Welding operation table for precise electronic component welding

Abstract

The invention relates to the field of welding operation tables for welding, and discloses a welding operation table for precise electronic component welding, which comprises a bottom plate, a supporting column is fixedly mounted at the bottom end of the bottom plate, a tool box and a tin soldering bin are arranged at the top end of the bottom plate, and a moving device is arranged on the tin soldering bin; the moving device comprises a first fixing plate, a first moving column and a moving part, two first threaded rods are rotationally installed on the upper portion of the first fixing plate, the outer walls of the first threaded rods are meshed with the first moving column, the first threaded rods rotate to drive the first moving column and the moving part to move, and a liquid receiving device is arranged on the moving part; the first damping rod and the second damping rod on the direction detection device stretch out and draw back to drive the direction transmission part to adjust the angle, so that the movement direction of the soldering tin collecting pipe is detected and determined, the equidistant transmission part is driven by the equidistant transmission part to adjust the direction and moves to the position under the pins of the welded circuit board, and the soldering tin collecting pipe is fixed. And the problems of sputtering and difficult cleaning caused by tin liquid dripping are prevented.

Description

Technical Field

[0001] The invention relates to the technical field of welding operation tables, and more specifically, to a welding operation table for welding precision electronic components. Background Art

[0002] Precision electronic components refer to electronic components with extremely high precision and stability, including resistors, capacitors, inductors, transistors, diodes, integrated circuits, etc.; these components play a key role in electronic technology and are widely used in communications, computers, home appliances and other fields. There are many ways to weld precision electronic components, including selective wave soldering.

[0003] The patent with publication number CN117324716A discloses a precision electronic component welding equipment and its operating table, including a workbench, and an operating surface and welding equipment fixedly installed on the workbench; the welding equipment includes a solder state maintaining device and a circuit board mounting device; a welding position identification device is also arranged in the welding state maintaining device for welding position identification and a solder conveying device; the solder conveying device includes a conveying pipe, and a lifting cover and a protective frame are respectively arranged at the top end of the outer periphery of the conveying pipe from the inside to the outside, and a plurality of groups of springs are arranged at the bottom end of the lifting cover; the position is first accurately identified and matched by three groups of cameras, and then accurately positioned by three groups of cameras, and then welded by the conveying pipe, so that the overall welding accuracy in the welding process is greatly increased, and the welding through the conveying pipe increases the efficiency of the overall welding process and reduces the loss of solder.

[0004] During the use of the above-mentioned device, there are openings on all sides of the solder pool, thereby increasing the air circulation during the soldering process, which makes the solder prone to oxidation during the soldering process. When using selective wave soldering to solder the pins, the solder will continue to fall due to surface tension after soldering, and when the solder falls, it is easy to fall outside the tin spray port. If a plate is set under the tin spray port, the solder will solidify quickly after falling and cannot return to the solder pool. It is time-consuming and troublesome to heat it again. Summary of the invention

[0005] The present invention provides a welding operation table for welding precision electronic components, which solves the technical problem in the related art that when selective wave soldering passes through the welding pins, the solder will continue to drop due to surface tension after welding, and when the solder drops, it is easy to drop outside the tin spraying port. If a plate is arranged under the tin spraying port, after dropping, the solder solidifies quickly and cannot return to the solder pool, so it is time-consuming to heat it again.

[0006] The present invention provides a welding operation table for welding precision electronic components, comprising a base plate, a supporting column is fixedly installed at the bottom end of the base plate, a tool box and a solder bin are arranged at the top end of the base plate, and a moving device is arranged on the solder bin; the moving device comprises a first fixed plate, a first moving column and a moving part, two first threaded rods are rotatably installed on the upper part of the first fixed plate, the outer wall of the first threaded rod is engaged with the first moving column, the first threaded rod is rotated to drive the first moving column and the moving part to move, a liquid contacting device is arranged on the moving part, the mobile device drives the liquid contacting device to move for welding electronic components, the liquid contacting device comprises a liquid contacting part, a direction detection device is arranged on the first moving column, and the direction detection device is used to adjust the direction of the liquid contacting part when the mobile device moves to receive the solder liquid dripped after welding.

[0007] As a further optimization scheme of the present invention, the solder bin includes a solder pool fixedly installed on the top of the base plate, a clamping base is provided on the top of the solder pool, a clamping plate is provided on the top of the clamping base, and after the clamping base and the clamping plate are engaged, a clamping frame is formed inside for placing a circuit board, a first opening is provided on the solder pool, and the first opening is used for the moving device to drive the liquid contacting device to move, and a first slide groove is provided on the solder pool at the lower part of the first opening.

