Universal batch ultrasonic detection device for different packaged integrated circuits

Abstract

The invention discloses a general batch ultrasonic detection device for different packaged integrated circuits, and belongs to the field of reliability tests. The tray comprises a tray base, a clamping push rod, a fixing push rod and a fixing nut. Through the assembly of the clamping push rod and the tray base, QFN and other non-outer-pin packaging plastic package integrated circuits are fixed, and the freedom degrees of the integrated circuits in all directions in the tray device are limited. The bottom of the clamping push rod is provided with a groove structure, and the groove structure is used for clamping SOP, QFP and other plastic packaging devices with pins. Besides, the fixing push rod and the fixing nut provide certain pre-tightening force in the assembling process, it is guaranteed that the circuit floating phenomenon does not occur in the water entering process of the circuit, and the position of the circuit does not change in the moving process of the ultrasonic scanning probe. The ultrasonic detection method that a small-size and light-weight packaged circuit is pasted and fixed to a stainless steel sheet body can be replaced, and the situation that the surface of a base body is contaminated after ultrasonic scanning of an integrated circuit and the problem of lead deformation caused in the clamping process are effectively avoided.

Description

Technical Field

[0001] The invention relates to the technical field of reliability testing, and in particular to a universal device for batch ultrasonic testing of integrated circuits with different packages. Background Art

[0002] Ultrasonic waves are widely used in nondestructive testing of semiconductor plastic-encapsulated integrated circuits due to their excellent characteristics such as high frequency, short wavelength, good directionality and no radiation damage. Specifically, ultrasonic scanning microscopes use the acoustic continuity of ultrasonic waves to detect defects such as integrated circuit delamination, voids, and cracks. At present, when testing integrated circuits in the industry, testing agencies usually divide the discharge method of the circuit to be tested into two situations. One is that for integrated circuits with large package volume and heavy weight, they are directly put into water with matching anti-static trays or neatly placed on the glass plate of the equipment sink. However, the plastic-encapsulated integrated circuits in this method are prone to produce tiny bubbles in water and adhere to the surface of the circuit. It is necessary to remove the surface bubbles while preventing the circuit from drifting, which makes the detection process difficult to implement and inefficient; the second is that for integrated circuits with small package volume and light weight, the circuits need to be neatly placed on a stainless steel sheet with double-sided tape. The fixed integrated circuit will not drift when entering the water and it is convenient to blow away the bubbles. However, the method of pasting the circuit may cause glue stains on the surface of the circuit substrate and introduce lead deformation during the clamping process of the external lead package circuit, which greatly restricts the efficiency of the current ultrasonic testing process and subsequent finishing process. Summary of the invention

[0003] The object of the present invention is to provide a universal device for batch ultrasonic testing of integrated circuits with different packages, so as to solve the problems in the background technology.

[0004] To solve the above technical problems, the present invention provides a universal device for batch ultrasonic testing of integrated circuits with different packages, comprising: a tray base, a clamping push rod, a fixing push rod and a fixing nut;

[0005] The tray base is a placement plane for different packaged integrated circuits.

[0006] The clamping push rod is assembled with the tray base, and the clamping push rod is limited to move only in the axial direction of the tray base. The clamping push rod is used to move axially to clamp the packaged integrated circuit, and the displacement of the packaged integrated circuit in all directions is limited;

[0007] The fixed push rod and the fixed nut are used to limit the displacement of the clamping push rod and the packaged integrated circuit; the limiting groove of the fixed push rod is assembled with the assembly feature groove of the tray base;

[0008] The fixing nut is used to assemble with the limiting screw of the fixed push rod. The preload force generated by the assembly of the two is applied to the axial direction of the fixed push rod and clamps the assembly beam of the tray base, limiting the clamping push rod, the fixed push rod and the packaged integrated circuit from moving in the axial direction of the assembly beam, and applying clamping force to the clamping push rod and the house integrated circuit in the axial direction of the assembly beam, limiting the six degrees of freedom of the packaged integrated circuit.

