Exposure apparatus, exposure method, and article manufacturing method

Abstract

The invention provides an exposure apparatus, an exposure method, and an article manufacturing method. The exposure apparatus exposes a substrate using a reticle assembly having a reticle, a film frame, and a film. The exposure device is provided with: a measurer that measures the relative position of the film frame with respect to the reticle; a conveying robot which conveys the mask plate assembly in a state in which the film frame is located under the mask plate; and a controller that corrects a transfer target position of the transfer robot to the reticle assembly on the basis of the relative position measured by the measurer.

Description

Technical Field

[0001] The present invention relates to an exposure device, an exposure method, and an article manufacturing method. Background Art

[0002] Patent Document 1 describes that when a reticle is transferred to a reticle stage by a robot, a mark provided on the reticle is detected, and based on the result, the position of the reticle relative to the reticle stage is adjusted.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent No. 6401872 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] A film frame and a film can be mounted on the mask. In this specification, a structure formed by mounting a film frame and a film on the mask is referred to as a mask assembly. In the device described in Patent Document 1, even if the position of the mask relative to the mask mounting table is aligned using a mark provided on the mask, the film frame may collide with the mask mounting table if the relative position of the film frame relative to the mask is inappropriate.

[0008] An object of the present invention is to provide an exposure apparatus and an exposure method for preventing a film frame of a mask assembly from colliding with a supporting member of a transport destination.

[0009] Solutions for solving problems

[0010] A first aspect of the present invention relates to an exposure device that uses a mask assembly having a mask, a film frame, and a film to expose a substrate, the exposure device comprising: a measuring device that measures the relative position of the film frame with respect to the mask; a transport robot that transports the mask assembly with the film frame located under the mask; and a controller that corrects the transport target position of the mask assembly by the transport robot based on the relative position measured by the measuring device.

[0011] A second aspect of the present invention relates to an exposure method, which uses a mask assembly having a mask, a film frame and a film to expose a substrate, the exposure method comprising: a measuring step of measuring the relative position of the film frame with respect to the mask; a correction step of correcting a transport target position of the mask assembly based on the relative position to obtain a correction target position; a transport step of transporting the mask assembly to the correction target position with the film frame located under the mask; and an exposure step of using the mask assembly to expose the substrate.

[0012] The third aspect of the present invention relates to a method for manufacturing an article, which includes: a photolithography process, exposing a substrate according to the exposure method involved in the second aspect to form a pattern on the substrate; and a processing process, processing the substrate that has undergone the photolithography process to obtain an article.

[0013] Effects of the Invention

[0014] According to the present invention, an exposure apparatus and an exposure method are provided for preventing a pellicle frame of a reticle assembly from colliding with a supporting member of a conveyance destination. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a diagram schematically showing the structure of a mask assembly.

[0016] Figure 2 This is a diagram schematically showing the structure of an exposure apparatus according to one embodiment.

[0017] Figure 3 It is a diagram schematically showing a configuration example of a measuring device.

[0018] Figure 4 This is a diagram illustrating information related to relative positions measured by a measuring instrument.

[0019] Figure 5 This is a diagram showing an example in which relative position information corresponding to the relative position measured by a measuring instrument is associated with the identifier of the reticle assembly and registered.

[0020] Figure 6 It is a diagram schematically showing another configuration example of the measuring device.

[0021] Figure 7 This is a diagram showing an exposure method according to one embodiment.

[0022] Description of Reference Numerals

[0023] 1: mask; 2: film frame; 3: film; RA: mask assembly; 40: measuring device; 32: mask support mechanism; 50: controller. DETAILED DESCRIPTION

[0024] The following embodiments are described in detail with reference to the accompanying drawings. Moreover, the following embodiments are not intended to limit the invention to which the claims relate. A plurality of features are described in the embodiments, but the present invention is not limited to requiring all of these multiple features, and multiple features may be combined arbitrarily. In addition, in the accompanying drawings, the same reference numerals are attached to the same or similar structures, and repeated descriptions are omitted.

[0025] In this specification and the drawings, directions are described based on an XYZ coordinate system in which the Z axis is parallel to the vertical direction and the XY plane is parallel to the horizontal plane.

