An automatic packaging device for semiconductor etching liquid

Abstract

The invention discloses an automatic packaging device for semiconductor etching liquid, comprising a packaging table, two sets of parallel conveyor belts are installed on the packaging table, a weighing mechanism is provided in the middle between the two sets of conveyor belts, the weighing mechanism can weigh the placement plate conveyed on the conveyor belt, a lifting guide rail is installed in the middle of the packaging table, and a quantitative liquid adding mechanism is installed on the lifting guide rail. The semiconductor etching liquid that can be quantitatively sprayed can stably flow into the volume cavity of the container, avoid the generation of foam and bubbles in the solution, reduce the pollution and oxidation of the solution, and improve the automatic packaging quality and efficiency of the semiconductor etching liquid.

Description

Technical Field

[0001] The invention relates to the technical field of etching liquid production, in particular to an automatic packaging device for semiconductor etching liquid. Background Art

[0002] Etching is a technique that uses chemical reactions or physical impact to remove metal materials. Semiconductor etching is to immerse the semiconductor in an etching solution to remove unwanted substances attached to its surface to ensure its cleanliness and purity. In the semiconductor production process, at present, the packaging of semiconductor etching solutions mainly relies on manual operations. Manual packaging is inefficient and cannot meet the needs of large-scale production. It is easy to produce errors, resulting in inaccurate packaging volume, which affects the use effect of the etching solution. In addition, during the liquid injection process in the packaging process, the solution experiences long-distance flow and air resistance during its downward flow, which is prone to disturbances. In addition, its gravity, viscosity, and surface tension will interact and accumulate, causing the liquid to easily disperse into water droplets that hit the surface of the solution when it flows, generating foam and bubbles in the solution, which can easily lead to the solution being contaminated and oxidized, reducing the effective ingredients in the etching solution and affecting the etching rate when the etching solution is used later.

[0003] Therefore, it is necessary to provide an automatic packaging device for semiconductor etching solution to solve the problems raised in the above background technology. Summary of the invention

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an automatic packaging device for semiconductor etching liquid, comprising a packaging table, wherein two groups of parallel conveyor belts are installed on the packaging table, and a weighing mechanism is provided in the middle between the two groups of conveyor belts, and the weighing mechanism can weigh the placement plate conveyed on the conveyor belt, and a lifting guide rail is installed in the middle of the packaging table, and a quantitative liquid adding mechanism is installed on the lifting guide rail, and the quantitative liquid adding mechanism comprises a lifting seat and a guide rod, the lifting seat is installed on the lifting guide rail, and a solution tank is installed on the lifting seat, and a quantitative cylinder is connected to the lower end of the solution tank, and a liquid squeezing plug is installed in the cylinder cavity of the quantitative cylinder, and a liquid injection nozzle is installed at the lower end of the quantitative cylinder, and the guide rod passes through the solution tank, the liquid squeezing plug and the liquid injection nozzle, and a lifting cylinder 2 and a lifting cylinder 3 are also installed on the lifting seat, and a strap 1 connected to the guide rod is installed on the output end of the lifting cylinder 2, and a strap 2 is installed on the output end of the lifting cylinder 3, and the strap 2 is connected to the liquid squeezing plug through a column rod.

[0005] Preferably, a column cavity is provided at the center of the guide rod, a guide nozzle is installed at the lower end of the column cavity, a conical hole is provided at the lower end of the guide nozzle, an inverted conical hole connected with the conical hole is provided at the upper end of the guide nozzle, the inverted conical hole is also connected with the column cavity, an air control pump installed on a lifting seat is connected to the upper end of the column cavity, and a sealing plunger is also installed in the column cavity.

[0006] Preferably, when the semiconductor etching liquid is initially packaged automatically, the column cavity between the sealing plunger and the guide nozzle 1 is filled with etching liquid.

[0007] Preferably, the weighing mechanism comprises a lifting cylinder 1 installed on the packaging table, a weight sensor is installed on the upper end of the lifting cylinder 1, and a tray for supporting the placement plate is installed on the upper end of the weight sensor.

