Rectifying device, power module, and electronic apparatus

Abstract

The invention discloses a rectification device, a power module and electronic equipment, the rectification device comprises a bearing substrate, a packaging part and a fixing part, the bearing substrate comprises a substrate, a first conductive layer and a second conductive layer, the first conductive layer and the second conductive layer are arranged on the substrate in the same layer, the first conductive layer is used for connecting a power device, and the second conductive layer is used for connecting a power module. The second conducting layer is used for connecting a connecting terminal, and the first conducting layer and the second conducting layer are connected through a connecting piece; the packaging part is connected with the bearing substrate and at least covers the first conductive layer and the second conductive layer, and the packaging part is an epoxy resin cured material; the fixing part is connected with the packaging part, and the rectification device is connected with the heat dissipation piece through the fixing part. According to the embodiment of the invention, the bearing substrate and the fixing part can be connected through the packaging part to form an integrated structure so as to improve the waterproof and anti-seepage performance, the packaging part formed by curing the epoxy resin can shorten the heat transfer path of the power module so as to improve the heat dissipation performance, and meanwhile, the packaging part has better high temperature resistance compared with a silica gel potting process.

Description

Technical Field

[0001] The present application belongs to the technical field of semiconductor devices, and in particular relates to a rectifier device, a power module and an electronic device. Background Art

[0002] A power module is an integral structure that integrates multiple components. The packaging process directly affects the electrical performance and reliability of the power module.

[0003] In the related art, the packaging of power modules is mostly in the form of silicone potting, but this packaging form still has shortcomings in terms of high temperature resistance and waterproof performance. Summary of the invention

[0004] The embodiments of the present application provide a rectifier device, a power module and an electronic device. The rectifier device can provide an interconnection structure with a high degree of integration, and the interconnection structure has a strong waterproof performance.

[0005] In the first aspect, an embodiment of the present application provides a rectifier device, which includes a carrier substrate, a packaging part and a fixing part. The carrier substrate includes a substrate, a first conductive layer and a second conductive layer. The first conductive layer and the second conductive layer are arranged on the same layer on the substrate. The first conductive layer is used to connect the power device, and the second conductive layer is used to connect the connection terminal. The first conductive layer and the second conductive layer are interconnected through a connector; the packaging part is connected to the carrier substrate and at least covers the first conductive layer and the second conductive layer, and the packaging part is an epoxy resin cured material; the fixing part is connected to the packaging part, and the rectifier device is connected to the heat sink through the fixing part.

[0006] In some embodiments, the rectifier device further includes a mounting bracket, which is disposed on the second conductive layer and has a socket for circumferentially fixing the connection terminal.

[0007] In some embodiments, a length of the mounting bracket in the first direction is greater than a length of the packaging portion in the first direction to expose the insertion hole.

[0008] In some embodiments, the connecting member includes a current carrier and two electrical terminals, wherein the two electrical terminals are respectively connected to the first conductive layer and the second conductive layer and are interconnected through the current carrier.

[0009] In some embodiments, the current carrier has a raised portion, and along the first direction, a bottom surface of the raised portion is higher than a top surface of any power terminal.

[0010] In some embodiments, the packaging portion includes a first base connected to the carrier substrate, the first base covers the substrate and encapsulates the first conductive layer and the second conductive layer.

[0011] In some embodiments, the packaging portion further includes two second substrates, the fixing portion is embedded in the second substrates, the two second substrates are arranged on both sides of the first substrate along the second direction, and the length of the second substrate in the first direction gradually decreases in the direction away from the first substrate.

[0012] In some embodiments, the carrier substrate further includes a heat transfer layer, which is disposed on a side of the substrate away from the first conductive layer and the second conductive layer, and the heat transfer layer is fixedly connected to the substrate.

[0013] In the second aspect, an embodiment of the present application provides a power module, which includes a heat sink, a power device, a connecting terminal, and a rectifier device provided by any of the aforementioned embodiments, wherein the power device is electrically connected to the first conductive layer, the connecting terminal is electrically connected to the second conductive layer, the power device and the connecting terminal are interconnected through the rectifier device, and the heat sink is connected to the rectifier device through a fixing portion.

[0014] In a third aspect, an embodiment of the present application provides an electronic device, the electronic device comprising a power module provided by any of the aforementioned embodiments.