[0026] Figure 1 (a) schematically shows the structure of the mask assembly RA. The mask assembly RA includes a mask 1, a film frame 2, and a film 3. In one example, the film frame 2 may be fixed to the mask 1 by an adhesive or the like, and the film 3 may be fixed to the film frame 2 by an adhesive or the like. Figure 1 (b) schematically shows a state in which the lower surface of the mask 1 is supported by two mask support parts 34a, 34b (or 74a, 74b) in such a manner that the film frame 2 is located between two mask support parts 34a, 34b (or 74a, 74b) separated from each other.

[0027] Figure 2 The structure of an exposure apparatus EXP according to an embodiment is schematically shown. The exposure apparatus EXP may include a transport robot 20 that transports the mask assembly RA in a state where the film frame 2 is located under the mask 1. The exposure apparatus EXP may include: a mask stage mechanism 30 that holds the mask assembly RA by a mask support mechanism 32 including two mask support parts 34a and 34b; and a substrate stage mechanism 64 that holds and drives the substrate S. In addition, the exposure apparatus EXP may include a projection optical system 62 that projects the pattern of the mask 1 of the mask assembly RA supported by the mask support mechanism 32 (mask stage mechanism 30) onto the substrate S. In addition, the exposure apparatus EXP may include an illumination optical system 60 that illuminates the mask assembly RA supported by the mask support mechanism 32 (mask stage mechanism 30). The exposure apparatus EXP can be configured such that the illumination optical system 60 illuminates the mask assembly RA (mask 1 ), and the projection optical system 62 projects the pattern of the mask 1 onto the substrate S, thereby exposing the substrate S.

[0028] In addition, the exposure apparatus EXP may include a mask inspection device 70 that supports the mask assembly RA using two mask support parts 74a and 74b to inspect the mask assembly RA. In addition, the exposure apparatus EXP may include a measuring device 40 that measures the relative position of the film frame 2 with respect to the mask 1. For example, the measuring device 40 may measure the relative position of the film frame 2 with respect to the mask 1 in a state where the mask assembly RA is held by the transport robot 20. For example, the mask inspection device 70 may be configured as a foreign matter inspection device that inspects foreign matter attached to the mask assembly RA. In addition, the exposure apparatus EXP may include a chamber 90 that accommodates the mask stage mechanism 30 (mask support mechanism 32), the substrate stage mechanism 64, the projection optical system 62, the measuring device 40, and the transport robot 20. The measuring device 40 may be disposed in the chamber 90 , and measure the relative position of the pellicle frame 2 with respect to the reticle 1 with respect to the reticle assembly RA carried into the chamber 90 as an object.

[0029] In addition, the exposure device EXP may include a controller 50. The controller 50 may control the transport processing of the mask assembly RA by the transport robot 20. For example, the transport processing of the mask assembly RA by the transport robot 20 may include the following processing: the mask assembly RA is transported from the supply source 10 (for example, a box, a loader) of the mask assembly RA via the measurement area 41 of the measuring device 40 to the transport target position. For example, the controller 50 may correct the transport target position of the mask assembly RA by the transport robot 20 based on the relative position measured by the measuring device 40, that is, the relative position of the film frame 2 relative to the mask 1. The controller 50 may correct the transport target position TP based on the relative position measured by the measuring device 40 so that the mask assembly RA is transported in a state where the film frame 2 is separated from the mask support mechanism 32, 72. In addition, the controller 50 may control the exposure action of the substrate S in the exposure device EXP. For example, the controller 50 can be composed of a PLD (Programmable Logic Device) such as FPGA (Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit), or a general or special-purpose computer embedded with a program, or a combination of all or part of these.

[0030] Figure 3The structure example of the measuring device 40 is schematically shown. The measuring device 40 can measure the relative position of the film frame 2 relative to the mask 1 by irradiating the measuring light 42 to the measuring area 41. For example, the measuring device 40 may include a laser displacement meter that measures displacement using a laser. The relative position of the film frame 2 relative to the mask 1 can be represented by various information or parameters. The relative position of the film frame 2 relative to the mask 1 can be represented by, for example, Figure 4 The values ​​of the parameters a and b are shown as examples. Here, the parameter a represents the distance between the first side 11a of the mask 1 and the first side 21a of the film frame 2, and the parameter b represents the distance between the second side 11b of the mask 1 and the second side 21b of the film frame 2. The first side 11a and the second side 11b are opposite sides. In addition, the first side 21a and the second side 21b are opposite sides.

