Cooling device for cooling an electrical and / or electronic component
By setting up turbulences inside the bottom plate of the cooling equipment, and using the pressure printing part to expand the concave, combined with welded width, to solve the problem of low cooling efficiency caused by the flow of bypass flow in the existing cooling equipment, and achieve more efficient efficiency The cooling effect.
Patent Information
- Application Number
- CN202380045614.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-06-07
- Filing Date
- 2023-05-25
- Publication Date
- 2025-01-24
AI Technical Summary
When existing cooling equipment cools electrical and/or electronic components, there is a problem of bypass flow, resulting in low cooling efficiency.
Design a cooling device with the bottom plate with concave and stamping parts. The turbulent device is filled in the concave part and expanded the concave parts by the pressure seal to reduce the bearing area. Essence
By reducing the bypass area, the efficiency of cooling fluid passing through the turbulator is increased, significantly improving the efficiency of cooling electrical and/or electronic components.
Smart Images
Figure CN119365976A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a cooling device for cooling an electrical and / or electronic component and an electronic device arrangement. Background Art
[0002] Power modules such as inverter structures or converter structures are used in hybrid vehicles or electric vehicles. For example, an inverter is used to operate an electric motor, which inverter provides the electric motor with phase current. The power module can, for example, include a carrier substrate with a conductor circuit, on which, for example, power semiconductors are arranged, which together with the carrier substrate form an electronic device unit. During operation, heat is generated by the electronic device unit, which heat must be discharged to a cooling device. For this purpose, the electronic device unit is thermally connected to the cooling device. It is known that the cooling device is equipped with a cooling channel, in which a cooling fluid can flow, which cools the heat away from the cooling body. So-called turbulators can be arranged in the cooling channel, which turbulators make it possible to better discharge the heat from the cooling device to the cooling fluid flowing through the cooling device. Turbulence is generated by the turbulator and the cooling surface is increased. Summary of the invention
[0003] According to the invention, a cooling device for cooling electrical and / or electronic components is proposed. The cooling device comprises a cover plate and a base plate, wherein the base plate is configured as a deep-drawn component with a recess, wherein the cover plate and the base plate are arranged in such a way that a cooling channel is formed between the cover plate and the base plate through the recess, wherein the cover plate and the base plate are connected to each other at a contact area outside the recess, wherein a cooling fluid flow of a cooling fluid can flow through the cooling channel, wherein the cooling device also comprises at least one turbulator, which is arranged in the recess of the cooling channel, wherein the turbulator abuts against a bottom surface in the recess of the base plate, wherein the bottom surface faces the cover plate. The base plate has an embossing in a curved area at the edge of the bottom surface.
[0004] Compared with the prior art, the cooling device with the features of the independent claim has a particularly high efficiency in cooling the electrical and / or electronic components to be cooled. By means of the stamped portion, the bypass flow through the bypass area at the edge of the turbulator can be blocked or severely restricted. By means of the stamped portion, the recess in the base plate is enlarged. Since the stamping is performed in the curved area at the edge of the bottom surface, the recess in the curved area at the edge of the bottom surface is enlarged. The bottom surface edge that is rounded by deep drawing of the base plate loses the rounding due to the stamped portion. Therefore, the turbulator can fill a larger area in the recess and therefore in the cooling channel. Therefore, the deep-drawn base plate is then adapted to the shape of the turbulator so that the spacing between the turbulator and the base plate and therefore the bypass flow is kept as small as possible. Therefore, the turbulator extends into the stamped portion and fills a large area in the cooling channel that is advantageous. Therefore, the bypass area next to the turbulator is advantageously reduced. Therefore, the bypass flow through the bypass area at the edge of the turbulator can be blocked or severely restricted.
[0005] Further advantageous embodiments and developments of the invention are achieved by the features specified in the dependent claims.
[0006] According to an advantageous embodiment, it is provided that the radius of the bottom plate in the curvature region at the bottom edge is reduced by the embossing. Thus, the radius of the curvature region at the bottom edge in the interior of the cooling channel can advantageously be smaller, and due to the embossing in the interior of the cooling channel, the curvature region can be designed, for example, substantially at a right angle. Thus, the turbulator can advantageously extend further into the curvature region and the bypass flow in the bypass region can advantageously be reduced.
