Wafer detection device with optical receiver

Abstract

The invention relates to a wafer detection device with an optical receiver. The wafer detection device comprises a mounting base, a sample table, a probe assembly, an objective lens assembly and an optical signal acquisition assembly, the sample table is arranged on the mounting base and used for bearing a to-be-detected sample, and the to-be-detected sample comprises a first electrode and a second electrode; the probe assembly is arranged on the mounting seat and comprises a first probe and a second probe, the first probe is used for being electrically connected with the first electrode, and the second probe is used for being electrically connected with the second electrode, so that the to-be-detected sample emits detection light; the objective lens assembly is arranged on the mounting seat and used for observing a to-be-detected sample; the optical signal acquisition assembly comprises an optical receiver, and the optical receiver is arranged close to the sample table and is used for receiving the detection light so as to obtain optical performance parameters of the to-be-detected sample according to the detection light; the light receiver is arranged on the objective lens assembly, or the sample table is provided with a light transmitting part, and the light receiver is arranged on the side, away from the objective lens assembly, of the sample table. The wafer detection device has good detection performance.

Description

Technical Field

[0001] The present application relates to the field of wafer detection technology, and in particular to a wafer detection device with an optical receiver. Background Art

[0002] With the continuous development of wafer detection technology, new requirements have been put forward for wafer performance testing. In order to detect the luminous performance of the wafer after power is turned on, an integrating sphere is often set to collect the light emitted by the wafer and obtain the light performance of the wafer. The integrating sphere and the microscope are usually movably set on the mounting seat. When in use, the microscope is first moved to the top of the wafer to observe the contact between the wafer and the tip of the probe, and then the integrating sphere is moved to the luminous place to collect light. However, the movement of the microscope and the integrating sphere are both large-stroke movements. In this process, the mounting seat will be shaken too much, which may affect the contact between the tip of the probe and the wafer, and then the position of the tip of the probe may be offset or pierce the wafer, affecting the detection performance of the wafer detection device. Summary of the invention

[0003] In view of this, the present application provides a wafer detection device with an optical receiver, and the wafer detection device has good detection performance.

[0004] The present application provides a wafer detection device with an optical receiver, the wafer detection device comprising: a mounting seat, a sample stage, a probe assembly, an objective lens assembly and an optical signal acquisition assembly, the sample stage is arranged on the mounting seat, the sample stage is used to carry a sample to be detected, and the sample to be detected comprises a first electrode and a second electrode; the probe assembly is arranged on the mounting seat, the probe assembly comprises a first probe and a second probe, the first probe is used to electrically connect the first electrode, and the second probe is used to electrically connect the second electrode, so that the sample to be detected emits a detection light; the objective lens assembly is arranged on the mounting seat, and is used to observe the sample to be detected; the optical signal acquisition assembly comprises an optical receiver, the optical receiver is arranged close to the sample stage, and is used to receive the detection light, so as to obtain the optical performance parameters of the sample to be detected according to the detection light; the optical receiver is arranged on the objective lens assembly, or the sample stage has a light-transmitting portion, and the optical receiver is arranged on a side of the sample stage away from the objective lens assembly.

[0005] Furthermore, the optical signal acquisition component also includes an optical fiber and an optical processor, wherein the optical fiber is used to connect the optical receiver and the optical processor to transmit the detection light to the optical processor, and the optical processor is used to process the detection light to obtain the optical performance parameters of the sample to be detected.

[0006] Furthermore, the wafer detection device also includes a movable frame, which is arranged on the mounting seat, and the objective lens assembly can be moved relative to the movable frame along a first direction; the objective lens assembly includes an objective lens holder, an objective lens mounting member and at least one objective lens, the objective lens holder can be moved relative to the movable frame along a first direction, the objective lens mounting member can be rotatably arranged at one end of the objective lens holder close to the sample stage, and the objective lens mounting member has at least one first mounting hole for mounting the at least one objective lens, wherein the first direction is the arrangement direction of the objective lens holder and the sample stage.

[0007] Further, the wafer detection device includes a driving component, which is arranged between the objective lens holder and the movable frame. The driving component includes a driving member and a movable member. The driving member is used to drive the movable member to move along a first direction. The driving member is connected to the movable frame, and the movable member is connected to the objective lens holder. When the driving member is started, it is used to drive the movable member and the objective lens holder to move synchronously along the first direction.

[0008] Furthermore, the driving assembly further comprises a guide member, which is arranged on a side of the driving member facing the moving member and extends along a first direction, and is used for guiding the moving member to move relative to the driving member along the first direction.

[0009] Further, the movable frame includes a first movable sub-section, a second movable sub-section and a third movable sub-section arranged in sequence along a first direction, the first movable sub-section is connected to the driving member, the first movable sub-section can be slidably connected to the second movable sub-section along a second direction, the second movable sub-section can be slidably connected to the third movable sub-section along a third direction, and the side of the third movable sub-section facing away from the second movable sub-section is arranged on the mounting seat, wherein the first direction, the second direction and the third direction intersect with each other respectively.

[0010] Furthermore, the wafer inspection device also includes a moving mechanism, which is arranged between the sample stage and the mounting seat and is used to adjust the relative position of the sample stage and the mounting seat, thereby adjusting the relative position of the sample to be inspected carried on the sample stage and the probe assembly.

[0011] Furthermore, when the optical receiver is arranged on the objective lens assembly, the objective lens mounting member further has a second mounting hole, the second mounting hole is arranged at an interval from the first mounting hole, and the second mounting hole is used to mount the optical receiver.

[0012] Furthermore, when the optical receiver is arranged on a side of the sample stage away from the objective lens assembly, the optical signal collection assembly further comprises a fixing seat, which is arranged on a mounting seat and is used for mounting the optical receiver.

