like Figure 5 As shown, the present application also provides an automatic quartz wafer arrangement system, comprising: An acquisition module, used to acquire a tray image of a first tray for storing quartz wafers, wherein the first tray is used to store quartz wafers before wafer arrangement; A first feature extraction module is used to extract features of the quartz wafers in the plurality of partitions in the tray image to obtain contour features and the number of quartz wafers in each partition in the tray image; A vibration control module, configured to calculate the overlap of each partition based on the contour features of each partition and the number of quartz wafers, and when there is a target partition whose overlap is greater than a preset overlap threshold, control the vibration motor corresponding to the target partition to vibrate for a target duration, and return to the first feature extraction module until the overlap of all partitions is no greater than the preset overlap threshold, wherein a plurality of vibration motors are preset at the bottom of the first tray, and each vibration motor is used to vibrate one partition; A second feature extraction module is used to construct the position and posture features of each quartz wafer based on the contour features of the tray image when the overlap of all partitions is not greater than a preset overlap threshold; The wafer arrangement control module is used to control the robot arm to grab the quartz wafers from the first tray one by one and arrange them in the second tray based on the position and posture characteristics of each quartz wafer, wherein the second tray is used to store the quartz wafers after arrangement.

[0057] An automatic quartz wafer arrangement system of the present invention collects a tray image of a quartz wafer tray, and then extracts contour features and quartz wafer data in the tray image, thereby calculating the overlap of quartz wafers in multiple partitions. If the overlap of any partition is high, the corresponding vibration motor is controlled to vibrate the target duration, thereby separating and flattening the overlapping quartz wafers. Then the tray image is collected again and the partition overlap is calculated. The above process is repeated until the overlap of the quartz wafers in all partitions is no greater than a preset threshold. Then the position and posture features of each quartz wafer are collected at this time, and finally the position and posture features of the quartz wafer are used to perform grabbing and arrangement. The present application can automatically determine the stacking situation of the quartz wafers in the tray, and perform arrangement while keeping the quartz wafers flat. Compared with manual jitter, it is more efficient and has a better arrangement effect.

[0058] This embodiment also provides an electronic terminal, including: a processor and a memory; The memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the terminal executes any one of the methods in this embodiment.

[0059] The computer-readable storage medium in this embodiment can be understood by ordinary technicians in this field: all or part of the steps of implementing the above-mentioned method embodiments can be completed by hardware related to the computer program. The aforementioned computer program can be stored in a computer-readable storage medium. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the aforementioned storage medium includes: ROM, RAM, magnetic disk or optical disk and other media that can store program codes.

[0060] The electronic terminal provided in this embodiment includes a processor, a memory, a transceiver and a communication interface. The memory and the communication interface are connected to the processor and the transceiver and complete communication with each other. The memory is used to store computer programs, the communication interface is used to communicate, and the processor and the transceiver are used to run computer programs so that the electronic terminal executes each step of the above method.

[0061] In this embodiment, the memory may include a random access memory (RAM), and may also include a non-volatile memory (non-volatile memory), such as at least one disk memory.

[0062] The above-mentioned processor can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.

[0063] In the above-mentioned embodiments, although the present invention has been described in conjunction with the specific embodiments of the present invention, many replacements, modifications and variations of these embodiments will be apparent to those of ordinary skill in the art based on the foregoing description. The embodiments of the present invention are intended to cover all such replacements, modifications and variations falling within the broad scope of the appended claims.

[0064] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A method for automatically arranging quartz wafers, characterized in that: Includes steps: S11, acquiring a tray image of a first tray for storing quartz wafers, wherein the first tray is used to store quartz wafers before wafer arrangement; S12, performing feature extraction on the quartz wafers in the plurality of partitions in the tray image to obtain contour features and the number of quartz wafers in each partition in the tray image; S13, calculating the overlap of each partition based on the contour features of each partition and the number of quartz wafers, and when there is a target partition with an overlap greater than a preset overlap threshold, controlling the vibration motor corresponding to the target partition to vibrate for a target duration, and returning to step S12 until the overlap of all partitions is not greater than the preset overlap threshold, wherein a plurality of vibration motors are preset at the bottom of the first tray, and each vibration motor is used to vibrate a partition; S14, when the overlap of all partitions is not greater than a preset overlap threshold, constructing the position and posture features of each quartz wafer based on the contour features of the tray image; S15, based on the position and posture characteristics of each quartz wafer, controlling the robot arm to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement, wherein the second tray is used to store the quartz wafers after wafer arrangement.

2. The automatic quartz wafer arrangement method according to claim 1, characterized in that: Performing feature extraction on the quartz wafers of the plurality of partitions in the tray image to obtain the contour features and the number of quartz wafers of each partition in the tray image includes: Converting the tray image into a grayscale image; Performing threshold segmentation on the grayscale image to obtain a binary image; Extracting contour features from the binary image, and extracting convex right-angle features from the contour features, wherein the convex right-angle features are composed of two perpendicular straight line contours, and the inner side of the convex right-angle features is a quartz wafer area; All the convex right-angle features are traversed, and all the convex right-angle features are classified based on the reference size of the pre-built quartz wafer outline template to obtain the number of quartz wafers.

