Flexible chip production system and method

Abstract

The invention relates to the technical field of flexible chip production, in particular to a flexible chip production system and method.The flexible chip production system comprises a production line track, a mounting frame, an air blowing pump, an air blowing row, a first dust collection box, a plurality of magnetic suction plates, a rubber bottom plate, a flow guide plate, a negative pressure air pump and a second dust collection box; the first dust collection box corresponds to the air blowing row, air flow enters the first dust collection box after passing through the surface of the chip, a plurality of magnetic suction plates are arranged in the first dust collection box, the magnetic suction plates adsorb metal dust on the surface, the flow guide plate inclines downwards, the air flow blows the surface of the chip again, dust impurities on the surface of the chip are further blown away, and the negative pressure air pump is used for sucking out the air flow. Dust carried by the airflow is also sucked out; according to the device, airflow blown out by the air pump is utilized for multiple times, the blowing dust removal effect is improved, and therefore the problems that an existing device is not thorough in blowing and poor in dust removal effect are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible chip production, and in particular to a flexible chip production system and method. Background Art

[0002] Flexible chips are a branch of flexible electronics, with incomparable advantages over traditional silicon-based electronics. Their emergence has overturned the physical form of traditional rigid circuits, promoted the integration of man, machine and objects, and demonstrated broad application potential in the fields of communications, digital medicine, intelligent manufacturing, and the Internet of Things. Due to the small size of flexible chips, the distance between their chip pins is usually within 20-25um, and in automated production, metal dust that is invisible to the naked eye will inevitably be generated; in the packaging process, if metal dust falls on the product, it will short-circuit the pins and cause the driver chip to fail.

[0003] The existing patent discloses a dust remover for flexible circuit board and chip surface before COF flip chip bonding (CN203695518U). The blower structure is divided into upper and lower parts, each part is embedded with multiple blowing nozzles and an air inlet, each blowing nozzle is connected to the air inlet, the axis of the blowing nozzle hole in the upper part is at an angle of 45° with the horizontal plane, and the axis of the blowing nozzle hole in the lower part is perpendicular to the horizontal plane; the lower part of the blower structure is provided with a suction dust collection device. The utility model blows away foreign matter on the chip surface before the chip is about to be produced and bonded, which can effectively avoid re-contamination of the chip caused by any process before production; when the dust remover is working, the suction dust collection device works at the same time, which can timely suck away and collect foreign matter blown off by the blowing, effectively avoiding secondary pollution caused by foreign matter blown off.

[0004] However, this device only cooperates with the blower mechanism and the air suction dust collection device, and only removes dust by simple wind power once, which is easy to not blow cleanly and the dust removal effect is poor. Summary of the invention

[0005] The purpose of the present invention is to provide a flexible chip production system and method, aiming to solve the problem that the existing device is not clean enough and the dust removal effect is poor.

[0006] To achieve the above-mentioned objectives, in a first aspect, the present invention provides a flexible chip production system, comprising a production line track, a mounting frame, a blowing air pump, a blowing row, a first dust box, a plurality of magnetic plates, a rubber bottom plate, a guide plate, a negative pressure air pump and a second dust box, wherein the mounting frame is fixed on the production line track; the blowing air pump is fixed on the mounting frame; the blowing row is connected to the output end of the blowing air pump and is fixed above the production line track; the first dust box corresponds to the blowing row and is fixed above the production line track; a plurality of the magnetic plates are staggered in the first dust box; the rubber bottom plate is fixed below the first dust box; the guide plate is fixed to a side of the first dust box away from the blowing row; the negative pressure air pump is arranged above the production line track; the second dust box is connected to the input end of the negative pressure air pump and is arranged behind the first dust box.

[0007] Among them, the flexible chip production system also includes a first sliding box and a pull rod, the first sliding box is slidably set in the first dust suction box and is fixedly connected to the plurality of magnetic suction plates; the pull rod is fixed to the side of the first sliding box.

[0008] The flexible chip production system further comprises a second sliding box and a flannel tube, wherein the second sliding box is slidably disposed in the second dust collection box; and the flannel tube is fixed in the second sliding box.

[0009] Wherein, the flexible chip production system further includes a sealing box, which is fixedly connected to the production line track and is arranged behind the second dust collection box.

[0010] Wherein, the flexible chip production system further includes a filter box and a plurality of dust suction filter elements, wherein the filter box is arranged at the input end of the blowing air pump; and the plurality of dust suction filter elements are arranged in the filter box.

[0011] Wherein, the flexible chip production system further includes a dust shield, and the dust shield is fixed on the side of the mounting frame.