[0013] Furthermore, the wafer detection device also includes a support frame, which is arranged on the side of the sample stage away from the objective lens assembly, and the support frame includes a first sub-frame, a second sub-frame and a connecting frame, the first sub-frame and the second sub-frame are arranged at an interval, the first sub-frame is arranged closer to the objective lens assembly than the second sub-frame, and the first sub-frame is arranged around the periphery of the sample stage for supporting the sample stage; the connecting frame is arranged between the first sub-frame and the second sub-frame and respectively connects the first sub-frame and the second sub-frame, the first sub-frame, the connecting frame and the second sub-frame enclose a setting space, and the setting space is used to set the optical receiver.

[0014] Further, the mounting seat includes a base, a first mounting sub-seat and a second mounting sub-seat, the first mounting sub-seat and the second mounting sub-seat are arranged at intervals on the same side of the base, the first mounting sub-seat is used to set the objective lens assembly, the second mounting sub-seat includes two columns, a first mounting plate and a second mounting plate, the two columns are arranged at intervals and are respectively connected to the base, the first mounting plate and the second mounting plate are stacked and arranged between the two columns, the first mounting plate is closer to the objective lens assembly than the second mounting plate, and the sample stage is located between the first mounting plate and the second mounting plate; the fixing seat includes a fixing portion, a main body portion and an extending portion connected in sequence, the fixing portion is arranged on the surface of the second mounting plate facing the first mounting plate, and the extending portion extends to the setting space and is used to carry the optical receiver.

[0015] In the present application, the first probe and the second probe are arranged on the side of the sample to be detected away from the sample stage. When the first probe is electrically connected to the first electrode and the second probe is electrically connected to the second electrode, the sample to be detected emits detection light. The light receiver is arranged close to the sample stage, that is, the light receiver is arranged close to the sample to be detected, so that the light receiver can receive the detection light emitted by the sample to be detected, so as to obtain the optical performance parameters of the sample to be detected according to the detection light. The objective lens assembly is arranged on the mounting seat. After the relative position adjustment of the objective lens assembly and the mounting seat is completed, the objective lens assembly can observe the contact between the first probe and the second probe and the sample to be detected, so as to realize that the first probe is electrically connected to the first electrode and the second probe is electrically connected to the second electrode, so that the sample to be detected emits light. Compared with the solution in which the optical receiver and the objective lens assembly are independently arranged and can slide along the mounting seat respectively, this solution can avoid the optical receiver and the objective lens assembly from moving over a large stroke after the first probe and the second probe respectively contact the sample to be detected, which is beneficial to avoid the influence of shaking on the detection, avoid the first probe and / or the second probe piercing the sample to be detected and causing damage to the wafer, and alleviate the situation in which the first probe deviates from the first electrode due to large shaking and is unable to be electrically connected to the first electrode, and alleviate the situation in which the second probe deviates from the second electrode due to large shaking and is unable to be electrically connected to the first electrode, so that the wafer detection device has higher detection accuracy for the sample to be detected, and the wafer detection device has better detection performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the implementation will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 This is a schematic structural diagram of a wafer inspection device according to a first embodiment of the present application;

[0018] Figure 2 for Figure 1 A is an enlarged view of the dotted box in center A;

[0019] Figure 3 A schematic structural diagram of a wafer inspection device according to a second embodiment of the present application;

[0020] Figure 4 for Figure 3 A magnified image of the dashed box in middle B;

[0021] Figure 5This is a schematic diagram of the structure of an optical signal acquisition component according to an embodiment of the present application;

[0022] Figure 6 This is a schematic diagram of the explosion structure of a wafer inspection device according to an embodiment of the present application;

[0023] Figure 7 This is a schematic structural diagram of an objective lens assembly according to an embodiment of the present application;

[0024] Figure 8 This is a schematic diagram of the structure of a driving component according to an embodiment of the present application;

[0025] Fig. 9 A schematic diagram of the structure of a driving assembly according to another embodiment of the present application;

[0026] Fig.10 for Fig. 9 Schematic diagram of the cross-sectional structure of the CC;

[0027] Fig.11 This is a schematic diagram of the structure of a mobile rack according to an embodiment of the present application;

[0028] Fig.12 This is a schematic diagram of the exploded structure of a mobile frame according to an embodiment of the present application;

[0029] Fig.13 A schematic diagram of a partial exploded structure of a wafer inspection device according to an embodiment of the present application;

[0030] Fig.14 A partial structural schematic diagram of a wafer inspection device according to an embodiment of the present application;

[0031] Fig.15 Schematic diagram of the matching relationship between the sample stage and the support frame according to an embodiment of the present application.

[0032] Description of reference numerals:

[0033] 100-wafer detection device, 110-mounting seat, 111-base, 112-first mounting sub-seat, 113-second mounting sub-seat, 114-column, 115-first mounting plate, 116-second mounting plate, 120-sample stage, 121-light-transmitting portion, 130-probe assembly, 131-first probe, 132-second probe, 133-first probe seat, 134-second probe seat, 140-objective lens assembly, 141-objective lens bracket, 142-objective lens mounting member, 143-objective lens, 144-first mounting hole, 145-second mounting hole, 15 0-optical signal acquisition component, 151-optical receiver, 152-optical fiber, 153-optical processor, 154-fixed seat, 1541-fixed part, 1542-main part, 1543-extension part, 160-movable frame, 161-first moving sub-part, 162-second moving sub-part, 163-third moving sub-part, 170-driving assembly, 171-driving member, 172-moving member, 173-guide member, 180-moving mechanism, 190-support frame, 191-first sub-frame, 192-second sub-frame, 193-connecting frame, 194-setting space. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0035] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0036] Reference to "embodiment" or "implementation" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment or implementation may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0037] With the continuous development of wafer detection technology, new requirements have been put forward for wafer performance testing. In order to detect the luminous performance of the wafer after power is turned on, an integrating sphere is often set to collect the light emitted by the wafer and obtain the light performance of the wafer. The integrating sphere and the microscope are usually movably set on the mounting seat. When in use, the microscope is first moved to the top of the wafer to observe the contact between the wafer and the tip of the probe, and then the integrating sphere is moved to the luminous place to collect light. However, the movement of the microscope and the integrating sphere are both large-stroke movements. In this process, the mounting seat will be shaken too much, which may affect the contact between the tip of the probe and the wafer, and then the position of the tip of the probe may be offset or pierce the wafer, affecting the detection performance of the wafer detection device.

