Electronic device

Abstract

The invention relates to an electronic device. The electronic device comprises a first substrate, a first light-emitting unit, a retaining wall structure and a first optical film. The first light emitting unit is disposed on the first substrate. The retaining wall structure is arranged on the first substrate and comprises a first opening corresponding to the first light-emitting unit. At least a portion of the first optical film is disposed on the first light emitting unit, and at least a portion of the first optical film is disposed in the first opening.

Description

Technical Field

[0001] The present disclosure relates to an electronic device, in particular to an electronic device having a light emitting unit. Background Art

[0002] Electronic devices with light-emitting units, such as backlight modules, can improve the contrast of the picture through partition control. However, when performing partition control, a halo problem often occurs, such as light leakage from the illuminated area to the non-illuminated area. This problem is more serious in a backlight module architecture with closely arranged light-emitting units, such as a direct-type backlight module.

[0003] Therefore, an electronic device is needed to improve the above problems. Summary of the invention

[0004] The present disclosure provides an electronic device. The electronic device includes a first substrate, a first light-emitting unit, a retaining wall structure, and a first optical film. The first light-emitting unit is disposed on the first substrate. The retaining wall structure is disposed on the first substrate and includes a first opening corresponding to the first light-emitting unit. At least a portion of the first optical film is disposed on the first light-emitting unit, and at least a portion of the first optical film is disposed in the first opening. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Figure 1 is a schematic diagram of an electronic device according to an embodiment of the present disclosure.

[0006] Figure 2A is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0007] Figure 2B Schematic diagram of the detailed structure of the first substrate and the light-emitting unit according to an embodiment of the present disclosure.

[0008] Figure 3 is a cross-sectional view of an electronic device according to another embodiment of the present disclosure.

[0009] Figure 4 is a cross-sectional view of an electronic device according to another embodiment of the present disclosure.

[0010] Figure 5 is a cross-sectional view of an electronic device according to another embodiment of the present disclosure.

[0011] Figure 6 is a cross-sectional view of an electronic device according to another embodiment of the present disclosure.

[0012] Figure 7 is a cross-sectional view of an electronic device according to another embodiment of the present disclosure.

[0013] Figure 8 Schematic diagram of a retaining wall structure and a first optical film according to an embodiment of the present disclosure.

[0014] Fig. 9 is a schematic diagram of an electronic device according to another embodiment of the present disclosure.

[0015] Explanation of symbols

[0016] 100 Electronic devices

[0017] 1. First substrate

[0018] 2 Lighting units

[0019] 21. First light emitting unit

[0020] 22. Second light emitting unit

[0021] 3 Retaining wall structure

[0022] 3s side surface

[0023] 3t Upper surface

[0024] 30 Sidewall

[0025] 31 First side wall

[0026] 32 Second side wall

[0027] 4, 41, 43, 60, 61, 62, 63 Optical film

[0028] 5 Opening

[0029] 51 First Opening

[0030] 52 Second Opening

[0031] 7 Gap

[0032] 70 Glue

[0033] θ1 First opening angle

[0034] T1 First thickness

[0035] W1 First Width

[0036] W2 First opening width

[0037] L1 First Length

[0038] L2 First opening length

[0039] 8 Second bottom

[0040] 9 Third bottom

[0041] 33 recess

[0042] 34 convex part

[0043] 41s Opening

[0044] 201 First semiconductor layer

[0045] 202 Active Layer

[0046] 203 Second semiconductor layer

[0047] 204 first electrode

[0048] 205 Second electrode

[0049] 12 Insulation layer

[0050] 13 Conductive channel

[0051] 14 Conductive pad

[0052] 3c Curved edge

[0053] W3, W4, W5, W6 Width

[0054] 1c Edge of the first substrate

[0055] 301 First Electronic Components

[0056] 302 Second electronic component

[0057] P1-1, P1-2, P2-1, P2-2 spacing

[0058] R Corner

[0059] AA Active Zone

[0060] PA Surrounding Area DETAILED DESCRIPTION

[0061] The following disclosure provides many different embodiments or examples for implementing different components in the provided display device. Specific examples of each component and its configuration are described below to simplify the embodiments of the present disclosure. Of course, these are merely examples and are not intended to limit the present disclosure. For example, if the description mentions that a first component is formed on a second component, it may include an embodiment in which the first and second components are in direct contact, and it may also include an embodiment in which an additional component is formed between the first and second components so that they are not in direct contact. In addition, the embodiments of the present disclosure may repeat component symbols and / or characters in different examples. Such repetition is for simplicity and clarity, and is not used to represent the relationship between the different embodiments and / or forms discussed.

[0062] Directional terms mentioned herein, such as "upper", "lower", "front", "back", "left", "right" and the like, are only used to refer to the directions of the drawings. Therefore, the directional terms used are used to illustrate rather than to limit the present disclosure.

[0063] In some embodiments of the present disclosure, terms such as "connect", "interconnect" and similar terms related to bonding and connection, unless otherwise defined, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, wherein there is another structure disposed between the two structures. Terms related to bonding and connection may also include situations where both structures are movable, or both structures are fixed. In addition, the terms "electrically connected" and "coupled" include any direct and indirect electrical connection means.

[0064] The ordinal numbers used in the specification and claims, such as "first", "second", etc., are used to modify components. They themselves do not include or represent any previous ordinal numbers of the (or those) components, nor do they represent the order of a component and another component, or the order of the manufacturing method. These ordinal numbers are only used to make a component with a certain name clearly distinguishable from another component with the same name. The same words may not be used in the claims and the specification. Accordingly, the first component in the specification may be the second component in the claims. The terms "approximately", "equal to", "equal" or "same", "substantially" or "approximately" are generally interpreted as within 20% of a given value or range, or as within 10%, 5%, 3%, 2%, 1% or 0.5% of a given value or range.

