Electronic packaging module and manufacturing method thereof

Abstract

The invention provides an electronic packaging module and a manufacturing method thereof. The electronic packaging module comprises a circuit substrate, an electronic element, a sealing layer, a heat conduction material and a heat dissipation element, wherein the electronic element and the sealing layer are arranged on the circuit substrate, the heat conduction material is arranged in a groove of the sealing layer, and the heat dissipation element is arranged on the heat conduction material. The electronic component is electrically connected to the circuit substrate and has a top surface opposite to the circuit substrate. The sealing layer wraps the electronic component, and the groove of the sealing layer is located on the electronic component. The bottom surface of the groove exposes the top surface of the electronic component. The heat conduction material is located on the top surface of the electronic component and provided with a first surface far away from the electronic component, the sealing layer is provided with a second surface far away from the circuit substrate, and the first surface is flush with the second surface. The heat conduction material is located between the electronic element and the heat dissipation element. Therefore, the heat dissipation efficiency of the electronic packaging module can be improved.

Description

Technical Field

[0001] The invention relates to an electronic packaging module and a manufacturing method thereof. Background Art

[0002] As the functions of electronic products become more diverse, electronic packaging modules in electronic products need to accommodate more and more electronic components. Therefore, the demand for heat dissipation of packaging modules also increases. In electronic packaging modules with high heat dissipation requirements, the efficiency of heat dissipation can be improved by exposing the back of electronic components (e.g., transistors) that generate more heat.

[0003] Generally speaking, there are two ways to expose the back of electronic components. One is to make the mold of the sealing process have a concave-convex design so that a part of the mold can cover and contact the back of the electronic component so that the sealing material does not cover the back of the electronic component. However, if the heights of the electronic components in the packaging module are inconsistent, this method requires the use of different molds, so it is difficult to reduce manufacturing costs. Another way is to grind or cut the sealing material of the packaging module to expose the back of the electronic component, but this method cannot be used when the height of the electronic component to be exposed is lower than that of other electronic components. Summary of the invention

[0004] Therefore, at least one embodiment of the present invention provides an electronic packaging module, which helps to improve the heat dissipation efficiency of the electronic packaging module.

[0005] At least one embodiment of the present invention further provides a method for manufacturing the electronic packaging module.

[0006] At least one embodiment of the present invention provides an electronic packaging module, which includes a circuit substrate, a first electronic component and a sealing layer disposed on the circuit substrate, a thermally conductive material disposed in a groove of the sealing layer, and a heat dissipation element disposed on a first surface of the thermally conductive material. The first electronic component is electrically connected to the circuit substrate and has a first top surface facing away from the circuit substrate. The sealing layer covers the first electronic component and includes a groove on the first electronic component. A bottom surface of the groove exposes the first top surface of the first electronic component. The thermally conductive material is located on the first top surface of the first electronic component and has a first surface away from the first electronic component, and the sealing layer has a second surface away from the circuit substrate. The first surface is flush with the second surface. The thermally conductive material is located between the first electronic component and the heat dissipation element.

[0007] At least one embodiment of the present invention provides a method for manufacturing an electronic packaging module, comprising providing an initial circuit substrate and arranging an electronic component on the initial circuit substrate. After the electronic component is arranged, a release material is arranged on a top surface of the electronic component, and the release material directly contacts the top surface of the electronic component. After the release material is arranged, an initial sealing layer is formed on the initial circuit substrate so that the initial sealing layer covers the electronic component and the release material. The initial sealing layer has a first surface away from the initial circuit substrate, and the release material has a second surface away from the initial circuit substrate. The first surface exposes the second surface, and the first surface is flush with the second surface. After the initial sealing layer is formed, the release material is removed to form a groove, and the top surface of the electronic component is exposed. After the groove is formed, the initial circuit substrate and the initial sealing layer are cut to form a circuit substrate and a sealing layer respectively. A thermal conductive material is arranged in the groove. A heat dissipation element is arranged on the thermal conductive material, and the thermal conductive material is located between the heat dissipation element and the electronic component.