[0038] See also Figures 1 to 4 The present application provides a wafer detection device 100 with an optical receiver 151, the wafer detection device 100 includes: a mounting seat 110, a sample stage 120, a probe assembly 130, an objective lens assembly 140 and an optical signal acquisition assembly 150, the sample stage 120 is arranged on the mounting seat 110, the sample stage 120 is used to carry a sample to be detected, and the sample to be detected includes a first electrode and a second electrode; the probe assembly 130 is arranged on the mounting seat 110, the probe assembly 130 includes a first probe 131 and a second probe 132, the first probe 131 is used to electrically connect the first electrode, and the second probe 1 32 is used to electrically connect the second electrode so that the sample to be detected emits detection light; the objective lens assembly 140 is arranged on the mounting seat 110, and is used to observe the sample to be detected; the optical signal acquisition assembly 150 includes a light receiver 151, and the light receiver 151 is arranged close to the sample stage 120, and is used to receive the detection light, so as to obtain the optical performance parameters of the sample to be detected according to the detection light; the light receiver 151 is arranged in the objective lens assembly 140, or the sample stage 120 has a light-transmitting portion 121, and the light receiver 151 is arranged on the side of the sample stage 120 away from the objective lens assembly 140.

[0039] It can be understood that when power is loaded on the first probe 131 and the second probe 132, when the first probe 131 contacts the first electrode of the sample to be detected and is electrically connected to the first electrode, and the second probe 132 contacts the second electrode of the sample to be detected and is electrically connected to the second electrode, there is a potential difference between the first electrode and the second electrode, and the sample to be detected is energized and emits detection light.

[0040] It can be understood that the light receiver 151 is disposed close to the sample stage 120 . When the sample stage 120 is used to set a sample to be detected, the light receiver 151 is disposed close to the sample to be detected.

[0041] Optionally, in some embodiments, the first electrode is a pin of the sample to be detected, and the second electrode is a pin of the sample to be detected.

[0042] Optionally, the optical performance parameter may be, but is not limited to, luminous flux, color temperature, and light effect.

[0043] Optionally, the sample to be detected may be, but is not limited to, a wafer, and specifically, may be an LED wafer.

[0044] It can be understood that in some embodiments, the light receiver 151 and the objective lens assembly 140 are located on the same side of the sample stage 120 ; in other embodiments, the light receiver 151 and the objective lens assembly 140 are located on opposite sides of the sample stage 120 .

[0045] Understandably, in Figure 1 and Figure 2 In the embodiment, the light receiver 151 is disposed on the objective lens assembly 140; Figure 3 and Figure 4 In an embodiment, the sample stage 120 has a light-transmitting portion 121 , and the light receiver 151 is disposed on a side of the sample stage 120 away from the objective lens assembly 140 .

[0046] In this embodiment, the first probe 131 and the second probe 132 are arranged on the side of the sample to be detected away from the sample stage 120. When the first probe 131 is electrically connected to the first electrode and the second probe 132 is electrically connected to the second electrode, the sample to be detected emits a detection light, and the light receiver 151 is arranged close to the sample stage 120, that is, the light receiver 151 is arranged close to the sample to be detected, so that the light receiver 151 receives the detection light emitted by the sample to be detected, so as to obtain the optical performance parameters of the sample to be detected according to the detection light. The objective lens assembly 140 is arranged on the mounting seat 110. After the relative position adjustment of the objective lens assembly 140 and the mounting seat 110 is completed, the objective lens assembly 140 can observe the contact between the first probe 131 and the second probe 132 and the sample to be detected, so as to realize that the first probe 131 is electrically connected to the first electrode and the second probe 132 is electrically connected to the second electrode, so that the sample to be detected emits light.

[0047] In one embodiment of the present application, the light receiver 151 is disposed on the objective lens assembly 140. When the surface of the sample to be detected on which the first electrode and the second electrode are disposed is a light-emitting surface and emits detection light, it is convenient for the light receiver 151 to receive the detection light. In this process, the light receiver 151 does not need to be moved significantly to receive the detection light, and the objective lens assembly 140 does not need to be moved significantly. Compared with the solution in which the light receiver 151 and the objective lens assembly 140 are independently arranged and can slide along the mounting base 110 respectively, this solution can avoid the light receiver 151 and the objective lens assembly 140 from moving over a large stroke after the first probe 131 and the second probe 132 respectively contact the sample to be detected, which is beneficial to avoid the influence of shaking on the detection, avoid the first probe 131 and / or the second probe 132 piercing the sample to be detected and causing damage to the wafer, and alleviate the situation in which the first probe 131 deviates from the first electrode due to large shaking and is unable to be electrically connected to the first electrode, and alleviate the situation in which the second probe 132 deviates from the second electrode due to large shaking and is unable to be electrically connected to the first electrode, so that the wafer detection device 100 has higher detection accuracy for the sample to be detected, and the wafer detection device 100 has better detection performance.

