Multi-chip integrated eutectic precision limiting and pressurizing device and method

Abstract

The invention discloses a multi-chip integrated eutectic precise limiting and pressurizing device and method, belongs to the technical field of microelectronic packaging, is used for limiting and pressurizing components and solder pieces, and comprises a spring assembly, a component limiting assembly, a bearing plate and a bearing plate limiting assembly. The component and the solder sheet are sequentially stacked and then are limited between the spring assembly and the component limiting assembly; the carrier plate limiting assembly enables the carrier plate to penetrate through the component limiting assembly to be tightly attached to the solder piece. According to the multi-chip integrated eutectic precise limiting and pressurizing device and method, the problems that in the prior art, a vacuum eutectic welding clamp is not universal, multi-chip and multi-component products cannot be welded at the same time, meanwhile, precise pressurizing cannot be conducted on bare chips of complex circuits, and the operation complexity is high are solved.

Description

Technical Field

[0001] The present invention belongs to the field of microelectronic packaging technology, and specifically relates to a multi-chip integrated eutectic precision limiting pressurizing device and method. Background Art

[0002] As microwave hybrid integrated circuits develop towards high performance, high reliability and miniaturization, the eutectic welding process of bare chips has gradually become an indispensable key process for microwave hybrid integrated circuits due to its advantages such as low resistance, low microwave loss and high reliability. However, at present, eutectics mainly rely on manual friction eutectics, which has high requirements for operators, low production efficiency and poor consistency. Especially for the welding of high-power bare chips and devices, how to achieve simple, reliable and efficient integrated eutectics has become a difficult problem in the industry. At present, the use of vacuum eutectic furnaces combined with formic acid atmosphere for welding in reducing gases has become the forefront of scientific research and production, and has been widely used in the field of electronic packaging, especially in the eutectic process of bare chips and components.

[0003] However, there are many problems in the prior art. For example, patent application number 201811552872.3 and publication number CN109637967 discloses a graphite fixture for eutectic sintering of hybrid integrated circuits, which uses a limit groove and an inverted integrated movable weight to apply pressure to the circuit chip. The pressurization precision is not enough to meet the needs of a large number of existing complex circuits and chip eutectics with air bridges on the surface. At the same time, the counterweight is not easy to control, which will bring the risk of fragmentation to the GaAs chip; patent application number 201811447054.7 and publication number CN109671663 discloses a high-power hybrid integrated circuit device A sintering method is used, which uses a multi-chip positioning fixture to position the chip and fix the pressing block. Placing the pressing block directly on the chip may cause damage to the chip with complex circuits and air bridges on the surface. At the same time, the counterweight is not easy to control, which may bring the risk of breakage to the GaAs chip; Application No. 201711170461.3 and Publication No. CN108109948 discloses a method for positioning a surface mounted integrated circuit vacuum eutectic welding chip. After limiting the chip, the surface is directly pressurized on the chip surface. This method cannot meet the requirements of existing chips with air bridges or complex circuit patterns on the surface, and is easy to damage or even crush the chip. Summary of the invention

[0004] The purpose of the present invention is to provide a multi-chip integrated eutectic precision limit pressurizing device and method to address the above shortcomings, so as to solve the problems of the vacuum eutectic welding fixture in the prior art being not universal, not being able to weld multiple chips and multi-component products at the same time, not being able to precisely pressurize complex circuit bare chips, and high operational complexity. To achieve the above purpose, the present invention provides the following technical solutions:

[0005] A multi-chip integrated eutectic precision limiting and pressurizing device is used for limiting and pressurizing components and solder sheets, comprising a spring assembly, a component limiting assembly, a carrier plate and a carrier plate limiting assembly; the components and solder sheets are stacked in sequence and limited between the spring assembly and the component limiting assembly; the carrier plate limiting assembly passes the carrier plate through the component limiting assembly and tightly adheres to the solder sheet.

[0006] Furthermore, the carrier plate limiting assembly includes a base plate and a carrier plate limiting spring; the base plate is provided with a groove for limiting the installation of the carrier plate limiting spring.