[0015] The rectifier device of the embodiment of the present application uses epoxy resin to replace the silicone gel in the traditional packaging structure. After the epoxy resin is cured, a packaging part is formed. The supporting substrate and the fixing part can be formed into an integrated structure through the packaging part, thereby improving the waterproof and anti-seepage performance of the rectifier device. Different from the silicone gel in the traditional packaging structure with the shell as the supporting frame, the packaging part shortens the heat transfer path to improve the heat dissipation performance, and the epoxy resin has better high temperature resistance than silicone gel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings:

[0017] Figure 1 This is a schematic diagram of the structure of a rectifier device in some embodiments of the present application;

[0018] Figure 2 for Figure 1 A schematic structural diagram of a carrier substrate in the rectifier device shown;

[0019] Figure 3 for Figure 2 A schematic diagram of the structure of interconnection between the first conductive layer and the second conductive layer in the carrier substrate;

[0020] Figure 4 A schematic diagram of the structure of a power module in some embodiments of the present application;

[0021] Figure 5 for Figure 4 The connection diagram of the power module is shown.

[0022] The reference numerals in the specific implementation manner are as follows:

[0023] 100, substrate; 101, first conductive layer; 102, second conductive layer; 110, connector; 111, power terminal; 112, current carrier; 120, power device; 130, connecting terminal; 140, mounting bracket; 141, main body; 142, first extension; 143, second extension;

[0024] 200, packaging unit; 201, first substrate; 202, second substrate;

[0025] 300, fixing portion; 301, first hole; 302, second hole;

[0026] 400, heat sink; 500, PCB board;

[0027] First direction Z; second direction X. DETAILED DESCRIPTION

[0028] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0030] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0031] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0032] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0033] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0034] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0035] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0036] A power module is a packaged unit that integrates multiple power devices and related components, enabling efficient and reliable power conversion and control. The quality of the package directly affects the electrical performance and reliability of the power module.

[0037] In the related art, the packaging of power modules is mostly carried out by injecting silicone gel into the shell to improve the insulation between the components and circuits inside the shell, while covering the components and circuits to achieve waterproof and anti-seepage, thereby improving the reliability of the power module.

[0038] However, due to the heat resistance of silicone gel and the complexity of the process, bubbles are likely to appear inside the silicone gel during the potting process and subsequent use. These bubbles will not only affect the overall strength of the silicone gel, making it easy to crack or fall off, but will also seriously affect the insulation properties of the silicone gel material, such as causing the breakdown voltage to decrease. High temperatures are inevitable in the use of power modules. Therefore, it is necessary to provide a packaging structure with better high temperature resistance to improve the reliability of the power module.

[0039] In addition, the silicone gel is still soft after curing and needs a shell as a support to ensure the stability of its connection with the power device. The existence of the shell undoubtedly increases the difficulty of the power module's heat dissipation design.

[0040] In order to solve the problems in the prior art, the embodiments of the present application provide a rectifier device, a power module and an electronic device. The rectifier device provided in the embodiments of the present application is first introduced below.

[0041] See also Figures 1 to 3 , the embodiment of the present application provides a rectifier device, the rectifier device includes a carrier substrate, a fixing part 300 and a packaging part 200 formed by curing epoxy resin, the carrier substrate forms an integrated rectifier device through the packaging part 200 and the fixing part 300, and the rectifier device is connected to the heat sink 400 of the power module through the fixing part 300. Among them, the carrier substrate includes a substrate 100, a first conductive layer 101 and a second conductive layer 102, the first conductive layer 101 is used to connect the power device 120, the second conductive layer 102 is used to connect the connection terminal 130, the first conductive layer 101 and the second conductive layer 102 are interconnected through the connector 110, and the packaging part 200 is connected to the carrier substrate and at least covers the first conductive layer 101 and the second conductive layer 102.

[0042] Among them, the first conductive layer 101 and the second conductive layer 102 are arranged on the same layer on the substrate 100. For example, in some embodiments, the substrate 100 is a ceramic plate, and the first conductive layer 101 and the second conductive layer 102 are directly applied on top of the ceramic plate; in other embodiments, the first conductive layer 101 and the second conductive layer 103 are buried in the substrate 100 and are at least partially exposed to connect the connector 110.

[0043] It is understood that in the embodiment of the present application, the encapsulation part 200 is an epoxy resin cured material, which means that the molding material of the encapsulation part 200 includes at least an epoxy resin component. Exemplarily, the molding material of the encapsulation part 200 includes an epoxy resin oligomer or compound and also includes a curing agent. Optionally, the molding material of the encapsulation part 200 also includes additives, such as a plasticizer, a filler, a toughening agent, etc.

