A heat dissipating conductive foam

Abstract

The present invention discloses a heat dissipation conductive foam, comprising a foam body, and a conductive cloth wrapped on the outer surface of the foam body, the conductive cloth is coated with a conductive adhesive layer for bonding with an external device, the bottom surface of the foam body is evenly provided with cutouts, and memory alloy sheets are provided on both sides of the cutouts, and the memory alloy sheets are used to drive the foam body on both sides of the cutouts to deform. The heat dissipation conductive foam of the present invention is provided with a memory alloy sheet. When the heat accumulation on the surface of the device is too high, the heat will be transferred to the memory alloy sheet. The memory alloy sheet will restore the deformation after being heated, and then the deformation section will restore from a horizontal state to an inclined state. In this way, after the two deformation sections are deformed, the two first connecting parts and the second connecting parts form an inverted "V" shape, so that a heat dissipation channel is formed between the conductive cloth and the device, and the heat of the device can be dissipated to the outside air, which is conducive to the stable operation of the device.

Description

Technical Field

[0001] The invention relates to the technical field of conductive foam, and in particular to a heat dissipating conductive foam. Background Art

[0002] Conductive foam is widely used in various electronic devices, mainly for electromagnetic shielding. By wrapping the conductive cloth material on the surface of the foam, it can effectively shield external electromagnetic interference and protect the normal operation of the equipment. However, in practical applications, conductive foam usually needs to be directly pasted on the surface of the electronic device, which makes it difficult to dissipate the heat on the surface of the device. Especially for electronic devices that need to run for a long time, the heat generated by them accumulates inside the device, affecting its performance and stability, and may even cause overheating and damage to the device.

[0003] For this purpose, the prior art (Announcement No.: CN118234212B) discloses a switchable conductive foam. The thermal control unit controls the two I-shaped sealing frames to move relative to each other, so that the foam extension can switch between the rotational folding state and the wave discrete state. When the foam extension enters the wave discrete state, a heat dissipation space can be formed between the target object, and the external environment can more efficiently take away the heat from the outer surface of the foam extension.

[0004] However, when the above technology is used for heat dissipation, the two I-shaped sealing frames need to move relative to each other. After the conductive foam is pasted on the device, the space reserved for the conductive foam may be relatively small. After the device is assembled, the conductive foam will be squeezed. In this case, the two I-shaped sealing frames will also be squeezed, which is not conducive to the assembly of the device. Therefore, the conductive foam of the above technology is only suitable for scenarios with larger reserved space, which greatly reduces the use scope of the conductive foam. On the other hand, when the foam extension part needs to be fully unfolded, the two I-shaped sealing frames need to move a sufficient distance, and the conductive foam is bonded to the device, and the conductive foam itself cannot move. Then, when the two I-shaped sealing frames move relative to each other, the conductive foam will be deformed, and the conductive foam has a certain elastic resistance. Under the obstruction of the conductive foam, the movement range of the two I-shaped sealing frames is limited, and it cannot be ensured that the foam extension part is fully unfolded, resulting in poor heat dissipation effect.

[0005] In summary, this type of technology requires a large installation space to be reserved for the equipment, and in the actual assembly process, the foam may be squeezed, affecting the use effect. In addition, some existing technologies rely on external mechanical structures for control in the design of heat dissipation channels, which are highly complex and cannot adapt well to compact equipment spaces. Summary of the invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0007] Therefore, an object of the present invention is to provide a heat dissipating conductive foam, comprising a foam body, and a conductive cloth wrapped around the outer surface of the foam body, wherein the conductive cloth is coated with a conductive adhesive layer for bonding to an external device.

[0008] The bottom surface of the foam body is evenly provided with cutouts, and memory alloy sheets are provided on both sides of the cutouts. The memory alloy sheets are used to drive the foam body on both sides of the cutouts to deform.

[0009] A thermally conductive silicone pad is arranged outside the conductive adhesive layer, and the thermally conductive silicone pad is fixedly bonded to the conductive cloth.

[0010] The memory alloy sheet includes a deformation section, a connection section and a heat conduction section. The deformation section is connected to the heat conduction section through the connection section. The bottom end of the connection section passes through the conductive cloth and extends into the heat conduction silicone pad. The heat conduction section is located in the heat conduction silicone pad.

[0011] The conductive cloth comprises a first connecting portion for cooperating with the deformation segment, and a second connecting portion for connecting the two first connecting portions.