[0008] Based on the above, the bottom surface of the groove of the sealing layer of the electronic packaging module of at least one embodiment of the present invention exposes the top surface of the electronic component, and a thermal conductive material with a thermal conductivity coefficient between 1W / mK and 200W / mK is disposed between the top surface and the heat dissipation element. In this way, the heat transfer efficiency between the electronic component and the heat dissipation element can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 A cross-sectional view of an electronic packaging module according to an embodiment of the present invention is shown;

[0010] Figure 2 A cross-sectional view of an electronic packaging module according to another embodiment of the present invention is shown;

[0011] FIG. 3A to FIG. 3F A cross-sectional view is shown of a method for manufacturing an electronic packaging module according to an embodiment of the present invention.

[0012]

Explanation of symbols

[0013] 100,200:Electronic packaging module

[0014] 102: Connector pad

[0015] 110,210: Circuit board

[0016] 110f,110s,140f,160f,310f,307f,340f:Surface

[0017] 120,170,190,220:Electronic components

[0018] 120t, 170t, 220t: Top surface

[0019] 140,240: Sealing layer

[0020] 142,242: Groove

[0021] 142b, 242b, 307b: bottom

[0022] 150:Metal layer

[0023] 160,260: Thermally conductive material

[0024] 180,280: Cooling components

[0025] 307: Release material

[0026] 309:Mold

[0027] 310: Initial circuit substrate

[0028] 315: Protective film

[0029] 340: Initial sealing layer

[0030] d1: depth

[0031] S1, S2: Welded structure

[0032] t1, t3: thickness DETAILED DESCRIPTION

[0033] Please refer to Figure 1 At least one embodiment of the present invention discloses an electronic packaging module 100, which includes a circuit substrate 110, an electronic component 120, a sealing layer 140, a thermally conductive material 160, and a heat dissipation component 180. The electronic component 120 is disposed on the circuit substrate 110 and electrically connected to the circuit substrate 110. In detail, the circuit substrate 110 includes a plurality of pads 102 located on a surface 110f, and the pads 102 can be disposed on the electronic component 120 so that the electronic component 120 can be electrically connected to the circuit substrate 110 through the pads 102. The electronic component 120 can be a packaged chip or an unpackaged die.

[0034] In addition, although not shown in the figure, a plurality of solder balls, copper pillars or various solder structures S1 suitable for electrical connection are also provided on the electronic component 120. These solder structures S1 are respectively connected to the pads 102, so that the electronic component 120 can be electrically connected to the circuit substrate 110 through these solder structures S1. In addition, the circuit substrate 110 may also include at least one solder mask (not shown), which can cover the surface 110f of the circuit substrate 110 and expose the pads 102.

[0035] In particular, the electronic component 120 has a top surface 120t facing away from the circuit substrate 110. In this embodiment, the electronic component 120 is disposed on the circuit substrate 110 in a flip chip manner, but the present invention is not limited thereto. In other embodiments, the electronic component 120 may also be disposed on the circuit substrate 110 by wire bonding. In particular, the electronic component 120 has a top surface 120t facing away from the circuit substrate 110.

[0036] In the present embodiment, the electronic packaging module 100 further includes an electronic component 170 and an electronic component 190, wherein the electronic component 170 and the electronic component 190 are both disposed on the circuit substrate 110. The electronic component 120 may be an active component such as a transistor, and the electronic component 170 and the electronic component 190 may be passive components such as a capacitor or an inductor. However, in other embodiments of the present invention, the types of the electronic component 120, the electronic component 170, and the electronic component 190 are not limited thereto. In addition, in various embodiments of the present invention, the number of the electronic component 120, the electronic component 170, and the electronic component 190 is not limited to the present embodiment. In detail, the number of the electronic component 120 may be any integer greater than one (e.g., two), and the number of the electronic component 170 or the electronic component 190 may be any integer greater than zero.

