Inertial navigation equipment based on heat conduction design

Abstract

The invention discloses inertial navigation equipment based on heat conduction design, which comprises a base, an outer cover, an inertial measurement assembly, a support column, a power supply module, an IF conversion circuit board and a computer interface board, the inertial measurement assembly, the support column, the power supply module, the IF conversion circuit board and the computer interface board are installed in a space formed by the base and the outer cover, the power supply module is installed on the base, and the computer interface board is installed on the support column. The computer interface board is installed on the power module, the IF conversion circuit board is installed on the side face of the outer cover, the inertial measurement assembly is arranged in the middle of a space formed by the base and the outer cover, and gaps are formed between the inertial measurement assembly and the computer interface board and between the inertial measurement assembly and the IF conversion circuit board. According to the scheme, the influence of the temperature on the inertial measurement assembly is reduced by increasing heat dissipation conditions and reducing heat transfer, and meanwhile, the requirement for miniaturization of equipment can be better met without adopting a cavity separation type design. Therefore, according to the scheme, the influence of the temperature on the inertial measurement assembly can be reduced while miniaturization is met.

Description

Technical Field

[0001] The present invention relates to the technical field of navigation equipment, and in particular to an inertial navigation equipment based on heat conduction design. Background Art

[0002] An inertial navigation system (INS) is a navigation system that uses inertial measurement elements (such as gyroscopes and accelerometers) to measure the angular motion parameters and linear motion parameters of a carrier in an inertial reference system. It does not rely on external information and does not radiate energy to the outside, so it has good autonomy, concealment, and anti-interference. The main working principle of an inertial navigation device is to obtain velocity by integrating acceleration, and then obtain displacement by integrating velocity, thereby determining the position and attitude of the carrier.

[0003] During the use of inertial navigation equipment, temperature will have a great impact on the drift of inertial measurement elements, making it the main source of error for inertial navigation equipment. In order to reduce the impact of temperature on inertial measurement elements, inertial navigation equipment generally uses a split-chamber design, that is, the heat source and the inertial measurement element are placed in different cavities to achieve physical isolation. However, with the demand for miniaturization of inertial navigation equipment, the split-chamber design is increasingly unable to meet the demand for miniaturization. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is: how to provide an inertial navigation device based on thermal conductivity design which can reduce the influence of temperature on inertial measurement elements while meeting the requirements of device miniaturization.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions: An inertial navigation device based on thermal conductive design comprises a base, an outer cover, an inertial measurement unit, a pillar, a power module, an IF conversion circuit board and a computer interface board, wherein the inertial measurement unit, the pillar, the power module, the IF conversion circuit board and the computer interface board are installed in a space formed by the base and the outer cover, the power module is installed on the base, the computer interface board is installed on the power module, the IF conversion circuit board is installed on a side of the outer cover, the inertial measurement unit is arranged in the middle of the space formed by the base and the outer cover, and there is a gap between the inertial measurement unit and the computer interface board and the IF conversion circuit board.

[0006] Preferably, the IF conversion circuit board is provided with a heat dissipation cover outside, and the IF conversion circuit board is installed on the side of the outer cover through the heat dissipation cover.

[0007] Preferably, the inertial measurement assembly comprises a fiber optic gyroscope, an accelerometer and a mounting bracket, the fiber optic gyroscope and the accelerometer are arranged in the mounting bracket, and the mounting bracket is fixedly connected to the pillar.

[0008] Preferably, a rubber shock absorber is provided at a position where the mounting bracket is connected to the pillar, and the rubber shock absorber is located between the mounting bracket and the pillar.

[0009] Preferably, the outer surface of the outer cover is provided with a plurality of heat dissipation ribs.

