Copper plating method for improving missed routing of board edge and printed circuit board

Abstract

The invention relates to a method for improving missed routing board edge copper plating and a printed circuit board, and the method has the beneficial effects that a PCB multilayer board is obtained by designing first mechanical drilling, and mechanical drilling is carried out on the PCB multilayer board according to drilling data, and the drilling data comprises a drilling identifier; and forming for the first time: forming a PTH groove in the PCB multilayer board according to the first forming data, and forming a first forming identifier in a region corresponding to the drilling identifier. In each forming step, an operator can identify whether the forming step of the current multi-layer PCB is completed or not through the drilling identifier and the first forming identifier. And meanwhile, in a process with a plurality of forming steps, the current processing state of the PCB multilayer board can be identified according to the first forming identifier and the second forming identifier. By adding the steps, the accuracy of detecting whether the PCB multilayer board is missed in the forming stage, especially in the forming stage of the PTH groove and the NPTH groove, can be greatly improved, and defective products are prevented from flowing to the next process, so that the overall success rate of the products is improved.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of PCB manufacturing, and in particular to a method for improving copper plating on the edge of a leaky plate and a printed circuit board. Background Art

[0002] With the complexity of circuit board technology, the copper plating process of the board edge needs to be completed several times, and then these complex copper plating areas need to be opened before electroplating. After drilling holes in conventional PCB boards, they will be sent to electroplating for surface copper, hole copper, board edge copper plating, etc. After the PCB board is transferred to molding, this kind of PCB board has no graphics, and it is impossible to see what is going to be done from the edge of the board. The visual effect is very poor. Once the production is missed, the quality control is not detected, and the board will be scrapped when it is sent to the back. Summary of the invention

[0003] In view of the above problems, the embodiments of the present invention provide a method for improving copper plating on the edge of a board with leakage and a printed circuit board, which are used to solve the problem that in the prior art, after the holes in a conventional PCB board are drilled, the board will be sent for electroplating of surface copper, hole copper, board edge copper, etc. After the PCB board is formed, this type of PCB board has no graphics, and it is impossible to tell what is to be done from the edge of the board, and the visual effect is very poor. Once a leakage occurs in production and is not detected by quality control, the board will face the problem of being scrapped when it is circulated later.

[0004] According to one aspect of an embodiment of the present invention, a method for improving copper plating on a plate edge with leakage is provided, the method comprising: The first mechanical drilling is to obtain a PCB multilayer board and perform mechanical drilling on the PCB multilayer board according to the drilling data, wherein the drilling data includes drilling marks; The first molding is to punch out a PTH groove on the PCB multilayer board according to the first molding data, and punch out a first molding mark in the area corresponding to the drilling mark; Board electroplating, copper is plated on the PCB multilayer board by electroplating to form a copper-plated layer; The outer layer is made of the copper-plated layer of the PCB multilayer board; The first time, copper is plated on the outer layer of the PCB multilayer board by electroplating to thicken the outer layer; The second mechanical drilling is performed to clean the PTH slot area and the connection area between the PTH slot and the non-PTH slot; The second molding is to punch out the NPTH groove on the PCB multilayer board according to the second molding data, and punch out the second molding mark in the corresponding area of ​​the drilling mark; In the second electroplating, the PCB multilayer board is copper plated three times by electroplating.

[0005] In some optional embodiments, the drilling mark includes a first drilling mark and a second drilling mark; the first molding mark is arranged adjacent to the first drilling mark, and the second molding mark is arranged adjacent to the second drilling mark.

[0006] In some optional embodiments, after the second electrical diagram, the method further includes: The third molding is to drill grooves on the PCB multilayer board according to the third molding data, and drill out the third molding mark in the corresponding area of ​​the drilling mark.

[0007] In some optional embodiments, in the first molding step, the slot width tolerance of the PTH slot is controlled at ±0.15, the slot length is controlled at ±0.2, and the parameters of the first molding material are adjusted to the tolerance median before molding the PTH slot.

