Cooling device for cooling an electrical and / or electronic component
By designing turbulences with turbulence and blocking areas in the cooling equipment, the cooling fluid only flows through the turbulent area to form a vortex, solving the problem of low efficiency of existing cooling equipment, and achieved the effect of high -efficiency cooling electrical and/or electronic components. Essence
Patent Information
- Application Number
- CN202380045641.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-06-07
- Filing Date
- 2023-05-24
- Publication Date
- 2025-01-21
AI Technical Summary
Existing cooling equipment is less efficient when cooling electrical and/or electronic components, making it difficult to effectively derivate heat.
A cooling device is designed, including the cover and the bottom plate. The bottom plate has the concave structure to form a cooling channel. There is at least one turbulence in the device. The turbulent device is arranged in the cooling channel. It has turbulent areas and blocking areas. Local turbulence is generated through turbulent areas to block the bypass flow of cooling fluid in the area.
Through the design of the blocking area and the turbulent flow area of the turbulator, the cooling fluid can only flow through the turbulent area of the turbulator, forming a vortex, which significantly improves the cooling efficiency and particularly efficiently cools electrical and/or electronic components.
Smart Images
Figure CN119343776A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a cooling device for cooling an electrical and / or electronic component and an electronic device arrangement. Background Art
[0002] Power modules such as inverter structures or converter structures are used in hybrid vehicles or electric vehicles. For example, an inverter is used to operate an electric motor, which inverter provides the electric motor with phase current. The power module can, for example, include a carrier substrate with a conductor circuit, on which, for example, power semiconductors are arranged, which together with the carrier substrate form an electronic device unit. During operation, heat is generated by the electronic device unit, which heat must be discharged to a cooling device. For this purpose, the electronic device unit is thermally connected to the cooling device. It is known that the cooling device is equipped with a cooling channel, in which a cooling fluid can flow, which cools the heat away from the cooling body. So-called turbulators can be arranged in the cooling channel, which turbulators make it possible to better discharge the heat from the cooling device to the cooling fluid flowing through the cooling device. Turbulence is generated by the turbulator and the cooling surface is increased. Summary of the invention
[0003] According to the present invention, a cooling device for cooling electrical and / or electronic components is proposed. The cooling device comprises a cover plate and a base plate, wherein the base plate is constructed as a deep-drawn component with a recess, wherein the cover plate and the base plate are arranged in such a way that a cooling channel is formed between the cover plate and the base plate through the recess, wherein the cover plate and the base plate are connected to each other at a contact area outside the recess, wherein a cooling fluid flow of a cooling fluid can flow through the cooling channel in a longitudinal direction, wherein the cooling device further comprises at least one turbulator, which is arranged in a turbulator section of the cooling channel. A turbulent region for generating local turbulence in the flow of the cooling fluid and a blocking region for locally blocking the flow of the cooling fluid are constructed at the turbulator.
[0004] Compared to the prior art, a cooling device having the features of the independent claim has a particularly high efficiency in cooling electrical and / or electronic components to be cooled. By means of the blocking area at the turbulator, the bypass flow is blocked or severely restricted by the bypass area at the edge of the turbulator. Therefore, the flow of the cooling fluid is guided through the turbulent area of the turbulator by the cooling body. The turbulent area of the turbulator is arranged, for example, below the electrical and / or electronic components to be cooled. The turbulent area of the turbulator is constructed in such a way that the cooling fluid flowing through the turbulent area of the turbulator forms a vortex there. In contrast, the blocking area of the turbulator blocks the flow next to the turbulent area, so that the cooling fluid cannot flow through the turbulator there. Therefore, when the cooling fluid flows through the cooling channel, it can only flow through the turbulent area of the turbulator and cannot pass by it.
[0005] Further advantageous embodiments and developments of the invention can be achieved by the features specified in the dependent claims.
[0006] According to an advantageous embodiment, it is provided that the blocking region extends from the edge of the turbulent region into the bypass region of the cooling channel between the base plate and the cover plate. At the edge of the recess, the base plate extends toward the contact region onto the cover plate, so that the cooling channel tapers in this direction. The blocking region extends into this tapering region, so that this region is at least partially closed by the blocking region.
[0007] According to an advantageous embodiment, it is provided that the blocking area of the turbulator extends from the turbulent area of the turbulator towards the contact area between the cover plate and the base plate. As a result, the area between the turbulent area and the contact area is closed and the cooling fluid cannot flow past the turbulent area of the turbulator. As a result, the cooling fluid flows through the cooling channel only in the turbulent area of the turbulator. As a result, the flow of the cooling fluid is not lost at the edge of the cooling channel. The electrical and / or electronic components to be cooled can be cooled particularly efficiently.