[0048] In another embodiment of the present application, the sample stage 120 has a light-transmitting portion 121. On the one hand, the light-transmitting portion 121 provides support for the sample to be detected, and on the other hand, the detection light emitted by the sample to be detected can pass through the light-transmitting portion 121. The light receiver 151 is arranged on the side of the sample stage 120 away from the objective lens assembly 140. When the side of the sample to be detected away from the first electrode and the second electrode is a light-emitting surface and emits detection light, the detection light passes through the light-transmitting portion 121 and enters the light receiver 151, so that the light receiver 151 receives the detection light. In this process, the relative position of the light receiver 151 and the sample to be detected can be adjusted first, and then the relative position of the first probe 131, the second probe 132 and the sample to be detected can be adjusted, so that when the first probe 131 is electrically connected to the first electrode, the second probe 132 is electrically connected to the second electrode and emits detection light, the detection light can be received without moving the light receiver 151 and the objective lens assembly 140. Compared with the solution in which the light receiver 151 and the objective lens assembly 140 are independently arranged and can slide along the mounting base 110 respectively, this solution can avoid the light receiver 151 and the objective lens assembly 140 from moving over a large stroke after the first probe 131 and the second probe 132 respectively contact the sample to be detected, which is beneficial to avoid the influence of shaking on the detection, avoid the first probe 131 and / or the second probe 132 piercing the sample to be detected and causing damage to the wafer, and alleviate the situation in which the first probe 131 deviates from the first electrode due to large shaking and is unable to be electrically connected to the first electrode, and alleviate the situation in which the second probe 132 deviates from the second electrode due to large shaking and is unable to be electrically connected to the first electrode, so that the wafer detection device 100 has higher detection accuracy for the sample to be detected, and the wafer detection device 100 has better detection performance.

[0049] It can be understood that in order to adapt to different types of samples to be detected, the setting position of the light receiver 151 is changed. In some embodiments, the first electrode and the second electrode of the sample to be detected are set on the light-emitting surface, and the objective lens assembly 140 and the light receiver 151 are set on the same side of the sample to be detected; in other embodiments, the first electrode and the second electrode of the sample to be detected are set on the back of the light-emitting surface, and the objective lens assembly 140 and the light receiver 151 are set on opposite sides of the sample to be detected.

[0050] Optionally, in some embodiments, the first electrode is a positive electrode and the second electrode is a negative electrode; in other embodiments, the first electrode is a negative electrode and the second electrode is a positive electrode.

[0051] Optionally, the light receiver 151 is an integrating sphere, also known as a light-passing sphere. The integrating sphere is a hollow, complete spherical shell with an inner wall coated with a layer of flat diffuse reflective material. After the detection light enters the light receiver 151, it can be evenly scattered inside the integrating sphere after multiple reflections inside the integrating sphere, so as to emit uniform detection light and facilitate further acquisition of the optical performance parameters of the sample to be detected.

[0052] It can be understood that the sample to be detected has multiple chips arranged in an array, and each chip has the first electrode and the second electrode; when the first probe 131 and the second probe 132 are respectively electrically connected to the first electrode and the second electrode on the same chip, the chip emits detection light.

[0053] See also Figure 5 In some embodiments, the optical signal acquisition component 150 also includes an optical fiber 152 and an optical processor 153. The optical fiber 152 is used to connect the optical receiver 151 and the optical processor 153 to transmit the detection light to the optical processor 153. The optical processor 153 is used to process the detection light to obtain the optical performance parameters of the sample to be detected.

[0054] In this embodiment, the optical fiber 152 is a light transmission tool to transmit the detection light from the optical receiver 151 to the optical processor 153. The optical processor 153 analyzes and processes the detection light to obtain the optical performance parameters of the sample to be detected, thereby detecting the performance of the light emitted by the sample to be detected when powered on.

[0055] Optionally, the light processor 153 is a spectrometer.

[0056] See also Figure 6 and Figure 7 In some embodiments, the wafer inspection device 100 further includes a moving frame 160, the moving frame 160 is disposed on the mounting seat 110, and the objective lens assembly 140 can be moved along a first direction (such as Figure 6 The objective lens assembly 140 includes an objective lens holder 141, an objective lens mounting member 142 and at least one objective lens 143. The objective lens holder 141 can be moved relative to the movable frame 160 along a first direction. The objective lens mounting member 142 can be rotatably arranged at one end of the objective lens holder 141 close to the sample stage 120. The objective lens mounting member 142 has at least one first mounting hole 144 for mounting the at least one objective lens 143. The first direction is the arrangement direction of the objective lens holder 141 and the sample stage 120.

[0057] In the terms of the present application, "at least one" means one or more, and "plurality" means greater than or equal to two, which can be two, three, four, five, six or seven, etc.

[0058] It can be understood that one objective lens 143 is arranged corresponding to one first mounting hole 144 , and different objective lenses 143 are arranged corresponding to different first mounting holes 144 .

[0059] In the present embodiment, the mobile frame 160 is arranged on the mounting seat 110, and the objective lens assembly 140 can move relative to the mobile frame 160 along a first direction, so that the objective lens assembly 140 moves along the first direction toward the direction close to the sample to be detected or away from the sample to be detected, so that the user can adjust the objective lens assembly 140 to a suitable position to observe the sample to be detected. In the present embodiment, the objective lens assembly 140 includes an objective lens holder 141, an objective lens mounting member 142 and at least one objective lens 143. When the objective lens holder 141 moves relative to the mobile frame 160 along the first direction, the objective lens mounting member 142 and the objective lens 143 are driven to move relative to the mobile frame 160 along the first direction, thereby adjusting the distance between the objective lens 143 and the sample to be detected in the first direction. When the objective lens assembly 140 includes multiple objective lenses 143, the multiple objective lenses 143 are arranged in different first mounting holes 144. When the objective lens mounting member 142 rotates relative to the objective lens bracket 141, the relative positions of the different first mounting holes 144 of the objective lens mounting member 142 and the sample stage 120 can be adjusted to adjust different objective lenses 143 to correspond to the sample stage 120, so that users can select different objective lenses 143 according to actual needs, thereby realizing the observation of the contact conditions of the first probe 131, the second probe 132 and the sample to be detected respectively.

