Buck-boost circuit and energy storage power supply

Abstract

The invention relates to a buck-boost circuit and an energy storage power supply. The buck-boost circuit comprises a first switch module, a second switch module and at least one buck-boost module. Wherein the buck-boost module comprises an inductance element, a first transistor and a second transistor; the first end of the inductance element is connected with the first switch module and the second switch module, the second end of the inductance element is connected with the first transistor and the second transistor, the first transistor is connected with the first switch module and the second switch module, and the first switch module is further connected with the input end and the output end of the buck-boost circuit. The second switch module is further connected with the input end and the output end of the buck-boost circuit. By adopting the buck-boost circuit, the hardware cost can be reduced.

Description

Technical Field

[0001] The present application relates to the field of energy storage technology, and in particular to a step-up / step-down circuit and an energy storage power supply. Background Art

[0002] Buck-boost circuits are widely used in switching power supplies such as energy storage inverters to achieve voltage step-up and step-down conversions to meet the specific requirements of different devices for input voltage.

[0003] However, the hardware cost of the currently widely used buck-boost circuit is relatively high. Therefore, how to propose a buck-boost circuit with relatively low hardware cost is a key research topic for researchers in this field. Summary of the invention

[0004] Based on this, it is necessary to provide a buck-boost circuit and energy storage power supply that can reduce hardware costs in response to the above technical problems.

[0005] In a first aspect, the present application provides a buck-boost circuit, the buck-boost circuit comprising a first switch module, a second switch module and at least one buck-boost module; the buck-boost module comprises an inductor, a first transistor and a second transistor; the first end of the inductor is respectively connected to the first switch module and the second switch module, the second end of the inductor is respectively connected to the first transistor and the second transistor, the first transistor is respectively connected to the first switch module and the second switch module, the first switch module is also respectively connected to the input end and the output end of the buck-boost circuit, and the second switch module is also respectively connected to the input end and the output end of the buck-boost circuit;

[0006] A buck-boost circuit, used for, when the first switch module is in the on state and the second switch module is in the off state, to enable the buck-boost circuit to operate in a boost mode through the first switch module and the buck-boost module;

[0007] The buck-boost circuit is also used to enable the buck-boost circuit to operate in a buck mode through the second switch module and the buck-boost module when the first switch module is in an open state and the second switch module is in a closed state.

[0008] In one embodiment, the buck-boost circuit includes a plurality of buck-boost modules connected in parallel.

[0009] In one of the embodiments, the first switch module includes a first switch unit and a second switch unit;

[0010] The first switch unit is arranged between the first end of the inductor element and the input end of the buck-boost circuit, and the second switch unit is arranged between the first transistor and the output end of the buck-boost circuit.

[0011] In one embodiment, the second switch module includes a third switch unit and a fourth switch unit;

[0012] A first end of the third switch unit is connected to the input end of the buck-boost circuit, and a second end of the third switch unit is connected to the first transistor and the second switch unit respectively;

[0013] The first end of the fourth switch unit is connected to the first switch unit and the first end of the inductor element respectively, and the second end of the fourth switch unit is connected to the second switch unit and the output end of the buck-boost circuit respectively.

[0014] In one embodiment, the first end of the third switch unit is also connected to the first switch unit.

[0015] In one embodiment, the buck-boost circuit further includes a first energy storage module, and the first energy storage module is connected to the first switch unit and the first end of the inductor element respectively.

[0016] In one of the embodiments, the first energy storage module includes a first energy storage unit and a second energy storage unit;

[0017] The first end of the first energy storage unit is arranged between the first switch unit and the first end of the inductor element, and the second end of the first energy storage unit is grounded;

[0018] The first end of the second energy storage unit is disposed between the first end of the first energy storage unit and the first end of the inductor element, and the second end of the second energy storage unit is grounded.

[0019] In one of the embodiments, the buck-boost circuit further includes a second energy storage module, and the second energy storage module is connected to the first transistor and the second switch unit respectively.