[0065] In addition, any two values ​​or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular or substantially perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel or substantially parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0066] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as those commonly understood by those skilled in the art of the present disclosure. It is understood that, for example, the definitions of these terms commonly used in dictionaries should be interpreted as having a meaning consistent with the background or context of the relevant technology in the field and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present disclosure.

[0067] Some variations of the embodiments are described below. In the embodiments of the different drawings and descriptions, similar component symbols are used to indicate similar components. It is understood that additional operations can be provided before, during, and after the method, and some of the described operations can be replaced or deleted for other embodiments of the method.

[0068] It should be understood that according to the embodiments of the present disclosure, an optical microscope (OM), a scanning electron microscope (SEM), a transmission electron microscope (TEM), an α-step, an ellipsometer, or other suitable methods may be used to measure the depth, thickness, width or height of each component, or the spacing between components. According to some embodiments, a scanning electron microscope may be used to obtain a cross-sectional structural image containing the components to be measured, and measure the depth, thickness, width or height of each component, or the spacing between components.

[0069] In the present disclosure, the electronic device may include a backlight device, a display device, an antenna device, a sensing device or a splicing device, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may be a non-self-luminous display device or a self-luminous display device. The antenna device may be a liquid crystal antenna device or a non-liquid crystal antenna device, and the sensing device may be a sensing device for sensing capacitance, light, heat or ultrasound, but is not limited thereto. The backlight device may include electronic components. The electronic components may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may include a light emitting diode or a photodiode. The light emitting diode may include an organic light emitting diode (OLED), a sub-millimeter light emitting diode (mini LED), a micro light emitting diode (micro LED) or a quantum dot light emitting diode (quantum dot LED), but is not limited thereto. The splicing device may be a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the electronic device may be any combination of the foregoing, but is not limited thereto. The following description will take a backlight device as an electronic device to illustrate the present disclosure, but the present disclosure is not limited thereto.

[0070] In addition, the electronic device may be rectangular, circular, polygonal, have curved edges or other suitable shapes. The electronic device may have peripheral systems such as a processing system, a drive system, a control system, a light source system, and a shelf system to support the display device or the splicing device.

[0071] It should be noted that the electronic device can be any combination of the above, but is not limited thereto. It should be noted that the following embodiments can replace, reorganize, and mix the features of multiple different embodiments to complete other embodiments without departing from the spirit of the present disclosure. The features of each embodiment can be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other.

[0072] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art to which the present disclosure belongs. It is understood that, for example, these terms are defined in commonly used dictionaries and should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present disclosure.

[0073] It is emphasized again that the terms "first", "second", etc. in this article are only used to distinguish components, and their order does not have any process order.

[0074] Please refer to Figure 1 and Figure 2A . Figure 1 is a schematic diagram of an electronic device 100 according to an embodiment of the present disclosure, which is presented in a top view. Figure 2A is a cross-sectional view of an electronic device 100 according to an embodiment of the present disclosure, which shows Figure 1 The AA' section line in FIG. 1 corresponds to the section of the electronic device 100. In addition, for clarity of description, Figure 1 Components such as optical film 61, optical film 62, or optical film 63 are not shown (shown in FIG. Figure 2A ).

[0075] like Figure 1 and Figure 2A As shown, the electronic device 100 includes a first substrate 1, a plurality of light-emitting units 2, a retaining wall structure 3 and at least one optical film 4. The plurality of light-emitting units 2 are arranged on the first substrate 1. The retaining wall structure 3 has a plurality of side walls 30 and a plurality of openings 5, wherein the openings 5 ​​may be formed between the side walls 30. Each opening 5 may correspond to at least one light-emitting unit 2. In one embodiment, the material of the first substrate 1 may be a hard substrate or a flexible substrate, and the material may include glass, polyimide (PI), polyethylene terephthalate (PET) or other suitable materials, or any combination thereof, and is not limited thereto.

[0076] Further, the light-emitting unit 2 may include a first light-emitting unit 21, which is disposed on the first substrate 1. The opening 5 of the retaining wall structure 3 may include a first opening 51, wherein the first opening 51 corresponds to the first light-emitting unit 21, for example, when viewed from a direction of looking down at the electronic device 100 (-Z), the first light-emitting unit 21 is disposed in the first opening 51. In one embodiment, the position of the first light-emitting unit 21 in the first opening 51 is not limited, for example, it may be located in the middle position, but may also be located in other positions. In addition, the optical film 4 may include an optical film 41, and in the normal direction (Z) of the electronic device 100, at least a portion of the optical film 41 may be disposed in the first opening 51, and at least a portion of the optical film 41 disposed in the first opening 51 may be disposed on the first light-emitting unit 21.

[0077] Next, the details of each component are described.

[0078] First, the light-emitting unit 2 of the electronic device 100 is described. In one embodiment, the light-emitting unit 2 may be a light-emitting diode or a photodiode, but is not limited thereto. When the light-emitting unit 2 is a light-emitting diode, the type of the light-emitting unit 2 may include an organic light-emitting diode (OLED), a sub-millimeter light-emitting diode (mini LED), a micro light-emitting diode (micro LED), or a quantum dot light-emitting diode (quantum dot LED), but is not limited thereto. In one embodiment, the size (e.g., width) of the sub-millimeter light-emitting diode may be between 100 microns and 300 microns (100μm≦size≦300μm), but is not limited thereto. In one embodiment, the size (e.g., width) of the micro light-emitting diode (micro LED) may be between 1 mm and 100 mm (1μm≦size≦100μm), but is not limited thereto. For the convenience of explanation, the light-emitting unit 2 will be taken as an example of a sub-millimeter light-emitting diode (miniLED), and the electronic device 1 may be a backlight device using direct-type sub-millimeter light-emitting diode technology, but is not limited thereto.