[0007] Further, the component limiting assembly includes a carrier limiting plate, a device limiting plate and a device limiting plate pressure plate; the carrier limiting plate is a porous plate, and corresponding limiting grooves for installing the carrier plate are provided; the device limiting plate is also a porous plate, and corresponding limiting grooves for installing components are provided; the device limiting plate pressure plate is a frame plate, and a U-shaped through hole is provided in the middle;

[0008] Furthermore, positioning pins are provided around the carrier limit plate, and positioning pin holes are provided at corresponding positions on the device limit plate and the device limit plate pressure plate, and the carrier limit plate, the device limit plate and the device limit plate pressure plate are aligned and connected by the cooperation of the positioning pins and the positioning pin holes.

[0009] Furthermore, the spring assembly includes a spring limit plate, a precision pressure spring and a spring pressure plate; the precision pressure spring includes a spring portion at the tail and a spring needle at the top; the spring limit plate is provided with a limit pin hole matching the spring needle; the spring pressure plate is provided with a limit groove matching the spring portion.

[0010] Furthermore, positioning pin holes are provided around the spring limiting plate, which can cooperate with the positioning pins on the carrier plate limiting plate to complete fixation.

[0011] Furthermore, the spring pressure plate, spring limiting plate, device limiting plate pressure plate, device limiting plate, carrier limiting plate and base plate are provided with locking screw holes at corresponding positions, and multiple holes are evenly arranged to cooperate with locking screws for connection and fixation.

[0012] Furthermore, the bottom and top of the carrier plate limiting spring are both arranged in planes, the bottom plane contacts the bottom plate, and the top plane contacts the carrier plate.

[0013] A multi-chip integrated eutectic precision limiting and pressurizing method, using the multi-chip integrated eutectic precision limiting and pressurizing device mentioned above; comprising:

[0014] S1: Install the load-bearing plate into the limiting groove of the load-bearing plate limiting plate, and combine it with the bottom plate with the load-bearing plate limiting spring, and use the elastic force of the load-bearing plate limiting spring to make the load-bearing plate and the load-bearing plate closely fit together;

[0015] S2: accurately place the device limit plate on the carrier limit plate through the positioning pins, and fix the device limit plate through the device limit plate pressing plate;

[0016] S3: Pre-formed solder sheets and components are accurately placed in the limiting grooves of the device limiting plate by manual methods or automatic plate placing machines;

[0017] S4: The precision pressure spring is accurately limited by the spring limit plate, and is assembled into a spring assembly with the spring pressure plate by means of locking screws, and is accurately placed above the device limit plate pressure plate by means of positioning pins;

[0018] S5: placing the device assembled and fixed according to the above steps into a vacuum eutectic furnace for heating and eutectic welding;

[0019] S6: After welding is completed, the device is taken out of the vacuum eutectic furnace;

[0020] S7: Remove the spring assembly, disassemble the component limit assembly, and take out the welded component product;

[0021] The solder sheet can be replaced by a chip or a ceramic circuit sheet or a chip capacitor.

[0022] Further, the S4 includes:

[0023] S41: The spring pin of the precision pressure spring is passed through the limit pin hole on the spring limit plate and positioned above the designated pressure point;

[0024] S42: Assemble the spring pressure plate, the precision pressure spring and the spring limit plate into a spring assembly by using locking screws;

[0025] S43: Accurately position the spring limit plate above the device limit plate through the positioning pin hole and the positioning pin, tighten the locking screw, and compress the spring at the same time. Control the tightening degree to control the applied pressure so that the spring on the precision pressure spring can accurately apply pressure to the specified pressure point.

[0026] The beneficial effects of the present invention are:

[0027] 1. An integrated eutectic precision limiting and pressurizing device and method for simultaneously limiting and pressurizing the carrier board, chips and components has been developed. The precisely matched limiting grooves prevent the bare chip from shifting due to the surface tension and flow of the solder during vacuum eutectic formation, thus achieving precise positioning production. The solder flow area is limited, and solder will not contaminate other areas on the carrier board;

[0028] 2. A spring pin and pressurization method of precision pressurized spring were developed. The pressurized position of the chip can be precisely pressurized by reasonably adjusting the number of turns of the precision pressurized spring, the spring length, the position and size of the spring pin, without damaging the air bridge and circuit pattern area on the chip surface. The tension of the molten solder can be overcome during eutectic formation, so that the solder can fully wet the bottom of the chip.

