Semiconductor circuit module and manufacturing method thereof

Abstract

The invention is suitable for the technical field of semiconductors, and particularly relates to a semiconductor circuit module and a manufacturing method thereof. Compared with the prior art, the metal pin support is adopted as a fixed pin mode, and a plurality of pin mounting holes are formed above the metal pin support according to the safety requirements of the semiconductor circuit, so that the pin mounting holes can be mounted and replaced at any time according to different pin schemes in the semiconductor circuit, the product design flexibility is improved, and the development cost is reduced; stress-free packaging is realized, the problem of layering of an insulating layer of a semiconductor circuit in the industry is solved, and the reliability of the semiconductor circuit is improved; seamless switching between a semi-encapsulation structure and a full-encapsulation structure can be realized on the premise that a mold carrier is not changed, so that the cost is reduced, the efficiency is improved, and the flexibility of a product is greatly improved; the loss of the testing seat in the testing process is reduced, and the design structure of the testing seat in the testing process is simplified.

Description

Technical Field

[0001] The present invention is applicable to the field of semiconductor technology, and in particular relates to a semiconductor circuit module and a manufacturing method thereof. Background Art

[0002] The semiconductor circuit, namely the modular intelligent power system MIPS (Module Intelligent Power System), not only integrates the power switch device and the drive circuit, but also has built-in fault detection circuits such as overvoltage, overcurrent and overheating, and can send the detection signal to the CPU or DSP for interrupt processing. It is composed of high-speed and low-power consumption tube cores, optimized gate-level drive circuits and fast protection circuits. Even if a load accident or improper use occurs, the MIPS itself can be kept from being damaged. MIPS generally uses IGBT as the power switch element, and has an integrated structure of built-in current sensor and drive circuit.

[0003] The existing MIPS modular intelligent power system IC drive control circuit, MIPS sampling amplifier circuit, PFC current protection circuit and other low-voltage control circuits and the inverter circuit composed of high-voltage semiconductor circuit modules are arranged on the same board. At the same time, the existing MIPS modular intelligent power system only integrates a single MIPS module, and the integration of multiple MIPS modular intelligent power systems has not yet been realized. In the face of market miniaturization and low-cost competition, higher requirements are placed on the high integration and high heat dissipation technology of the MIPS modular intelligent power system.

[0004] Therefore, there is an urgent need for a new semiconductor circuit module and a manufacturing method thereof to solve the above problems. Summary of the invention

[0005] The present invention proposes a semiconductor circuit module and a manufacturing method thereof, aiming to solve the problem of insulating layer delamination in existing semiconductor circuits and improve the reliability of semiconductor circuits. At the same time, the module can be installed and replaced at any time according to different pin schemes inside the semiconductor circuit, thereby improving product design flexibility and reducing development costs.

[0006] In a first aspect, the present invention provides a semiconductor circuit module, the semiconductor circuit module comprising a metal substrate; a plurality of circuit components arranged at preset positions of the metal substrate; a binding metal wire for realizing electrical connection between the plurality of circuit components; a package body coated on the metal substrate;

[0007] The metal substrate is provided with a plurality of internal input / output pin connection positions and a plurality of external input / output pin connection positions, and the package body is provided with through holes at corresponding positions above the internal input / output pin connection positions and the external input / output pin connection positions.

[0008] The semiconductor circuit module also includes an electric control board, a metal pin bracket is fixed on the electric control board, the package body is fixedly connected to the electric control board through the metal pin bracket, the metal pin bracket is provided with a plurality of pin mounting holes, a plurality of metal pin columns are inserted into the pin mounting holes, one end of the metal pin column passes through the through hole and is inserted into the internal input / output pin connection position or the external input / output pin connection position, and the other end of the metal pin column is electrically connected to the electric control board.

[0009] Preferably, the metal pin column is made of C194 (-1 / 2H) copper alloy or KFC (-1 / 2H) copper alloy.