[0079] Here, the detailed structures of the first substrate 1 and the light emitting unit 2 are described. Figure 2B is a detailed structural diagram of the first substrate 1 and the light-emitting unit 2 of an embodiment of the present disclosure, and please also refer to Figure 1 and Figure 2A .like Figure 2BAs shown, the light-emitting unit 2 may include a first semiconductor layer 201, an active layer 202, a second semiconductor layer 203, a first electrode 204 and a second electrode 205. In one embodiment, in the Z direction, the active layer 202 may be located between the first semiconductor layer 201 and the second semiconductor layer 203, the first electrode 204 is electrically connected to the second semiconductor layer 203, and the second electrode 205 is electrically connected to the first semiconductor layer 201, but not limited thereto. In addition, at least one insulating layer 12 is disposed between the first substrate 1 and the light-emitting unit 2. In one embodiment, a plurality of conductive pads 14 are disposed on the insulating layer 12, and the first electrode 204 and the second electrode 205 of the light-emitting unit 2 may be electrically connected to one of the conductive pads 14, respectively. In addition, at least one of the conductive pads 14 may be electrically connected to an active component (not shown), such as a transistor or a driver chip, etc., through a conductive channel 13 (such as a conductive through hole (via)), but not limited thereto. Among them, the active component may include the semiconductor material described below. The semiconductor material may include silicon carbide (SiC), silicon (Si), germanium (Ge), gallium arsenide (GaAs), indium phosphide (InP), gallium nitride (GaN), other suitable materials or combinations of the above materials. The semiconductor material may include low temperature polysilicon (LTPS), low temperature polysilicon oxide (LTPO) or amorphous silicon (a-Si), but is not limited thereto. The semiconductor material may include but is not limited to amorphous silicon, polycrystalline silicon, germanium, compound semiconductors (such as gallium nitride, silicon carbide, gallium arsenide, gallium phosphide, indium phosphide, indium arsenide and / or indium antimonide), alloy semiconductors (such as silicon germanium (SiGe) alloys, gallium arsenic phosphide (GaAsP) alloys, aluminum indium arsenic (AlInAs) alloys, aluminum gallium arsenic (AlGaAs) alloys, gallium indium arsenic (GaInAs) alloys, gallium indium phosphide (GaInP) alloys, gallium indium arsenic phosphide (GaInAsP) alloys), or combinations of the above materials, but is not limited thereto. The semiconductor material may include, but is not limited to, metal oxides such as indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), indium gallium zinc tin oxide (IGZTO), or organic semiconductors including polycyclic aromatic compounds, or combinations thereof.

[0080] Next, the retaining wall structure 3 and the opening 5 are described. In one embodiment, the material of the retaining wall structure 3 may be polycarbonate (PC), polyethylene terephthalate (PET), polymethylmethacrylate (PMMA) or other suitable materials, or any combination of the above, but not limited thereto. In addition, the retaining wall structure 3 may be light-transmissive or non-light-transmissive. In one embodiment, the retaining wall structure 3 may have a color, wherein the color of the retaining wall structure 3 may be any color. In one embodiment, the color of the retaining wall structure 3 may be, but not limited to, yellow or white, and is not limited thereto. In one embodiment, the reflectivity of the retaining wall structure 3 may be greater than 85% (85% ≦ reflectivity), and is not limited thereto.

[0081] The side walls 30 of the retaining wall structure 3 may be connected or not connected, for example, two adjacent openings 5 ​​may share the same side wall 30, but may not share it. In one embodiment, the shape of the opening 5 may be any shape, such as a rectangle, a circle, a triangle, a polygon, etc., but is not limited thereto. In addition, in one embodiment, the side wall 30 may have a side surface 3s and an upper surface 3t, wherein the side surface 3s may be connected to the upper surface 3t, and the upper surface 3t may contact the optical film 4, but is not limited thereto.

[0082] like Figure 1 As shown, the size of the opening 5 can be adjusted according to the size or number of the light-emitting units 2 in the opening 5, for example, the first opening 51 can be adjusted according to the size of the first light-emitting unit 21; the size of the component here may refer to the width or area of ​​the component, but is not limited thereto. In one embodiment, when viewed from the direction (-Z) of looking down at the electronic device 100, the first light-emitting unit 21 has a first width W1 in a first direction (for example, X), and the first opening 51 has a first opening width W2 in the first direction (X), wherein the first direction (X) is perpendicular to the normal direction (Z) of the electronic device 100. In one embodiment, the first opening width W2 may be 2 to 30 times the first width W1 (2*W1≦W2≦30*W1), and is not limited thereto. In one embodiment, the first opening width W2 may be 2 to 6 times the first width W1 (2*W1≦W2≦6*W1), and is not limited thereto. In this embodiment, the width may be measured corresponding to the side wall of the retaining wall structure. The advantage of the design range of the first width W1 or the first opening width W2 is that it can be applied to the placement of the optical film after cutting, or can be applied to the optimal recovery efficiency of the light path of the light emitting unit 2, thereby achieving a brightness gain effect.

