Integrated automatic plastic package eutectic machine

Abstract

The invention relates to an integrated automatic plastic packaging eutectic machine, and relates to the technical field of semiconductor packaging equipment. The eutectic table is used for heating and bonding the chip and the substrate, and the eutectic table is arranged on the mounting platform; the chip feeding device is used for conveying chips to the eutectic table, and the chip feeding device is arranged on the mounting platform; the substrate feeding device is used for conveying a substrate to the eutectic table, and the substrate feeding device is arranged on the mounting platform; the finished product discharging device comprises a suction manipulator and a manipulator driving mechanism, the manipulator driving mechanism is arranged on the mounting platform, the suction manipulator is arranged on the manipulator driving mechanism, and the suction manipulator is used for sucking finished products on the eutectic table; the manipulator driving mechanism is used for driving the suction manipulator to move close to or away from the eutectic table. The packaging speed of the eutectic machine can be increased, and the overall packaging efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor packaging equipment, and in particular to an integrated automatic plastic packaging eutectic machine. Background Art

[0002] Eutectic refers to the phenomenon of eutectic fusion between eutectic solders. It is a process that forms a highly thermally and electrically conductive bond, which is usually required for densely packed circuits in today's chips. Eutectic technology is widely used in the electronic packaging industry, such as bonding chips to substrates, bonding substrates to tube shells, tube shell capping, etc. Compared with common epoxy conductive adhesive bonding, eutectic welding has the advantages of high thermal conductivity, low resistance, fast heat transfer, strong reliability, and high shear force after bonding. It is suitable for the interconnection of chips and substrates, and substrates and tube shells in high-frequency and high-power devices.

[0003] The eutectic machine is a key equipment in the optoelectronic communication device packaging production line. Its working process is: the placement head mechanism sucks the substrate from the material table and places it on the eutectic mechanism. The eutectic mechanism preheats the substrate to the mounting operation temperature. The placement head mechanism sucks the chip from the corresponding material table and mounts it on the corresponding mounting position of the substrate. When the chip and substrate are mounted, the eutectic mechanism heats the substrate to the eutectic temperature, and then quickly cools it down for solidification to complete the eutectic.

[0004] At present, the existing eutectic machines mainly include a eutectic table, a chip loading mechanism and a substrate loading mechanism. The substrate loading mechanism is used to transport the substrate to the eutectic table, and the chip loading mechanism is used to transport the chip to the eutectic table. The eutectic table is heated, so that the substrate and the chip are bonded to obtain a finished product.

[0005] In order to realize automated production, existing eutectic machines often use substrate loading and finished product unloading mechanisms. This means that after the substrate and chip are eutectic, the finished product needs to be transported out through the substrate loading mechanism, which means that the substrate loading needs to wait until the finished product is placed, which will affect the packaging speed of the eutectic machine and reduce the overall packaging efficiency. Summary of the invention

[0006] The present application provides an integrated automated plastic packaging eutectic machine, the purpose of which is to speed up the packaging speed of the eutectic machine and improve the overall packaging efficiency.

[0007] The integrated automatic plastic sealing eutectic machine provided in this application adopts the following technical solution: An integrated automatic plastic sealing eutectic machine comprises a mounting platform; a eutectic table for heating and bonding a chip and a substrate, the eutectic table being arranged on the mounting platform; a chip loading device for conveying chips toward the eutectic table, the chip loading device being arranged on the mounting platform; a substrate loading device for conveying substrates toward the eutectic table, the substrate loading device being arranged on the mounting platform; a finished product unloading device, the finished product unloading device comprising a suction manipulator and a manipulator driving mechanism, the manipulator driving mechanism being arranged on the mounting platform, the suction manipulator being arranged on the manipulator driving mechanism, the suction manipulator being used to suck the finished product on the eutectic table, and the manipulator driving mechanism being used to drive the suction manipulator to move close to or away from the eutectic table.