[0010] Preferably, the metal pin column is formed by stamping a 0.5mm copper plate through machining to form a semi-finished pin welding part, and then the surface of the semi-finished pin welding part is plated with nickel with a thickness of 0.1-0.5um and tin with a thickness of 2-5um in sequence.

[0011] Preferably, the metal pin column includes a first connecting part, a fixing part and a second connecting part, one end of the first connecting part is connected to the internal input / output pin connection position or the external input / output pin connection position, the other end of the first connecting part is connected to the fixing part, an end of the fixing part away from the first connecting part is connected to the second connecting part, an end of the second connecting part away from the fixing part is connected to the electric control board, and the fixing part is used to be fixedly connected to the pin mounting hole.

[0012] Preferably, the metal pin bracket includes a first metal pin bracket and a second metal pin bracket, and the first metal pin bracket and the second metal pin bracket are respectively fixed to opposite sides of the package body.

[0013] Preferably, the metal substrate includes a metal base material, an insulating layer, a copper foil layer and a protective layer, the insulating layer is attached to one side of the metal base material, the copper foil layer is pressed onto the side of the insulating layer away from the metal base material, and the protective layer is attached to the side of the copper foil layer away from the insulating layer.

[0014] Preferably, the circuit wiring layer is produced by etching the copper foil layer.

[0015] Preferably, the circuit components include chip capacitors, chip resistors and components, and the chip capacitors, chip resistors and components are respectively mounted on the metal substrate.

[0016] In a second aspect, the present invention further provides a method for manufacturing a semiconductor circuit module as described in the above embodiment, the manufacturing method comprising the following steps:

[0017] S1. Place the metal substrate on a special carrier by automated equipment or manually;

[0018] S2, mounting the semiconductor inverter circuit chip on the component mounting position reserved on the copper foil layer of the metal substrate by applying solder paste or applying silver glue through an automatic die bonding device;

[0019] S3, mounting the high-voltage power device on the silver-plated copper heat sink through a soft solder die-bonding machine to form a semi-finished component;

[0020] S4, using automatic SMT equipment to reduce resistance and capacity, and mount the semi-finished components on the component installation position;

[0021] S5. Place the lead frame on the corresponding welding position of the metal substrate by a robot or manually, pass the metal substrate including the special carrier through a reflow furnace, and weld all the circuit components to the corresponding mounting positions;

[0022] S6, inspecting the welding quality of the circuit components by visual inspection AOI equipment, and removing the flux and aluminum chips remaining on the metal substrate by spraying and ultrasound;

[0023] S7, electrically connecting the circuit components and the circuit wiring layer through the binding metal wires;

[0024] S8, plastic-sealing the metal substrate circuit in a specific mold by a packaging device, and then marking it by laser marking;

[0025] S9, post-curing stress relief treatment in a high-temperature oven and electrical parameter testing;

[0026] S10. Install the metal pin bracket on the electronic control board, and place and fix the metal pin column on the pin mounting hole corresponding to the metal pin bracket according to the semiconductor circuit pin scheme, so that one end of the metal pin column is connected to the electronic control board and the other end is connected to the metal substrate, thereby realizing the installation and manufacturing of the semiconductor circuit module.

