Test tray system and related method

Abstract

Test tray systems and related methods for electronic devices such as photonic integrated circuit (PIC) structures are disclosed. The test tray system includes at least one test tray. Each test tray includes a first portion exposing the first electronic component to a high temperature; and a second portion covered by a thermal protection element configured to prevent the second component from being exposed to the high temperature while the first electronic component is exposed to the high temperature. The test tray system allows a first component to be tested at an elevated temperature (e.g., 125 DEG C) while protecting a second component from the elevated temperature.

Description

Technical Field

[0001] The present disclosure relates to electronic device testing, and more particularly, to a test tray system and related methods for testing, for example, photonic integrated circuit (PIC) structures. Background Art

[0002] The PIC structure combines an integrated circuit with a photonic element on a single chip. The PIC structure can include a PIC module containing circuits and photonic elements. The PIC module is coupled to an optical connector using an optical fiber. The optical connector uses an optical fiber to communicate optical signals to / from the PIC module. The PIC structure is tested at an elevated temperature to ensure reliability. For example, the current standard for testing PIC modules requires testing at 125 degrees Celsius (°C). However, the standards for testing optical connectors generally mandate temperatures not higher than 85°C. The current method is to test the PIC module at 125°C, exclude the optical connector or place the optical connector outside the test chamber, and couple the optical connector using a long optical fiber (e.g., 1 meter long). Another method is to test the PIC structure at a temperature of up to 85°C. Each of these methods can produce defects during the testing process. Summary of the invention

[0003] All aspects, examples and features mentioned below can be combined in any technically possible way.

[0004] One aspect of the present disclosure provides a test tray system, comprising: at least one test tray, comprising: a first section configured to expose a first electronic component to a high temperature; and a second section covered by a thermal protection element configured to prevent a second component from being exposed to the high temperature while the first electronic component is exposed to the high temperature.

[0005] One aspect of the present disclosure provides a test tray system for a photonic integrated circuit (PIC) structure, the PIC structure including a PIC module connected to an optical connector via an optical fiber, the test tray system comprising: at least one test tray including: a first section configured to expose the PIC module to a high temperature; and a second section covered by a thermal protection element configured to prevent the optical connector from being exposed to the high temperature while the PIC module is exposed to the high temperature.

[0006] One aspect of the present disclosure provides a method for testing a photonic integrated circuit (PIC) structure, the method comprising: testing the PIC structure while: exposing a PIC module of the PIC structure in a first section of a test tray to a high temperature; and thermally insulating an optical connector of the PIC structure in a second section of the test tray to prevent the optical connector from being exposed to the high temperature while the PIC module is exposed to the high temperature, the PIC module being coupled to the optical connector via an optical fiber.

[0007] Two or more aspects described in this disclosure, including those described in the Summary of the Invention, may be combined to form implementations not specifically described herein. The details of one or more implementations are set forth in the accompanying drawings and the following description. Other features, purposes, and advantages will become apparent from the specification and drawings, as well as from the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Embodiments of the present disclosure will be described in detail with reference to the following drawings, wherein like reference numerals represent like elements, and wherein:

[0009] Figure 1 A top view of a test tray of a test tray system having a thermal protection element according to an embodiment of the present disclosure is shown;

[0010] Figure 2 A top view of a test tray of a test tray system showing a portion of a thermal protection element according to an embodiment of the present disclosure;

[0011] Figure 3 The embodiment according to the present disclosure is shown along Figure 1 A cross-sectional view of the test tray taken along the view line AA in FIG.

[0012] Figure 4 According to other embodiments of the present disclosure, Figure 1 A cross-sectional view of the test tray taken along the view line AA in FIG.

[0013] Figure 5 An additional embodiment according to the present disclosure is shown along Figure 1 A cross-sectional view of the test tray taken along the view line AA in FIG.