[0009] In one embodiment, the tray base includes a bottom fixing groove, an assembly feature groove, an assembly feature beam, an assembly limit groove, and a fixed bottom plate; the external pins on one side of the plastic-encapsulated integrated circuit are clamped in the bottom fixing groove, the assembly feature groove and the assembly feature beam are used to assemble the clamping push rod and the fixed push rod, and the assembly limit groove is used to limit the displacement of the clamping push rod and the fixed push rod in their respective axial directions.

[0010] In one embodiment, the clamping push rod includes a limiting boss, a fixed side plate, a fixed groove and a concave assembly groove; the limiting boss is assembled in the assembly limiting groove, and the clamping push rod is placed parallel to the concave assembly groove and enters the assembly feature groove, thereby limiting the axial displacement of the clamping push rod only along the assembly feature beam; the fixed side plate is used to clamp the side substrate of the plastic-encapsulated integrated circuit, and the fixed side plates of the two clamping push rods cooperate with each other to squeeze the two sides of the plastic-encapsulated integrated circuit respectively, thereby ensuring that the plastic-encapsulated integrated circuit is not displaced due to the influence of buoyancy; the fixed groove is used to fix the pins of the plastic-encapsulated integrated circuit, and the fixed grooves of the two clamping push rods cooperate with each other to fix the pins on both sides of the plastic-encapsulated integrated circuit respectively, thereby limiting the degree of freedom of the plastic-encapsulated integrated circuit.

[0011] In one embodiment, the fixed push rod includes an assembly boss, a limiting side plate, a limiting groove, an assembly groove and a limiting screw; the assembly boss feature is assembled in the assembly limiting groove, and the fixed push rod is placed parallel to the assembly groove and enters the assembly feature groove, limiting the axial displacement of the clamping push rod only along the assembly feature beam; the limiting side plate is used to limit the side substrate of the last row of plastic-encapsulated integrated circuits, and the limiting groove is used to fix the pins on one side of the last row of plastic-encapsulated integrated circuits.

[0012] In one embodiment, the fixing nut includes an assembly thread and a limiting surface. The assembly thread has the same thread parameters as the limiting screw thread of the fixed push rod. The fixing nut is assembled on the limiting screw. The limiting surface contacts the assembly feature beam. The pre-tightening force is applied to the axial direction of the fixed push rod through the fixing nut to limit the displacement of the clamping push rod, the fixed push rod and the integrated circuit, thereby completing the construction of the universal device.

[0013] In one embodiment, when the universal ultrasonic detection device fixes an integrated circuit with an external pin package, the bottom of the tray base, the clamping push rod and the fixed push rod have groove features, and the pins of the integrated circuit with external pins are placed in the grooves. The fixing grooves of the tray base and the clamping push rod, the fixing grooves of the two clamping push rods, and the fixing grooves of the clamping push rods and the assembly grooves of the fixed push rods cooperate with each other to fix the pins on both sides of the integrated circuit, thereby limiting the displacement of the integrated circuit in a direction perpendicular to the clamping push rod.

[0014] In one embodiment, when the universal ultrasonic detection device fixes an integrated circuit packaged without external pins, the clamping push rod and the fixing push rod are used to apply a certain preload force on the substrate of the integrated circuit packaged without external pins, and the preload force acts in the axial direction of the characteristic beam assembled on the tray base, thereby limiting the six degrees of freedom of the integrated circuit and preventing the integrated circuit from being displaced by buoyancy in the coupling liquid.