[0029] 3. An elastic limiting method for the load plate has been developed. The load plate is pressed into the load plate limiting plate through the load plate limiting spring and fits tightly with the device limiting plate, which expands the applicability of the device to load plates of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is an exploded schematic diagram of the structure of the present invention;

[0031] Figure 2 It is an exploded schematic diagram of the spring assembly structure of the present invention;

[0032] Figure 3 It is an exploded schematic diagram of the structure of the component limiting assembly of the present invention;

[0033] Figure 4 is a schematic diagram of the pressurization site of the present invention;

[0034] Figure 5 It is a schematic diagram of the structure of the precision pressurized spring of the present invention;

[0035] Figure 6 It is a schematic diagram of the limiting pinhole on the spring limiting plate of the present invention;

[0036] In the attached drawings: 1. bottom plate; 2. carrier plate limiting spring; 3. carrier plate; 4. component limiting assembly; 5. carrier plate limiting plate; 6. device limiting plate; 7. device limiting plate pressure plate; 8. positioning pins; 9. solder sheet; 10. component; 11. spring assembly; 12. spring limiting plate; 13. precision pressure spring; 14. spring pressure plate; 15. locking screw; 16. a chip; 17. b chip; 18. positive pressure point; 19. side pressure point. DETAILED DESCRIPTION

[0037] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0038] It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In the description of the present invention, it should be noted that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the invention product is usually placed when used, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In addition, the terms "horizontal", "vertical", etc. do not mean that the components are absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted. In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] Embodiment 1:

[0040] See attached Figures 1 to 6A multi-chip integrated eutectic precision limit pressurizing device, a plurality of grooves are provided on the bottom plate 1, preferably a circular concave structure, the concave circle diameter of the plurality of grooves on the bottom plate 1 is 3mm, and the carrier limit spring 2 can be embedded, and the four corners and the center of the bottom plate 1 are provided with locking screw holes, that is, the number of corresponding locking screw holes is 5, the bottom plate 1 is selected to withstand a temperature of more than 400°C, has a thermal expansion coefficient matching the carrier plate 3 and good thermal conductivity, the thickness of the bottom plate 1 is preferably 1mm, and the length and width of the bottom plate 1 are preferably 50mm.

[0041] The material of the carrier plate limiting spring 2 is preferably 304 stainless steel, and its top and bottom are planar structures, which can better contact and connect with the base plate 1 and the carrier plate 3 respectively. The outer diameter of the carrier plate limiting spring 2 is preferably 3mm, the wire diameter of the carrier plate limiting spring 2 is preferably 0.2mm, the total number of turns of the carrier plate limiting spring 2 is preferably 10 turns, and the free length of the carrier plate limiting spring 2 is preferably 5mm.

[0042] The carrier plate limit plate 5 is a porous plate, and the material is preferably molybdenum-copper alloy. It is provided with a number of limit grooves for limiting the carrier plate 3. The four corners and the center of the carrier plate limit plate 5 are provided with locking screw holes corresponding to the bottom plate 1, and the number is 5. The thickness of the carrier plate limit plate 5 is preferably 2 mm, and the length and width of the carrier plate limit plate 5 are preferably 50 mm. The carrier plate limit plate 5 is made of precision machining by electric spark wire cutting. Positioning pins 8 are provided on the carrier plate limit plate 5, and the number is preferably 2 to improve the positioning accuracy. The carrier plate limit plate 5 can withstand high temperatures above 400°C and can achieve rapid heat conduction.

[0043] The device limiting plate 6 is also a porous plate, and the material is preferably molybdenum-copper alloy. The four corners and the center of the device limiting plate 6 are provided with locking screw holes corresponding to the bottom plate 1, and the number is 5. The thickness of the device limiting plate 6 is preferably 1mm, and the length and width of the device limiting plate 6 are preferably 50mm. The device limiting plate 6 is made of precision electric spark wire cutting, and the device limiting plate 6 is processed with positioning pin holes, and the number is 2, to cooperate with the positioning pin 8 to improve the positioning accuracy.