[0007] According to an advantageous embodiment, provision is made that the embossing forms a particularly right-angled shape in the curved region at the bottom edge. Thus, for example, a turbulator which itself has a curvature in the region of the curved region towards the bottom plate can advantageously extend further into the embossing and the bypass region.
[0008] According to an advantageous embodiment, a solder is arranged between the turbulator and the base plate in the stamping, and the turbulator is connected to the base plate in the stamping by means of the solder. The solder can advantageously be easily drawn into the stamping by means of capillary action into the minimized gap between the turbulator and the base plate. Thus, a bypass flow between the turbulator and the base plate can advantageously be reduced in the stamping.
[0009] The cooling device according to any of the preceding claims, characterized in that the gap in the stamped portion between the turbulator and the base plate is completely filled with solder. Thus, the area in the stamped portion between the turbulator and the base area is completely closed and prevents a bypass flow of cooling fluid past the turbulator. The solder can advantageously be easily sucked into the gap by means of capillary action.
[0010] The cooling device according to any of the preceding claims is characterized in that in the area where the cover plate is spaced apart from the base plate, the solder is arranged between the cover plate and the base plate, and / or in the area outside the stamped portion, the solder is arranged between the turbulator and the base plate. Thus, the bypass area in the cooling channel is further closed by additional solder in the cooling device, which is not used, for example, to connect the base plate, the cover plate and the turbulator to each other. As a result, more cooling fluid flows through the turbulator and less cooling fluid flows past the turbulator, so that the cooling device has an increased efficiency for cooling electrical and / or electronic components. Here, the solder can also be advantageously easily sucked into the corresponding gap by means of capillary action.
[0011] The cooling device according to claim 1 , characterized in that the turbulator consists of a bent sheet metal, wherein the sheet metal has a bend of the turbulator with a radius in the region of the bend region of the turbulator facing the base plate. Such a turbulator can advantageously be easily produced by cutting and reshaping the sheet metal, for example by punching and bending, for example in the same way as the cover plate and the base plate.
[0012] According to an advantageous embodiment, the radius of the base plate in the curvature region at the bottom edge is smaller than the radius of the turbulator in the region of the curvature region of the turbulator facing the base plate. As a result, the turbulator can advantageously extend further into the embossing and contact the base plate at the bottom and side regions thereof and / or be fastened to the base plate, for example welded to the base plate.
[0013] The cooling device according to any of the preceding claims, characterized in that the stamping is recessed relative to the bottom surface at the bottom surface edge. As a result, a groove is punched into the bottom surface at the bottom surface edge. This advantageously prevents overlapping of components and ensures that the turbulator can extend into the stamping. Furthermore, an enlarged gap can be formed in the stamping between the turbulator and the bottom plate, which gap can advantageously be well filled with solder.
[0014] Furthermore, the cooling device can be comprised by the electronics arrangement, wherein the electronics arrangement also comprises at least one electrical and / or electronic component to be cooled, wherein the electronic components are arranged on the cover plate or on the base plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Embodiments of the present invention are shown in the drawings and are explained in detail in the following description.
[0016] Figure 1 shows a cross section of an embodiment of an electronic device arrangement having a cooling device;
[0017] Figure 2 A partial enlarged view of an embodiment of an electronic device arrangement having a cooling device is shown;
[0018] Figure 3 A partial view of a second embodiment of an electronics arrangement is shown. DETAILED DESCRIPTION
[0019] Figure 1 A cross-sectional view of an embodiment of an electronics arrangement 50 is shown. The electronics arrangement 50 comprises a cooling device 1 and electrical and / or electronic components on the cooling device 1 . Figure 2 Shows Figure 1 A partially enlarged view of an embodiment of the cooling device 1 in FIG. Figure 3 A second embodiment of a cooling device 1 is shown.