[0008] In some optional embodiments, in the board electroplating step, copper plating is performed on the PTH holes and the side walls of the PTH grooves of the PCB multilayer board.

[0009] In some optional embodiments, the outer layer step specifically includes: A photosensitive film is covered on the copper-plated layer of the PCB multilayer board, and the photosensitive film is exposed by UV light; the photosensitive film that is not polymerized during the exposure process is dissolved to expose the copper surface; and the copper layer exposed on the copper surface is etched away to form an outer layer circuit, wherein the photosensitive film is Hongrui dry film HD245.

[0010] In some optional embodiments, before the first mechanical drilling, the PCB multilayer board is manufactured through the following steps: cutting, inner layer, inner layer AOI, lamination, cutting and grinding to form a PCB multilayer board.

[0011] In some optional embodiments, after the second electrochemical step, the method further includes: Outer layer AOI, performing AOI inspection on the outer layer circuits, pads, and appearance of the PCB multilayer board; Solder-proof, printing solder-proof paint on the surface of the PCB multilayer board to protect the outer layer circuit; Text, printed on the PCB multilayer board; Lead-free tin spraying, immersing the PCB multilayer board in tin paste, and forming a tin layer on the surface of the PCB multilayer board through hot air leveling; The board edge is formed by groove-forming the board edge of the PCB multilayer board to form a target PCB board.

[0012] In some optional embodiments, after the board edge is formed, the target PCB board is tested, FQC, OSP, and packaged in sequence.

[0013] According to another aspect of an embodiment of the present invention, there is provided a printed circuit board, which is manufactured by the above-mentioned improved copper plating method for the edge of a leaky board.

[0014] The invention provides a method for improving copper plating of a plate edge with leakage and a printed circuit board, and its beneficial effects are as follows: the invention obtains a PCB multilayer board by designing the first mechanical drilling, and mechanically drills the PCB multilayer board according to the drilling data, wherein the drilling data includes a drilling mark; in the first molding, a PTH groove is drilled on the PCB multilayer board according to the first molding data, and a first molding mark is drilled in the corresponding area of ​​the drilling mark. In each molding step, the operator can identify whether the current PCB multilayer board has completed the molding step by the drilling mark and the first molding mark. At the same time, in a process with multiple molding steps, the processing status of the current PCB multilayer board can be identified according to the first molding mark and the second molding mark. By adding the above steps, the detection accuracy of whether the PCB multilayer board is leaking during the molding stage, especially the molding stage of the PTH groove and the NPTH groove, can be greatly improved, and defective products can be prevented from flowing to the next process, thereby improving the overall success rate of the product.

[0015] The above description is only an overview of the technical solution of the embodiment of the present invention. In order to more clearly understand the technical means of the embodiment of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiment of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are only used to illustrate the embodiments and are not to be considered as limiting the present invention. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings. In the accompanying drawings: Figure 1 The schematic diagram of the process of improving the copper plating method of the edge of the leaky plate provided in Example 1 of the present invention is shown; Figure 2 A schematic diagram of a key process after the second circuit of the embodiment 1 provided by the present invention is shown; Figure 3 A specific schematic diagram of a PCB multilayer board according to Example 1 provided by the present invention is shown. DETAILED DESCRIPTION

[0017] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0018] Embodiment 1, See also Figure 1According to one aspect of an embodiment of the present invention, a method for improving copper plating on the edge of a leaky plate is provided, the method comprising: 110, the first mechanical drilling, obtaining the PCB multilayer board, and mechanically drilling the PCB multilayer board according to the drilling data, wherein the drilling data includes drilling marks; in step 110, the drilling data includes customized holes and customized blind holes of the PCB multilayer board; in addition, the drilling data also includes PTH holes and drilling marks, wherein the drilling marks are used to mark subsequent molding steps.