[0008] By adopting the above technical solution, a eutectic table, a chip loading device and a substrate loading device are arranged on the installation platform. Through the cooperation of the eutectic table, the chip loading device and the substrate loading device, the substrate and the chip can be transported to the eutectic table, and the eutectic table is heated so that the substrate and the chip are heated and bonded, so that the finished product can be obtained.

[0009] On this basis, a finished product unloading device is added to the mounting platform. The finished product unloading device can suck the finished product on the eutectic table through a suction robot, and the setting of the robot driving mechanism can drive the suction robot to move close to or away from the eutectic table. Through the coordinated setting of the suction robot and the robot driving mechanism, the unloading of the finished product can be achieved.

[0010] By setting up the substrate loading device, chip loading device and finished product unloading device, the substrate loading, chip loading and finished product unloading steps are independent of each other, so that each step can be carried out independently without interference between each step. This can speed up the packaging speed of the eutectic machine and improve the overall packaging efficiency.

[0011] Optionally, the finished product unloading device also includes a material tray and a material tray driving mechanism, the material tray driving mechanism is arranged on the mounting platform, the material tray is arranged on the material tray driving mechanism, the material tray and the eutectic table are spaced apart, the material tray driving mechanism is used to drive the material tray to move toward or away from the suction robot, and the robot driving mechanism is used to drive the suction robot to move between the eutectic table and the material tray.

[0012] By adopting the above technical solution, firstly, the material tray can store the prepared finished products. Secondly, through the coordinated setting of the material tray driving mechanism and the manipulator driving mechanism, the material tray and the suction manipulator can be driven to move synchronously, thereby facilitating the material tray and the suction manipulator to quickly locate each other, which can speed up the unloading and loading of finished products into the material tray.

[0013] Optionally, a heating module is provided on the eutectic table, and the heating module includes a heating table, the heating table is provided on the eutectic table, and a plurality of heating rods are embedded in the heating table.

[0014] By adopting the above technical solution, the heating table and the heating rod are arranged in coordination, so as to realize the heating function of the eutectic table. At the same time, the arrangement of the heating rod can improve the accuracy of the temperature control of the heating table.

[0015] Optionally, a heating chamber is provided in the heating platform, a vacuum component is provided on one side of the heating platform, and the vacuum component is connected to the heating chamber; a vacuum adsorption hole is provided on the heating platform, and the vacuum adsorption hole is connected to the heating chamber.

[0016] By adopting the above technical solution, the vacuum adsorption holes on the heating platform, the heating chamber and the exhaust member are arranged in coordination, so that the exhaust member can extract the gas in the heating chamber. Then, when the substrate is placed on the heating platform, the vacuum adsorption holes can absorb the substrate, which can achieve the fixation of the substrate.

[0017] Optionally, a plurality of the vacuum adsorption holes are provided, and the plurality of the vacuum adsorption holes are all connected to the vacuum suction member; the plurality of the vacuum adsorption holes are arranged at intervals, and the inner diameters of the plurality of the vacuum adsorption holes are different.

[0018] By adopting the above technical solution and providing a plurality of vacuum adsorption holes of different sizes, the heating table of the present application can adsorb substrates of different sizes, thereby realizing the production of finished products of different sizes.

[0019] Optionally, a first nitrogen gas supply component is further provided on the eutectic table, and a heating gas pipe for heating nitrogen is provided between the first nitrogen gas supply component and the heating table, one end of the heating gas pipe is connected to the first nitrogen gas supply component, and the other end is connected to the heating table, and the heating gas pipe is connected to the heating chamber.

[0020] By adopting the above technical solution, the cooperation between the heating gas pipe and the first nitrogen gas supply member can inject heated hot nitrogen into the heating chamber. On the one hand, it can assist the heating rod to heat the heating table; on the other hand, the hot nitrogen fills the heating chamber, which can provide uniform heating of the heating table.

[0021] Optionally, a eutectic groove is provided on the upper side of the eutectic table, and a transparent plate is arranged on the eutectic table, and the transparent plate closes the eutectic groove; the heating table is arranged in the eutectic groove, and a eutectic long hole for accommodating the chip and the substrate is provided on the transparent plate.