[0014] Fig. 6A A cross-sectional view showing a test tray of a test tray system having a thermal protection element according to an embodiment of the present disclosure;

[0015] Figure 6B , 6C 6D and 6D show an embodiment according to the present disclosure Fig. 6A a top view, a first side view, and an exploded view of a second side of a thermal protection element;

[0016] Fig. 7A A cross-sectional view showing a test tray of a test tray system having a thermal protection element according to an embodiment of the present disclosure;

[0017] Figure 7B , 7C 7D and 7D show an embodiment according to the present disclosure Fig. 7A a top view, a first side view, and an exploded view of a second side of a thermal protection element;

[0018] Fig. 8A A cross-sectional view showing a test tray of a test tray system having a thermal protection element according to an embodiment of the present disclosure;

[0019] Figure 8B , 8C 8D and 8D show an embodiment according to the present disclosure. Fig. 8A a top view, a first side view, and an exploded view of a second side of a thermal protection element;

[0020] Fig.9A A cross-sectional view showing a test tray of a test tray system having a thermal protection element according to an embodiment of the present disclosure;

[0021] Fig. 9B , 9C 9D and 9D show an embodiment according to the present disclosure. Fig.9A a top view, a first side view, and an exploded view of a second side of a thermal protection element;

[0022] Fig.10 shows a cross-sectional view of a test tray with a thermal protection element according to an embodiment of the present disclosure, wherein a cooling system is located in both the test tray and portions of the thermal protection element;

[0023] Fig.11 shows a cross-sectional view of a test tray according to an embodiment of the present disclosure, wherein a thermal protection element is adhered to the tray;

[0024] Fig.12 shows a cross-sectional view of a test tray integrally formed with a thermal protection element according to an embodiment of the present disclosure;

[0025] Fig.13 shows a cross-sectional view of a test tray system and method having a plurality of stacked test trays in a test chamber according to an embodiment of the present disclosure;

[0026] Fig.14 A cross-sectional view showing a test tray system and method having a plurality of stacked test trays in a test chamber according to other embodiments of the present disclosure; and

[0027] Fig.15 A top view of a plurality of structures to be tested located on a test tray of a test system according to an embodiment of the present disclosure is shown.

[0028] It should be noted that the drawings of the present disclosure are not necessarily drawn to scale. The drawings are intended only to depict typical aspects of the present disclosure and therefore should not be considered to limit the scope of the present disclosure. In the drawings, similar reference numerals represent similar elements between the drawings. DETAILED DESCRIPTION

[0029] In the following description, reference is made to the accompanying drawings which form a part of the specification and in which are shown by way of illustration specific exemplary embodiments in which the present teachings may be practiced. The description of these embodiments is detailed enough to enable those skilled in the art to practice the present teachings, and it should be understood that other embodiments may be used and changes may be made without departing from the scope of the present teachings. Therefore, the following description is illustrative only.

[0030] It will be understood that when an element such as a layer, region, or substrate is referred to as being "on" or "above" another element, it may be directly on the other element or there may be intervening elements. In contrast, when an element is referred to as being "directly on" or "directly above" another element, there are no intervening elements. It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element or there may be intervening elements. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements.

[0031] References in the specification to "one embodiment" or "an embodiment" of the present disclosure and other variations thereof mean that the specific features, structures, characteristics, etc. described in conjunction with the embodiment are included in at least one embodiment of the present disclosure. Therefore, the phrases "in one embodiment" or "in an embodiment" and any other variations appearing throughout the specification do not necessarily refer to the same embodiment. It should be understood that, for example, the use of any of " / ", "and / or", and "at least one of" in the case of "A / B", "A and / or B", and "at least one of A and B" is intended to include selecting only the first listed option (A), or only the second listed option (B), or both options (A and B) at the same time. As other examples, in the case of "A, B, and / or C" and "at least one of A, B, and C," these phrases are intended to include selecting only the first listed option (A), or only the second listed option (B), or only the third listed option (C), or only the first and second listed options (A and B), or only the first and third listed options (A and C), or only the second and third listed options (B and C), or all three options (A, B, and C). This scenario can be extended to many of the listed items, as will be apparent to one of ordinary skill in the art.

