Electronic component reliability digital twin model construction method and computer equipment

Abstract

The invention discloses an electronic component reliability digital twin model construction method and computer equipment, and the method comprises the steps: determining input information, and constructing an electronic component fault mechanism model; fault first time series sampling values of all the electronic components are obtained through the electronic component fault mechanism model, and an electronic component fault first time model is constructed; constructing a failure rate model of the electronic component based on the fault first time model; constructing a circuit board level failure rate model; constructing an electronic component failure rate model; constructing an electronic component fault first time model; constructing an electronic component reliability model; and constructing a reliability digital twin model of the electronic component based on the electronic component fault first time model, the electronic component failure rate model and the electronic component reliability model. According to the method, a complete electronic component reliability digital twin model can be constructed, and reliability design analysis, test evaluation and diagnosis prediction of the electronic component are realized by using a digital means.

Description

Technical Field

[0001] The present invention belongs to the technical field of reliability and relates to a method for constructing a reliability digital twin model of an electronic component and a computer device. Background Art

[0002] Electronic components are important components of electronic products and are directly related to the performance, stability and service life of the entire electronic equipment. With the rapid development of electronic technology, electronic components have become more and more complex, including more functions and higher integration, which increases the difficulty of reliability design of electronic components. Due to the limitations of reliability test equipment and environmental conditions, it is often difficult to fully simulate the real working environment, which may affect the accuracy and reliability of the test results and fail to truly reflect the reliability level of the product. Reliability tests usually require a large number of samples and a long test cycle, which increases the cost and time investment of the test. At present, these reliability bottlenecks in electronic components have made it impossible to meet the needs of rapid product iteration, quality improvement and efficiency improvement at this stage. As an emerging simulation technology, reliability digital twin technology realizes real-time simulation, monitoring, prediction and optimization of the reliability operation status of physical entities by creating digital images of physical entities. With the rapid development of computer technology and the widespread application of technologies such as big data and artificial intelligence, reliability digital twin technology has gradually expanded to multiple fields. In the reliability design analysis, test evaluation and operation monitoring of electronic products, reliability digital twin technology can provide solutions for their life cycle reliability assurance.

[0003] At present, the application of digital twin technology focuses on function and performance, but digital twin models of electronic component reliability are rarely established. It is impossible to simulate, monitor, diagnose, predict and control the reliability characteristics, reliability behavior and reliability process of electronic components in the digital space, and it is difficult to realize the needs of forward design, rapid testing and diagnostic prediction of electronic component reliability. Summary of the invention

[0004] The purpose of the present invention is to provide a method for constructing a digital twin model of electronic component reliability, a computer device, a computer-readable storage medium and a computer program product, which can construct a complete digital twin model of electronic component reliability and realize reliability design analysis, test evaluation and diagnostic prediction of electronic components by digital means.

[0005] In order to achieve the above object, one aspect of the present invention provides a method for constructing a digital twin model of electronic component reliability, comprising:

[0006] Step S1, determine input information and build an electronic component failure mechanism model:

[0007] M model(ij) =M(IPA(ij) , I PR(ij) , I CAE(ij) )

[0008] Among them, M model(ij) represents the failure mechanism model of the jth electronic component in the i-th circuit board of the electronic component, I PA(ij) Indicates the packaging information input of the jth electronic component in the i-th circuit board, I PR(ij) Represents the cross-sectional information input of the jth electronic component in the i-th circuit board, I CAE(ij) Represents the CAE simulation model information input of the ,th electronic component in the ith circuit board;

[0009] Step S2, obtaining the first failure time series sampling values ​​of all electronic components from the electronic component failure mechanism model, and constructing the first failure time model of electronic components:

[0010]

[0011] Among them, MTTF model(ij) represents the first fault time model of the jth electronic component in the i-th circuit board, l represents the number of sampling values ​​of the first fault time of the jth electronic component in the i-th circuit board in the sampling value, M model(ijk) represents the first failure time model of the kth electronic component in the jth circuit board in the sampled value; or

[0012] MTTF model(ij) =E(M model(ij) )

[0013] Among them, E(M model(ij) ) represents the expected first failure time based on the distribution fit of the series of sample values;

[0014] Step S3, constructing a failure rate model of electronic components based on the first failure time model of electronic components:

[0015]

[0016] Among them, λ model(ij) represents the failure rate model of the jth electronic component in the i-th circuit board;

[0017] Step S4, constructing a circuit board level failure rate model based on the failure rate model of electronic components:

[0018]

[0019] Among them, λ model(i) represents the board-level failure rate model of the i-th circuit board, and n represents the number of electronic components contained in the i-th circuit board;

