PCB cutting and layout method and system

Abstract

The present invention relates to the field of PCB technology, and specifically discloses a PCB cutting and layout method and system. The present invention obtains a PCB material quality index based on the surface integrity and side integrity of a PCB material board. In this way, under the action of the PCB material quality index, it is possible to quickly determine whether the PCB material board has defects, and determine whether the PCB material quality index is greater than a preset PCB material quality index. If not, it is determined that the PCB material board has defects, and the material board defect location information is obtained based on the material board appearance feature information. The material board area is marked according to the material board defect location information to obtain the defect-marked PCB material board area. Then, based on CAD, multiple preset segmentation requirement areas are layout-adapted with the defect-marked PCB material board area to obtain adapted layout information. The PCB material board is cut and laid out according to the adapted layout information. In this way, the re-layout PCB material board can reuse the defective PCB material board, while also avoiding the problem of large-scale material board waste.

Description

Technical Field

[0001] The present invention relates to the field of PCB technology, and in particular to a PCB cutting and layout method and system. Background Art

[0002] A printed circuit board (PCB) is a substrate used for electrical connections and support between electronic components. It is one of the most basic and important components of modern electronic devices. The main function of a PCB is to provide a platform on which various electronic components (such as resistors, capacitors, transistors, integrated circuits, etc.) can be fixed and electrically connected through pre-designed traces.

[0003] During the processing of PCB boards, the boards need to be laid out. However, existing PCB boards are usually laid out and divided into sections with uniform area specifications during the processing. Therefore, when a board defect is encountered, the preset section area with the board defect is discarded, which results in a large amount of board waste. Therefore, a PCB cutting and layout method and system are needed to solve the problem of discarding the preset section area with a board defect, which results in a large amount of board waste. Summary of the Invention

[0004] The purpose of the present invention is to provide a PCB cutting and layout method and system to solve the technical problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A PCB cutting and layout method, comprising:

[0007] Acquire segmentation feature information of a PCB board, wherein the segmentation feature information includes board image information and a plurality of preset segmentation required areas;

[0008] Acquire the material board area and material board appearance feature information according to the material board image information, acquire the surface integrity and side integrity according to the material board appearance feature information, and acquire the PCB board quality index according to the surface integrity and side integrity;

[0009] Determining whether the PCB board quality index is greater than a preset PCB board quality index;

[0010] If the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has a defect, and the board defect location information is obtained based on the board appearance feature information, and the board area is marked according to the board defect location information to obtain the defect-marked PCB board area;

[0011] Based on CAD, the plurality of preset segmentation required areas are adapted to the defect-marked PCB material area to obtain adapted layout information;

[0012] The PCB material board is cut and laid out according to the adapted layout information.

[0013] Preferably, the step of obtaining the surface integrity and the side integrity according to the appearance feature information of the material board, and obtaining the PCB board quality index according to the surface integrity and the side integrity comprises:

[0014] Grayscale processing is performed on the sheet image information to obtain black and white surface image information, and the black and white surface image information is filtered to obtain black stripes. Coordinates are respectively set for both ends of the black stripes to obtain first coordinates and second coordinates. The surface crack length of the black stripes is calculated based on the first coordinates and the second coordinates, and a corresponding first weight value is obtained based on the surface crack length.

[0015] The method comprises: transmitting a plurality of acoustic wave pulse signals toward the black stripes based on an acoustic wave scanner, receiving a plurality of rebound signals returned after the acoustic wave pulse signals hit the black stripes, obtaining a surface crack depth based on the plurality of rebound signals, and obtaining a corresponding second weight value based on the surface crack depth;

[0016] Obtaining contour information of the black stripes based on Canny edge detection, and obtaining multiple crack widths between openings of the black stripes based on the contour information of the black stripes, sorting the multiple crack widths in ascending order to obtain a crack width sorting table, using the last crack width in the crack width sorting table as the apparent crack width, and obtaining a corresponding third weight value based on the apparent crack width;

[0017] Obtaining a preset crack length judgment threshold according to the surface crack length;

[0018] Obtaining a preset crack depth judgment threshold according to the surface crack depth;

[0019] Obtaining a preset crack width judgment threshold according to the surface crack width;

[0020] The surface integrity is calculated based on the surface crack length, surface crack depth, surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value, and a third weight value, wherein the calculation formula is:

[0021]

[0022] Wherein, B(M) represents surface integrity, H(c) represents surface crack length, H(s) represents surface crack depth, H(k) represents surface crack width, Y(c) represents a preset crack length judgment threshold, Y(s) represents a preset crack depth judgment threshold, Y(k) represents a preset crack width judgment threshold, d(y) represents a first weight value, d(e) represents a second weight value, and d(s) represents a third weight value;

[0023] Obtaining a first dark stripe and side smoothness of the PCB side surface based on the black and white surface image information, obtaining a side stripe crack width based on the first dark stripe, and obtaining a side integrity based on the side stripe crack width and side smoothness, wherein the side integrity is calculated in the same manner as the surface integrity;

[0024] Obtaining a corresponding surface integrity weight value according to the surface integrity;

[0025] Obtaining a corresponding aspect integrity weight value according to the aspect integrity;

[0026] The PCB board quality index is calculated based on the surface integrity and side integrity, wherein the calculation formula is:

[0027] s(c)=[B(M)*a+C(D)*b]*100%;

[0028] Among them, s(c) represents the PCB material quality index, B(M) represents the surface integrity, a represents the surface integrity weight value, C(D) represents the side integrity, and b represents the side integrity weight value.

[0029] Preferably, the step of obtaining the sheet material defect position information based on the sheet material appearance feature information includes:

[0030] Acquire a plurality of first corner fixed point coordinates corresponding to the sheet area, and select one of the plurality of first corner fixed point coordinates as a first origin coordinate;

[0031] Obtaining a corresponding first center point according to the black stripes, and obtaining first coordinates of the first center point according to the first origin coordinates and the first center point;

[0032] Acquire a plurality of corresponding second corner fixed point coordinates according to the side surface area, and select one of the plurality of second corner fixed point coordinates as the second origin coordinate;

[0033] Obtain a corresponding second center point according to the first dark stripe, and obtain second coordinates of the second center point according to the second origin coordinates and the second center point;

[0034] The position information corresponding to the first coordinate and the second coordinate is used as the sheet material defect position information.