[0012] As the preferred technical solution:

[0013] In the heat dissipation conductive foam as described above, when the temperature of the memory alloy sheet is lower than a preset temperature, the deformation section is horizontal, and when the temperature of the memory alloy sheet is higher than a preset temperature, the deformation section is inclined.

[0014] Through the above technical solution, the memory alloy sheet has two forms at different temperatures, and the working temperature of the memory alloy sheet can be set by debugging or changing the material ratio of the memory alloy sheet. Therefore, when the temperature is lower than the preset temperature, the deformation segment is horizontal, and when the temperature is higher than the preset temperature, the deformation segment will restore the deformation, that is, it will bend and become inclined.

[0015] In the heat dissipating conductive foam as described above, the deformation section, the connection section and the heat conduction section are integrally formed, the heat conduction section is in the shape of a long strip, and the deformation section and the connection section are symmetrically arranged with respect to the heat conduction section.

[0016] Through the above technical solution, the integrated design of the deformation section, the connection section and the heat conduction section allows the heat on the heat conduction section to be transferred to the deformation section through the connection section, thereby enabling the deformation of the deformation section.

[0017] In the heat dissipating conductive foam as described above, a long slot is provided on the bottom surface of the foam body, the deformation section and the horizontal portion of the connecting section are both embedded in the slot, and the horizontal portion of the connecting section is fixedly bonded to the foam body at the slot.

[0018] Through the above technical solution and the design of the card slot, the deformation section and the connection section are both embedded, which can ensure the flatness of the bottom of the foam body, ensure that the foam body and the conductive cloth can fit smoothly with the surface of the device, and can completely cover the device, which is beneficial to the electromagnetic shielding effect.

[0019] In the heat dissipating conductive foam as described above, the deformation section is fixedly bonded to the first connecting portion, and the length of the deformation section is consistent with the width of the first connecting portion.

[0020] Through the above technical solution, the length of the deformation section is designed so that after the deformation of the deformation section, the first connection part can be driven to move as a whole, and the second connection part can be fully stretched. In this way, the size of the heat dissipation channel formed by the first connection part, the second connection part and the surface of the device can be increased, which is beneficial to the heat dissipation effect.

[0021] In the heat dissipating conductive foam as described above, the top surface of the foam body is provided with upper grooves, and the number of the upper grooves and the number of the cutouts are the same and correspond one to another.

[0022] A first hole groove is formed in the foam body on both sides of the upper groove, and a second hole groove is formed in the foam body between the upper groove and the cutout. Both the first hole groove and the second hole groove penetrate the foam body.

[0023] Through the above technical scheme, the setting of the upper groove makes the top surface of the foam body uneven, so that when squeezed by the outside, the foam body on both sides of the upper groove will be compressed and deformed, while the foam body between the upper groove and the incision will be less squeezed and deformed, thus avoiding the foam body at the incision from being compressed and compacted, and the structure is reasonable.

[0024] In the heat dissipating conductive foam as described above, the thermally conductive silicone pad is in a rectangular frame shape, the thermally conductive silicone pad surrounds the conductive adhesive layer, and the thermally conductive silicone pad is flush with the bottom surface of the conductive adhesive layer.

[0025] The overall cross-section of the second connecting portion is an inverted "U" shape, the arc-shaped end surface of the second connecting portion is fixedly bonded with the first rubber sheet, and the second connecting portion and the incision are aligned vertically.

[0026] Through the above technical solution, in the initial state, the second connecting part is folded up. When the first connecting part moves with the deformation section, the second connecting part will be stretched open. The shape design of the second connecting part allows the second connecting part to have a certain deformation space and will not hinder the deformation of the deformation section.

[0027] In the heat dissipating conductive foam as described above, arc-shaped grooves are formed on both sides of the foam body, the groove surfaces of the grooves are bonded with second rubber sheets, and the outer surface of the second rubber sheet is fixedly bonded to the conductive cloth.

[0028] The second rubber sheet protrudes outwardly toward the foam body to form a ridge, the end surface of the ridge is semicircular, and the groove wall of the groove is provided with a side groove matched with the ridge.

[0029] Through the above technical solution, the second rubber sheet is located on both sides of the foam body, and the second rubber sheet can play a supporting role. In this way, when the foam body is compressed, the foam body can restore the deformation through its own elasticity, and can also restore the deformation with the assistance of the second rubber sheet, thereby making the permanent deformation of the foam body smaller, which is beneficial to the overall electromagnetic shielding effect.

