Holding member, cutting table and device, and method for manufacturing semiconductor device

Abstract

The invention provides a holding member, a cutting table and device, and a method for manufacturing a semiconductor device, which can prevent a non-product part generated by cutting an object to be cut from being attached to the holding member. The holding member (10) sucks and holds an object (W) to be cut on a cutting table (4), a plurality of recesses (10c) are formed in the surface of a contact region (10S) that contacts a non-product portion (Wy) generated by cutting the object (W) to be cut, and the plurality of recesses (10c) communicate with the outside of the contact region (10S).

Description

Technical Field

[0001] The present invention relates to a holding member, a cutting table, a cutting device, and a method for manufacturing a semiconductor device. Background Art

[0002] In the past, as shown in Patent Document 1, it was considered that in a cutting device for cutting a wafer, a chuck table for adsorbing and holding the wafer had the following structure, that is, a disc-shaped holding portion made of porous ceramics and an outer peripheral ring portion provided around the outer periphery of the holding portion. Moreover, the outer peripheral ring portion was provided corresponding to the outer peripheral edge of the wafer and was composed of a stacked quartz glass layer with a small surface roughness. With this structure, the cutting chips generated when the wafer is cut are prevented from staying on the surface of the quartz glass layer.

[0003] [Prior art literature]

[0004] [Patent Document]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2013-084755 Summary of the invention

[0006] [Problems to be solved by the invention]

[0007] On the other hand, from the viewpoints of water resistance, tracking of warping of the cut object, or preventing positional displacement of the cut object, elastic resins such as silicone resins or fluorine resins are used in the holding member (holding layer) for holding the cut object. In addition, adsorption holes for adsorbing and holding the cut object are formed in the holding member.

[0008] However, in the holding member, since the object to be cut is closely held by the elastic resin, there is a problem that the non-product portion produced by cutting the object to be cut is attached to the holding member. The non-product portion attached to the holding member can also be washed away by a machining fluid such as cutting water, but sometimes it is impossible to wash away the non-product portion. In addition, if the product portion is always attached to the holding member, there is also a concern that the rotating blade of the cutting mechanism may be damaged.

[0009] Therefore, the present invention is made to solve the above-mentioned problems, and a main subject thereof is to prevent a non-product portion generated by cutting an object to be cut from being attached to a holding member.

[0010] [Technical means to solve the problem]

[0011] That is, the holding member of the present invention is a holding member that adsorbs and holds the cutting object on the cutting workbench, wherein a plurality of recesses are formed on the surface of the contact area that contacts the non-product portion produced by cutting the cutting object, and the plurality of recesses are connected to the outside of the contact area.

[0012] [Effects of the Invention]

[0013] According to the present invention thus constituted, it is possible to prevent the non-product portion produced by cutting the object to be cut from adhering to the holding member. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram which shows the structure of the cutting device which concerns on one Embodiment of this invention.

[0015] Figure 2 It is a cross-sectional view schematically showing the structure of the cutting table according to the embodiment.

[0016] Figure 3 (a) is a plan view schematically showing the structure of a substrate of the embodiment, and Figure 3 (b) is a plan view schematically showing the structure (particularly the holding region) of the holding member of the embodiment.

[0017] Figure 4 It is a plan view schematically showing the structure (particularly the contact region) of the holding member according to the embodiment.

[0018] Figure 5 It is a partially enlarged plan view schematically showing the structure of the holding member according to the embodiment.

[0019] Figure 6 It is a partially enlarged cross-sectional view schematically showing the structure of the holding member according to the embodiment.

[0020] Figure 7 It is a partially enlarged plan view schematically showing the structure of a holding member according to a modified embodiment.

[0021] Figure 8 It is a partially enlarged cross-sectional view schematically showing the structure of a holding member according to a modified embodiment.

[0022] Fig. 9 It is a schematic diagram which shows the structure around the cutting table in a modified embodiment.