[0032] Embodiments of the present disclosure include a test tray system and related methods for an electronic device system such as a PIC structure. The test tray system includes at least one test tray and may include a plurality of stacked test trays. Each test tray includes a first subdivision that exposes a first electronic component (e.g., a PIC module of a PIC structure) to a high temperature, and a second subdivision covered by a thermal protection element, the thermal protection element being configured to prevent a second component (e.g., an optical connector of a PIC structure) from being exposed to a high temperature while the first electronic component is exposed to a high temperature. The test tray system allows the first component to be tested at a high temperature (e.g., 125°C) while protecting the second component from the high temperature, such as keeping the temperature of the second component below a temperature that may cause damage to it (e.g., below 85°C). The thermal protection element may take various forms. A cooling system may also be used to cool at least the second component. The test tray system allows the first component to be tested at a high temperature (e.g., 125°C) while protecting the second component from the high temperature. In this way, the working connector (e.g., optical fiber) of the connecting component does not have to be elongated to protect the second component by placing the second component outside the test chamber. The thermal protection element may also reduce the vibration or mechanical damage to the structure under test.

[0033] Figure 1 A top view of a test tray 100 of a test tray system 110 having a thermal protection element 112 according to an embodiment of the present disclosure is shown; Figure 2A top view of a test tray 100 showing a portion of a thermal protection element 112 according to an embodiment of the present disclosure; and, Figure 3 The embodiment according to the present disclosure is shown along Figure 1 FIG. 1 is a cross-sectional view of the test tray 100 taken along the view line AA in FIG.

[0034] The test tray system 110 (hereinafter referred to as "system 110") includes at least one test tray 100. Each test tray 100 holds a structure 114 (located at Figure 1-2 For clarity, the dashed box in Figure 1-2 In some embodiments, the structure 114 may include a photonic integrated circuit (PIC) structure 120. The PIC structure 120 includes a first electronic component 122 in the form of a PIC module 124 and a second component 126 in the form of an optical connector 128. The PIC structure 120 may also include an optical fiber 130 that optically couples the PIC module 124 and the optical connector 128.

[0035] The PIC module 124 may include any photonic integrated circuit known now or developed later, which includes an electronic integrated circuit and a photonic structure for receiving an optical signal from the electronic integrated circuit and / or sending an optical signal to the electronic integrated circuit. The PIC module 124 will be tested under exposure to high temperatures (e.g., 125° C. or higher). The photonic structure within the PIC module 124 may include, but is not limited to, waveguides, photodetectors, optical absorbers, and optical filters. The optical connector 128 may include any optical receiver and / or transmitter known now or developed later for receiving an optical signal (e.g., visible light or other wavelengths of light) from the optical fiber 130 or transmitting an optical signal into the optical fiber 130. The optical connector 128 may also be operably connected to a test system to evaluate optical performance, such as insertion loss. The optical fiber 130 may include any flexible, transparent optical fiber capable of transmitting an optical signal therethrough. It is emphasized that the structure 114 may include other devices in addition to the PIC structure, which have another form of electronic component 122 to be tested at high temperatures and another form of component 126 to be protected from the effects of high temperatures while the electronic component 122 is exposed to high temperatures.

[0036] Each tray 100 includes a first subsection 140 and a second subsection 142. The first subsection 140 exposes the first electronic component 122 to high temperatures. More specifically, the first subsection 140 accommodates the electronic component 124 of the structure 114, such that the subsection exposes the electronic component 124 to high temperatures. In contrast, the second subsection 142 is covered by or includes a thermal protection element 112, which is configured to prevent the second component 126 from being exposed to high temperatures while the first electronic component 122 is exposed to high temperatures. More specifically, the second subsection 142 accommodates the second component 126 of the structure 114 within the thermal protection element 112. Each tray 100 may also accommodate any other structures in the subsections 140, 142, such as accommodating the optical fiber 130 in the first subsection 140.

[0037] As used herein, "receive" means that the tray 100 includes some support structure that allows the corresponding components and / or elements to be positioned thereon, but does not necessarily secure them to the tray 100. For example, Figure 1-3 As shown, the tray 100 may include a plurality of depressions or openings 150 in a surface 152 thereof, each opening 150 supporting a portion of the element 112 and / or structure 114 . Figure 4 1 shows a cross-sectional view of a test tray 100 according to other embodiments of the present disclosure. Figure 4 As shown, the tray 100 may include a single recessed surface 154 that covers most of the tray 100 except for the side walls 156. The tray 100 may also have various supports 158 for supporting various portions of the components 112 and / or structures 114. For example, support 158A may support the PIC module 124, support 158B may support the optical fiber 130, and support 158C may support the thermal protection element 112 and the optical connector 128. Each support 158A-C may have a certain height within the recess 154 to accommodate a portion of the device 114 it supports. The tray 100 may also include a plurality of supports 158A-C for supporting the components 112 and / or structures 114. Figure 1-4 A combination of arrangements of structures 114 .