[0020] Step S5, constructing an electronic component failure rate model based on the circuit board level failure rate model:

[0021]

[0022] Among them, λ model represents the failure rate model of electronic components, and m represents the number of circuit boards contained in the electronic components;

[0023] Step S6, constructing an electronic component failure first occurrence time model based on the electronic component failure rate model:

[0024]

[0025] Among them, MTTF model It represents the first time model of electronic component failure;

[0026] Step S7, constructing an electronic component reliability model based on the electronic component failure rate model:

[0027]

[0028] Among them, R model Representing the reliability model of electronic components;

[0029] Step S8, constructing a reliability digital twin model of the electronic component based on the electronic component failure first occurrence time model, the electronic component failure rate model and the electronic component reliability model:

[0030]

[0031] Among them, RDT represents the reliability digital twin model of electronic components. and Respectively represent MTTF model , model and R model The first failure time model, failure rate model and reliability model of electronic components that comply with the FMI protocol are formed through simulation.

[0032] Another aspect of the present invention provides a computer device, including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the steps of the above method.

[0033] Another aspect of the present invention provides a computer-readable storage medium having a computer program stored thereon, which implements the steps of the above method when executed by a processor.

[0034] Another aspect of the present invention provides a computer program product, comprising a computer program, which implements the steps of the above method when executed by a processor.

[0035] According to the electronic component reliability digital twin model construction method, computer equipment, computer-readable storage medium and computer program product of the above aspects of the present invention, a complete electronic component reliability digital twin model can be constructed, and reliability design analysis, test evaluation and diagnostic prediction of electronic components can be realized by digital means. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings used in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0037] Figure 1 It is a flowchart of a method for constructing a digital twin model of electronic component reliability according to an embodiment of the present invention;

[0038] Figure 2 4 is a structural diagram of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0040] The embodiment of the present invention focuses on reliability and provides a method for constructing a digital twin model of electronic component reliability based on the fusion of mechanism model and simulation model, providing a digital model foundation for electronic component reliability design analysis, test evaluation and diagnosis prediction. Figure 1 As shown, the method for constructing a digital twin model of electronic component reliability according to an embodiment of the present invention includes steps S1 to S8.

[0041] In step S1, input information is determined and a failure mechanism model of electronic components is constructed.

[0042] The prerequisite for constructing a digital twin model of electronic component reliability is to first determine its input information. The input information covers three categories: electronic component packaging information input, cross-section information input, and CAE simulation information input.

[0043] Category 1: Electronic component packaging information input, including component materials, packaging dimensions, load response, etc.:

[0044] I PA(ij) =I 1 (M P(ij) , D P(ij) , L S(ij) )

[0045] An electronic component generally includes one or more circuit boards, and a circuit board contains multiple electronic components. PA(ij) Represents the packaging information input of the jth electronic component in the i-th circuit board of the electronic component, M P(ij) represents the material properties of the jth electronic component in the i-th circuit board, D P(ij) represents the size parameter of the jth electronic component in the i-th circuit board, L S(ij) Represents the load response of the jth electronic component in the i-th circuit board.

[0046] Set this type of input information to follow a certain distribution:

[0047]

[0048] Among them, the random variable X={M P , D P , L S} obeys a certain distribution, and the distribution probability function is P(X≤x), where x represents a certain value. For electronic components, a normal distribution is generally used.

[0049] Sampling component packaging information to obtain the input sample space of component packaging information

[0050]

[0051] Among them, I PA(ij) is the sample space after sampling the jth electronic component packaging information in the i-th circuit board, represents sampling of the random variable X.

[0052] The purpose of sampling here is to obtain a series of packaging information input sampling values ​​of a certain electronic component. Combined with the second type of profile information input and the third type of CAE simulation information input described later, a series of output values ​​of the fault mechanism model can be obtained.

[0053] The second category: Profile information input, including the temperature and vibration environment profiles to which the components are subjected, can be expressed as:

[0054] I PR(ij) =I 2 (T P(ij) , VP(ij) , t T(ij) , t V(ij) )

[0055] Among them, I PR(ij) represents the cross-sectional information input of the i-th electronic component in the i-th circuit board, T P(ij) represents the temperature profile magnitude of the jth electronic component in the i-th circuit board, V P(ij) represents the vibration profile magnitude of the jth electronic component in the i-th circuit board, t T(ij) represents the duration of the jth electronic component in the i-th circuit board under each step of the temperature profile, t V(ij) It represents the duration of the jth electronic component in the i-th circuit board under each step of the vibration profile.