[0020] The cooling device 1 is provided for cooling an electrical and / or electronic component 2, for example an electrical and / or electronic component of a power circuit. This can be, for example, a power circuit of a hybrid vehicle or an electric vehicle, for example an inverter structure or a converter structure. The electrical and / or electronic component 2 can be designed as a power module, for example, and can include, for example, a carrier substrate with a conductor circuit, on which, for example, power semiconductors are arranged, which together with the carrier substrate form an electronic device unit. During operation, the electrical and / or electronic component 2 generates heat, which must be conducted to the cooling device 1. For this purpose, the electrical and / or electronic component 2 is arranged on the cooling device 1, for example, on a supporting surface of a cover plate 3 or a base plate 4. One or more layers for fastening and thermally connecting the electrical and / or electronic component 2 to the cooling body 1 can be arranged between the cooling device 1 and the electrical and / or electronic component 2.
[0021] For example, a copper coating can be provided on the support surface of the cover plate 3 facing the electrical and / or electronic component 2. On the cooling device 1, a plurality of electrical and / or electronic components 2 can also be arranged, for example, next to each other on the cover plate 3 of the cooling device 1. Thus, each of the electrical and / or electronic components 2 is thermally connected to the cooling device 1 and fastened thereto.
[0022] The bottom plate 4 and the cover plate 3 form the outer wall of the cooling device 1. The bottom plate 4 forms the bottom of the cooling device 1. The cover plate 3 forms the top of the cooling device 1. The bottom plate 4 and the cover plate 3 can be made of a material with high thermal conductivity, such as metal, such as aluminum. The bottom plate 4 and the cover plate 3 are formed from a sheet material. The bottom plate 4 and / or the cover plate 3 have, for example, a constant thickness. The bottom plate 4 and the cover plate 3 can have, for example, the same thickness. However, the bottom plate 4 and the cover plate 3 can also have different thicknesses.
[0023] A recess 40 is formed in the bottom plate 4. Therefore, the bottom plate 4 is basically shaped like a pot. The cover plate 3 is arranged on the bottom plate 4 so that the recess 40 in the bottom plate 4 is covered by the cover plate 3. The bottom plate 4 and the cover plate 3 are arranged closely to each other so that a cooling channel 5 is formed between the bottom plate 4 and the cover plate 3 through the recess 40. The cooling channel 5 extends between the bottom plate 4 and the cover plate 3. The bottom plate 4 and the cover plate 3 form a wall that defines the cooling channel 5. The bottom plate 4 is configured as a deep-drawn part. An edge 41 of the bottom plate 4, which is configured in one plane, for example, is connected to an edge 31 of the cover plate 3. The area where the bottom plate 4 is connected to the cover plate 3 is called the contact area 8. The edge 41 of the bottom plate 4 surrounds the recess 40 in the bottom plate 4. The edge 41 of the bottom plate 4 is placed on the edge 31 of the cover plate 3, for example, directly or with an intermediate layer inserted. The edge 41 of the bottom plate 4 is fixedly connected, especially welded, to the edge 31 of the cover plate 3. The edge 41 of the bottom plate 4 can be connected, in particular welded, to the edge 31 of the cover plate 3 directly or with the insertion of one or more intermediate layers or intermediate elements. The edge 41 of the bottom plate 4 is connected to the edge 31 of the cover plate 3, for example, by a brazing process. The edge 41 of the bottom plate 4 is completely circumferentially connected, in particular welded, to the edge 31 of the cover plate 3.
[0024] In the region of the recess 40, the base plate 4 is spaced apart from the cover plate 3, so that a cavity capable of flow through is formed between the base plate 4 and the cover plate 3, in which the cooling channel 5 extends. Here, as in the embodiment, the edge 41 of the base plate 40 can extend in a planar manner in a first plane. In addition, a plate section 42 of the base plate 40, for example, which forms the bottom of the recess 40, can extend flatly in a second plane, which extends in particular parallel to the first plane. Therefore, the edge 41 of the base plate 40 and the plate section 42 of the base plate 4 are arranged flatly and parallel to each other. The cover plate 3 can be constructed flatly or can also be constructed as a deep-drawn part, for example. The recess 40 and therefore the cooling channel 5 can be constructed in an elongated manner with respect to the base plate 4, in particular, in a rectangular shape at least in sections. The cooling channel 5 extends in a longitudinal direction at least in sections. Preferably, when viewed toward the plate plane of the cover plate 3, the cooling channel 5 has an elongated region extending in a longitudinal direction, in particular defined by a straight line, and the elongated region has a rectangular geometry in particular.