[0020] In one embodiment, the second energy storage module includes a third energy storage unit and a fourth energy storage unit;

[0021] A first end of the third energy storage unit is disposed between the first transistor and the second switch unit, and a second end of the third energy storage unit is grounded;

[0022] The first end of the fourth energy storage unit is arranged between the first transistor and the first end of the third energy storage unit, and the second end of the fourth energy storage unit is grounded.

[0023] In a second aspect, the present application further provides an energy storage power supply, which includes any one of the above-mentioned buck-boost circuits.

[0024] The buck-boost circuit and energy storage power supply, the buck-boost circuit includes a first switch module, a second switch module and at least one buck-boost module. The buck-boost module includes an inductor, a first transistor and a second transistor. Since the first end of the inductor is connected to the first switch module and the second switch module respectively, the second end of the inductor is connected to the first transistor and the second transistor respectively, the first transistor is connected to the first switch module and the second switch module respectively, the first switch module is also connected to the input end and the output end of the buck-boost circuit respectively, and the second switch module is also connected to the input end and the output end of the buck-boost circuit respectively, therefore, the buck-boost circuit can be operated in a boost mode through the first switch module and the buck-boost module when the first switch module is in a conducting state and the second switch module is in a disconnected state, and the buck-boost circuit can be operated in a buck mode through the second switch module and the buck-boost module when the first switch module is in a disconnected state and the second switch module is in a closed state. In this way, the boost mode and buck mode of the buck-boost circuit can be realized by only two first transistors and a second transistor, that is, only two PWM drive signals are needed, which reduces the resource occupancy rate of PWM and does not cause transistors to be idle, thereby reducing hardware costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the drawings required for use in the embodiments of the present application or related technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 It is a schematic diagram of a buck-boost circuit in the related art;

[0027] Figure 2 It is a schematic diagram of another buck-boost circuit in the related art;

[0028] Figure 3 is a schematic diagram of a buck-boost circuit in one embodiment;

[0029] Figure 4 is a schematic diagram of yet another buck-boost circuit in an embodiment;

[0030] Figure 5 is a schematic diagram of yet another buck-boost circuit in an embodiment;

[0031] Figure 6 is a schematic diagram of yet another buck-boost circuit in an embodiment;

[0032] Figure 7is a schematic diagram of yet another buck-boost circuit in an embodiment;

[0033] Figure 8 is a schematic diagram of yet another buck-boost circuit in an embodiment;

[0034] Fig. 9 is a schematic diagram of yet another buck-boost circuit in an embodiment;

[0035] Fig.10 is a schematic diagram of yet another buck-boost circuit in an embodiment;

[0036] Fig.11 Schematic diagram of an energy storage power supply in one embodiment. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0038] In the application of switching power supplies such as energy storage inverters, many direct current (DC) circuits use buck-boost circuits. For example, buck-boost circuits can be used in 24V (volt), 48V, 72V battery charging and discharging circuits, photovoltaic (PV) circuits, high and low voltage circuits, etc. Figure 1 and Figure 2 The schematic diagram of the buck-boost circuit in the related art is shown in FIG. Figure 1 or Figure 2 topology.

[0039] Please refer to Figure 1 ,exist Figure 1 In the buck-boost circuit shown, synchronous freewheeling is achieved through a Schottky diode. Figure 1 In the boost mode of the buck-boost circuit shown, the switch tube Q1 is normally turned on, the diode D2 is normally turned off, and the diode D1 and the switch tube Q2 are turned on and off in a complementary manner. Figure 1 In the buck mode, the diode D1 is always on, the Q2 switch is always off, and the diode D1 and the Q1 switch are turned on and off complementary to each other. This method is simple to control with software, and only two pulse width modulations (PWM) are needed to control the Q1 switch and the Q2 switch, which does not occupy a high resource of the PWM in the microcontroller unit (MCU).

[0040] However, Figure 1The buck-boost circuit shown has high losses, especially when used in high-frequency circuits above 200KHz (kilohertz) based on third-generation semiconductors such as silicon carbide (SiC) or gallium nitride (GaN). Figure 1 The buck-boost circuit shown in the figure uses diodes D1 and D2 for passive rectification, which has high losses, especially when used in high-frequency circuits above 200KHz. In addition, in medium and high voltage applications, the selection of diodes D1 and D2 is relatively difficult, and the cost is also high.