[0023] [Explanation of Symbols]

[0024] 2: Substrate storage unit

[0025] 3: Transport mechanism (loader)

[0026] 4: Cutting table

[0027] 5: Cutting off mechanism

[0028] 6: Transport mechanism (unloader)

[0029] 7: Inspection workbench

[0030] 8: Check the camera

[0031] 9a: Pallet for good products

[0032] 9b: Pallets for defective products

[0033] 10: Keep the components

[0034] 10a: Adsorption hole

[0035] 10b: Bag

[0036] 10c: concave part

[0037] 10d: Roughened surface

[0038] 10e: Second recess

[0039] 10M: Knife avoidance groove

[0040] 10R: Retention Zone

[0041] 10S: Contact area

[0042] 11: Plate

[0043] 11a: Workbench tray

[0044] 11a1: Upper surface

[0045] 11b: Recycling disc

[0046] 11b1: Upper surface

[0047] 12: Recycling Bin

[0048] 31: Guide rail

[0049] 50: Processing fluid supply department

[0050] 51: Spindle

[0051] 52: Rotating Knife

[0052] 61: Maintaining Department

[0053] 62: Mobile mechanism

[0054] 100: Cutting device (semiconductor manufacturing equipment)

[0055] 100A: Supply module (module)

[0056] 100B: Cut off module (module)

[0057] 100C: Check module (module)

[0058] CTL: Control Department

[0059] P: Cut products (semiconductor devices)

[0060] W: Substrate (cutting object)

[0061] Wx: Product Department

[0062] Wy: Non-product department DETAILED DESCRIPTION

[0063] Next, the technology of the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following technology.

[0064] The holding component of technology 1 of the present invention is a holding component that adsorbs and holds the cutting object on a cutting workbench, wherein a plurality of recesses are formed on the surface of a contact area that contacts a non-product portion produced by cutting the cutting object, and the plurality of recesses are connected to the outside of the contact area.

[0065] If such a holding member is used, since a plurality of recesses are formed on the surface of the contact area with the non-product part, the contact area between the holding member and the non-product part can be reduced to reduce the adhesion force, thereby making it easy to remove the non-product part. In addition, since the plurality of recesses are connected to the outside of the contact area, the machining fluid can easily flow between the holding member and the non-product part, thereby making it easy to remove the non-product part. Therefore, it is possible to prevent the non-product part generated by cutting the object from being attached to the holding member. In addition, the supply amount of the machining fluid can be reduced, thereby saving the machining fluid.

[0066] As a specific embodiment of the holding member, a structure in which a plurality of recesses are regularly formed, a structure in which a plurality of recesses are irregularly formed, or a structure in which a plurality of recesses are formed in an amorphous manner can be considered. Here, the structure in which a plurality of recesses are regularly formed can easily process the holding member. Therefore, the holding member of the technology 2 of the present invention is based on the structure of the technology 1, wherein it is ideal that the plurality of recesses are in a lattice shape, a stripe shape, or a dot shape when viewed from above.

[0067] The cutting table according to the third aspect of the present invention is a cutting table that sucks and holds an object to be cut, and includes a holding member having the structure of the first or second aspect.

[0068] According to such a configuration, it is possible to prevent a non-product portion generated by cutting the object to be cut from being attached to the holding member, and thus the non-product portion can be easily removed from the cutting table.

[0069] The cutting device of technology 4 of the present invention includes: a cutting workbench that adsorbs and holds the cutting object; and a cutting mechanism that cuts the cutting object held on the cutting workbench, and the cutting workbench has a holding component with the structure of technology 1 or 2.

[0070] With such a structure, it is possible to prevent the non-product portion produced by cutting the object from being attached to the holding member, so that the non-product portion can be easily removed from the cutting table. In addition, since the non-product portion can be prevented from being attached, it is also possible to prevent the rotary blade of the cutting mechanism from being damaged due to the non-product portion being attached.

[0071] The method for manufacturing a semiconductor device according to technology 5 of the present invention uses the cutting device of technology 4 to cut a substrate on which a plurality of semiconductor devices are formed, thereby manufacturing a singulated semiconductor device. The method for manufacturing a semiconductor device uses the cutting workbench to hold the substrate, and uses the cutting mechanism to cut the substrate held on the cutting workbench.

[0072] <One embodiment of the present invention>

[0073] Hereinafter, one embodiment of the cutting device of the present invention will be described with reference to the drawings.

[0074] In addition, for the sake of easy understanding, the following drawings are schematically depicted with appropriate omission or exaggeration. The same components are denoted by the same reference numerals and the description thereof is appropriately omitted.

[0075] <Overall Structure of Cutting Device 100>

[0076] The cutting device 100 of the present embodiment is a device that cuts a substrate W as a cutting object and separates the substrate W into a plurality of cut products P.