[0044] Optionally, along a first direction (eg, Z direction in the figure), the fixing portion 300 is spaced apart from the carrier substrate.

[0045] Thus, the rectifier device realizes the connection between the carrier substrate and the fixing part 300 through the curing of the packaging part 200, so that the rectifier device can be subsequently connected to the heat sink 400 to form a power module and connected to electrical parts such as a PCB board in the form of a power module as a whole. The rectifier device realizes the interconnection between the power device 120 and the connection terminal 130 through the first conductive layer 101, the second conductive layer 102 and the connector 110 provided on the carrier substrate, and the packaging part 200 formed by curing the epoxy resin covers the first conductive layer 101 and the second conductive layer 102 to improve the insulation performance of the rectifier device, reduce the probability of unexpected conduction inside the rectifier device, and improve the reliability of the power module.

[0046] Compared with the silicone gel potting in the traditional packaging process, on the one hand, the packaging part 200 is formed by an epoxy resin curing process, which improves its reliability and yield as an insulating structure and reduces the process requirements. Compared with silicone gel, epoxy resin has better high temperature resistance, which expands the application scenarios of power modules. On the other hand, after curing, the epoxy resin presents a solid structure and does not require a shell to support it. Compared with the packaging structure on the market, the shell is removed, which realizes the miniaturization and lightweight of the power module. At the same time, it shortens the heat transfer path of the power module and reduces the difficulty of heat dissipation design.

[0047] See also Figure 2 According to some embodiments of the present application, the rectifier device further includes a mounting bracket 140 , which is disposed on the second conductive layer 102 , and the mounting bracket 140 is provided with a plug hole.

[0048] Optionally, the mounting bracket 140 is fixed to the second conductive layer 102 by welding.

[0049] See also Figure 3 Optionally, the mounting bracket 140 includes a main body 141 with a socket and a first extension portion 142 arranged on a side of the main body 141 close to the second conductive layer 102. The first extension portion 142 is arranged along the circumference of the main body 141 to increase the contact area between the mounting bracket 140 and the second conductive layer 102, thereby improving the stability of the connection between the mounting bracket 140 and the second conductive layer 102.

[0050] Further optionally, a material groove is formed on a side of the first extension portion 142 facing the second conductive layer 102 to accommodate solder.

[0051] Therefore, the connecting terminal 130 is inserted into the mounting bracket 140 to improve the stability of the connection between the connecting terminal 130 and the second conductive layer 102. The mounting bracket 140 realizes circumferential fixation of the connecting terminal 130 through the insertion hole. The mounting bracket 140 is fixedly connected to the packaging part 200 covering the second conductive layer 102 to improve the connection strength between the connecting terminal 130 and the rectifier device.

[0052] See also Figure 5 According to some embodiments of the present application, the length of the mounting bracket 140 in the first direction is greater than the length of the packaging part 200 in the first direction.

[0053] Optionally, the mounting bracket 140 further includes a second extension portion 143, which is disposed at an end of the main body 141 away from the second conductive layer 102, and is disposed along the circumference of the main body 141. The second extension portion 143 has a first surface facing the second conductive layer 102 and a second surface facing away from the second conductive layer 102. The vertical distance between the second surface and the second conductive layer 102 is less than the length of the packaging portion 200 in the first direction.

[0054] Further optionally, the length of the packaging part 200 in the first direction is equal to the vertical distance between the first surface and the second conductive layer 102, that is, the first surface is arranged in contact with the packaging part 200 to increase the contact area between the mounting bracket 140 and the packaging part 200, thereby further improving the stability of the connection between the mounting bracket 140 and the packaging part 200 and the second conductive layer 102.

[0055] Further optionally, a guiding slope is provided at one end of the main body portion 141 connected to the second extension portion 143 to reduce the difficulty of assembling the connecting terminal 130 to the mounting bracket 140 .

[0056] Thus, the socket of the mounting structure is exposed for the later insertion of the connection terminal 130, the rectifier device can be pre-cured and formed, and the connection terminal 130 can be inserted later to achieve the interconnection between the connection terminal 130 and the power device 120, thereby reducing the process difficulty and processing cost.

[0057] According to certain embodiments of the present application, the second conductive layer 102 is provided with a mounting hole, and the mounting hole is arranged in a one-to-one correspondence with the mounting bracket 140, and at least a portion of the first extension portion 142 is arranged in the mounting hole and fixedly connected to the second conductive layer 102 structure around the mounting hole.