[0019] 120, first molding, drilling a PTH groove on the PCB multilayer board according to the first molding data, and drilling a first molding mark in the corresponding area of ​​the drilling mark; in step 120, the first molding is used to make a PTH groove; at the same time, the first molding mark is drilled in the corresponding area of ​​the PCB multilayer board to indicate that the first molding step is completed. In the first molding step, the groove width tolerance of the PTH groove is controlled at ±0.15, the groove length is controlled at ±0.2, and the parameters of the first molding data are adjusted to the tolerance median before drilling the PTH groove.

[0020] 130, board electroplating, copper is plated on the PCB multilayer board by electroplating to form a copper-plated layer; in step 130, in the board electroplating step, copper is plated on the PTH hole and the side wall of the PTH groove of the PCB multilayer board, and its production requirements are: the aspect ratio of the through hole is: 6.1:1, the hole thickness: ≤1.18mil, the electroplating clamping edge: short side, the glue residue is removed once, and the hole copper control range is: 0.3-0.5mil.

[0021] 140, outer layer, making an outer layer circuit on the copper-plated layer of the PCB multilayer board; in step 140, specifically including: covering the copper-plated layer of the PCB multilayer board with a photosensitive film, exposing the photosensitive film by UV light; dissolving the photosensitive film that is not polymerized during the exposure process to expose the copper surface; and then etching and removing the copper layer exposed on the copper surface to form an outer layer circuit, wherein the photosensitive film is Hongrui dry film HD245.

[0022] 150, the first electrical drawing, the outer layer circuit of the PCB multilayer board is plated with copper for the second time by electroplating to thicken the outer layer circuit; in step 150, the control range of the copper of the first electrical drawing surface is: 2.43~3.63 mil; the min of the controlled hole copper is: 1.15mil; the aspect ratio of the through hole is 6.1:1.

[0023] 160, a second mechanical drilling to clean the PTH slot area and the connection area between the PTH slot and the non-PTH slot; in the second mechanical drilling, the area between the PTH slot and the non-PTH slot is drilled to remove the burrs or burrs in the hole.

[0024] 170, the second molding, according to the second molding data, the NPTH groove is drilled on the PCB multilayer board, and the second molding mark is drilled in the corresponding area of ​​the drilling mark; in step 170, according to the second molding data, the NPTH groove in the shaded part of the drawing is drilled. The groove width tolerance is +0.1 / -0.05, and the groove length tolerance is + / -0.1. In step 170, the manufacturing parameters need to be controlled as follows: the groove width of 1.0 is roughed with a 0.8MM milling cutter single cutter + 1.0MM milling cutter secondary single cutter repair, and then a 1.05MM milling cutter is used for fine repair. The groove width of 1.2 is roughed with a 0.8MM milling cutter single cutter + 1.1MM milling cutter secondary single cutter repair, and then a 1.25MM milling cutter is used for fine repair.

[0025] 180, second electroplating, copper plating the PCB multilayer board three times by electroplating. In step 180, the second electroplating is used to copper plate the NPTH slot in step 170 and / or the drilled hole in step 160, so that the surface is covered with a copper layer; its manufacturing requirements are outer layer etching, positive film, and half-hole board to ensure that there is copper in the hole within a minimum range of 90 degrees.

[0026] See also Figure 3 , the left side is a PCB multilayer board, and the right side is an enlarged view of the board edge area of ​​the PCB board, wherein the numbers in the enlarged view of the board edge area of ​​the PCB board can be drilling marks, and the rectangles adjacent to the numbers can be the completion marks of the corresponding molding steps. In this embodiment, the first molding and the second molding are the in-board molding of the PCB multilayer board. Since the PTH grooves and NPTH grooves formed in the board are not easy to be formed in the area, the first molding mark and the second molding mark need to be gonged when performing the first molding and the second molding steps. After the PTH grooves and NPTH grooves of the product are completed, the board edges of the PCB multilayer board need to be molded. When the board edges are molded, there is no need to perform multiple complicated molding steps, so there is no need to gong out the marks.