[0031] In addition, the offset of the center of the film frame 2 relative to the center of the mask 1 is also the relative position of the film frame 2 relative to the mask 1, which is equivalent to (ba). If (ba) = 0, the center of the film frame 2 coincides with the center of the mask 1. When the minimum allowable gap between the first mask support portion 34a and the film frame 2 is set to c, when c ≤ (ba), the film frame 2 may interfere with the first mask support portion 34a. When the minimum allowable gap between the second mask support portion 34b and the film frame 2 is set to d, when d ≤ (ba), the film frame 2 may interfere with the second mask support portion 34b. For example, the controller 50 corrects the transport target position TP of the transport robot 20 for the mask assembly RA based on the relative position measured by the measuring device 40, that is, the relative position of the film frame 2 relative to the mask 1. Thus, in an example of generating a corrected transport target position (hereinafter referred to as the corrected target position TP'), the correction amount Δ is Δ=(ba) / 2, and TP' is represented by TP'=TP+(ba) / 2. The transport target position TP and the corrected target position TP' may be positions where the center of gravity of the mask assembly RA should be arranged.

[0032] Alternatively, the controller 50 associates the relative position information corresponding to the relative position measured by the measuring device 40 with the identifier ID of the mask assembly RA and stores it in the storage device 52 to manage it. For example, the controller 50 uses a reader (not shown) to read a code (e.g., a barcode) or a tag (e.g., an RF tag) attached to the mask assembly RA, thereby acquiring the identifier ID. Alternatively, when the relative position information associated with the identifier ID has been stored in the storage device 52, the controller 50 does not cause the measuring device 40 to measure the mask assembly RA, but corrects the transport target position TP based on the relative position information stored in the storage device 52. Figure 5FIG. 4 shows an example in which relative position information corresponding to the relative position measured by the measuring device 40 is associated with the identifier ID of the mask assembly RA and stored in the storage device 52. Figure 5 In the example shown, the values ​​of a and b are stored in association with the identifier ID of the mask assembly RA as relative position information. Figure 5 In the example shown, the correction value Δ is also stored in association with the identifier ID of the mask assembly RA. The storage device 52 can be arranged anywhere if it is arranged so that the controller 50 can access it. Alternatively, the storage device 52 can be shared by a plurality of exposure devices EXP. Such a plurality of exposure devices EXP are a plurality of exposure devices that can share the mask assembly RA, and can be, for example, a plurality of exposure devices installed in the same factory.

[0033] The transport robot 20 may be controlled so that the mask assembly RA is transported in such a manner that the mask assembly RA passes through the measurement area 41 of the measuring device 40. The measuring device 40 may be controlled so that when the mask assembly RA transported by the transport robot 20 passes through the measurement area 41, the measuring device 40 measures the relative position of the film frame 2 with respect to the mask 1. In another aspect, the transport robot 20 may transport the mask assembly RA from the supply source 10 of the mask assembly RA via the measurement area 41 to the mask support mechanism 32 (or 72). The controller 50 may control the transport robot 20 so that the mask assembly RA is transported according to a preset transport path before the mask assembly RA passes through the measurement area 41. In addition, the controller 50 may be configured to correct the transport target position TP based on the relative position of the film frame 2 with respect to the mask 1 measured by the measuring device 40 in the measurement area 41. While the mask assembly RA moves in the measurement area 41 , the measurer 40 can measure the relative position of the film frame 2 with respect to the mask 1 .

[0034] like Figure 6 As shown in the example, the exposure apparatus EXP may include a plurality of measuring devices 40 for measuring the relative position of the film frame 2 with respect to the mask plate 1. Figure 6 As shown in the example, each measuring device 40 may be arranged so as to include the corners of the film frame 2 and the corners of the mask 1 in its field of view. Figure 3 As shown in the example, the film frame 2 is arranged between the measuring device 40 and the mask 1, and it can also be arranged as follows. Figure 6 As shown in the example, the reticle 1 is arranged between the measuring instrument 40 and the pellicle frame 2 .