[0008] As a further optimization scheme of the present invention, the moving device includes a first fixed plate fixedly installed on the solder pool, a first fixed block is fixedly installed on the top of the first fixed plate, a first threaded rod is rotatably installed inside the first fixed block, two first threaded rods are symmetrically arranged about the first fixed plate, a first moving column is threadedly installed on the outer wall of the first threaded rod, a first slider is rotatably arranged on the outside of the first moving column, the first slider slides on the inner wall of the first slide groove, sixth protrusions are symmetrically arranged on both side walls of the first slider, and moving parts are slidably installed on the inner sides of the two sixth protrusions.

[0009] As a further optimization scheme of the present invention, a first gear is provided at the top of the first movable column, a first tooth is fixedly mounted on the first movable column, a movable part is meshed with an outer wall of the first gear, the movable part includes a first movable tooth plate slidably mounted on the inner sides of the two sixth protrusions, a first limiting ring is fixedly mounted on one end of the first movable tooth plate close to the center of the solder pool, a first protrusion is fixedly mounted on the first movable tooth plate, a fixed frame is fixedly mounted on the first movable tooth plate, and a second protrusion is fixedly mounted on one end of the first movable tooth plate away from the center of the solder pool.

[0010] As a further optimization scheme of the present invention, the direction detection device includes a second fixed block fixedly mounted on the first fixed plate, a first damping rod fixedly mounted on the second fixed block, a second damping rod fixedly mounted on the second protrusion, a direction transmission member is arranged at the top end of the sixth protrusion, the first damping rod and the second damping rod are both connected to the direction transmission member, an equidistant transmission member is slidably mounted inside the fixed frame, and a first motor is arranged outside the equidistant transmission member.

[0011] As a further optimization scheme of the present invention, the direction transmission member includes a first cylinder fixedly installed on the top of the sixth protrusion, the outer wall of the first cylinder is fixedly installed with a third limit block, the interior of the third limit block is provided with a second limit ring, and the interior of the second limit ring is movably installed with a first ball, the top and bottom of the first ball are symmetrically provided with a second telescopic rod, the outer wall of the second telescopic rod has two first round blocks fixedly installed, the outer wall of the first round block is rotatably installed with a second rotating block, the first damping rod and the second damping rod are respectively fixedly installed with a first square slide groove, and the two first square slide grooves are staggered according to height, and the second rotating block away from the center end of the first ball is slidably installed in the interior of the first square slide groove, the top of the third limit block is fixedly installed with a third fixed column, the top of the third fixed column is fixedly installed with a direction limit frame, the inner wall of the direction limit frame is fixedly installed with a first spring, and the first spring is connected to the second telescopic rod arranged at the top of the first ball.

[0012] As a further optimization solution of the present invention, the equidistant transmission member includes a third rotating block rotatably mounted on the outer wall of the upper second telescopic rod, and a fourth fixed column is rotatably mounted on the outer wall of the third rotating block.

[0013] As a further optimization scheme of the present invention, the liquid receiving device includes a solder collecting tube rotatably mounted on the inner wall of the first limiting ring, a fifth protrusion is fixedly mounted on the inner wall of the solder collecting tube, a tin spraying tube is fixedly mounted on the fifth protrusion, a liquid receiving part is provided on the outer wall of the solder collecting tube, a first liquid leakage port is provided inside the solder collecting tube and is connected to the liquid receiving part, a sixth cylinder is rotatably mounted on the top of the first limiting ring, a fifth cylinder is rotatably mounted on the top of the first protrusion, a fourth gear is fixedly mounted on the top of the sixth cylinder, a third gear is fixedly mounted on the top of the fifth cylinder, the third gear is meshed with the liquid receiving part through the fourth gear, one end of the fourth fixed column close to the center of the tin spraying tube is rotatably mounted on the third gear, a seventh protrusion is provided inside the fixed frame, a sixth slider is slidably mounted inside the fourth fixed column, and the sixth slider slides inside the fixed frame through the seventh protrusion.

[0014] As a further optimization scheme of the present invention, the liquid contacting part includes a liquid contacting rotating block fixedly installed on the outer wall of the solder collection tube, a second tooth is fixedly installed on the bottom end of the liquid contacting rotating block, the second tooth is used to engage with the fourth gear, a liquid receiving trough is fixedly installed on the liquid contacting rotating block, a second liquid leakage port is arranged inside the liquid receiving trough, the second liquid leakage port is connected to the first liquid leakage port, and an inclined block is arranged on the liquid receiving trough.

[0015] As a further optimization scheme of the present invention, a fourth protrusion is fixedly installed on the first movable tooth plate, and the fourth protrusion is used to detect the distance between the first ball and the third gear, and the first motor is started according to the distance to adjust the equidistant transmission member.

