Substrate processing apparatus and gas supply method

Abstract

The present invention discloses a substrate processing apparatus, comprising: a process chamber (100) forming a processing space in which substrate processing is performed; a plurality of gas supply parts (200), each of the plurality of gas sensing devices comprises a supply line (210) forming a supply channel communicated with the processing space and transmitting process gas from a process gas supply source (270), a supply valve (220) arranged on the supply line (210) to open and close the supply channel, and a gas sensing tool for sensing the process gas at the rear end of the supply valve (220) in the supply line (210); a control unit (300) for controlling the supply of different types of process gases by the gas supply unit (200) on the basis of the sensing results of the gas sensing means; wherein the control part (300) is used for confirming whether the supply is cut off or not based on the sensing result of at least any one gas sensing tool in the residual gas supply part (200) before the process gas is supplied by at least any one gas supply part (200) in the plurality of gas supply parts (200).

Description

Technical Field

[0001] The present invention relates to a substrate processing device and a gas supply method, and more particularly to a substrate processing device and a gas supply method for supplying different types of gases into the substrate processing device. Background Art

[0002] Generally, a substrate processing apparatus is an apparatus for performing processes such as deposition, etching, and heat treatment on a substrate. When a substrate is placed in the substrate processing apparatus, substrate processing can be performed by supplying process gases and creating an appropriate temperature environment.

[0003] A conventional substrate processing apparatus uses different types of process gases, and supplies the different types of process gases simultaneously or separately with a time difference according to the type of process to be performed.

[0004] In particular, in the process of supplying different types of process gases, the process gases mix and react, which may cause problems such as failure to react as intended by the user in the process chamber or cause explosions or the generation of harmful substances.

[0005] In order to improve the above-mentioned problem, a conventional substrate processing apparatus adopts a structure in which separate supply lines for supplying respective process gases are interlocked with each other to prevent a phenomenon in which one process gas is supplied while another process gas is supplied.

[0006] However, in the case of conventional substrate processing apparatuses, valves arranged in process lines are interlocked to prevent the simultaneous supply of different types of process gases, but it is difficult to sense whether there is leakage or inflow of process gas in the supply line, especially in the valves.

[0007] In particular, when a leak occurs in the supply line and the process gas enters, there is a possibility that two different types of process gases may mix with each other, thereby causing safety problems such as explosion and generation of harmful substances.

[0008] More specifically, conventional substrate processing apparatuses supply and cut off the supply of process gas through a valve while the supply line is filled with process gas. However, in this case, the supply line is kept filled with process gas, and positive pressure is also maintained through pressure detection. Therefore, it is difficult to confirm and respond to leakage in the supply line and the inflow of process gas.

[0009] In addition, when process gas leaks and flows into the supply line, different types of process gases are mixed and supplied in the supply line, thereby causing a problem of reducing process quality. Summary of the invention

[0010] Problem to be solved

[0011] An object of the present invention is to solve the above-mentioned problem and to provide a substrate processing apparatus and a gas supply method that can prevent different types of process gases from mixing with each other.

[0012] Means of solving the problem

[0013] The present invention is proposed to achieve the purpose of the present invention as described above. The present invention discloses a substrate processing device, including: a process chamber 100, forming a processing space for performing substrate processing; a plurality of gas supply parts 200, each including a supply line 210, a supply valve 220 and a gas sensing tool, the supply line 210 forms a supply channel connected to the processing space and transmits process gas from a process gas supply source 270, the supply valve 220 is arranged on the supply line 210 to switch the supply channel, and the gas sensing tool senses the process gas in the supply line 210 at the rear end of the supply valve 220; a control part 300, based on the sensing result of the gas sensing tool, controls the supply of different types of process gases through the gas supply part 200; wherein the control part 300 is to confirm whether to cut off the supply based on the sensing result of the gas sensing tool of at least any one of the remaining gas supply parts 200 before supplying the process gas through at least any one of the plurality of gas supply parts 200.

[0014] The gas sensing tool is a pressure sensor 230, which detects the pressure of the supply channel at the rear end of the supply valve 220; the control unit 300 can confirm whether to cut off the supply based on the pressure measurement value detected by the pressure sensor 230 of at least one of the remaining gas supply units 200 before supplying the process gas through any gas supply unit 200.

[0015] The control unit 300 compares the pressure measurement value detected by at least one pressure sensor 230 in the remaining gas supply units 200 except for at least one of the arbitrary gas supply units 200 that is scheduled to supply process gas with a preset reference value, and when the pressure is below the reference value, the process gas can be supplied through the arbitrary gas supply unit 200.

[0016] The control unit 300 compares the pressure measurement value detected by the pressure sensor 230 of the arbitrary gas supply unit 200 with a preset reference value, and when the pressure measurement value is below the reference value, the arbitrary gas supply unit 200 that is scheduled to supply the process gas can supply the process gas.

[0017] The control unit 300 can supply process gas through any gas supply unit 200 when the pressure measurement value detected by at least one pressure sensor 230 in the remaining gas supply units 200 except for at least one of the arbitrary gas supply units 200 that is scheduled to supply process gas is a negative pressure.

[0018] The control unit 300 compares the pressure measurement value detected by at least one pressure sensor 230 in the remaining gas supply unit 200 except for any gas supply unit 200 in the gas supply unit 200 with a preset reference value, and when the pressure measurement value exceeds the reference value, closes the supply valve 220 corresponding to the pressure sensor 230 that exceeds the reference value.

[0019] The control unit 300 compares the pressure measurement value detected by at least one pressure sensor 230 in the remaining gas supply units 200 except for any gas supply unit 200 in the gas supply unit 200 with a preset reference value, and when the pressure measurement value exceeds the reference value, the supply of process gas through the process gas supply source 270 can be cut off.

[0020] The control unit 300 can confirm whether the process gas is normally supplied by measuring the pressure value measured by the pressure sensor 230 of the arbitrary gas supply unit 200 supplying the process gas during the supply of the process gas by the arbitrary gas supply unit 200 in the gas supply unit 200 .