[0008] According to an advantageous embodiment, the turbulator is formed from a bent sheet material, wherein the sheet material is bent in such a way that the blocking region is directed flatly in the longitudinal direction. Such a turbulator can advantageously be manufactured simply and cost-effectively. For example, the same sheet material or similar sheets can be used for the base plate, the cover plate and the turbulator. The turbulent region and the blocking region of the turbulator can then be formed in the turbulator, for example by cutting and reshaping the sheet material, for example by punching and bending.
[0009] According to an advantageous embodiment, it is provided that the blocking region of the turbulator extends at least partially flat in a plane perpendicular to the longitudinal direction. As a result, the flow at the edge of the cooling channel is blocked particularly well. Thus, at the edge of the cooling channel, the flow impinges on the blocking region, for example perpendicularly, and is thus blocked by it.
[0010] According to an advantageous embodiment, the blocking region of the turbulator has a shape that is adapted to the geometry of the base plate, in particular to the edge of the recess. The blocking region can thus abut against the base plate up to the contact region and be connected to the base plate, for example up to the contact region. Thus, the cooling fluid flow located next to the turbulent region of the turbulator can be blocked effectively.
[0011] According to an advantageous embodiment, it is provided that the barrier region extends over a surface from the turbulent region to the contact region between the cover plate and the base plate.
[0012] According to an advantageous embodiment, it is provided that a plurality of, in particular similarly designed, blocking regions are formed at the turbulator. Thus, the cooling fluid flowing from the turbulator region in the direction of the contact region can be blocked at different locations. For example, if a cooling liquid flow is formed again downstream of the blocking region in the flow direction due to the cooling liquid flowing out of the turbulator region, this can be blocked by the next blocking region of the turbulator.
[0013] According to an advantageous embodiment, it is provided that the barrier regions are formed at opposite edges of the turbulent region. Thus, the bypass can be closed on both sides of the cooling channel in the contact region.
[0014] Furthermore, the cooling device can be comprised by the electronics arrangement, wherein the electronics arrangement further comprises at least one electrical and / or electronic component to be cooled, wherein the electronic components are arranged on the cover plate or on the base plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Exemplary embodiments of the invention are shown in the drawings and are explained in detail in the following description.
[0016] Figure 1 shows a cross section of an embodiment of an electronic device arrangement having a cooling device;
[0017] Figure 2 Shows Figure 1 A partial view of the bottom plate and turbulator of the cooling device;
[0018] Figure 3 Shows Figure 1 A partial view of the base plate and turbulators of the cooling device. DETAILED DESCRIPTION
[0019] Figure 1 A cross-sectional view of an embodiment of an electronics arrangement 50 is shown. The electronics arrangement 50 comprises a cooling device 1 and electrical and / or electronic components on the cooling device 1 . Figure 2 and Figure 3 The base plate 4 and the turbulators 6 of the cooling device 1 are shown, without the cover plate 3 for the sake of greater clarity.
[0020] The cooling device 1 is provided for cooling an electrical and / or electronic component 2, for example an electrical and / or electronic component of a power circuit. This can be, for example, a power circuit of a hybrid vehicle or an electric vehicle, for example an inverter structure or a converter structure. The electrical and / or electronic component 2 can be designed as a power module, for example, and can include, for example, a carrier substrate with a conductor circuit, on which, for example, power semiconductors are arranged, which together with the carrier substrate form an electronic device unit. During operation, the electrical and / or electronic component 2 generates heat, which must be conducted to the cooling device 1. For this purpose, the electrical and / or electronic component 2 is arranged on the cooling device 1, for example, on a supporting surface of a cover plate 3 or a base plate 4. One or more layers for fastening and thermally connecting the electrical and / or electronic component 2 to the cooling body 1 can be arranged between the cooling device 1 and the electrical and / or electronic component 2.
[0021] For example, a copper coating can be provided on the support surface of the cover plate 3 facing the electrical and / or electronic component 2. As in the illustrated embodiment, on the cooling device 1, a plurality of electrical and / or electronic components 2 can be arranged, for example, next to one another on the cover plate 3 of the cooling device 1. Each of the electrical and / or electronic components 2 is thus thermally connected to the cooling device 1 and fastened thereto.