[0035] Preferably, the step of marking the sheet area according to the sheet defect position information to obtain the defect-marked PCB sheet area includes:

[0036] Obtain the corresponding dark stripe depth according to the first dark stripe, and obtain the area of ​​the side defective PCB material board according to the dark stripe depth and the side stripe crack width;

[0037] Obtain the surface defect PCB material area according to the second origin coordinate and the surface crack length, wherein the second origin coordinate is used as the center of the circle and the surface crack length is used as the diameter;

[0038] The side defect PCB board area and the surface defect PCB board area are marked respectively to obtain the side defect marked PCB board area and the surface defect marked PCB board area, and the side defect marked PCB board area and the surface defect marked PCB board area are used as the defect marked PCB board area.

[0039] Preferably, the step of performing layout adaptation on the plurality of preset segmentation requirement areas and the defect mark PCB material board area based on CAD to obtain adapted layout information comprises:

[0040] Obtain the actual usage area of ​​the PCB board according to the defect marked PCB board area;

[0041] Based on particle swarm optimization, the preset segmentation required area is randomly arranged as particles on the actual use area to obtain multiple layouts, wherein each particle represents a PCB layout;

[0042] Corresponding layout feature parameters are obtained according to the plurality of layout layouts, wherein the layout feature parameters include a plurality of cutting paths, a plurality of layout area utilization rates, a plurality of segmentation safety distances, and a plurality of preset segmentation required area layout quantities, and a plurality of fitness comprehensive values ​​are calculated in sequence according to the plurality of cutting paths, the plurality of layout area utilization rates, the plurality of segmentation safety distances, and the plurality of preset segmentation required area layout quantities, wherein the calculation formula is:

[0043] S(i...n)=[L(J) i *C i +X(L) i *D i +J(L) i *E i +S(L) i *F i ] i ;...;

[0044] [L(J) n *Cn +X(L) n *D n +J(L) n *E n +S(L) n *F n ] n ;

[0045] Among them, S(i...n) represents the comprehensive value of fitness from the i-th to the n-th, L(J) i represents the i-th cutting path, C i Indicates the weight value of the i-th cutting path, X(L) i Indicates the utilization rate of the i-th typesetting area, D i Indicates the weight value of the i-th layout area utilization, J(L) i represents the i-th segmentation safety distance, E i Represents the weight value of the i-th segmentation safety distance, S(L) i Indicates the layout quantity of the i-th preset segmentation area requirement, F i represents the weight value of the layout quantity of the i-th preset segmentation requirement area, where i represents the counting number, i=1, 2, 3...n;

[0046] The multiple comprehensive suitability values ​​are filtered according to the maximum value to obtain a first screening comprehensive suitability value, the layout layout corresponding to the first screening comprehensive suitability value is used as the optimal layout scheme, and the PCB material board is layout-adapted based on the layout layout corresponding to the first screening comprehensive suitability value based on CAD to obtain adapted layout information.

[0047] Preferably, the step of cutting and typesetting the PCB material board according to the adapted typesetting information includes:

[0048] Acquire corresponding multiple first preset segmentation required areas according to the adaptive layout information;

[0049] A corresponding first cutting path is obtained according to the adaptation layout information, and a plurality of the first preset segmentation required areas are cut and laid out on the PCB material board according to the first cutting path.

[0050] This application also provides a PCB cutting and layout system, including:

[0051] A first acquisition module is configured to acquire segmentation feature information of a PCB board, wherein the segmentation feature information includes board image information and a plurality of preset segmentation required areas;

[0052] A second acquisition module is used to obtain the material board area and material board appearance feature information based on the material board image information, obtain the surface integrity and side integrity based on the material board appearance feature information, and obtain the PCB board quality index based on the surface integrity and side integrity;

[0053] A first judgment module is used to judge whether the PCB material quality index is greater than a preset PCB material quality index;

[0054] If the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has a defect, and the board defect location information is obtained based on the board appearance feature information, and the board area is marked according to the board defect location information to obtain the defect-marked PCB board area;

[0055] The first layout module is used to perform layout adaptation on the plurality of preset segmentation required areas and the defective marked PCB material board area based on CAD to obtain adaptation layout information;

[0056] The first processing module is used to cut and layout the PCB material board according to the adapted layout information.

[0057] Preferably, the second acquisition module includes:

[0058] a first acquisition unit, configured to perform grayscale processing on the sheet image information to obtain black and white surface image information, filter the black and white surface image information to obtain black stripes, establish coordinates for both ends of the black stripes to obtain first coordinates and second coordinates, calculate the surface crack length of the black stripes based on the first coordinates and the second coordinates, and obtain a corresponding first weight value based on the surface crack length;

[0059] a second acquiring unit, configured to transmit a plurality of acoustic wave pulse signals toward the black stripes based on an acoustic wave scanner, and receive a plurality of rebound signals returned after the acoustic wave pulse signals impact the black stripes, acquire a surface crack depth based on the plurality of rebound signals, and acquire a corresponding second weight value based on the surface crack depth;

[0060] a third acquisition unit, configured to acquire contour information of the black stripes based on Canny edge detection, and acquire multiple crack widths between openings of the black stripes based on the contour information of the black stripes, sort the multiple crack widths in ascending order to obtain a crack width sorting table, use the last crack width in the crack width sorting table as the apparent crack width, and acquire a corresponding third weight value based on the apparent crack width;

[0061] A fourth acquiring unit, configured to acquire a preset crack length determination threshold value according to the surface crack length;

[0062] A fifth obtaining unit, configured to obtain a preset crack depth judgment threshold according to the surface crack depth;

[0063] a sixth obtaining unit, configured to obtain a preset crack width judgment threshold value according to the surface crack width;

[0064] A first calculation unit is configured to calculate the surface integrity based on the surface crack length, the surface crack depth, the surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value, and a third weight value, wherein the calculation formula is:

[0065]

[0066] Wherein, B(M) represents surface integrity, H(c) represents surface crack length, H(s) represents surface crack depth, H(k) represents surface crack width, Y(c) represents a preset crack length judgment threshold, Y(s) represents a preset crack depth judgment threshold, Y(k) represents a preset crack width judgment threshold, d(y) represents a first weight value, d(e) represents a second weight value, and d(s) represents a third weight value;

[0067] a seventh acquiring unit, configured to acquire a first dark stripe and side smoothness on a side surface of the PCB based on the black-and-white surface image information, acquire a side stripe crack width based on the first dark stripe, and acquire a side integrity based on the side stripe crack width and side smoothness, wherein the side integrity is calculated in the same manner as the surface integrity;

[0068] an eighth acquiring unit, configured to acquire a corresponding surface integrity weight value according to the surface integrity;

[0069] a ninth acquiring unit, configured to acquire a corresponding aspect integrity weight value according to the aspect integrity;

[0070] The second calculation unit is used to calculate the PCB board quality index according to the surface integrity and the side integrity, wherein the calculation formula is:

[0071] s(c)=[B(M)*a+C(D)*b]*100%;

[0072] Among them, s(c) represents the PCB material quality index, B(M) represents the surface integrity, a represents the surface integrity weight value, C(D) represents the side integrity, and b represents the side integrity weight value.

[0073] The present application also provides a computer device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above method when executing the computer program.

[0074] The present application also provides a computer-readable storage medium having a computer program stored thereon, which implements the steps of the above method when executed by a processor.

[0075] The beneficial effects of the present application are as follows: the present invention first obtains the segmentation feature information of the PCB material board, wherein the segmentation feature information includes the material board image information and a plurality of preset segmentation required areas, and then obtains the material board area and material board appearance feature information according to the material board image information, so that after obtaining the material board area and material board appearance feature information, it can provide a basis for subsequent re-layout, and at the same time, it can obtain the surface integrity and side integrity according to the material board appearance feature information, and obtain the PCB board quality index according to the surface integrity and side integrity, so that under the action of the PCB board quality index, it can be quickly judged whether the PCB material board has defects, and whether the PCB board quality index is greater than the preset PCB board quality index. If the PCB board quality index is not large, Based on the preset PCB board quality index, it is determined that the PCB board has defects, and the board defect location information is obtained based on the board appearance feature information. The board area is marked based on the board defect location information to obtain the defect-marked PCB board area. In this way, after obtaining the defect-marked PCB board area, it can be avoided and the PCB board can be re-layouted. At the same time, multiple preset segmentation requirement areas are layout-adapted with the defect-marked PCB board area through CAD to obtain adapted layout information. Then, the PCB board is cut and laid out according to the adapted layout information. In this way, the re-layouted PCB board can reuse the defective PCB board, and the problem of large-scale board waste can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] Figure 1 This is a schematic diagram of a method flow chart according to an embodiment of the present application.

[0077] Figure 2 This is a schematic diagram of the system structure of an embodiment of the present application.

[0078] Figure 3 This is a schematic diagram of the internal structure of a computer device according to an embodiment of the present application.

[0079] Figure 4 This is a schematic diagram related to a PCB material board according to an embodiment of the present application.

[0080] The purpose, features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0081] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0082] like Figure 1-3 As shown, the present application provides a PCB cutting and layout method, which is applied to an earphone charging stand detection platform, comprising:

[0083] S1. Acquire segmentation feature information of a PCB board, wherein the segmentation feature information includes board image information and a plurality of preset segmentation required areas;

[0084] S2. Obtaining the sheet area and sheet appearance feature information based on the sheet image information, obtaining the surface integrity and side integrity based on the sheet appearance feature information, and obtaining the PCB board quality index based on the surface integrity and side integrity;

[0085] S3, determining whether the PCB board quality index is greater than a preset PCB board quality index;

[0086] If the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has a defect, and the board defect location information is obtained based on the board appearance feature information, and the board area is marked according to the board defect location information to obtain the defect-marked PCB board area;

[0087] S4. Based on CAD, the plurality of preset segmentation required areas are adapted to the defect-marked PCB material area to obtain adapted layout information;

[0088] S5. Cutting and layout processing are performed on the PCB material board according to the adapted layout information.

[0089] As described in steps S1-S5 above, during the processing of PCB board materials, it is necessary to layout the board materials. However, during the processing of existing PCB boards, layout and segmentation of segmented areas with uniform area specifications are usually performed. In this way, when a board defect is encountered, the preset segmented area with the board defect will be discarded, which will cause a large amount of board waste. Therefore, the present invention first obtains segmentation feature information of the PCB board, wherein the segmentation feature information includes board image information and multiple preset segmentation required areas, and then obtains board area and board appearance feature information based on the board image information. In this way, after obtaining the board area and board appearance feature information, a basis can be provided for subsequent re-layout. At the same time, the surface integrity and side integrity can be obtained based on the board appearance feature information, and the PCB board quality index can be obtained based on the surface integrity and side integrity. In this way, the PCB board quality index can be used to quickly judge the PCB board quality. Whether the CB material board has defects, and whether the PCB material quality index is greater than the preset PCB material quality index is judged. If the PCB material quality index is not greater than the preset PCB material quality index, it is determined that the PCB material board has defects, and the material board defect position information is obtained according to the material board appearance feature information, and the material board area is marked according to the material board defect position information to obtain the defective marked PCB material board area. In this way, after obtaining the defective marked PCB material board area, it can be avoided and the PCB material board is re-layouted. The specific steps are: based on CAD, multiple preset segmentation requirement areas are layout-adapted with the defective marked PCB material board area to obtain adapted layout information, and then the PCB material board is cut and laid out according to the adapted layout information. In this way, the re-layouted PCB material board can reuse the defective PCB material board, and at the same time, it can also avoid the problem of causing a large amount of material board waste.