[0025] In the recess 40 of the bottom plate 4, the bottom plate 4 has a stamping 7. At the stamping 7, the bottom plate 4 is deformed by stamping. The bottom plate 4 is stamped in the recess. The stamping 7 is arranged at the edge of the bottom surface 44 of the bottom plate. The bottom surface 44 of the bottom plate 4 extends particularly flat on the plate section 42. The bottom surface 44 is the surface of the bottom plate 4 facing the cooling channel 5 and the cover plate 3. The bottom surface 44 forms the bottom of the cooling channel 5 on the bottom plate 4. The stamping 7 is arranged at the edge of the bottom surface 44. The edge of the bottom surface 44 is the area where the bottom plate 4 is deformed from the plane of the bottom surface 44 in the direction of the cover plate 3. The edge of the bottom surface 44 is arranged in the bending area 43 of the bottom plate 4, wherein the bottom plate 4 is bent in the direction of the cover plate 3 at the edge of the flat plate section 42. By the stamping 7, the radius R4 of the bending area 43 inside the recess 40 is reduced compared with the radius in the bending area 43 before stamping. The recess 40 and the cooling channel 5 are enlarged in the bending area 43 by the embossing 7. The embossing 7 is embossed into the bending area 43, for example, as a substantially rectangular corner. At the edge of the bottom surface 44, for example, a rectangular shape is embossed into the bending area 43 of the bottom plate 4. Therefore, the flat plate section 42 at the edge of the bottom surface 44 inside the recess 40 transitions into the bending area 43 of the bottom plate 4 at an angle, in particular at a right angle. The bottom surface 44 is arranged at an angle, in particular at a substantially right angle, relative to the side surface adjacent to the bottom surface 44 in the recess 40. The radius R4 of the bend in the bottom plate 4 between the bottom surface 44 and the side surface is reduced by the embossing 7. By means of the embossing 7, an angle, in particular a substantially right angle, is embossed in the bending area 43 of the bottom plate 4. The embossing 7 can, for example, be flatly connected to the bottom surface 44, such as Figure 2 As in the first embodiment of the cooling device 1 in FIG. Therefore, the bottom surface 44 is widened by the embossing 7. However, the embossing 7 can also be configured recessed relative to the bottom surface 44, for example as a groove at the edge of the bottom surface 44. This Figure 3 A second embodiment of a cooling device 1 is shown in FIG.
[0026] For example, an intermediate plate can be provided between the cover plate 3 and the bottom plate 4. Such an intermediate plate can provide, for example, an additional spacing relative to the top of the bottom plate 4 in order to adjust the height of the cooling channel 5. Alternatively, as in the embodiment shown in the figure, the cover plate 3 and the first plate section 41 of the bottom plate 4 can also directly abut against each other.
[0027] In addition, the cooling device 1 includes an inflow opening not shown in the figure, through which a cooling fluid can be delivered to the cooling channel 5 in the cooling device 1. In addition, the cooling device 1 includes a discharge opening, through which a cooling fluid can flow out from the cooling channel 5 and the cooling device 1. The cooling fluid can be water, for example. The inflow opening and / or the discharge opening can be formed, for example, by an opening in the recess 40 of the base plate 4. The opening can be, for example, a through-hole in the base plate 4. For example, an inflow pipe connection piece can also be arranged or constructed at the inflow opening. Similarly, a discharge pipe connection piece can be arranged or constructed at the discharge opening. The cooling channel 5 can be penetrated by a cooling fluid flow of a cooling fluid from the inflow opening to the discharge opening. The cooling fluid can flow into the cooling channel 5 through the inflow opening of the cooling device 1, and flow out from the cooling channel 5 of the cooling device 1 through the discharge opening of the cooling device 1. The cooling channel 5 is configured to guide the cooling fluid through the cooling device 1. The cooling channel 5 in the cooling device 1 extends from the inflow opening to the discharge opening in the cooling device 1. A cooling fluid flow of a cooling fluid can flow through the cooling channel 5 in the longitudinal direction from the inlet opening to the outlet opening.