[0021] The substrate processing apparatus may further include a main supply line 600 that is coupled to the supply lines 210 of the plurality of gas supply parts 200 and has an end coupled to the process chamber 100 .

[0022] The gas supply part 200 may include: a first process gas supply part 400, including a first supply line 410, a first supply valve 420 and a first pressure sensor 430, the first supply line 410 forms a supply channel connected to the processing space and used to supply the first process gas, the first supply valve 420 is arranged on the first supply line 410 to switch the supply channel, and the first pressure sensor 430 is arranged in the first supply line 410 at the rear end of the first supply valve 420 to detect the pressure of the supply channel; a second process gas supply part 500, including a second supply line 510, a second supply valve 520 and a second pressure sensor 530, the second supply line 510 forms a supply channel connected to the processing space and used to supply the second process gas, the second supply valve 520 is arranged on the second supply line 510 to switch the supply channel, and the second pressure sensor 530 is arranged in the second supply line 510 at the rear end of the second supply valve 520 to detect the pressure of the supply channel.

[0023] The first process gas supply part 400 also includes a first control valve 440, which is arranged at the rear end of the first supply valve 420 in the first supply line 410 to control the flow rate of the first process gas; the first pressure sensor 430 can be arranged at at least one of the front end and the rear end of the first control valve 440.

[0024] The second process gas supply part 500 also includes a second control valve 540, which is arranged at the rear end of the second supply valve 520 in the second supply line 510 to control the flow rate of the second process gas; the second pressure sensor 530 can be arranged at at least one of the front end and the rear end of the second control valve 540.

[0025] In addition, the present invention discloses a gas supply method, using a substrate processing device, the substrate processing device includes: a process chamber 100, forming a processing space for performing substrate processing; multiple gas supply parts, each including a supply line, a supply valve, and a pressure sensor, the supply line forms a supply channel connected to the processing space, the supply valve is arranged on the supply line to switch the supply channel, and the pressure sensor detects the pressure of the supply channel at the rear end of the supply valve in the supply line. The gas supply method includes: a first process gas supply step S100, supplying a first process gas to the processing space through a first process gas supply part 400 in the multiple gas supply parts; a first pressure confirmation step S300, after the first process gas supply step S100, confirming whether the measured value detected by the first pressure sensor 430 of the first process gas supply part 400 is below a preset reference value; a second process gas supply step S400, when it is confirmed through the first pressure confirmation step S300 that the measured value is below the reference value, supplying a second process gas of a different type from the first process gas to the processing space through a second process gas supply part 500 in the gas supply part.

[0026] The gas supply method may further include a first process gas cleaning step S200 of performing cleaning on the first process gas supply part 400 after the first process gas supply step S100 .

[0027] The first process gas cleaning step S200 may include a supply line purging step S210 of purging the first supply line 410 of the first process gas supply part 400 ; and a supply line pumping step S220 of pumping the first supply line 410 after the supply line purging step S210 .

[0028] The first pressure confirmation step S300 may include: a first pressure detection step S310, detecting the pressure of the supply channel by the first pressure sensor 430; and a first pressure comparison step S320, comparing the measured value detected by the first pressure detection step S310 with the reference value.

[0029] The gas supply method may include a supply valve closing step S500 of closing the first supply valve 420 of the first process gas supplier 400 when it is confirmed in the first pressure confirmation step S300 that the measured value exceeds the reference value.

[0030] The supply valve closing step S500 may close the supply valves of the gas supply parts.

[0031] The first pressure confirmation step S300 may further confirm whether a measurement value measured by the second pressure sensor 530 of the second process gas supply part 500 is below a preset reference value.

[0032] The gas supply method also includes a second pressure confirmation step S600, which determines whether the measured value detected by the second pressure sensor 530 of the second process gas supply part 500 after the second process gas supply step S400 is below a preset reference value; the first process gas supply step S100, the first pressure confirmation step S300, the second process gas supply step S400 and the second pressure confirmation step S600 are performed in sequence to form a unit cycle, and the unit cycle can be performed at least once.

[0033] Effects of the Invention

[0034] The substrate processing device and gas supply method of the present invention monitor the status of each different type of process gas on each supply line, thereby having the advantage of preventing and coping with the phenomenon of mixed supply of different types of process gases.

[0035] In addition, the substrate processing device and gas supply method of the present invention monitor and detect leakage of each process gas in the supply line and the entry of process gas, thereby correspondingly cutting off the phenomenon of mixing of different types of process gases, thereby having the advantage of preventing equipment safety problems such as explosion and generation of harmful substances.

[0036] In addition, the substrate processing apparatus and gas supply method of the present invention monitors the leakage of process gas and confirms the leakage in the supply line and valve and the inflow of process gas in advance, thereby having the advantage of shortening the maintenance time. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a diagram schematically showing a substrate processing apparatus according to the present invention.

[0038] Figure 2 It is shown Figure 1 FIG. 1 is a diagram of a portion of a gas supply portion in a substrate processing apparatus.

[0039] Figure 3 is a flow chart showing the gas supply method of the present invention.

[0040] Figure 4 It is shown Figure 3 A flow chart of a case where a first pressure confirmation step in a gas supply method of the present invention confirms that a pressure measurement value exceeds a reference value. DETAILED DESCRIPTION

[0041] Hereinafter, a substrate processing apparatus according to the present invention will be described with reference to the accompanying drawings.

[0042] like Figure 1 As shown, the substrate processing device of the present invention includes: a process chamber 100, forming a processing space for performing substrate processing; a plurality of gas supply parts 200, each including a supply line 210, a supply valve 220 and a gas sensing tool, the supply line 210 forms a supply channel connected to the processing space and transmits process gas from a process gas supply source 270, the supply valve 220 is arranged on the supply line 210 to switch the supply channel, and the gas sensing tool senses the process gas at the rear end of the supply valve 220 in the supply line 210; and a control part 300, based on the sensing result of the gas sensing tool, controls the supply of different types of process gases through the gas supply part 200.

