Electronic package and fabrication method thereof

Abstract

An electronic package and a method of fabricating the same are mainly provided with an electronic component and a heat dissipation structure having an opening on a carrier structure, so that a heat dissipation member is disposed in the opening and combined with the electronic component, and then the electronic component, the heat dissipation structure and the heat dissipation member are encapsulated by an encapsulation layer. Therefore, the heat dissipation piece can be arranged aiming at a heating source at a specific part of the electronic component so as to effectively dissipate heat.

Description

Technical Field

[0001] The present invention relates to a packaging process, in particular to an electronic packaging component with a heat dissipation structure and a manufacturing method thereof. Background Art

[0002] With the vigorous development of portable electronic products in recent years, various related products are gradually developing towards high density, high performance, light, thin, short and small. Among them, various styles of semiconductor packaging structures used in these portable electronic products are also being innovated to meet the requirements of lightness, thinness, shortness and high density.

[0003] like Figure 1 As shown, the conventional semiconductor package 1 is provided with semiconductor elements 11 and passive elements 18 on the upper and lower sides of a circuit structure 10, and then the semiconductor elements 11 and the passive elements 18 are encapsulated with a molding compound 14, and the contacts (I / O) 100 of the circuit structure 10 are exposed from the molding compound 14, and then a plurality of solder balls 19 are formed on the contacts 100, so that in the subsequent process, the semiconductor package 1 is connected to an electronic device such as a circuit board through the solder balls 19 (not shown).

[0004] However, in the conventional semiconductor package 1, the semiconductor element 11 and the passive element 18 generate a large amount of heat energy during operation, and the encapsulation colloid 14 covering the semiconductor element 11 and the passive element 18 has a thermal conductivity of only 0.8 Wm. - 1 k -1 Poor heat transfer materials (i.e., poor heat dissipation efficiency) make it impossible to effectively dissipate the aforementioned heat, and may even cause damage to the semiconductor element 11 and the passive element 18, seriously affecting product reliability.

[0005] Therefore, how to overcome the above-mentioned problems of the prior art has become a topic that needs to be solved urgently. Summary of the invention

[0006] In view of the above-mentioned defects of the prior art, the present invention provides an electronic package and a method for manufacturing the same, which can at least partially solve the problems of the prior art.

[0007] The electronic package of the present invention comprises: a supporting structure having a circuit layer; an electronic component disposed on the supporting structure to electrically connect the circuit layer; a heat sink disposed on the electronic component; a packaging layer formed on the supporting structure to cover the electronic component and the heat sink; and a heat sink structure embedded in the packaging layer and having an opening so that the heat sink is located in the opening.

[0008] The present invention also provides a method for manufacturing an electronic package, including: providing a supporting structure with a circuit layer; arranging an electronic component and a heat dissipation structure with an opening on the supporting structure so that the electronic component is electrically connected to the circuit layer, and the position of the opening is correspondingly located above the electronic component so that the electronic component is correspondingly exposed to the opening; arranging a heat sink in the opening, and arranging the heat sink on the electronic component; and forming a packaging layer on the supporting structure so that the packaging layer covers the electronic component, the heat dissipation structure and the heat sink.

[0009] In the aforementioned electronic package and its manufacturing method, the electronic element is electrically connected to the circuit layer through a plurality of conductive bumps or a plurality of conductive wires.

[0010] In the aforementioned electronic package and its manufacturing method, the width or area of ​​the heat sink is smaller than or equal to the width or area of ​​the electronic component.

[0011] In the aforementioned electronic package and its manufacturing method, the heat sink is combined with the electronic element through an adhesive material.

[0012] In the aforementioned electronic packaging component and its manufacturing method, the heat sink is coplanar with the outer surface of the packaging layer.

[0013] In the aforementioned electronic packaging component and its manufacturing method, the heat sink, the heat dissipation structure and the outer surface of the packaging layer are coplanar.

[0014] In the aforementioned electronic package and its manufacturing method, the heat dissipation structure is exposed on the side surface of the packaging layer.

[0015] In the aforementioned electronic package and its manufacturing method, the heat dissipation structure covers the electronic element.

[0016] In the aforementioned electronic package and its manufacturing method, the heat dissipation structure includes a sheet body surrounding the heat dissipation element. For example, the heat dissipation structure also includes at least one supporting foot connected to the sheet body, which is combined with the supporting structure.

[0017] In the aforementioned electronic package and its manufacturing method, a plurality of heat sinks are arranged on the electronic element.