[0090] In one embodiment, the step S2 of obtaining the surface integrity and the side integrity according to the appearance feature information of the material board, and obtaining the PCB board quality index according to the surface integrity and the side integrity includes:

[0091] S201, performing grayscale processing on the image information of the sheet material to obtain black and white surface image information, filtering the black and white surface image information to obtain black stripes, setting coordinates for both ends of the black stripes to obtain first coordinates and second coordinates, calculating the surface crack length of the black stripes based on the first coordinates and the second coordinates, and obtaining a corresponding first weight value based on the surface crack length;

[0092] S202, transmitting a plurality of acoustic wave pulse signals toward the black stripes using an acoustic wave scanner, and receiving a plurality of rebound signals returned after the acoustic wave pulse signals hit the black stripes, obtaining a surface crack depth based on the plurality of rebound signals, and obtaining a corresponding second weight value based on the surface crack depth;

[0093] S203, obtaining contour information of the black stripes based on Canny edge detection, and obtaining multiple crack widths between openings of the black stripes based on the contour information of the black stripes, sorting the multiple crack widths in ascending order to obtain a crack width sorting table, using the last crack width in the crack width sorting table as the apparent crack width, and obtaining a corresponding third weight value based on the apparent crack width;

[0094] S204, obtaining a preset crack length judgment threshold according to the surface crack length;

[0095] S205: Obtaining a preset crack depth judgment threshold according to the surface crack depth;

[0096] S206, obtaining a preset crack width judgment threshold according to the surface crack width;

[0097] S207: Calculate the surface integrity based on the surface crack length, surface crack depth, surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value, and a third weight value, wherein the calculation formula is:

[0098]

[0099] Wherein, B(M) represents surface integrity, H(c) represents surface crack length, H(s) represents surface crack depth, H(k) represents surface crack width, Y(c) represents a preset crack length judgment threshold, Y(s) represents a preset crack depth judgment threshold, Y(k) represents a preset crack width judgment threshold, d(y) represents a first weight value, d(e) represents a second weight value, and d(s) represents a third weight value;

[0100] S208. Obtaining a first dark stripe and side smoothness of the PCB side surface based on the black-and-white surface image information, obtaining a side stripe crack width based on the first dark stripe, and obtaining a side integrity based on the side stripe crack width and the side smoothness, wherein the side integrity is calculated in the same manner as the surface integrity.

[0101] S209, obtaining a corresponding surface integrity weight value according to the surface integrity;

[0102] S2010, obtaining a corresponding aspect integrity weight value according to the aspect integrity;

[0103] S2011. Calculate the PCB board quality index based on the surface integrity and the side integrity, wherein the calculation formula is:

[0104] s(c)=[B(M)*a+C(D)*b]*100%;

[0105] Among them, s(c) represents the PCB material quality index, B(M) represents the surface integrity, a represents the surface integrity weight value, C(D) represents the side integrity, and b represents the side integrity weight value.

[0106] As described in steps S201-S2011 above, since defects on PCB boards are typically cracks on the sides and surfaces, it is necessary to locate the crack locations on the PCB boards. Since cracks appear black or dark black in the grayscale-processed image, the present invention first grayscale-processes the board image information to obtain black and white surface image information, and then filters the black and white surface image information to obtain black stripes. In this way, the locations of defects on the PCB board surface can be determined based on the black stripes. Since the length, width, and depth of the crack all have a certain impact on the PCB board, coordinates are established for both ends of the black stripe to obtain first and second coordinates. The apparent crack length of the black stripe is then calculated based on the first and second coordinates. For example, if one end of the crack is at coordinates (100, 200) and the other end is at coordinates (300, 400), and the length is measured in mm, the crack length can be calculated using the following formula: And obtain the corresponding first weight value according to the surface crack length, so that after obtaining the surface crack length, it is helpful to evaluate the severity of the crack, and then based on the acoustic scanner, transmit multiple acoustic pulse signals to the black stripe, and receive multiple rebound signals returned after the multiple acoustic pulse signals hit the black stripe, obtain the surface crack depth according to the multiple rebound signals, and obtain the corresponding second weight value according to the surface crack depth, so that the damage degree of the surface crack depth can be determined, and then obtain the contour information of the black stripe based on Canny edge detection, and obtain multiple crack widths between the openings of the black stripe according to the contour information of the black stripe, sort the multiple crack widths in ascending order, and obtain a crack width sorting table, and use the last crack width in the crack width sorting table as the surface crack width, and the surface crack width is also an important parameter basis for judging the integrity of the PCB, and then obtain a preset crack length judgment threshold according to the surface crack length, and then obtain a preset crack depth judgment threshold according to the surface crack depth, and then obtain a preset crack width judgment threshold according to the surface crack width, and finally, according to the surface crack length, surface crack depth, and surface The surface integrity is calculated based on the crack width, the preset crack length judgment threshold, the preset crack depth judgment threshold, the preset crack width judgment threshold, the first weight value, the second weight value, and the third weight value. The surface integrity can be used to judge the integrity of the PCB material surface and provide a basis for calculating the PCB material quality index. Next, a first dark stripe and the side flatness of the PCB side are obtained based on the black and white surface image information, and the side stripe crack width is obtained based on the first dark stripe. The side integrity is obtained based on the side stripe crack width and the side flatness. The side integrity is calculated in the same manner as the surface integrity. Thus, after obtaining the surface integrity and side integrity, the PCB material quality index can be fully obtained. Next, a corresponding surface integrity weight value is obtained based on the surface integrity, and then a corresponding side integrity weight value is obtained based on the side integrity. Finally, the PCB material quality index is calculated based on the surface integrity and side integrity. The PCB material quality index can be used to understand the integrity of the PCB material and provide an important basis for subsequent PCB material defect judgment. The aforementioned numerical values ​​are for illustration only and are not intended to be exclusive references.