[0027] In some optional embodiments, the drilling mark includes a first drilling mark and a second drilling mark; the first molding mark is set adjacent to the first drilling mark, and the second molding mark is set adjacent to the second drilling mark. In this embodiment, the drilling mark includes a mark drilled on the edge of the PCB multilayer board, wherein the drilling mark can be a number, such as 1, 2... etc., and the number represents the number of molding processes required, and the higher the number, the more molding processes are required. In the first molding step, a recognizable first molding mark is drilled out by a gong at the position adjacent to the number of the drilling mark 1. In the second molding step, a recognizable second molding mark is drilled out by a gong at the position adjacent to the number of the drilling mark 2. The first molding mark and the second molding mark can be a slot structure.

[0028] In addition, the number of times of forming the PCB board in the board can be increased according to the design requirements of the PCB multilayer board, such as including the third forming after the second drawing and electrical, drilling grooves on the PCB multilayer board according to the third forming data, and drilling out the third forming mark in the corresponding area of ​​the drilling mark. Among them, the number of drilling marks is set according to the number of forming times, and the number of drillings completed means drilling out a recognizable groove structure at the corresponding position of the number of drilling marks.

[0029] At the same time, there are two types of grooves in PCB multilayer boards, one is used for copper plating, and the other is used to remove burrs or burrs. Therefore, using the molding mark, that is, whether there is copper or no copper in the groove on the edge of the board, it is also a good visual judgment whether the process is wrong or missed.

[0030] The present invention obtains a PCB multilayer board by designing the first mechanical drilling, and mechanically drills the PCB multilayer board according to the drilling data, wherein the drilling data includes a drilling mark; in the first molding, a PTH groove is drilled on the PCB multilayer board according to the first molding data, and a first molding mark is drilled in the corresponding area of ​​the drilling mark. In each molding step, the operator can identify whether the current PCB multilayer board has completed the molding step through the drilling mark and the first molding mark. At the same time, in a process with multiple molding steps, the processing status of the current PCB multilayer board can be identified according to the first molding mark and the second molding mark. By adding the above steps, the detection accuracy of whether the PCB multilayer board is missed during the molding stage, especially the molding stage of the PTH groove and the NPTH groove, can be greatly improved, and defective products can be prevented from flowing to the next process, thereby improving the overall success rate of the product.

[0031] Embodiment 2: This embodiment is based on the first embodiment. This embodiment provides a method for improving copper plating on the edge of a PCB with leakage, and the method comprises: first mechanical drilling, obtaining a PCB multilayer board, and mechanically drilling the PCB multilayer board according to drilling data, wherein the drilling data includes drilling marks; first molding, drilling a PTH groove on the PCB multilayer board according to the first molding data, and drilling a first molding mark in the area corresponding to the drilling mark; Board electrical, copper is plated on the PCB multilayer board by electroplating to form a copper-plated layer; outer layer, outer layer circuit is made on the copper-plated layer of the PCB multilayer board; first drawing electrical, secondary copper plating is performed on the outer layer circuit of the PCB multilayer board by electroplating to thicken the outer layer circuit; second mechanical drilling is performed to clean the PTH slot area and the connection area between the PTH slot and the non-PTH slot; second molding, according to the second molding data, NPTH slot is gonged on the PCB multilayer board, and the second molding mark is gonged in the corresponding area of ​​the drilling mark; second drawing electrical, copper plating is performed on the PCB multilayer board three times by electroplating.

[0032] In some optional embodiments, before the first mechanical drilling, the PCB multilayer board is manufactured through the following steps: cutting, inner layer, inner layer AOI, lamination, cutting and grinding to form a PCB multilayer board.