[0038] The tray 100 may be made of any material that can provide the necessary structural rigidity to hold one or more structures 114 and withstand the test environment (eg, 125°C or higher). In a non-limiting example, the tray 100 may be made of a plastic that can withstand temperatures above 125°C.

[0039] Only if Figure 2As shown, for clarity, the tray 100 may optionally include one or more openings 160 therein to reduce the amount of material required for the tray 100 and improve heat transfer during testing. The tray 100 may also include any necessary structure (not shown) to increase rigidity, such as reinforcing or strengthening ribs.

[0040] like Figure 1-4 As shown, the tray 100 in the system 110 includes a thermal protection element 112 configured to prevent the second component 126 from being exposed to high temperatures at the same time as the first electronic component 120 is exposed to high temperatures. The thermal protection element 112 can take a variety of forms.

[0041] like Figure 3-4 As shown, the thermal protection element 112 may include an insulation layer 162 surrounding the second component 126 (e.g., the optical connector 128). The insulation layer 162 may include any form of flexible insulation material (thermal blanket), such as, but not limited to: fiberglass / glass wool, ceramic fiber, bubble plastic, graphite, polystyrene, polyurethane, cellulose, mineral wool, wool, cementitious foam and formaldehyde resin, or a combination of these materials. The insulation layer 162 "surrounds" the second component 126, meaning that it completely surrounds the second component without openings or gaps. However, in other embodiments, there may be some small openings or gaps, as long as the second component 126 is not affected by high temperatures. In some embodiments, the insulation layer 162 may take the form of, for example, a flexible thermal blanket that is wrapped around the second component 126 and is made of any of the aforementioned materials. As Figure 3-4 As shown, the insulation layer 162 may have an upper surface 164 that is flush with or below the upper surface 152 of the pallet 100 to allow for stacking of the pallets 100; however, this is not necessarily the case in all cases.

[0042] Figure 5A side view of a tray 100 according to other embodiments of the present disclosure is shown. In this embodiment, the system 110 also includes a cooling system 170 operably coupled to the thermal protection element 112 to cool at least the second component 126. The cooling system 170 can take various forms, such as, but not limited to: an air cooling system, a water cooling system, a cold finger cooling system, and / or a thermoelectric cooling system. In the example shown, the cooling system 170 includes a fluid-based cooling system that uses a fluid coolant such as air to cool at least the second component 126, such as the second component 126, the thermal protection element 112, and possibly the tray 100. In this case, the thermal protection element 112 can include a conduit 172 coupled to a fluid coolant source 174 for conveying or transferring the fluid coolant thereto to cool at least the second component 126. The fluid coolant can take any form capable of thermally transferring heat to protect the second component 126, including, but not limited to: air; an inert gas (e.g., argon); water; and a thermal fluid (antifreeze) such as propylene glycol. In the case of using a gas (such as air), the opening of the conduit 172 can enter the thermal protection element 112. Conversely, in the case where the fluid needs to be separated from the second component 126 to prevent damage to the component, the conduit 172 provides a closed circulation system in and out of the thermal protection element 112. In the closed circulation system, the conduit 172 can be routed in any arrangement through the thermal protection element 112, that is, in a circular or sinusoidal path, to distribute the cooling effect of the fluid coolant. The fluid coolant source 174 can take any form suitable for the fluid used, such as, but not limited to, a pressurized tank of fluid coolant, a fan, and a pump.

[0043] Fig. 6A 7A-D, 8A-D, and 9A-D illustrate embodiments of the test system 110 in which the thermal protection element 112 includes a housing 180 surrounding the second component 126. (Note that the figures labeled "C" illustrate cross-sectional views taken along the view line CC in their corresponding set of figures.) The housing 180 can be distinguished from the thermal insulation layer 162 in that it is not as flexible as the layer 162. The housing 180 can include any necessary positioning structures 182 (e.g., see Figure 6B , 7B , 8B, 9B) to position the second component 126 therein, such as but not limited to an opening, a recess, a seat (shown), a vertical post or other positioning member. The housing 180 may also include any necessary openings 184 to allow the optical fiber 130 to exit the housing.