[0056] The third category: CAE simulation information input under different temperature and vibration profile steps. To obtain this CAE simulation information, you need to first input a 3D CAD model, and then perform thermal simulation and vibration simulation on the 3D CAD model at each temperature and vibration profile step.

[0057] Construct a CAD geometric model of electronic components to describe the size parameters and assembly parameters of electronic components. The CAD geometric model parameters of the ith electronic component in the ith circuit board can be expressed as

[0058] G model(ij) =G(D (ij) , A (ij) )

[0059] Among them, G model(ij) represents the CAD geometric model parameters of the jth electronic component in the i-th circuit board, D (ij) A represents the size parameter of the jth electronic component in the i-th circuit board. (ij) Represents the assembly parameters of the jth electronic component in the i-th circuit board.

[0060] Thermal simulation and vibration simulation are performed on electronic components at each temperature and vibration profile step, and CAE simulation is constructed at different temperature and vibration profile steps. The simulation model includes a mechanical simulation model and a thermal simulation model, which can be expressed as:

[0061] M CAEmodel(ij) =M CAE (G model(ij) , M PM(ij) , V P(ij) )

[0062] T CAEmodel(ij) =T CAE (G model(ij) , M PT(ij) , TP(ij) )

[0063] Among them, M CAEmodel(ij) represents the CAE mechanical model of the jth electronic component in the i-th circuit board, T CAEmodel(ij) represents the CAE thermal model of the jth electronic component in the i-th circuit board, M PM(ij) represents the mechanical material properties of the jth electronic component in the i-th circuit board, M PT(ij) represents the thermal material properties of the jth electronic component in the i-th circuit board, V P(ij) represents the vibration profile magnitude of the jth electronic component in the i-th circuit board, T P(ij) Represents the temperature profile magnitude of the jth electronic component in the i-th circuit board.

[0064] Then, the CAE simulation model information input of the jth electronic component in the i-th circuit board can be expressed as:

[0065] I CAE(ij) ={M CAEmodel(ij) , T CAEmodel(ij)}

[0066] Among them, I CAE(ij) Represents the CAE simulation model information input of the jth electronic component in the i-th circuit board.

[0067] With the above three types of input information, the electronic component failure mechanism model can be constructed to describe the first failure time of the constructed electronic component. The component failure mechanism model is generally a function of the component packaging information, profile information, and CAE simulation information. The failure mechanism model of the ith electronic component in the ith circuit board can be expressed as

[0068] M model(ij) =M(I PA(ij) , I PR(ij) , I CAE(ij) )

[0069] Among them, M model(ij) Represents the failure mechanism model of the jth electronic component in the i-th circuit board.

[0070] In step S2, an electronic component failure first occurrence time model is constructed based on the electronic component failure mechanism model.

[0071] With the component failure mechanism model, a component failure first time model can be constructed to describe the first failure time of the constructed electronic components. The failure mechanism model can be used to obtain the first failure time series sampling values ​​of the ith electronic component in the ith circuit board under the above-mentioned profile information input. Assuming that the sampling sample has l values ​​in total, the l first failure times are sorted from small to large to obtain the sorted samples {M model(ij1) , M model(ij2) , …, M model(ijk) , …M model(ijl)}, there are two methods to calculate the first occurrence time of component failure:

[0072] First, take the median value of the distribution function, that is

[0073]

[0074] Where, l represents the number of sampling values ​​of the first fault time of the jth electronic component in the i-th circuit board in the sampling value, M model(ijk) Represents the kth fault first occurrence time model of the jth electronic component in the i-th circuit board in the sampling value.

[0075] Second, the distribution of the series of sample values ​​is fitted, and the characteristic fault first time or expected fault first time is taken based on the distribution score, that is, the fault first time of each component, that is,

[0076] MTTF2 (ij) =E(M model(ij) )

[0077] Among them, E(M model(ij) ) represents the expected first fault occurrence time based on distribution fitting.

[0078] Then, the first failure time model of the ith electronic component in the ith circuit board can be expressed as:

[0079] MTTF model(ij) =(MTTF1 (ij) or MTTF2 (ij) )

[0080] Among them, MTTF model(ij) Represents the first failure time model of the jth electronic component in the i-th circuit board.

[0081] In step S3, a failure rate model of electronic components is constructed based on the first fault occurrence time model of the electronic components.

[0082] With the component failure first occurrence time model, a component failure rate model can be constructed to describe the failure rate of the constructed electronic components. The following exponential distribution method is used to calculate the component failure rate:

[0083]

[0084] Among them, λ model(ij) Represents the failure rate model of the jth electronic component in the i-th circuit board.