[0083] In another embodiment, from the direction of looking down at the electronic device 100 (-Z), the first light-emitting unit 21 has a first length L1 in a second direction (for example, Y), and the first opening 51 has a first opening length L2 in the second direction (Y), wherein the second direction (Y) is perpendicular to the normal direction (Z) of the electronic device 100, and the second direction (Y) is different from the first direction (X). In one embodiment, the first opening length L2 may be 2 to 30 times the first length L1 (2*L1≦L2≦30*L1), and is not limited thereto. In one embodiment, the first opening length L2 may be 2 to 20 times the first length L1 (2*L1≦L2≦20*L1), and is not limited thereto. The advantage of the above-mentioned range design of the first length L1 or the first opening length L2 is that it can be applied to the placement of the optical film after cutting, or it can be applied to the optimal recovery efficiency of the light path of the light emitted by the light-emitting unit 2, thereby achieving a brightness gain effect.

[0084] In addition, if Figure 2A As shown, in one embodiment, from the cross section formed by the A-A' section line, the retaining wall structure 3 may include a first side wall 31 and a second side wall 32 forming a first opening 51. In one embodiment, the projection of the first side wall 31 or the second side wall 32 on the cross section formed by the A-A' section line may be a trapezoid, but in other embodiments, it may also be a rectangle, a triangle or other suitable shapes, and is not limited thereto. In one embodiment, from the cross section formed by the A-A' section line, the first opening 51 may have a first opening angle θ1, and the first opening angle θ1 may be defined as the angle formed by the tangent extension line of the side surface 3s of the first side wall 31 adjacent to the first opening 51 and the tangent extension line of the side surface 3s of the second side wall 32 adjacent to the first opening 51, but is not limited thereto. In one embodiment, the first opening angle θ1 may be between 70 degrees and 170 degrees (70°≦θ1≦170°), but is not limited thereto. In one embodiment, the first opening angle θ1 may be between 65 degrees and 165 degrees (65°≦θ1≦165°), but is not limited thereto. In one embodiment, the first opening angle θ1 may be between 60 degrees and 160 degrees (60°≦θ1≦160°), but is not limited thereto. The advantage of the above opening angle design is that it can be suitable for controlling the degree of light expansion and light focusing of the light emitted by the light emitting unit 2.

[0085] In addition, in one embodiment, in the normal direction (Z) of the electronic device 100, the side wall 30 of the retaining wall structure 3 may have a first thickness T1 (which can be regarded as the height of the retaining wall structure 3). In one embodiment, the first thickness T1 may be less than or equal to 6 millimeters (mm), that is, T1≦6mm. In one embodiment, the first thickness T1 may be between 0.1 millimeters and 8 millimeters (0.1mm≦T1≦8mm), but is not limited thereto. In one embodiment, the first thickness T1 may be between 0.075 millimeters (mm) and 7 millimeters (0.075mm≦T1≦7mm), but is not limited thereto. In one embodiment, the first thickness T1 may be between 0.05 millimeters (mm) and 6 millimeters (0.05mm≦T1≦6mm), but is not limited thereto. The advantage of the above-mentioned range design of the first thickness T1 is that it can enhance the effect of shielding adjacent light sources, but is not limited thereto.

[0086] Next, the optical film 4 of the electronic device 100 is described. In one embodiment, the optical film 4 may include a light uniforming film, a diffusion film, a blue light transmitting film (BLT), a brightness enhancement film (BEF), a quantum dot (QD) film, a filter film, a phosphor film, etc., but is not limited thereto. Figure 2A As shown, the optical film 41 is disposed in the retaining wall structure 3, and the light emitted by the first light emitting unit 21 can be more convergent and less likely to scatter. Therefore, the brightness quality of the electronic device 100 can be improved. In addition, in the present disclosure, the optical film 4 can be a single-layer structure (such as Figure 2A The optical film 41 shown is a single-layer structure), but in fact the optical film 4 can also be a multi-layer structure.

[0087] Next, various embodiments of the electronic device 100 are described. Figure 2A .

[0088] exist Figure 2AIn an embodiment, the light-emitting unit 2 of the electronic device 100 may further include a second light-emitting unit 22, which is disposed on the first substrate 1. The retaining wall structure 3 further includes a second opening 52. The second opening 52 may be adjacent to the first opening 51. The second opening 52 corresponds to the second light-emitting unit 22, for example, when viewed from a direction (-Z) of looking down on the electronic device 100, the second light-emitting unit 22 is disposed in the second opening 52. In addition, in an embodiment, when viewed from a direction (-Z) of looking down on the electronic device 100, another optical film 41 may be disposed in the second opening 52. The optical film 41 in the second opening 52 may be disposed on the second light-emitting unit 22. The details of the second light-emitting unit 22 and the second opening 52 may be applicable to the description of the first light-emitting unit 21 and the first opening 51, and thus will not be described in detail. The design of the retaining wall structure 3 is such that the file wall structure 3 can form a fence for light. Therefore, when the electronic device 100 performs partition control, for example, when the first light-emitting unit 21 emits light and the second light-emitting unit 22 does not emit light, at least part of the light of the first light-emitting unit 21 can converge in the retaining wall structure 3, thereby reducing the probability of generating a halo in the area of ​​the second light-emitting unit 22.