[0037] It is worth mentioning that the electronic component 170 of this embodiment has a top surface 170t away from the circuit substrate 110, and the top surface 170t can protrude from the top surface 120t of the electronic component 120. In other words, on the surface 110f of the circuit substrate 110, the top surface 170t of the electronic component 170 is higher than the top surface 120t of the electronic component 120.

[0038] The sealing layer 140 is disposed on the circuit substrate 110 and covers the electronic component 120. However, the sealing layer 140 does not completely cover the electronic component 120. Figure 1 As shown, the sealing layer 140 includes a groove 142 located on the electronic component 120, and the bottom surface 142b of the groove 142 exposes the top surface 120t of the electronic component 120. However, the sealing layer 140 still covers a portion of the top surface 120t of the electronic component 120. On the other hand, the sealing layer 140 completely covers the top surface 170t of the electronic component 170. The sealing layer 140 may include an insulating material such as an organic resin (e.g., epoxy resin) or the like.

[0039] It is worth mentioning that, in some embodiments, the depth d1 of the groove 142 of the sealing layer 140 may be greater than the thickness t1 of the electronic component 120. Further, the depth d1 of the groove 142 may be 0.5 to 5.0 times the thickness t1 of the electronic component 120. However, the size and proportional relationship between the thickness t1 of the electronic component 120 and the depth d1 of the groove 142 of the sealing layer 140 in each embodiment of the present invention is not limited to the above. That is, in other embodiments, the thickness t1 of the electronic component 120 may also be less than or equal to the depth d1 of the groove 142.

[0040] exist Figure 1 In the embodiment of the present invention, the area of ​​the bottom surface 142b of the groove 142 is smaller than the area of ​​the top surface 120t of the electronic component 120, but the present invention is not limited thereto. The area of ​​the bottom surface 142b of the groove 142 may also be greater than or equal to the area of ​​the top surface 120t of the electronic component 120. For example, please refer to Figure 2 Another embodiment of the electronic packaging module 200 is shown in FIG. The electronic packaging module 200 is similar to the electronic packaging module 100 and also includes a circuit substrate 210, an electronic component 220, a sealing layer 240, a thermal conductive material 260, and a heat dissipation component 280. The difference between the two is that the area of ​​the bottom surface 242b of the groove 242 of the electronic packaging module 200 is larger than the area of ​​the top surface 220t of the electronic component 220.

[0041] Please go back Figure 1 , the thermal conductive material 160 is disposed in the groove 142 of the sealing layer 140 and is located on the top surface 120t of the electronic component 120. The thermal conductive material 160 has a surface 160f away from the electronic component 120, and the sealing layer 140 has a surface 140f away from the circuit substrate 110, wherein the surface 160f of the thermal conductive material 160 is flush with the surface 140f of the sealing layer 140. In detail, the thermal conductive material 160 of this embodiment fills the groove 142 of the sealing layer 140 and does not protrude from the opening of the groove 142.

[0042] The thermal conductive material 160 includes a thermal interface material (TIM), such as thermal conductive paste, thermal conductive sheet, and thermal conductive glue, and the thermal conductivity of these thermal interface materials can fall within the range of 1W / mK to 200W / mK. Since the thermal conductive material 160 is located above the top surface 120t of the electronic component 120, it is beneficial to transfer the heat generated by the electronic component 120 (upward) to the side away from the circuit substrate 110.

[0043] In addition, the electronic packaging module 100 of this embodiment further includes a metal layer 150. The metal layer 150 is disposed on the sealing layer 140 and covers the electronic components 120 and the sealing layer 140. The metal layer 150 is electrically connected to the circuit substrate 110 so that the electronic components 120 (as well as the electronic components 170 and the electronic components 190) in the electronic packaging module 100 can be electromagnetically shielded from the outside world. In detail, the metal layer 150 can cover the side surface (not shown) of the sealing layer 140 and extend to the circuit substrate 110, and then be electrically connected to the ground layer (not shown) in the circuit substrate 110. However, the present invention is not limited to this embodiment. In other embodiments, the electronic packaging module 100 may not include the metal layer 150.