[0018] The aforementioned electronic package and its manufacturing method also include forming a shielding layer on the packaging layer, and the shielding layer contacts the heat dissipation structure.

[0019] In the aforementioned electronic package and its manufacturing method, the heat sink protrudes out of the side surface of the electronic component.

[0020] From the above, it can be seen that in the electronic package and its manufacturing method of the present invention, the heat source of a specific part of the electronic component can be set mainly through the heat sink, so it has great flexibility in use and a small setting area. Therefore, compared with the prior art, the electronic package of the present invention can effectively dissipate heat during operation and has low cost.

[0021] Furthermore, the manufacturing method of the present invention can use existing materials and old processes and machines without adding new processes and materials or purchasing new equipment. Therefore, the manufacturing method of the present invention can effectively control the process cost, making the electronic package of the present invention economical. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a cross-sectional schematic diagram of a conventional semiconductor package.

[0023] Figures 2A to 2G FIG. 4 is a cross-sectional schematic diagram of a method for manufacturing an electronic package according to a first embodiment of the present invention.

[0024] Figure 2C-1 for Figure 2C A partial top view schematic diagram of .

[0025] Figure 2G-1 for Figure 2G A cross-sectional schematic diagram of another embodiment of the present invention.

[0026] Figure 3A and Figure 3B for Figure 2G Schematic cross-sectional view of other embodiments.

[0027] Figure 4A , Figure 4B and Figure 4C FIG. 4 is a cross-sectional schematic diagram of a second embodiment of an electronic package of the present invention.

[0028] Figure 4A-1 for Figure 4A A partial top view schematic diagram of .

[0029] Figure 5A and Figure 5B FIG. 4 is a cross-sectional schematic diagram of a third embodiment of an electronic package of the present invention.

[0030] Figure 6 FIG. 4 is a cross-sectional schematic diagram of a fourth embodiment of an electronic package of the present invention.

[0031] Main component symbols

[0032] 1 Semiconductor Package

[0033] 10 Line structure

[0034] 100 contacts

[0035] 11 Semiconductor components

[0036] 14 Encapsulation colloid

[0037] 18,28 Passive components

[0038] 19 Solder balls

[0039] 2,3,3a,3b,4a,4b,4c,5a,5b,6Electronic packaging

[0040] 20 Load-bearing structure

[0041] 20a First side

[0042] 20b Second side

[0043] 20c, 21c, 24c side

[0044] 200 Line Layer

[0045] 201 Electrical contact pad

[0046] 202 External pad

[0047] 203 Insulation protective layer

[0048] 204 Ball Planting Pad

[0049] 21,51 Electronic components

[0050] 21a,51a Action surface

[0051] 21b,51b Non-active surface

[0052] 210,510 Electrode pads

[0053] 211 Conductive bump

[0054] 212 Coating

[0055] 22,32,42,62 heat sink

[0056] 220 Adhesive

[0057] 23. Heat dissipation structure

[0058] 23a,33a,43a sheet

[0059] 23b Support feet

[0060] 230 Opening

[0061] 231,512 Bonding layer

[0062] 24 Encapsulation layer

[0063] 24a First surface

[0064] 24b Second surface

[0065] 29 Conductive element

[0066] 47 Shielding layer

[0067] 511 Wire

[0068] D,R Width

[0069] S Cutting path. DETAILED DESCRIPTION

[0070] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0071] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented, so they have no substantial technical significance. Any structural modification, change in proportional relationship, or adjustment in size should still fall within the scope of the technical contents disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "on", "first", "second", and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0072] Figures 2A to 2G It is a cross-sectional schematic diagram of a manufacturing method of a first embodiment of an electronic package 2 of the present invention.

[0073] like Figure 2A As shown, a supporting structure 20 is provided, which has a first side 20a and a second side 20b opposite to each other, and at least one electronic component 21 is disposed on the first side 20a of the supporting structure 20. For example, the first side 20a of the supporting structure 20 is used as a die placement side for carrying the electronic component 21, and the second side 20b of the supporting structure 20 is used as a ball implantation side.

[0074] The supporting structure 20 may be a package substrate having a core layer and a circuit portion or a coreless circuit structure.

[0075] In this embodiment, the carrier structure 20 includes a dielectric layer and a circuit layer 200 formed on the dielectric layer, such as a fan-out redistribution layer (RDL) specification. For example, the material forming the dielectric layer is Ajinomoto build-up film (ABF), polybenzoxazole (PBO), polyimide (PI), prepreg (PP) or other dielectric materials.