[0022] By adopting the above technical solution, the heating stage is arranged in the eutectic tank, which can reduce the height of the eutectic stage. The eutectic tank is covered with a transparent plate, which makes it easy to observe the internal situation of the eutectic tank. The transparent plate is provided with a eutectic long hole, which provides space for the substrate and the chip to be loaded.

[0023] Optionally, the transparent plate and the heating table are spaced apart, and a eutectic chamber is formed between the transparent plate and the heating table; a second nitrogen gas supply component is provided on one side of the eutectic table, and an air duct is provided between the second nitrogen gas supply component and the eutectic table, one end of the air duct is connected to the second nitrogen gas supply component, and the other end is connected to the eutectic table, and the air duct is connected to the eutectic chamber.

[0024] By adopting the above technical solution, since a eutectic chamber is formed between the transparent plate and the heating table, and the second nitrogen gas supply component is connected to the eutectic chamber through the air duct, cold nitrogen can be introduced into the eutectic chamber, thereby forming a nitrogen atmosphere in the eutectic chamber, which can form an effective atmosphere protection in the heating area on the eutectic table and avoid oxidation defects in the finished product during the eutectic process.

[0025] Optionally, a wind knife is provided on one side of the eutectic table, a plurality of wind holes are opened on the side of the wind knife facing the eutectic table, the wind holes are arranged toward the transparent plate, the wind knife is connected to the second nitrogen gas supply component, and the plurality of wind holes are connected to the second nitrogen gas supply component.

[0026] By adopting the above technical solution, the air holes on the wind knife are opened, so that the second nitrogen supply component can blow cold nitrogen onto the transparent plate, which can prevent the transparent plate from generating fog due to the temperature difference between the inside and outside, thereby ensuring the transparency of the transparent plate.

[0027] Optionally, a eutectic visual element is disposed on the eutectic table, and the eutectic visual element is disposed on the upper side of the eutectic table in the vertical direction, and the eutectic visual element and the eutectic table are disposed opposite to each other in the vertical direction.

[0028] By adopting the above technical solution and setting up the eutectic visual element, it is possible to monitor the bonding of the chip and the substrate on the tool table to ensure that the finished product meets the requirements.

[0029] In summary, the present application includes at least one of the following beneficial technical effects: 1. This application makes the steps of substrate loading, chip loading and finished product unloading independent of each other through the arrangement of substrate loading device, chip loading device and finished product unloading device, so that each step can be carried out independently without interference between each step. This can speed up the packaging speed of the eutectic machine and improve the overall packaging efficiency.

[0030] 2. The present application opens a number of vacuum adsorption holes, so that the eutectic table of the present application can adsorb substrates of different sizes, and thus can adapt to the production of finished products of different sizes, thereby improving the scope of application of the present application.

[0031] 3. The present application can form a nitrogen atmosphere in the eutectic chamber through the coordinated arrangement of the air duct and the second nitrogen gas supply component, which can form an effective atmosphere protection in the heating area of ​​the eutectic table and avoid oxidation defects in the finished product during the eutectic process. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the overall structure of the eutectic machine of this application.

[0033] Figure 2 It is a schematic diagram of the overall structure of the chip loading device of the present application.

[0034] Figure 3 It is a schematic diagram of the overall structure of the eutectic table of this application.

[0035] Figure 4 It is a schematic diagram of the cross-sectional structure of the eutectic table of the present application.

[0036] Figure 5 It is a schematic diagram of the exploded structure of the eutectic platform of this application.

[0037] Figure 6 It is a schematic diagram of the overall structure of the finished product unloading device of this application.