[0033] After the second electrochemical step, see Figure 2 , also includes: 210, outer layer AOI, performing AOI inspection on the outer layer circuits, pads, and appearance of the PCB multilayer board; 220, solder mask, printing solder mask paint on the surface of the PCB multilayer board to protect the outer layer circuit; 230, text, printing text on the PCB multilayer board; 240, lead-free tin spraying, immerse the PCB multilayer board in tin paste, and level it with hot air to form a tin layer on the surface of the PCB multilayer board; 250, board edge forming, the PCB multilayer board is grooved to form a target PCB board. In step 250, the board edge forming is to form the outer edge of the PCB board after the PCB multilayer board is manufactured, so that the size of the product reaches the set specification.

[0034] After the board edge is formed, the target PCB board is tested, FQC, OSP and packaged in sequence.

[0035] The present invention realizes the production of PCB products from substrate raw materials to final product output through the above steps. By adding drilling marks and molding marks and adding corresponding process steps, the detection accuracy of whether the PCB multilayer board is leaking during the molding stage, especially the molding stage of the PTH groove and the NPTH groove, can be greatly improved, thereby avoiding defective products from flowing to the next process, thereby improving the overall success rate of the product.

[0036] Embodiment 3: According to another aspect of the present invention, a printed circuit board is provided, wherein the printed circuit board is manufactured by the above-mentioned improved copper plating method for the edge of the leaky plate. Figure 3For multi-layer PCBs that have been formed multiple times, numbers are added to the edge of the board according to the number of times when drilling. The edge of the board formed twice is drilled with two numbers 1 and 2, and the edge of the board formed three times is drilled with three numbers 1, 2, and 3. When the board is transferred to the molding workshop, for the first molding, when the board edge pattern is completed, a 5*5cm groove is drilled next to the number 1, and the drilling knife for this groove is the same as the drilling knife inside the board, which can avoid the risk of leakage at the edge of the board. After the boards are drilled, they are stacked together. The quality control personnel use 1 and the groove to determine whether they are made according to the process, and check whether the groove is missing in the board. For example, for a lot 76 panel, the boards are put together, and the groove position on the side can be used to see which piece is missing. This visual effect is very good. Similarly, for the second molding, check whether there is a groove behind the number 2, and for the third molding, check whether there is a groove behind the number 3. There are two types of grooves in PCB multilayer boards, one is used for copper plating, and the other is used to remove burrs or burrs. Therefore, whether there is copper or no copper in the groove on the edge of the board can also be used to visually judge whether the process is wrong or missed.

[0037] The invention provides a method for improving copper plating of a plate edge with leakage and a printed circuit board, and its beneficial effects are as follows: the invention obtains a PCB multilayer board by designing the first mechanical drilling, and mechanically drills the PCB multilayer board according to the drilling data, wherein the drilling data includes a drilling mark; in the first molding, a PTH groove is drilled on the PCB multilayer board according to the first molding data, and a first molding mark is drilled in the corresponding area of ​​the drilling mark. In each molding step, the operator can identify whether the current PCB multilayer board has completed the molding step by the drilling mark and the first molding mark. At the same time, in a process with multiple molding steps, the processing status of the current PCB multilayer board can be identified according to the first molding mark and the second molding mark. By adding the above steps, the detection accuracy of whether the PCB multilayer board is leaking during the molding stage, especially the molding stage of the PTH groove and the NPTH groove, can be greatly improved, and defective products can be prevented from flowing to the next process, thereby improving the overall success rate of the product.

[0038] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. Similarly, in order to simplify the present invention and help understand one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, the various features of the embodiments of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. Wherein, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, wherein each claim itself is a separate embodiment of the present invention.

[0039] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and further may be divided into a plurality of submodules or subunits or subcomponents. Except that at least some of such features and / or processes or units are mutually exclusive.

[0040] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of multiple such elements. The present invention may be implemented with the aid of hardware comprising several different elements and with the aid of appropriately programmed computers. In a unit claim that lists several systems, several of these systems may be embodied by the same hardware item. The use of the words first, second, and third, etc. does not indicate any order. These words may be interpreted as names. The steps in the above embodiments, unless otherwise specified, should not be understood as limitations on the order of execution.