[0008] Preferably, the extrusion plug is provided with a second guide nozzle, in which a second inverted cone hole is provided, the upper end of the second inverted cone hole is connected to the space of the upper end surface of the extrusion plug, and the lower end of the second inverted cone hole is connected to the space of the lower end surface of the extrusion plug.

[0009] Preferably, the liquid injection nozzle includes an inverted cone-shaped nozzle sleeve installed at the lower end of the metering cylinder, the upper part of the inverted cone-shaped nozzle sleeve is provided with circumferentially evenly distributed horizontal sliding holes, the lower part of the inverted cone-shaped nozzle sleeve is provided with a jet hole connected to the inner end of the horizontal sliding hole, and each group of corresponding horizontal sliding holes and jet holes is provided with a flow control component, the flow control component includes a sealing block fixed to the hole wall at the outer end of the horizontal sliding hole, an inclined block is slidably provided on the hole wall at the inner end of the horizontal sliding hole, a drainage piece cooperating with the jet hole is installed at the lower end of the inclined block, the inclined block is connected to the sealing block by a spring, and the lower end of the liquid extrusion plug is provided with an inclined groove cooperating with the inclined block.

[0010] Preferably, the guide plate and the jet hole are inclined to point toward the rod surface of the guide rod.

[0011] Preferably, a hydrophobic film is provided on the conical surface of the lower end of the inverted conical mouthpiece.

[0012] Preferably, the rod surface of the guide rod is provided with a hydrophilic film.

[0013] Compared with the prior art, the present invention provides an automatic packaging device for semiconductor etching solution, which has the following beneficial effects:

[0014] The present invention can timely judge the weight of the container of the packaged semiconductor etching liquid by setting up the quantitative liquid adding mechanism, the weighing mechanism, the conveyor belt and other structures. If there is a deviation value from the preset weight, the semiconductor etching liquid of the packaged container can be adjusted by controlling the air pump. When the semiconductor etching liquid in the quantitative cylinder of the extrusion plug is squeezed and pushed, the semiconductor etching liquid is sprayed to the rod surface of the guide rod through the liquid injection nozzle, so that the semiconductor etching liquid sprayed from the liquid injection nozzle can flow along the rod surface of the guide rod and be introduced into the container cavity, thereby reducing the accumulated effect of the interaction of air resistance, gravity, viscosity and surface tension in the flow process of the semiconductor etching liquid, so that the semiconductor etching liquid can be sprayed to the container cavity by the liquid injection nozzle. The etching liquid can continue to flow downward along the rod surface of the guide rod, thereby reducing the disturbance effect on the flow of the semiconductor etching liquid, avoiding the semiconductor etching liquid from flowing downward to form water droplets, and avoiding the impact effect on the solution surface and the inner wall of the container, thereby avoiding the generation of foam and bubbles in the solution, reducing the contamination and oxidation of the solution, etc., so that the effective ingredients in the etching liquid are maintained at a high level, and the etching rate and etching quality of the subsequent etching liquid are guaranteed; wherein, under the drive of the lifting cylinder three, the lower end of the guide rod can be adjusted to different lengths of the injection nozzle, so that the semiconductor etching liquid can be flexibly adapted to containers with different depths of cavities during the automatic packaging process, thereby improving the automatic packaging quality of the semiconductor etching liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the automatic packaging device of the present invention;

[0016] Figure 2 It is a structural schematic diagram of the weighing mechanism of the present invention;

[0017] Figure 3 It is a structural schematic diagram of the quantitative liquid adding mechanism of the present invention;

[0018] Figure 4 It is a schematic cross-sectional structure diagram of the quantitative liquid adding mechanism of the present invention;

[0019] Figure 5 It is a schematic diagram of the structure of the liquid injection nozzle of the present invention;

[0020] Figure 6 It is a structural schematic diagram of a flow guide nozzle of the present invention;

[0021] Figure 7 It is a schematic diagram of the flow control component structure of the present invention;

[0022] Figure 8 It is a schematic diagram of the hydrophilic membrane structure of the present invention;

[0023] Fig. 9 It is a schematic diagram of the structure of the inclined surface groove of the present invention;

[0024] Fig.10 It is a schematic diagram of the hydrophobic membrane structure of the present invention.

