Efficient waste crystal sorting and recycling system
Through the design of the waste crystal efficient sorting and recycling system, the positioning mobile platform and the rotating crystal mechanism are used for logical movement and positive pressure blowing to recycling, and bad grains solve the problem of low sorting efficiency and high bad rate in existing technologies. , Realizing efficient sorting and 100 % good product rate.
Patent Information
- Application Number
- CN202411275791.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-01-24
AI Technical Summary
The prior art has low efficiency in the semiconductor grain sorting process. It takes 24 hours to sort a wafer conventionally, and the defective rate is high, which affects production efficiency.
An efficient waste crystal sorting and recovery system is designed, including a positioning mobile platform, a rotating crystal picking mechanism, a waste crystal recycling mechanism and a servo control mechanism. It recovers bad crystals through logical motion and positive pressure blowing to achieve efficient sorting.
It achieves a 100% delivery state of the die yield rate on the wafer blue diaphragm, reduces production time, improves production efficiency, and ensures cleanliness in the stage.
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Figure CN119346472A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of semiconductor crystal grain sorting, and in particular relates to a waste crystal efficient sorting and recycling system. Background Art
[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. It is generally round in shape. A die is a small piece on the wafer, which is a chip wafer body. After packaging, it becomes a particle. In the production process of the die, defects, contamination, size deviation, electrical parameter differences and other defective products usually appear. The current process is to determine the coordinates of different levels of qualified wafers and defective products through detection, and sort the qualified products onto the BIN blue film through sorting technology. In the production process of semiconductors from wafers to die (chips), it is completely impossible to achieve a 100% product yield. In this way, it is necessary to sort the products on the wafer. Conventional production is to select qualified products to ensure 100% yield out of the warehouse. For different grades of products (for example, 0406 size and below, the number of die in each wafer disk reaches 700,000, and the defective rate is less than 15%), it takes about 24 hours to sort a wafer conventionally, and the abnormality rate of the operation process is high. Summary of the invention
[0003] In view of this, an object of the present invention is to provide a waste crystal efficient sorting and recycling system to solve the deficiencies in the prior art.
[0004] In order to achieve the above object, the present invention is achieved through the following technical solutions:
[0005] Provided is a waste crystal efficient sorting and recycling system, which includes:
[0006] The positioning mobile platform includes a wafer clamping and fixing table, an X-axis moving mechanism and a Y-axis moving mechanism. The wafer clamping and fixing table realizes movement in the X-axis direction and the Y-axis direction through the X-axis moving mechanism and the Y-axis moving mechanism respectively. The waste crystals to be sorted are fixed on the wafer clamping and fixing table and are equipped with a crystal blue film.
[0007] A rotating crystal picking mechanism comprises a rotating table, a first temporary attachment end and a second temporary attachment end, wherein the first temporary attachment end and the second temporary attachment end are fixed on the rotating table;
[0008] A waste crystal recovery mechanism, when the position of the defective product is facing the first temporary attachment end, the second temporary attachment end enters the waste crystal recovery mechanism, and when the position of the defective product is facing the second temporary attachment end, the first temporary attachment end enters the waste crystal recovery mechanism;
[0009] The servo control mechanism controls the positioning mobile platform, the rotating crystal picking mechanism and the waste crystal recovery mechanism to perform specified actions at specified times.
[0010] As described above, the efficient waste crystal sorting and recycling system further includes a scanning and combining mechanism, which scans and combines the grains on the wafer blue film, determines the mechanical coordinate position of the defective product and feeds back to the servo control mechanism.
[0011] As described in the waste crystal efficient sorting and recycling system, wherein the waste crystal recycling mechanism includes a blowing mechanism, a storage box and a discharge outlet which are connected in sequence.
[0012] As described in the waste crystal efficient sorting and recycling system, wherein the first temporary attachment end is a first suction nozzle, the second temporary attachment end is a second suction nozzle, and the rotary crystal picking mechanism also includes a pressure mechanism, which provides negative pressure for the first suction nozzle and the second suction nozzle.
[0013] As described in the waste crystal efficient sorting and recycling system, wherein the rotary crystal picking mechanism also includes a heat dissipation mechanism and a manual angle fine-tuning mechanism.
[0014] As described in the waste crystal efficient sorting and recycling system, wherein the first suction nozzle and the second suction nozzle are arranged back to back.