[0015] The present invention provides a universal device for batch ultrasonic detection of integrated circuits with different packages. After assembly, the universal device can fix plastic-sealed integrated circuits without external pins such as QFN and plastic-sealed devices with external pins such as SOP and QFP. The fixed push rod and the fixed nut provide a certain pre-tightening force during the assembly process to ensure that the universal device does not undergo any displacement after assembly. The universal device replaces the traditional double-sided adhesive method of pasting the circuit on the surface of a stainless steel sheet, and can effectively avoid the problem of contamination of the surface of the integrated circuit substrate after the ultrasonic detection test and the problem of lead deformation during the circuit clamping process, which is conducive to ensuring the quality of the circuit, improving the efficiency of ultrasonic detection and reducing the probability of appearance problems in subsequent circuits. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The diagram is an exploded view of a universal device for batch ultrasonic testing of integrated circuits with different packages provided by the present invention.

[0017] Figure 2 This is a structural diagram of a tray base provided by the present invention.

[0018] Figure 3 It is a structural diagram of the clamping push rod provided by the present invention.

[0019] Figure 4 It is a structural diagram of the fixed push rod provided by the present invention.

[0020] Figure 5 It is a structural diagram of the fixing nut provided by the present invention.

[0021] Figure 6 The present invention provides a structural diagram of a plastic-sealed integrated circuit with external pins.

[0022] Figure 7 The present invention provides a structural diagram of a plastic-encapsulated integrated circuit without external pins.

[0023] Figure 8 The invention provides a general device for batch ultrasonic testing of integrated circuits with different packages, which clamps an assembly diagram of a plastic-sealed integrated circuit with external pins.

[0024] Fig. 9 The present invention provides a general device for batch ultrasonic testing of integrated circuits with different packages, which clamps an assembly diagram of a plastic-sealed integrated circuit without external pins. DETAILED DESCRIPTION

[0025] The following is a further detailed description of a general device for batch ultrasonic testing of integrated circuits with different packages proposed by the present invention in combination with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer according to the following description. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0026] The present invention provides a general device for batch ultrasonic testing of integrated circuits with different packages, the structure of which is shown in the exploded diagram as follows: Figure 1 As shown, it includes a tray base 1, a clamping push rod 2, a fixed push rod 3, and a fixed nut 4. These four parts constitute a universal ultrasonic detection device. The fixed properties of the clamping push rod 2, the fixed push rod 3, and the fixed nut 4 are used to fix the plastic-encapsulated integrated circuit 5 in the tray base 1, thereby limiting the drift of the plastic-encapsulated integrated circuit in the coupling liquid of the ultrasonic scanning microscope instrument.

[0027] The pallet base 1 includes a bottom fixing groove 11, an assembly feature groove 12, an assembly feature beam 13, an assembly limit groove 14, and a fixed bottom plate 15. The structure is as follows: Figure 2 The outer pins on one side of the plastic packaged integrated circuit 5 are clamped in the bottom fixing groove 11, the assembly feature groove 12 and the assembly feature beam 13 are used to assemble the clamping push rod 2 and the fixed push rod 3, and the assembly limit groove 14 is used to limit the displacement of the clamping push rod 2 and the fixed push rod 3 in their respective axial directions.

[0028] The clamping push rod 2 includes a limiting boss 21, a fixed side plate 22, a fixed groove 23 and a concave assembly groove 24. Its structure is as follows: Figure 3As shown. The limiting boss 21 is assembled in the assembly limiting groove 14, and the clamping push rod 2 is placed in parallel through the concave assembly groove 24 into the assembly feature groove 12, limiting the axial displacement of the clamping push rod 2 to only the assembly feature beam 13. The fixed side plate 22 is used to clamp the side substrate of the plastic-encapsulated integrated circuit 5. The fixed side plates of the two clamping push rods 2 cooperate with each other to squeeze the two sides of the plastic-encapsulated integrated circuit 5 respectively, ensuring that the plastic-encapsulated integrated circuit 5 is not displaced due to the influence of buoyancy. The fixed groove 23 is used to fix the pins of the plastic-encapsulated integrated circuit 5. The fixed grooves of the two clamping push rods 2 cooperate with each other to fix the pins on both sides of the plastic-encapsulated integrated circuit 5 respectively, limiting the degree of freedom of the plastic-encapsulated integrated circuit 5. Fixed side plates 22 and fixed grooves 23 with different characteristics can complete the universal clamping of a variety of packaged integrated circuits (such as packaged integrated circuits with external pins and packaged integrated circuits without external pins).