[0028] The cooling device 1 also includes at least one turbulator 6. The turbulator 6 is arranged in the cooling channel 5. The turbulator 6 is arranged in a turbulator section 56 of the cooling channel 5 extending in the longitudinal direction. The turbulator 6 is arranged between the cover plate 3 and the base plate 4. The turbulator 6 can extend from the cover plate 3 completely through the cooling channel 5 to the base plate 4. In particular, the turbulator 6 is in indirect and / or direct heat-conducting contact with the cover plate 3 and the base plate 4. The turbulator 6 is fastened to the cover plate 3 and / or the base plate 4, for example, by means of a brazing process. The turbulator 6 abuts against the bottom surface 44 on the base plate 4 and / or is connected to the bottom surface 44, in particular welded. The turbulator 6 extends on the bottom surface 44. The turbulator 6 extends into the stamped portion 7. The turbulator 6 is passed through by the cooling fluid in the longitudinal direction parallel to the cover plate 3, for example, which is flat in structure, and / or parallel to the plate section 42, for example, which is flat in structure, of the base plate 4. The turbulator 6 has a surface-enlarging, flow-guiding and heat-transferring structure. The turbulator 6 is, for example, made of a metal with good thermal conductivity, such as aluminum. For example, the turbulator 6 can also have a coating. The turbulator 6 can, for example, be constructed as a structured plate. In order to achieve the highest possible cooling efficiency, the flow cross section of the cooling channel 5 between the base plate 4 and the cover plate 3 is filled with the turbulator 6 as much as possible. The turbulator 6 extends, for example, substantially parallel to the plate section 42 of the cover plate 3 and / or the base plate 4, which is, for example, a flat structure. For example, the turbulator 6 has substantially the same surface extension as the supporting surface on the cover plate 3 on which the electrical and / or electronic components 2 are arranged.
[0029] The turbulator 6 is, for example, of an integral structure. The turbulator 6 is, for example, made of a sheet material by cutting and deforming, in particular by stamping and bending. The turbulator 6 is configured to generate turbulence in the cooling fluid. The turbulator 6 is structured to generate turbulence in the cooling fluid. For example, a plurality of turbulent sections are configured at the turbulator 6, which are arranged at an angle relative to the flow direction, in particular the longitudinal direction, of the cooling fluid through the cooling channel 5. The turbulent sections are used to form vortices in the cooling fluid flowing through the cooling channel 5. Heat can thereby be discharged particularly efficiently. The turbulent sections can, for example, be configured in a wavy or serrated manner, or as periodically recurring ridges and / or recesses in the turbulator. The turbulent sections of the turbulator 6 can, for example, be configured by cutting and deforming, for example, stamping and bending, the sheet material from which the turbulator 6 is made.
[0030] In order to achieve high cooling efficiency, the flow cross section of the cooling channel 5 is covered by the turbulator 6 as much as possible. Since the base plate 4 is a deep-drawn component, the demolding process during deep drawing requires a demolding slope and radius at the edge of the recess 40. The radius formed by deep drawing is reduced by the stamping portion 7. The turbulator 6 is arranged below the electrical and / or electronic component 2. At the edge of the cooling channel 5, there is a bypass area 55 beside the turbulator 6 and between the turbulator 6, the base plate 4 and the cover plate 3. When viewed in the plane of the support surface for the electrical and / or electronic component 2, the bypass area 55 is located next to the electrical and / or electronic component 2. In the bypass area 55, the cooling channel 5 is constructed in a tapered manner. In the bypass area 55, no eddy current occurs in the cooling fluid flow. Through the stamping portion 7, the turbulator 6 can extend into the stamping portion 7 with a constant extension from the base plate 4 to the cover plate 3, advantageously filling most of the cooling channel 5. In the region of the curvature region 43 of the turbulator 6 facing the base plate 4, the turbulator 6 is curved and has a radius R6 of the turbulator. The radius R4 represents the radius of the curvature region 43 at the edge of the base surface 44. The radius R6 of the turbulator 6 is greater than the radius R4 in the curvature region 43 at the edge of the base surface 44. As a result, the turbulator 6 can extend further into the stamping 7 and advantageously fill a large portion of the cooling channel 5.