[0010] Compared with the prior art, the present invention has the following advantages: 1. In order to reduce the impact of temperature on the inertial measurement unit, this solution adopts a more reasonable circuit board layout. In the inertial navigation device, except for the heat accident of the inertial measurement unit itself, the heat source of the device is mainly concentrated in the power module and the IF conversion circuit board. Therefore, when laying out, the power module is installed close to the base, and the IF conversion circuit board is installed close to the outer cover, so that the heat generated by the power module and the IF conversion circuit board can be dissipated outward through the base and the outer cover in time. At the same time, the computer interface board is installed on the power module, and there is a certain gap between the IF conversion circuit board and the power module and the inertial measurement unit, thereby avoiding the heat generated by the power module and the IF conversion circuit board from being directly transferred to the inertial measurement unit. In this way, the impact of temperature on the inertial measurement unit is reduced by increasing the heat dissipation conditions and reducing the heat transfer. At the same time, not adopting the split-chamber design can better meet the requirements of equipment miniaturization. Therefore, this solution can reduce the impact of temperature on the inertial measurement unit while meeting the miniaturization requirements.

[0011] 2. This solution provides a heat dissipation cover outside the IF conversion circuit board, and the heat dissipation capacity of the IF conversion circuit board can be further improved by using the heat dissipation cover.

[0012] 3. This solution places the fiber optic gyroscope and accelerometer in the mounting bracket, which can further reduce the heat transferred to the fiber optic gyroscope and accelerometer, thereby reducing the impact of temperature on the operation of the inertial measurement assembly.

[0013] 4. This solution sets a rubber shock absorber between the mounting bracket and the pillar. However, due to the low thermal conductivity and small contact area of ​​the rubber shock absorber, the thermal resistance of the hot runner is large. The heat on the outer cover and the base is difficult to transfer to the inertial measurement unit through heat conduction. The temperature rise rate of the inertial measurement unit can only be controlled through convection and radiation heat transfer.

[0014] 5. By providing heat dissipation ribs on the outer cover, the heat dissipation capacity of the outer cover can be increased, so that the heat generated by the power module and the IF conversion circuit board can be dissipated more quickly, further reducing the impact of temperature on the inertial measurement assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a structural diagram of the inertial navigation device based on thermal conductivity design of the present invention; Figure 2 This is an internal structure diagram of an inertial navigation device based on heat conduction design of the present invention; Figure 3 The figure is a schematic diagram of the arrangement of the power module and the computer interface board in the inertial navigation device based on the thermal conductive design of the present invention.

[0016] Description of reference numerals: base 1 , outer cover 2 , heat dissipation rib 3 , IF conversion circuit board 4 , support 5 , mounting bracket 6 , rubber shock absorber 7 , fiber optic gyroscope 8 , power module 9 , computer interface board 10 . DETAILED DESCRIPTION

[0017] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the scope of protection of the present invention.

[0018] It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In the description of the present invention, it should be noted that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the invention product is usually placed when used, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance. In addition, the terms "horizontal", "vertical", etc. do not mean that the components are absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted. In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0019] As attached Figure 1 To the attached Figure 3As shown, in this specific embodiment, an inertial navigation device based on thermal conductive design is provided, including a base 1, an outer cover 2, an inertial measurement unit, a pillar 5, a power module 9, an IF conversion circuit board 4 and a computer interface board 10. The inertial measurement unit, the pillar 5, the power module 9, the IF conversion circuit board 4 and the computer interface board 10 are installed in a space formed by the base 1 and the outer cover 2, the power module 9 is installed on the base 1, the computer interface board 10 is installed on the power module 9, the IF conversion circuit board 4 is installed on the side of the outer cover 2, the inertial measurement unit is arranged in the middle position of the space formed by the base 1 and the outer cover 2, and there is a gap between the inertial measurement unit and the computer interface board 10 and the IF conversion circuit board 4. In order to reduce the influence of temperature on the inertial measurement unit, this scheme adopts a more reasonable circuit board layout. In the inertial navigation device, except for the heating accident of the inertial measurement unit itself, the heat source of the device is mainly concentrated on the power module 9 and the IF conversion circuit board 4. Therefore, when laying out, the power module 9 is installed close to the base 1, and the IF conversion circuit board 4 is installed close to the outer cover 2, so that the heat generated by the power module 9 and the IF conversion circuit board 4 can be timely dissipated outward through the base 1 and the outer cover 2. At the same time, the computer interface board 10 is installed on the power module 9, and there is a certain gap between the IF conversion circuit board 4 and the power module 9 and the inertial measurement unit, thereby avoiding the heat generated by the power module 9 and the IF conversion circuit board 4 from being directly transferred to the inertial measurement unit, thereby jointly reducing the influence of temperature on the inertial measurement unit by increasing the heat dissipation conditions and reducing the heat transfer. At the same time, not adopting the split-chamber design can also better meet the requirements of equipment miniaturization. Therefore, this scheme can reduce the influence of temperature on the inertial measurement unit while meeting the miniaturization requirements.