[0016] The beneficial effects of the present invention are:

[0017] The welding workbench for welding precision electronic components described in the present invention adjusts the movement of the solder collecting tube along the length direction of the first fixed plate by synchronously rotating the two first fixed blocks inside the moving device, and adjusts the movement of the solder collecting tube along the width direction of the first fixed plate by rotating the first fixed plate alone. It is not necessary to provide multiple openings for driving the movement of the solder collecting tube, thereby reducing the contact between the tin liquid inside the solder pool and the air, and reducing the oxidation rate of the tin liquid. The first damping rod and the second damping rod on the direction detection device are extended and retracted to drive the direction transmission member to adjust the angle, thereby detecting the movement direction of the solder collecting tube, adjusting the direction by the equidistant transmission member, and moving it to just below the pins of the circuit board after welding, to prevent the tin liquid from dripping and causing splashing and difficulty in cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is the appearance diagram of the overall device of the present invention;

[0019] Figure 2 It is a rear view of the overall device of the present invention;

[0020] Figure 3 This is a structural diagram of the solder bin position of the present invention;

[0021] Figure 4 It is a partial connection diagram of the solder bin of the present invention;

[0022] Figure 5 This is the internal transmission diagram of the solder bin of the present invention;

[0023] Figure 6 It is the overall transmission diagram of the mobile device of the present invention;

[0024] Figure 7 It is an overall coordination diagram of the mobile device and the direction detection device of the present invention;

[0025] Figure 8It is the transmission matching diagram of the directional transmission member of the present invention;

[0026] Fig. 9 It is a structural diagram of the position of the directional transmission member of the present invention;

[0027] Fig.10 Internal connection diagram of the liquid receiving device of the present invention;

[0028] Fig.11 It is the internal transmission diagram of the liquid contact device of the present invention.

[0029] In the figure:

[0030] 1. Bottom plate; 11. Support column; 12. Tool box; 13. Solder bin; 131. Solder pool; 132. Clamping base; 133. Clamping plate; 134. Clamping frame; 135. First opening; 136. First slide groove;

[0031] 2. Moving device; 21. First fixing plate; 22. First fixing block; 23. First threaded rod; 24. First slider; 241. Sixth protrusion; 25. First moving column; 251. First gear; 252. First tooth; 26. Moving member; 261. First moving tooth plate; 262. First limiting ring; 263. Fixed frame; 264. First protrusion; 265. Second protrusion; 266. Fourth protrusion; 267. Seventh protrusion;

[0032] 3. Direction detection device; 31. Second fixed block; 32. First damping rod; 33. Second limiting ring; 34. Direction transmission member; 341. First cylinder; 342. Third limiting block; 343. First ball; 344. Second telescopic rod; 345. First round block; 346. Second rotating block; 3461. First square slide; 347. Third fixed column; 348. Direction limiting frame; 349. First spring; 35. Second damping rod; 36. First motor; 37. Equidistant transmission member; 371. Third rotating block; 372. Fourth fixed column; 373. Sixth sliding block;

[0033] 4. Liquid receiving device; 41. Solder collecting tube; 411. Fifth protrusion; 412. First liquid leakage port; 42. Tin spraying tube; 43. Liquid receiving part; 431. Liquid receiving rotating block; 432. Second tooth; 433. Liquid receiving groove; 434. Second liquid leakage port; 435. Inclined block; 44. Fifth cylinder; 45. Sixth cylinder; 46. Third gear; 47. Fourth gear. DETAILED DESCRIPTION

[0034] The subject matter described herein will now be discussed with reference to example embodiments. It should be understood that the discussion of these embodiments is only to enable those skilled in the art to better understand and implement the subject matter described herein, and the functions and arrangements of the elements discussed may be changed without departing from the scope of protection of the contents of this specification. Each example may omit, replace or add various processes or components as needed. In addition, the features described relative to some examples may also be combined in other examples.

[0035] like Figures 1 to 3 As shown, a welding operation table for welding precision electronic components according to an embodiment of the present invention comprises a base plate 1, a support column 11 is fixedly installed at the bottom end of the base plate 1, a tool box 12 and a solder bin 13 are arranged at the top end of the base plate 1, and a moving device 2 is arranged on the solder bin 13;

[0036] like Figures 5 to 7 As shown, the moving device 2 includes a first fixed plate 21, a first moving column 25 and a moving member 26. Two first threaded rods 23 are rotatably installed on the upper part of the first fixed plate 21. The outer wall of the first threaded rod 23 is engaged with the first moving column 25. The first threaded rod 23 rotates to drive the first moving column 25 and the moving member 26 to move. The moving member 26 is provided with a liquid receiving device 4. The moving device 2 drives the liquid receiving device 4 to move for welding electronic components.