[0038] In the figure, 1. mounting platform; 2. chip loading device; 21. feeding mechanism; 211. feeding visual element; 212. feeding ejector element; 213. wafer mounting frame; 214. wafer driving member; 22. first transport mechanism; 221. suction nozzle; 222. swing arm; 223. swing driving member; 23. calibration mechanism; 231. calibration platform; 232. calibration visual element; 233. adsorption platform; 234. rotation driving member; 235. calibration driving member; 24. second transport mechanism; 241. adsorption manipulator; 242. first axis driving member; 243. second axis driving member; 3. substrate loading device; 4. eutectic platform; 41. Heating module; 411. Heating table; 412. Heating rod; 413. Heating chamber; 414. Vacuum adsorption hole; 415. Heating air pipe; 42. Vacuum element; 43. First nitrogen gas supply element; 44. Eutectic groove; 45. Transparent plate; 451. Eutectic long hole; 452. Eutectic chamber; 46. Second nitrogen gas supply element; 47. Air duct; 48. Air knife; 481. Air supply pipe; 482. Air hole; 49. Eutectic visual element; 5. Finished product unloading device; 51. Suction robot; 52. Robot drive mechanism; 521. Y-axis drive element; 522. Z-axis drive element; 53. Material tray; 54. Material tray drive mechanism. DETAILED DESCRIPTION

[0039] The following is combined with Figure 1 -Attached Figure 6 , further details of this application are given.

[0040] An integrated automatic plastic sealing eutectic machine, referring to Figure 1 , including a mounting platform 1, which is horizontally arranged. A chip loading device 2, a substrate loading device 3, a eutectic stage 4 and a finished product unloading device 5 are arranged on the mounting platform 1, the chip loading device 2 and the substrate loading device 3 are arranged at intervals in the horizontal direction, and the eutectic stage 4 is located between the chip loading device 2 and the substrate loading device 3 in the horizontal direction, and the finished product unloading device 5 is located on one side of the eutectic stage 4.

[0041] The substrate loading device 3 can provide a substrate to the eutectic table 4, and the chip loading device 2 can provide a chip to the eutectic table 4. After the substrate and the chip are transported to the eutectic table 4, the eutectic table 4 is heated. At this time, the substrate and the chip are heated and bonded to obtain a finished product, and the finished product unloading device 5 unloads the finished product.

[0042] Reference Figure 1 and Figure 2 In this embodiment, the chip loading device 2 has the same structure as the substrate loading device 3, and this embodiment is described by taking the chip loading device 2 as an example.

[0043] Reference Figure 1 and Figure 2 The chip loading device 2 includes a feeding mechanism 21, which is spaced apart from the eutectic table 4. A first transfer mechanism 22, a calibration mechanism 23 and a second transfer mechanism 24 are sequentially arranged on the side of the feeding mechanism 21 facing the eutectic table 4. The first transfer mechanism 22, the calibration mechanism 23 and the second transfer mechanism 24 are located between the feeding mechanism 21 and the eutectic table 4.

[0044] The feeding mechanism 21 provides chips, and the first transfer mechanism 22 transfers the chips provided by the feeding mechanism 21 to the calibration mechanism 23. The calibration mechanism 23 calibrates the angle and position of the chips. After the calibration is completed, the second transfer mechanism 24 transfers the calibrated chips to the eutectic table 4. The feeding mechanism 21, the first transfer mechanism 22, the calibration mechanism 23 and the second transfer mechanism 24 cooperate to realize chip loading.

[0045] Reference Figure 1 and Figure 2The feeding mechanism 21 includes a feeding visual element 211, a feeding ejector element 212, a wafer mounting frame 213 and a wafer driver 214. The wafer mounting frame 213 is located on the upper side of the mounting platform 1. The feeding visual element 211 is located on the upper side of the wafer mounting frame 213 in the vertical direction. The feeding ejector element 212 is located on the lower side of the wafer mounting frame 213 in the vertical direction. The feeding visual element 211 and the feeding ejector element 212 are arranged opposite to each other in the vertical direction. The wafer driver 214 is installed on the mounting platform 1, and the wafer driver 214 is connected to the wafer mounting frame 213. The wafer driver 214 adopts a two-axis moving platform.

[0046] The wafer includes a circular wafer ring, a film stretched on the wafer ring, and a number of chips attached to the film. The wafer mounting frame 213 realizes the installation of the wafer, and the cooperation of the feeding visual element 211 and the wafer driving element 214 enables the chip on the wafer to be aligned with the feeding ejector element 212, and then the feeding ejector element 212 pushes the chip upward and makes the chip detach from the film, so that the chip can be obtained on the wafer.