[0044] It is worth mentioning that a portion of the metal layer 150 is located between the electronic component 120 and the thermally conductive material 160, and this portion of the metal layer 150 directly contacts the top surface 120t of the electronic component 120 and the thermally conductive material 160. Since the material of the metal layer 150 may include metal materials with a high thermal conductivity such as stainless steel, copper and titanium, when the metal layer 150 directly contacts the electronic component 120 and the thermally conductive material 160 respectively, it is more conducive to conduct the heat generated by the electronic component 120 to the thermally conductive material 160.

[0045] The heat dissipation element 180 is disposed on the surface 160f of the thermally conductive material 160, and the thermally conductive material 160 is located between the electronic component 120 and the heat dissipation element 180. The heat dissipation element 180 may be a heat dissipation structure such as a heat dissipation fin, and the material of the heat dissipation element 180 may include copper, aluminum, similar metal materials or alloys thereof. In some embodiments, the heat dissipation element 180 may directly contact the surface 160f of the thermally conductive material 160, while in other embodiments, the heat dissipation element 180 may be attached to the surface 160f of the thermally conductive material 160 through a bonding material (not shown). The smaller the thickness of the bonding material, the more conducive it is to improving the heat transfer efficiency between the thermally conductive material 160 and the heat dissipation element 180.

[0046] The electronic packaging module 100 further includes a plurality of soldering structures S2, which are disposed on the surface 110s of the circuit substrate 110 (through the pads 102), wherein the surface 110f and the surface 110s of the circuit substrate 110 are respectively located on opposite sides of the circuit substrate 110. The electronic packaging module 100 can be electrically connected to other external components, such as a main board, through the soldering structures S2.

[0047] At least one embodiment of the present invention provides a method for manufacturing the electronic packaging module 100, comprising: FIG. 3A to FIG. 3F A series of steps in the present invention are used to illustrate at least one embodiment of the present invention. Figure 3AFirst, an initial circuit substrate 310 is provided. The initial circuit substrate 310 includes a surface 310f and a plurality of pads 102 exposed on the surface 310f. Then, the electronic component 120 can be arranged on the initial circuit substrate 310 by, for example, welding. That is, the electronic component 120 is connected to the pad 102 of the initial circuit substrate 310 through the welding structure S1, so that the electronic component 120 is electrically connected to the initial circuit substrate 310. In addition, this step also includes arranging the electronic component 170 and the electronic component 190 on (the pad 102 of) the initial circuit substrate 310.

[0048] Please refer to Figure 3B , after the electronic component 120 (as well as the electronic component 170 and the electronic component 190) is arranged, a release material 307 is arranged on the top surface 120t of the electronic component 120. The release material 307 may include a silicone polymer, such as silicone. It is particularly mentioned that the release material 307 directly contacts the top surface 120t of the electronic component 120. In the present embodiment, the area of ​​the bottom surface 307b of the release material 307 is smaller than the top surface 120t of the electronic component 120, and the thickness t3 of the release material 307 is smaller than the thickness t1 of the electronic component 120. However, the present invention is not limited thereto, and in various embodiments, the size (including the bottom surface area or thickness) of the release material 307 can be adjusted according to the heat dissipation requirements of the electronic packaging module 100.

[0049] In addition, the shape of the release material 307 is not limited to the truncated cone (trapezoidal in cross-sectional view) of the present embodiment, and the three-dimensional shape of the release material 307 can also be various three-dimensional shapes such as a cube, a cylinder, or a triangular prism. Figure 3C ) is greater than or equal to the area of ​​the bottom surface 307b. In this way, the release material 307 can be more easily removed in a series of subsequent steps.