[0037] like Figures 8 to 10 As shown, the liquid contact device 4 includes a liquid contact part 43, and a direction detection device 3 is provided on the first moving column 25. The direction detection device 3 is used to adjust the direction of the liquid contact part 43 to receive the solder liquid dripping after welding when the moving device 2 moves.

[0038] It should be noted that the wave soldering currently used generally combines the two working systems of circuit board transportation and flux coating into an integrated system. It is rare to separate the wave soldering for welding. In order to facilitate wave soldering, a welding operation table is designed. When precision electronic components are welded using selective wave soldering, the pins of the circuit board and the metal components mounted on the circuit board are coated with flux, and then the solder liquid contacts the pins to achieve the welding effect. However, since the solder liquid is a heated liquid, the tension effect of the liquid will appear during welding. When the solder liquid after welding is cooled, small drops of solder liquid will drip downward. However, since the nozzle of the solder liquid has been moved away, it may drip on other positions of the wave soldering. In addition, the temperature of the solder liquid is high. If sputtering occurs, it is difficult to remove and burns will occur. If a larger board is directly set at the bottom of the tin spraying port, the solder liquid will completely adhere to the board, making it difficult to remove and wasting the solder liquid. In order to solve this problem, the following improvements have been made:

[0039] The circuit board is placed on the solder bin 13 and is clamped and stabilized by a clamp. A motor is used to drive the two first threaded rods 23 to rotate, thereby driving the first moving column 25 to slide on the side of the solder bin 13 and move. The motor is used to drive one of the first threaded rods 23 to rotate, which drives the moving part 26 to move. The end of the moving part 26 is provided with a liquid receiving device 4, which can drive the liquid receiving device 4 to move to the position where the lower end of the circuit board needs to be soldered. Solder liquid is placed at the lower part of the solder bin 13, and the bottom and lower periphery of the solder bin 13 are provided with tin bar adding and heating devices for adding tin liquid to the interior of the solder bin 13. A pump is provided in the center of the liquid receiving part 43, so that the molten tin liquid is discharged from the liquid receiving device 43. 4 is sprayed out, and then the motor is started to adjust the single first fixed block 22 or multiple first fixed blocks 22 to rotate, so that welding can be achieved. The first movable column 25 and the movable member 26 tilt the direction detection device 3 during the movement, and the tilt angle of the direction detection device 3 is the same as the moving direction, thereby driving the liquid contact part 43 to rotate and adjust the angle, so that the direction of the liquid contact part 43 is opposite to the moving direction, so that the liquid contact device 4 can pass through the bottom of the pin after welding after the liquid is sprayed, so as to receive the tin liquid after welding, thereby preventing the solder liquid from splashing and wasting, and the dripping solder liquid flows into the interior of the solder bin 13 again through the liquid contact part 43, so as to be heated and melted for reuse.

[0040] like Figures 3 to 5As shown, the solder bin 13 includes a solder pool 131 fixedly mounted on the top of the base plate 1, a clamping base 132 is provided on the top of the solder pool 131, a clamping plate 133 is provided on the top of the clamping base 132, and the clamping base 132 and the clamping plate 133 are engaged to form a clamping frame 134 for placing a circuit board, a first opening 135 is provided on the solder pool 131, and the first opening 135 is used for the mobile device 2 to drive the liquid contact device 4 to move, and a first slide groove 136 is provided on the solder pool 131 at the lower part of the first opening 135.

[0041] It should be noted that, considering that the circuit board needs to be placed above the liquid receiving device 4 for fixation, a clamping base 132 and a clamping plate 133 are placed above the solder pool 131, and the clamping base 132 and the clamping plate 133 are installed to form a clamping frame 134, which is the placement position of the circuit board. Thereafter, the clamping plate 133 and the clamping frame 134 are fixed to the upper end of the solder pool 131 for soldering.

[0042] like Figure 6 to Figure 7 As shown, the moving device 2 includes a first fixed plate 21 fixedly mounted on the solder pool 131, a first fixed block 22 is fixedly mounted on the top of the first fixed plate 21, a first threaded rod 23 is rotatably mounted inside the first fixed block 22, two first threaded rods 23 are symmetrically arranged about the first fixed plate 21, a first moving column 25 is threadedly mounted on the outer wall of the first threaded rod 23, a first slider 24 is rotatably mounted on the outside of the first moving column 25, the first slider 24 slides on the inner wall of the first slide groove 136, sixth protrusions 241 are symmetrically arranged on both side walls of the first slider 24, and moving parts 26 are slidably mounted on the inner sides of the two sixth protrusions 241.

[0043] It should be noted that when a first fixed block 22 rotates, it can drive the first movable column 25 to move, and the outer wall of the first movable column 25 is provided with a first slider 24, and the first slider 24 slides inside the first slide groove 136, thereby limiting the first slider 24 and the first movable column 25 to prevent the first movable column 25 from tilting during the movement.