[0107] In one embodiment, the step S3 of acquiring the sheet defect position information according to the sheet appearance feature information includes:

[0108] S301, obtaining a plurality of first corner fixed point coordinates corresponding to the area of ​​the sheet, and selecting one of the plurality of first corner fixed point coordinates as a first origin coordinate;

[0109] S302: Obtain a corresponding first center point according to the black stripe, and obtain first coordinates of the first center point according to the first origin coordinates and the first center point;

[0110] S303: Acquire multiple corresponding second corner fixed-point coordinates according to the side surface area, and select one of the multiple second corner fixed-point coordinates as the second origin coordinate;

[0111] Obtain a corresponding second center point according to the first dark stripe, and obtain second coordinates of the second center point according to the second origin coordinates and the second center point;

[0112] S304: Use the position information corresponding to the first coordinate and the second coordinate as the sheet material defect position information.

[0113] As described in the above steps S301-S304, after determining that the PCB material board has defects, it is necessary to identify the defect position and provide a basis for the subsequent re-cutting and layout of the PCB material board. Therefore, first obtain the corresponding multiple first corner fixed point coordinates according to the area of ​​the material board, and select one as the first origin coordinate based on the multiple first corner fixed point coordinates. In this way, a coordinate system can be established based on the first origin coordinates to facilitate subsequent calculation and positioning. Then, obtain the corresponding first center point according to the black stripe, and obtain the first coordinate of the first center point according to the first origin coordinate and the first center point. Then, obtain the corresponding multiple second corner fixed point coordinates according to the side surface area, and select one as the second origin coordinate based on the multiple second corner fixed point coordinates. In this way, the potential defect area can be inferred from the position of the black stripe, and provide a basis for subsequent re-layout. Then, obtain the corresponding second center point according to the first dark stripe, and obtain the second coordinate of the second center point according to the second origin coordinate and the second center point (such as Figure 4 As shown), the position corresponding to the first coordinate and the second coordinate is the defect position of the material sheet. After obtaining the defect position of the material sheet, it can provide an important basis for the subsequent rearrangement and segmentation path planning and the adaptation of the preset segmentation requirement area.

[0114] In one embodiment, the step S3 of marking the board area according to the board defect position information to obtain the defect-marked PCB board area includes:

[0115] S301: Obtain the corresponding dark stripe depth according to the first dark stripe, and obtain the area of ​​the PCB material board with side defects according to the dark stripe depth and the side stripe crack width;

[0116] S302, obtaining the area of ​​the PCB material with surface defects based on the coordinates of the second origin and the length of the surface crack, wherein the coordinates of the second origin are used as the center of the circle and the length of the surface crack is used as the diameter;

[0117] S303: Mark the PCB board area with side defects and the PCB board area with surface defects respectively to obtain the PCB board area with side defects and the PCB board area with surface defects, and use the PCB board area with side defects and the PCB board area with surface defects as the PCB board area with defect marks.

[0118] As described in the above steps S301-S303, since the defect position of the material board affects the segmentation and layout of the PCB, it is necessary to mark the area corresponding to the defect position of the material board, and then provide data support for subsequent re-planning. On this basis, the present invention first obtains the corresponding dark stripe depth according to the first dark stripe, and obtains the side defect PCB material board area according to the dark stripe depth and the side stripe crack width. Since it is necessary to cut the surface of the PCB material board when removing the defective part of the PCB material board, the dark stripe depth in the surface represents the width, and the side stripe crack width in the surface represents the length (such as Figure 4 As shown), the area of ​​the PCB material board with side defects is the product of the depth of the dark stripes and the width of the cracks on the side stripes. Then, the area of ​​the PCB material board with surface defects is obtained according to the coordinates of the second origin and the length of the surface cracks, where the coordinates of the second origin are taken as the center of the circle and the length of the surface cracks are taken as the diameter (as shown). Figure 4 As shown in the figure, after the side and surface defects are standardized, an important basis can be provided for subsequent rearrangement (such as defect path avoidance), and then the side defect PCB board area and the surface defect PCB board area are marked respectively to obtain the side defect marked PCB board area and the surface defect marked PCB board area, and the side defect marked PCB board area and the surface defect marked PCB board area are used as the defect marked PCB board area. After knowing the defect marked PCB board area, a basis can be provided for rearrangement of PCB boards that are scrapped due to defects in a targeted manner. In this way, a large amount of materials can be saved and a large amount of waste can be avoided after rearrangement.

[0119] In one embodiment, the step S4 of performing layout adaptation on the plurality of preset segmentation required areas and the defective marked PCB material area based on CAD to obtain adapted layout information includes:

[0120] S401, obtaining the actual use area of ​​the PCB material board according to the defect marked PCB material board area;

[0121] S402: Randomly arranging the preset required segmentation area as particles on the actual use area based on particle swarm optimization to obtain multiple layouts, wherein each particle represents a PCB layout;

[0122] S403, obtaining corresponding layout characteristic parameters according to the plurality of layout layouts, wherein the layout characteristic parameters include a plurality of cutting paths, a plurality of layout area utilization rates, a plurality of segmentation safety distances, and a plurality of preset segmentation required area layout quantities, and sequentially calculating a plurality of fitness comprehensive values ​​according to the plurality of cutting paths, the plurality of layout area utilization rates, the plurality of segmentation safety distances, and the plurality of preset segmentation required area layout quantities, wherein the calculation formula is:

[0123] S(i...n)=[L(J) i *C i +X(L) i *D i +J(L) i *E i +S(L) i *F i ] i ;...;

[0124] [L(J) n *C n +X(L) n *D n +J(L) n *E n +S(L) n *F n ] n ;

[0125] Among them, S(i...n) represents the comprehensive value of fitness from the i-th to the n-th, L(J) i represents the i-th cutting path, C i Indicates the weight value of the i-th cutting path, X(L) i Indicates the utilization rate of the i-th typesetting area, D i Indicates the weight value of the i-th layout area utilization, J(L) i represents the i-th segmentation safety distance, E i Represents the weight value of the i-th segmentation safety distance, S(L) i Indicates the layout quantity of the i-th preset segmentation area requirement, F i represents the weight value of the layout quantity of the i-th preset segmentation requirement area, where i represents the counting number, i=1, 2, 3...n;

[0126] S404. Filter the multiple comprehensive suitability values ​​according to the maximum value to obtain a first screening comprehensive suitability value, use the typesetting layout corresponding to the first screening comprehensive suitability value as the optimal typesetting solution, and perform typesetting adaptation on the PCB material board based on the typesetting layout corresponding to the first screening comprehensive suitability value based on CAD to obtain adapted typesetting information.