[0085] In step S4, a circuit board level failure rate model is constructed based on the failure rate model of electronic components.

[0086] With the component failure rate model, a circuit board-level failure rate model can be constructed to describe the failure rate of the constructed circuit board. The series model method is used to calculate the board-level failure rate:

[0087]

[0088] Among them, λ model(i) represents the board-level failure rate model of the i-th circuit board, and n represents the number of electronic components contained in the i-th circuit board.

[0089] In step S5, an electronic component failure rate model is constructed based on the circuit board level failure rate model.

[0090] With the circuit board-level failure rate model, an electronic component failure rate model can be constructed to describe the failure rate of the constructed electronic components. The failure rate of the electronic components is calculated using the series model method:

[0091]

[0092] Among them, λ model represents the failure rate model of electronic components, and m represents the number of circuit boards contained in the electronic components.

[0093] In step S6, an electronic component failure first occurrence time model is constructed based on the electronic component failure rate model.

[0094] With the electronic component failure rate model, we can build an electronic component failure first time model to describe the first time of failure of the constructed electronic component. The exponential distribution method is used to calculate the first time of failure of the electronic component:

[0095]

[0096] Among them, MTTF model Represents the first occurrence time model of electronic component failure.

[0097] In step S7, an electronic component reliability model is constructed based on the electronic component failure rate model.

[0098] With the electronic component failure rate model, we can build an electronic component reliability model to describe the reliability of the constructed electronic components, and use the exponential distribution method to calculate the first occurrence time of electronic component failures:

[0099]

[0100] Among them, R model Represents the reliability model of electronic components.

[0101] In step S8, a reliability digital twin model of the electronic component is constructed based on the electronic component failure first occurrence time model, the electronic component failure rate model and the electronic component reliability model.

[0102] After building the failure rate, reliability, and first failure time models of electronic components, it is necessary to build a reliability digital twin model of electronic components. The steps are as follows:

[0103] Using the Simulink module in Matlab software, the obtained mathematical expressions of the failure rate and first failure time model of the electronic components are used to create a simulation model in the Simulink environment, configure the step mode and step value of the model solution, and export the electronic component functional model unit FMU that meets the FMI (Functional Mock-up Interface) standard, that is,

[0104]

[0105] Among them, FMU represents the functional model unit of electronic components. Represents the mechanical model of the electronic component in accordance with the FMI protocol, Respectively represent MTTF model , model and R model The first failure time model, failure rate model and reliability model of electronic components that comply with the FMI protocol are formed through simulation.

[0106] Since this FMU has fast computing capabilities and a universal FMI interface for system simulation, it can be used as a reliability digital twin model for electronic components:

[0107] RDT=FMU

[0108] Among them, RDT represents the reliability digital twin model of electronic components.

[0109] To sum up, the method of the embodiment of the present invention focuses on reliability. By establishing a digital twin model of the reliability of electronic components, it realizes the simulation, monitoring, diagnosis, prediction and control of reliability indicators such as failure rate, reliability, life, and remaining life of electronic components, thereby using digital means to realize reliability design analysis, test evaluation and diagnostic prediction of electronic components, greatly shortening the product iteration and upgrade cycle, and greatly reducing the research and development and use costs of electronic components.

[0110] An embodiment of the present invention further provides a computer device, which may be a server, and its internal structure diagram may be as shown in FIG. Figure 2 As shown. The computer device includes a processor, a memory and a network interface connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the computer device is used to store operating parameter data of each framework. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, the steps of the method of the embodiment of the present invention are implemented.

[0111] Those skilled in the art will understand that Figure 2 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0112] An embodiment of the present invention further provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the method of the embodiment of the present invention are implemented.

[0113] An embodiment of the present invention further provides a computer program product, including a computer program, which implements the steps of the method of the embodiment of the present invention when executed by a processor.