[0044] like Figure 6 to Figure 7As shown, a first gear 251 is provided at the top of the first movable column 25, a first tooth 252 is fixedly installed on the first movable column 25, a movable member 26 is meshed on the outer wall of the first gear 251, and the movable member 26 includes a first movable tooth plate 261 slidably installed on the inner side of the two sixth protrusions 241, a first limiting ring 262 is fixedly installed at one end of the first movable tooth plate 261 close to the center of the solder pool 131, a first protrusion 264 is fixedly installed on the first movable tooth plate 261, a fixed frame 263 is fixedly installed on the first movable tooth plate 26, and a second protrusion 265 is fixedly installed at one end of the first movable tooth plate 261 away from the center of the solder pool 131.

[0045] It should be noted that when it is necessary to drive the moving member 26 to move, the two first threaded rods 23 are rotated, and the rotation of the two first threaded rods 23 drives the first teeth 252 to rotate, and the first teeth 252 drives the first moving column 25 to rotate, and the first moving column 25 drives the first gear 251 to rotate, and the first gear 251 engages with the side wall of the first moving tooth plate 261, and the side of the first slider 24 is provided with a sixth protrusion 241 to clamp the first moving tooth plate 261, thereby mobilizing the first moving tooth plate 261 to move and limit, and the end of the first moving tooth plate 261 is provided with a first limiting ring 262 for moving the liquid contacting device 4, and the fixed frame 263 and the first protrusion 264 and the second protrusion 265 are used to assist the direction detection device 3 and the liquid contacting device 4 in determining the moving direction of the liquid contacting device 4 during the movement.

[0046] like Figures 7 to 9 As shown, the direction detection device 3 includes a second fixed block 31 fixedly mounted on the first fixed plate 21, a first damping rod 32 fixedly mounted on the second fixed block 31, a second damping rod 35 fixedly mounted on the second protrusion 265, a direction transmission member 34 is arranged at the top end of the sixth protrusion 241, the first damping rod 32 and the second damping rod 35 are both connected to the direction transmission member 34, an equidistant transmission member 37 is slidably mounted inside the fixed frame 263, and a first motor 36 is arranged outside the equidistant transmission member 37.

[0047] It should be noted that when the first movable column 25 moves, the first damping rod 32 extends or contracts, and the first damping rod 32 is a damping rod, so in the process of contraction, it will be in a state of always supporting the lower part of the direction transmission member 34, and the upper part of the direction transmission member 34 is toward the direction of movement of the first movable column 25, thereby indicating the movement direction of the liquid receiving device 4, and the direction transmission member 34 and the second damping rod 35 have the same function, so in the process of the movable device 2 driving the liquid receiving device 4 to move, the movement direction of the liquid receiving device 4 is indicated, thereby driving the liquid receiving member 43 to receive the solder liquid after the circuit board pins are soldered, to prevent the solder liquid from splashing and causing burns and difficulty in cleaning.

[0048] like Figures 7 to 9 As shown, the direction transmission member 34 includes a first cylinder 341 fixedly mounted on the top of the sixth protrusion 241, a third limit block 342 is fixedly mounted on the outer wall of the first cylinder 341, a second limit ring 33 is arranged inside the third limit block 342, a first ball 343 is movably mounted inside the second limit ring 33, a second telescopic rod 344 is symmetrically arranged at the top and bottom ends of the first ball 343, two first round blocks 345 are fixedly mounted on the outer wall of the second telescopic rod 344, a second rotating block 346 is rotatably mounted on the outer wall of the first round block 345, and the first damping rod 32 and the second The damping rod 35 is respectively fixedly installed with a first square slide groove 3461, and the two first square slide grooves 3461 are staggered according to height. The second rotating block 346 at one end away from the center of the first sphere is slidably installed inside the first square slide groove 3461. The top of the third limit block 342 is fixedly installed with a third fixed column 347, and the top of the third fixed column 347 is fixedly installed with a direction limit frame 348. The inner wall of the direction limit frame 348 is fixedly installed with a first spring 349, and the first spring 349 is connected to the second telescopic rod 344 set at the top of the first sphere 343.