[0047] Reference Figure 1 and Figure 2 The first transfer mechanism 22 includes a suction nozzle 221, a swing arm 222 and a swing driving member 223. One end of the swing arm 222 in the length direction is connected to the suction nozzle 221, and the other end is connected to the swing driving member 223. The swing driving member 223 is arranged on the mounting platform 1. The swing driving member 223 adopts a motor. The swing driving member 223 drives the swing arm 222 to swing back and forth, which enables the swing arm 222 to reciprocate between the feeding mechanism 21 and the calibration mechanism 23. Through the cooperation between the swing arm 222 and the feeding ejector element 212, the suction nozzle 221 can absorb the chip lifted by the feeding ejector element 212, and then through the drive of the swing driving member 223, the chip can be transported to the calibration mechanism 23.

[0048] Reference Figure 1 and Figure 2 The calibration mechanism 23 includes a calibration platform 231 and a calibration visual element 232. An adsorption platform 233 is disposed on the upper side of the calibration platform 231. A rotation driving member 234 is also disposed on the calibration platform 231. The rotation driving member 234 adopts a motor, and the driving shaft of the rotation driving member 234 is coaxially disposed with the adsorption platform 233. The calibration visual element 232 is disposed on the upper side of the adsorption platform 233 in the vertical direction, and the calibration visual element 232 and the adsorption platform 233 are disposed directly opposite to each other.

[0049] Reference Figure 1 and Figure 2 The calibration mechanism 23 further includes a calibration driver 235 , which is disposed on the mounting platform 1 , and the calibration platform 231 is disposed on the calibration driver 235 , which adopts a two-axis moving platform.

[0050] After the first transfer mechanism 22 conveys the chip to the calibration table 231, the chip is placed on the adsorption table 233. The adsorption table 233 fixes the chip in the direction of negative pressure adsorption, detects the position of the chip through the calibration visual element 232, drives the adsorption table 233 to rotate through the rotating drive 234, and drives the adsorption table 233 to move in the plane through the calibration drive 235, so that the angle of the chip can be adjusted to the required state.

[0051] Reference Figure 1 and Figure 2 The second transfer mechanism 24 includes an adsorption manipulator 241, a first shaft driver 242 and a second shaft driver 243. The first shaft driver 242 is arranged in the vertical direction, the adsorption manipulator 241 is arranged on the first shaft driver 242, the second shaft driver 243 is arranged in the horizontal direction, and the first shaft driver 242 is connected to the second shaft driver 243, and the second shaft driver 243 is arranged on the mounting platform 1. The first shaft driver 242 and the second shaft driver 243 both adopt linear modules. With the cooperation of the first shaft driver 242 and the second shaft driver 243, the chip on the adsorption platform 233 can be sucked and transferred to the eutectic platform 4, which can realize the second transfer of the chip.

[0052] Reference Figure 3 and Figure 4 A eutectic groove 44 is provided on the upper side of the eutectic table 4. A heating module 41 is also provided on the eutectic table 4. The heating module 41 includes a heating table 411. The heating table 411 is provided in the eutectic groove 44 and connected to the bottom of the eutectic groove 44. The heating module 41 also includes a plurality of heating rods 412. One end of the plurality of heating rods 412 is embedded in the heating table 411 and the other end extends outside the eutectic table 4. By controlling the heating rods 412, the heating effect of the heating table 411 can be controlled, and then the temperature of the eutectic table 4 can be controlled to provide a suitable temperature for the eutectic.