[0022] The bottom plate 4 and the cover plate 3 form the outer wall of the cooling device 1. The bottom plate 4 forms the bottom of the cooling device 1. The cover plate 3 forms the top of the cooling device 1. The bottom plate 4 and the cover plate 3 can be made of a material with high thermal conductivity, such as metal, such as aluminum. The bottom plate 4 and the cover plate 3 are formed from a sheet material. The bottom plate 4 and / or the cover plate 3 have, for example, a constant thickness. The bottom plate 4 and the cover plate 3 can have, for example, the same thickness. However, the bottom plate 4 and the cover plate 3 can also have different thicknesses.
[0023] A recess 40 is formed in the bottom plate 4. Therefore, the bottom plate 4 is basically shaped like a pot. The cover plate 3 is arranged on the bottom plate 4 so that the recess 40 in the bottom plate 4 is covered by the cover plate 3. The bottom plate 4 and the cover plate 3 are arranged closely to each other so that a cooling channel 5 is formed between the bottom plate 4 and the cover plate 3 through the recess 40. The cooling channel 5 extends between the bottom plate 4 and the cover plate 3. The bottom plate 4 and the cover plate 3 form a wall that defines the cooling channel 5. The bottom plate 4 is configured as a deep-drawn part. An edge 41 of the bottom plate 4, which is configured in one plane, for example, is connected to an edge 31 of the cover plate 3. The area where the bottom plate 4 is connected to the cover plate 3 is called the contact area 8. The edge 41 of the bottom plate 4 surrounds the recess 40 in the bottom plate 4. The edge 41 of the bottom plate 4 is placed on the edge 31 of the cover plate 3, for example, directly or with an intermediate layer inserted. The edge 41 of the bottom plate 4 is fixedly connected, especially welded, to the edge 31 of the cover plate 3. The edge 41 of the bottom plate 4 can be connected, in particular welded, to the edge 31 of the cover plate 3 directly or with the insertion of one or more intermediate layers or intermediate elements. The edge 41 of the bottom plate 4 is connected to the edge 31 of the cover plate 3, for example, by a brazing process. The edge 41 of the bottom plate 4 is completely circumferentially connected, in particular welded, to the edge 31 of the cover plate 3.
[0024] In the region of the recess 40, the base plate 4 is spaced apart from the cover plate 3, so that a cavity through which flow can be formed is formed between the base plate 4 and the cover plate 3, in which the cooling channel 5 extends. Here, as in the embodiment, the edge 41 of the base plate 40 can extend in a planar manner in a first plane. In addition, a plate section 42 of the base plate 40, which forms the bottom of the recess 40, for example, can extend flatly in a second plane, which extends in particular parallel to the first plane. Therefore, the edge 41 of the base plate 40 and the plate section 42 of the base plate 4 are arranged flatly and parallel to each other. The cover plate 3 can be constructed flatly or can also be constructed as a deep-drawn part, for example. The recess 40 and therefore the cooling channel 5 can be constructed in an elongated manner with respect to the base plate 4, in particular, in a rectangular shape at least in sections. The cooling channel 5 extends at least in sections along the longitudinal direction 11. Preferably, when viewed toward the plate plane of the cover plate 3, the cooling channel 5 has an elongated region extending along the longitudinal direction 11, which is particularly defined by a straight line, and the elongated region has a rectangular geometry in particular.
[0025] For example, an intermediate plate can be provided between the cover plate 3 and the bottom plate 4. Such an intermediate plate can provide, for example, an additional spacing relative to the top of the bottom plate 4 in order to adjust the height of the cooling channel 5. Alternatively, as in the embodiment shown in the figure, the cover plate 3 and the first plate section 41 of the bottom plate 4 can also directly abut against each other.
[0026] In addition, the cooling device 1 includes an inflow opening not shown in the figure, through which a cooling fluid can be delivered to the cooling channel 5 in the cooling device 1. In addition, the cooling device 1 includes a discharge opening, through which a cooling fluid can flow out from the cooling channel 5 and the cooling device 1. The cooling fluid can be water, for example. The inflow opening and / or the discharge opening can be formed, for example, by an opening in the recess 40 of the base plate 4. The opening can be, for example, a through-hole in the base plate 4. For example, an inflow pipe connection piece can also be arranged or constructed at the inflow opening. Similarly, a discharge pipe connection piece can be arranged or constructed at the discharge opening. The cooling channel 5 can be penetrated by a cooling fluid flow of a cooling fluid from the inflow opening to the discharge opening. The cooling fluid can flow into the cooling channel 5 through the inflow opening of the cooling device 1, and flow out from the cooling channel 5 of the cooling device 1 through the discharge opening of the cooling device 1. The cooling channel 5 is configured to guide the cooling fluid through the cooling device 1. The cooling channel 5 in the cooling device 1 extends from the inflow opening to the discharge opening in the cooling device 1. A cooling fluid flow of a cooling fluid can flow through the cooling channel 5 along the longitudinal direction 11 from the inlet opening to the outlet opening.