[0049] It should be noted that when the first movable column 25 moves in the direction close to the second fixed block 31, the first damping rod 32 has a damping effect, thereby lifting the first round block 345, and the second telescopic rod 344 is slidably installed inside the first round block 345 to adapt to the height of the first damping rod 32. The second telescopic rod 344 drives the first round ball 343 to rotate inside the third limit block 342, thereby driving the second telescopic rod 344 and the first round block 345 installed at the top to move in opposite directions, thereby achieving the effect of driving the equidistant transmission member 37 to move, and the end of the equidistant transmission member 37 is connected to the liquid receiving device 4, so that the liquid receiving device 4 can be driven when the equidistant transmission member 37 moves. The part 43 adjusts the direction. As mentioned above, when the first movable column 25 moves in the direction away from or close to the liquid contacting device 4, the second damping rod 35 plays a damping role, thereby driving the equidistant transmission member 37 to adjust the angle, so that the liquid contacting member 43 is opposite to the movement direction, so as to achieve the effect of receiving the solder liquid on the circuit board after welding. The outside of the equidistant transmission member 37 is provided with a first motor 36. When the first movable column 25 moves in the direction close to or away from the liquid contacting device 4, the first motor 36 can drive the equidistant transmission member 37 to extend and retract according to the center distance of the liquid contacting device 4 and the center distance of the first movable column 25, so that the equidistant transmission member 37 has the function of driving the liquid contacting device 4 to point.

[0050] like Figures 8 to 10 As shown, the equidistant transmission member 37 includes a third rotating block 371 rotatably mounted on the outer wall of the upper second telescopic rod 344 , and a fourth fixing column 372 is rotatably mounted on the outer wall of the third rotating block 371 .

[0051] It should be noted that the third rotating block 371 is connected to the direction detection device 3, and the fourth fixed column 372 is connected to the liquid contacting device 4. The end of the fourth fixed column 372 is provided with a first motor 36. When the distance between the first movable column 25 and the center of the liquid contacting device 4 changes, the distance difference between the two ends of the third rotating block 371 and the fourth fixed column 372 can be adjusted by starting the first motor 36 to rotate, so that the equidistant transmission member 37 has the function of lifting the liquid contacting device 4 to adjust the angle of the liquid contacting member 43.

[0052] like Figure 10 to Figure 11As shown, the liquid receiving device 4 includes a solder collecting tube 41 rotatably mounted on the inner wall of the first limiting ring 262, the inner wall of the solder collecting tube 41 is fixedly mounted with a fifth protrusion 411, a tin spraying tube 42 is fixedly mounted on the fifth protrusion 411, a liquid receiving part 43 is arranged on the outer wall of the solder collecting tube 41, a first liquid leakage port 412 is arranged inside the solder collecting tube 41 and communicates with the liquid receiving part 43, a sixth cylinder 45 is rotatably mounted on the top of the first limiting ring 262, a fifth cylinder 44 is rotatably mounted on the top of the first protrusion 264, and the sixth cylinder 45 is rotatably mounted on the top of the first protrusion 264. A fourth gear 47 is fixedly installed on the top of the column 45, and a third gear 46 is fixedly installed on the top of the fifth cylinder 44. The third gear 46 is meshed with the liquid contact part 43 through the fourth gear 47. One end of the fourth fixed column 372 close to the center of the tin spray tube 42 is rotatably installed on the third gear 46. A seventh protrusion 267 is provided inside the fixed frame 263, and a sixth slider 373 is slidably installed inside the fourth fixed column 372. The sixth slider 373 slides inside the fixed frame 263 through the seventh protrusion 267.

[0053] It should be noted that when it is necessary to solder the pins installed on the circuit board, the tin liquid inside the solder pool 131 is first heated continuously to keep the heating temperature constant and keep the liquid in a liquid state without over-boiling. Then, the molten tin liquid is pumped out from the top of the tin spraying tube 42 through the pump arranged inside the lower end of the tin spraying tube 42. Then, the motor is started to drive the first threaded rod 23 to rotate, thereby driving the first movable column 25 to move. The first movable column 25 and the movable member 26 drive the first ball 343 to rotate during the movement. The rotation of the first ball 343 drives the fourth fixed column 372 and the sixth slider 373 to slide inside the fixed frame 263 and the seventh protrusion 267, thereby driving the third gear 46 to rotate. The third gear 46 is meshed with the fourth gear 47, thereby driving the liquid contact member 43 to adjust the angle. The equidistant transmission member 37 is provided with a first motor 36. When the second damping rod 35 moves, the first motor 36 rotates to automatically adjust the distance between the center of the third gear 46 and the center of the first movable column 25, so that the third rotating block 371 and the fourth fixed block 372 are engaged with the fourth gear 47. The distance between the two ends of the fixed column 372 is kept the same as the distance between the center of the third gear 46 and the center of the first movable column 25, so that the equidistant transmission member 37 can adjust the rotation state of the third gear 46 and the angle of the liquid receiving member 43 under the action of the first ball 343, and then flow down from the outer wall of the tin liquid spraying tube 42 and enter the interior of the solder collecting tube 41, and the bottom end of the solder collecting tube 41 is connected to the bottom end of the solder pool 131, so that the outflowing tin liquid enters the interior of the solder pool 131 again, and the solder collecting tube 41 A first liquid leakage port 412 is provided inside, and the first liquid leakage port 412 is connected to the liquid contact part 43. When the top end of the tin spray tube 42 continues to move forward after soldering the circuit board, the tin liquid will drip again due to the surface tension, and then be received by the liquid contact part 43. The liquid contact part 43 is also provided with a heating device. When the tin liquid falls on the liquid contact part 43, it can enter the interior of the solder collecting tube 41 through the first liquid leakage port 412, and then enter the interior of the solder pool 131, so as to prevent the waste and splashing of the tin liquid.