[0030] Compared with the prior art, the present invention has at least the following beneficial effects:

[0031] (1) Improving heat dissipation performance and ensuring stable operation of the device: The present invention adds a memory alloy sheet to the conductive foam. When the surface temperature of the device is too high, the memory alloy sheet deforms after being heated to form an inverted "V" shape, so that a heat dissipation channel is generated between the conductive foam and the device surface. In this way, the heat accumulated inside the device can be effectively dissipated to the outside, avoiding performance degradation or damage of the device due to overheating, and ensuring stable operation of the device.

[0032] (2) Automatically adjust deformation without external power: In the present invention, the memory alloy sheet automatically deforms according to the temperature without the involvement of external mechanical devices or power systems. This design makes the heat dissipation adjustment process more intelligent and efficient, reduces complex mechanical structures, and reduces the manufacturing and maintenance costs of the equipment.

[0033] (3) Suitable for small spaces and expanded application scope: The deformation of the memory alloy sheet in the present invention only needs to be carried out in a small range. Even in the compact space of the electronic device, the deformation of the foam can still be carried out effectively without being restricted by the compression during the assembly of the device. This makes the conductive foam not only suitable for devices with a large reserved space, but also has a good heat dissipation effect in devices with limited space, thus expanding the application scope of the conductive foam.

[0034] (4) Maintaining electromagnetic shielding function and improving overall performance: The design of the present invention ensures that the conductive foam can still fit closely to the surface of the device while deforming and dissipating heat, ensuring that the electromagnetic shielding performance will not be affected by the formation of the heat dissipation channel. Through reasonable structural design, the conductive foam achieves a good balance between heat dissipation and shielding, further improving the overall performance of the electronic device.

[0035] (5) Simple structure and high reliability: The memory alloy sheet is integrally formed and embedded in the foam body, which will not be damaged or fail due to long-term use or multiple deformation of the equipment, thus ensuring the long-term stability and reliability of the equipment. At the same time, due to the simple structure, the manufacturing process of the entire conductive foam is simpler, reducing the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0037] Figure 1 is a cross-sectional view of the present invention;

[0038] Figure 2 A bottom view of the bottom wall of the present invention;

[0039] Figure 3 It is a three-dimensional diagram of the memory alloy sheet of the present invention;

[0040] Figure 4 For the present invention Figure 1 A magnified view of point A in the figure;

[0041] Figure 5 It is an enlarged view of the deformation section of the present invention after deformation;

[0042] Figure 6 It is a three-dimensional diagram of the foam body and the upper groove of the present invention;

[0043] Figure 7 It is a three-dimensional diagram of the second rubber sheet and convex ridges of the present invention.

[0044] In the figure: 1. foam body; 2. conductive cloth; 21. first connecting part; 22. second connecting part; 23. first rubber sheet; 3. conductive adhesive layer; 4. upper groove; 5. card slot; 6. groove; 7. side groove; 8. thermal conductive silicone pad; 9. memory alloy sheet; 91. deformation section; 92. connecting section; 93. thermal conductive section; 10. incision; 11. first hole groove; 12. second hole groove; 13. second rubber sheet; 14. ridge. DETAILED DESCRIPTION

[0045] In order to more clearly understand the above-mentioned purpose, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0046] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the specific embodiments disclosed below.

[0047] See also Figure 1-2 The present invention provides a technical solution: a heat dissipating conductive foam, comprising a foam body 1, and a conductive cloth 2 wrapped on the outer surface of the foam body 1, and the conductive cloth 2 is coated with a conductive adhesive layer 3 for bonding with an external device.

[0048] The conductive cloth 2 is nickel-plated fiber cloth, which can be nickel-plated by chemical electroplating, gold-plated fiber cloth, carbon-plated fiber cloth or aluminum foil fiber cloth, so that the whole has good conductivity. In this way, when the conductive foam is pasted on the device through the conductive adhesive layer 3, the electromagnetic shielding effect can be achieved.

[0049] like Figure 1 and Figure 2 As shown, a thermally conductive silicone pad 8 is arranged on the outside of the conductive adhesive layer 3. The thermally conductive silicone pad 8 is fixedly bonded to the conductive cloth 2. The thermally conductive silicone pad 8 is in a rectangular frame shape. The thermally conductive silicone pad 8 surrounds the conductive adhesive layer 3. The thermally conductive silicone pad 8 is flush with the bottom surface of the conductive adhesive layer 3.