[0015] As described in the waste crystal efficient sorting and recycling system, wherein the X-axis moving mechanism includes an X-axis servo motor, an X-axis slide rail and an X-axis lead screw, and the X-axis lead screw moves back and forth along the X-axis slide rail driven by the X-axis servo motor; the Y-axis moving mechanism includes a Y-axis servo motor, a Y-axis slide rail and a Y-axis lead screw, and the Y-axis lead screw moves back and forth along the Y-axis slide rail driven by the Y-axis servo motor, and the X-axis lead screw and the Y-axis lead screw are fixedly connected to the wafer clamping and fixing table.
[0016] As described in the waste crystal efficient sorting and recycling system, wherein the waste crystals to be sorted on the wafer clamping and fixing table are arranged vertically.
[0017] The beneficial effects of the technical solution of the present invention are:
[0018] After picking out the defective grains on the wafer side, they are blown directly into the waste crystal tank. After sorting out the unnecessary grade products, the qualification rate of the whole wafer (product yield) reaches 100%, which meets the delivery requirements. At the same time, the defective grains are collected by the recycling box to ensure the cleanliness of the table and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] To further illustrate the above-mentioned objectives, structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings.
[0020] Figure 1It is a schematic diagram of the overall structure of a preferred embodiment of the present invention;
[0021] Figure 2 This is a schematic diagram of the structure of a positioning mobile platform in a preferred embodiment of the present invention;
[0022] Figure 3 This is a schematic diagram of the structure of a rotary crystal picking mechanism according to a preferred embodiment of the present invention;
[0023] Figure 4 This is a schematic diagram of the structure of a waste crystal recovery mechanism according to a preferred embodiment of the present invention;
[0024] In the figure: 1. Positioning mobile platform; 101. Wafer clamping and fixing table; 102. Crystal grain blue diaphragm; 103. X-axis servo motor; 104. X-axis screw; 105. Y-axis servo motor; 106. Y-axis screw; 2. Rotary crystal picking mechanism; 201. Rotary table; 202. First suction nozzle; 203. Second suction nozzle; 204. Heat dissipation mechanism; 205. Manual angle fine-tuning mechanism; 3. Waste crystal recovery mechanism; 301. Blowing mechanism; 302. Storage box; 303. Discharge outlet; 304. High-speed solenoid valve. DETAILED DESCRIPTION
[0025] The terms "invention", "present invention" and "the present invention" used in this specification are intended to refer broadly to all subject matter of this specification and any patent claims below. Statements containing these terms should not be understood to limit the subject matter described herein or to limit the meaning or scope of any patent claim below. In addition, this specification does not attempt to describe or limit the subject matter covered by any claim of any specific component, paragraph, statement or figure of this application. The subject matter should be understood with reference to the entire specification, all drawings and any claims below. The present invention may have other embodiments and be practiced or implemented in other ways. Moreover, it should be understood that the words and terms used herein are for illustrative purposes and should not be considered as limiting.
[0026] The details of the present invention will now be discussed with reference to the accompanying drawings which illustrate the present invention by way of example only. In the accompanying drawings, similar features or components may be marked with the same reference numerals.
[0027] The use of "including," "having," and "comprising" and variations thereof herein is meant to encompass the items listed thereafter and their equivalents and additional items. Although reference may be made to directions such as above, below, upward, downward, rearward, bottom, top, front, rear, etc., in describing the drawings, for convenience, reference is made relative to the drawings. These directions are not intended to literally accept or limit the present invention in any form. In addition, terms such as "first," "second," "third," etc., are used herein for illustrative purposes and are not intended to indicate or imply importance or significance.
[0028] The design idea of this case is that the system controls the wafer platform to move in X and Y directions to locate the position of the grains, and through logical movement, transports the defective grains that need to be removed to the waste crystal recovery position, uses the positive pressure of the recovery device to blow off the grains and recover them into the waste crystal box, so as to achieve a 100% yield rate of the grains on the wafer blue film.
[0029] See also Figure 1 As shown, in a preferred embodiment, the waste crystal efficient sorting and recycling system of the present invention comprises a positioning mobile platform 1, a rotating crystal picking mechanism 2, a waste crystal recycling mechanism 3 and a servo control mechanism. The positioning mobile platform 1 fixes the wafer and moves in the X and Y directions to locate the crystal grain position, the rotating crystal picking mechanism 2 transports the defective crystal grains to be removed to the waste crystal recycling position, the waste crystal recycling mechanism 3 blows off the crystal grains through positive pressure and recycles them, and the servo control mechanism controls the positioning mobile platform 1, the rotating crystal picking mechanism 2 and the waste crystal recycling mechanism 3 to perform specified actions at specified times.