[0077] Here, as the substrate W, for example, a flip chip substrate or a sealed substrate can be listed. The so-called flip chip substrate is a substrate to which electronic components such as semiconductor chips, resistor elements, capacitor elements, etc. are connected via a flip chip. In addition, the so-called sealed substrate is a substrate that is resin-molded in a manner such that at least the electronic components are sealed with resin, to which electronic components such as semiconductor chips, resistor elements, capacitor elements, etc. are connected. As a substrate constituting a sealed substrate, a lead frame or a printed wiring board can be used. In addition, a semiconductor substrate (including semiconductor chips such as silicon chips), a metal substrate, a ceramic substrate, a glass substrate, a resin substrate, etc. can also be used. In addition, wiring may or may not be applied to the substrate constituting the sealed substrate.

[0078] Specifically, the cutting device 100 is as follows: Figure 1As shown, the cutting device 100 includes a supply module 100A for supplying a substrate W, a cutting module 100B for cutting the substrate W, and an inspection module 100C for inspecting the cut products P that have been cut and singulated as components. Each component is detachable and replaceable relative to other components. In addition, when the substrate W is a substrate on which a plurality of semiconductor devices are formed, the cutting device 100 can be called a semiconductor manufacturing device for manufacturing singulated semiconductor devices.

[0079] The operation control of the cutting device 100 including the modules 100A to 100C shown below is performed by the control unit CTL provided in the supply module 100A. The control unit CTL may also be provided in the modules 100B and 100C other than the supply module 100A. In addition, the control unit CTL may be divided into a plurality of modules and provided in at least two modules among the supply module 100A, the cutting module 100B and the inspection module 100C.

[0080] The supply module 100A supplies the substrate W to be cut from the outside and receives the substrate W. The supply module 100A is provided with a substrate receiving section 2 for receiving the substrate W. The substrate W is transported from the supply module 100A to the cutting module 100B by a transport mechanism (loader) 3. In addition, the loader 3 transports the substrate W to the cutting module 100B using a guide rail 31. The cutting device 100 of this embodiment includes three substrate receiving sections 2, but the number of the substrate receiving sections 2 is not particularly limited.

[0081] The cutting module 100B cuts the substrate W into a plurality of cut products P. The cutting module 100B includes a cutting table 4 that sucks and holds the substrate W, and a cutting mechanism 5 that cuts the substrate W held on the cutting table 4 .

[0082] The cutting mechanism 5 is formed by installing a rotating knife 52 on a main shaft 51. Then, by moving the cutting workbench 4 and the cutting mechanism 5 relative to each other, the substrate W is cut by the rotating knife 52 and singulated into cut products P. Here, in order to suppress the friction heat generated when the substrate W is cut, cutting water as a processing fluid is supplied to the rotating knife 52 and the substrate W by the processing fluid supply unit 50. Then, the singulated cut products P are transported from the cutting module 100B to the inspection module 100C by the transport mechanism (unloader) 6. In addition, the unloader 6 has: a holding portion 61 that respectively adsorbs and holds a plurality of cut products P, and a moving mechanism 62 that moves the holding portion 61. The cutting device 100 of this embodiment includes two cutting mechanisms 5, but the cutting mechanism 5 may also be one.

[0083] The inspection module 100C takes an image of the cut products P that have been singulated by the cutting module 100B and inspects them. The inspection module 100C includes an inspection workbench 7 that absorbs and holds a plurality of cut products P, and an inspection camera 8 that takes an image of the plurality of cut products P held on the inspection workbench 7. Then, in the inspection module 100C, the cut products P that have been singulated are divided into good products and defective products based on the image obtained by the inspection camera 8. Then, by a transfer mechanism (not shown), good products are transferred and stored in a good product tray 9a, and defective products are transferred and stored in a defective product tray 9b (see FIG. 1 ). Figure 1 ).

[0084] <Structure of cutting table 4>

[0085] Then, in this embodiment, if Figure 2 to Figure 5 As shown, the cutting table 4 has a holding member 10 for sucking and holding the substrate W. A knife avoidance groove 10M for retracting the rotating knife 52 during cutting is formed in the holding member 10. The holding member 10 is made of elastic resin (rubber material) such as silicone resin or fluorine resin.

[0086] The holding member 10 is formed with an adsorption hole 10a for adsorbing and holding the substrate W or the plurality of cut products P. In this embodiment, in order to enhance the adsorption force of the adsorption hole 10a, the opening size of the adsorption side opening of the adsorption hole 10a is enlarged to form a pocket portion 10b. Figure 2 to Figure 5 The bag portion 10b has a rectangular shape in a plan view, but the shape of the bag portion 10b in a plan view is not limited to this.