[0053] Reference Figure 3 and Figure 4 , the heating module 41 also includes a heating air pipe 415, and a first nitrogen gas supply part 43 is arranged on the outside of the eutectic table 4. One end of the heating air pipe 415 is connected to the first nitrogen gas supply part 43, and the other end is connected to the heating table 411. A heating chamber 413 is provided in the heating table 411, one end of the heating rod 412 is inserted in the heating chamber 413, and the heating air pipe 415 is connected to the heating chamber 413. In this embodiment, a plurality of heating wires are arranged on the inner wall of the heating air pipe 415. Nitrogen can be introduced into the heating air pipe 415 through the first nitrogen gas supply part 43, and the nitrogen is heated by the heating air pipe 415 and then sent into the heating chamber 413, which enables the nitrogen to fill the vacancies in the heating chamber 413, and at the same time makes the heating of the eutectic table 4 more uniform.

[0054] Reference Figure 4 and Figure 5 A plurality of vacuum adsorption holes 414 are formed through the upper side of the heating platform 411 , and the plurality of vacuum adsorption holes 414 are all connected to the heating chamber 413 .

[0055] Reference Figure 3 and Figure 4 A vacuum element 42 is also provided on one side of the eutectic stage 4. The vacuum element 42 is connected to the heating stage 411 through a pipeline, and the vacuum element 42 is connected to the heating chamber 413 through a corresponding pipeline. The nitrogen in the heating chamber 413 can be extracted through the vacuum element 42, which can form a negative pressure at the vacuum adsorption hole 414 on the heating stage 411. When the substrate is placed on the heating stage 411, the corresponding vacuum adsorption hole 414 can absorb the substrate to fix the substrate.

[0056] Reference Figure 4 and Figure 5 The plurality of vacuum adsorption holes 414 are arranged in a horizontal direction in sequence and the inner diameters of the plurality of vacuum adsorption holes 414 decrease or increase in sequence. Due to the different sizes of finished products, the corresponding vacuum adsorption holes 414 can be selected according to the actual finished products, ensuring that the vacuum adsorption holes 414 can fix the corresponding finished products.

[0057] Reference Figure 3 and Figure 4 A transparent plate 45 is disposed on the upper side of the eutectic stage 4. The transparent plate 45 encloses the heating stage 411, and the transparent plate 45 is spaced apart from the heating stage 411, so that a eutectic chamber 452 is formed between the transparent plate 45 and the heating stage 411. A eutectic long hole 451 is provided on the transparent plate 45, and a plurality of vacuum adsorption holes 414 are all located in the eutectic long hole 451. The opening of the eutectic long hole 451 ensures that the chip and the substrate can be placed on the heating stage 411, and thus the substrate can be adsorbed by the corresponding vacuum adsorption hole 414.

[0058] Reference Figure 4 and Figure 5 A second nitrogen supply member 46 is provided on one side of the eutectic stage 4, and a plurality of air ducts 47 are provided between the second nitrogen supply member 46 and the eutectic stage 4. One end of the air duct 47 is connected to the second nitrogen supply member 46, and the other end is connected to the eutectic stage 4, and the air duct 47 is in communication with the eutectic chamber 452. Through the cooperation of the nitrogen supply member and the air duct 47, cold nitrogen can be injected into the eutectic chamber 452. On the one hand, a nitrogen atmosphere can be formed in the eutectic chamber 452, so that the heating area on the eutectic stage 4 has effective atmosphere protection, avoiding oxidation defects in the finished product during the eutectic process; on the other hand, the injection of cold nitrogen facilitates the rapid cooling of the finished product and the eutectic stage 4.

[0059] Reference Figure 3 and Figure 5 A wind knife 48 is also provided between the eutectic table 4 and the second nitrogen supply member 46. A plurality of wind holes 482 are provided on the side of the wind knife 48 facing the eutectic table 4. The plurality of wind holes 482 are arranged in sequence in the horizontal direction. A plurality of air supply pipes 481 are provided between the wind knife 48 and the second nitrogen supply member 46. The air supply pipes 481 and the wind holes 482 are arranged one by one. One end of the air supply pipe 481 is connected to the second nitrogen supply member 46, and the other end is connected to the wind knife 48. The air supply pipe 481 is connected to the corresponding wind hole 482. The plurality of wind holes 482 are arranged along their own axis facing the transparent plate 45. Through the cooperation of the wind knife 48 and the second nitrogen supply member 46, the cold nitrogen can be blown to the surface of the transparent plate 45, thereby preventing the generation of fog on the transparent plate 45.