[0127] As described in the above steps S401-S404, the present invention first obtains the actual usage area of ​​the PCB material board according to the area of ​​the defective marked PCB material board, so that the PCB material board can be rearranged and segmented according to the actual usage area, and then the preset segmentation requirement area is randomly arranged as particles on the actual usage area based on particle swarm optimization to obtain multiple layout layouts, wherein each particle represents a PCB layout layout, wherein the particle swarm optimization algorithm is an optimization method that simulates social behavior, and finds the optimal solution to the problem through information exchange and collaboration between particles. Its simplicity and flexibility make it an effective tool for solving various complex optimization problems. Since multiple factors need to be considered in the rearrangement process, and each layout scheme corresponds to a set of operation data, usually the operation data includes cutting path, layout area utilization, segmentation safety distance and preset segmentation requirement area layout quantity, so it is only necessary to find the optimal solution among these factors, and the optimal solution is the optimal solution. The solution is the best adaptation solution, and the screening of the optimal solution is judged by the comprehensive value of suitability. Therefore, the corresponding layout feature parameters are obtained according to the multiple layout layouts, wherein the layout feature parameters include multiple cutting paths, multiple layout area utilization rates, multiple segmentation safety distances and multiple preset segmentation requirement area layout quantities, and multiple comprehensive suitability values ​​are calculated in turn according to the multiple cutting paths, multiple layout area utilization rates, multiple segmentation safety distances and multiple preset segmentation requirement area layout quantities, and then the multiple comprehensive suitability values ​​are screened according to the maximum value to obtain a first screening comprehensive suitability value, and the layout layout corresponding to the first screening comprehensive suitability value is used as the optimal layout solution, and the PCB material board is layout-adapted based on the layout layout corresponding to the first screening comprehensive suitability value based on CAD to obtain adapted layout information, so that the best segmentation solution can be provided for the PCB material board through adapted layout information.

[0128] In one embodiment, the step S5 of cutting and typesetting the PCB material board according to the adapted typesetting information includes:

[0129] S501: Acquire corresponding first preset segmentation required areas according to the adaptive layout information;

[0130] S502: Acquire a corresponding first cutting path according to the adaptation layout information, and perform cutting and layout processing on the PCB material board according to the first cutting path for the plurality of first preset segmentation required areas.

[0131] As described in the above steps S501-S502, the present invention first obtains the corresponding multiple first preset segmentation required areas according to the adaptive layout information, then obtains the corresponding first cutting path according to the adaptive layout information, and cuts and lays out the multiple first preset segmentation required areas on the PCB material board according to the first cutting path. In this way, the defective PCB material board can be reused after the rearrangement of the PCB material board, and the problem of wasting a large amount of material boards can be avoided.

[0132] This application also provides a PCB cutting and layout system, including:

[0133] A first acquisition module is configured to acquire segmentation feature information of a PCB board, wherein the segmentation feature information includes board image information and a plurality of preset segmentation required areas;

[0134] A second acquisition module is used to obtain the material board area and material board appearance feature information based on the material board image information, obtain the surface integrity and side integrity based on the material board appearance feature information, and obtain the PCB board quality index based on the surface integrity and side integrity;

[0135] A first judgment module is used to judge whether the PCB material quality index is greater than a preset PCB material quality index;

[0136] If the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has a defect, and the board defect location information is obtained based on the board appearance feature information, and the board area is marked according to the board defect location information to obtain the defect-marked PCB board area;

[0137] The first layout module is used to perform layout adaptation on the plurality of preset segmentation required areas and the defective marked PCB material board area based on CAD to obtain adaptation layout information;

[0138] The first processing module is used to cut and layout the PCB material board according to the adapted layout information.

[0139] In one embodiment, the second acquisition module includes:

[0140] a first acquisition unit, configured to perform grayscale processing on the sheet image information to obtain black and white surface image information, filter the black and white surface image information to obtain black stripes, establish coordinates for both ends of the black stripes to obtain first coordinates and second coordinates, calculate the surface crack length of the black stripes based on the first coordinates and the second coordinates, and obtain a corresponding first weight value based on the surface crack length;

[0141] a second acquiring unit, configured to transmit a plurality of acoustic wave pulse signals toward the black stripes based on an acoustic wave scanner, and receive a plurality of rebound signals returned after the acoustic wave pulse signals impact the black stripes, acquire a surface crack depth based on the plurality of rebound signals, and acquire a corresponding second weight value based on the surface crack depth;

[0142] a third acquisition unit, configured to acquire contour information of the black stripes based on Canny edge detection, and acquire multiple crack widths between openings of the black stripes based on the contour information of the black stripes, sort the multiple crack widths in ascending order to obtain a crack width sorting table, use the last crack width in the crack width sorting table as the apparent crack width, and acquire a corresponding third weight value based on the apparent crack width;

[0143] A fourth acquiring unit, configured to acquire a preset crack length determination threshold value according to the surface crack length;

[0144] A fifth obtaining unit, configured to obtain a preset crack depth judgment threshold according to the surface crack depth;

[0145] a sixth obtaining unit, configured to obtain a preset crack width judgment threshold value according to the surface crack width;

[0146] A first calculation unit is configured to calculate the surface integrity based on the surface crack length, the surface crack depth, the surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value, and a third weight value, wherein the calculation formula is:

[0147]

[0148] Wherein, B(M) represents surface integrity, H(c) represents surface crack length, H(s) represents surface crack depth, H(k) represents surface crack width, Y(c) represents a preset crack length judgment threshold, Y(s) represents a preset crack depth judgment threshold, Y(k) represents a preset crack width judgment threshold, d(y) represents a first weight value, d(e) represents a second weight value, and d(s) represents a third weight value;

[0149] a seventh acquiring unit, configured to acquire a first dark stripe and side smoothness on a side surface of the PCB based on the black-and-white surface image information, acquire a side stripe crack width based on the first dark stripe, and acquire a side integrity based on the side stripe crack width and side smoothness, wherein the side integrity is calculated in the same manner as the surface integrity;

[0150] an eighth acquiring unit, configured to acquire a corresponding surface integrity weight value according to the surface integrity;

[0151] a ninth acquiring unit, configured to acquire a corresponding aspect integrity weight value according to the aspect integrity;

[0152] The second calculation unit is used to calculate the PCB board quality index according to the surface integrity and the side integrity, wherein the calculation formula is:

[0153] s(c)=[B(M)*a+C(D)*b]*100%;

[0154] Among them, s(c) represents the PCB material quality index, B(M) represents the surface integrity, a represents the surface integrity weight value, C(D) represents the side integrity, and b represents the side integrity weight value.