[0089] In addition, one or more optical films 4 may be disposed above the retaining wall structure 3. Figure 2A As shown, in one embodiment, the optical film 4 of the electronic device 100 further includes an optical film 61, which is disposed on the retaining wall structure 3, and from the direction (-Z) of looking down on the electronic device 100, the optical film 61 at least partially overlaps the optical film 41 in the first opening 51 and the optical film 41 in the second opening 52, that is, the optical film 61 can be disposed on the optical film 41 in the first opening 51 and the optical film 42 in the second opening 52. Further, in one embodiment, in the normal direction (Z) of the electronic device 100, an optical film 62 can also be disposed on the optical film 61, and an optical film 63 can also be disposed on the optical film 62, but it is not limited thereto. In addition, from the direction (-Z) of looking down on the electronic device 100, the optical film 62 or the optical film 63 can at least partially overlap the optical film 41 in the first opening 51 and the optical film 41 in the second opening 52, that is, the optical film 62 or the optical film 63 can be disposed on the optical film 41 in the first opening 51 and the optical film 41 in the second opening 52. Disposing the optical film 61 , the optical film 62 and / or the optical film 63 above the retaining wall structure 3 can enhance the visual effect of the electronic device 100 , for example, can enhance contrast, mask blemishes or reduce halo problems, but is not limited thereto.

[0090] In addition, more optical films 4 may be disposed in the first opening 51 or the second opening 52 of the retaining wall structure 3. In one embodiment, the optical film 4 of the electronic device 100 may further include an optical film 43, which is located in the first opening 51, and in the normal direction (Z) of the electronic device 100, the optical film 41 in the first opening 51 may be disposed between the first light-emitting unit 21 and the optical film 43 in the first opening 51, but is not limited thereto. In addition, another optical film 43 may also be disposed in the second opening 52, and in the normal direction (Z) of the electronic device 100, the optical film 41 in the second opening 52 may be disposed between the second light-emitting unit 22 and the optical film 43 in the second opening 52, but is not limited thereto. The optical film 43 may also enhance the effect of brightness quality. In addition, the optical films 4 may be the same or different from each other. For example, in one embodiment, the optical film 41 may be a QD film, the optical film 43 may be a diffusion film, the optical film 61 may be a blue light film (BLT), and the optical films 62 and 63 may be brightness enhancement films (BEF), but are not limited thereto. In addition, in one embodiment, the thicknesses (eg, heights in the Z direction) of the optical films 4 may be the same or different. For example, the thickness of the optical film 41 may be smaller than the thickness of the optical film 43 , but the invention is not limited thereto.

[0091] In one embodiment, when the light emitting unit 2 of the electronic device 100 is used to emit white light, the type of the one or more optical films 4 in the first opening 51 or the second opening 52 may include a diffusion film and a filter film, but is not limited thereto. In another embodiment, when the light emitting unit 2 of the electronic device 100 is used to emit blue light, the type of the one or more optical films 4 in the first opening 51 or the second opening 52 may include a diffusion film, a filter film, and a quantum dot (QD) film, but is not limited thereto.

[0092] In one embodiment, the thickness of the optical films 41 , 43 , 61 - 63 in the normal direction (Z) of the electronic device 100 can be adjusted according to needs without limitation.

[0093] In addition, in one embodiment, in the normal direction (Z) of the electronic device 100, there may be a gap 7 between the optical film 41 and the optical film 61, wherein the gap 7 may be an air layer or other light-transmitting material, and is not limited thereto. In one embodiment, the electronic device 100 may be provided with or without a gap according to user needs. The present disclosure is not limited thereto. In this embodiment, there may also be a gap 7 between the optical film 43 and the third optical film 61. In one embodiment, the thickness of the gap 7 in the Z direction may be approximately between 1 and 3 mm (1 mm≦thickness of the gap 7≦3 mm), which is approximately 2 mm, but is not limited thereto.

[0094] Based on this, Figure 2A The embodiments have been understood.

[0095] The electronic device 100 also has different implementation aspects. Figure 3 is a cross-sectional view of an electronic device 100 according to another embodiment of the present disclosure. Figures 1 to 2A As a reference aid. Figure 3 Most of the features of the embodiments are applicable Figure 2A The following is a description of the embodiments, so the differences are mainly described.

[0096] like Figure 3 As shown, an optical film 60 is disposed in the first opening 51, and another optical film 60 is disposed in the second opening 52. In the normal direction (Z) of the electronic device 100, the optical film 60 in the first opening 51 may be disposed between the optical film 43 in the first opening 51 and the optical film 61, and the optical film 60 in the second opening 52 may be disposed between the optical film 43 in the second opening 52 and the optical film 61, but the present invention is not limited thereto. Further, the optical film 43 in the first opening 51 may contact the optical film 61, and the optical film 43 in the second opening 52 may contact the optical film 61, so there may be no gap between the optical film 43 and the optical film 61, but the present invention is not limited thereto.

[0097] In addition, the number of optical films above the retaining wall structure 3 can also be adjusted. In this embodiment, the optical films above the retaining wall structure 3 can include the optical film 61 and the optical film 62, but may not include Figure 2A The optical film 63 in the embodiment is not limited thereto. In fact, more or fewer optical films may be disposed above the retaining wall structure 3 .

[0098] In addition, the shape of the retaining wall structure 3 can have different variations. Figure 3 In the embodiment, when viewing the cross section formed by the AA' section line, Figure 3 The retaining wall structure 3 of the embodiment may have at least one arc-shaped edge 3c. In addition, the bottom of the retaining wall structure 3 has a width W3 in the horizontal direction (e.g., Y), and the middle portion of the retaining wall structure 3 has a width W4 in the horizontal direction (e.g., Y), wherein the width W3 may be greater than the width W4, but is not limited thereto; the "bottom" here may be regarded as the position of the retaining wall structure 3 adjacent to the first substrate 1, and the "middle portion" may be defined as the position extending from the bottom of the retaining wall structure 3 along the Z direction by half the first thickness T1, that is, the distance between the "middle portion" and the "bottom" in the Z direction is half the first thickness T1.