[0041] In some application scenarios, in order to increase the power of the buck-boost circuit, two sets of the same buck-boost circuits are connected together, but the number of Q1 switch tubes, Q2 switch tubes, diodes D1 and D2 will increase exponentially, and the cost of a single SiC or GaN tube is much higher than that of an ordinary metal-oxide-semiconductor field-effect transistor (MOS tube). In addition, the overcurrent of a single SiC or GaN tube is relatively small, and the application technology of parallel tubes is not mature, so it is difficult to increase the power of the buck-boost circuit. In addition, if there are multiple sets of circuits, the layout area of ​​the printed circuit board (PCB) will also increase exponentially, making it difficult to achieve high-frequency miniaturized design.

[0042] Please refer to Figure 2 ,exist Figure 2 In the buck-boost circuit shown, diodes D1 and D2 are replaced with SiC or GaN switches Q3 and Q4. Figure 2 In the boost mode of the buck-boost circuit shown, the Q2 switch tube is normally turned on, the Q4 switch tube is normally turned off, and the Q1 switch tube and the Q3 switch tube are turned on and off in a complementary manner. Figure 2 In the buck-boost circuit shown in the figure, in buck mode, the Q1 switch is always on, the Q3 switch is always off, and the Q2 switch and the Q4 switch are turned on and off in a complementary manner. Figure 2 In the process, the efficiency of the buck-boost circuit is improved, but Figure 2 The structure also faces the problem of high cost in high-power design, and has a high resource utilization rate of PWM in the MCU. In addition, the buck-boost circuit is in boost mode or buck mode most of the time. Since two PWMs are required to control the Q3 switch tube and Q4 switch tube, both switches will be idle regardless of whether they are working in boost mode or buck mode. In addition, the two bridge arms in the buck-boost circuit must be processed for electromagnetic compatibility (EMC), which makes the hardware more difficult.

[0043] Based on this, in order to solve the above technical problems, it is necessary to provide a buck-boost circuit. The buck-boost circuit provided by the present application will be introduced in detail below.

[0044] Figure 3 FIG. 1 is a schematic diagram of a buck-boost circuit in an embodiment, Figure 3 As shown, the buck-boost circuit 100 includes a first switch module 101 , a second switch module 103 and at least one buck-boost module 102 .

[0045] The first switch module 101 may include at least one switch element with a switch function, such as a diode, a photoelectric switch, or a relay, and the second switch module 103 is similar to the first switch module 101 and will not be described in detail herein. It should be noted that the switch element in the first switch module 101 and the switch element in the second switch module 103 may be the same or different, and this embodiment does not limit the type and quantity of the switch elements included in the first switch module 101 and the second switch module 103.

[0046] Further, the buck-boost module 102 includes an inductor element 1021, a first transistor 1022, and a second transistor 1023. The inductor element 1021 may include at least one inductor.

[0047] The first end of the inductor element 1021 is connected to the first switch module 101 and the second switch module 103 respectively, and the second end of the inductor element 1021 is connected to the first transistor 1022 and the second transistor 1023 respectively. The first transistor 1022 is connected to the first switch module 101 and the second switch module 103 respectively, the first switch module 101 is also connected to the input end 104 and the output end 105 of the buck-boost circuit 100 respectively, and the second switch module 103 is also connected to the input end 104 and the output end 105 of the buck-boost circuit 100 respectively.

[0048] The input terminal 104 of the buck-boost circuit 100 can be used to receive a DC input positive voltage, and the output terminal 105 of the buck-boost circuit 100 can be used to output a DC output positive voltage. Further optionally, the first transistor 1022 and the second transistor 1023 are complementary and turned on.