[0054] like Figure 10 to Figure 11 As shown, the liquid contacting part 43 includes a liquid contacting rotating block 431 fixedly mounted on the outer wall of the solder collecting tube 41, a second tooth 432 is fixedly mounted on the bottom end of the liquid contacting rotating block 431, the second tooth 432 is used to engage with the fourth gear 47, a liquid contacting trough 433 is fixedly mounted on the liquid contacting rotating block 431, a second liquid leakage port 434 is arranged inside the liquid contacting trough 433, the second liquid leakage port 434 is connected to the first liquid leakage port 412, and a tilting block 435 is arranged on the liquid contacting trough 433.

[0055] It should be noted that the fourth gear 47 is meshed with the second tooth 432, thereby driving the liquid receiving rotating block 431 to rotate, and the liquid receiving groove 433 is used to receive the dripping tin liquid, and a tilting block 435 is provided at the bottom of the liquid receiving groove 433 to guide the dripping tin liquid, and a second liquid leakage port 434 is provided inside the liquid receiving groove 433 to guide the tin liquid to the inside of the solder collecting tube 41 for reuse.

[0056] like Figure 7 and Fig.11 As shown, a fourth protrusion 266 is fixedly mounted on the first movable tooth plate 261 , and the fourth protrusion 266 is used to detect the distance between the first ball 343 and the third gear 46 , and start the first motor 36 to adjust the equidistant transmission member 37 according to the distance.

[0057] It should be noted that an infrared rangefinder is provided on the fourth protrusion 266 , and a baffle is also provided on the side wall of the fourth protrusion 261 at the center of the first movable column 25 for detecting and calculating the distance between the center of the third gear 46 and the center of the first movable column 25 .

[0058] The above describes an embodiment of the present embodiment, but the present embodiment is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present embodiment, ordinary technicians in this field can also make many forms, all of which are within the protection of the present embodiment.

Claims

1. A welding operation table for welding precision electronic components, comprising a base plate (1), a support column (11) being fixedly mounted at the bottom end of the base plate (1), and a tool box (12) and a solder bin (13) being arranged at the top end of the base plate (1), characterized in that: The solder bin (13) is provided with a moving device (2); The moving device (2) comprises a first fixed plate (21), a first moving column (25) and a moving part (26); two first threaded rods (23) are rotatably mounted on the upper part of the first fixed plate (21); the outer wall of the first threaded rod (23) is meshed with the first moving column (25); the first threaded rod (23) rotates to drive the first moving column (25) and the moving part (26) to move; a liquid contact device (4) is provided on the moving part (26); the moving device (2) drives the liquid contact device (4) to move to weld electronic components; the liquid contact device (4) comprises a liquid contact part (43); a direction detection device (3) is provided on the first moving column (25); the direction detection device (3) is used to adjust the direction of the liquid contact part (43) when the moving device (2) moves to receive solder liquid dripping after welding.

2. A welding operation table for welding precision electronic components according to claim 1, characterized in that: The solder bin (13) comprises a solder pool (131) fixedly mounted on the top of the base plate (1); a clamping base (132) is arranged at the top of the solder pool (131); a clamping plate (133) is arranged at the top of the clamping base (132); after the clamping base (132) and the clamping plate (133) are engaged, a clamping frame (134) is formed inside for placing a circuit board; a first opening (135) is provided on the solder pool (131); the first opening (135) is used for the moving device (2) to drive the liquid contact device (4) to move; and a first slide groove (136) is provided on the solder pool (131) below the first opening (135).

3. A welding operation table for welding precision electronic components according to claim 2, characterized in that: The moving device (2) comprises a first fixed plate (21) fixedly mounted on the solder pool (131), a first fixed block (22) fixedly mounted on the top of the first fixed plate (21), a first threaded rod (23) rotatably mounted inside the first fixed block (22), two first threaded rods (23) symmetrically arranged with respect to the first fixed plate (21), a first moving column (25) threadedly mounted on the outer wall of the first threaded rod (23), a first sliding block (24) rotatably mounted outside the first moving column (25), the first sliding block (24) sliding on the inner wall of the first sliding groove (136), sixth protrusions (241) symmetrically arranged on both side walls of the first sliding block (24), and moving parts (26) slidably mounted on the inner sides of the two sixth protrusions (241).