[0030] See also Figure 2 As shown, the positioning mobile platform 1 includes a wafer clamping and fixing table 101, an X-axis moving mechanism and a Y-axis moving mechanism. The wafer clamping and fixing table 101 realizes X-axis movement and Y-axis movement through the X-axis moving mechanism and the Y-axis moving mechanism respectively. The waste wafers to be sorted are fixed on the wafer clamping and fixing table 101 and are equipped with a grain blue membrane 102.
[0031] The X-axis moving mechanism includes an X-axis servo motor 103, an X-axis slide rail and an X-axis lead screw 104. The X-axis lead screw 104 moves back and forth along the X-axis slide rail driven by the X-axis servo motor 103. The Y-axis moving mechanism includes a Y-axis servo motor 105, a Y-axis slide rail and a Y-axis lead screw 106. The Y-axis lead screw 106 moves back and forth along the Y-axis slide rail driven by the Y-axis servo motor 105. The X-axis lead screw 104 and the Y-axis lead screw 106 are fixedly connected to the wafer clamping and fixing table 101.
[0032] See also Figure 3 As shown, the rotary crystal picking mechanism 2 includes a rotating table 201, a first temporary attachment end and a second temporary attachment end, and the first temporary attachment end and the second temporary attachment end are fixed on the rotating table 201. When the position of the defective product is facing the first temporary attachment end, the second temporary attachment end enters the waste crystal recovery mechanism 3, and when the position of the defective product is facing the second temporary attachment end, the first temporary attachment end enters the waste crystal recovery mechanism 3.
[0033] Furthermore, the sorting and recycling system also includes a scanning and combining mechanism, which scans and combines the grains on the wafer blue film, determines the mechanical coordinate position of the defective products and feeds back to the servo control mechanism.
[0034] See also Figure 3As shown, the first temporary attachment end is the first suction nozzle 202, the second temporary attachment end is the second suction nozzle 203, and the rotating crystal picking mechanism 2 also includes a pressure mechanism, which provides negative pressure for the first suction nozzle 202 and the second suction nozzle 203, so that defective crystal grains can be adsorbed on the first suction nozzle 202 or the second suction nozzle 203.
[0035] Furthermore, the rotary crystal picking mechanism 2 further includes a heat dissipation mechanism 204 and a manual angle fine-tuning mechanism 205. In a preferred embodiment, the heat dissipation mechanism 204 may adopt a longitudinally arranged multi-layer metal fin structure, and the unit of the manual angle fine-tuning mechanism 205 is 0.1°.
[0036] The first suction nozzle 202 and the second suction nozzle 203 are arranged opposite to each other, that is, when the rotating table 201 rotates 180 degrees, the positions of the first suction nozzle 202 and the second suction nozzle 203 are interchanged. The waste wafers to be sorted on the wafer clamping and fixing table 101 are arranged vertically, and accordingly, the suction surfaces of the first suction nozzle 202 and the second suction nozzle 203 are also vertical surfaces.
[0037] Continue to view Figure 4 As shown, the waste crystal recovery mechanism 3 includes a blowing mechanism 301, a storage box 302 and a discharge outlet 303 which are connected in sequence. The blowing mechanism 301 can use a high-speed electromagnetic valve 304 to achieve blowing. In the preferred embodiment, the blowing mechanism 301 has a recess structure that can accommodate the first temporary attachment end or the second temporary attachment end. When the first temporary attachment end or the second temporary attachment end enters the recess structure, the high-speed electromagnetic valve 304 opens, and a downward airflow is generated at the upper part of the recess structure, so that the defective crystal grains attached to the first temporary attachment end or the second temporary attachment end are blown into the storage box 302 below.
[0038] During operation, the system first instructs the scanning and combining of the grains on the blue diaphragm of the wafer to determine the mechanical coordinate position of the defective product, and the servo system controls the movement of the positioning mobile platform 1 to drive the grains on the blue diaphragm 102 to move to the picking position (the target grain is opposite the suction nozzle); then the system logic coordinates the movement, and the first suction nozzle 202 with negative pressure removes the grain to be picked and adsorbs it on the suction nozzle. The servo system controls the rotating crystal picking mechanism 2 to rotate 180° clockwise, so that the grains on the first suction nozzle 202 enter the blowing mechanism 301. The system instructs the high-speed solenoid valve 304 to open, and the suction nozzle positive pressure is turned on at the same time, and the blowing mechanism 301 generates airflow downward to blow the grains into the storage box 302.