[0031] As shown in the figure, solder 20 can also be provided at different locations in the cooling device 1. The solder 20 can be sucked into a narrow location in the cooling device 1 by capillary action, for example. The solder 20 can be arranged, for example, in the region of the stamped portion 7 and / or between the turbulator 6 and the base plate 4 in the stamped portion 7. Here, for example, the gap between the turbulator 6 and the base plate 4, especially in the stamped portion 7, can be filled with solder 20. The region in the cooling device 1 where the cover plate 3 is spaced apart from the base plate 4 can also be filled with solder 20. In addition, the solder 20 can also be arranged in the region between the base plate 4 and the turbulator 6 outside the stamped portion 7. The region where the cooling fluid can flow past the turbulator 6 is closed by the solder 20. Therefore, the bypass flow of the cooling fluid past the turbulator 6 is reduced or prevented, and the efficiency of cooling the electrical and / or electronic components 2 by the cooling device 1 is improved.
[0032] Of course, further embodiments and combinations of the embodiments shown are also possible.
Claims
1. A cooling device for cooling an electrical and / or electronic component (2), comprising a cover plate (3) and a base plate (4), wherein: The base plate (4) is designed as a deep-drawn component with a recess (40), wherein the cover plate (3) and the base plate (4) are arranged in such a way that a cooling channel (5) is formed between the cover plate (3) and the base plate (4) through the recess (40), wherein the cover plate (3) and the base plate (4) are connected to each other at a contact area (8) outside the recess (40), wherein a cooling fluid flow of a cooling fluid can flow through the cooling channel (5), wherein the cooling device (1) further comprises at least one turbulator (6) which is arranged in the recess (40) of the cooling channel (5), wherein the turbulator (6) abuts against a bottom surface (44) in the recess (40) of the base plate (4), wherein the bottom surface (44) faces the cover plate (3), The invention is characterized in that the bottom plate (4) has an embossing portion (7) in a bending area (43) at the edge of the bottom surface (44).
2. The cooling device according to claim 1, characterized in that: The radius (R4) of the bottom plate (4) in the curved region (43) at the edge of the bottom surface (44) is reduced by the embossing (7).
3. A cooling device according to any one of the preceding claims, characterised in that The embossing (7) forms, in particular right-angled shapes, in the curved region (43) at the edge of the bottom surface (44).
4. A cooling device according to any one of the preceding claims, characterised in that A solder (20) is arranged between the turbulator (6) and the base plate (4) in the embossing (7), and the turbulator (6) is connected to the base plate in the embossing (7) by means of the solder (20).
5. A cooling device according to any one of the preceding claims, characterised in that The gap between the turbulator (6) and the base plate (4) in the stamped portion (7) is completely filled with solder (20).
6. A cooling device according to any one of the preceding claims, characterised in that The solder (20) is arranged between the cover plate (3) and the base plate (4) in an area where the cover plate (3) is spaced apart from the base plate (4), and / or the solder (20) is arranged between the turbulator (6) and the base plate (4) in an area outside the stamping (7).
7. A cooling device according to any one of the preceding claims, characterised in that The turbulator (6) is formed by a curved sheet metal, wherein the sheet metal has a curvature of the turbulator (6) in the region of a curvature region (43) of the turbulator (6) facing the base plate (4), the curvature having a radius (R6).
8. The cooling device according to claim 7, characterized in that The radius (R4) of the bottom plate (4) in the curved region (43) at the edge of the bottom surface (44) is smaller than the radius (R6) of the turbulator (6) in the region of the curved region (43) of the turbulator (6) facing the bottom plate (4).
9. A cooling device according to any one of the preceding claims, characterised in that The embossed portion (7) is recessed relative to the bottom surface (44) at an edge of the bottom surface (44).
10. An electronic device apparatus, comprising: - A cooling device (1) according to any one of the preceding claims, and At least one electrical and / or electronic component (2) to be cooled, wherein the electrical and / or electronic component (2) is arranged on the cover plate (3) or on the base plate (4).