[0060] Optionally, the aperture of the first mounting hole 144 ranges from 25 mm to 35 mm, and specifically, may be, but is not limited to, 25 mm, 26 mm, 27 mm, 28 mm, 29 mm, 30 mm, 31 mm, 32 mm, 33 mm, 34 mm, 35 mm, and the like.

[0061] See also Figures 8 to 10In some embodiments, the wafer inspection device 100 includes a driving component 170, and the driving component 170 is arranged between the objective lens holder 141 and the movable frame 160. The driving component 170 includes a driving member 171 and a movable member 172. The driving member 171 is used to drive the movable member 172 to move along a first direction. The driving member 171 is connected to the movable frame 160, and the movable member 172 is connected to the objective lens holder 141. When the driving member 171 is started, it is used to drive the movable member 172 to move synchronously with the objective lens holder 141 along the first direction.

[0062] In this embodiment, the driving member 171 is disposed on a side of the moving frame 160 facing the objective lens holder 141, and the moving member 172 is disposed on a side of the objective lens holder 141 facing the moving frame 160. When the driving member 171 is started, the moving member 172 moves relative to the driving member 171 along a first direction toward a direction close to the sample stage 120 or away from the sample stage 120, thereby driving the objective lens holder 141, the objective lens mounting member 142, and the at least one objective lens 143 to move along the first direction toward a direction close to the sample stage 120 or away from the sample stage 120.

[0063] Optionally, the driving member 171 may be, but is not limited to, a driving cylinder, a driving motor, etc.

[0064] In some embodiments, the driving assembly 170 further includes a guide member 173, which is disposed on a side of the driving member 171 facing the movable member 172 and extends along a first direction, and is used to guide the movable member 172 to move relative to the driving member 171 along the first direction.

[0065] In the present embodiment, the guide member 173 is arranged on a side of the driving member 171 facing the moving member 172. In other words, the guide member 173 is sandwiched between the driving member 171 and the moving member 172. When the driving member 171 drives the moving member 172 to move, the moving member 172 slides relative to the guide member 173. The guide member 173 provides a guiding effect for the movement of the moving member 172 in the first direction, so as to guide the moving member 172 to stably move relative to the driving member 171 along the first direction, thereby improving the stability of adjusting the relative position of the objective lens assembly 140 and the sample stage 120 in the first direction, thereby avoiding shaking when adjusting the objective lens assembly 140, avoiding affecting the electrical connection between the first probe 131 and the first electrode, and / or the point connection between the second probe 132 and the second electrode, which is conducive to improving the detection performance of the wafer detection device 100.

[0066] See also Fig.11 and Fig.12 In some embodiments, the movable frame 160 includes a first movable sub-section 161, a second movable sub-section 162, and a third movable sub-section 163 arranged in sequence along the first direction, the first movable sub-section 161 is connected to the driving member 171, and the first movable sub-section 161 can be moved in the second direction (such as Fig.12 The second moving sub-section 162 is slidably connected to the second moving sub-section 162, and the second moving sub-section 162 can move along the third direction (as shown in the Y direction) Fig.12 The third movable sub-portion 163 is slidably connected to the third movable sub-portion 163, and the side of the third movable sub-portion 163 away from the second movable sub-portion 162 is arranged on the mounting seat 110, wherein the first direction, the second direction and the third direction intersect each other.

[0067] Optionally, in some embodiments, the first direction, the second direction and the third direction are respectively perpendicular to each other.

[0068] In the present embodiment, the side that the described 3rd mobile sub-portion 163 deviates from the described 2nd mobile sub-portion 162 is arranged on the described mounting seat 110, in other words, the relative position of the described 3rd mobile sub-portion 163 and the described mounting seat 110 is fixed.When the described object lens assembly 140 is arranged on the described mobile frame 160, the described object lens assembly 140 can be avoided to move significantly, thereby avoid the influence of shaking on detection.When the described 2nd mobile sub-portion 162 moves relative to the described 3rd mobile sub-portion 163 along the third direction, drive the described 1st mobile sub-portion 161, the described driving member 171, the described moving member 172, the described object lens assembly 140 to move relative to the described mounting seat 110 along the third direction, thereby the relative position of the object lens 143 on the described object lens assembly 140 and the described mounting seat 110 along the third direction, and / or the relative position of the light receiver 151 and the described mounting seat 110 along the third direction is regulated. Furthermore, the first movable sub-section 161 is connected to the driving member 171. When the first movable sub-section 161 moves along the second direction relative to the second movable sub-section 162, the driving member 171, the movable member 172, and the objective lens assembly 140 are driven to move along the second direction relative to the mounting seat 110, thereby adjusting the relative position of the objective lens 143 on the objective lens assembly 140 and the mounting seat 110 along the second direction, and / or the relative position of the optical receiver 151 and the mounting seat 110 along the second direction. The movable frame 160 is provided with a first movable sub-section 161, a second movable sub-section 162 and a third movable sub-section 163 which are arranged in sequence, so as to facilitate adjustment of the position of the objective lens 143 and / or the optical receiver 151 relative to the mounting seat 110 in the second direction and the third direction, so as to avoid large shaking when adjusting the relative position of the objective lens 143 and the mounting seat 110, and the relative position of the optical receiver 151 and the mounting seat 110, thereby reducing the influence of shaking on the detection accuracy and improving the detection performance of the wafer detection device 100.

[0069] See also Figure 1 and Figure 3 In some embodiments, the wafer inspection device 100 also includes a moving mechanism 180, which is disposed between the sample stage 120 and the mounting base 110, and is used to adjust the relative position of the sample stage 120 and the mounting base 110, thereby adjusting the relative position of the sample to be inspected carried on the sample stage 120 and the probe assembly 130.