[0058] Optionally, the mounting hole is a blind hole, and a depth of the blind hole is less than or equal to 0.2 mm and greater than or equal to 0.1 mm.

[0059] Optionally, an orthographic projection of the mounting hole on the second conductive layer 102 and an orthographic projection of the mounting bracket 140 on the second conductive layer 102 have an installation gap.

[0060] Further optionally, along the radial direction of the mounting hole, the width of the mounting gap is less than or equal to 0.2 mm and greater than or equal to 0.05 mm.

[0061] Optionally, the orthographic projection of the mounting hole on the second conductive layer 102 is identical to and coincides with the orthographic projection of the mounting bracket 140 on the second conductive layer 102. Exemplarily, the orthographic projection of the mounting hole on the second conductive layer 102 is a first circle, and the orthographic projection of the mounting bracket 140 on the second conductive layer 102 is a second circle, the first circle and the second circle are co-centered, and the radius of the first circle is greater than the radius of the second circle. In other embodiments, the orthographic projections of the mounting hole and the mounting bracket 140 on the second conductive layer 102 may also be polygons such as rectangles, hexagons, or other special shapes that meet actual needs, and this application does not limit this.

[0062] Therefore, the provision of the mounting hole can achieve pre-positioning of the mounting bracket 140 to the second conductive layer 102. At the same time, the provision of the mounting hole can connect at least part of the side wall of the first extension portion 142 to the second conductive layer 102, thereby increasing the contact area between the mounting bracket 140 and the second conductive layer 102, thereby achieving an improvement in the stability of the connection between the mounting bracket 140 and the second conductive layer 102.

[0063] In addition, during the process of welding and fixing the mounting bracket 140, on the one hand, the mounting gap between the mounting hole and the mounting bracket 140 can accommodate the melted solder paste, and on the other hand, during the reflow soldering operation, the mounting gap forms a siphon effect during welding, and the solder paste reduces overflow under the action of the siphon effect, thereby improving the docking accuracy between the mounting hole and the mounting bracket 140, and at the same time, the yield of the rectifier device is improved by controlling the overflow of the solder paste.

[0064] See also Figure 5 According to some embodiments of the present application, the connector 110 includes a current carrier 112 and two power terminals 111 . The two power terminals 111 are respectively connected to the first conductive layer 101 and the second conductive layer 102 . The two power terminals 111 are interconnected through the current carrier 112 .

[0065] Optionally, both of the two electrical terminals 111 are made of copper to reduce the difference in thermal expansion coefficient between the electrical terminal 111 and the first conductive layer 101 or between the electrical terminal 111 and the second conductive layer 102 .

[0066] Further optionally, the current carrier 112 is made of copper.

[0067] Optionally, the power terminal 111 is provided with a through hole penetrating along the thickness direction thereof, so as to reduce stress concentration at the connection between the power terminal 111 and the second conductive layer 102 .

[0068] Optionally, the current carrier 112 has a width greater than its thickness, so that the current carrier 112 has a sheet-like structure, and the power terminal 111 and the current carrier 112 have a sheet-like structure correspondingly. On the one hand, it is convenient to connect the power terminal 111 with the first conductive layer 101 or the second conductive layer 102, and on the other hand, the stray inductance of the connector 110 is reduced to improve the conduction performance of the power module.

[0069] Therefore, compared with traditional aluminum wire bonding, the connector 110 is separately provided with the power terminal 111 and the carrier 112, which reduces the difficulty of bonding the connector 110 to the first conductive layer 101 or the second conductive layer 102, while increasing the contact area between the connector 110 and the packaging part 200, and improving the mechanical strength and stability of the connector 110.

[0070] According to some embodiments of the present application, the carrier current 112 has a convex portion.

[0071] Optionally, along the first direction, the bottom surface of the arched portion is higher than the top surface of any power terminal 111 .

[0072] Optionally, the arched portion is arranged in a polygonal shape. Exemplarily, the arched portion is arranged in a rectangular shape.

[0073] Optionally, the arched portion is in an arc shape or a smooth curve shape so that the current is more evenly distributed on the carrier 112 .

[0074] Thus, the arched portion can further reduce the stress concentration caused by the difference in thermal expansion coefficient between the connector 110 and the first conductive layer 101 or the second conductive layer 102, and at the same time increase the heat dissipation area of ​​the connector 110 to improve the high temperature resistance of the power module. In addition, the design of the arched portion allows the connector 110 to have a certain deformation space, which reduces the difficulty of assembling the connector 110 to the first conductive layer 101 or the second conductive layer 102, and contributes to the miniaturization and integration of the power module.