[0027] Compared with the prior art, the present invention adopts a metal pin bracket as a pin fixing method, and a plurality of pin mounting holes are set on the metal pin bracket according to the safety regulations of the semiconductor circuit. The pins can be installed and replaced at any time according to different pin schemes inside the semiconductor circuit, thereby improving the flexibility of product design and reducing the development cost. It realizes stress-free packaging, solves the problem of insulation layer delamination in the semiconductor circuit industry, and improves the reliability of the semiconductor circuit. It solves the problem of lead frame and substrate overflow while solving the stress problem. It can realize seamless switching between semi-encapsulated structure and fully encapsulated structure without changing the mold carrier, which not only reduces the cost and improves the efficiency, but also greatly improves the flexibility of the product. degree; since the semiconductor circuit module of the present invention is designed as a hidden pin-free structure, the input and output bits will not be plastic-sealed, and the outside can be connected to the input and output bits through metal conductive materials. In this way, the loss of the test socket in the test process is reduced, and the design structure of the test socket in the test process is also simplified (the existing scheme needs to design a complex clamping device to clamp and fix the pins during testing. In order to ensure that the clamping device and the pins are in good contact, the contact force between the clamping device and the pins needs to be increased, which makes the clamping device easy to wear and the service life is often not long, which increases the cost); since the semiconductor circuit structure of the present invention is designed as a hidden pin-free structure, it can well prevent failure caused by external static electricity. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The present invention will be described in detail below in conjunction with the accompanying drawings. The above and other aspects of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings. In the accompanying drawings:

[0029] Figure 1 It is a schematic diagram of the metal pin column structure of the semiconductor circuit module provided by an embodiment of the present invention;

[0030] Figure 2 is a schematic diagram of the metal substrate structure of a semiconductor circuit module provided by an embodiment of the present invention;

[0031] Figure 3 is a schematic diagram of the three-dimensional structure of a package of a semiconductor circuit module provided by an embodiment of the present invention;

[0032] Figure 4 is a structural schematic diagram of a metal substrate of a semiconductor circuit module provided by an embodiment of the present invention from another perspective;

[0033] Figure 5 is a schematic diagram of the three-dimensional structure of a metal substrate of a semiconductor circuit module provided by an embodiment of the present invention;

[0034] Figure 6 Schematic diagram of the placement structure of the metal substrate of the semiconductor circuit module provided by the embodiment of the present invention

[0035] Figure 7 It is a schematic diagram of the metal pin bracket installation structure of the semiconductor circuit module provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0037] Please refer to Figure 1-Figure 7 In a first aspect, the present invention provides a semiconductor circuit module, the semiconductor circuit module comprising a metal substrate 1; a plurality of circuit components (not shown in the figure) arranged at preset positions of the metal substrate 1; a binding metal wire 12 for realizing electrical connection between the plurality of circuit components; a package body 11 coated on the metal substrate 1;

[0038] The metal substrate 1 is provided with a plurality of internal input / output pin connection positions 001 and a plurality of external input / output pin connection positions 002. The package body 11 is provided with through holes 16 at corresponding positions above the internal input / output pin connection positions 001 and the external input / output pin connection positions 002.

[0039] The semiconductor circuit module further includes an electric control board 15, on which a metal pin bracket 13 is fixed, the package body 11 and the electric control board 15 are fixedly connected through the metal pin bracket 13, the metal pin bracket 13 is provided with a plurality of pin mounting holes, the pin mounting holes are provided with a plurality of metal pin posts 10, one end of the metal pin post 10 passes through the through hole 16 and is inserted in the internal input / output pin connection position 001 or the external input / output pin connection position 002, and the other end of the metal pin post 10 is electrically connected to the electric control board 15. The electric control board 15 is the control center of the entire terminal electrical appliance.

[0040] In an embodiment of the present invention, the material of the metal pin column 10 is C194 (-1 / 2H) copper alloy or KFC (-1 / 2H) copper alloy, and the specific material is C194 (-1 / 2H) (chemical composition: Cu (≧97.0) Fe: 2.4P: 0.03Zn: 0.12) or KFC (-1 / 2H) (chemical composition: Cu (≧99.6) Fe: 0.1 (0.05~0.15) P: 0.03 (0.025~0.04)). The metal pin column 10 is formed by stamping a 0.5mm copper sheet through machining to form a semi-finished pin welding part, and then the surface of the semi-finished pin welding part is plated with nickel with a thickness of 0.1-0.5um and tin with a thickness of 2-5um.