[0044] The device limiting plate pressure plate 7 is preferably made of aluminum alloy. The device limiting plate pressure plate 7 is a frame plate with a U-shaped through hole in the middle to avoid the device area. It is pressed on the edges of the device limiting plate 6 to fix the device limiting plate 6. The four corners of the device limiting plate pressure plate 7 are correspondingly provided with locking screw holes, and the number is 4. The thickness of the device limiting plate pressure plate 7 is preferably 2mm.

[0045] The material of the spring limit plate 12 is preferably aluminum alloy. Locking screw holes are set at the four corners and the center of the spring limit plate 12, and the number is 5. A limit pin hole is set inside the spring limit plate 12. The diameter of the lower end of the limit pin hole is consistent with the wire diameter of the precision pressurized spring 13, which is 0.1mm, and the length is 2mm. The diameter of the upper part of the limit pin hole is consistent with the outer diameter of the precision pressurized spring 13, and the length is 5mm. There are corresponding positioning pin holes on both sides of the spring limit plate 12, and the number is 2. The spring limit plate 12 is made of precision mechanical processing.

[0046] The precision pressurizing spring 13 is preferably made of 304 stainless steel. The precision pressurizing spring 13 is divided into a spring portion at the tail and a spring needle at the top. The wire diameter is 0.1mm. The free length of the spring portion at the tail is 5mm, the outer diameter is 0.9mm, the total number of turns is 18, and the effective number of turns is 16. The length of the spring needle portion at the top is 2mm, the tip is conical, and the contact surface diameter does not exceed 50μm. The precision pressurizing spring 13 is die-casted with a precision mold. According to the pressurization position, the precision pressurizing spring 13 can realize two forms of center pressurization and offset pressurization. For details, see the attached Figure 3 As shown, chip a 16 and chip b 17 are close to each other. In some cases, adjacent pressure points are too close to each other. A precision pressure spring 13 is provided, which includes two structures. One is that the spring needle is located at the center, and the other is that the spring needle is located at the edge, to respectively complete the center pressure and the bias pressure, that is, the corresponding pressure points are respectively the positive pressure point 18 and the pressure measuring pressure point 19. When multiple chips are pressurized in this case, two different precision pressure springs cooperate to complete the chip site pressurization, to avoid interference between precision pressure springs 13 of the same structure when pressurizing multiple chips, resulting in failure to complete the pressurization.

[0047] The spring pressure plate 14 is provided with a limiting groove that matches the spring part. The groove is concave in shape and is circular. The diameter of the concave circle of the spring pressure plate 14 is 3mm, and the spring part of the precision pressure spring 13 can be embedded. Locking screw holes are correspondingly set at the four corners and the center of the spring pressure plate 14. There are 5 screw holes. The thickness of the spring pressure plate 14 is preferably 1mm, and the length and width of the spring pressure plate 14 are preferably 50mm.

[0048] The positioning pin 8 is made of steel, and the end is chamfered for easy alignment.

[0049] The locking screw is made of steel.

[0050] In this embodiment, a multi-chip integrated eutectic precision limit pressurization device is provided, which uses spring elastic force to press the carrier plate 3 into the carrier limit plate 5 and fits tightly with the device limit plate 6, and is suitable for carrier plates 3 of different thicknesses and sizes. The precision pressurization spring 13 is used to pressurize chips and components 10 of different thicknesses and surfaces with air bridges through the spring limit plate 12. The pressure is adjusted by adjusting the tightness of the locking screw 15 to achieve the matching of the pressure size and reach the optimal pressure value. Accurate pressure and ideal welding effect are achieved.

[0051] Embodiment 2:

[0052] See attached Figures 1 to 6 A multi-chip integrated eutectic precision limiting pressurization method, the specific implementation process is:

[0053] S1: Provide the device with the carrier board 3, solder sheet 9, chip, capacitor and circuit sheet required for eutectic combination welding.

[0054] S2: Use locking screws 15 to assemble the carrier limiting plate 5, the device limiting plate 6, and the device limiting plate pressure plate 7 to form a component limiting assembly 4. The alignment accuracy is required to be less than 10 μm during assembly.