[0020] In this embodiment, a heat dissipation cover is provided outside the IF conversion circuit board 4, and the IF conversion circuit board 4 is installed on the side of the outer cover 2 through the heat dissipation cover. In this solution, a heat dissipation cover is provided outside the IF conversion circuit board 4, and the heat dissipation capacity of the IF conversion circuit board 4 can be further improved by using the heat dissipation cover.

[0021] In this embodiment, the inertial measurement assembly includes a fiber optic gyroscope 8, an accelerometer and a mounting bracket 6, wherein the fiber optic gyroscope 8 and the accelerometer are arranged in the mounting bracket 6, and the mounting bracket 6 is fixedly connected to the support 5. In this solution, the fiber optic gyroscope 8 and the accelerometer are arranged in the mounting bracket 6, which can further reduce the heat transferred to the fiber optic gyroscope 8 and the accelerometer, thereby reducing the influence of temperature on the operation of the inertial measurement assembly.

[0022] In this embodiment, rubber shock absorbers are provided at the positions where the mounting bracket 6 and the pillar 5 are connected, and the rubber shock absorber 7 is located between the mounting bracket 6 and the pillar 5. In this solution, by providing a rubber shock absorber between the mounting bracket 6 and the pillar 5, the rubber shock absorber has a low thermal conductivity and a small contact area, resulting in a large thermal resistance of the hot runner. The heat on the outer cover 2 and the base 1 is difficult to be transferred to the inertial measurement unit by heat conduction, and the temperature rise rate of the inertial measurement unit can only be controlled by convection heat transfer and radiation heat transfer.

[0023] In this embodiment, a plurality of heat dissipation ribs 3 are provided on the outer surface of the outer cover 2. By providing the heat dissipation ribs 3 on the outer cover 2, the heat dissipation capacity of the outer cover 2 can be increased, so that the heat generated by the power module 9 and the IF conversion circuit board 4 can be dissipated more quickly, further reducing the influence of temperature on the inertial measurement assembly.

[0024] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit the technical solution. Those skilled in the art should understand that those modifications or equivalent substitutions of the technical solution of the present invention that do not depart from the purpose and scope of the technical solution should be included in the scope of the claims of the present invention.

Claims

1. An inertial navigation device based on thermal conductivity design, characterized in that: The invention comprises a base, an outer cover, an inertial measurement unit, a pillar, a power module, an IF conversion circuit board and a computer interface board, wherein the inertial measurement unit, the pillar, the power module, the IF conversion circuit board and the computer interface board are installed in a space formed by the base and the outer cover, the power module is installed on the base, the computer interface board is installed on the power module, the IF conversion circuit board is installed on a side of the outer cover, the inertial measurement unit is arranged in the middle position of the space formed by the base and the outer cover, and there is a gap between the inertial measurement unit and the computer interface board and the IF conversion circuit board.

2. The inertial navigation device based on thermal conduction design according to claim 1, characterized in that: The IF conversion circuit board is provided with a heat dissipation cover outside, and the IF conversion circuit board is installed on the side of the outer cover through the heat dissipation cover.

3. The inertial navigation device based on thermal conduction design according to claim 2, characterized in that: The inertial measurement assembly comprises a fiber optic gyroscope, an accelerometer and a mounting bracket. The fiber optic gyroscope and the accelerometer are arranged in the mounting bracket, and the mounting bracket is fixedly connected to the pillar.

4. The inertial navigation device based on thermal conduction design according to claim 3, characterized in that: A rubber shock absorber is provided at a position where the mounting bracket is connected to the pillar, and the rubber shock absorber is located between the mounting bracket and the pillar.

5. The inertial navigation device based on thermal conductive design according to claim 1, characterized in that: The outer surface of the outer cover is provided with a plurality of heat dissipation ribs.

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