[0044] The housing 180 may include, for example, two parts 190, 192 that together form the housing 180. In the figure, the parts 190, 192 are shown as two laterally or horizontally extending members that mate along a horizontal line, but other arrangements are possible, for example, the two members mate along a vertical line. A positioning structure 182 for positioning the second component 126, such as an opening, a recess, a seat (shown), a vertical column, or other positioning members therein, may be located in one or all of the parts 190, 192.

[0045] In certain embodiments, such as Fig. 6A As shown in Figure 1-D, the housing 180 can be made of a single material. In one example, the housing 180 includes a heat-transmitting material, such as a metal, such as aluminum, copper, etc. In the case of using metal, as an option, a heat-insulating material, such as a polytetrafluoroethylene (PTFE) layer, can be provided inside. In other embodiments, such as Fig. 7A -D, 8A-D and 9A-D, the housing 180 can include multiple layers that together form an insulated housing. In one example, the portions 190, 192 include an inner portion 200 of a first material (e.g., a metal such as aluminum or a plastic), and an outer portion 202 of a second material, such as an insulating layer made of any of the materials listed herein for the insulating layer 162. Thus, the housing 180 can include an insulating layer (the outer portion 202) and an inner container (the inner portion 200 with the positioning structure 182). Although two layers are shown, the housing 180 can include any number of layers.

[0046] like Fig. 8A -B and D and Fig.9A -B and D, the thermal protection element 112 may also include a heat exchanger 210, the heat exchanger 210 is thermally coupled to the inner portion 200 ( Fig.9A , C and D) or the second component 126 ( Fig. 8A , C and D), such as the optical connector 128. The heat exchanger 200 may include any structure capable of thermally removing heat from the second component 126. Fig. 8A and 9A As shown, the heat exchanger 210 may include a base member 212 and a fin structure 214. The base member 210 may be connected to the inner portion 200 ( Fig.9A ) (wherein the housing 180 includes more than one layer) or the second component 126 ( Fig. 8A) in direct contact. The fin structure 214 can extend away from the base member 212 to thermally interact with the environment within a test container (not shown) in which the test is conducted to protect the second component 126 from high temperatures. The heat exchanger 210 can be made of any thermally conductive material, such as, but not limited to, aluminum and copper. Although a particular heat exchanger structure has been shown, it will be understood that the heat exchanger 210 can take a variety of alternative forms.

[0047] The housing portions 190, 192 may be positioned together, or may be coupled together in any manner, such as by using threaded fasteners, releasable snaps, etc. Fig. 6A -D and 7A-D, portions 190, 192 are positioned together. Fig. 6A -D, only the outer sides of the portions 190, 192 are used to position them together, and in Fig. 7A -D, a mating segment 220 may be provided to position them together in an aligned manner. The mating segment 220 may include any manner of alignment structure, such as but not limited to engagement and alignment features (e.g., mating male / female, pegs and holes, or tongue and groove joints) (as shown). If desired, any fastener may be used to hold the portions 190, 192 together. In Fig. 8A 9A-D and 9A-D, the portions 190, 192 are pivotally coupled together by hinges 222. In this example, the portions 190, 192 can be pivotally opened and closed for placement or removal of the second assembly 126 therein. It will be appreciated that other mechanisms may also be used to position the portions 190, 192 of the housing 180 together.

[0048] As stated in this article, Fig. 6A -D, 7A-D, 8A-D, or 9A-D, the housing 180 of any embodiment may also include a cooling system 170. In this embodiment, the system 110 also includes a cooling system 170 operably coupled to the housing 180 to cool at least the second component 126. For clarity, the cooling system 170 is only shown in FIG. Figure 8C and 9A As previously described, the cooling system 170 may include a fluid-based cooling system that uses a fluid coolant such as air to cool at least the second component 126, such as the second component 126, the thermal protection element 112, and possibly the tray 100. Fig.9A-C, the channel 172 of the cooling system 170 is positioned in the portion 192 of the housing 180 (which is fluidly coupled to the heat exchanger 210). The portion 192 includes at least one channel 172 configured to receive a fluid coolant. An outlet (not shown) for the channel 172 may be provided to allow the fluid coolant to escape into the housing 180, or, depending on the type of fluid coolant, the channel 172 may provide a closed loop system. The channel 172 of the cooling system 170 may be disposed in one or more of the portions 190, 192 of the housing 180, within any layer of the portions 190 and 192 of the housing 180, and / or within a heat exchanger 210 (if provided) coupled to a portion of the housing 180 or the second component 126.