[0049] Please continue to refer to Figure 3, the buck-boost circuit 100 is used to make the buck-boost circuit work in a boost mode through the first switch module 101 and the buck-boost module 102 when the first switch module 101 is in an on state and the second switch module 103 is in an off state. Further optionally, when the buck-boost circuit 100 works in a boost mode, the first switch module 101 and the buck-boost module 102 can form a boost loop. For example, the input end 104 of the buck-boost circuit 100 passes through the first switch module 101, the inductor element 1021, the first transistor 1022, and the first switch module 101 in sequence to reach the output end 105 of the buck-boost circuit 100.

[0050] The buck-boost circuit 100 is also used to make the buck-boost circuit work in a buck mode through the second switch module 103 and the buck-boost module 102 when the first switch module 101 is in an open state and the second switch module 103 is in a closed state. Further optionally, when the buck-boost circuit 100 works in the buck mode, the second switch module 103 and the buck-boost module 102 can form a buck loop. For example, the input end 104 of the buck-boost circuit 100 passes through the second switch module 103, the first transistor 1022, the inductor element 1021, and the second switch module 103 in sequence to reach the output end 105 of the buck-boost circuit 100.

[0051] In one embodiment, the first switch module 101 and the second switch module 103 only have conduction losses, and can use ordinary MOS tubes, insulated gate bipolar transistors (IGBT) or relays, which are low-cost and easy to select, and are conducive to subsequent power expansion, so as to be suitable for application scenarios with a wide voltage input range.

[0052] In the buck-boost circuit 100 , the buck-boost circuit 100 includes a first switch module 101 , a second switch module 103 and at least one buck-boost module 102 . The buck-boost module 102 includes an inductor 1021 , a first transistor 1022 and a second transistor 1023 . Since the first end of the inductor element 1021 is respectively connected to the first switch module 101 and the second switch module 103, the second end of the inductor element 1021 is respectively connected to the first transistor 1022 and the second transistor 1023, the first transistor 1022 is respectively connected to the first switch module 101 and the second switch module 103, the first switch module 101 is also respectively connected to the input end 104 and the output end 105 of the buck-boost circuit 100, and the second switch module 103 is also respectively connected to the input end 104 and the output end 105 of the buck-boost circuit 100, therefore, the buck-boost circuit 100 can be operated in a boost mode through the first switch module 101 and the buck-boost module 102 when the first switch module 101 is in an on state and the second switch module 103 is in an off state, and the buck-boost circuit can be operated in a buck mode through the second switch module 103 and the buck-boost module 102 when the first switch module 101 is in an off state and the second switch module 103 is in a closed state. In this way, the boost mode and the buck mode of the buck-boost circuit can be realized by only two first transistors 1022 and the second transistor 1023, that is, only two PWM drive signals are needed, which reduces the resource occupancy rate of PWM and does not cause the transistors to be idle, thereby reducing the hardware cost.

[0053] Figure 4 FIG. 1 is a schematic diagram of another buck-boost circuit in an embodiment. In an exemplary embodiment, optionally, the buck-boost circuit 100 includes a plurality of buck-boost modules 102 connected in parallel. It should be noted that: Figure 4 Taking three buck-boost modules 102 connected in parallel as an example, this embodiment does not limit the number of buck-boost modules 102 connected in parallel.

[0054] In the above embodiment, since the buck-boost circuit 100 includes a plurality of buck-boost modules 102 connected in parallel, the power expansion of the buck-boost circuit 100 can be achieved through the buck-boost modules 102 connected in parallel, and the relative cost of increasing the power is lower.

[0055] Figure 5 is a schematic diagram of yet another buck-boost circuit in an embodiment. In an exemplary embodiment, optionally, the first switch module 101 includes a first switch unit 1011 and a second switch unit 1012 .

[0056] Among them, the first switch unit 1011 may include at least one switch element with a switch function such as a diode, a photoelectric switch, a relay, etc., and the second switch unit 1012 is similar to the first switch unit 1011, and will not be repeated here. Similarly, the switch element in the first switch unit 1011 and the switch element in the second switch unit 1012 may be the same or different, and this embodiment does not limit the type and quantity of the switch elements included in the first switch unit 1011 and the second switch unit 1012.