[0029] The fixed push rod 3 includes an assembly boss 31, a limiting side plate 32, a limiting groove 33, an assembly groove 34 and a limiting screw 35, and its structure is as follows: Figure 4 As shown. The assembly boss 31 is featured in the assembly limit groove 14, and the fixed push rod 3 is placed in parallel in the assembly feature groove 12 through the assembly groove 34, limiting the axial displacement of the clamping push rod 2 to only in the assembly feature beam 13. The limit side plate 32 is used to limit the side substrate of the last row of plastic-encapsulated integrated circuits 5, and the limit groove 33 is used to fix the pins on one side of the last row of plastic-encapsulated integrated circuits 5. The fixed push rod 3 is generally used for clamping and fixing integrated circuits with or without external pins. The limit screw 35 is assembled with the fixing nut 4 to complete the limit of the fixed push rod 3.

[0030] The fixing nut 4 includes an assembly thread 41 and a limiting surface 41, and its structure is as follows: Figure 5 As shown, the assembly thread 41 has the same thread parameters as the limiting screw 35 of the fixed push rod, the fixing nut 4 is assembled on the limiting screw 35, the limiting surface 41 is in contact with the assembly characteristic beam 13, and a certain pre-tightening force is applied to the axial direction of the fixed push rod 3 through the fixing nut 4 to limit the displacement of the clamping push rod 2, the fixed push rod 3 and the integrated circuit 5, thereby completing the construction of the universal device.

[0031] The invention discloses a general device for batch ultrasonic testing of integrated circuits of different packages. Figure 8 and Fig. 9 As shown, Figure 6 The external pin package integrated circuit 51 shown and Figure 7The tapeless pin packaged integrated circuit 61 shown is constrained by a clamping push rod 2 and a fixed push rod 3, the plastic-encapsulated integrated circuit pin 51 is fixed by a bottom fixing groove, a fixing groove 23 and a limiting groove 33, and the plastic-encapsulated integrated circuit substrate 61 is limited by a fixed side plate 22 and a limiting side plate 32, thereby completing the clamping and fixing of the integrated circuit by a general device. This method improves the problems of colloid contamination and lead deformation introduced by the traditional use of double-sided tape to stick the circuit.

[0032] The above description is only a description of the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention. Any changes or modifications made by a person skilled in the art in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A general device for batch ultrasonic testing of integrated circuits of different packages, characterized in that: include: Tray base, clamping push rod, fixing push rod and fixing nut; The tray base is a placement plane for different packaged integrated circuits. The clamping push rod is assembled with the tray base, and the clamping push rod is limited to move only in the axial direction of the tray base. The clamping push rod is used to move axially to clamp the packaged integrated circuit, and the displacement of the packaged integrated circuit in all directions is limited; The fixed push rod and the fixed nut are used to limit the displacement of the clamping push rod and the packaged integrated circuit; the limiting groove of the fixed push rod is assembled with the assembly feature groove of the tray base; The fixing nut is used to assemble with the limiting screw of the fixed push rod. The preload force generated by the assembly of the two is applied to the axial direction of the fixed push rod and clamps the assembly beam of the tray base, limiting the clamping push rod, the fixed push rod and the packaged integrated circuit from moving in the axial direction of the assembly beam, and applying clamping force to the clamping push rod and the house integrated circuit in the axial direction of the assembly beam, limiting the six degrees of freedom of the packaged integrated circuit.