[0050] The shape of the thermally conductive silicone pad 8 is set so that it can surround the conductive adhesive layer 3, so as to prevent dust in the device from adhering to the conductive adhesive layer 3, thereby not only ensuring the adhesion effect of the conductive adhesive layer 3, but also preventing the conductive performance of the conductive adhesive layer 3 from being affected by dust.

[0051] At the same time, when the conductive adhesive layer 3 is adhered to the device, the thermal conductive silicone pad 8 can also be attached to the surface of the device, so that the heat of the device itself can be quickly transferred to the thermal conductive silicone pad 8, thereby improving the heat conduction effect.

[0052] like Figure 1 , Figure 3 , Figure 4 and Figure 5 As shown, the bottom surface of the foam body 1 is evenly provided with cutouts 10, and memory alloy sheets 9 are provided on both sides of the cutouts 10. The memory alloy sheets 9 are used to drive the foam body 1 on both sides of the cutouts 10 to deform. When the temperature of the memory alloy sheet 9 is lower than the preset temperature, the deformation section 91 is horizontal, and when the temperature of the memory alloy sheet 9 is higher than the preset temperature, the deformation section 91 is inclined.

[0053] The memory alloy sheet 9 includes a deformation section 91, a connecting section 92 and a heat-conducting section 93. The deformation section 91 is connected to the heat-conducting section 93 through the connecting section 92. The bottom end of the connecting section 92 passes through the conductive cloth 2 and extends into the heat-conducting silicone pad 8. The heat-conducting section 93 is located in the heat-conducting silicone pad 8.

[0054] The deformation section 91, the connecting section 92 and the heat conducting section 93 are integrally formed. The heat conducting section 93 is in the shape of an elongated strip. The deformation section 91 and the connecting section 92 are symmetrically arranged about the heat conducting section 93. The deformation section 91 is fixedly bonded to the first connecting portion 21. The length of the deformation section 91 is consistent with the width of the first connecting portion 21.

[0055] The conductive cloth 2 includes a first connecting portion 21 for cooperating with the deformation section 91, and a second connecting portion 22 for connecting the two first connecting portions 21. The overall cross-section of the second connecting portion 22 is an inverted "U" shape. The arc-shaped end surface of the second connecting portion 22 is fixedly bonded with a first rubber sheet 23. The second connecting portion 22 and the incision 10 are aligned up and down.

[0056] Under normal conditions, the first connection portion 21 on the deformation section 91 is in contact with the device surface, and the second connection portion 22 can also be in contact with the device surface, so that the conductive cloth 2 can be evenly covered on the device surface, ensuring the electromagnetic shielding effect of the conductive foam.

[0057] When the temperature of the device gradually rises, the temperature of the device surface will be transferred to the thermally conductive silicone pad 8, and the thermally conductive silicone pad 8 will transfer the heat to the thermally conductive segment 93 inside it. The heat on the thermally conductive segment 93 will be transferred to the deformation segment 91 again through the two connecting segments 92. At this time, the temperature of the deformation segment 91 itself is higher than the preset value, and the deformation segment 91 will restore the deformation, and then the deformation segment 91 will warp upward. Due to the setting of the incision 10, the upward-warped deformation segment 91 will compress and deform the foam body 1 on both sides of the incision 10, which is beneficial to the deformation of the deformation segment 91. At this time, the incision 10 will be pulled open to form an inverted "V" shape.

[0058] When the deformation section 91 is deformed, the first connection part 21 will be pulled upward together. After the two first connection parts 21 are pulled, the second connection part 22 will be pulled synchronously, so that the second connection part 22 will be stretched from an inverted "U" shape to an inverted "V" shape. At this time, the first connection part 21 and the second connection part 22 form an arch shape, thereby forming a heat dissipation channel between the device surface, and the heat of the device itself can be dissipated through the heat dissipation channel, which is beneficial to the working stability and service life of the device.

[0059] After the device dissipates its own heat through the heat dissipation channel, the temperature of the device itself will gradually drop, and then the heat conducted to the deformation section 91 through the thermally conductive silicone pad 8 will also gradually decrease, and the temperature of the deformation section 91 itself will also gradually drop. At this time, the temperature of the deformation section 91 itself is lower than the preset value. The deformation section 91 will deform again as the temperature drops, until the deformation section 91 is deformed from an inclined shape to a horizontal shape again, and the first connecting portion 21 will also fit the device surface again as the deformation section 91 is deformed.

[0060] It can be understood that the memory alloy sheet 9 used in the present invention has a two-way memory, that is, it recovers the high-temperature shape when heated and recovers the low-temperature shape when cooled.