[0043] In addition, the substrate processing apparatus of the present invention may further include a main supply line 600 , which is connected to the supply lines 210 of the gas supply units 200 and has an end connected to the process chamber 100 .

[0044] Here, the substrate to be processed may include a semiconductor substrate, a substrate for a display device such as an LED or LCD, a solar cell substrate, a glass substrate, etc., and any target substrate disclosed in the past may also be applied.

[0045] In addition, substrate treatment may refer to substrate processing processes including deposition, etching, and thermal treatment, and in particular, may refer to an annealing process for improving thin film quality.

[0046] Thus, the substrate processing may be performed in a high temperature environment of more than 600 degrees Celsius. Depending on the type of process gas supplied in the high temperature environment, there may be a risk of explosion and generation of harmful substances when the process gases are mixed with each other.

[0047] On the other hand, the process gas used in the present invention may refer to a gas used for substrate processing, and various kinds of gases may be used.

[0048] As an example, the process gas in the present invention can use gases such as ammonia (NH3), hydrogen (H2), and oxygen (O2). In particular, hydrogen (H2) as a first process gas and oxygen (O2) as a second process gas are alternately supplied to the processing space in the process chamber 100, so that substrate processing can be performed.

[0049] In the process of alternately supplying hydrogen (H2) and oxygen (O2), there is a risk of explosion when these gases are mixed with each other, thus causing equipment safety problems.

[0050] Therefore, in order to prevent different types of first process gases and second process gases alternately supplied to perform substrate processing from mixing with each other, it is necessary to monitor the leakage of each process gas in the supply line and prevent and deal with the phenomenon.

[0051] The process chamber 100 of the present invention may have various structures as a structure forming a processing space for performing substrate processing.

[0052] For example, the process chamber 100 may be a single-piece device that introduces a single substrate to perform substrate processing, or as another example, may be a batch device that introduces a plurality of substrates through a substrate loading part to simultaneously perform substrate processing on the substrates.

[0053] For example, when the process chamber 100 is a batch device, it can be a process tube, forming a processing space inside to accommodate a substrate loading portion for stacking multiple substrates, and can have a manifold, which is connected to the main supply line 600 described later and is used to supply a plurality of different types of gases including a first process gas and a second process gas to the processing space.

[0054] Accordingly, the process chamber 100 accommodates a substrate loading portion for stacking a plurality of substrates and can perform a substrate processing process.

[0055] On the other hand, the process chamber 100 may be made of various materials. For example, the process chamber 100 may be made of quartz, stainless steel, aluminum, graphite, silicon carbide, or aluminum oxide.

[0056] The gas supply unit 200 may include: a supply line 210 forming a supply channel connected to the processing space; a supply valve 220 disposed on the supply line 210 to open and close the supply channel; and a gas sensing tool for sensing the process gas in the supply line 210 at the rear end of the supply valve 220 .

[0057] In addition, the gas supply unit 200 may further include a front-end control valve 240 and a rear-end control valve 250 . The front-end control valve 240 and the rear-end control valve 250 are additionally disposed at the rear end of the pressure sensor 230 on the supply line 210 .

[0058] In addition, the gas supply unit 200 may further include a purge gas supply line 260 , wherein the purge gas supply line 260 is connected to the supply line 210 to supply the purge gas to the supply channel.

[0059] In the following description, “back end” refers to the process chamber 100 side on the supply line 210 , and “front end” refers to the opposite side of the process chamber 100 on the supply line 210 , that is, the process gas supply source 270 side.

[0060] The supply line 210 is a structure forming a supply passage communicating with the processing space, and may have various structures.

[0061] For example, one end of the supply line 210 is connected to the process gas supply source 270 , and the other end is connected to the main supply line 600 , and the process gas received from the process gas supply source 270 can be supplied to the processing space through the main supply line 600 .

[0062] On the other hand, the supply line 210 is directly connected to the process chamber 100 , and the main supply line 600 is omitted, so that the process gas received from the process gas supply source 270 can be directly supplied to the processing space.

[0063] The supply line 210 is a pipeline that can form a supply channel inside. The supply of process gas and the supply flow rate can be determined by the supply valve 220, the front-end control valve 240, and the back-end control valve 250 described later.

[0064] In addition, the supply line 210 is combined with a purge gas supply line 260 to be described later, so that the inside of the supply channel can be purged, and cleaning and suction can be performed after the process gas is supplied.

[0065] The supply valve 220 is a structure provided on the supply line 210 to open and close the supply passage, and may have various structures.

[0066] For example, the supply valve 220 is disposed at the process gas supply source 270 side of the supply line 210 and can open and close the supply channel, thereby supplying or blocking the process gas through the supply line 210 .

[0067] On the other hand, in the supply line 210, until the front end of the supply valve 220 can maintain a state of being filled with the injected process gas, when the supply valve 220 is closed, a hollow supply channel without process gas can be formed at the rear end of the supply valve 220, so that the supply channel pressure at the rear end of the supply valve 220 before the process gas is supplied can be in a negative pressure state.

[0068] The gas sensing tool is a structure disposed at the rear end of the supply valve 220 in the supply line 210 to sense whether the process gas exists in the supply channel, and may have various structures.

[0069] For example, the gas sensing tool can flexibly utilize flow sensors, gas sensing sensors and pressure sensors 230, wherein the flow sensor detects whether there is process gas and the process gas flow in the supply channel, the gas sensing sensor is used to detect whether there is process gas, and the pressure sensor 230 detects the pressure in the supply channel to detect whether there is process gas and the flow in the supply channel. In addition, any previously disclosed tool that can determine whether there is process gas in the supply channel inside the supply line 210 can also be used.

[0070] In the following, an example in which the pressure sensor 230 is applied as the gas sensing tool is described, but other structures described above can of course also be used.

[0071] The pressure sensor 230 is a structure disposed at the rear end of the supply valve 220 in the supply line 210 to detect the pressure of the supply channel, and may have various structures.