[0087] Here, if Figure 3 As shown in (a), the substrate W has a product portion Wx used as a product after being cut, and a non-product portion Wy not used as a product after being cut. In this embodiment, a plurality of product portions Wx are arranged in a central portion, for example, in a vertical and horizontal matrix (in a rectangular shape as a whole), and a non-product portion Wy is arranged at the periphery of the plurality of product portions Wx. In addition, the configuration of each of the product portion Wx and the non-product portion Wy is not limited to the above. For example, the non-product portion Wy may also be arranged outside the periphery of the substrate W.

[0088] Therefore, if Figure 3 (b) and Figure 4 As shown, the knife avoidance grooves 10M are formed in a grid shape corresponding to the product parts Wx and the non-product parts Wy, and the rectangular area surrounded by the knife avoidance grooves 10M becomes a holding area 10R for holding each product part Wx of the substrate W (see Figure 3 (b)). In addition, in the holding member 10, the four sides surrounding the plurality of holding regions 10R are formed with contact regions 10S that are in contact with the non-product portion Wy (see Figure 4 ).

[0089] Moreover, if Figure 5 and Figure 6 As shown in FIG. 1 , in the holding member 10, a plurality of recesses 10c are formed on the surface of the contact region 10S that contacts the non-product portion Wy generated by cutting the substrate W. The plurality of recesses 10c reduce the contact area between the surface of the contact region 10S and the non-product portion Wy. By forming the plurality of recesses 10c, the contact area is, for example, 20% to 30% when the contact area when the recesses 10c are not formed is set to 100%.

[0090] In addition, if Figure 5 and Figure 6 As shown, the plurality of recesses 10c are connected to the outside of the contact area 10S when the non-product portion Wy is in contact with the contact area 10S. Thus, the machining fluid supplied by the machining fluid supply unit 50 flows between the non-product portion Wy and the contact area 10S (see Figure 6 ).

[0091] Here, the term "communicating with the outside of the contact region 10S" includes: (1) the recess 10c extends to the outside of the non-product portion Wy (contact region 10S) when viewed from above and the recess 10c opens on the surface of the retaining member 10, or (2) the recess 10c is covered by the non-product portion Wy when viewed from above, but the recess 10c opens on the side surface of the retaining member 10 or the inner surface of the tool avoidance groove 10M. In addition, in a plan view, the two ends of the recess 10c may be connected to the outside of the contact region 10S, or one end of the recess 10c may be connected to the outside of the contact region 10S. In addition, in the case of a structure in which one end of the recess 10c is connected to the outside of the contact region 10S, it is desirable that, for example, one end on the side where the machining fluid is supplied is connected to the outside of the contact region 10S so that the machining fluid can flow in easily.

[0092] Specifically, if Figure 5 and Figure 6 As shown, the plurality of recesses 10c are in a grid, stripe or dot shape when viewed from above. Figure 5 and Figure 6 The example of forming the plurality of recesses 10c in a grid shape is shown. By forming the plurality of recesses 10c in a grid shape, the number of inflow sites of the processing fluid can be increased and the processing fluid can be easily flowed in. In addition, depending on the type of substrate W, the material of the holding member 10, or the flow conditions of the processing fluid (such as the flow rate or the supply direction, etc.), the plurality of recesses 10c can be formed in various shapes other than a grid shape, such as stripes or dots.

[0093] The width and depth of each recess 10c are desirably reduced to a size that does not trap foreign matter in the recess 10c and is not affected by the cutting of the substrate W (production of the cut product P) and the wear caused by cleaning. Specifically, it is considered that the width and depth of each recess 10c are, for example, several 10 μm to several 100 μm. It is considered that the spacing between the plurality of recesses 10c is, for example, several 10 μm. The plurality of recesses 10c can be formed by irradiating a laser, can be formed by mechanical processing such as cutting, can be formed by chemical treatment using a liquid medicine, or can be formed by mold transfer molding.

[0094] <Effects of the present embodiment>

[0095] According to the cutting device 100 of the present embodiment, since a plurality of recesses 10c are formed on the surface of the contact region 10S that contacts the non-product portion Wy, the contact area between the holding member 10 and the non-product portion Wy can be reduced to reduce the adhesion force, thereby making it easy to remove the non-product portion Wy. In addition, since the plurality of recesses 10c are connected to the outside of the contact region 10S, the processing fluid can easily flow between the holding member 10 and the non-product portion Wy, thereby making it easy to remove the non-product portion Wy. Therefore, it is possible to prevent the non-product portion Wy generated by cutting the substrate W from being attached to the holding member 10. In addition, the supply amount of the processing fluid can be reduced, thereby saving the processing fluid.