[0025] In the figure: 1, packaging table; 2, weighing mechanism; 3, conveyor belt; 4, placement plate; 5, lifting rail; 6, quantitative liquid adding mechanism; 21, lifting cylinder 1; 22, weight sensor; 23, tray; 61, lifting seat; 62, solution tank; 63, quantitative cylinder; 64, injection nozzle; 65, guide rod; 66, lifting cylinder 2; 67, board 1; 68, squeeze plug; 69, lifting cylinder 3; 610, board 2; 611, column rod; 641, inverted cone nozzle Sleeve; 642, flow control part; 643, hydrophobic membrane; 6411, horizontal sliding hole; 6412, jet hole; 6421, blocking block; 6422, spring; 6423, oblique stopper; 6424, drainage plate; 651, column cavity; 652, flow guide nozzle 1; 653, sealing plunger; 654, air control pump; 655, hydrophilic membrane; 6521, inverted cone hole 1; 6522, cone hole; 681, flow guide nozzle 2; 6811, inverted cone hole 2; 6812, inclined groove. DETAILED DESCRIPTION

[0026] Reference Figure 1-Figure 10The present invention provides a technical solution: an automatic packaging device for semiconductor etching liquid, comprising a packaging table 1, two sets of parallel conveyor belts 3 are installed on the packaging table 1, a weighing mechanism 2 is arranged in the middle between the two sets of conveyor belts 3, and the weighing mechanism 2 can weigh the placement plate 4 conveyed on the conveyor belt 3, a lifting guide rail 5 is installed in the middle of the packaging table 1, and a quantitative liquid adding mechanism 6 is installed on the lifting guide rail 5, and the quantitative liquid adding mechanism 6 includes a lifting seat 61 and a guide rod 65, the lifting seat 61 is installed on the lifting guide rail 5, and a solution tank 62 is installed on the lifting seat 61, and the lower end of the solution tank 62 is connected to a quantitative cylinder 63 , a squeeze plug 68 is installed in the barrel cavity of the quantitative cylinder 63, and a liquid injection nozzle 64 is installed at the lower end of the quantitative cylinder 63. The guide rod 65 passes through the solution tank 62, the squeeze plug 68 and the liquid injection nozzle 64. The lifting seat 61 is also equipped with a lifting cylinder 2 66 and a lifting cylinder 3 69. The output end of the lifting cylinder 2 66 is equipped with a strap 1 67 connected to the guide rod 65, and the output end of the lifting cylinder 3 69 is equipped with a strap 2 610, and the strap 2 610 is connected to the squeeze plug 68 through a column 611; the placement plate 4 is used to place a container for accommodating semiconductor etching solution; when the container is conveyed to the bottom of the quantitative liquid adding mechanism 6 by the conveyor belt 3, The lifting guide rail 5 and the lifting cylinder 2 66 cooperate to drive the lower end of the guide rod 65 to contact the bottom of the container cavity. The lifting cylinder 3 69 drives the liquid extrusion plug 68 to squeeze and push the semiconductor etching liquid in the metering cylinder 63. The semiconductor etching liquid is sprayed to the rod surface of the guide rod 65 through the liquid injection nozzle 64, so that the semiconductor etching liquid sprayed from the liquid injection nozzle 64 can flow along the rod surface of the guide rod 65 and be introduced into the container cavity, reducing the accumulated effect of the interaction of air resistance, gravity, viscosity and surface tension in the flow process of the semiconductor etching liquid, so that the semiconductor etching liquid can flow along the guide rod 65. The rod surface continues to flow downward, reducing the disturbance effect on the flow of the semiconductor etching solution, avoiding the semiconductor etching solution from flowing downward to form water droplets, avoiding the impact effect with the solution surface and the inner wall of the container, thereby avoiding the generation of foam and bubbles in the solution, reducing the contamination and oxidation of the solution, so that the effective ingredients in the etching solution are maintained at a high level, ensuring the etching rate and etching quality when the etching solution is used subsequently; wherein, under the drive of the lifting cylinder three 69, the lower end of the guide rod 65 can be adjusted to extend out of the injection nozzle 64 to different lengths, so that the semiconductor etching solution can be flexibly adapted to containers with different depths of cavities during the automatic packaging process.