[0035] Figure 7 An exposure method according to one embodiment that can be implemented in the exposure apparatus EXP is shown. Figure 7The exposure method or action shown is controlled by the controller 50. In step S701, the controller 50 uses a reader (not shown) to read a code (e.g., a barcode) or a tag (e.g., an RF tag) attached to the mask assembly RA, thereby acquiring an identifier ID. In step S702, the controller 50 determines whether there is relative position information associated with the identifier ID acquired in step S701 and registered in the storage device 52. If such relative position information is registered in the storage device 52, the process proceeds to step S710. On the other hand, if such relative position information is not registered in the storage device 52, the process proceeds to step S703.

[0036] In step S703, the controller 50 causes the transport robot 20 to start the transport process of the mask assembly RA. Specifically, the controller 50 controls the transport robot 20 to start transporting the mask assembly RA from the supply source 10 (e.g., a box, a loader) of the mask assembly RA toward the measurement area 41 of the measuring instrument 40. Although the description is omitted below, according to the above description, the controller 50 performs the transport process of the mask assembly RA. In step S704, the controller 50 controls the measuring instrument 40 so that the measuring instrument 40 measures the relative position of the film frame 2 relative to the mask 1 when passing through the measurement area 41 of the measuring instrument 40 to obtain relative position information related to the relative position (measurement process). In step S710, the controller 50 obtains the relative position information stored in the storage device 52 based on the identification information ID obtained in step S701 (that is, the relative position information corresponding to the identification information ID obtained in step S701).

[0037] In step S705, the controller 50 corrects the transport target position TP based on the relative position information corresponding to the relative position of the film frame 2 with respect to the mask 1, thereby obtaining the corrected target position TP' (correction step). In step S706, the controller 50 controls the transport robot 20 so that the mask assembly RA is transported to the corrected target position TP' with the film frame 2 located below the mask 1 (transportation step). Furthermore, when the mask assembly RA is transported to the corrected target position TP', in step S707, the controller 50 controls the transport robot 20 so that the transport of the mask assembly RA is terminated.

[0038] In step S708, the controller 50 causes the mask support mechanism 32 of the mask stage mechanism 30 to support the mask assembly RA. In step S709, the controller 50 controls the process of exposing the substrate S using the mask assembly RA (exposure process). The substrate S may have a plurality of projection grid areas, and each projection grid area may be exposed. In addition, a plurality of substrates S may be exposed.

[0039] The following is an explanation of an article manufacturing method using the above exposure method to manufacture an article. For example, the article may be a semiconductor device, a micro device such as MEMS, or other articles. The article manufacturing method may include: a photolithography process, according to Figure 7 The exemplary exposure method exposes a substrate to form a pattern on the substrate, and a processing step is performed on the substrate after the photolithography step to obtain an article. For example, the processing step may include an etching step, an ion implantation step, a cutting step, a sealing step, etc.

[0040] The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the present invention. Therefore, claims are appended to disclose the scope of the invention.

Claims

1. An exposure device, which uses a mask assembly having a mask, a film frame and a film to expose a substrate, wherein the exposure device is characterized by comprising: a measuring device for measuring a relative position of the film frame with respect to the mask; a transport robot configured to transport the mask assembly with the film frame being located below the mask; and A controller corrects a transport target position of the reticle assembly by the transport robot based on the relative position measured by the measuring device.

2. The exposure device according to claim 1, characterized in that A mask supporting mechanism is provided, wherein the mask supporting mechanism receives the mask assembly transported to the transport target position, The mask supporting mechanism includes two mask supporting parts separated from each other, and the lower surface of the mask is supported by the two mask supporting parts in a manner that the film frame is located between the two mask supporting parts.

3. The exposure device according to claim 2, characterized in that The controller corrects the transport target position based on the relative position measured by the measuring device so that the reticle assembly is transported in a state where the film frame is separated from the two reticle supporting parts.

4. The exposure device according to claim 3, characterized in that The mask supporting mechanism is provided on a mask mounting stage mechanism, and the mask mounting stage mechanism holds and drives the mask.

5. The exposure device according to claim 3, characterized in that The mask supporting mechanism is arranged in the mask inspection device.