[0075] See also Figure 5 According to some embodiments of the present application, the packaging portion 200 includes a first base 201 connected to the carrier substrate, and the first base 201 is disposed to cover the first conductive layer 101 and the second conductive layer 102 and extend along a first direction.

[0076] Optionally, the first base body 201 covers the substrate 100 to protect a side of the substrate 100 on which the power device 120 is mounted.

[0077] Further optionally, the first base 201 covers the substrate 100 and extends in at least one direction, so as to increase the contact area between the packaging portion 200 and the heat sink 400 to improve the heat dissipation performance of the rectifier device.

[0078] Thus, the connection stability between the first base body 201 and the carrier substrate is improved, so as to increase the strength of the integrated structure formed by the first base body 201 and the carrier substrate, and improve the reliability of the rectifier device and the power module.

[0079] Please continue reading Figure 5 According to some embodiments of the present application, the packaging portion 200 further includes two second substrates 202 , which are formed by extending the end of the first substrate 201 in the second direction, and the two second substrates 202 are disposed at both ends of the first substrate 201 along the second direction.

[0080] Optionally, the fixing portion 300 is embedded in the second substrate 202 to achieve connection between the fixing portion 300 and the packaging portion 200 .

[0081] Optionally, along the direction away from the first substrate 201, the length of the second substrate 202 in the first direction gradually decreases, increasing the embedded length of the fixing portion 300 to increase the contact area between the fixing portion 300 and the second substrate 202, while helping to control the volume of the packaging portion 200, which is beneficial to the miniaturization and integration of the power module.

[0082] Optionally, in a cross section perpendicular to the first direction, an orthographic projection of the second substrate 202 falls outside an orthographic projection of the first conductive layer 101 and the second conductive layer 102 .

[0083] Further optionally, in a cross section perpendicular to the first direction, the orthographic projection of the second substrate 202 falls outside the orthographic projection of the substrate 100 , that is, the orthographic projections of the two second substrates 202 are spaced apart from the orthographic projection of the substrate 100 .

[0084] Therefore, the packaging part 200 is divided into a first base 201 and a second base 202 to separate the fixed part 300 and the substrate 100, thereby reducing the design difficulty of the fixed part 300, enabling the fixed part 300 to be made of metal material to improve the structural strength of the fixed part 300, and facilitating subsequent processing of the fixed part 300 so that the fixed part 300 can be more conveniently connected to the heat sink 400.

[0085] See also Figure 1 According to some embodiments of the present application, the fixing portion 300 is a sheet-like structure, and a first hole 301 is formed in a portion of the fixing portion 300 extending relative to the packaging portion 200 .

[0086] Optionally, a screw or a pin is passed through the first hole 301 to connect the fixing portion 300 and the heat sink 400 .

[0087] Optionally, part of the fixing portion 300 is embedded in the first substrate 201 to increase the contact area between the fixing portion 300 and the packaging portion 200 , thereby improving the connection strength between the fixing portion 300 and the packaging portion 200 .

[0088] Optionally, on a cross section perpendicular to the first direction, the orthographic projection of the first conductive layer 101 and the orthographic projection of the second conductive layer 102 are spaced apart from the orthographic projection of the fixing part 300 to reduce the probability of unexpected conduction between the first conductive layer 101 or the second conductive layer 102 and the fixing part 300 .

[0089] Optionally, the fixing portion 300 is further provided with a second hole 302 , and a screw or a pin is passed through the second hole 302 to assist in fixing.

[0090] Further optionally, the second hole 302 is an arc-shaped hole. Exemplarily, two second holes 302 are provided, and the two second holes 302 are arranged concentrically, which helps to strengthen the connection between the fixing part 300 and the heat sink 400 and reduce the difficulty of assembly.

[0091] Therefore, it is convenient to install and remove the rectifying device to and from the heat sink 400 through the fixing portion 300 .

[0092] According to some embodiments of the present application, the carrier substrate further includes a heat transfer layer, which is disposed on a side of the substrate 100 away from the first conductive layer 101 and the second conductive layer 102 and is fixedly connected to the substrate 100 .

[0093] It can be understood that the thermal conductivity of the heat transfer layer is greater than the thermal conductivity of the substrate 100 .