[0050] After the release material 307 is provided, an initial sealing layer 340 is formed on the initial circuit substrate 310 so that the initial sealing layer 340 covers the electronic component 120 and the release material 307. Figure 3C As shown, a mold 309 is first placed on the release material 307, and the mold 309 covers the initial circuit substrate 310, the electronic component 120, the electronic component 170, the electronic component 190 and the release material 307. It is particularly noted that a protective film 315 is provided between the mold 309 and the release material 307, and the protective film 315 can serve as a buffer layer between the mold 309 and the release material 307. The protective film 315 can be a layer of polyimide (PI) film or a similar polymer film.

[0051] Next, a fluid sealing material (not shown) is filled between the surface 310f of the initial circuit substrate 310 and the mold 309, and the sealing material covers the electronic components 120, the electronic components 170, the electronic components 190 and the release material 307. After the sealing material is cured, an initial sealing layer 340 is formed on the initial circuit substrate 310. The initial sealing layer 340 has a surface 340f away from the initial circuit substrate 310, and the release material 307 has a surface 307f away from the initial circuit substrate 310. The surface 340f of the initial sealing layer 340 exposes the surface 307f of the release material 307, and the surface 340f is flush with the surface 307f.

[0052] Please refer to Figure 3D After the initial sealing layer 340 is formed, the mold 309 and the protective film 315 are removed. It is worth mentioning that in the present embodiment, the protective film 315 may be an adhesive film (e.g., a polyimide tape) having adhesion, and is attached to the release material 307. Therefore, when the protective film 315 is removed, the release material 307 is also removed along with the protective film 315 to form the groove 142 and expose the top surface 120t of the electronic component 120.

[0053] After the groove 142 is formed, the initial circuit substrate 310 and the initial sealing layer 340 can be cut by mechanical cutting, laser cutting, or ion beam cutting to form the following structures: Figure 1 The circuit substrate 110 and the sealing layer 140 are shown.

[0054] Please refer to Figure 3E The steps of this embodiment further include depositing a metal layer 150 on the sealing layer 140 by physical vapor deposition, such as sputtering, after forming the circuit substrate 110 and the sealing layer 140, so that the metal layer 150 covers the sealing layer 140 (covering the surface 140f and the side surface of the sealing layer 140) and the top surface 120t of the electronic component 120. In this way, a portion of the metal layer 150 is distributed inside the groove 142.

[0055] Next, please refer to Figure 3F , a heat conductive material 160 is disposed in the groove 142 . The heat conductive material 160 is disposed on the metal layer 150 inside the groove 142 , that is, a portion of the metal layer 150 inside the groove 142 is located between the electronic component 120 and the heat conductive material 160 .

[0056] Next, a heat dissipation element 180 (shown in FIG. 1 ) is disposed on the thermally conductive material 160. Figure 1), wherein the thermally conductive material 160 is located between the heat dissipation element 180 and the electronic element 120. It is particularly worth mentioning that the steps of this embodiment also include disposing the welding structure S2 on the surface 110s of the circuit substrate 110 by, for example, pre-soldering. Although this embodiment disposes the welding structure S2 on the circuit substrate 110 before forming the metal layer 150, the present invention is not limited to this. In other embodiments, the welding structure S2 may be disposed on the circuit substrate 110 after the metal layer 150 is formed. So far, the process has been substantially completed. Figure 1 The electronic package module 100 is shown.

[0057] In summary, at least one embodiment of the present invention exposes the top surface of the electronic component through the bottom surface of the groove of the sealing layer, and arranges a thermal conductive material with a thermal conductivity coefficient between 1W / mK and 200W / mK between the top surface and the heat dissipation component. In this way, the heat transfer efficiency between the electronic component and the heat dissipation component can be improved.

[0058] On the other hand, at least one embodiment of the present invention sets a release material on the top surface of the electronic component before forming the sealing layer, and then forms the sealing layer covering the electronic component. Therefore, after removing the release material, a groove can be formed on the top surface of the electronic component and the top surface of the electronic component can be exposed without cutting, grinding or drilling. In addition, since the release material includes a silicone polymer such as silicone, the release material will not react with the sealing layer (including epoxy resin) to form a bond. Therefore, there is no need to additionally set a release layer (e.g., pyrolytic adhesive) between the release material and the sealing layer. In the process of removing the release material, additional removal steps such as pyrolysis or UV photolysis can be omitted, thereby reducing the manufacturing cost of electronic packaging components.