[0072] As described above, the pressure sensor 230 is located at the rear end of the supply valve 220. Before the process gas is supplied, the supply channel pressure is a low pressure relatively lower than the external pressure, for example, it is in a negative pressure state. After the process gas is supplied, the supply channel pressure is a high pressure relatively higher than the external pressure, for example, it can be in a positive pressure state.

[0073] As described above, the pressure sensor 230 detects the pressure of the supply channel, and thus can confirm whether the process gas is normally supplied and whether the process gas is leaking at a specific location in the supply channel.

[0074] The front-end control valve 240 is a structure additionally disposed on the supply line 210 at the rear end of the pressure sensor 230 , and may be a structure for adjusting the supply flow rate of the process gas.

[0075] At this time, the front-end control valve 240 adjusts the opening of the supply channel on the supply line 210, thereby appropriately adjusting the flow rate of the supplied process gas, and the front-end control valve 240 can also be fully opened or fully closed according to demand.

[0076] The rear-end control valve 250 is a structure additionally disposed at the rear end of the front-end control valve 240 on the supply line 210 , and may be a structure for adjusting the supply flow rate of the process gas.

[0077] At this time, the back-end control valve 250 adjusts the opening of the supply channel on the supply line 210, thereby appropriately controlling the flow rate of the supplied process gas. It can also be fully opened or fully closed according to demand, and can be combined with the above-mentioned front-end control valve 240 to appropriately adjust the flow rate of the supplied process gas.

[0078] On the other hand, in this case, the pressure sensor 230 may be disposed at least one of between the front control valve 240 and the supply valve 220 , between the front control valve 240 and the rear control valve 250 , and at the rear end of the rear control valve 250 .

[0079] The purge gas supply line 260 is a structure connected to the supply line 210 to supply the purge gas to the supply passage, and may have various structures.

[0080] In particular, the purge gas supply line 260 supplies inert gas to the supply line 210, thereby performing a purge on the supply channel in the supply line 210. For example, after the process gas is supplied through the supply line 210, the inert gas is supplied to the inside of the supply line 210, thereby purging the residual process gas.

[0081] On the other hand, a plurality of the gas supply parts 200 are provided, and the gas supply parts 200 are arranged separately to correspond to the types of process gases to be supplied that are different from each other.

[0082] At this time, in order to prevent the supplied process gases from mixing with each other, the gas supply part 200 can supply the process gases with a time difference in supply. Each gas supply part 200 only supplies different types of process gases and can respectively include the above-mentioned structures.

[0083] For example, the gas supply unit 200 may include a first process gas supply unit 400 for supplying a first process gas and a second process gas supply unit 500 for supplying a second process gas, and may be composed of only the first process gas supply unit 400 and the second process gas supply unit 500, or may also include other gas supply units 200 in addition to these.

[0084] The first process gas supply part 400 may include: a first supply line 410, forming a supply channel, which is connected to the processing space and is used to supply the first process gas; a first supply valve 420, which is arranged on the first supply line 410 to switch the supply channel; and a first pressure sensor 430, which is arranged in the first supply line 410 at the rear end of the first supply valve 420 to detect the pressure of the supply channel.

[0085] In addition, the first process gas supply unit 400 may further include a first control valve 440 , which is disposed in the first supply line 410 at the rear end of the first supply valve 420 to control the flow rate of the first process gas.

[0086] In addition, the first process gas supply unit 400 may further include a first rear-end control valve 450 , which is additionally provided in the first supply line 410 at the rear end of the first control valve 440 to control the flow rate of the first process gas.

[0087] In addition, the first process gas supply part 400 may further include a first purge gas supply line 460 connected to the first supply line 410 to supply the purge gas to the supply channel.

[0088] In addition, the first process gas supplier 400 may include a first process gas supply source 270 connected to the first supply line 410 to supply the first process gas.

[0089] The second process gas supply part 500 may include: a second supply line 510, forming a supply channel, which is connected to the processing space and is used to supply the second process gas; a second supply valve 520, which is arranged on the second supply line 510 to switch the supply channel; and a second pressure sensor 530, which is arranged in the second supply line 510 at the rear end of the second supply valve 520 to detect the pressure of the supply channel.

[0090] At this time, the second process gas supply part 500 may further include a second control valve 540 , which is disposed in the second supply line 510 at the rear end of the second supply valve 520 to control the flow rate of the second process gas.

[0091] In addition, the second process gas supply unit 500 may further include a second rear-end control valve 550 , which is additionally disposed at the rear end of the second control valve 540 in the second supply line 510 to control the flow rate of the second process gas.

[0092] In addition, the second process gas supply part 500 may further include a second purge gas supply line 560 connected to the second supply line 510 to supply the purge gas to the supply channel.

[0093] In addition, the second process gas supplier 500 may include a second process gas supply source 570 connected to the second supply line 510 to supply the second process gas.

[0094] At this time, the first process gas and the second process gas are gases that may cause safety problems such as explosion when mixed with each other. As mentioned above, for example, the first process gas may be hydrogen and the second process gas may be oxygen.

[0095] On the other hand, the structures of the first supply line 410 and the second supply line 510, the first supply valve 420 and the second supply valve 520, the first pressure sensor 430 and the second pressure sensor 530, the first control valve 440 and the second control valve 540, the first rear-end control valve 450 and the second rear-end control valve 550, the first purge gas supply line 460 and the second purge gas supply line 560 are respectively the same as the above-mentioned supply line 210, supply valve 220, pressure sensor 230, front-end control valve 240, rear-end control valve 250 and purge gas supply line 260, and repeated description is omitted.

[0096] In addition, the first process gas supply source 470 and the second process gas supply source 570 may be structures for storing and delivering the first process gas and the second process gas, respectively.

[0097] At this time, the first pressure sensor 430 may be disposed at at least one of the front end and the rear end of the first control valve 440 , and the second pressure sensor 530 may be disposed at at least one of the front end and the rear end of the second control valve 540 .