[0027] In this embodiment, a column cavity 651 is provided at the center of the flow guide rod 65, a flow guide nozzle 652 is installed at the lower end of the column cavity 651, a tapered hole 6522 is provided at the lower end of the flow guide nozzle 652, an inverted tapered hole 6521 connected to the tapered hole 6522 is provided at the upper end of the flow guide nozzle 652, and the inverted tapered hole 6521 is also connected to the column cavity 651, and an air control pump 654 installed on the lifting seat 61 is connected to the upper end of the column cavity 651, and a sealing plunger 653 is also installed in the column cavity 651. Through the setting of the tapered hole 6522 and the inverted tapered hole 6521, the air control pump 654 can suck and pressurize the column cavity 651. When the weight of the container that has been packaged with the semiconductor etching liquid has a deviation value from the preset weight, if the deviation value is greater than the preset value, the air control pump 654 is used to suck the semiconductor etching liquid of the deviation value from the packaged container. If the deviation value is less than the preset value, the air control pump 654 is used to fill the packaged container with the semiconductor etching liquid of the deviation value.

[0028] In this embodiment, when the semiconductor etching liquid is initially packaged automatically, the column cavity 651 between the sealing plunger 653 and the guide nozzle 652 is filled with etching liquid, so that when the weight of the container of the packaged semiconductor etching liquid has a deviation value from the preset weight, and the deviation value is less than the preset value, the packaged container can be filled with semiconductor etching liquid of the deviation value through the air control pump 654.

[0029] In this embodiment, the weighing mechanism 2 includes a lifting cylinder 21 installed on the packaging table 1, a weight sensor 22 is installed on the upper end of the lifting cylinder 21, and a tray 23 for supporting the placement plate 4 is installed on the upper end of the weight sensor 22; when the container is placed on the placement plate 4 and transmitted to the top of the weighing mechanism 2, the lifting cylinder 21 is started, so that the tray 23 lifts the placement plate 4 and the container, and then the container is filled with semiconductor etching liquid and packaged. After completion, the guide rod 65 is separated from the container, and the weight sensor 22 reads the weight value. If there is a deviation from the preset value, it is fine-tuned through the guide rod 65 to ensure the accuracy of the semiconductor etching liquid filling and packaging process.

[0030] In this embodiment, a second guide nozzle 681 is installed in the liquid extrusion plug 68, and a second inverted cone hole 6811 is provided in the guide nozzle 681. The upper end of the second inverted cone hole 6811 is connected to the space of the upper end surface of the liquid extrusion plug 68, and the lower end of the second inverted cone hole 6811 is connected to the space of the lower end surface of the liquid extrusion plug 68. When the liquid extrusion plug 68 moves upward in the quantitative cylinder 63, the liquid above the liquid extrusion plug 68 can flow into the space below the liquid extrusion plug 68 through the second inverted cone hole 6811, so as to quantitatively control the semiconductor etching liquid. When the liquid extrusion plug 68 moves downward in the quantitative cylinder 63, the liquid extrusion plug 68 can squeeze and push the liquid below it.