[0027] The cooling device 1 also includes at least one turbulator 6. The turbulator 6 is arranged in the cooling channel 5. The turbulator 6 is arranged in a turbulator section 56 extending along the longitudinal direction 11 of the cooling channel 5. The turbulator 6 is arranged between the cover plate 3 and the base plate 4. The turbulator 6 can extend from the cover plate 3 completely through the cooling channel 5 to the base plate 4. In particular, the turbulator 6 is in indirect and / or direct heat conduction contact with the cover plate 3 and the base plate 4. The turbulator 6 is fastened to the cover plate 3 and / or the base plate 4, for example, by means of a brazing process. The turbulator 6 is flowed through by the cooling fluid along the longitudinal direction 11 parallel to the cover plate 3, for example, which is flat in structure, and / or parallel to the plate section 42, for example, which is flat in structure, of the base plate 4. The turbulator 6 has a surface-enlarged, flow-conducting and heat-transferring structure, especially in the turbulent region 61 of the turbulator 6. The turbulator 6 is made of, for example, a metal with good heat conduction, for example, made of aluminum. For example, the turbulator 6 can also have a coating. The turbulator 6 can be configured as a structured plate, for example. In order to achieve the highest possible cooling efficiency, the flow cross section of the cooling channel 5 between the base plate 4 and the cover plate 3 is filled with the turbulator 6 as much as possible. The turbulator 6 extends, for example, substantially parallel to the plate section 43 of the cover plate 3 and / or the base plate 4, which is configured to be flat, for example. For example, the turbulent region 61 of the turbulator 6 has substantially the same surface extension as the support surface on the cover plate 3 on which the electrical and / or electronic components 2 are arranged.
[0028] The turbulator 6 has a turbulence region 61 and at least one barrier region 62. The turbulator 6 is constructed in one piece, wherein the turbulence region 61 and the barrier region 62 represent regions of the integrally constructed turbulator 6. The turbulator 6 having the turbulence region 61 and the barrier region 62 is made of sheet metal.
[0029] The turbulence region 61 of the turbulator 6 is configured to generate turbulence in the cooling fluid. The turbulence region 61 is structured to generate turbulence in the cooling fluid. On the turbulator 6, in the turbulence region 61 of the turbulator 6, for example, a plurality of turbulence sections are constructed, which are arranged at an angle relative to the flow direction of the cooling fluid through the cooling channel 5, especially the longitudinal direction 11. The turbulence sections are used to form vortices in the cooling fluid flowing through the cooling channel 5. Heat can thereby be discharged particularly efficiently. The turbulence sections can be constructed, for example, in a wavy or serrated manner, or as periodically recurring ridges and / or recesses in the turbulator. The turbulence sections in the turbulence region 61 of the turbulator 6 can be constructed, for example, by cutting and reshaping the sheet material from which the turbulator 6 is made, for example, by stamping and bending.
[0030] In order to achieve high cooling efficiency, as large a portion of the flow cross section of the cooling channel 5 as possible is covered by the turbulator 6. Since the base plate 4 is a deep-drawn component, a demolding slope and radius at the edge of the recess 40 are required for the demolding process during deep drawing. The turbulence area 61 of the turbulator 6 is arranged below the electrical and / or electronic component 2. At the edge of the cooling channel 5, there is a bypass area 55 laterally beside the turbulence area 61 of the turbulator 6 and between the turbulence area 61 of the turbulator 6, the base plate 4 and the cover plate 3. Observed in the plane of the support surface for the electrical and / or electronic component 2, the bypass area 55 is located next to the electrical and / or electronic component 2. In the bypass area 55, the cooling channel 5 is constructed to be tapered. In the bypass area 55, no eddy currents occur in the cooling fluid flow.
[0031] In order to keep the flow through the bypass region 55 as low as possible and thus achieve the highest possible cooling effect of the cooling device 1, a blocking region 62 is formed on the turbulator 6. The blocking region 62 is arranged at the edge of the turbulator 6 located in the bypass region 55 next to the turbulence region 61. The blocking region 62 is arranged next to the turbulence region 61 of the turbulator 6 with respect to the longitudinal direction 11 of the cooling channel 5. The blocking region 62 extends from the turbulence region 61 into the bypass region 55. The blocking region 62 extends from the turbulence region 61 to the contact region 8, in which the cover plate 4 is in contact with the base plate 3.