[0098] The control unit 300 may control the supply of different kinds of process gases through the gas supply unit 200 based on the pressure detected by various gas sensing means, such as the pressure sensor 230 , of the gas supply unit 200 .

[0099] In particular, the control unit 300 may confirm whether the process gas is supplied based on the pressure measurement value detected by the pressure sensor 230 of the remaining gas supply unit 200 before at least any one of the plurality of gas supply units 200 supplies the process gas.

[0100] That is, in order to prevent the process gases supplied with time differences from mixing with each other, the control unit 300 can confirm whether the gas supply unit 200 that supplies other process gases is supplying process gas before supplying a specific process gas, that is, it can confirm whether the process gas supply of the gas supply unit 200 is in a state of cutting off.

[0101] Furthermore, the control unit 300 detects the pressure measurement value based on the pressure sensor 230 to confirm whether the process gas in the specific gas supply unit 200 through the supply valve 220 is leaking, whether different types of process gases flow into the supply line 210, monitor and prevent the mixing of different types of process gases, and can deal with this phenomenon.

[0102] More specifically, the control unit 300 compares the pressure measurement value detected by at least one pressure sensor 230 in the remaining gas supply units 200 except for at least one of the arbitrary gas supply units 200 that is predetermined to supply process gas with a preset reference value, and when the pressure is below the reference value, the process gas can be supplied through the arbitrary gas supply unit 200.

[0103] That is, when the supply valves 220 of the multiple gas supply parts 200 are closed, the pressure at the rear end of the supply valve 220 is detected. When the measured value is lower than the preset reference value, it is determined that there is no leakage in the process gas supply line 210 and new process gas can be supplied.

[0104] In this case, the preset reference value is 0 or the external pressure value of the supply line 210, and the control unit 300 can supply process gas through any gas supply unit 200 when the pressure measurement value detected by at least one pressure sensor 230 in the remaining gas supply units 200 except for at least any one gas supply unit 200 that is predetermined to supply process gas is a negative pressure.

[0105] That is, when the supply valve 220 is closed and there is no residual process gas in the supply channel inside the supply line 210, the rear end of the supply valve 220 maintains a negative pressure state. However, if process gas leakage occurs at the rear end of the supply valve 220, it becomes a positive pressure state, so the internal leakage of process gas can be confirmed by detection by the pressure sensor 230.

[0106] Thus, as described above, the control part 300 may supply a new process gas when a pressure measurement value detected by at least one pressure sensor 230 of the plurality of gas supply parts 200 is below a reference value.

[0107] Thus, the control unit 300 can prevent mixing by measuring the pressure value of the gas supply unit 200 that supplies the process gas that should not be mixed with any gas supply unit 200 that supplies the specific process gas among the plurality of gas supply units 200, thereby improving safety.

[0108] On the other hand, in this case, for higher safety, the control unit 300 can also determine whether all measurement values ​​are below the reference value by using the pressure measurement values ​​detected by the pressure sensors 230 of all remaining gas supply units 200 except any gas supply unit 200 that supplies a specific process gas.

[0109] Furthermore, the control unit 300 compares the pressure measurement value detected by the pressure sensor 230 of any gas supply unit 200 that supplies a specific process gas with a pre-set reference value, and can determine whether it is below the reference value. When it is below the reference value, the process gas can be supplied by any gas supply unit 200 that supplies the predetermined process gas.

[0110] On the other hand, the control unit 300 compares the pressure measurement value detected by at least one pressure sensor 230 in the remaining gas supply units 200 except any gas supply unit 200 in the gas supply unit 200 with a preset reference value, and when the pressure value exceeds the reference value, the supply valve 220 corresponding to the pressure sensor 230 that exceeds the reference value can be closed.

[0111] That is, the control unit 300 can supply process gas when the pressure measurement value is below the reference value. On the contrary, when the pressure measurement value exceeds the reference value, it is determined that a process gas leakage occurs in the supply line 210, and the supply valve 220 can be closed for the gas supply unit 200 including the pressure sensor 230 whose measurement value exceeds the reference value.

[0112] Furthermore, the control unit 300 may also close the supply valves 220 of all the gas supply units 200 and generate a reminder.

[0113] In addition, since the function of the supply valve 220 is damaged and the process gas leaks at the rear end of the supply valve 220 , the control unit 300 controls the process gas supply source 270 to cut off the supply of the process gas from the process gas supply source 270 .

[0114] That is, the control unit 300 compares the pressure measurement value detected by at least one pressure sensor 230 in the remaining gas supply units 200 except any gas supply unit 200 in the gas supply unit 200 with a preset reference value, and when the pressure exceeds the reference value, the supply of process gas through the process gas supply source 270 can be fundamentally cut off.

[0115] In addition, the control unit 300 not only detects the pressure of multiple gas supply units 200 before supplying process gas, but also confirms whether the process gas is supplied normally by measuring the pressure value detected by the pressure sensor 230 of the gas supply unit 200 that supplies the process gas during the supply of process gas by any one of the gas supply units 200.

[0116] That is, by using the pressure measurement value detected by the pressure sensor 230 of the gas supply unit 200 that supplies the process gas, it is confirmed whether the pressure measurement value is within the standard range of positive pressure. When it is within the standard range, it is judged that the process gas is being supplied normally. In the case of a negative pressure state, it is judged that the process gas is not being supplied. When it exceeds the standard range of positive pressure, it can be judged that the process gas is not being supplied normally.

[0117] On the other hand, if it is determined that the process gas is not supplied normally, as described above, the control unit 300 generates a reminder, closes the supply valve 220, and fundamentally cuts off the supply of process gas from the process gas supply source 270 as needed.

[0118] The main supply line 600 is coupled to each supply line 210 of the plurality of gas supply units 200 and has its end coupled to the process chamber 100 . The main supply line 600 can supply the process gas transmitted from the supply line 210 to the processing space in the process chamber 100 .

[0119] The main supply line 600 has a separate valve 610 , which can ultimately control the supply of process gas to the processing space, and can not only control whether to supply the process gas, but also adjust the supply flow rate.