[0061] After the second connection part 22 is stretched, the first rubber sheet 23 thereon will also be deformed. When the first connection part 21 is restored as the deformation section 91 is deformed, the second connection part 22 will return to an inverted "U" shape again under the elastic deformation of the first rubber sheet 23. This ensures that the first connection part 21 and the second connection part 22 can fit the surface of the device, thereby ensuring the overall electromagnetic shielding effect.

[0062] After losing the extrusion of the deformation section 91, the foam body 1 on both sides of the incision 10 will restore its deformation under the action of its own elasticity, so that the opened incision 10 will close again. During the closing process of the incision 10, the foam body 1 on both sides will also assist in pushing the deformation section 91 to deform again under the action of its own elasticity.

[0063] like Figure 4 and Figure 6 As shown, a long slot 5 is provided on the bottom surface of the foam body 1 , the deformation section 91 and the horizontal portion of the connecting section 92 are both embedded in the slot 5 , and the horizontal portion of the connecting section 92 is fixedly bonded to the foam body 1 at the slot 5 .

[0064] The part of the memory alloy sheet 9 between the foam body 1 and the conductive cloth 2 will be embedded in the card slot 5, so as to ensure that the foam body 1 and the conductive cloth 2 can fit smoothly, thereby ensuring the flatness of the bottom of the conductive foam, so that the conductive foam can fit smoothly with the surface of the device, which is beneficial to the electromagnetic shielding effect of the conductive foam.

[0065] like Figure 1 and Figure 6 As shown, an upper groove 4 is opened on the top surface of the foam body 1, the number of the upper grooves 4 and the incisions 10 are the same and correspond one to another, a first hole groove 11 is opened in the foam body 1 on both sides of the upper groove 4, and a second hole groove 12 is opened in the foam body 1 between the upper groove 4 and the incision 10, and the first hole groove 11 and the second hole groove 12 both penetrate the foam body 1.

[0066] After the foam body 1 is attached to the surface of the device, if the space where the foam body 1 is located is relatively ample, the foam body 1 as a whole will not be squeezed. The setting of the first hole groove 11 and the second hole groove 12 can quickly conduct the heat of the foam body 1 itself, which is beneficial to the heat dissipation effect of the device itself.

[0067] If the installation space reserved for the foam body 1 is relatively narrow, when the device is assembled, the back cover or the cover plate of other parts of the device will squeeze the foam body 1, and then the foam body 1 will undergo compression deformation. Due to the setting of the upper groove 4, the top surface of the foam body 1 is not flat, and the foam bodies 1 on both sides of the upper groove 4 will first be subjected to the extrusion force and compressively deform. Due to the setting of the first hole groove 11, space will be reserved for the compression deformation of the foam body 1, that is, during the compression process, the first hole groove 11 will be squeezed closed. Through the above design, it is possible to avoid excessive compression deformation of the foam body 1 between the upper groove 4 and the incision 10, thereby preventing the foam body 1 around the incision 10 from being compressed tightly, and then the deformation section 91 can easily squeeze the foam body 1 on both sides of the incision 10 during the deformation process, and cause the foam body 1 to undergo compression deformation.

[0068] After the first hole groove 11 is squeezed and closed, the compression deformation degree of the foam body 1 around the second hole groove 12 is relatively low, and the second hole groove 12 will not be squeezed and closed, and the second hole groove 12 can still exert the heat dissipation effect.

[0069] like Figure 1 , Figure 6 and Figure 7 As shown, arc-shaped grooves 6 are provided on both sides of the foam body 1, and a second rubber sheet 13 is bonded to the groove surface of the groove 6. The outer surface of the second rubber sheet 13 is fixedly bonded to the conductive cloth 2. The second rubber sheet 13 protrudes outwardly on the side facing the foam body 1 to form a ridge 14. The end face of the ridge 14 is semicircular, and a side groove 7 adapted to the ridge 14 is provided on the groove wall of the groove 6.

[0070] When the foam body 1 is compressed and deformed under external pressure, since the second rubber sheet 13 and the groove 6 are both arc-shaped, the second rubber sheet 13 bends inward under pressure, and the shape design of the ridge 14 makes the pressure evenly distributed, thereby increasing the bending strength. When the external pressure disappears, the foam body 1 will recover by itself under the action of its own elastic deformation, and the ridge 14 can increase the deformation restoration amount of the second rubber sheet 13 under the action of its own elastic deformation, so that the second rubber sheet 13 can assist the foam body 1 in recovering the deformation, thereby reducing the permanent deformation rate of the foam body 1. After being squeezed and deformed for many times, the foam body 1 can still recover and maintain a certain thickness, and the thickness of the foam body 1 affects the overall electromagnetic shielding effect. Through this design, the electromagnetic shielding performance of the conductive foam can be improved.