[0076] Furthermore, the circuit layer 200 is formed with a plurality of external pads 202 and a plurality of electrical contact pads 201 on the first side 20a, and a plurality of ball planting pads 204 are formed on the second side 20b, and an insulating protective layer 203 such as a solder mask is formed on the first side 20a and the second side 20b, respectively, so that the external pads 202 and the electrical contact pads 201 on the first side 20a and the ball planting pads 204 on the second side 20b are respectively exposed outside the insulating protective layer 203.

[0077] It should be understood that the supporting structure 20 may also be other supporting units capable of supporting chips, such as a silicon interposer, and is not limited to the above.

[0078] The electronic component 21 is an active component, a passive component or a combination of the two. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor.

[0079] In this embodiment, the electronic component 21 is a semiconductor chip having an active surface 21a and an inactive surface 21b opposite to each other, and the active surface 21a has a plurality of electrode pads 210, so that the electrode pads 210 are combined and electrically connected to the electrical contact pads 201 of the supporting structure 20 in a flip-chip manner through a plurality of conductive bumps 211 such as solder materials, and then a coating layer 212 such as a primer is filled and formed between the first side 20a of the supporting structure 20 and the active surface 21a of the electronic component 21 to cover the conductive bumps 211.

[0080] like Figure 2B As shown, a heat dissipation structure 23 having an opening 230 is disposed on the first side 20 a of the supporting structure 20 , so that the position of the opening 230 is correspondingly located above the electronic component 21 , and a portion of the inactive surface 21 b is exposed from the opening 230 .

[0081] In this embodiment, the heat dissipation structure 23 is a heat dissipation frame such as copper, which includes a sheet 23a having the opening 230 and a plurality of support legs 23b erected on the sheet 23a, so that the sheet 23a is separated from the non-active surface 21b, so that the sheet 23a covers a portion of the non-active surface 21b of the electronic component 21, and the support legs 23b are bonded to the external pad 202 through a bonding layer 231 such as glue.

[0082] like Figure 2C and Figure 2C-1 ( Figure 2C As shown in the partial top view of the embodiment, a single heat sink 22 is formed in the opening 230, so that the heat sink 22 is combined with the non-active surface 21b of the electronic component 21, and the sheet 23a surrounds the heat sink 22.

[0083] In this embodiment, the heat sink 22 is in the form of a sheet, block or fin, and its width D is less than (or equal to) the width R of the electronic component 21, so that the heat sink 22 can be configured for the heat source of a specific part of the electronic component 21 without having to cover the entire electronic component 21, so as to improve the flexibility of use and the heat dissipation efficiency. In addition, the material of the heat sink 22 can be metal or silicon, and the specific embodiment can be a metal block or a dummy die.

[0084] Furthermore, the heat sink 22 protrudes out of the opening 230 and is disposed on the inactive surface 21 b of the electronic component 21 through an adhesive 220 .

[0085] In addition, the adhesive material 220 is a die attach film (DAF) or a metal paste (such as solder paste, silver paste), etc.

[0086] like Figure 2D As shown, a packaging layer 24 is formed on the first side 20 a of the supporting structure 20 , so that the packaging layer 24 covers the electronic element 21 , the covering layer 212 , the heat dissipation element 22 and the heat dissipation structure 23 .

[0087] In this embodiment, the packaging layer 24 is defined with a first surface 24 a and a second surface 24 b opposite to each other, so that the packaging layer 24 is bonded to the first side 20 a of the supporting structure 20 with the first surface 24 a thereof.

[0088] Furthermore, the packaging layer 24 can be an insulating material, such as polyimide (PI), dry film, epoxy-containing molding compound or other appropriate materials. For example, the packaging layer 24 is formed on the supporting structure 20 by lamination or molding.

[0089] like Figure 2E As shown, part of the material on the second surface 24 b of the packaging layer 24 is removed, so that the heat sink 22 is exposed on the second surface 24 b of the packaging layer 24 .

[0090] In this embodiment, a flattening process or a thinning process can be performed to make the outer surface of the heat sink 22 and the second surface 24b of the packaging layer 24 coplanar, that is, the outer surface of the heat sink 22 is flush with the second surface 24b of the packaging layer 24, so that the outer surface of the heat sink 22 is exposed to the packaging layer 24. For example, a portion of the material of the second surface 24b of the packaging layer 24 is removed by grinding or cutting, so that the outer surface of the heat sink 22 is flush with the second surface 24b of the packaging layer 24.