[0099] Based on this, Figure 3 The embodiments have been understood.

[0100] The electronic device 100 also has different implementation aspects. Figure 4 is a cross-sectional view of an electronic device 100 according to another embodiment of the present disclosure. Figures 1 to 3 As a reference aid. Figure 4 Most of the features of the embodiments are applicable Figure 2A The following is a description of the embodiments, so the differences are mainly described.

[0101] like Figure 4 As shown, in the present embodiment, an optical film 43 may be disposed in the first opening 51, and another optical film 43 may be disposed in the second opening 52, and in the normal direction (Z) of the electronic device 100, the optical film 43 in the first opening 51 may be disposed between the optical mold 41 in the first opening 51 and the optical film 61, and the optical film 43 in the first opening 51 may contact the optical film 61, and the optical film 43 in the second opening 52 may be disposed between the optical mold 41 in the second opening 52 and the optical film 61, and the optical film 43 in the second opening 52 may contact the optical film 61, so there may be no gap between the optical film 43 and the optical film 61, but is not limited thereto.

[0102] Based on this, Figure 4 The embodiments have been understood.

[0103] The electronic device 100 also has different implementation aspects. Figure 5 is a cross-sectional view of an electronic device 100 according to another embodiment of the present disclosure. Figures 1 to 4 As a reference aid. Figure 5 Most of the features of the embodiments are applicable Figure 2A The following is a description of the embodiments, so the differences are mainly described.

[0104] like Figure 5 As shown, the electronic device 100 of the present embodiment further includes a second substrate 8. In the normal direction (Z) of the electronic device 100, the second substrate 8 may be disposed between the retaining wall structure 3 and the first light-emitting unit 21. In more detail, in the normal direction (Z) of the electronic device 100, the first light-emitting unit 21 may be disposed on the first substrate 1, the second substrate 8 may be disposed on the first light-emitting unit 21, and the retaining wall structure 3 may be disposed on the second substrate 8. Further, the electronic device 100 may also include a second light-emitting unit 22 disposed on the first substrate 1, and in the normal direction (Z) of the electronic device 100, the second substrate 8 may also be disposed between the second light-emitting unit 22 and the retaining wall structure 3. In one embodiment, the second substrate 8 may at least partially overlap the first light-emitting unit 21 and the second light-emitting unit 22, but is not limited thereto. In addition, the electronic device 100 further includes at least one glue 70, which is disposed around the light-emitting unit 2. For example, the glue 70 may surround the first light-emitting unit 21 and the second light-emitting unit 22. Based on this, the second substrate 8 or the optical film 4 may be placed flat on the glue 70, but is not limited thereto. In this embodiment, the upper surface of the glue 70 may be substantially aligned with the upper surface of the light-emitting unit 2, so that the second substrate 8 may be placed flat thereon.

[0105] In addition, in the present embodiment, an optical film 43 may be disposed in the first opening 51, and another optical film 43 may be disposed in the second opening 52. In the normal direction (Z) of the electronic device 100, the optical film 41 in the first opening 51 may be disposed between the second substrate 8 and the optical film 43 in the first opening 51, the optical film 43 in the first opening 51 may be disposed between the optical film 41 in the first opening 51 and the optical film 61, the optical film 41 in the second opening 52 may be disposed between the second substrate 8 and the optical film 43 in the second opening 52, and the optical film 43 in the second opening 52 may be disposed between the optical film 41 in the second opening 52 and the optical film 61, but the invention is not limited thereto. Further, a gap may be provided or not provided between the optical film 43 and the optical film 61 as required.

[0106] In one embodiment, the material of the second substrate 8 can be applicable to the description of the first substrate 1, but is not limited thereto. In another embodiment, the second substrate 8 can also be replaced by another optical film 4, but is not limited thereto.

[0107] Based on this, Figure 5 The embodiments have been understood.

[0108] The electronic device 100 also has different implementation aspects. Figure 6 is a cross-sectional view of an electronic device 100 according to another embodiment of the present disclosure. Figures 1 to 5 As a reference aid. Figure 6 Most of the features of the embodiments are applicable Figure 5 The following is a description of the embodiments, so the differences are mainly described.

[0109] Figure 6 The embodiment also has Figure 5 The second substrate 8 in the embodiment, for details, can be referred to Figure 5 In the present embodiment, the electronic device 100 may include at least one glue 70, and the glue 70 may cover the light-emitting unit 2, for example, the glue 70 may cover the first light-emitting unit 21 and the second light-emitting unit 22. In the Z direction, the glue 70 may be higher than the light-emitting unit 2. Based on this, the second substrate 8 or the optical film 4 may be placed flat on the glue 70, but is not limited thereto. In addition, as shown in FIG. Figure 6 As shown, in the normal direction (Z) of the electronic device 100, the optical film 41 in the first opening 51 can be disposed between the second substrate 8 and the optical film 61, and the optical film 41 in the second opening 52 can be disposed between the eighth substrate 8 and the optical film 61, but is not limited thereto. Furthermore, a gap can be provided or not provided between the optical film 41 and the third optical film 61 as required.

[0110] In one embodiment, the number of optical films disposed on the second substrate 8 and located in the first opening 51 or the second opening 52 can be adjusted according to needs. Figure 6 The embodiments have been understood.

[0111] The electronic device 100 has different implementation aspects. Figure 7 is a cross-sectional view of an electronic device 100 according to another embodiment of the present disclosure. Figures 1 to 6 As a reference aid. Figure 7 Most of the features of the embodiments are applicable Figure 6 The following is a description of the embodiments, so the differences are mainly described.