[0012] In the second aspect, a flexible chip production method is applied to the flexible chip production system, including: transporting the flexible chip on the production line track and packaging it; starting the air pump to blow the chip surface; the blown air flow passes through the first dust box to remove metal dust; the air flow blows the chip again through the guide plate; starting the negative pressure air pump to suck the air flow out of the second dust box.

[0013] The present invention relates to a flexible chip production system and method, wherein the production line track is used to transport flexible chips and perform packaging processing on them, the mounting frame is used to place the blowing air pump, the blowing row is connected to the output end of the blowing air pump, and is used to blow the airflow generated by the blowing air pump to the chip surface to blow out metal dust and other fine impurities, the first dust collection box corresponds to the blowing row, and when the airflow blown out passes through the chip surface, it enters the first dust collection box, and a plurality of the magnetic suction plates are arranged in the first dust collection box, and the magnetic suction plates are staggered so as not to affect the air The outflow of the air flow will adsorb metal dust on its surface, and the rubber bottom plate is used to shield and isolate the magnetic suction plate to avoid it affecting the chip; the guide plate is tilted downward, which will allow the airflow passing through the first dust suction box to blow the chip surface again, and further blow away the dust and impurities on the surface; the negative pressure air pump is used to suck out the air flow through the second dust suction box, and also suck out the dust carried by the air flow to avoid affecting the chip packaging; the present invention improves the blowing and dust removal effect by repeatedly utilizing the air flow blown out by the air pump, thereby solving the problem that the existing device does not blow cleanly and the dust removal effect is poor. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0015] Figure 1 It is a structural schematic diagram of a flexible chip production system according to the first embodiment of the present invention.

[0016] Figure 2 The present invention relates to a flexible chip production system according to the first embodiment of the present invention.

[0017] Figure 3 It is a partially enlarged view of detail A of a flexible chip production system according to the first embodiment of the present invention.

[0018] Figure 4 It is a flow chart of a flexible chip production method according to the second embodiment of the present invention.

[0019] Figure 5 It is a structural schematic diagram of a flexible chip production system according to the third embodiment of the present invention.

[0020] 101-production line track, 102-mounting frame, 103-air blowing pump, 104-air blowing row, 105-first dust suction box, 106-magnetic suction plate, 107-rubber bottom plate, 108-guide plate, 109-negative pressure air pump, 110-second dust suction box, 111-first sliding box, 112-pull rod, 113-second sliding box, 114-flannel tube, 115-sealing box, 116-filter box, 117-dust filter element, 118-dust baffle, 201-glass side panel, 202-flip cover, 203-fixed hook, 204-hanging ring, 205-hanging rope. DETAILED DESCRIPTION

[0021] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0022] For the first embodiment, please refer to Figure 1 to Figure 3 , Figure 1 is a structural schematic diagram of a flexible chip production system according to a first embodiment of the present invention; Figure 2 A flexible chip production system according to the first embodiment of the present invention; Figure 3 It is a partially enlarged view of detail A of a flexible chip production system according to the first embodiment of the present invention.

[0023] The present invention provides a flexible chip production system: including a production line track 101, a mounting frame 102, a blowing air pump 103, a blowing row 104, a first dust suction box 105, multiple magnetic suction plates 106, a rubber bottom plate 107, a guide plate 108, a negative pressure air pump 109, a second dust suction box 110, a first sliding box 111, a pull rod 112, a second sliding box 113, a flannel tube 114, a sealing box 115, a filter box 116, multiple dust suction filter elements 117 and a dust baffle 118.

[0024] The aforementioned solution solves the problem that the existing device does not blow cleanly and has poor dust removal effect. It can be understood that the aforementioned solution can reuse the airflow blown out by the air pump multiple times to improve the blowing and dust removal effect.