[0091] like Figure 2F As shown, a plurality of conductive elements 29 such as solder balls are implanted on the ball implant pads 204 of the second side 20 b of the supporting structure 20 , so as to be connected with an electronic device such as a circuit board (not shown) in a subsequent manufacturing process.

[0092] like Figure 2G As shown, along Figure 2F The cutting path S shown is used for performing a singulation process to obtain the electronic package 2 .

[0093] In this embodiment, the support pin 23 b on one side of the heat dissipation structure 23 is removed during the singulation process, so that the sheet 23 a is exposed on one side surface 24 c of the packaging layer 24 .

[0094] Furthermore, the supporting legs 23b on multiple sides of the heat dissipation structure 23 may also be removed during the singulation process. Figure 2G-1 The electronic package 3 shown is such that the sheet 33 a is exposed at multiple side surfaces 24 c of the packaging layer 24 .

[0095] In addition, the first side 20a and / or the second side 20b of the supporting structure 20 may be provided with passive components 28 as required, such as Figure 2G-1 For example, the sheet 33 a of the heat dissipation structure 23 covers the passive component 28 .

[0096] In addition, if Figure 3A and Figure 3B For the electronic packages 3a, 3b shown, when part of the material on the second surface 24b of the packaging layer 24 is removed, part of the material on the heat sink 32 can be removed simultaneously, so that the heat sink 32 is coplanar with the outer surface of the sheet 23a, 33a of the heat dissipation structure 23, that is, the outer surface of the heat sink 32 is flush with the upper surface of the sheet 23a, 33a of the heat dissipation structure 23, so that the outer surface of the heat sink 32 and the upper surface of the sheet 23a, 33a of the heat dissipation structure 23 are exposed on the second surface 24b of the packaging layer 24.

[0097] Please refer to Figure 4A , Figure 4B and Figure 4C , is a cross-sectional view of a second embodiment of the electronic package 4a, 4b, 4c of the present invention. The difference between this embodiment and the first embodiment lies in the number of heat sinks, and the other structures are substantially the same, so the same points will not be described in detail below.

[0098] like Figure 4A , Figure 4B , Figure 4C as well as Figure 4A-1 ( Figure 4A As shown in the partial top view of FIG. 1 , if the electronic component 21 has multiple heat sources at specific locations, Figure 2C In the manufacturing process shown, a plurality of heat sinks 42 separated from each other are formed in the opening 230 , so that each heat sink 42 is combined with the inactive surface 21 b of the electronic component 21 .

[0099] In this embodiment, a shielding layer 47 contacting the sheet 23a, 33a, 43a can be formed on the packaging layer 24, and the shielding layer 47 is extended to the side surface 20c of the supporting structure 20. For example, the shielding layer 47 can be formed of materials such as gold, silver, copper (Cu), nickel (Ni), iron (Fe), aluminum (Al), stainless steel (Sus), etc.

[0100] Furthermore, the shielding layer 47 can be formed by electroplating, coating, sputtering, chemical plating, electroless plating or evaporation, etc. Alternatively, the shielding layer 47 can also be formed by a metal cover plate or a conductive film and then fixed.

[0101] In addition, if Figure 4C As shown, if the support pin 23 b is not disposed on one end side of the sheet 43 a of the heat dissipation structure 23 , the end side of the sheet 43 a does not contact the shielding layer 47 after the singulation process.

[0102] In addition, the heat sink 42 may contact or space between the sheets 23a, 33a, 43a.

[0103] Please refer to Figure 5A and Figure 5B , is a cross-sectional view of a third embodiment of the electronic package 5a, 5b of the present invention. The difference between this embodiment and the second embodiment lies in the type of electronic components, and the other structures are substantially the same, so the same points will not be described in detail below.

[0104] like Figure 5A and Figure 5B As shown, corresponding to Figure 2A In the manufacturing process shown, the electronic component 51 is electrically connected to the supporting structure 20 by wire bonding.

[0105] In this embodiment, the electronic component 51 is disposed on the first side 20a of the supporting structure 20 with its non-active surface 51b through a bonding layer 512 such as a deposition film, and then the electrode pad 510 is connected to the electrical contact pad 201 through a plurality of wires 511 such as gold wires, so that the electronic component 51 is electrically connected to the circuit layer 200 of the supporting structure 20.

[0106] It should be understood that there are many ways to electrically connect the electronic components to the supporting structure 20 , and any desired type and number of electronic components can be placed on the supporting structure 20 without any particular limitation.