[0032] The blocking area 62 has a geometry that is adapted to the demoulding geometry of the deep-drawn base plate 4. Here, the blocking area 62 has a shape that is adapted to the demoulding geometry of the base plate 4 so that the blocking area 62 can block as large a portion of the flow cross section in the bypass area 55 as possible. As a result, the bypass area 55 is substantially completely blocked by the blocking area 62. As a result, the cooling fluid flow must pass substantially completely through the turbulent area 61 of the turbulator 6 when flowing through the cooling channel 5. As a result, a particularly efficient use of the cooling potential of the cooling fluid flow is achieved and the electrical and / or electronic component 2 can be optimally cooled.
[0033] The blocking region 62 extends in a planar manner perpendicular to the, for example, flat cover plate 3. The blocking region 62 extends in a planar manner perpendicular to the, for example, flat plate section 42. Thus, the blocking region 62 opposes the flow of the cooling fluid in the cooling channel 5 in a planar manner. The blocking region 62 extends in a planar manner perpendicular to the longitudinal direction 11, for example. As a result, the cross section of the bypass region 55 available for flow is significantly reduced or completely filled.
[0034] The barrier region 62 is made of the same sheet metal as the turbulent region 61. For the barrier region 62, the sheet metal is bent out of a plane parallel to the cover plate 3 and / or the flat plate section 42 so that it extends in the barrier region 62 in a planar manner, for example perpendicularly or obliquely to the plane. In addition, the sheet metal can be punched in the barrier region 62 so that it is adapted to the geometry of the base plate 4 extending onto the cover plate 3 in the bypass region 55. Here, the sheet metal can be punched so that it abuts against the cover plate 3 and the base plate 4 in the bypass region 55 and / or can be connected to them. This is Figure 2 and Figure 3 Shown in.
[0035] Of course, further embodiments and combinations of the embodiments shown are also possible.
Claims
1. A cooling device for cooling an electrical and / or electronic component (2), comprising a cover plate (3) and a base plate (4), wherein: The base plate (4) is designed as a deep-drawn component with a recess (40), wherein the cover plate (3) and the base plate (4) are arranged in such a way that a cooling channel (5) is formed between the cover plate (3) and the base plate (4) through the recess (40), wherein the cover plate (3) and the base plate (4) are connected to each other at a contact area (8) outside the recess (40), wherein a cooling fluid flow of a cooling fluid can flow through the cooling channel (5) along a longitudinal direction (11), wherein the cooling device (1) further comprises at least one turbulator (6) which is arranged in a turbulator section (56) of the cooling channel (5), The invention is characterized in that a turbulent region (61) for generating local turbulence in the flow of the cooling fluid and a blocking region (62) for locally blocking the flow of the cooling fluid are configured on the turbulator (6).
2. The cooling device according to claim 1, characterized in that: The blocking region (62) extends from an edge (65) of the turbulent region (61) into a bypass region (55) of the cooling channel (5) between the base plate (4) and the cover plate (3).
3. A cooling device according to any one of the preceding claims, characterised in that The blocking region (62) of the turbulator (6) extends from the turbulent region (61) of the turbulator (6) toward the contact region (8) between the cover plate (3) and the base plate (4).
4. A cooling device according to any one of the preceding claims, characterised in that The turbulator (6) is formed from a bent sheet metal, wherein the sheet metal is bent in such a way that the blocking region (52) points in a planar manner in the longitudinal direction (11).
5. A cooling device according to any one of the preceding claims, characterised in that The barrier region (62) of the turbulator (6) extends at least partially flat in a plane perpendicular to the longitudinal direction (11).
6. A cooling device according to any one of the preceding claims, characterised in that The blocking area (62) of the turbulator (6) has a shape that is adapted to the geometry of the base plate (4), in particular to the edge of the recess (40).
7. A cooling device according to any one of the preceding claims, characterised in that The barrier region (62) extends over the surface from the turbulence region (61) to the contact region (8) between the cover plate (3) and the base plate (4).
8. A cooling device according to any one of the preceding claims, characterised in that A plurality of barrier regions (62), in particular of similar design, are formed on the turbulator (6).
9. The cooling device according to claim 8, characterized in that The barrier region (62) is formed at the opposite edge (65) of the turbulence region (61).
10. An electronic device apparatus, comprising: - A cooling device (1) according to any one of the preceding claims, and At least one electrical and / or electronic component (2) to be cooled, wherein the electrical and / or electronic component (2) is arranged on the cover plate (3) or on the base plate (4).