[0059] Although the present invention has been disclosed as above by way of embodiments, they are not intended to limit the present invention. A person having ordinary knowledge in the technical field to which the present invention belongs may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the definition of the attached claims.

Claims

1. An electronic packaging module, characterized in that: Include: a circuit substrate; a first electronic component disposed on the circuit substrate and electrically connected to the circuit substrate, wherein the first electronic component has a first top surface facing away from the circuit substrate; a sealing layer, disposed on the circuit substrate and covering the first electronic component, wherein the sealing layer comprises a groove located on the first electronic component, and a bottom surface of the groove exposes the first top surface of the first electronic component; a heat-conducting material disposed in the groove of the sealing layer and located on the first top surface of the first electronic component, wherein the heat-conducting material has a first surface away from the first electronic component, and the sealing layer has a second surface away from the circuit substrate, wherein the first surface is flush with the second surface; as well as A heat dissipation element is disposed on the first surface of the thermally conductive material, and the thermally conductive material is located between the first electronic element and the heat dissipation element.

2. The electronic packaging module according to claim 1, characterized in that: The depth of the groove is greater than the thickness of the first electronic component.

3. The electronic packaging module according to claim 2, characterized in that: The depth of the groove is 0.5 to 5.0 times the thickness of the first electronic component.

4. The electronic packaging module according to claim 1, characterized in that: An area of ​​the bottom surface of the groove is larger than an area of ​​the first top surface of the first electronic component.

5. The electronic packaging module according to claim 1, characterized in that: Also includes: A metal layer is disposed on the sealing layer and covers the first electronic component and the sealing layer, wherein a portion of the metal layer is located between the first electronic component and the thermally conductive material, and the portion of the metal layer directly contacts the first top surface of the first electronic component and the thermally conductive material, wherein the metal layer is electrically connected to the circuit substrate.

6. The electronic packaging module according to claim 1, characterized in that: The thermally conductive material comprises a thermal interface material.

7. The electronic packaging module according to claim 1, characterized in that: Also includes: A second electronic component is disposed on the circuit substrate, wherein the second electronic component has a second top surface away from the circuit substrate and the second top surface protrudes from the first top surface of the first electronic component, wherein the sealing layer covers the second top surface of the second electronic component.

8. A method for manufacturing an electronic packaging module, characterized in that: Include: Providing an initial circuit substrate; Disposing an electronic component on the initial circuit substrate; After the electronic component is disposed, a release material is disposed on a top surface of the electronic component, wherein the release material directly contacts the top surface; After the release material is provided, an initial sealing layer is formed on the initial circuit substrate, so that the initial sealing layer covers the electronic component and the release material, wherein the initial sealing layer has a first surface away from the initial circuit substrate, and the release material has a second surface away from the initial circuit substrate, wherein the first surface exposes the second surface, and the first surface is flush with the second surface; After forming the initial sealing layer, removing the release material to form a groove and exposing the top surface of the electronic component; After forming the groove, cutting the initial circuit substrate and the initial sealing layer to form a circuit substrate and a sealing layer respectively; Disposing a heat conductive material in the groove; as well as A heat dissipation element is arranged on the heat conductive material, wherein the heat conductive material is located between the heat dissipation element and the electronic element.

9. The method according to claim 8, characterized in that The release material includes a silicone polymer.

10. The method according to claim 8, characterized in that Also includes: After forming the circuit substrate and the sealing layer, depositing a metal layer on the sealing layer so that the metal layer covers the sealing layer and the top surface of the electronic component; wherein the metal layer is electrically connected to the circuit substrate; A portion of the metal layer is located between the electronic component and the thermal conductive material.

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