[0041] In an embodiment of the present invention, the metal pin column 10 includes a first connecting portion 101, a fixing portion 102 and a second connecting portion 103, one end of the first connecting portion 101 is connected to the internal input / output pin connection position 001 or the external input / output pin connection position 002, the other end of the first connecting portion 101 is connected to the fixing portion 102, one end of the fixing portion 102 away from the first connecting portion 101 is connected to the second connecting portion 103, one end of the second connecting portion 103 away from the fixing portion 102 is connected to the electric control board 15, and the fixing portion 102 is used to be fixedly connected to the pin mounting hole to achieve an interference fit with the pin mounting hole, thereby fixing the metal pin column 10.

[0042] In the embodiment of the present invention, the metal pin bracket 13 includes a first metal pin bracket 131 and a second metal pin bracket 132, the first metal pin bracket 131 and the second metal pin bracket 132 are respectively fixed to the opposite sides of the package body 11, and the first metal pin bracket 131 and the second metal pin bracket 132 are both provided with pin mounting holes, which can not only better support the semiconductor circuit but also meet the pin-out solution on both sides of the semiconductor circuit;

[0043] In the embodiment of the present invention, the metal substrate 1 includes a metal substrate 01, an insulating layer 02, a copper foil layer 03 and a protective layer 04, wherein the insulating layer 02 is attached to one side of the metal substrate 01, the copper foil layer 03 is pressed on the side of the insulating layer 02 away from the metal substrate 01, and the protective layer 04 is attached to the side of the copper foil layer 03 away from the insulating layer 02. Among them, the metal substrate 01 serves as a carrier of the entire internal circuit of the semiconductor circuit and plays a heat dissipation role for the entire semiconductor circuit; the insulating layer 02 prevents the circuit wiring layer from being energized with the metal substrate, resulting in the risk of short circuit and leakage of the internal circuit; the copper foil layer 03 is formed by etching the copper foil layer to form the required circuit to form the circuit wiring layer; the protective layer 04, also known as the green oil layer, prevents tinning where it should not be tinned, increases the withstand voltage between the circuits, prevents short circuits caused by oxidation or contamination of the circuits, and protects the circuits.

[0044] In the embodiment of the present invention, the circuit wiring layer is manufactured by etching the copper foil layer 03 .

[0045] In the embodiment of the present invention, the circuit components include chip capacitor 05, chip resistor 06 and component 07, and the chip capacitor 05, the chip resistor 06 and the component 07 are respectively mounted on the metal substrate 1. Among them, the chip resistor 05 is connected to the gate of the IGBT chip in the semiconductor circuit, and the switching speed of the IGBT is limited by current limiting; the chip capacitor 06 plays a role of filtering, coupling and bootstrapping in the semiconductor circuit; the component 07 constitutes the chip required for the internal functional circuit of the semiconductor circuit; the semi-finished component 08 is formed by mounting high-voltage power components with high heat dissipation requirements on the heat sink 09 to form a semi-finished component; the heat sink 09 adopts the copper surface silver plating process to achieve better bonding between the surface components and the heat sink, thereby improving the heat dissipation capacity.

[0046] In the embodiment of the present invention, the package body 11 is a powdered molding compound made of epoxy resin as a base resin, high-performance phenolic resin as a curing agent, silicon micropowder and the like as a filler, and a variety of additives. It is extruded into the mold cavity by a heat transfer molding method and the semiconductor chip therein is embedded, and cross-linked and cured to form a device with a certain external structure; the metal wire 12 (the metal wire is generally made of gold, aluminum, copper, etc.) is bound, and the metal wire is used to realize the electrical connection between the components in the circuit.