[0107] Please refer to Figure 6 , is a cross-sectional view of a fourth embodiment of the electronic package 6 of the present invention. The difference between this embodiment and the above embodiments lies in the size of the heat sink, and the other structures are substantially the same, so the same points will not be described in detail below.

[0108] like Figure 6 As shown, taking the first embodiment as an example, the width of the heat sink 62 is increased to protrude from the side surface 21 c of the electronic component 21 .

[0109] Therefore, the manufacturing method of the present invention mainly uses the heat sink 22, 32, 42, 62 to set the heat source at the specific part of the electronic component 21, 51, so it has great flexibility in use. Therefore, compared with the prior art, the electronic package 2, 3, 3a, 3b, 4a, 4b, 4c, 5a, 5b, 6 of the present invention can effectively dissipate heat during operation.

[0110] Furthermore, through the configuration of the heat sink 22, 32, 42, 62 and the heat dissipation structure 23, the electronic package 2, 3, 3a, 3b, 4a, 4b, 4c, 5a, 5b, 6 of the present invention can be applicable to various types of packaging specifications, such as flip chip packaging or wire bonding packaging.

[0111] In addition, by embedding the heat dissipation structure 23 in the packaging layer 24, a large amount of heat energy is generated when the electronic components 21, 51 and the passive components 28 are in operation, and the heat can be quickly dissipated to the outside through the heat dissipation structure 23 to avoid damage to the electronic components 21, 51 and the passive components 28 or problems such as product reliability.

[0112] In addition, the manufacturing method of the present invention can use existing materials and old processes and machines without adding new processes and materials or purchasing new equipment. Therefore, the manufacturing method of the present invention can effectively control the process cost, making the electronic packaging 2, 3, 3a, 3b, 4a, 4b, 4c, 5a, 5b, 6 of the present invention economical.

[0113] The present invention provides an electronic package 2, 3, 3a, 3b, 4a, 4b, 4c, 5a, 5b, 6, comprising: a supporting structure 20 having a circuit layer 200, at least one electronic component 21, 51 disposed on the supporting structure 20 to electrically connect the circuit layer 200, at least one heat sink 22, 32, 42, 62 disposed on the electronic component 21, 51, a packaging layer 24 formed on the supporting structure 20 to cover the electronic component 21, 51 and the heat sink 22, 32, 42, 62, and a heat dissipation structure 23 embedded in the packaging layer 24.

[0114] The heat dissipation structure 23 has at least one opening 230 , so that the heat dissipation elements 22 , 32 , 42 , 62 are located in the opening 230 .

[0115] In one embodiment, the electronic components 21 , 51 are electrically connected to the circuit layer 200 via a plurality of conductive bumps 211 or a plurality of conductive wires 511 .

[0116] In one embodiment, the width D of the heat sink 22 is less than or equal to the width R of the electronic component 21 .

[0117] In one embodiment, the heat sink 22 , 32 , 42 is combined with the electronic components 21 , 51 via an adhesive 220 .

[0118] In one embodiment, the heat sink 22 , 42 , 62 is coplanar with an outer surface of the packaging layer 24 .

[0119] In one embodiment, the heat sink 32 , the heat dissipation structure 23 , and the outer surfaces of the packaging layer 24 are coplanar.

[0120] In one embodiment, the heat dissipation structure 23 is exposed on the side surface 24 c of the packaging layer 24 .

[0121] In one embodiment, the heat dissipation structure 23 covers the electronic component 21 .

[0122] In one embodiment, the heat dissipation structure 23 includes a sheet 23a, 33a, 43a surrounding the heat dissipation element 22, 32, 42, 62. For example, the heat dissipation structure 23 further includes at least one supporting foot 23b connected to the sheet 23a, 33a, 43a, which is combined with the supporting structure 20.

[0123] In one embodiment, a plurality of heat sinks 42 are disposed on the electronic components 21 , 51 .

[0124] In one embodiment, the electronic package 4 a , 4 b , 4 c , 5 a , 5 b further includes a shielding layer 47 formed on the packaging layer 24 and contacting the heat dissipation structure 23 .

[0125] In one embodiment, the heat sink 62 protrudes from the side surface 21 c of the electronic component 21 .

[0126] In summary, in the electronic package and its manufacturing method of the present invention, the heat sink can be set for the heat source of the specific part of the electronic component, so it has great flexibility in use and a small setting area. Therefore, the electronic package of the present invention can effectively dissipate heat during operation with low cost, and can be applicable to a variety of different types of packaging specifications.