[0120] On the other hand, the main supply line 600 may be omitted, and the plurality of supply lines 210 may be directly connected to the process chamber 100 .

[0121] Below, refer to Figure 2 , an embodiment of a substrate processing apparatus of the present invention is described.

[0122] When the supply of the first process gas through the first process gas supply part 400 is completed, the first process gas supply part 400 , especially the first supply line 410 , may be cleaned by purging and suction.

[0123] Then, before supplying the second process gas through the second process gas supply part 500, the pressure at the rear end of the first supply valve 420 in the first supply line 410 can be detected by the first pressure sensor 430. At this time, when the detected pressure value is below the reference value, as an example, when it is a negative pressure, the second process gas can be supplied through the second process gas supply part 500.

[0124] On the other hand, when the pressure value detected by the first pressure sensor 430 exceeds the reference value, for example, a positive pressure, the second process gas supply part 500 does not supply the second process gas, but instead generates a reminder and closes the first supply valve 420 .

[0125] Then, the second process gas is supplied through the second process gas supply part 500. If the supply of the second process gas is completed, the second process gas supply part 500, especially the second supply line 510, is cleaned by purging and suction. Then, the pressure at the rear end of the second supply valve 520 in the second supply line 510 is detected again through the second pressure sensor 530 to confirm whether the supply of the second process gas through the second supply line 510 is cut off.

[0126] On the other hand, as described above, during the supply of the first process gas through the first process gas supply part 400, the pressure can be detected by the first pressure sensor 430 to confirm whether it is supplied normally, and the pressure can be detected by the second pressure sensor 530 to monitor the leakage of the second process gas in the second supply line 510.

[0127] Similarly, during the supply of the second process gas by the second process gas supplier 500 , the second pressure sensor 530 detects the pressure to confirm whether the supply is normal, and the first pressure sensor 430 detects the pressure to monitor the leakage of the first process gas in the first supply line 410 .

[0128] Hereinafter, the gas supply method of the present invention will be described with reference to the drawings.

[0129] like Figure 3 As shown, the gas supply method of the present invention includes: a first process gas supply step S100, in which the first process gas is supplied to the processing space through the first process gas supply part 400 among the multiple gas supply parts; a first pressure confirmation step S300, after the first process gas supply step S100, confirming whether the measurement value detected by the first pressure sensor 430 of the first process gas supply part 400 is below a preset reference value; a second process gas supply step S400, when it is confirmed through the first pressure confirmation step S300 that the measurement value is below the reference value, a second process gas different from the first process gas is supplied to the processing space through the second process gas supply part 500 in the gas supply part.

[0130] In addition, the gas supply method of the present invention may further include a first process gas cleaning step S200 , which cleans the first process gas supply part 400 after the first process gas supply step S100 .

[0131] In addition, the gas supply method of the present invention may include a supply valve closing step S500 of closing the first supply valve 420 of the first process gas supply part 400 when it is confirmed in the first pressure confirmation step S300 that the measured value exceeds the reference value.

[0132] In addition, the gas supply method of the present invention may further include a second pressure confirmation step S600, which is to confirm whether the measured value detected by the second pressure sensor 530 of the second process gas supply part 500 is below a preset reference value after the second process gas supply step S400.

[0133] The first process gas supplying step S100 may be a step of supplying the first process gas to the processing space through the first process gas supplying part 400 among a plurality of gas supplying parts.

[0134] For example, the first process gas supply step S100 is a step of supplying the first process gas through the first process gas supply part 400, receiving the first process gas from the first process gas supply source 470, and supplying the first process gas to the processing space through the first supply line 410 when the first supply valve 420 is open.

[0135] At this time, the remaining gas supply parts except the first process gas supply part 400 are in a state of closing the supply valve until the front end of the supply valve remains filled with process gas, and from the rear end of the supply valve it can be maintained below a preset reference value, such as a negative pressure state.

[0136] On the other hand, the first process gas supply step S100 detects the pressure through the first pressure sensor 430 to confirm whether the measured value is within a preset standard range of positive pressure, thereby monitoring whether the first process gas is supplied normally.

[0137] In addition, the first process gas supply step S100 detects pressure through a pressure sensor of a gas supply part other than the first process gas supply part 400, and the measured value remains in a negative pressure state, thereby monitoring whether a process gas different from the first process gas leaks in the supply line.

[0138] The first process gas cleaning step S200 may be a step of performing cleaning on the first process gas supplier 400 after the first process gas supplying step S100 .

[0139] For example, the first process gas cleaning step S200 may include: a supply line purging step S210 of purging the first supply line 410 of the first process gas supply part 400; and a supply line pumping step S220 of pumping the first supply line 410 after the supply line purging step S210.

[0140] The supply line purging step S210 is a step of purging the first supply line 410 of the first process gas supply part 400 . The purging can be performed by supplying the purge gas to the first supply line 410 through the first purge gas supply line 460 .

[0141] The supply line pumping step S220 can remove the first process gas and the purge gas remaining inside by pumping and exhausting the first supply line 410 after the supply line purge step S210 .

[0142] The first pressure confirmation step S300 may be a step of confirming whether a measurement value detected by the first pressure sensor 430 of the first process gas supply part 400 is below a preset reference value after the first process gas supply step S100.

[0143] That is, the first pressure confirmation step S300 can confirm whether the first process gas in the first supply line 410 remains, leaks, or is supplied by detecting the pressure through the first pressure sensor 430, and confirm whether the leakage and supply are cut off, and then the second process gas supply step S400 can be executed.

[0144] To this end, the first pressure confirmation step S300 may include: a first pressure detection step S310, detecting the pressure of the supply channel by the first pressure sensor 430; and a first pressure comparison step S320, comparing the measured value detected by the first pressure detection step S310 with a reference value.

[0145] At this time, the reference value may be a preset absolute value. As another example, whether the pressure is positive or negative may be confirmed by comparison with the external pressure.