[0055] S3: The spring limit plate 12, the precision pressure spring 13, and the spring pressure plate 14 are assembled by means of locking screws 15 to form a spring assembly 11, and the alignment accuracy is required to be less than 10 μm during assembly.

[0056] S4: placing the carrier plate 3 into the limiting groove of the carrier plate limiting plate 5 .

[0057] S5: Install the carrier plate limit spring 2 into the groove of the base plate 1.

[0058] S6: Use locking screws 15 to combine the bottom plate 1 equipped with the carrier limit spring 2 with the component limit assembly 4 placed on the carrier plate 3. At this time, the carrier plate 3 is pressed against the component limit plate 6 by the pressure of the carrier limit spring 2.

[0059] S7: stack the solder sheets 9 and components 10 from above in sequence and place them into the limiting grooves of the component limiting plate 6. At this time, the carrier plate 3 is tightly fitted with the solder sheets 9 and components 10.

[0060] S8: The assembled spring assembly 11 is aligned and connected with the component limiting assembly 4 and the bottom plate 1 in which the solder sheet 9 and the component 10 are placed through the positioning pin holes and the positioning pins 8.

[0061] S9: The spring assembly 11 and the component limiting assembly 4 are locked by means of the locking screw 15 . The locking degree determines the compression deformation of the precision pressure spring 13 and the pressure applied to the surface of the component 10 .

[0062] S10: placing the assembled device into a vacuum eutectic furnace for heating and eutectic welding.

[0063] S11: After welding is completed, the bottom plate 1 is removed, and the welded bearing plate 3 is removed from below by gravity, and the first welding is completed.

[0064] S12: Open the connection between the spring assembly 11 and the component assembly 10, and repeat S4 to S11 to perform the next cycle of welding operation.

[0065] The present invention provides a multi-chip integrated eutectic precision limiting and pressurizing device and method, through which the chip and component 10 are limited by the device, and the pressure is adjusted by adjusting the compression length of the precision pressurizing spring 13. The device limits the carrier plate 3 accordingly and presses it with the device limiting plate 6, thereby broadening the applicability of the device to carrier plates 3 of different thicknesses. The solder is reduced by filling with formic acid and vacuuming to prevent oxidation. Through the above process means, the eutectic operation of carrier plates 3 of different thicknesses and multiple chips and components 10 of different thicknesses is simplified, and an innovative method for pressurized welding of chips with air bridges and active circuits on the surface is provided, realizing integrated eutectic, while simplifying the difficulty of operation and improving efficiency and welding consistency.

[0066] From the use effect, combined with automatic wafer swing machine and vacuum eutectic furnace and other equipment, the automation degree of eutectic welding process has been improved, and production efficiency and consistency have been guaranteed. It has found a new feasible method for eutectic welding technology of high-power bare chips and multi-chip multi-component complex welding products, and promoted the progress of automated and integrated eutectic process technology.

[0067] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A multi-chip integrated eutectic precision limiting and pressurizing device, used for limiting and pressurizing components (10) and solder sheets (9), characterized in that: It comprises a spring assembly (11), a component limiting assembly (4), a carrier plate (3) and a carrier plate limiting assembly; the components (10) and the solder sheet (9) are stacked in sequence and then limited between the spring assembly (11) and the component limiting assembly (4); the carrier plate limiting assembly allows the carrier plate (3) to pass through the component limiting assembly (4) and to be in close contact with the solder sheet (9).

2. The multi-chip integrated eutectic precision limiting and pressurizing device according to claim 1 is characterized in that: The carrier plate limiting assembly comprises a base plate (1) and a carrier plate limiting spring (2); the base plate (1) is provided with a groove for limiting the installation of the carrier plate limiting spring (2).

3. The multi-chip integrated eutectic precision limiting and pressurizing device according to claim 2 is characterized in that: The component limiting assembly (4) comprises a carrier plate limiting plate (5), a component limiting plate (6) and a component limiting plate pressure plate (7); the carrier plate limiting plate (5) is a porous plate, and is provided with corresponding limiting grooves for installing the carrier plate (3); the component limiting plate (6) is also a porous plate, and is provided with corresponding limiting grooves for installing the component (10); the component limiting plate pressure plate (7) is a frame plate, and has a square-shaped through hole in the middle.