[0060] Reference Figure 1 and Figure 3 A eutectic visual element 49 is also provided on the upper side of the eutectic stage 4. The eutectic visual element 49 is located on the upper side of the eutectic stage 4 in the vertical direction, and the eutectic visual element 49 is arranged directly opposite the eutectic stage 4. By setting the eutectic visual element 49, the finished eutectic product can be visually inspected.

[0061] Reference Figure 1 and Figure 6 The finished product unloading device 5 includes a suction robot 51 and a robot driving mechanism 52. The robot driving mechanism 52 includes a Y-axis driving member 521 and a Z-axis driving member 522. The driving direction of the Y-axis driving member 521 is perpendicular to the spacing direction of the chip loading device 2 and the substrate loading device 3. The driving direction of the Y-axis driving member 521 is set in the horizontal direction. The Y-axis driving member 521 is connected to the mounting platform 1. The driving direction of the Z-axis driving member 522 is set in the vertical direction. The driving direction of the Z-axis driving member 522 is set in the vertical direction, and the Z-axis driving member 522 is connected to the Y-axis driving member 521. The suction robot 51 is set on the Z-axis driving member 522. With the cooperation of the Y-axis driving member 521 and the Z-axis driving member 522, the suction robot 51 can move to the upper side of the eutectic table 4, and then suck the finished product after eutecticization, and transport the finished product away.

[0062] Reference Figure 1 and Figure 6 The finished product unloading device 5 further includes a material tray 53 and a material tray driving mechanism 54. The material tray driving mechanism 54 adopts an X-axis driving member, the driving direction of the X-axis driving member is set in the horizontal direction, the driving direction of the X-axis driving member is set perpendicular to the driving direction of the Y-axis driving member 521, and the X-axis driving member is located at the lower side of the Y-axis driving member 521. The material tray 53 is set on the X-axis driving member.

[0063] After the suction robot 51 sucks the finished product, the material tray driving mechanism 54 drives the material tray 53 to move, and the manipulator driving mechanism 52 drives the suction robot 51 to move. At this time, the material tray 53 and the suction robot 51 are positioned with each other, and then rapid positioning can be achieved, which facilitates the rapid loading of the finished product into the material tray 53.

[0064] In this embodiment, the X-axis driving member, the Y-axis driving member 521 and the Z-axis driving member 522 are all linear modules.

[0065] The implementation principle of the embodiment of the present application is: the substrate is transported to the eutectic table 4 by the substrate loading device 3, and the chip loading device 2 is transported to the eutectic table 4. During the transportation process of the substrate and the chip, the chip and the substrate will be calibrated by the corresponding calibration mechanism 23. After the chip and the substrate are transported to the eutectic table 4, the eutectic table 4 is heated to achieve heat bonding between the chip and the substrate, and then the finished product is obtained. After that, the finished product unloading device 5 removes the finished product from the eutectic table 4 and places it on the tray 53. Such a eutectic machine structure setting optimizes the connection and cooperation between the various processing steps, and realizes continuous, stable and high-precision packaging operations.

[0066] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An integrated automatic plastic packaging eutectic machine, characterized in that: include: Mounting platform (1); A eutectic table (4) for heating and bonding the chip and the substrate, the eutectic table (4) being arranged on the mounting platform (1); A chip loading device (2) for conveying chips toward the eutectic table (4), the chip loading device (2) being arranged on the mounting platform (1); A substrate loading device (3) for conveying a substrate toward the eutectic table (4), the substrate loading device (3) being arranged on the mounting platform (1); A finished product unloading device (5), the finished product unloading device (5) comprising a suction manipulator (51) and a manipulator driving mechanism (52), the manipulator driving mechanism (52) being arranged on the mounting platform (1), the suction manipulator (51) being arranged on the manipulator driving mechanism (52), the suction manipulator (51) being used to suck the finished product on the eutectic table (4), and the manipulator driving mechanism (52) being used to drive the suction manipulator (51) to move closer to or away from the eutectic table (4).