[0025] In this embodiment, the mounting frame 102 is fixed on the production line track 101; the blowing air pump 103 is fixed on the mounting frame 102; the blowing row 104 is connected to the output end of the blowing air pump 103 and is fixed above the production line track 101; the first dust collection box 105 corresponds to the blowing row 104 and is fixed above the production line track 101; a plurality of magnetic suction plates 106 are staggered in the first dust collection box 105; the rubber bottom plate 107 is fixed in the The first dust box 105 is below; the guide plate 108 is fixed to the side of the first dust box 105 away from the blowing row 104; the negative pressure air pump 109 is arranged above the production line track 101; the second dust box 110 is connected to the input end of the negative pressure air pump 109 and is arranged behind the first dust box 105; the production line track 101 is used to transport flexible chips and perform packaging processing on them, the mounting frame 102 is used to place the blowing air pump 103, the blowing row 104 and The output end of the blowing air pump 103 is connected to the chip surface to blow the airflow generated by the blowing air pump 103 to blow out the metal dust and other fine impurities. The first dust box 105 corresponds to the blowing row 104. When the airflow blown out passes through the chip surface, it enters the first dust box 105. The first dust box 105 is provided with a plurality of magnetic suction plates 106. The magnetic suction plates 106 are staggered and do not affect the outflow of the airflow, but will absorb the metal dust on its surface. The rubber bottom plate 107 is used to The magnetic plate 106 is shielded and isolated to prevent it from affecting the chip; the guide plate 108 is tilted downward, so that the airflow passing through the first dust collection box 105 will blow the chip surface again to further blow away the dust and impurities on the surface; the negative pressure air pump 109 is used to suck out the airflow through the second dust collection box 110, and also suck out the dust carried by the airflow to avoid affecting the chip packaging; the present invention improves the blowing and dust removal effect by repeatedly utilizing the airflow blown out by the air pump, thereby solving the problem that the existing device does not blow cleanly and has a poor dust removal effect.

[0026] Among them, the first sliding box 111 is slidably set in the first dust collection box 105, and is fixedly connected to the multiple magnetic plates 106; the pull rod 112 is fixed to the side of the first sliding box 111; the first sliding box 111 is used to install multiple magnetic blocks, and can be quickly pulled out through the pull rod 112, so as to facilitate cleaning of metal dust adsorbed on the magnetic blocks.

[0027] Secondly, the second sliding box 113 is slidably arranged in the second dust collection box 110; the flannel cylinder 114 is fixed in the second sliding box 113; the second sliding box 113 is used to install the flannel cylinder 114, and the flannel cylinder 114 is used to absorb dust to improve the dust removal effect.

[0028] Again, the sealing box 115 is fixedly connected to the production line track 101 and is disposed behind the second dust collecting box 110; the sealing box 115 is used to wrap and seal the dust-removed chips to reduce the dust from falling onto the chips again after dust removal.

[0029] Then, the filter box 116 is arranged at the input end of the blowing air pump 103; a plurality of the dust collecting filters 117 are arranged in the filter box 116; the filter box 116 is used to install a plurality of the dust collecting filters 117 to reduce the dust in the air sucked in by the blowing air pump 103.

[0030] Finally, the dust shield 118 is fixed to the side of the mounting frame 102; the dust shield 118 is used to reduce the dust accumulation from above and fall onto the chip.

[0031] During use, the production line track 101 is used to transport flexible chips and perform packaging processing on them. The mounting frame 102 is used to place the blowing air pump 103. The blowing row 104 is connected to the output end of the blowing air pump 103, and is used to blow the airflow generated by the blowing air pump 103 to the surface of the chip to blow out metal dust and other fine impurities. The first dust collection box 105 corresponds to the blowing row 104. When the airflow blown out passes through the surface of the chip, it enters the first dust collection box 105. A plurality of magnetic suction plates 106 are arranged in the first dust collection box 105. The magnetic suction plates 106 are staggered and do not affect the outflow of the airflow, but will adsorb the metal dust on their surface. The rubber bottom plate 107 is used to shield and isolate the magnetic suction plates 106 to prevent them from affecting the chip; the guide plate 108 is tilted downward, which will allow the airflow passing through the first dust collection box 105 to blow the chip surface again, further blowing away the surface The dust impurities, the negative pressure air pump 109 is used to suck out the airflow through the second dust suction box 110, and also suck out the dust carried by the airflow to avoid affecting the chip packaging; the first sliding box 111 is used to install a plurality of the magnetic blocks, and can be quickly pulled out through the pull rod 112, so as to facilitate the cleaning of the metal dust adsorbed on the magnetic blocks; the second sliding box 113 is used to install a velvet cylinder 114, and the velvet cylinder 114 is used to adsorb dust and improve the dust removal effect; the sealing box 115 is used to wrap and seal the chip after dust removal to reduce the dust from falling on the chip again after dust removal; the filter box 116 is used to install a plurality of the dust suction filter elements 117 to reduce the dust in the air sucked by the blowing air pump 103; the dust baffle 118 is used to reduce the dust deposition above and fall on the chip; the present invention improves the blowing and dust removal effect by repeatedly utilizing the airflow blown out by the air pump, thereby solving the problem that the existing device does not blow cleanly and the dust removal effect is poor.