[0057] The first switch unit 1011 is disposed between the first end of the inductor 1021 and the input end 104 of the buck-boost circuit 100 , and the second switch unit 1012 is disposed between the first transistor 1022 and the output end 105 of the buck-boost circuit 100 .

[0058] Please continue to refer to Figure 5 If the first switch module 101 is in the on state and the second switch module 103 is in the off state, then when the second transistor 1023 is in the on state and the first transistor 1022 is in the off state, the input end 104 of the buck-boost circuit stores energy for the inductor element 1021 through the first switch unit 1011; when the second transistor 1023 is in the off state and the first transistor 1022 is in the on state, the input end 104 of the buck-boost circuit 100 passes through the first switch unit 1011, the inductor element 1021, the first transistor 1022, and the second switch unit 1012 in sequence to reach the output end 105 of the buck-boost circuit 100, and the output end 105 of the buck-boost circuit 100 is boosted through the inductor element 1021.

[0059] In the above embodiment, since the first switch module 101 includes the first switch unit 1011 and the second switch unit 1012, and the first switch unit 1011 is arranged between the first end of the inductor element 1021 and the input end 104 of the buck-boost circuit 100, and the second switch unit 1012 is arranged between the first transistor 1022 and the output end 105 of the buck-boost circuit 100, therefore, when the first switch module 101 is in the on state and the second switch module 103 is in the off state, the buck-boost circuit can be operated in the boost mode through the first switch module 101 and the buck-boost module 102, so that the buck-boost circuit 100 enters the boost mode.

[0060] Please continue to refer to Figure 5 In an exemplary embodiment, optionally, the second switch module 103 includes a third switch unit 1031 and a fourth switch unit 1032 .

[0061] Among them, the first end of the third switch unit 1031 is connected to the input end 104 of the buck-boost circuit 100, and the second end of the third switch unit 1031 is respectively connected to the first transistor 1022 and the second switch unit 1012; the first end of the fourth switch unit 1032 is respectively connected to the first switch unit 1011 and the first end of the inductor element 1021, and the second end of the fourth switch unit 1032 is respectively connected to the second switch unit 1012 and the output end 105 of the buck-boost circuit 100.

[0062] Similarly, the third switch unit 1031 may include at least one switching element with a switching function such as a diode, a photoelectric switch, a relay, etc. The fourth switch unit 1032 is similar to the third switch unit 1031 and will not be described in detail here. The switching element in the third switch unit 1031 may be the same as or different from the switching element in the fourth switch unit 1032. This embodiment does not limit the type and quantity of the switching elements included in the third switch unit 1031 and the fourth switch unit 1032. In an exemplary embodiment, the third switch unit 1031 may be a single-pole multi-throw switch formed with other switch elements. Further optionally, the third switch unit 1031 may form a single-pole multi-throw switch with the first switch unit 1011, for example, a single-pole double-throw switch.

[0063] Please continue to refer to Figure 5 If the first switch module 101 is in the open state and the second switch module 103 is in the closed state, the input end 104 of the buck-boost circuit 100 passes through the third switch unit 1031, the first transistor 1022, the inductor element 1021, and the fourth switch unit 1032 to reach the output end 105 of the buck-boost circuit 100, and the output end 105 of the buck-boost circuit 100 is stepped down through the energy storage of the inductor element 1021.

[0064] In the above embodiment, since the second switch module 103 includes the third switch unit 1031 and the fourth switch unit 1032, and the first end of the third switch unit 1031 is connected to the input end 104 of the buck-boost circuit 100, and the second end of the third switch unit 1031 is respectively connected to the first transistor 1022 and the second switch unit 1012; the first end of the fourth switch unit 1032 is respectively connected to the first end of the first switch unit 1011 and the inductor element 1021, and the second end of the fourth switch unit 1032 is respectively connected to the second switch unit 1012 and the output end 105 of the buck-boost circuit 100, therefore, when the first switch module 101 is in an open state and the second switch module 103 is in a closed state, the buck-boost circuit is operated in the buck mode through the second switch module 103 and the buck-boost module 102.