3. The automatic quartz wafer arrangement method according to claim 2, characterized in that: Based on the reference dimensions of the pre-built quartz wafer outline template, all protruding right-angle features are classified and divided to obtain the number of quartz wafers, including: S21, extracting the vertex of each convex right-angle feature; S22, take one of the undivided vertices as the reference point ; When there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the long side of the rectangle; when there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the short side of the rectangle; when there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the diagonal of the rectangle, where is the reference length of the long side of the quartz wafer outline template, is the reference length of the short side of the quartz wafer outline template, is the diagonal reference length of the quartz wafer outline template, is the distance threshold; S23, aligning the target point and the reference point with a pre-constructed quartz wafer outline template, and dividing the reference point where the corresponding convex right-angle feature overlaps with the pre-constructed quartz wafer outline template into the same quartz wafer outline as the target point; S24, return to step S22, until all vertices are divided, and the division results and the number of quartz wafers are obtained.

4. The automatic quartz wafer arrangement method according to claim 1, characterized in that: The overlap of each partition is calculated based on the contour characteristics of each partition and the number of quartz crystals, including: Calculate the number of pixels within the outline feature to obtain the total projection area of ​​the quartz wafer in each partition ,in, is the partition number; Total projected area of ​​quartz wafer based on each partition And the number of quartz crystals in each partition Calculate the overlap of each partition , where the overlap of each partition is The mathematical expression is: In the formula, Reference area for the pre-built quartz wafer outline template.

5. The automatic quartz wafer arrangement method according to claim 3, characterized in that: The position and posture features of each quartz wafer are constructed based on the contour features of the tray image, including: Segmenting the contour of each quartz wafer based on the division result when the overlap of all partitions is not greater than a preset overlap threshold; For the outline of the quartz wafer obtained by segmentation and having complete vertices, determine its diagonal line and the diagonal vertex; For the contour of the quartz wafer obtained by segmentation and having incomplete vertices, the diagonal line and the diagonal vertex thereof are determined by referring to the pre-built quartz wafer contour template; The diagonal vertex is used as the position of the quartz wafer, and the diagonal line is used as the posture feature of the quartz wafer.

6. The automatic quartz wafer arrangement method according to claim 5, characterized in that: Based on the position and posture characteristics of each quartz wafer, the robot arm is controlled to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement, including: Determine the position coordinates of each quartz crystal, and select the quartz crystal of the current position according to the set order; Control the robot arm to move to the horizontal position of the position coordinates of the quartz wafer at the current position, and then control the robot arm to move downward to a first target height so that the suction cup at the end of the robot arm is directly opposite to the quartz wafer at the current position; Control the suction cup at the end of the robotic arm to suck up the quartz wafer at the current position, then control the robotic arm to move upward to a first target height, and then control the robotic arm to move to the target position coordinates of the second tray; Rotating the mechanical arm to rotate the quartz wafer to a target posture, and then controlling the mechanical arm to move downward to a second target height until the quartz wafer is placed in the groove of the second tray; Return the robot arm to its original position and return to select the quartz wafer in the current position according to the set order.

7. The automatic quartz wafer arrangement method according to claim 1, characterized in that: Before controlling the robot arm to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement based on the position and posture characteristics of each quartz wafer, the method further includes: constructing a coordinate system of the first pallet and a coordinate system of the second pallet; The coordinate system of the first pallet and the coordinate system of the second pallet are coordinated based on the robot arm.

8. The automatic quartz wafer arrangement method according to claim 7, characterized in that: Constructing a unified coordinate system based on the coordinate system of the first pallet and the coordinate system of the second pallet, including: Taking the coordinate system of the first pallet as a reference coordinate system, and controlling the robot arm to align with the origin of the reference coordinate system; Control the robot arm to move horizontally to the origin of the coordinate system of the second pallet, and record the horizontal axis displacement and the vertical axis displacement; The horizontal axis displacement and the vertical axis displacement are compensated to the coordinate system of the second pallet to unify the coordinate system.

9. The automatic quartz wafer arrangement method according to claim 1, characterized in that: Also includes: An image of the second pallet is acquired, and the image of the second pallet is synchronized to the monitoring display.

10. An automatic quartz wafer arrangement system, characterized in that: include: An acquisition module, used to acquire a tray image of a first tray for storing quartz wafers, wherein the first tray is used to store quartz wafers before wafer arrangement; A first feature extraction module is used to extract features of the quartz wafers in the plurality of partitions in the tray image to obtain contour features and the number of quartz wafers in each partition in the tray image; A vibration control module, configured to calculate the overlap of each partition based on the contour features of each partition and the number of quartz wafers, and when there is a target partition whose overlap is greater than a preset overlap threshold, control the vibration motor corresponding to the target partition to vibrate for a target duration, and return to the first feature extraction module until the overlap of all partitions is no greater than the preset overlap threshold, wherein a plurality of vibration motors are preset at the bottom of the first tray, and each vibration motor is used to vibrate one partition; A second feature extraction module is used to construct the position and posture features of each quartz wafer based on the contour features of the tray image when the overlap of all partitions is not greater than a preset overlap threshold; The wafer arrangement control module is used to control the robot arm to grab the quartz wafers from the first tray one by one and arrange them in the second tray based on the position and posture characteristics of each quartz wafer, wherein the second tray is used to store the quartz wafers after arrangement.

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