2. The integrated automatic plastic packaging eutectic machine according to claim 1, characterized in that: The finished product unloading device (5) further comprises a material tray (53) and a material tray driving mechanism (54), wherein the material tray driving mechanism (54) is arranged on the mounting platform (1), the material tray (53) is arranged on the material tray driving mechanism (54), the material tray (53) and the eutectic table (4) are arranged at a distance, the material tray driving mechanism (54) is used to drive the material tray (53) to move toward or away from the suction robot (51), and the robot driving mechanism (52) is used to drive the suction robot (51) to move between the eutectic table (4) and the material tray (53).

3. The integrated automatic plastic packaging eutectic machine according to claim 1, characterized in that: A heating module (41) is arranged on the eutectic table (4), the heating module (41) comprises a heating table (411), the heating table (411) is arranged on the eutectic table (4), and a plurality of heating rods (412) are embedded in the heating table (411).

4. The integrated automatic plastic packaging eutectic machine according to claim 3, characterized in that: A heating chamber (413) is provided in the heating platform (411); a vacuum element (42) is provided on one side of the heating platform (411); the vacuum element (42) is in communication with the heating chamber (413); and a vacuum adsorption hole (414) is provided on the heating platform (411); the vacuum adsorption hole (414) is in communication with the heating chamber (413).

5. The integrated automatic plastic packaging eutectic machine according to claim 4, characterized in that: A plurality of the vacuum adsorption holes (414) are provided, and the plurality of the vacuum adsorption holes (414) are all connected to the air suction member (42); the plurality of the vacuum adsorption holes (414) are arranged at intervals, and the inner diameters of the plurality of the vacuum adsorption holes (414) are all different.

6. The integrated automatic plastic packaging eutectic machine according to claim 4, characterized in that: A first nitrogen gas supply component (43) is also provided on the eutectic table (4); a heating gas pipe (415) for heating nitrogen is provided between the first nitrogen gas supply component (43) and the heating table (411); one end of the heating gas pipe (415) is connected to the first nitrogen gas supply component (43), and the other end is connected to the heating table (411); and the heating gas pipe (415) is in communication with the heating chamber (413).

7. The integrated automatic plastic packaging eutectic machine according to claim 3, characterized in that: A eutectic groove (44) is provided on the upper side of the eutectic table (4), and a transparent plate (45) is provided on the eutectic table (4), wherein the transparent plate (45) seals the eutectic groove (44); the heating table (411) is arranged in the eutectic groove (44), and a eutectic long hole (451) for accommodating a chip and a substrate is provided on the transparent plate (45).

8. The integrated automatic plastic packaging eutectic machine according to claim 7, characterized in that: The transparent plate (45) and the heating platform (411) are arranged at a distance from each other, and a eutectic chamber (452) is formed between the transparent plate (45) and the heating platform (411); A second nitrogen gas supply component (46) is provided on one side of the eutectic table (4), and an air duct (47) is provided between the second nitrogen gas supply component (46) and the eutectic table (4), one end of the air duct (47) is connected to the second nitrogen gas supply component (46), and the other end is connected to the eutectic table (4), and the air duct (47) is connected to the eutectic chamber (452).

9. The integrated automatic plastic packaging eutectic machine according to claim 8, characterized in that: A wind knife (48) is provided on one side of the eutectic table (4); a plurality of wind holes (482) are provided on the side of the wind knife (48) facing the eutectic table (4); the wind holes (482) are arranged toward the transparent plate (45); the wind knife (48) is connected to the second nitrogen gas supply component (46), and the plurality of wind holes (482) are all in communication with the second nitrogen gas supply component (46).

10. The integrated automatic plastic packaging eutectic machine according to claim 1, characterized in that: A eutectic visual element (49) is arranged on the eutectic table (4), the eutectic visual element (49) is arranged on the upper side of the eutectic table (4) in the vertical direction, and the eutectic visual element (49) and the eutectic table (4) are arranged opposite to each other in the vertical direction.

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