[0071] In the description of this specification, "connection", "installation", "fixation" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0072] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0073] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A heat dissipating conductive foam, comprising a foam body (1), and a conductive cloth (2) wrapped around the outer surface of the foam body (1), wherein the conductive cloth (2) is coated with a conductive adhesive layer (3) for bonding to an external device; characterized in that: The bottom surface of the foam body (1) is evenly provided with cutouts (10), and memory alloy sheets (9) are provided on both sides of the cutout (10), and the memory alloy sheets (9) are used to drive the foam body (1) on both sides of the cutout (10) to deform; A thermally conductive silicone pad (8) is arranged outside the conductive adhesive layer (3), and the thermally conductive silicone pad (8) is fixedly bonded to the conductive cloth (2); The memory alloy sheet (9) comprises a deformation section (91), a connection section (92) and a heat-conducting section (93); the deformation section (91) is connected to the heat-conducting section (93) via the connection section (92); the bottom end of the connection section (92) passes through the conductive cloth (2) and extends into the heat-conducting silicone pad (8); and the heat-conducting section (93) is located inside the heat-conducting silicone pad (8); The conductive cloth (2) comprises a first connecting portion (21) for cooperating with the deformation segment (91) and a second connecting portion (22) for connecting two first connecting portions (21).

2. The heat dissipating conductive foam according to claim 1, characterized in that: When the temperature of the memory alloy sheet (9) is lower than a preset temperature, the deformation section (91) is horizontal; when the temperature of the memory alloy sheet (9) is higher than a preset temperature, the deformation section (91) is inclined.

3. The heat dissipating conductive foam according to claim 2, characterized in that: The deformation section (91), the connection section (92) and the heat conduction section (93) are integrally formed; the heat conduction section (93) is in the shape of a long strip; and the deformation section (91) and the connection section (92) are symmetrically arranged with respect to the heat conduction section (93).

4. The heat dissipating conductive foam according to claim 1, characterized in that: The bottom surface of the foam body (1) is provided with a long slot (5), the deformation section (91) and the horizontal portion of the connecting section (92) are both embedded in the slot (5), and the horizontal portion of the connecting section (92) is fixedly bonded to the foam body (1) at the slot (5).

5. The heat dissipating conductive foam according to claim 1, characterized in that: The deformation section (91) is fixedly bonded to the first connection portion (21), and the length of the deformation section (91) is consistent with the width of the first connection portion (21).

6. The heat dissipating conductive foam according to claim 1, characterized in that: The top surface of the foam body (1) is provided with an upper groove (4), the number of the upper grooves (4) and the number of the cutouts (10) being the same and corresponding to each other. A first hole groove (11) is provided in the foam body (1) on both sides of the upper groove (4), and a second hole groove (12) is provided in the foam body (1) between the upper groove (4) and the cutout (10), and both the first hole groove (11) and the second hole groove (12) penetrate the foam body (1).

7. The heat dissipating conductive foam according to claim 1, characterized in that: The thermally conductive silicone pad (8) is in the shape of a rectangular frame, and the thermally conductive silicone pad (8) surrounds the conductive adhesive layer (3), and the bottom surfaces of the thermally conductive silicone pad (8) and the conductive adhesive layer (3) are flush.

8. The heat dissipating conductive foam according to claim 1, characterized in that: The overall cross-section of the second connecting portion (22) is an inverted "U" shape, the arc-shaped end surface of the second connecting portion (22) is fixedly bonded with a first rubber sheet (23), and the second connecting portion (22) and the cutout (10) are aligned vertically.

9. The heat dissipating conductive foam according to claim 1, characterized in that: Arc-shaped grooves (6) are formed on both sides of the foam body (1), a second rubber sheet (13) is bonded to the groove surface of the groove (6), and the outer surface of the second rubber sheet (13) is fixedly bonded to the conductive cloth (2).

10. The heat dissipating conductive foam according to claim 9, characterized in that: The second rubber sheet (13) protrudes outwardly on the side facing the foam body (1) to form a ridge (14), the end surface of the ridge (14) is semicircular, and the groove wall of the groove (6) is provided with a side groove (7) adapted to the ridge (14).

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