[0146] On the other hand, in addition to detecting the pressure through the first pressure sensor 430, the first pressure confirmation step S300 also confirms whether the measured value is below a preset reference value through the pressure sensors of the remaining gas supply parts except the first process gas supply part 400. Even if it is another gas supply part, as long as the measured value exceeds the reference value, the second process gas supply step S400 cannot be executed, but the supply valve closing step S500 can be executed.

[0147] At this time, unlike the embodiment in which the pressure sensors of the remaining gas supply parts other than the first process gas supply part 400 are used to determine whether the measured value is below the preset reference value, the second pressure sensor 530 of the second process gas supply part 500 can also be used to additionally determine whether the measured value is below the preset reference value.

[0148] When it is confirmed through the first pressure confirmation step S300 that the measured value detected by the first pressure sensor 430 is below the reference value, it is determined that the leakage and supply of the first process gas on the first supply line 410 are cut off, so the second process gas supply step S400 for supplying the second process gas can be executed.

[0149] At this time, the second process gas supplying step S400 may be a step of supplying a second process gas different from the first process gas to the processing space through the second process gas supplying part 500 in the gas supplying part when the measured value is confirmed to be below the reference value through the first pressure confirming step S300.

[0150] The second process gas supply step S400 may be a step of supplying the second process gas to the processing space through the second process gas supply part 500 among the plurality of gas supply parts.

[0151] For example, the second process gas supply step S400 is a step of supplying the second process gas through the second process gas supply part 500, receiving the second process gas from the second process gas supply source 570, and supplying the second process gas to the processing space through the second supply line 510 when the second supply valve 520 is open.

[0152] At this time, the remaining gas supply parts except the second process gas supply part 500 are in a state of closing the supply valve until the front end of the supply valve remains filled with process gas, and from the rear end of the supply valve it can be maintained below a preset reference value, such as a negative pressure state.

[0153] On the other hand, the second process gas supply step S400 is to detect the pressure through the second pressure sensor 530 to confirm whether the measured value is within the preset standard range of positive pressure, thereby monitoring whether the second process gas is supplied normally.

[0154] In addition, the second process gas supply step S400 is to detect the pressure through the pressure sensor of the gas supply part other than the second process gas supply part 500, and keep the measured value in a negative pressure state, so as to monitor whether a process gas different from the second process gas leaks in the supply line.

[0155] On the other hand, when it is confirmed in the first pressure confirmation step S300 that the detected pressure measurement value exceeds the reference value, there is a concern that mixing of different kinds of process gases may occur, so an alert is generated and the supply valve closing step S500 may be performed.

[0156] The supply valve closing step S500 may be a step of closing the first supply valve 420 of the first process gas supplier 400 when it is confirmed through the first pressure confirmation step S300 that the measured value exceeds the reference value.

[0157] That is, the supply valve closing step S500 closes the first supply valve 420, thereby preventing the first process gas from leaking at the rear end of the first supply valve 420. Even if it is closed in this way, if the pressure measurement value detected by the first pressure sensor 430 still exceeds the reference value, assuming that the function of the first supply valve 420 is damaged, the supply of the first process gas from the first process gas supply source 470 can be cut off from the source.

[0158] At this time, in addition to closing the first supply valve 420 of the first process gas supply unit 400, the supply valve closing step S500 may also close all the supply valves of the plurality of gas supply units for safety purposes.

[0159] The second pressure confirmation step S600 may be a step of confirming whether a measurement value detected by the second pressure sensor 530 of the second process gas supply part 500 is below a preset reference value after the second process gas supply step S400.

[0160] That is, similar to the above-mentioned first pressure confirmation step S300 , the second pressure confirmation step S600 may be performed on the second process gas supply part 500 , and may be similarly applicable to the first pressure confirmation step S300 , so repeated description is omitted.

[0161] On the other hand, the first process gas supply step S100, the first pressure confirmation step S300, the second process gas supply step S400 and the second pressure confirmation step S600 are sequentially performed to form a unit cycle. More preferably, the unit cycle is performed multiple times, thereby alternately and repeatedly supplying the first process gas and the second process gas.

[0162] The above is only a part of the relevant description of the preferred embodiments that can be implemented by the present invention. It is well known that the scope of the present invention shall not be limited to the above embodiments. The technical ideas of the present invention described above and their fundamental technical ideas are all included in the scope of the present invention.

Claims

1. A substrate processing device, characterized in that: include: A process chamber (100) forms a processing space for performing substrate processing; A plurality of gas supply parts (200), each comprising a supply line (210), a supply valve (220) and a gas sensing tool, wherein the supply line (210) forms a supply channel connected to the processing space and transmits process gas from a process gas supply source (270), the supply valve (220) is arranged on the supply line (210) to open and close the supply channel, and the gas sensing tool senses the process gas in the supply line (210) at the rear end of the supply valve (220); A control unit (300) controls the supply of different types of process gases through the gas supply unit (200) based on the sensing result of the gas sensing tool; The control unit (300) is configured to confirm whether to cut off the supply based on the sensing result of the gas sensing tool of at least any one of the remaining gas supply units (200) before supplying the process gas through at least any one of the multiple gas supply units (200).

2. The substrate processing device according to claim 1, characterized in that: The gas sensing means is a pressure sensor (230), The pressure sensor (230) detects the pressure of the supply channel at the rear end of the supply valve (220); The control unit (300) determines whether to cut off the supply based on the pressure measurement value detected by the pressure sensor (230) of at least one of the remaining gas supply units (200) before supplying the process gas through any of the gas supply units (200).

3. The substrate processing device according to claim 2, characterized in that: The control unit (300) compares the pressure measurement value detected by at least one pressure sensor (230) in the remaining gas supply units (200) except at least one of the gas supply units (200) that is scheduled to supply process gas with a preset reference value, and supplies process gas through any of the gas supply units (200) when the pressure measurement value is below the reference value.

4. The substrate processing device according to claim 3, characterized in that: The control unit (300) compares the pressure measurement value detected by the pressure sensor (230) of any of the gas supply units (200) with a preset reference value, and when the pressure measurement value is below the reference value, supplies the process gas through any of the gas supply units (200) that are predetermined to supply the process gas.