4. The multi-chip integrated eutectic precision limiting and pressurizing device according to claim 3 is characterized in that: Positioning pins (8) are arranged around the carrier plate limiting plate (5), and positioning pin holes are arranged at corresponding positions on the device limiting plate (6) and the device limiting plate pressure plate (7), and the carrier plate limiting plate (5), the device limiting plate (6) and the device limiting plate pressure plate (7) are aligned and connected by the cooperation of the positioning pins (8) and the positioning pin holes.

5. The multi-chip integrated eutectic precision limiting and pressurizing device according to claim 4, characterized in that: The spring assembly (11) comprises a spring limiting plate (12), a precision pressurizing spring (13) and a spring pressure plate (14); the precision pressurizing spring (13) comprises a spring portion at the tail and a spring pin at the top; the spring limiting plate (12) is provided with a limiting pin hole matching the spring pin; the spring pressure plate (14) is provided with a limiting groove matching the spring portion.

6. The multi-chip integrated eutectic precision limiting and pressurizing device according to claim 5, characterized in that: The spring limiting plate (12) is provided with positioning pin holes around its periphery, which can cooperate with the positioning pins (8) on the carrier limiting plate (5) to complete the fixation.

7. The multi-chip integrated eutectic precision limiting and pressurizing device according to claim 6, characterized in that: The spring pressure plate (14), the spring limiting plate (12), the device limiting plate pressure plate (7), the device limiting plate (6), the carrier limiting plate (5) and the bottom plate (1) are all provided with locking screw holes at corresponding positions, and a plurality of locking screw holes are evenly arranged, and are connected and fixed together with locking screws (15).

8. The multi-chip integrated eutectic precision limiting and pressurizing device according to claim 7, characterized in that: The bottom and top of the carrier plate limiting spring (2) are both arranged in planes, the bottom plane contacts the bottom plate (1), and the top plane contacts the carrier plate (3).

9. A multi-chip integrated eutectic precision limiting pressurization method, characterized in that: Using the multi-chip integrated eutectic precision limiting and pressurizing device as claimed in claim 8; include: S1: The load-bearing plate (3) is installed into the limiting groove provided in the load-bearing plate limiting plate (5), and is combined with the bottom plate (1) with the load-bearing plate limiting spring (2), and the load-bearing plate (3) and the load-bearing plate limiting plate (5) are tightly fitted by utilizing the elastic force of the load-bearing plate limiting spring (2); S2: accurately placing the device limiting plate (6) on the carrier limiting plate (5) by means of the positioning pins (8), and fixing the device limiting plate (6) by means of the device limiting plate pressing plate (7); S3: accurately placing the preformed solder sheet (9) and the component (10) in the limiting groove of the component limiting plate (6) manually or automatically by an automatic sheet placing machine; S4: The precision pressure spring (13) is precisely limited by the spring limit plate (12), and is assembled with the spring pressure plate (14) by means of a locking screw (15) to form a spring assembly (11), which is accurately placed above the device limit plate pressure plate (7) by means of a positioning pin (8); S5: placing the device assembled and fixed according to the above steps into a vacuum eutectic furnace for heating and eutectic welding; S6: After welding is completed, the device is taken out of the vacuum eutectic furnace; S7: remove the spring assembly (11), disassemble the component limiting assembly (4), and take out the welded component (10) product; The solder sheet (9) can be replaced by a chip or a ceramic circuit sheet or a chip capacitor.

10. The multi-chip integrated eutectic precision limiting pressurization method according to claim 9, characterized in that: The S4 includes: S41: The spring pin of the precision pressure spring (13) is passed through the limit pin hole on the spring limit plate (12) and positioned above the designated pressure point; S42: Assemble the spring pressure plate (14) with the precision pressure spring (13) and the spring limit plate (12) into a spring assembly (11) by using a locking screw (15); S43: The spring limit plate (12) is accurately positioned above the device limit plate (6) through the positioning pin hole and the positioning pin (8), and the locking screw (15) is tightened, and the spring is compressed at the same time, and the tightening degree is controlled to control the applied pressure, so that the spring on the precision pressure spring (13) can accurately apply pressure to the specified pressure point.

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