6. The exposure device according to claim 1, characterized in that The controller associates relative position information corresponding to the relative position measured by the measuring device with an identifier of the mask assembly and stores the corresponding information in a storage device.

7. The exposure device according to claim 6, characterized in that When the relative position information associated with the identifier is already stored in the storage device, the controller corrects the transport target position based on the relative position information stored in the storage device without causing the measuring device to measure the reticle assembly.

8. The exposure device according to claim 7, characterized in that The storage device is shared by a plurality of exposure devices.

9. The exposure device according to claim 1, characterized in that The transport robot transports the mask assembly in such a manner that the mask assembly passes through a measurement area of ​​the measuring device. When the reticle assembly being transported by the transport robot passes through the measurement area, the measuring instrument measures the relative position.

10. The exposure device according to claim 2, characterized in that: The transport robot transports the mask assembly from a supply source of the mask assembly to the mask support mechanism via a measurement area of ​​the measuring instrument. The controller controls the transport robot so that the mask assembly is transported according to a preset transport path before the mask assembly passes through the measurement area, and the transport target position is corrected based on the relative position measured by the measuring instrument in the measurement area.

11. The exposure device according to claim 10, characterized in that The measurer measures the relative position while the reticle assembly moves in the measurement area.

12. The exposure device according to any one of claims 1 to 10, characterized in that: Also available: a substrate mounting stage mechanism that holds and drives the substrate; a projection optical system that projects a pattern of the mask of the mask assembly onto the substrate; and a chamber that houses the substrate mounting table mechanism, the projection optical system, the measuring instrument, and the transfer robot; The measuring device measures the relative position of the pellicle frame with respect to the reticle by taking the reticle assembly carried into the chamber as an object.

13. An exposure method, wherein the exposure method uses a mask assembly having a mask, a film frame, and a film to expose a substrate, the exposure method comprising: A measuring step of measuring a relative position of the film frame with respect to the mask; A correction step of correcting a transport target position of the mask assembly based on the relative position, thereby obtaining a corrected target position; A conveying step of conveying the mask assembly to the calibration target position in a state where the film frame is located below the mask; as well as The exposure process uses the mask assembly to expose the substrate.

14. The exposure method according to claim 13, characterized in that: The method comprises a supporting step in which a mask stage mechanism supports the mask assembly conveyed to the correction target position. The mask stage mechanism includes two mask supporting parts separated from each other, and the lower surface of the mask is supported by the two mask supporting parts in a manner that the film frame is located between the two mask supporting parts.

15. The exposure method according to claim 14, characterized in that: In the correction step, the transport target position is corrected based on the relative position so that the reticle assembly is transported in a state where the film frame is separated from the two reticle supporting portions.

16. The exposure method according to claim 13, characterized in that: The method further includes a storage step in which relative position information corresponding to the relative position measured in the measurement step is associated with an identifier of the mask assembly and stored in a storage device.

17. The exposure method according to claim 16, characterized in that: The storage device is a storage device shared by a plurality of exposure devices.

18. The exposure method according to claim 13, characterized in that: In the conveying step, the mask assembly is conveyed so as to pass through a measurement area for performing the measurement step. In the measuring step, the relative position is measured when the mask assembly passes through the measuring area.

19. The exposure method according to claim 18, characterized in that: In the transporting step, the mask assembly is transported from a supply source of the mask assembly to the calibration target position via the measurement area. In the transport process, before the mask assembly passes through the measurement area, the mask assembly is transported according to a preset transport path, and the transport target position is corrected based on the relative position measured in the measurement process to obtain the corrected target position.

20. The exposure method according to claim 19, characterized in that: In the measurement step, the relative position is measured while the mask assembly moves in the measurement area.

21. The exposure method according to claim 13, characterized in that: In the measuring step, the relative position is measured by a measuring instrument disposed in a chamber that houses a substrate stage mechanism and a projection optical system.

22. A method for manufacturing an article, characterized in that: include: A photolithography step of exposing a substrate to light according to the exposure method according to any one of claims 13 to 21 to form a pattern on the substrate; as well as The processing step is to process the substrate that has undergone the photolithography step to obtain an article.

Images