[0065] Figure 6FIG. 1 is a schematic diagram of another buck-boost circuit in an embodiment. As shown in the figure, in an exemplary embodiment, optionally, the first end of the third switch unit 1031 is also connected to the first switch unit 1011. That is, the first end of the third switch unit 1031 can be arranged between the input end 104 of the buck-boost circuit 100 and the first switch unit 1011.

[0066] In the above embodiment, since the first end of the third switch unit 1031 is also connected to the first switch unit 1011 , the configuration flexibility of the third switch unit 1031 is improved.

[0067] Figure 7 FIG. 1 is a schematic diagram of another buck-boost circuit in an embodiment, Figure 7 As shown, in an exemplary embodiment, optionally, the buck-boost circuit 100 further includes a first energy storage module 106, and the first energy storage module 106 is respectively connected to the first switch unit 1011 and the first end of the inductor element 1021. The first energy storage module 106 may include at least one element for energy storage such as a capacitor and a battery.

[0068] It should be noted that Figure 7 So Figure 5 Based on the example, in some embodiments, Figure 6 Based on, the first end of the third switch unit 1031 can also be connected to the first switch unit 1011.

[0069] In the above embodiment, since the buck-boost circuit 100 also includes a first energy storage module 106, the first energy storage module 106 is connected to the first switch unit 1011 and the first end of the inductor element 1021 respectively. Therefore, the working stability of the buck-boost circuit 100 is further improved by the first energy storage module 106.

[0070] Please continue to refer to Figure 7 In an exemplary embodiment, optionally, the first energy storage module 106 includes a first energy storage unit 1061 and a second energy storage unit 1062 .

[0071] The first energy storage unit 1061 and the second energy storage unit 1062 may each include at least one element for energy storage, such as a capacitor and a battery. The first end of the first energy storage unit 1061 is disposed between the first switch unit 1011 and the first end of the inductor element 1021, and the second end of the first energy storage unit 1061 is grounded. The first end of the second energy storage unit 1062 is disposed between the first end of the first energy storage unit 1061 and the first end of the inductor element 1021, and the second end of the second energy storage unit 1062 is grounded.

[0072] In the above embodiment, since the first energy storage module 106 includes the first energy storage unit 1061 and the second energy storage unit 1062, and the first end of the first energy storage unit 1061 is arranged between the first switch unit 1011 and the first end of the inductor element 1021, and the second end of the first energy storage unit 1061 is grounded; the first end of the second energy storage unit 1062 is arranged between the first end of the first energy storage unit 1061 and the first end of the inductor element 1021, and the second end of the second energy storage unit 1062 is grounded, therefore, the working stability of the buck-boost circuit 100 can be improved by the first energy storage module 106.

[0073] Please continue to refer to Figure 7 In an exemplary embodiment, optionally, the buck-boost circuit 100 further includes a second energy storage module 107, and the second energy storage module 107 is respectively connected to the first transistor 1022 and the second switch unit 1012. Similarly, the second energy storage module 107 may include at least one element for energy storage such as a capacitor and a battery.

[0074] In the above embodiment, since the buck-boost circuit 100 further includes the second energy storage module 107 , the second energy storage module 107 is respectively connected to the first transistor 1022 and the second switch unit 1012 . Therefore, the working stability of the buck-boost circuit 100 can be improved by the second energy storage module 107 .

[0075] Please continue to refer to Figure 7 In an exemplary embodiment, optionally, the second energy storage module 107 includes a third energy storage unit 1071 and a fourth energy storage unit 1072 .

[0076] The third energy storage unit 1071 and the fourth energy storage unit 1072 may each include at least one element for energy storage, such as a capacitor and a battery. The first end of the third energy storage unit 1071 is disposed between the first transistor 1022 and the second switch unit 1012, and the second end of the third energy storage unit 1071 is grounded; the first end of the fourth energy storage unit 1072 is disposed between the first transistor 1022 and the first end of the third energy storage unit 1071, and the second end of the fourth energy storage unit 1072 is grounded.