5. The substrate processing device according to claim 2, characterized in that: The control unit (300) supplies process gas through any of the gas supply units (200) when a pressure measurement value detected by at least one pressure sensor (230) in the remaining gas supply units (200) other than at least one of the gas supply units (200) that is predetermined to supply process gas is a negative pressure.

6. The substrate processing device according to claim 2, characterized in that: The control unit (300) is configured to compare a pressure measurement value detected by at least one pressure sensor (230) in the remaining gas supply units (200) except any of the gas supply units (200) with a preset reference value, and when the pressure measurement value exceeds the reference value, close the supply valve (220) corresponding to the pressure sensor (230) that exceeds the reference value.

7. The substrate processing device according to claim 2, characterized in that: The control unit (300) compares the pressure measurement value detected by at least one pressure sensor (230) in the remaining gas supply units (200) except any of the gas supply units (200) with a preset reference value, and cuts off the supply of process gas through the process gas supply source (270) when the pressure measurement value exceeds the reference value.

8. The substrate processing device according to claim 2, characterized in that: The control unit (300) is configured to confirm whether the process gas is being supplied normally by measuring a pressure value measured by a pressure sensor (230) of any of the gas supply units (200) supplying the process gas during supply of the process gas by any of the gas supply units (200) in the gas supply unit (200).

9. The substrate processing apparatus according to claim 1, wherein: Also includes: The main supply line (600) is connected to the supply lines (210) of the plurality of gas supply parts (200), and the end thereof is connected to the process chamber (100).

10. The substrate processing apparatus according to claim 1, wherein: The gas supply unit (200) comprises: A first process gas supply unit (400) comprises a first supply line (410), a first supply valve (420) and a first pressure sensor (430), wherein the first supply line (410) forms a supply channel connected to the processing space and used to supply the first process gas, the first supply valve (420) is arranged on the first supply line (410) to open and close the supply channel, and the first pressure sensor (430) is arranged in the first supply line (410) at the rear end of the first supply valve (420) to detect the pressure of the supply channel; The second process gas supply part (500) includes a second supply line (510), a second supply valve (520) and a second pressure sensor (530), wherein the second supply line (510) forms a supply channel connected to the processing space and used to supply the second process gas, the second supply valve (520) is arranged on the second supply line (510) to switch the supply channel, and the second pressure sensor (530) is arranged in the second supply line (510) at the rear end of the second supply valve (520) to detect the pressure of the supply channel.

11. The substrate processing apparatus according to claim 10, wherein: The first process gas supply unit (400) further includes a first control valve (440), The first control valve (440) is arranged in the first supply line (410) at the rear end of the first supply valve (420) to control the flow rate of the first process gas; The first pressure sensor (430) is disposed at at least one of the front end and the rear end of the first control valve (440).

12. The substrate processing apparatus according to claim 10, wherein: The second process gas supply unit (500) further includes a second control valve (540), The second control valve (540) is arranged at the rear end of the second supply valve (520) in the second supply line (510) to control the flow rate of the second process gas; The second pressure sensor (530) is disposed at at least one of the front end and the rear end of the second control valve (540).

13. A gas supply method using a substrate processing device, the substrate processing device comprising: A process chamber (100) forms a processing space for performing substrate processing; A plurality of gas supply parts, each comprising a supply line, a supply valve, and a pressure sensor, wherein the supply line forms a supply channel connected to the processing space, the supply valve is arranged on the supply line to switch the supply channel, and the pressure sensor detects the pressure of the supply channel at the rear end of the supply valve in the supply line, characterized in that: The gas supply method comprises: a first process gas supplying step (S100), supplying a first process gas to the processing space through a first process gas supplying part (400) among the plurality of gas supplying parts; A first pressure confirmation step (S300), after the first process gas supply step (S100), confirming whether a measured value detected by a first pressure sensor (430) of the first process gas supply part (400) is below a preset reference value; A second process gas supply step (S400), when it is confirmed through the first pressure confirmation step (S300) that the measured value is below the reference value, a second process gas different from the first process gas is supplied to the processing space through a second process gas supply part (500) in the gas supply part.

14. The gas supply method according to claim 13, characterized in that: Also includes: The first process gas cleaning step (S200) is to clean the first process gas supply part (400) after the first process gas supply step (S100).

15. The gas supply method according to claim 14, characterized in that: The first process gas cleaning step (S200) includes: A supply line purging step (S210) is performed to purge the first supply line (410) of the first process gas supply part (400); and a supply line pumping step (S220) is performed to pump the first supply line (410) after the supply line purging step (S210).

16. The gas supply method according to claim 13, characterized in that: The first pressure confirmation step (S300) includes: A first pressure detection step (S310) is to detect the pressure of the supply channel by means of the first pressure sensor (430); and a first pressure comparison step (S320) is to compare the measured value detected by means of the first pressure detection step (S310) with the reference value.

17. The gas supply method according to claim 13, characterized in that: include: The supply valve closing step (S500) is to close the first supply valve (420) of the first process gas supply part (400) when it is confirmed through the first pressure confirmation step (S300) that the measured value exceeds the reference value.

18. The gas supply method according to claim 17, characterized in that: The supply valve closing step (S500) closes the supply valves of each of the plurality of gas supply parts.

19. The gas supply method according to claim 13, characterized in that: The first pressure confirmation step (S300) further confirms whether a measurement value measured by the second pressure sensor (530) of the second process gas supply part (500) is below a preset reference value.

20. The gas supply method according to claim 13, characterized in that: Also includes: a second pressure confirmation step (S600), in which after the second process gas supply step (S400), a measurement value detected by a second pressure sensor (530) of the second process gas supply unit (500) is determined to be below a preset reference value; The first process gas supply step (S100), the first pressure confirmation step (S300), the second process gas supply step (S400) and the second pressure confirmation step (S600) are performed in sequence to form a unit cycle, and the unit cycle is performed at least once.

Images