[0155] The present invention also provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the above-mentioned method for PCB cutting and layout are implemented.

[0156] Those skilled in the art will understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media provided in this application and used in the embodiments may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (SSRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct RAMbus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM).

[0157] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, apparatus, article, or method comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, apparatus, article, or method. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, apparatus, article, or method comprising the element.

[0158] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the present invention description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A PCB cutting and layout method, characterized in that: include: Acquire segmentation feature information of a PCB board, wherein the segmentation feature information includes board image information and a plurality of preset segmentation required areas; Obtaining a sheet area and sheet appearance feature information based on the sheet image information, obtaining a surface integrity and a side integrity based on the sheet appearance feature information, and obtaining a PCB board quality index based on the surface integrity and the side integrity, specifically performing grayscale processing on the sheet image information to obtain black and white surface image information, filtering the black and white surface image information to obtain black stripes, establishing coordinates for both ends of the black stripes to obtain first coordinates and second coordinates, calculating an external crack length of the black stripes based on the first coordinates and the second coordinates, and obtaining a corresponding first weight value based on the external crack length; The method comprises: transmitting a plurality of acoustic wave pulse signals toward the black stripes based on an acoustic wave scanner, receiving a plurality of rebound signals returned after the acoustic wave pulse signals hit the black stripes, obtaining a surface crack depth based on the plurality of rebound signals, and obtaining a corresponding second weight value based on the surface crack depth; Obtaining contour information of the black stripes based on Canny edge detection, and obtaining multiple crack widths between openings of the black stripes based on the contour information of the black stripes, sorting the multiple crack widths in ascending order to obtain a crack width sorting table, using the last crack width in the crack width sorting table as the apparent crack width, and obtaining a corresponding third weight value based on the apparent crack width; Obtaining a preset crack length judgment threshold according to the surface crack length; Obtaining a preset crack depth judgment threshold according to the surface crack depth; Obtaining a preset crack width judgment threshold according to the surface crack width; The surface integrity is calculated based on the surface crack length, surface crack depth, surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value, and a third weight value, wherein the calculation formula is: Wherein, B(M) represents surface integrity, H(c) represents surface crack length, H(s) represents surface crack depth, H(k) represents surface crack width, Y(c) represents a preset crack length judgment threshold, Y(s) represents a preset crack depth judgment threshold, Y(k) represents a preset crack width judgment threshold, d(y) represents a first weight value, d(e) represents a second weight value, and d(s) represents a third weight value; Obtaining a first dark stripe and side smoothness of the PCB side surface based on the black and white surface image information, obtaining a side stripe crack width based on the first dark stripe, and obtaining a side integrity based on the side stripe crack width and side smoothness, wherein the side integrity is calculated in the same manner as the surface integrity; Obtaining a corresponding surface integrity weight value according to the surface integrity; Obtaining a corresponding aspect integrity weight value according to the aspect integrity; The PCB board quality index is calculated based on the surface integrity and side integrity, wherein the calculation formula is: s(c)=[B(M)*a+C(D)*b]*100%; Where, s(c) represents the PCB material quality index, B(M) represents the surface integrity, a represents the surface integrity weight value, C(D) represents the side integrity, and b represents the side integrity weight value; Determining whether the PCB board quality index is greater than a preset PCB board quality index; If the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has a defect, and the board defect location information is obtained based on the board appearance feature information, and the board area is marked based on the board defect location information to obtain the defect-marked PCB board area. Specifically, the depth of the dark stripe corresponding to the first dark stripe is obtained, and the area of ​​the PCB board with side defects is obtained based on the dark stripe depth and the side stripe crack width. Obtain the surface defect PCB material area according to the second origin coordinate and the surface crack length, wherein the second origin coordinate is used as the center of the circle and the surface crack length is used as the diameter; Marking the side defect PCB board area and the surface defect PCB board area respectively to obtain the side defect marked PCB board area and the surface defect marked PCB board area, and using the side defect marked PCB board area and the surface defect marked PCB board area as the defect marked PCB board area; Based on CAD, the plurality of preset segmentation required areas are adapted to the defect-marked PCB material area to obtain adapted layout information; The PCB material board is cut and laid out according to the adapted layout information.

2. The PCB cutting and layout method according to claim 1, characterized in that: The step of obtaining the material sheet defect position information according to the material sheet appearance feature information includes: Acquire a plurality of first corner fixed point coordinates corresponding to the sheet area, and select one of the plurality of first corner fixed point coordinates as a first origin coordinate; Obtaining a corresponding first center point according to the black stripes, and obtaining first coordinates of the first center point according to the first origin coordinates and the first center point; Acquire a plurality of corresponding second corner fixed point coordinates according to the side surface area, and select one of the plurality of second corner fixed point coordinates as the second origin coordinate; Obtain a corresponding second center point according to the first dark stripe, and obtain second coordinates of the second center point according to the second origin coordinates and the second center point; The position information corresponding to the first coordinate and the second coordinate is used as the sheet material defect position information.