[0049] like Figure 8C As shown, the cooling system 170 described herein may also be disposed in the tray 100. Fig.10 As shown in the cross-sectional view of FIG. 1 , the cooling system 170 may also be disposed in both the tray 100 and the thermal protection element 112. As described herein, the channel 172 may take any form.

[0050] The thermal protection element 112 (e.g., housing 180) may be arranged relative to the tray 100 in a variety of ways. Fig. 6A and 6C 7A and 7C, a thermal protection element 112 in the form of a housing 180 is positioned on the tray 100. Fig. 6A and 6C In FIG. 1 , the thermal protection element 112 rests on the tray 100. Fig. 7A and Figure 7C 1, the thermal protection element 112 rests in a seat or recess 240 in the tray 100. The seat or recess 240 may be part of the opening 150 as described herein, or may be a separate seat or recess in the upper surface 152 of the tray 100. In other embodiments, the thermal protection element 112 may be secured to the tray 100 in a variety of ways. Figure 11-12 Shows something like Figure 6C , 7C , 8C and 9C cross-sectional views. Fig.11 Shows something like Figure 6C In the embodiment, however, the thermal protection element 112 is adhered to the tray 100 using an adhesive 230. The adhesive 230 may include any adhesive and is preferably thermally conductive. Fig. 7A and 7C In the embodiment of the present invention, adhesives can also be used. Figure 8C and 9C In other embodiments, the thermal protection element 112 may be secured to the tray 100 using mating recesses. Figure 8C A tongue and groove sliding fit element 242 is shown, while Fig. 9CIt will be appreciated that there are a variety of alternative methods, not described herein for brevity, in which the thermal protection element 112 and tray 110 may be coupled together, such as but not limited to other snap-in fasteners, threaded fasteners, male and female and other mating surfaces, and ties.

[0051] In another embodiment, if Fig.12 As shown, the thermal protection element 112 (housing 180) and the tray 100 are formed as a single piece of material (e.g., plastic). In the example shown, the portion 190 and the tray 100 can all be formed as a single piece (e.g., injection molded plastic). The portion 192 can be separately connected, for example, by a hinge 222, or can also be formed as a single piece (e.g., injection molded plastic) with the portion 190, the hinge 222, and the tray 100.

[0052] Fig.13 and 14 A cross-sectional view of a tray system 110 is shown with a plurality of stacked trays 110 in a test chamber 246. The test chamber 246 may include any now known or later developed test system for electronic assemblies (e.g., PIC structures 120). The test chamber 246 is capable of providing a high temperature environment, e.g., ≥ 125°C, and electronic connections and controls for running tests of the first electronic assembly 122. Since the details of these systems are well known, no further details are required.

[0053] The trays 100 can be simply stacked one on top of the other and placed in the test chamber 246. Alternatively, each test tray 100 can include a stacking structure 248 configured to position each test tray to be stacked with an adjacent test tray 100 in the plurality of test trays. In the example in the figures, the stacking structure 248 can include mating elements, such as mating male-female connectors or other structures (similar to the structures described with respect to portions 190, 192 of the housing 180) to ensure alignment of the trays 100. Figure 1-5 , 6A, 7A, the thermal protection element 112 does not extend above the upper surface 152 of the tray 100, that is, it is flush with the upper surface 152 or below the upper surface 152. In this case, the tray 100 can be stacked from the upper surface 152 to the lower surface 153 ( Fig.13 Only the surface of the top tray 100 is shown. Fig. 8A , 8C, 9A and 9C, where the heat exchanger 210 or any other structure of the thermal protection element 112 extends above the upper surface 152 of the tray 100, the tray 100 may include a divider or riser 250 that separates adjacent trays 110 by a sufficient distance to accommodate, for example, a portion of the thermal protection element 112. The riser 250 may include any stacking structure 248, such as the mating elements described herein. Fig.14 A plurality of pallets 100 are shown stacked together using risers 250 .