[0039] After the first suction nozzle 202 rotates 180° clockwise, the second suction nozzle 203 is in the picking position. At the same time, during the rotation of the rotary crystal picking mechanism 2, the servo system controls the positioning mobile platform 1 to move the next crystal to be picked to the picking position. While the crystals on the first suction nozzle 202 are blown away, the second suction nozzle 203 performs the crystal picking action. After the first suction nozzle 202 blows the crystals and the second suction nozzle 203 takes the crystals, the rotary crystal picking mechanism 2 rotates 180° counterclockwise. At this time, the second suction nozzle 203 performs the crystal blowing action, and the first suction nozzle 202 repeats the previous crystal picking action.
[0040] In this way, a closed-loop process is formed, which is realized by the logical coordination of the movement of the positioning mobile platform 1, the rotating crystal picking mechanism 2, and the waste crystal recovery mechanism 3. The unqualified crystals on the left are picked one by one and put into the waste crystal recovery box on the right. When the crystals in the storage box 302 are full, the valve is opened to release the unqualified crystals for scrapping, ensuring that the storage box 302 can continue to store crystals.
[0041] Through the cooperation of the above mechanism and the servo control system, all unqualified grains on the blue film of the wafer can be removed, so that the yield rate reaches 100% outbound status.
[0042] The present invention removes defective products and unnecessary grade products to ensure that the yield rate is 100%. For example: 4-inch wafers cut 0406-size grains, one wafer has about 70W grains, and usually about 85% of qualified products are detected. If the conventional process is used, one wafer needs 24 hours to complete. By removing the 15% defective products and unnecessary grade products, one wafer can be completed in 6 hours, and the production efficiency is increased by 4 times.
[0043] The above are only preferred embodiments of the present invention, and are not intended to limit the implementation methods and protection scope of the present invention. Those skilled in the art should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.
Claims
1. A waste crystal efficient sorting and recycling system, characterized in that: include: The positioning mobile platform includes a wafer clamping and fixing table, an X-axis moving mechanism and a Y-axis moving mechanism. The wafer clamping and fixing table realizes movement in the X-axis direction and the Y-axis direction through the X-axis moving mechanism and the Y-axis moving mechanism respectively. The waste crystals to be sorted are fixed on the wafer clamping and fixing table and are equipped with a crystal blue film. A rotating crystal picking mechanism comprises a rotating table, a first temporary attachment end and a second temporary attachment end, wherein the first temporary attachment end and the second temporary attachment end are fixed on the rotating table; A waste crystal recovery mechanism, when the position of the defective product is facing the first temporary attachment end, the second temporary attachment end enters the waste crystal recovery mechanism, and when the position of the defective product is facing the second temporary attachment end, the first temporary attachment end enters the waste crystal recovery mechanism; The servo control mechanism controls the positioning mobile platform, the rotating crystal picking mechanism and the waste crystal recovery mechanism to perform specified actions at specified times.
2. The waste crystal efficient sorting and recycling system as claimed in claim 1 is characterized in that: It also includes a scanning and combining mechanism, which scans and combines the grains on the wafer blue film, determines the mechanical coordinate position of the defective product and feeds it back to the servo control mechanism.
3. The waste crystal efficient sorting and recycling system as claimed in claim 1 is characterized in that: The waste crystal recovery mechanism comprises an air blowing mechanism, a storage box and a discharge outlet which are connected in sequence.
4. The waste crystal efficient sorting and recycling system as claimed in claim 1 is characterized in that: The first temporary attachment end is a first suction nozzle, the second temporary attachment end is a second suction nozzle, and the rotary crystal picking mechanism further includes a pressure mechanism, which provides negative pressure for the first suction nozzle and the second suction nozzle.
5. The waste crystal efficient sorting and recycling system as claimed in claim 4 is characterized in that: The rotary crystal picking mechanism also includes a heat dissipation mechanism and a manual angle fine-tuning mechanism.
6. The waste crystal efficient sorting and recycling system as claimed in claim 4 is characterized in that: The first suction nozzle and the second suction nozzle are arranged opposite to each other.
7. The waste crystal efficient sorting and recycling system as claimed in claim 1 is characterized in that: The X-axis moving mechanism includes an X-axis servo motor, an X-axis slide rail and an X-axis lead screw. The X-axis lead screw moves back and forth along the X-axis slide rail driven by the X-axis servo motor. The Y-axis moving mechanism includes a Y-axis servo motor, a Y-axis slide rail and a Y-axis lead screw. The Y-axis lead screw moves back and forth along the Y-axis slide rail driven by the Y-axis servo motor. The X-axis lead screw and the Y-axis lead screw are fixedly connected to the wafer clamping and fixing table.
8. The waste crystal efficient sorting and recycling system as claimed in claim 1 is characterized in that: The waste wafers to be sorted on the wafer clamping and fixing table are arranged vertically.