[0077] In the above embodiment, since the second energy storage module 107 includes the third energy storage unit 1071 and the fourth energy storage unit 1072, and the first end of the third energy storage unit 1071 is arranged between the first transistor 1022 and the second switch unit 1012, and the second end of the third energy storage unit 1071 is grounded; the first end of the fourth energy storage unit 1072 is arranged between the first transistor 1022 and the first end of the third energy storage unit 1071, and the second end of the fourth energy storage unit 1072 is grounded, therefore, the working stability of the buck-boost circuit 100 can be improved by the second energy storage module 107.

[0078] In an exemplary embodiment, optionally, the buck-boost circuit 100 may further include a first relay and / or a second relay, wherein the first relay is respectively connected between the input terminal 104 of the buck-boost circuit 100 and the first terminal of the third switch unit 1031, and the second relay is respectively connected to the second terminal of the fourth switch unit 1032 and the output terminal 105 of the buck-boost circuit 100. In this way, the working state of the buck-boost circuit 100 can be efficiently controlled by the first relay and / or the second relay.

[0079] In order to more clearly describe the buck-boost circuit 100 of the present application, Figure 8~Figure 10 Provide explanation. Figure 8 , Fig. 9 and Fig.10 They are schematic diagrams of yet another buck-boost circuit in one embodiment. Figure 8~Figure 10 , DC_IN+ represents the input terminal 104 of the buck-boost circuit 100, DC_OUT+ represents the output terminal 105 of the buck-boost circuit 100, and GND represents grounding. RLY1 represents the first relay, and RLY2 represents the second relay. The first energy storage unit 1061 includes a capacitor CE1, and the second energy storage unit 1062 includes a capacitor C2. The third energy storage unit 1071 includes a capacitor CE2, and the fourth energy storage unit 1072 includes a capacitor C1.

[0080] like Figure 8 As shown, Figure 8 Take a buck-boost module as an example. Figure 8 In the embodiment, the first switch unit 1011 includes a transistor Q2, the second switch unit 1012 includes a transistor Q3, the inductor element 1021 includes an inductor LD1, the first transistor 1022 includes a transistor Q4, the second transistor 1023 includes a transistor Q5, the third switch unit 1031 includes a transistor Q8 and a transistor Q1 connected to each other, and the fourth switch unit 1032 includes a transistor Q6 and a transistor Q7 connected to each other.

[0081] like Fig. 9 As shown, Fig. 9 Take two parallel buck-boost modules as an example. Fig. 9, the first switch unit 1011 includes a transistor Q2, and the second switch unit 1012 includes a transistor Q3. The inductor element 1021 of the first buck-boost module includes an inductor LD1, the first transistor 1022 of the first buck-boost module includes a transistor Q4, the second transistor 1023 of the first buck-boost module includes a transistor Q5, the inductor element 1021 of the second buck-boost module includes an inductor LD2, the first transistor 1022 of the second buck-boost module includes a transistor Q6, and the second transistor 1023 of the second buck-boost module includes a transistor Q7. The third switch unit 1031 includes a diode D2 and a transistor Q1 connected to each other, and the fourth switch unit 1032 includes a diode D1.

[0082] like Fig.10 As shown, Fig.10 Take a buck-boost module as an example. Fig.10 In the embodiment, the second switch unit 1012 includes a transistor Q2, the inductor element 1021 includes an inductor LD1, the first transistor 1022 includes a transistor Q3, the second transistor 1023 includes a transistor Q4, the third switch unit 1031 and the first switch unit 1011 can form a single-pole double-throw switch with the first relay RLY1, and the fourth switch unit 1032 includes a diode D1.

[0083] It should be noted that Figure 8~Figure 10 Only some optional forms of the buck-boost circuit 100 are illustrated, and this embodiment is not limiting.

[0084] Fig.11 is a schematic diagram of an energy storage power supply in one embodiment, such as Fig.11 As shown, based on the same inventive concept, in one embodiment, an energy storage power supply 1100 is provided, and the energy storage power supply 1100 includes any of the above-mentioned buck-boost circuits 100. The principle of the energy storage power supply 1100 can refer to the above-mentioned embodiments, and will not be repeated here.