[0094] Optionally, the heat transfer layer is a copper member. Exemplarily, the plane where the first conductive layer 101 and the second conductive layer 102 are located, the substrate 100, and the heat transfer layer are stacked in sequence and formed by a direct bonding copper (DBC) ceramic substrate process.

[0095] Optionally, in a cross section perpendicular to the first direction, the orthographic projection of the substrate 100 falls within the orthographic projection of the heat transfer layer to increase the heat dissipation area.

[0096] Further optionally, the orthographic projection of the substrate 100 is consistent with the orthographic projection shape of the heat transfer layer.

[0097] Thus, the two sides of the heat transfer layer are in contact with the substrate 100 and the heat sink 400 respectively, which accelerates the dissipation of heat generated during the operation of the power device 120 and improves the heat dissipation performance of the power module.

[0098] Second, see Figures 4 to 5, an embodiment of the present application provides a power module, the power module includes a power device 120, a connection terminal 130, a heat sink 400 and a rectifier device provided by any of the above embodiments. Among them, the power device 120 is electrically connected to the first conductive layer 101, the connection terminal 130 is electrically connected to the second conductive layer 102, and the rectifier device is connected to the heat sink 400 through the fixing portion 300. It can be understood that the power module has all the beneficial effects of the above rectifier devices.

[0099] Optionally, the connection terminal 130 is connected to the second conductive layer 102 by welding, and the connection terminal 130 forms an integrated structure with the rectifier device and the power device 120 through solidification of the packaging part 200 .

[0100] Optionally, see Figure 4 or Figure 5 When the second conductive layer 102 is welded with the mounting bracket 140 , the mounting bracket 140 is made of a conductive material, and the connecting terminal 130 is interference-fitted with the mounting bracket 140 and is electrically connected to the second conductive layer 102 through the mounting bracket 140 .

[0101] In a third aspect, an embodiment of the present application provides an electronic device, the electronic device comprising the power module provided by the embodiment of the second aspect. For the same reason, the electronic device has all the beneficial effects of the aforementioned rectifier device. Specifically, the electronic device can be at least one of a wearable device, a camera, a mobile phone, a tablet computer, a television, a remote control, and a car terminal.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A rectifier device, characterized in that: include: A carrier substrate, comprising a substrate, a first conductive layer and a second conductive layer, wherein the first conductive layer and the second conductive layer are arranged on the substrate in the same layer, the first conductive layer is used to connect a power device, the second conductive layer is used to connect a connection terminal, and the first conductive layer and the second conductive layer are interconnected through a connector; A packaging part connected to the carrier substrate and at least covering the first conductive layer and the second conductive layer, wherein the packaging part is a cured epoxy resin; The fixing part is connected to the packaging part, and the rectifying device is connected to the heat sink through the fixing part.

2. The rectifier device according to claim 1, characterized in that: The rectifier device further comprises a mounting bracket, which is arranged on the second conductive layer and has a plug hole for circumferentially fixing the connection terminal.

3. The rectifier device according to claim 2, characterized in that: The length of the mounting bracket in the first direction is greater than the length of the packaging portion in the first direction to expose the insertion hole.

4. The rectifier device according to claim 1, characterized in that: The connecting member includes a current carrier and two electrical terminals. The two electrical terminals are respectively connected to the first conductive layer and the second conductive layer and are interconnected through the current carrier.

5. The rectifier device according to claim 4, characterized in that: The current carrier has a raised portion, and along a first direction, a bottom surface of the raised portion is higher than a top surface of any of the power terminals.

6. The rectifier device according to claim 1, characterized in that: The packaging part includes a first base connected to the carrier substrate, wherein the first base covers the substrate and encapsulates the first conductive layer and the second conductive layer.

7. The rectifier device according to claim 6, characterized in that: The packaging part also includes two second substrates, the fixing part is embedded in the second substrates, the two second substrates are arranged on both sides of the first substrate along the second direction, and the length of the second substrate in the first direction gradually decreases along the direction away from the first substrate.

8. The rectifier device according to any one of claims 1 to 7, characterized in that: The carrier substrate further includes a heat transfer layer, which is disposed on a side of the substrate away from the first conductive layer and the second conductive layer, and is fixedly connected to the substrate.

9. A power module, characterized in that: include: The rectifier device according to any one of claims 1 to 8; a power device, electrically connected to the first conductive layer; A connecting terminal electrically connected to the second conductive layer; A heat sink is connected to the rectifier device through the fixing portion.

10. An electronic device, characterized in that: Comprising the power module as claimed in claim 9.

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