3. The PCB cutting and layout method according to claim 1, characterized in that: The step of performing layout adaptation on the plurality of preset segmentation requirement areas and the defect mark PCB material board area based on CAD to obtain adapted layout information includes: Obtain the actual usage area of ​​the PCB board according to the defect marked PCB board area; Based on particle swarm optimization, the preset segmentation required area is randomly arranged as particles on the actual use area to obtain multiple layouts, wherein each particle represents a PCB layout; Corresponding layout feature parameters are obtained according to the multiple layout layouts, wherein the layout feature parameters include multiple cutting paths, multiple layout area utilization rates, multiple segmentation safety distances, and multiple preset segmentation required area layout quantities, and multiple applicability comprehensive values ​​are calculated in sequence according to the multiple cutting paths, multiple layout area utilization rates, multiple segmentation safety distances, and multiple preset segmentation required area layout quantities, wherein the calculation formula is: S(i...n)=[L(J) i *C i +X(L) i *D i +J(L) i *E i +S(L) i *F i ] i ;...;[L(J) n * C n +X(L) n *D n +J(L) n *E n +S(L) n *F n ] n ; Among them, S(i...n) represents the comprehensive value of fitness from the i-th to the n-th, L(J) i represents the i-th cutting path, C i Indicates the weight value of the i-th cutting path, X(L) i Indicates the utilization rate of the i-th typesetting area, D i Indicates the weight value of the i-th layout area utilization, J(L) i represents the i-th segmentation safety distance, E i Represents the weight value of the i-th segmentation safety distance, S(L) i Indicates the layout quantity of the i-th preset segmentation area requirement, F i represents the weight value of the layout quantity of the i-th preset segmentation requirement area, where i represents the counting number, i=1, 2, 3...n; The multiple comprehensive suitability values ​​are filtered according to the maximum value to obtain a first screening comprehensive suitability value, the layout layout corresponding to the first screening comprehensive suitability value is used as the optimal layout scheme, and the PCB material board is layout-adapted based on the layout layout corresponding to the first screening comprehensive suitability value based on CAD to obtain adapted layout information.

4. The PCB cutting and layout method according to claim 1, wherein: The step of cutting and typesetting the PCB material board according to the adapted typesetting information includes: Acquire corresponding multiple first preset segmentation required areas according to the adaptive layout information; A corresponding first cutting path is obtained according to the adaptation layout information, and a plurality of the first preset segmentation required areas are cut and laid out on the PCB material board according to the first cutting path.

5. A PCB cutting and layout system, used to execute the PCB cutting and layout method according to any one of claims 1 to 4, characterized in that: include: A first acquisition module is configured to acquire segmentation feature information of a PCB board, wherein the segmentation feature information includes board image information and a plurality of preset segmentation required areas; A second acquisition module is used to obtain the material board area and material board appearance feature information based on the material board image information, obtain the surface integrity and side integrity based on the material board appearance feature information, and obtain the PCB board quality index based on the surface integrity and side integrity; A first judgment module is used to judge whether the PCB material quality index is greater than a preset PCB material quality index; If the PCB board quality index is not greater than the preset PCB board quality index, it is determined that the PCB board has a defect, and the board defect location information is obtained based on the board appearance feature information, and the board area is marked according to the board defect location information to obtain the defect-marked PCB board area; The first layout module is used to perform layout adaptation on the plurality of preset segmentation required areas and the defective marked PCB material board area based on CAD to obtain adaptation layout information; The first processing module is used to cut and layout the PCB material board according to the adapted layout information.

6. The PCB cutting and layout system according to claim 5, characterized in that: The second acquisition module includes: a first acquisition unit, configured to perform grayscale processing on the sheet image information to obtain black and white surface image information, filter the black and white surface image information to obtain black stripes, establish coordinates for both ends of the black stripes to obtain first coordinates and second coordinates, calculate the surface crack length of the black stripes based on the first coordinates and the second coordinates, and obtain a corresponding first weight value based on the surface crack length; a second acquiring unit, configured to transmit a plurality of acoustic wave pulse signals toward the black stripes based on an acoustic wave scanner, and receive a plurality of rebound signals returned after the acoustic wave pulse signals impact the black stripes, acquire a surface crack depth based on the plurality of rebound signals, and acquire a corresponding second weight value based on the surface crack depth; a third acquisition unit, configured to acquire contour information of the black stripes based on Canny edge detection, and acquire multiple crack widths between openings of the black stripes based on the contour information of the black stripes, sort the multiple crack widths in ascending order to obtain a crack width sorting table, use the last crack width in the crack width sorting table as the apparent crack width, and acquire a corresponding third weight value based on the apparent crack width; A fourth acquiring unit, configured to acquire a preset crack length determination threshold value according to the surface crack length; A fifth obtaining unit, configured to obtain a preset crack depth judgment threshold according to the surface crack depth; a sixth obtaining unit, configured to obtain a preset crack width judgment threshold value according to the surface crack width; A first calculation unit is configured to calculate the surface integrity based on the surface crack length, the surface crack depth, the surface crack width, a preset crack length judgment threshold, a preset crack depth judgment threshold, a preset crack width judgment threshold, a first weight value, a second weight value, and a third weight value, wherein the calculation formula is: Wherein, B(M) represents surface integrity, H(c) represents surface crack length, H(s) represents surface crack depth, H(k) represents surface crack width, Y(c) represents a preset crack length judgment threshold, Y(s) represents a preset crack depth judgment threshold, Y(k) represents a preset crack width judgment threshold, d(y) represents a first weight value, d(e) represents a second weight value, and d(s) represents a third weight value; a seventh acquiring unit, configured to acquire a first dark stripe and side smoothness on a side surface of the PCB based on the black-and-white surface image information, acquire a side stripe crack width based on the first dark stripe, and acquire a side integrity based on the side stripe crack width and side smoothness, wherein the side integrity is calculated in the same manner as the surface integrity; an eighth acquiring unit, configured to acquire a corresponding surface integrity weight value according to the surface integrity; a ninth acquiring unit, configured to acquire a corresponding aspect integrity weight value according to the aspect integrity; The second calculation unit is used to calculate the PCB board quality index according to the surface integrity and the side integrity, wherein the calculation formula is: s(c)=[B(M)*a+C(D)*b]*100%; Among them, s(c) represents the PCB material quality index, B(M) represents the surface integrity, a represents the surface integrity weight value, C(D) represents the side integrity, and b represents the side integrity weight value.

7. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 4 are implemented.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 4 are implemented.

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