[0112] Figure 7 Embodiments have Figure 5 In the second substrate 8. In addition, Figure 7 The embodiment further includes a third substrate 9, wherein the second substrate 8 may be disposed between the first light emitting unit 21 and the third substrate 9. In more detail, in the normal direction (Z) of the electronic device 100, the first light emitting unit 21 may be disposed on the first substrate 1, the second substrate 8 may be disposed on the first light emitting unit 21, the third substrate 9 may be disposed on the second substrate 8, and the retaining wall structure 3 may be disposed on the third substrate 9. Further, the electronic device 100 may also include a second light emitting unit 22 disposed on the first substrate 1, and in the normal direction (Z) of the electronic device 100, the second substrate 8 may be disposed between the second light emitting unit 22 and the third substrate 9. In one embodiment, the second substrate 8 may at least partially overlap the first light emitting unit 21 and the second light emitting unit 22, and the third substrate 9 may at least partially overlap the first light emitting unit 21 and the second light emitting unit 22, but is not limited thereto.

[0113] In one embodiment, the material of the third substrate 9 can be applicable to the description of the first substrate 1, but is not limited thereto. In another embodiment, the third substrate 9 can also be replaced by another optical film 4, but is not limited thereto.

[0114] In addition, in the present embodiment, the electronic device 100 may include glue 70, and the glue 70 can be placed flatly on the optical film 4, the second substrate 8 or the second substrate 9, and is not limited thereto. In addition, the optical film 41 and the optical film 43 are disposed in the first opening 51 of the retaining wall structure 3, and another optical film 41 and another optical film 43 are disposed in the second opening 52 of the retaining wall structure 3. In the normal direction (Z) of the electronic device 100, the optical film 41 in the first opening 51 can be disposed between the third substrate 9 and the optical film 43 in the first opening 51, the optical film 43 in the first opening 51 can be disposed between the optical film 41 in the first opening 51 and the optical film 61 on the retaining wall structure 3, and the optical film 41 in the second opening 52 can be disposed between the third substrate 9 and the optical film 43 in the second opening 52, and the optical film 43 in the second opening 52 can be disposed between the optical film 41 in the second opening 52 and the optical film 61, but is not limited thereto. Further, a gap can be provided or not provided between the optical film 43 and the optical film 61 as required. Furthermore, in one embodiment, the number of optical films disposed on the third substrate 9 and located in the first opening 51 can be adjusted as required, or the number of optical films disposed on the third substrate 9 and located in the second opening 52 can be adjusted as required.

[0115] Based on this, Figure 7 The embodiments have been understood.

[0116] The retaining wall structure 3 and the optical film 4 (eg, the optical film 41 ) disclosed in the present invention also have different implementation aspects. Figure 8 is a schematic diagram of a retaining wall structure 3 and an optical film 41 according to an embodiment of the present disclosure. Figures 1 to 7 As a reference. It should be noted that Figure 8 Most of the features of the embodiments are applicable Figure 2A The following mainly describes the differences. Figure 8 Only the retaining wall structure 3 and the optical film 41 are shown, while other parts of the electronic device 1 are not shown.

[0117] like Figure 8 As shown, the side wall 30 of the retaining wall structure 3 may have a concave portion 33 and a convex portion 34. In one embodiment, the concave portion 33 may form a plane for the optical film 41 to be placed. In addition, in one embodiment, the optical film 41 may include an opening 41s corresponding to the convex portion 34 of the side wall 30. The convex portion 34 of the side wall 30 may pass through the opening 51s of the optical film 41, and in this case, the concave portion 33 of the side wall 30 may be used to support the optical film 41.

[0118] In one embodiment, from the direction (-Z) of looking down at the electronic device 100, the optical film 41 can overlap with the plurality of openings 5 ​​(e.g., the first opening 51 and the second opening 52) of the retaining wall structure 3, wherein the optical film 41 can include a plurality of openings 41s, respectively corresponding to the plurality of convex portions 34 of the side wall 30, so when the convex portions 34 of the side wall 30 pass through the openings 41s of the optical film 41, the plurality of concave portions 33 of the side wall 30 can carry the optical film 41, and the invention is not limited thereto. At least a portion of the optical film 41 can be disposed in the first opening 51, and at least another portion of the optical film 41 can be disposed in the second opening 52, so that the at least a portion of the optical film 41 can overlap with the first light-emitting unit 21 in the first opening 51, and the at least another portion of the optical film 41 can overlap with the second light-emitting unit 22 in the second opening 52, and the invention is not limited thereto.

[0119] Fig. 9 is a schematic diagram of an electronic device 100 according to another embodiment of the present disclosure, which is presented in a top view, and please also refer to Figures 1 to 8 . Fig. 9 Some features of the embodiments are applicable Figure 1 The following is mainly about the differences. Fig. 9 The number of the light emitting units 2 or the openings 5 ​​and the shape and size of the first substrate 1 are examples and are not limiting.

[0120] like Fig. 9 As shown, in one embodiment, a plurality of light emitting units 2 may be disposed in the opening 5, and the arrangement of the light emitting units 2 in each opening 5 may be the same or different, for example Fig. 9 The arrangement of the light emitting units 2 in the first opening 51 of the embodiment may be different from the arrangement of the light emitting units 2 in the second opening 52 , for example, in a first direction (eg, X), Fig. 9 In the embodiment, the spacing P1-1 and the spacing P1-2 between two adjacent light emitting units 2 in the first opening 51 near the corner R are different, while the spacing P2-1 and the spacing P2-2 between two adjacent light emitting units 2 in the second opening 52 are the same, but not limited thereto. The advantage of the above arrangement design is that the light emitted by the light emitting unit at the corner can be adjusted, thereby achieving a brightness gain effect.