[0054] Although the description has been described using a tray 100 including two structures 114 (eg, PIC structures 120 ) thereon, the tray 100 may include any number of structures 114 . Fig.15 A top view showing another example of how to arrange devices 114 on tray 100 to increase the number of structures 114 that can be tested on each tray. In any case, first subdivision 140 exposes a plurality of first electronic components 122 to high temperatures, and thermal protection element 112 prevents a plurality of second components 126 from being exposed to high temperatures while a plurality of first electronic components 122 are exposed to high temperatures.

[0055] The thermal protection element 112 may, for example, in conjunction with an enclosure 180 surrounding one or more structures, thermally insulate the structure 114. Alternatively, each structure 114 may include its own thermal protection element 112.

[0056]

[0026] Embodiments of the present disclosure also include a test tray system 110 for a PIC structure 120 that includes a PIC module 124 connected to an optical connector 128 via an optical fiber 130, as described herein.

[0057] refer to Fig.13 and 14 In operation, the method of testing the PIC structure 120 according to an embodiment of the present disclosure may include testing the PIC structure 120 while: exposing the PIC modules 124 of the PIC structure 120 in the first subdivision 140 of the test tray 100 to a high temperature (e.g., ≥125° C.); and thermally insulating the optical connectors 128 of the PIC structure 120 in the second subdivision 142 of the test tray 100 to prevent the optical connectors 128 from being exposed to high temperatures while the PIC modules 124 are exposed to high temperatures. The PIC modules 124 are coupled to the optical connectors 128 via the optical fibers 130. As described herein and Figure 1-5 As shown, in some embodiments, thermal isolation can include using a thermal isolation layer 162 surrounding the optical connector 128. As also described herein, and as Fig. 6A-D, 7A-D, 8A-D, and 9A-D, in some embodiments, thermal isolation may include enclosing the optical connector 128 in a thermally insulating housing 180. Any of the described embodiments may also include cooling at least the optical connector 128 using a cooling system 170.

[0058] Embodiments of the present disclosure provide various technical and commercial advantages, examples of which are discussed herein. A test tray system with a thermal protection element allows a first component to be tested at an elevated temperature (e.g., 125° C.) while protecting a second component from the elevated temperature. In this manner, a working connector, such as an optical fiber, connecting the components does not have to be elongated to protect the second component by placing the second component outside the test chamber. The thermal protection element can also reduce the exposure of the structure under test to vibration or mechanical damage.

[0059] The above-described structures and methods are used for the manufacture of integrated circuit chips. The resulting integrated circuit chips can be distributed by the manufacturer in raw wafer form (i.e., as a single wafer with multiple unpackaged chips), as a bare die, or in a packaged form. In the latter case, the chip is mounted in the form of a single-chip package (e.g., a plastic carrier whose leads are fixed to a motherboard or other higher-level carrier) or a multi-chip package (e.g., a ceramic carrier with surface interconnects and / or buried interconnects). In any case, the chip is then integrated with other chips, discrete circuit elements, and / or other signal processing devices as part of (a) an intermediate product (e.g., a motherboard) or (b) a final product. The final product can be any product that includes an integrated circuit chip, from toys and other low-end applications to advanced computer products with displays, keyboards or other input devices, and central processing units.

[0060] The terms used herein are only used for the purpose of describing specific embodiments and are not intended to limit the present disclosure. As used herein, the singular forms "one", "an" and "the" are also intended to include plural forms, unless the context clearly states otherwise. It will be further understood that when used in this specification, the terms "include" and / or "comprise" specify the presence of the features, integral bodies, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integral bodies, steps, operations, elements, parts and / or the groups they constitute. "Optional" or "optionally" means that the event or situation described subsequently may or may not occur, and the description includes situations where the event occurs and situations where the event does not occur.

[0061] Approximate language used throughout the specification and claims can be used to modify any quantitative representation, which can be allowed to change without causing changes in its related basic functions. Therefore, the value modified by one or more terms such as "about", "approximately" and "substantially" is not limited to the specified exact value. In at least some cases, approximate language can correspond to the precision of the instrument used to measure the value. In this article and throughout the specification and claims, range limitations can be combined and / or interchanged, and such ranges are identified and include all sub-ranges contained therein, unless otherwise specified by context or language. The term "approximately" applied to a specific value of a range is applied to both values ​​of the range at the same time, and unless otherwise based on the precision of the instrument measuring the value, it represents + / -10% of the value.