[0070] In this embodiment, the moving mechanism 180 is disposed between the sample stage 120 and the mounting seat 110 and connected to the side of the sample stage 120 away from the objective lens assembly 140. The moving mechanism 180 can drive the sample stage 120 to move and rotate in the horizontal direction, and can drive the sample stage 120 to move in the first direction, so as to adjust the relative position of the sample stage 120 and the mounting seat 110. When the sample to be detected is carried on the sample stage 120, the relative position of the sample to be detected and the probe assembly 130 is adjusted to achieve the electrical connection between the first probe 131 and the first electrode, and the electrical connection between the second probe 132 and the second electrode.

[0071] See also Fig.13 In some embodiments, when the optical receiver 151 is disposed in the objective lens assembly 140, the objective lens mounting member 142 further has a second mounting hole 145, and the second mounting hole 145 is spaced apart from the first mounting hole 144, and the second mounting hole 145 is used to mount the optical receiver 151.

[0072] In this embodiment, when the wafer detection device 100 is provided with a side of the first electrode and the second electrode as a light-emitting surface, the light receiver 151, the objective lens assembly 140, the first probe 131 and the second probe 132 are arranged on the same side of the sample to be detected. When the objective lens mounting member 142 includes a second mounting hole 145 spaced apart from the first mounting hole 144, the light receiver 151 is arranged in the second mounting hole 145. In the process of detecting the optical performance parameters of the sample to be detected in the power-on state, the objective lens mounting member 142 is first rotated so that one of the objective lenses 143 is arranged corresponding to the sample to be detected, so as to observe the contact between the first probe 131, the second probe 132 and the sample to be detected, so that the first probe 131 is electrically connected to the first electrode, and the second probe 132 is electrically connected to the second electrode. Further, considering that the length of the light receiver 151 may be greater than the length of the objective lens 143, the objective lens holder 141 is moved so that the objective lens holder 141 moves in a first direction relative to the mobile frame 160 toward a side away from the sample to be detected, so as to avoid the light receiver 151 colliding with the sample to be detected and damaging the sample to be detected when the objective lens mounting member 142 is directly rotated. Further, the objective lens mounting member 142 is rotated so that the light receiver 151 is aligned with the light-emitting surface of the sample to be detected, and then the relative position of the objective lens holder 141 and the mobile frame 160 in the first direction is adjusted according to actual conditions, so that the distance between the light receiver 151 and the sample to be detected in the first direction is within a reasonable range, so as to facilitate the light receiver 151 to receive the detection light. In this process, the light receiver 151 can receive the detection light without having to move significantly, and there is no need to move the objective lens assembly 140 significantly. Compared with the solution in which the light receiver 151 and the objective lens assembly 140 are independently arranged and can slide along the mounting base 110 respectively, this solution can avoid the light receiver 151 and the objective lens assembly 140 from moving over a large stroke after the first probe 131 and the second probe 132 respectively contact the sample to be detected, which is beneficial to avoid the influence of shaking on the detection, avoid the first probe 131 and / or the second probe 132 piercing the sample to be detected and causing damage to the wafer, and alleviate the situation in which the first probe 131 deviates from the first electrode due to large shaking and is unable to be electrically connected to the first electrode, and alleviate the situation in which the second probe 132 deviates from the second electrode due to large shaking and is unable to be electrically connected to the first electrode, so that the wafer detection device 100 has higher detection accuracy for the sample to be detected, and the wafer detection device 100 has better detection performance.

[0073] Optionally, the aperture of the second mounting hole 145 ranges from 25 mm to 35 mm, and specifically, may be, but is not limited to, 25 mm, 26 mm, 27 mm, 28 mm, 29 mm, 30 mm, 31 mm, 32 mm, 33 mm, 34 mm, 35 mm, and the like.

[0074] See also Fig.14 In some embodiments, when the optical receiver 151 is disposed on a side of the sample stage 120 away from the objective lens assembly 140 , the optical signal collection assembly 150 further includes a fixing seat 154 , which is disposed on the mounting seat 110 for mounting the optical receiver 151 .

[0075] It can be understood that the fixing seat 154 is disposed on a side of the sample stage 120 away from the objective lens assembly 140 .

[0076] In this embodiment, when the side of the wafer detection device 100 away from the first electrode and the second electrode is a light-emitting surface, the objective lens assembly 140, the first probe 131 and the second probe 132 are arranged on one side of the sample to be detected, and the light receiver 151 is arranged on the other side of the sample to be detected. When the first probe 131 is electrically connected to the first electrode and the second probe 132 is electrically connected to the second electrode, the detection light emitted by the sample to be detected is incident on the light receiver 151 through the light-transmitting portion 121. In the process of detecting the optical performance parameters of the sample to be detected in the power-on state, the relative position of the fixing seat 154 and the mounting seat 110 can be adjusted first, and then the relative position of the first probe 131, the second probe 132 and the sample to be detected can be adjusted, so that when the first probe 131 is electrically connected to the first electrode, the second probe 132 is electrically connected to the second electrode and emits the detection light, it is not necessary to move the light receiver 151 and the objective lens assembly 140, so as to receive the detection light. Compared with the solution in which the light receiver 151 and the objective lens assembly 140 are independently arranged and can slide along the mounting base 110 respectively, this solution can avoid the light receiver 151 and the objective lens assembly 140 from moving over a large stroke after the first probe 131 and the second probe 132 respectively contact the sample to be detected, which is beneficial to avoid the influence of shaking on the detection, avoid the first probe 131 and / or the second probe 132 piercing the sample to be detected and causing damage to the wafer, and alleviate the situation in which the first probe 131 deviates from the first electrode due to large shaking and is unable to be electrically connected to the first electrode, and alleviate the situation in which the second probe 132 deviates from the second electrode due to large shaking and is unable to be electrically connected to the first electrode, so that the wafer detection device 100 has higher detection accuracy for the sample to be detected, and the wafer detection device 100 has better detection performance.