[0032] For the second embodiment, please refer to Figure 4, Figure 4 It is a flow chart of a flexible chip production method according to the second embodiment of the present invention.

[0033] On the basis of the first embodiment, a flexible chip production method of the present invention is applied to the flexible chip production system, including: S1: the production line track 101 transports the flexible chip and packages it; this step is used to receive the chip produced in the previous process and package it during transportation.

[0034] S2: Start the air pump 103 to blow air on the chip surface; this step is the preliminary dust removal of the chip to blow out metal dust or other dust impurities.

[0035] S3: The blown airflow passes through the first dust collection box 105 to remove the metal dust; this step is used to remove the metal dust through the magnetic block in the first dust collection box 105.

[0036] S4: The airflow passes through the guide plate 108 and blows the chip again; the guide plate 108 tilts downward to blow the airflow to the chip surface again.

[0037] S5: Start the negative pressure air pump 109 to suck the air out of the second dust collection box 110; the second dust collection box 110 is provided with the flannel tube 114 to absorb other dust and impurities.

[0038] For the third embodiment, please refer to Figure 5 , Figure 5 It is a structural schematic diagram of a flexible chip production system according to the third embodiment of the present invention.

[0039] On the basis of the second embodiment, a flexible chip production system of the present invention further includes a glass side panel 201 , a flip cover 202 , a fixing hook 203 , a hanging ring 204 and a hanging rope 205 .

[0040] The glass side panel 201 is arranged on the side of the dust shield 118; the flip cover 202 is rotatably arranged on the glass side panel 201; the glass side panel 201 is used to reduce the suction of dust from the side and facilitate observation; the flip cover 202 corresponds to the first sliding box 111 and the second sliding box 113, and is used to reserve space for sliding them out conveniently.

[0041] The fixing hook 203 is fixed on the glass side panel 201; the hanging rope 205 is fixed on the flip cover 202; the hanging ring 204 is fixed on the hanging rope 205; the fixing hook 203 is used to hang the hanging ring 204, and then temporarily fix it when the flip cover 202 is flipped out, so as to facilitate the sliding out of the first sliding box 111 and the second sliding box 113; the hanging rope 205 is used to connect the hanging ring 204.

[0042] What is disclosed above is only a preferred embodiment of the present invention, and it certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope of the invention.

Claims

1. A flexible chip production system, characterized in that: It includes a production line track, a mounting frame, a blower pump, a blower row, a first dust box, a plurality of magnetic suction plates, a rubber bottom plate, a guide plate, a negative pressure air pump and a second dust box, wherein the mounting frame is fixed on the production line track; the blower pump is fixed on the mounting frame; the blower row is connected to the output end of the blower pump and is fixed above the production line track; the first dust box corresponds to the blower row and is fixed above the production line track; a plurality of magnetic suction plates are staggered in the first dust box; The rubber bottom plate is fixed below the first dust box; the guide plate is fixed on the side of the first dust box away from the blowing row; the negative pressure air pump is arranged above the production line track; the second dust box is connected to the input end of the negative pressure air pump and is arranged behind the first dust box.

2. A flexible chip production system as claimed in claim 1, characterized in that: The flexible chip production system also includes a first sliding box and a pull rod. The first sliding box is slidably arranged in the first dust suction box and is fixedly connected to the plurality of magnetic suction plates; the pull rod is fixed to the side of the first sliding box.

3. A flexible chip production system as claimed in claim 2, characterized in that: The flexible chip production system further comprises a second sliding box and a flannel cylinder, wherein the second sliding box is slidably disposed in the second dust collecting box; The flannel tube is fixed in the second sliding box.

4. A flexible chip production system as claimed in claim 3, characterized in that: The flexible chip production system also includes a sealing box, which is fixedly connected to the production line track and is arranged behind the second dust collection box.

5. A flexible chip production system as claimed in claim 4, characterized in that: The flexible chip production system also includes a filter box and a plurality of dust suction filter elements. The filter box is arranged at the input end of the air pump; and the plurality of dust suction filter elements are arranged in the filter box.

6. A flexible chip production system as claimed in claim 5, characterized in that: The flexible chip production system further includes a dust shield plate, which is fixed on a side of the mounting frame.

7. A flexible chip production method, applied to a flexible chip production system as claimed in claims 1 to 6, characterized in that: Including: production line track transportation of flexible chips and packaging; Start the air pump to blow the chip surface; The blown airflow passes through the first dust collection box to remove metal dust; The airflow blows the chip again through the guide plate; Start the negative pressure air pump to suck the air out of the second dust box.

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