[0127] Furthermore, the manufacturing method of the present invention can use existing materials and old processes and machines without adding new processes and materials or purchasing new equipment. Therefore, the manufacturing method of the present invention can effectively control the process cost, making the electronic package of the present invention economical.

[0128] The above embodiments are used to illustrate the principles and effects of the present invention, but are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be as listed in the scope of the patent application described below.

Claims

1. An electronic package, comprising: A load-bearing structure having a circuit layer; An electronic component is disposed on the supporting structure to be electrically connected to the circuit layer; A heat sink is provided on the electronic component; A packaging layer formed on the supporting structure to cover the electronic component and the heat sink; as well as The heat dissipation structure is embedded in the packaging layer and has an opening so that the heat dissipation element is located in the opening.

2. The electronic package of claim 1, wherein: The electronic element is electrically connected to the circuit layer through a plurality of conductive bumps or a plurality of conductive wires.

3. The electronic package of claim 1, wherein: The width or area of ​​the heat sink is smaller than or equal to the width or area of ​​the electronic component.

4. The electronic package of claim 1, wherein: The heat sink is combined with the electronic element through an adhesive material.

5. The electronic package of claim 1, wherein: The heat sink is coplanar with an outer surface of the packaging layer.

6. The electronic package of claim 1, wherein: The heat sink, the heat dissipation structure and the outer surface of the packaging layer are coplanar.

7. The electronic package of claim 1, wherein: The heat dissipation structure is exposed on the side surface of the packaging layer.

8. The electronic package of claim 1, wherein: The heat dissipation structure covers the electronic component.

9. The electronic package of claim 1, wherein: The heat dissipation structure includes a sheet body surrounding the heat dissipation element.

10. The electronic package of claim 9, wherein: The heat dissipation structure also includes at least one supporting foot connected to the sheet body to combine with the bearing structure.

11. The electronic package of claim 1, wherein: A plurality of heat sinks are arranged on the electronic component.

12. The electronic package of claim 1, wherein: The electronic package also includes a shielding layer formed on the packaging layer and contacting the heat dissipation structure.

13. The electronic package of claim 1, wherein: The heat sink protrudes out of the side surface of the electronic component.

14. A method for manufacturing an electronic package, comprising: Providing a bearing structure having a circuit layer; An electronic component and a heat dissipation structure with an opening are arranged on the supporting structure so that the electronic component is electrically connected to the circuit layer, and the position of the opening corresponds to the electronic component so that the electronic component is exposed outside the opening; Disposing at least one heat sink in the opening, and placing the heat sink on the electronic component; as well as A packaging layer is formed on the supporting structure so that the packaging layer covers the electronic element, the heat dissipation structure and the heat dissipation member.

15. The method for manufacturing an electronic package according to claim 14, wherein: The electronic element is electrically connected to the circuit layer through a plurality of conductive bumps or a plurality of conductive wires.

16. The method for manufacturing an electronic package as claimed in claim 14, wherein: The width or area of ​​the heat sink is smaller than or equal to the width or area of ​​the electronic component.

17. The method for manufacturing an electronic package according to claim 14, wherein: The heat sink is combined with the electronic element through an adhesive material.

18. The method for manufacturing an electronic package according to claim 14, wherein: The heat sink is coplanar with an outer surface of the packaging layer.

19. The method for manufacturing an electronic package as claimed in claim 14, wherein: The heat sink, the heat dissipation structure and the outer surface of the packaging layer are coplanar.

20. The method for manufacturing an electronic package according to claim 14, wherein: The heat dissipation structure is exposed on the side surface of the packaging layer.

21. The method for manufacturing an electronic package according to claim 14, wherein: The heat dissipation structure covers the electronic component.

22. The method for manufacturing an electronic package as claimed in claim 14, wherein: The heat dissipation structure includes a sheet body surrounding the heat dissipation element.

23. The method for manufacturing an electronic package as claimed in claim 22, wherein: The heat dissipation structure also includes at least one supporting foot connected to the sheet body to combine with the bearing structure.

24. The method for manufacturing an electronic package according to claim 14, wherein: A plurality of heat sinks are arranged on the electronic component.

25. The method for manufacturing an electronic package as claimed in claim 14, wherein: The manufacturing method also includes forming a shielding layer on the packaging layer, and the shielding layer contacts the heat dissipation structure.

26. The method for manufacturing an electronic package as claimed in claim 14, wherein: The heat sink protrudes out of the side surface of the electronic component.

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