[0077] See also Fig.15 In some embodiments, the wafer inspection device 100 also includes a support frame 190, and the support frame 190 is arranged on the side of the sample stage 120 away from the objective lens assembly 140. The support frame 190 includes a first sub-frame 191, a second sub-frame 192 and a connecting frame 193. The first sub-frame 191 and the second sub-frame 192 are arranged at intervals, and the first sub-frame 191 is arranged closer to the objective lens assembly 140 than the second sub-frame 192. The first sub-frame 191 is arranged around the periphery of the sample stage 120 for supporting the sample stage 120; the connecting frame 193 is arranged between the first sub-frame 191 and the second sub-frame 192 and respectively connects the first sub-frame 191 and the second sub-frame 192. The first sub-frame 191, the connecting frame 193 and the second sub-frame 192 enclose a setting space 194, and the setting space 194 is used to set the light receiver 151.

[0078] It can be understood that along the first direction, the sample stage 120, the connecting frame 193, the second sub-frame 192, and the moving mechanism 180 are arranged in sequence.

[0079] In this embodiment, the first sub-frame 191 and the second sub-frame 192 are arranged at intervals to enclose a setting space 194 with the connecting frame 193, so that the fixing seat 154 partially extends to the setting space 194, so that the light receiver 151 is set in the setting space 194 and is set close to the sample to be detected. In this embodiment, the first sub-frame 191 is arranged around the periphery of the sample stage 120 to support the sample stage 120, so that the side of the sample stage 120 away from the objective lens assembly 140 has the setting space 194, which is convenient for setting the light receiver 151 and receiving the detection light.

[0080] In some embodiments, the mounting base 110 includes a base 111, a first mounting sub-base 112, and a second mounting sub-base 113, wherein the first mounting sub-base 112 and the second mounting sub-base 113 are spaced apart and arranged on the same side of the base 111, the first mounting sub-base 112 is used to set the objective lens assembly 140, and the second mounting sub-base 113 includes two columns 114, a first mounting plate 115, and a second mounting plate 116, wherein the two columns 114 are spaced apart and connected to the base 111, respectively, and the first mounting plate 115 and the second mounting plate 116 are stacked and arranged on the two columns 114. The first mounting plate 115 is closer to the objective lens assembly 140 than the second mounting plate 116, and the sample stage 120 is located between the first mounting plate 115 and the second mounting plate 116; the probe assembly 130 includes a first probe seat 133 and a second probe seat 134 that are spaced apart, the first probe seat 133 is disposed on a surface of the first mounting plate 115 that is away from the second mounting plate 116 and is used to install the first probe 131, and the second probe seat 134 is disposed on a surface of the first mounting plate 115 that is away from the second mounting plate 116 and is used to install the second probe 132.

[0081] It can be understood that, in some embodiments, the moving mechanism 180 and the sample stage 120 are sequentially disposed on the base 111 ; in other embodiments, the moving mechanism 180 , the support frame 190 and the sample stage 120 are sequentially disposed on the base 111 .

[0082] In this embodiment, the first mounting sub-base 112 and the second mounting sub-base 113 are spaced apart and arranged on the same side of the base 111, and the relative positions of the first mounting sub-base 112 and the second mounting sub-base 113 are fixed. The first mounting sub-base 112 is used to set the moving frame 160, the driving assembly 170 and the objective lens assembly 140, and the relative position of the objective lens assembly 140 and the first mounting sub-base 112 is adjustable. Furthermore, the sample stage 120 is arranged between the first mounting plate 115 and the second mounting plate 116. In other words, the surface of the sample stage 120 facing the objective lens assembly 140 is lower than the surface of the first mounting plate 115 facing the objective lens assembly 140, so that when the first probe seat 133 and the second probe seat 134 are arranged on the first mounting plate 115 and the sample to be detected is carried on the sample stage 120, it is convenient for the first probe 131 and the second probe 132 to contact the sample to be detected on the side of the sample to be detected away from the sample stage 120, thereby improving the performance of the wafer detection device 100.

[0083] Optionally, the relative position of the first probe seat 133 and the first mounting plate 115 is adjustable, and the first probe seat 133 has a first magnetic switch (not shown), which can change the magnetism of the side of the first probe seat 133 facing the first mounting plate 115, so as to achieve that the magnetism of the first probe seat 133 is opposite to or the same as the magnetism of the first mounting plate 115, thereby achieving the fixing or unlocking of the relative position of the first probe seat 133 and the first mounting plate 115.

[0084] Optionally, the relative position of the second probe seat 134 and the first mounting plate 115 is adjustable, and the second probe seat 134 has a second magnetic switch (not shown), which can change the magnetism of the side of the second probe seat 134 facing the first mounting plate 115, so as to achieve the magnetism of the second probe seat 134 being opposite to or the same as the magnetism of the first mounting plate 115, thereby achieving the fixing or unlocking of the relative position of the second probe seat 134 and the first mounting plate 115.

[0085] Optionally, the fixing seat 154 includes a fixing portion 1541, a main body portion 1542 and an extension portion 1543 which are connected in sequence, the fixing portion 1541 is arranged on the surface of the second mounting plate 116 facing the first mounting plate 115, and the extension portion 1543 extends to the setting space 194 and is used to support the optical receiver 151.

[0086] In this embodiment, when the light receiver 151 is set on the fixing seat 154, the fixing portion 1541 of the fixing seat 154 is set on the surface of the second mounting plate 116 facing the first mounting plate 115, and the main body 1542 provides support for the extension portion 1543 so that the extension portion 1543 can extend to the setting space 194, so that when the light receiver 151 is set at one end of the extension portion 1543 away from the main body 1542, the light receiver 151 is set close to the sample to be detected to achieve reception of detection light.

[0087] Optionally, the relative position of the fixing portion 1541 and the second mounting plate 116 is adjustable, and the fixing portion 1541 has a third magnetic switch (not shown), which can change the magnetism of the side of the fixing portion 1541 facing the second mounting plate 116 to achieve the magnetism of the fixing portion 1541 being opposite to or the same as the magnetism of the second mounting plate 116, thereby achieving the fixing or unlocking of the relative position of the fixing portion 1541 and the second mounting plate 116.