[0096] <Other Modified Embodiments>

[0097] In addition, the present invention is not limited to the above-described embodiments.

[0098] For example, by increasing the opening (for example, the width or the depth) of the end portion of the recessed portion 10 c communicating with the contact region 10S, a shape into which the machining fluid can flow easily may be formed.

[0099] In addition, if Figure 7 and Figure 8 As shown, a plurality of second recesses 10e may be formed on the surface of a holding region 10R for holding the product portion Wx of the substrate W in the holding member 10. The plurality of second recesses 10e reduce the contact area between the surface of the holding region 10R and the product portion Wx (cut product P). By forming a plurality of second recesses 10e, the contact area is, for example, 50% to 60% when the contact area when the second recesses 10e are not formed is set to 100%. In addition, Figure 7 In the figure, the recessed portion 10c of the contact region 10S of the above-described embodiment is omitted.

[0100] In addition, the plurality of second recesses 10e are formed so that the adsorption holes 10a are not connected to the outer space of the holding area 10R when the substrate W or the plurality of cut products P are held. Specifically, the plurality of second recesses 10e are in a grid shape, a stripe shape, or a dot shape when viewed from above. Figure 7 and Figure 8 An example of setting a plurality of second recesses 10e in a dot shape is shown. Here, the width and depth of each second recess 10e are preferably reduced to a size that does not capture foreign matter in the second recess 10e and is not affected by the cutting of the substrate W (production of the cut product P) and the wear caused by cleaning. Specifically, it is considered that the width and depth of each second recess 10e are, for example, several 10 μm to several 100 μm. The plurality of second recesses 10e can be formed by laser irradiation, by mechanical processing such as cutting, by chemical treatment using a liquid medicine, or by mold transfer molding.

[0101] Furthermore, if Figure 7 and Figure 8 As shown, the surface other than the plurality of second recesses 10e in the holding region 10R of the holding member 10 can be set as a roughened surface 10d. This roughened surface 10d improves the peeling relative to vacuum bonding. The roughened surface 10d has concavities and convexities smaller than the width and depth of the second recesses 10e, for example, in the form of stripes with a pitch of several 10 μm. As a method for forming the roughened surface 10d, it can be formed by irradiating a laser, can be formed by mechanical processing such as cutting, can be formed by sandblasting, and can be formed by mold transfer molding.

[0102] Furthermore, in the above-described embodiment, the holding member 10 has the pocket portion 10 b , but may also have a structure without the pocket portion 10 b .

[0103] like Fig. 9 As shown, a disk 11 for receiving the non-product portion Wy (processing chips such as end materials) generated by cutting the cutting object W is provided below the cutting workbench 4. Here, the disk 11 includes a workbench disk 11a that moves together with the cutting workbench 4, and a recovery disk 11b that allows the non-product portion Wy to flow to the recovery box 12 together with water. Moreover, a concave-convex shape for reducing the contact area with the non-product portion Wy is formed on the upper surface 11a1 of the workbench disk 11a and the upper surface 11b1 of the recovery disk 11b. Due to the concave-convex shape, the contact area between the upper surface 11a1 and the upper surface 11b1 of the disk 11 and the non-product portion Wy becomes smaller, and the static friction force becomes smaller. As a result, the non-product portion Wy easily flows with water. In addition, even with a small amount of water, the non-product portion Wy is easy to flow.

[0104] In addition, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

Claims

1. A holding member that absorbs and holds a cutting object on a cutting table, wherein A plurality of recessed portions are formed on a surface of a contact region that contacts a non-product portion produced by cutting the object to be cut. The plurality of recesses communicate with the outside of the contact region.

2. The holding member according to claim 1, wherein: The plurality of recesses are in a lattice shape, a stripe shape or a dot shape in a plan view.

3. A cutting workbench that absorbs and holds a cutting object, and A retaining member as claimed in claim 1 or 2.

4. A cutting device, comprising: Cutting table, which absorbs and holds the object to be cut; as well as A cutting mechanism cuts the object to be cut held on the cutting table, The cutting table has the holding member according to claim 1 or 2.

5. A method for manufacturing a semiconductor device, comprising: using the cutting device according to claim 4 to cut a substrate on which a plurality of semiconductor devices are formed, thereby manufacturing individual semiconductor devices, wherein: The substrate is held by the cutting table, and The substrate held on the cutting table is cut by the cutting mechanism.

Images