[0047] Compared with the prior art, the present invention adopts a metal pin bracket as a pin fixing method, and a plurality of pin mounting holes are set on the metal pin bracket according to the safety regulations of the semiconductor circuit. The pins can be installed and replaced at any time according to different pin schemes inside the semiconductor circuit, thereby improving the flexibility of product design and reducing the development cost. It realizes stress-free packaging, solves the problem of insulation layer delamination in the semiconductor circuit industry, and improves the reliability of the semiconductor circuit. It solves the problem of lead frame and substrate overflow while solving the stress problem. It can realize seamless switching between semi-encapsulated structure and fully encapsulated structure without changing the mold carrier, which not only reduces the cost and improves the efficiency, but also greatly improves the flexibility of the product. degree; since the semiconductor circuit module of the present invention is designed as a hidden pin-free structure, the input and output bits will not be plastic-sealed, and the outside can be connected to the input and output bits through metal conductive materials. In this way, the loss of the test socket in the test process is reduced, and the design structure of the test socket in the test process is also simplified (the existing scheme needs to design a complex clamping device to clamp and fix the pins during testing. In order to ensure that the clamping device and the pins are in good contact, the contact force between the clamping device and the pins needs to be increased, which makes the clamping device easy to wear and the service life is often not long, which increases the cost); since the semiconductor circuit structure of the present invention is designed as a hidden pin-free structure, it can well prevent failure caused by external static electricity.

[0048] In a second aspect, the present invention further provides a method for manufacturing a semiconductor circuit module as described in the above embodiment, the manufacturing method comprising the following steps:

[0049] S1. Place the metal substrate on a special carrier by automated equipment or manually;

[0050] S2, mounting the semiconductor inverter circuit chip on the component mounting position reserved on the copper foil layer of the metal substrate by applying solder paste or applying silver glue through an automatic die bonding device;

[0051] S3, mounting the high-voltage power device on the silver-plated copper heat sink through a soft solder die-bonding machine to form a semi-finished component;

[0052] S4, using automatic SMT equipment to reduce resistance and capacity, and mount the semi-finished components on the component installation position;

[0053] S5, placing the lead frame on the corresponding welding position of the metal substrate by a robot or manually, passing the metal substrate including the special carrier through a reflow furnace, and welding all the circuit components to the corresponding mounting positions;

[0054] S6, inspecting the welding quality of the circuit components by visual inspection AOI equipment, and removing the flux and aluminum chips remaining on the metal substrate by spraying and ultrasound;

[0055] S7, electrically connecting the circuit components and the circuit wiring layer through the binding metal wires;

[0056] S8, plastic-sealing the metal substrate circuit in a specific mold by a packaging device, and then marking it by laser marking;

[0057] S9, post-curing stress relief treatment in a high-temperature oven and electrical parameter testing;

[0058] S10. Install the metal pin bracket on the electronic control board, and place and fix the metal pin column on the pin mounting hole corresponding to the metal pin bracket according to the semiconductor circuit pin scheme, so that one end of the metal pin column is connected to the electronic control board and the other end is connected to the metal substrate, thereby realizing the installation and manufacturing of the semiconductor circuit module.

[0059] The semiconductor circuit module manufactured by the semiconductor circuit module manufacturing method can achieve the technical effects achieved by the semiconductor circuit module described in the above embodiments, and will not be described in detail here.

[0060] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0061] The embodiments of the present invention are described above in conjunction with the accompanying drawings. What is disclosed is only the preferred embodiment of the present invention. However, the present invention is not limited to the above-mentioned specific implementation manner. The above-mentioned specific implementation manner is only illustrative rather than restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many forms and equivalent changes without departing from the scope of protection of the purpose of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A semiconductor circuit module, characterized in that: The semiconductor circuit module comprises a metal substrate; a plurality of circuit components arranged at preset positions of the metal substrate; a binding metal wire for realizing electrical connection between the plurality of circuit components; and a package body coated on the metal substrate; The metal substrate is provided with a plurality of internal input / output pin connection positions and a plurality of external input / output pin connection positions, and the package body is provided with through holes at corresponding positions above the internal input / output pin connection positions and the external input / output pin connection positions. The semiconductor circuit module also includes an electric control board, a metal pin bracket is fixed on the electric control board, the package body is fixedly connected to the electric control board through the metal pin bracket, the metal pin bracket is provided with a plurality of pin mounting holes, a plurality of metal pin columns are inserted into the pin mounting holes, one end of the metal pin column passes through the through hole and is inserted into the internal input / output pin connection position or the external input / output pin connection position, and the other end of the metal pin column is electrically connected to the electric control board.