[0062] The corresponding structures, materials, actions, and equivalents of all means or step-plus-function elements in the following claims are intended to include any structure, material, or action that performs a function in conjunction with other claimed elements specifically claimed. The description of the present disclosure has been given for the purpose of illustration and description, but the description is not intended to be exhaustive or to limit the present disclosure to the disclosed form. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the present disclosure. The embodiments are selected and described in order to best explain the principles and practical applications of the present disclosure, and to enable other persons of ordinary skill in the art to understand the various embodiments of the present disclosure with various modifications suitable for the intended specific use.

Claims

1. A test tray system, comprising: At least one test tray comprising: a first subdivision configured to expose a first electronic component to an elevated temperature; and A second subsection is covered by a thermal protection element configured to prevent a second component from being exposed to the high temperature while the first electronic component is exposed to the high temperature.

2. The test tray system according to claim 1, wherein: The thermal protection element includes a thermal insulation layer surrounding the second component.

3. The test tray system according to claim 1, wherein: The thermal protection element includes a housing surrounding the second component.

4. The test tray system according to claim 3, wherein: The housing includes an insulating housing including an insulating layer located above the inner container.

5. The test tray system of claim 3, further comprising a cooling system operably coupled to the housing to cool at least the second assembly.

6. The test tray system according to claim 5, wherein: The cooling system cools at least the second component using a fluid coolant. 7 . The test tray system of claim 1 , further comprising a cooling system operably coupled to the thermal protection element to cool at least the second assembly.

8. The test tray system according to claim 1, wherein: The first electronic component includes a photonic integrated circuit (PIC) module, and the second component includes an optical connector, wherein the PIC module and the optical connector are connected by an optical fiber.

9. The test tray system according to claim 1, wherein: The at least one test tray includes a plurality of test trays, each test tray including a stacking structure configured to position the test tray to be stacked with an adjacent test tray of the plurality of test trays.

10. The test tray system according to claim 1, wherein: The first subdivision exposes a plurality of first electronic components to the high temperature; and The thermal protection element prevents the plurality of second components from being exposed to the high temperature while the plurality of first electronic components are exposed to the high temperature.

11. A test tray system for a photonic integrated circuit (PIC) structure, the PIC structure comprising a PIC module connected to an optical connector via an optical fiber, the test tray system comprising: At least one test tray comprising: a first subsection configured to expose the PIC module to high temperature; and A second subsection is covered by a thermal protection element configured to prevent the optical connector from being exposed to the high temperature while the PIC module is exposed to the high temperature.

12. The test tray system according to claim 11, wherein: The thermal protection element includes a thermal insulation layer surrounding the optical connector.

13. The test tray system according to claim 11, wherein: The thermal protection element includes a thermally insulating outer shell including a thermally insulating layer located above an inner container.

14. The test tray system of claim 13, further comprising a cooling system operably coupled to the thermally insulating housing to cool at least the optical connector.

15. The test tray system of claim 11, further comprising a cooling system operably coupled to the thermal protection element to cool at least the optical connector.

16. The test tray system according to claim 11, wherein: The at least one test tray includes a plurality of test trays, each test tray including a stacking structure configured to position the test tray to be stacked with an adjacent test tray of the plurality of test trays.

17. A method for testing a photonic integrated circuit (PIC) structure, the method comprising: The PIC structure is tested while: exposing the PIC modules of the PIC structure in the first subsection of the test tray to an elevated temperature; as well as The optical connectors of the PIC structure in the second section of the test tray are thermally insulated to prevent the optical connectors from being exposed to the high temperature at the same time as the PIC module coupled to the optical connectors via optical fibers is exposed to the high temperature.

18. The method according to claim 17, wherein: Thermal isolation includes using a thermal insulation layer surrounding the optical connector.

19. The method according to claim 17, wherein: Thermally isolating includes enclosing the optical connector in a thermally insulating housing.

20. The method of claim 17, further comprising cooling at least the optical connector via a cooling system.

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