[0031] In this embodiment, the liquid injection nozzle 64 includes an inverted cone-shaped nozzle sleeve 641 installed at the lower end of the metering cylinder 63, the upper part of the inverted cone-shaped nozzle sleeve 641 is provided with circumferentially uniformly distributed transverse sliding holes 6411, the lower part of the inverted cone-shaped nozzle sleeve 641 is provided with a jet hole 6412 connected to the inner end of the transverse sliding hole 6411, and each group of corresponding transverse sliding holes 6411 and jet holes 6412 is installed with a flow control member 642, and the flow control member 642 includes a blocking block 6421 fixed to the hole wall at the outer end of the transverse sliding hole 6411, and an inclined block 6423 is slidably provided on the hole wall at the inner end of the transverse sliding hole 6411, and a drainage piece 6424 cooperating with the jet hole 6412 is installed at the lower end of the inclined block 6423, and the inclined block 6423 is connected to the blocking block 6421 by a spring 6422, and the lower end of the squeeze plug 68 is provided with an inclined groove 6812 cooperating with the inclined block 6423; that is, When the squeezing plug 68 moves downward to squeeze the semiconductor etching liquid, it can squeeze the oblique stopper 6423 to drive the guide piece 6424 to open the jet hole 6412, so that the semiconductor etching liquid can be squeezed to the rod surface of the guide rod 65 for spraying. When the squeezing plug 68 does not move downward or upward, the oblique stopper 6423 and the guide piece 6424 block the jet hole 6412 under the action of the spring 6422, thereby opening and closing the jet hole 6412. Through the setting of the inclined groove 6812, when the squeezing plug 68 moves downward to completely contact the wall of the quantitative cylinder 63 and the inner wall of the inverted cone nozzle sleeve 641, the guide piece 6424 will also close the jet hole 6412 under the action of the spring 6422, so that the semiconductor etching liquid can be completely quantitatively injected and discharged each time, thereby improving the accuracy and packaging quality of the automatic injection packaging of the semiconductor etching liquid.

[0032] In this embodiment, the guide piece 6424 and the jet hole 6412 are both inclined to point toward the rod surface of the guide rod 65 so that the jetted semiconductor etching liquid can flow continuously and stably along the rod surface of the guide rod 65 .

[0033] In this embodiment, a hydrophobic film 643 is provided on the conical surface of the lower end of the inverted conical nozzle sleeve 641, so that when the guide rod 65 moves upward and retreats, the inverted conical nozzle sleeve 641 can scrape the semiconductor etching liquid molecules on the surface of the guide rod 65 more thoroughly and flow downward, thereby ensuring that the semiconductor etching liquid in the quantitative cylinder 63 can completely flow into the container.

[0034] In this embodiment, a hydrophilic film 655 is provided on the rod surface of the guide rod 65 so as to make the flow of the semiconductor etching liquid on the surface of the guide rod 65 more stable and continuous.

[0035] In specific implementation, it includes the following steps:

[0036] Step 1: Place the required container on the placement plate 4 and convey it to the top of the weighing mechanism 2 via the conveyor belt 3;

[0037] Step 2: The weighing mechanism 2 lifts the placement plate 4 above it;

[0038] Step 3: Packaging and filling the container with liquid through the quantitative liquid adding mechanism 6;

[0039] Step 4: Weigh the packaged and filled container again through the weighing mechanism 2 and compare it with the preset weight. When the weight of the container packed with the semiconductor etching liquid has a deviation value from the preset weight, if the deviation value is greater than the preset value, the semiconductor etching liquid of the deviation value is sucked out of the packaged container through the air control pump 654. If the deviation value is less than the preset value, the semiconductor etching liquid of the deviation value is filled into the packaged container through the air control pump 654, and the packaged and filled container is placed on the conveyor belt 3.

[0040] Step 5: The packaged and filled container is then transferred out through the conveyor belt 3, so as to accurately and automatically package and fill the semiconductor etching solution.

[0041] The above description is only a preferred specific implementation manner of the invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the invention, which should be covered by the protection scope of the present invention.

Claims

1. An automated packaging device for semiconductor etching solution, comprising a packaging station (1), characterized in that: Two sets of parallel conveyor belts (3) are installed on the packaging platform (1), and a weighing mechanism (2) is provided in the middle between the two sets of conveyor belts (3). The weighing mechanism (2) can weigh the placement plate (4) transported on the conveyor belt (3). A lifting guide rail (5) is installed in the middle of the packaging platform (1), and a quantitative liquid adding mechanism (6) is installed on the lifting guide rail (5). The quantitative liquid adding mechanism (6) comprises a lifting seat (61) and a guide rod (65). The lifting seat (61) is installed on the lifting guide rail (5), and a solution tank (62) is installed on the lifting seat (61). The lower end of the solution tank (62) is connected to a quantitative liquid adding mechanism (6). The measuring cylinder (63) is provided with a liquid squeezing plug (68) in the cylinder cavity of the quantitative cylinder (63), and a liquid injection nozzle (64) is provided at the lower end of the quantitative cylinder (63). The guide rod (65) penetrates the solution tank (62), the liquid squeezing plug (68) and the liquid injection nozzle (64). The lifting seat (61) is also provided with a lifting cylinder 2 (66) and a lifting cylinder 3 (69). The lifting cylinder 2 (66) is provided with a first strap plate (67) connected to the guide rod (65) at the output end thereof, and the lifting cylinder 3 (69) is provided with a second strap plate (610) at the output end thereof. The second strap plate (610) is connected to the liquid squeezing plug (68) via a column rod (611).