2. The semiconductor circuit module according to claim 1, wherein: The material of the metal pin column is C194 (-1 / 2H) copper alloy or KFC (-1 / 2H) copper alloy.

3. The semiconductor circuit module according to claim 2, wherein: The metal pin column is formed by stamping a 0.5mm copper plate through machining to form a semi-finished pin welding part, and then the surface of the semi-finished pin welding part is plated with nickel with a thickness of 0.1-0.5um and tin with a thickness of 2-5um in sequence.

4. The semiconductor circuit module according to claim 1, wherein: The metal pin column includes a first connecting part, a fixing part and a second connecting part, one end of the first connecting part is connected to the internal input / output pin connection position or the external input / output pin connection position, the other end of the first connecting part is connected to the fixing part, an end of the fixing part away from the first connecting part is connected to the second connecting part, an end of the second connecting part away from the fixing part is connected to the electric control board, and the fixing part is used to be fixedly connected to the pin mounting hole.

5. The semiconductor circuit module according to claim 1, wherein: The metal pin bracket includes a first metal pin bracket and a second metal pin bracket, and the first metal pin bracket and the second metal pin bracket are respectively fixed to opposite sides of the package body.

6. The semiconductor circuit module according to claim 1, wherein: The metal substrate includes a metal base material, an insulating layer, a copper foil layer and a protective layer. The insulating layer is attached to one side of the metal base material, the copper foil layer is pressed to the side of the insulating layer away from the metal base material, and the protective layer is attached to the side of the copper foil layer away from the insulating layer.

7. The semiconductor circuit module according to claim 6, wherein: A circuit wiring layer is produced by etching the copper foil layer.

8. The semiconductor circuit module according to claim 1, wherein: The circuit components include chip capacitors, chip resistors and components, and the chip capacitors, chip resistors and components are respectively mounted on the metal substrate.

9. A method for manufacturing a semiconductor circuit module, used for manufacturing the semiconductor circuit module according to any one of claims 1 to 8, characterized in that: The manufacturing method comprises the following steps: S1. Place the metal substrate on a special carrier by automated equipment or manually; S2, mounting the semiconductor inverter circuit chip on the component mounting position reserved on the copper foil layer of the metal substrate by applying solder paste or applying silver glue through an automatic die bonding device; S3, mounting the high-voltage power device on the silver-plated copper heat sink through a soft solder die-bonding machine to form a semi-finished component; S4, using automatic SMT equipment to reduce resistance and capacity, and mount the semi-finished components on the component installation position; S5. Place the lead frame on the corresponding welding position of the metal substrate by a robot or manually, pass the metal substrate including the special carrier through a reflow furnace, and weld all the circuit components to the corresponding mounting positions; S6, inspecting the welding quality of the circuit components by visual inspection AOI equipment, and removing the flux and aluminum chips remaining on the metal substrate by spraying and ultrasound; S7, electrically connecting the circuit components and the circuit wiring layer through the binding metal wires; S8, plastic-sealing the metal substrate circuit in a specific mold by a packaging device, and then marking it by laser marking; S9, post-curing stress relief treatment in a high-temperature oven and electrical parameter testing; S10. Install the metal pin bracket on the electronic control board, and place and fix the metal pin column on the pin mounting hole corresponding to the metal pin bracket according to the semiconductor circuit pin scheme, so that one end of the metal pin column is connected to the electronic control board and the other end is connected to the metal substrate, thereby realizing the installation and manufacturing of the semiconductor circuit module.

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