[0114] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A method for constructing a digital twin model of electronic component reliability, characterized in that: include: Step S1, determine input information and build an electronic component failure mechanism model: M model(ij) =M(I PA(ij) ,I PR(ij) ,I CAE(ij) ) Among them, M model(ij) represents the failure mechanism model of the jth electronic component in the i-th circuit board of the electronic component, I PA(ij) Indicates the packaging information input of the jth electronic component in the i-th circuit board, I PR(ij) Represents the cross-sectional information input of the jth electronic component in the i-th circuit board, I CAE(ij) Represents the CAE simulation model information input of the ,th electronic component in the ith circuit board; Step S2, obtaining the first failure time series sampling values ​​of all electronic components from the electronic component failure mechanism model, and constructing the first failure time model of electronic components: Among them, MTTF model(ij) represents the first fault time model of the jth electronic component in the i-th circuit board, l represents the number of sampling values ​​of the first fault time of the jth electronic component in the i-th circuit board in the sampling value, M model(ijk) represents the first failure time model of the kth electronic component in the jth circuit board in the sampled value; or MTTF model(ij) =E(M model(ij) ) Among them, E(M model(ij) ) represents the expected first failure time based on the distribution fit of the series of sample values; Step S3, constructing a failure rate model of electronic components based on the first failure time model of electronic components: Among them, λ model(ij) represents the failure rate model of the jth electronic component in the i-th circuit board; Step S4, constructing a circuit board level failure rate model based on the failure rate model of electronic components: Among them, λ model(i) represents the board-level failure rate model of the i-th circuit board, and n represents the number of electronic components contained in the i-th circuit board; Step S5, constructing an electronic component failure rate model based on the circuit board level failure rate model: Among them, λ model represents the failure rate model of electronic components, and m represents the number of circuit boards contained in the electronic components; Step S6, constructing an electronic component failure first occurrence time model based on the electronic component failure rate model: Among them, MTTF model It represents the first time model of electronic component failure; Step S7, constructing an electronic component reliability model based on the electronic component failure rate model: Among them, R model Representing the reliability model of electronic components; Step S8, constructing a reliability digital twin model of the electronic component based on the electronic component failure first occurrence time model, the electronic component failure rate model and the electronic component reliability model: Among them, RDT represents the reliability digital twin model of electronic components. and Respectively represent MTTF model , model and R model The first failure time model, failure rate model and reliability model of electronic components that comply with the FMI protocol are formed through simulation.

2. The method according to claim 1, characterized in that The packaging information input of electronic components is expressed as: I PA(ij) =I1(M P(ij) ,D P(ij) ,L S(ij) ) Among them, I PA(ij) represents the packaging information input of the jth electronic component in the i-th circuit board, M P(ij) represents the material properties of the jth electronic component in the i-th circuit board, D P(ij) represents the size parameter of the jth electronic component in the i-th circuit board, L S(ij) Represents the load response of the jth electronic component in the i-th circuit board.

3. The method according to claim 1 or 2, characterized in that The cross-sectional information input of electronic components is expressed as: I PR(ij) =I2(T P(ij) ,V P(ij) ,t T(ij) ,t V(ij) ) Among them, I PR(ij) represents the cross-sectional information input of the i-th electronic component in the i-th circuit board, T P(ij) represents the temperature profile magnitude of the jth electronic component in the i-th circuit board, V P(ij) represents the vibration profile magnitude of the jth electronic component in the i-th circuit board, t T(ij) represents the duration of the jth electronic component in the i-th circuit board under each step of the temperature profile, t V(ij) It represents the duration of the jth electronic component in the i-th circuit board under each step of the vibration profile.

4. The method according to claim 1 or 2, characterized in that: The CAE simulation model information input of electronic components is expressed as: I CAE(ij) ={M CAEmodel(ij) ,T CAEmodel(ij) } Among them, I CAE(ij) Represents the CAE simulation model information input of the jth electronic component in the i-th circuit board; M CAEmodel(ij) =M CAE (G model(ij) ,M PM(ij) ,V P(ij) ) T CAEmodel(ij) =T CAE (G model(ij) ,M PT(ij) ,T P(ij) ) Among them, M CAEmodel(ij) represents the CAE mechanical model of the jth electronic component in the i-th circuit board, T CAEmodel(ij) represents the CAE thermal model of the jth electronic component in the i-th circuit board, M PM(ij) represents the mechanical material properties of the jth electronic component in the i-th circuit board, M PT(ij) represents the thermal material properties of the jth electronic component in the i-th circuit board, V P(ij) represents the vibration profile magnitude of the jth electronic component in the i-th circuit board, T P(ij) represents the temperature profile magnitude of the jth electronic component in the i-th circuit board; G model(ij) =G(D (ij) ,A (ij) ) Among them, G model(ij) represents the CAD geometric model parameters of the jth electronic component in the i-th circuit board, D (ij) A represents the size parameter of the jth electronic component in the i-th circuit board. (ij) Represents the assembly parameters of the jth electronic component in the i-th circuit board.

5. A computer device comprising a memory, a processor and a computer program stored in the memory, characterized in that: The processor executes the computer program to implement the steps of the method according to any one of claims 1 to 4.

6. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 4 are implemented.

7. A computer program product, comprising a computer program, which implements the steps of the method according to any one of claims 1 to 4 when executed by a processor.

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