[0121] In addition, in one embodiment, the opening of the retaining wall structure 3 may have an arc-shaped edge 3c when viewed from the direction (-Z) of looking down at the electronic device 100, but is not limited thereto. In one embodiment, the curvature of the arc-shaped edge 3c of the first opening 51 near the corner R is different from the curvature of the arc-shaped edge 3c of the second opening 52. In one embodiment, the shapes of each opening 5 may be the same or different, for example Fig. 9The shape of the first opening 51 near the corner R in the embodiment may be different from the shape of the second opening 52, and is not limited thereto. In one embodiment, the area of ​​the first opening 51 near the corner R is smaller than the area of ​​the second opening 52, and is not limited thereto. The advantage of the above opening design is that the light emitted by the light-emitting unit at the corner can be adjusted, thereby achieving a brightness gain effect.

[0122] In one embodiment, the electronic device may include an active area AA and an adjacent peripheral area PA, the opening 5 of the retaining wall structure 3 may be disposed in the active area AA, and one or more electronic components may be disposed on the first substrate 1 in the peripheral area PA, such as a first electronic component 301 and a second electronic component 302, but not limited thereto. In one embodiment, the first electronic component 301 may be a passive component such as an inductor, a resistor, a capacitor, but not limited thereto. In one embodiment, the second electronic component 302 may be an active component such as a transistor, a driving chip, but not limited thereto. Among them, the first electronic component 301 and the second electronic component 302 may be electrically connected to the light-emitting unit of the active area AA, and the first electronic component 301 and the second electronic component 302 may be disposed in the peripheral area PA on the same side of the active area AA, so that the widths of the peripheral areas on different sides of the active area AA are different, such as Fig. 9 The width W5 of the peripheral area PA where the electronic components are arranged in the embodiment is greater than the width W6 of the peripheral area PA on different sides relative to the active area AA. The advantage of the above peripheral area width design is to reduce the use area of ​​the peripheral area and increase the use area of ​​the active area.

[0123] In one embodiment, the edge 1c of the corner R of the first substrate 1 may have any shape, and is not limited thereto. Fig. 9 The edge 1c of the corner R in the embodiment may be close to the active area AA, and the edge 1c may have at least one arc-shaped edge 3c, but is not limited thereto. The advantage of the above edge design is to reduce the area of ​​the peripheral area PA at the corner R, and reduce the collision problem of the corner of the first substrate during the movement of the electronic device.

[0124] In one embodiment, the present disclosure can at least compare the operation of an object in a mechanical observation manner, for example, using the operational relationship between components as evidence of whether the operation of the object falls within the scope of protection of the present patent, or using a display measurement machine to measure the brightness distribution of the light-emitting surface of the object as a basis for judgment, but is not limited to this.

[0125] Based on this, the present disclosure can provide a clear display screen and solve the problems of the prior art.

[0126] The details or features of the various embodiments of the present disclosure may be mixed and matched as desired as long as they do not violate the spirit of the invention or conflict with each other.

[0127] The above embodiments are merely examples for the convenience of explanation. The scope of rights claimed by the present disclosure shall be based on the scope of the patent application, and shall not be limited to the above embodiments.

Claims

1. An electronic device, characterized in that: The invention comprises: a first substrate; a first light-emitting unit, which is arranged on the first substrate; a retaining wall structure, which is arranged on the first substrate and comprises a first opening, and the first opening corresponds to the first light-emitting unit; and a first optical film, at least a portion of which is disposed in the first opening, and at least a portion of which is disposed in the first opening is disposed on the first light-emitting unit.

2. The electronic device according to claim 1, characterized in that: It further includes a second light-emitting unit and a second optical film, wherein the second light-emitting unit is disposed on the first substrate, and the second optical film is disposed on the second light-emitting unit, wherein the retaining wall structure includes a second opening, the second opening corresponds to the second light-emitting unit, and the second optical film is disposed in the second opening.

3. The electronic device according to claim 2, characterized in that: The invention further comprises a third optical film which is disposed on the retaining wall structure, and the third optical film at least partially overlaps the first optical film in the first opening and the second optical film in the second opening.

4. The electronic device according to claim 3, characterized in that: The invention further comprises a fourth optical film which is disposed in the first opening and between the first optical film and the third optical film.

5. The electronic device according to claim 3, characterized in that: A gap may be formed between the first optical film and the third optical film.

6. The electronic device according to claim 1, characterized in that: It further comprises a second substrate disposed between the retaining wall structure and the first light emitting unit.

7. The electronic device according to claim 1, characterized in that: The retaining wall structure has a side wall, the side wall has a concave portion and a convex portion, the first optical film has an opening corresponding to the convex portion of the side wall, and the concave portion of the side wall carries the first optical film.

8. The electronic device according to claim 1, characterized in that: In a normal direction of the electronic device, the retaining wall structure has a side wall, and the side wall has a thickness between 0.05 mm and 6 mm.

9. The electronic device according to claim 1, characterized in that: When viewed from above the electronic device, the first light emitting unit has a first width in a first direction, and the first opening has a first opening width in the first direction, wherein the first opening width is 2 to 30 times of the first width.

10. The electronic device according to claim 1, characterized in that: When viewed from above the electronic device, the first light emitting unit has a first length in a second direction, and the first opening has a first opening length in the second direction, wherein the first opening length is 2 to 30 times of the first length.

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