[0085] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to the memory, database or other medium used in the embodiments provided in the present application can include at least one of non-volatile memory and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in each embodiment provided in this application may include at least one of a relational database and a non-relational database. Non-relational databases may include distributed databases based on blockchains, etc., but are not limited to this. The processor involved in each embodiment provided in this application may be a general-purpose processor, a central processing unit, a graphics processor, a digital signal processor, a programmable logic device, a data processing logic device based on quantum computing, an artificial intelligence (AI) processor, etc., but are not limited to this.

[0086] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0087] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A step-up / step-down circuit, characterized in that: The buck-boost circuit comprises a first switch module, a second switch module and at least one buck-boost module; the buck-boost module comprises an inductor, a first transistor and a second transistor; the first end of the inductor is connected to the first switch module and the second switch module respectively, the second end of the inductor is connected to the first transistor and the second transistor respectively, the first transistor is connected to the first switch module and the second switch module respectively, the first switch module is also connected to the input end and the output end of the buck-boost circuit respectively, and the second switch module is also connected to the input end and the output end of the buck-boost circuit respectively; The buck-boost circuit is used for, when the first switch module is in the on state and the second switch module is in the off state, to enable the buck-boost circuit to operate in a boost mode through the first switch module and the buck-boost module; The buck-boost circuit is further configured to enable the buck-boost circuit to operate in a boost mode through the second switch module and the buck-boost module when the first switch module is in an open state and the second switch module is in a closed state.

2. The step-up / down voltage circuit according to claim 1, characterized in that: The buck-boost circuit includes a plurality of buck-boost modules connected in parallel.

3. The step-up / down voltage circuit according to claim 1, characterized in that: The first switch module includes a first switch unit and a second switch unit; The first switch unit is disposed between the first end of the inductor element and the input end of the buck-boost circuit, and the second switch unit is disposed between the first transistor and the output end of the buck-boost circuit.

4. The step-up / down voltage circuit according to claim 3, characterized in that: The second switch module includes a third switch unit and a fourth switch unit; A first end of the third switch unit is connected to an input end of the buck-boost circuit, and a second end of the third switch unit is connected to the first transistor and the second switch unit respectively; The first end of the fourth switch unit is connected to the first switch unit and the first end of the inductor element respectively, and the second end of the fourth switch unit is connected to the second switch unit and the output end of the buck-boost circuit respectively.

5. The step-up / down voltage circuit according to claim 4, characterized in that: The first end of the third switch unit is also connected to the first switch unit.

6. The step-up / down voltage circuit according to any one of claims 3 to 5, characterized in that: The buck-boost circuit further includes a first energy storage module, and the first energy storage module is connected to the first switch unit and the first end of the inductor element respectively.

7. The step-up / down voltage circuit according to claim 6, characterized in that: The first energy storage module includes a first energy storage unit and a second energy storage unit; The first end of the first energy storage unit is arranged between the first switch unit and the first end of the inductor element, and the second end of the first energy storage unit is grounded; The first end of the second energy storage unit is disposed between the first end of the first energy storage unit and the first end of the inductor element, and the second end of the second energy storage unit is grounded.

8. The step-up / down voltage circuit according to any one of claims 3 to 5, characterized in that: The buck-boost circuit further includes a second energy storage module, and the second energy storage module is connected to the first transistor and the second switch unit respectively.

9. The step-up / down voltage circuit according to claim 8, characterized in that: The second energy storage module includes a third energy storage unit and a fourth energy storage unit; The first end of the third energy storage unit is arranged between the first transistor and the second switch unit, and the second end of the third energy storage unit is grounded; The first end of the fourth energy storage unit is disposed between the first transistor and the first end of the third energy storage unit, and the second end of the fourth energy storage unit is grounded.

10. An energy storage power supply, characterized in that: The energy storage power supply comprises the buck-boost circuit described in any one of claims 1-9.

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