Claims

1. A method for improving copper plating on the edge of a leaky plate, characterized in that: The method comprises: The first mechanical drilling is to obtain a PCB multilayer board and perform mechanical drilling on the PCB multilayer board according to the drilling data, wherein the drilling data includes drilling marks; The first molding is to punch out a PTH groove on the PCB multilayer board according to the first molding data, and punch out a first molding mark in the area corresponding to the drilling mark; Board electroplating, copper is plated on the PCB multilayer board by electroplating to form a copper-plated layer; The outer layer is made of the copper-plated layer of the PCB multilayer board; The first time, copper is plated on the outer layer of the PCB multilayer board by electroplating to thicken the outer layer; The second mechanical drilling is performed to clean the PTH slot area and the connection area between the PTH slot and the non-PTH slot; The second molding is to punch out the NPTH groove on the PCB multilayer board according to the second molding data, and punch out the second molding mark in the corresponding area of ​​the drilling mark; In the second electroplating, the PCB multilayer board is copper plated three times by electroplating.

2. The copper plating method for improving the edge of a leaky plate according to claim 1, characterized in that: The drilling mark includes a first drilling mark and a second drilling mark; the first molding mark is arranged adjacent to the first drilling mark, and the second molding mark is arranged adjacent to the second drilling mark.

3. The copper plating method for improving the edge of a leaky plate according to claim 2, characterized in that: After the second electrical diagram, the method further includes: The third molding is to drill grooves on the PCB multilayer board according to the third molding data, and drill out the third molding mark in the corresponding area of ​​the drilling mark.

4. The copper plating method for improving the edge of a leaky plate according to claim 1, characterized in that: In the first molding step, the slot width tolerance of the PTH slot is controlled at ±0.15, the slot length is controlled at ±0.2, and the parameters of the first molding material are adjusted to the tolerance median before molding the PTH slot.

5. The copper plating method for improving the edge of a leaky plate according to claim 1, characterized in that: In the board electroplating step, copper plating is performed on the PTH holes and the side walls of the PTH grooves of the PCB multilayer board.

6. The copper plating method for improving the edge of a leaky plate according to claim 1, characterized in that: In the outer layer step, it specifically includes: A photosensitive film is covered on the copper-plated layer of the PCB multilayer board, and the photosensitive film is exposed by UV light; the photosensitive film that is not polymerized during the exposure process is dissolved to expose the copper surface; and the copper layer exposed on the copper surface is etched away to form an outer layer circuit, wherein the photosensitive film is Hongrui dry film HD245.

7. The copper plating method for improving the edge of a leaky plate according to claim 1, characterized in that: Before the first mechanical drilling, the PCB multilayer board is manufactured through the following steps: cutting, inner layer, inner layer AOI, lamination, cutting and grinding to form a PCB multilayer board.

8. The copper plating method for improving the edge of a leaky plate according to claim 1, characterized in that: After the second electrical diagram step, the method further comprises: Outer layer AOI, performing AOI inspection on the outer layer circuits, pads, and appearance of the PCB multilayer board; Solder-proof, printing solder-proof paint on the surface of the PCB multilayer board to protect the outer layer circuit; Text, printed on the PCB multilayer board; Lead-free tin spraying, immersing the PCB multilayer board in tin paste, and forming a tin layer on the surface of the PCB multilayer board through hot air leveling; The board edge is formed by groove-forming the board edge of the PCB multilayer board to form a target PCB board.

9. The copper plating method for improving the edge of a leaky plate according to claim 8, characterized in that: After the board edge is formed, the target PCB board is tested, FQC, OSP and packaged in sequence.

10. A printed circuit board, characterized in that: The printed circuit board is manufactured by the copper plating method for improving the edge of the leaky plate as described in any one of claims 1 to 9.

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