2. The automatic packaging device for semiconductor etching solution according to claim 1, characterized in that: A column cavity (651) is provided at the center of the flow guide rod (65), a flow guide nozzle (652) is installed at the lower end of the column cavity (651), a tapered hole (6522) is provided at the lower end of the flow guide nozzle (652), an inverted tapered hole (6521) communicating with the tapered hole (6522) is provided at the upper end of the flow guide nozzle (652), the inverted tapered hole (6521) is also communicated with the column cavity (651), an air control pump (654) installed on the lifting seat (61) is connected to the upper end of the column cavity (651), and a sealing plunger (653) is also installed in the column cavity (651).

3. The automatic packaging device for semiconductor etching solution according to claim 2, characterized in that: When the semiconductor etching liquid is initially packaged automatically, the column cavity (651) between the sealing plunger (653) and the first guide nozzle (652) is filled with etching liquid.

4. The automatic packaging device for semiconductor etching solution according to claim 1, characterized in that: The weighing mechanism (2) comprises a lifting cylinder (21) mounted on the packaging table (1), a weight sensor (22) being mounted on the upper end of the lifting cylinder (21), and a tray (23) for supporting the placement plate (4) being mounted on the upper end of the weight sensor (22).

5. The automatic packaging device for semiconductor etching solution according to claim 1, characterized in that: The extrusion plug (68) is provided with a second flow guide nozzle (681), and the second flow guide nozzle (681) is provided with a second inverted cone hole (6811), the upper end of the second inverted cone hole (6811) is connected to the space on the upper end surface of the extrusion plug (68), and the lower end of the second inverted cone hole (6811) is connected to the space on the lower end surface of the extrusion plug (68).

6. The automatic packaging device for semiconductor etching solution according to claim 1, characterized in that: The injection nozzle (64) comprises an inverted conical nozzle sleeve (641) mounted on the lower end of the metering cylinder (63); the upper portion of the inverted conical nozzle sleeve (641) is provided with circumferentially evenly distributed transverse sliding holes (6411); the lower portion of the inverted conical nozzle sleeve (641) is provided with jet holes (6412) connected to the inner ends of the transverse sliding holes (6411); each group of corresponding transverse sliding holes (6411) and jet holes (6412) is provided with a flow control member (642); the flow control member (642) comprises a fixed A blocking block (6421) is fixed on the hole wall at the outer end of the horizontal sliding hole (6411); an inclined block (6423) is slidably mounted on the hole wall at the inner end of the horizontal sliding hole (6411); a drainage piece (6424) cooperating with the jet hole (6412) is mounted at the lower end of the inclined block (6423); the inclined block (6423) and the blocking block (6421) are connected via a spring (6422); and an inclined groove (6812) cooperating with the inclined block (6423) is disposed at the lower end of the liquid squeezing plug (68).

7. The automatic packaging device for semiconductor etching solution according to claim 6, characterized in that: The guide plate (6424) and the jet hole (6412) are both inclined to point toward the rod surface of the guide rod (65).

8. The automatic packaging device for semiconductor etching solution according to claim 6, characterized in that: A hydrophobic film (643) is provided on the conical surface at the lower end of the inverted conical mouthpiece (641).

9. The automatic packaging device for semiconductor etching solution according to claim 1, characterized in that: The rod surface of the flow guide rod (65) is provided with a hydrophilic film (655).

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