2. The universal device for batch ultrasonic testing of integrated circuits of different packages as claimed in claim 1, characterized in that: The tray base includes a bottom fixing groove, an assembly feature groove, an assembly feature beam, an assembly limit groove, and a fixed bottom plate; the external pins on one side of the plastic-encapsulated integrated circuit are clamped in the bottom fixing groove, the assembly feature groove and the assembly feature beam are used to assemble the clamping push rod and the fixed push rod, and the assembly limit groove is used to limit the displacement of the clamping push rod and the fixed push rod in their respective axial directions.

3. The universal device for batch ultrasonic testing of integrated circuits with different packages as claimed in claim 2, characterized in that: The clamping push rod includes a limiting boss, a fixed side plate, a fixed groove and a concave assembly groove; the limiting boss is assembled in the assembly limiting groove, and the clamping push rod is placed in parallel through the concave assembly groove and enters the assembly feature groove, limiting the axial displacement of the clamping push rod only along the assembly feature beam; the fixed side plate is used to clamp the side substrate of the plastic-encapsulated integrated circuit, and the fixed side plates of the two clamping push rods cooperate with each other to squeeze the two sides of the plastic-encapsulated integrated circuit respectively, ensuring that the plastic-encapsulated integrated circuit is not displaced due to the influence of buoyancy; the fixed groove is used to fix the pins of the plastic-encapsulated integrated circuit, and the fixed grooves of the two clamping push rods cooperate with each other to fix the pins on both sides of the plastic-encapsulated integrated circuit respectively, limiting the degree of freedom of the plastic-encapsulated integrated circuit.

4. The universal device for batch ultrasonic testing of integrated circuits with different packages as claimed in claim 3, characterized in that: The fixed push rod includes an assembly boss, a limiting side plate, a limiting groove, an assembly groove and a limiting screw; the assembly boss feature is assembled in the assembly limiting groove, and the fixed push rod is placed parallel to the assembly groove and enters the assembly feature groove, limiting the axial displacement of the clamping push rod only along the assembly feature beam; the limiting side plate is used to limit the side substrate of the last row of plastic-encapsulated integrated circuits, and the limiting groove is used to fix the pins on one side of the last row of plastic-encapsulated integrated circuits.

5. The universal device for batch ultrasonic testing of integrated circuits with different packages as claimed in claim 4, characterized in that: The fixing nut includes an assembly thread and a limiting surface. The assembly thread has the same thread parameters as the limiting screw thread of the fixed push rod. The fixing nut is assembled on the limiting screw. The limiting surface contacts the assembly feature beam. The fixing nut applies a pre-tightening force in the axial direction of the fixed push rod to limit the displacement of the clamping push rod, the fixed push rod and the integrated circuit, thereby completing the construction of the universal device.

6. The universal device for batch ultrasonic testing of integrated circuits with different packages as claimed in claim 5, characterized in that: When the universal ultrasonic detection device fixes an integrated circuit with an external pin package, the bottom of the tray base, the clamping push rod and the fixed push rod have groove features, and the pins of the integrated circuit with external pins are placed in the grooves. The fixing grooves of the tray base and the clamping push rod, the fixing grooves of the two clamping push rods, and the fixing grooves of the clamping push rods and the assembly grooves of the fixed push rods cooperate with each other to fix the pins on both sides of the integrated circuit, thereby limiting the displacement of the integrated circuit in a direction perpendicular to the clamping push rod.

7. The universal device for batch ultrasonic testing of integrated circuits with different packages as claimed in claim 5, characterized in that: When the ultrasonic detection universal device fixes the integrated circuit packaged without external pins, the clamping push rod and the fixing push rod are used to apply a certain pre-tightening force on the substrate of the integrated circuit packaged without external pins. The pre-tightening force acts in the axial direction of the characteristic beam assembled on the tray base, restricting the six degrees of freedom of the integrated circuit and preventing the integrated circuit from being displaced by buoyancy in the coupling liquid.

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