[0088] Mentioning "embodiment" and "implementation method" in this application means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, provided that there is no contradiction between them.

[0089] Finally, it should be noted that the above implementation modes are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the above preferred implementation modes, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A wafer inspection device having an optical receiver, characterized in that: The wafer detection device comprises: Mounting seat; A sample stage, the sample stage is arranged on the mounting seat, the sample stage is used to carry a sample to be detected, and the sample to be detected includes a first electrode and a second electrode; A probe assembly, the probe assembly is arranged on the mounting seat, the probe assembly comprises a first probe and a second probe, the first probe is used to electrically connect the first electrode, and the second probe is used to electrically connect the second electrode, so that the sample to be detected emits detection light; An objective lens assembly, which is disposed on a mounting seat and is used to observe the sample to be detected; and An optical signal acquisition component, wherein the optical signal acquisition component includes an optical receiver, which is arranged close to the sample stage and is used to receive the detection light so as to obtain the optical performance parameters of the sample to be detected based on the detection light; the optical receiver is arranged on the objective lens assembly, or the sample stage has a light-transmitting portion, and the optical receiver is arranged on a side of the sample stage away from the objective lens assembly.

2. The wafer inspection device according to claim 1, characterized in that: The optical signal acquisition component also includes an optical fiber and an optical processor. The optical fiber is used to connect the optical receiver and the optical processor to transmit the detection light to the optical processor. The optical processor is used to process the detection light to obtain the optical performance parameters of the sample to be detected.

3. The wafer inspection device according to claim 1, characterized in that: The wafer inspection device further comprises a moving frame, wherein the moving frame is arranged on the mounting seat, and the objective lens assembly can move relative to the moving frame along a first direction; The objective lens assembly includes an objective lens holder, an objective lens mounting component and at least one objective lens, wherein the objective lens holder can be moved relative to the movable frame along a first direction, the objective lens mounting component can be rotatably disposed at one end of the objective lens holder close to the sample stage, and the objective lens mounting component has at least one first mounting hole for mounting the at least one objective lens, wherein the first direction is the arrangement direction of the objective lens holder and the sample stage.

4. The wafer inspection device according to claim 3, characterized in that: The wafer detection device includes a driving component, which is arranged between the objective lens holder and the movable frame. The driving component includes a driving member and a movable member. The driving member is used to drive the movable member to move along a first direction. The driving member is connected to the movable frame, and the movable member is connected to the objective lens holder. When the driving member is started, it is used to drive the movable member and the objective lens holder to move synchronously along the first direction.

5. The wafer inspection device according to claim 4, characterized in that: The driving assembly further includes a guide member, which is disposed on a side of the driving member facing the moving member and extends along a first direction, and is used to guide the moving member to move relative to the driving member along the first direction.

6. The wafer inspection device according to claim 5, characterized in that: The movable frame includes a first movable sub-section, a second movable sub-section and a third movable sub-section which are arranged in sequence along a first direction, the first movable sub-section is connected to the driving member, the first movable sub-section can be slidably connected to the second movable sub-section along a second direction, the second movable sub-section can be slidably connected to the third movable sub-section along a third direction, and the third movable sub-section is arranged on the mounting seat at a side away from the second movable sub-section, wherein the first direction, the second direction and the third direction intersect with each other respectively.

7. The wafer inspection device according to claim 1, characterized in that: The wafer detection device also includes a moving mechanism, which is arranged between the sample stage and the mounting seat and is used to adjust the relative position of the sample stage and the mounting seat, thereby adjusting the relative position of the sample to be detected carried on the sample stage and the probe assembly.

8. The wafer inspection device according to claim 3, characterized in that: When the optical receiver is arranged on the objective lens assembly, the objective lens mounting member further has a second mounting hole, the second mounting hole is arranged at an interval from the first mounting hole, and the second mounting hole is used to mount the optical receiver.

9. The wafer inspection device according to any one of claims 1 to 7, characterized in that: When the optical receiver is arranged on a side of the sample stage away from the objective lens assembly, the optical signal collection assembly further comprises a fixing seat, which is arranged on the mounting seat and is used for mounting the optical receiver.

10. The wafer inspection device according to claim 9, characterized in that: The wafer detection device also includes a support frame, which is arranged on a side of the sample stage away from the objective lens assembly. The support frame includes a first sub-frame, a second sub-frame and a connecting frame. The first sub-frame and the second sub-frame are arranged at an interval, and the first sub-frame is arranged closer to the objective lens assembly than the second sub-frame. The first sub-frame is arranged around the periphery of the sample stage for supporting the sample stage; the connecting frame is arranged between the first sub-frame and the second sub-frame and respectively connects the first sub-frame and the second sub-frame. The first sub-frame, the connecting frame and the second sub-frame enclose a setting space, and the setting space is used to set the optical receiver.

11. The wafer inspection device according to claim 10, characterized in that: The mounting seat comprises a base, a first mounting sub-base and a second mounting sub-base, the first mounting sub-base and the second mounting sub-base are arranged at intervals on the same side of the base, the first mounting sub-base is used to set the objective lens assembly, the second mounting sub-base comprises two columns, a first mounting plate and a second mounting plate, the two columns are arranged at intervals and are respectively connected to the base, the first mounting plate and the second mounting plate are stacked and arranged between the two columns, the first mounting plate is closer to the objective lens assembly than the second mounting plate, and the sample stage is located between the first mounting plate and the second mounting plate; The fixing seat comprises a fixing portion, a main body portion and an extending portion which are connected in sequence. The fixing portion is arranged on a surface of the second mounting plate facing the first mounting plate. The extending portion extends to the setting space and is used to carry the optical receiver.

Images