4. A welding operation table for welding precision electronic components according to claim 3, characterized in that: A first gear (251) is provided at the top of the first movable column (25), a first tooth (252) is fixedly mounted on the first movable column (25), a movable member (26) is meshed on the outer wall of the first gear (251), and the movable member (26) comprises a first movable tooth plate (261) slidably mounted on the inner sides of the two sixth protrusions (241), a first limiting ring (262) is fixedly mounted on one end of the first movable tooth plate (261) close to the center of the solder pool (131), a first protrusion (264) is fixedly mounted on the first movable tooth plate (261), a fixing frame (263) is fixedly mounted on the first movable tooth plate (261), and a second protrusion (265) is fixedly mounted on one end of the first movable tooth plate (261) away from the center of the solder pool (131).

5. A welding operation table for welding precision electronic components according to claim 4, characterized in that: The direction detection device (3) comprises a second fixed block (31) fixedly mounted on a first fixed plate (21), a first damping rod (32) fixedly mounted on the second fixed block (31), a second damping rod (35) fixedly mounted on the second protrusion (265), a direction transmission member (34) being arranged at the top end of the sixth protrusion (241), the first damping rod (32) and the second damping rod (35) both being connected to the direction transmission member (34), an equidistant transmission member (37) being slidably mounted inside the fixed frame (263), and a first motor (36) being arranged outside the equidistant transmission member (37).

6. A welding operation table for welding precision electronic components according to claim 5, characterized in that: The direction transmission member (34) comprises a first cylinder (341) fixedly mounted on the top of the sixth protrusion (241); a third limiting block (342) is fixedly mounted on the outer wall of the first cylinder (341); a second limiting ring (33) is arranged inside the third limiting block (342); a first ball (343) is movably mounted inside the second limiting ring (33); a second telescopic rod (344) is symmetrically arranged at the top and bottom of the first ball (343); two first round blocks (345) are fixedly mounted on the outer wall of the second telescopic rod (344); a second rotating block (346) is rotatably mounted on the outer wall of the first round block (345); the first damping rod (32) and the second damping rod (32) are rotatably mounted on the outer wall of the second telescopic rod (344); A first square slide groove (3461) is fixedly installed on the rod (35), and the two first square slide grooves (3461) are staggered and connected according to the height. The second rotating block (346) at one end away from the center of the first ball (343) is slidably installed inside the first square slide groove (3461). A third fixed column (347) is fixedly installed on the top of the third limit block (342), and a direction limit frame (348) is fixedly installed on the top of the third fixed column (347). A first spring (349) is fixedly installed on the inner wall of the direction limit frame (348). The first spring (349) is connected to the second telescopic rod (344) set at the top of the first ball (343).

7. A welding operation table for welding precision electronic components according to claim 6, characterized in that: The equidistant transmission member (37) comprises a third rotating block (371) rotatably mounted on the outer wall of the upper second telescopic rod (344), and a fourth fixing column (372) is rotatably mounted on the outer wall of the third rotating block (371).

8. A welding operation table for welding precision electronic components according to claim 7, characterized in that: The liquid receiving device (4) comprises a solder collecting tube (41) rotatably mounted on the inner wall of a first limiting ring (262); a fifth protrusion (411) is fixedly mounted on the inner wall of the solder collecting tube (41); a tin spraying tube (42) is fixedly mounted on the fifth protrusion (411); a liquid receiving part (43) is arranged on the outer wall of the solder collecting tube (41); a first liquid leakage port (412) is arranged inside the solder collecting tube (41) and is connected to the liquid receiving part (43); a sixth cylinder (45) is rotatably mounted on the top end of the first limiting ring (262); a fifth cylinder (44) is rotatably mounted on the top end of the first protrusion (264); and the sixth cylinder (45) is rotatably mounted on the top end of the first protrusion (264); and 5), a fourth gear (47) is fixedly installed on the top of the fifth cylinder (44), a third gear (46) is fixedly installed on the top of the fifth cylinder (44), the third gear (46) is meshed with the liquid contact part (43) through the fourth gear (47), one end of the fourth fixed column (372) close to the center of the tin spraying tube (42) is rotatably installed on the third gear (46), a seventh protrusion (267) is provided inside the fixed frame (263), a sixth slider (373) is slidably installed inside the fourth fixed column (372), and the sixth slider (373) slides inside the fixed frame (263) through the seventh protrusion (267).

9. A welding operation table for welding precision electronic components according to claim 8, characterized in that: The liquid contacting part (43) comprises a liquid contacting rotating block (431) fixedly mounted on the outer wall of the solder collecting tube (41); a second tooth (432) is fixedly mounted on the bottom end of the liquid contacting rotating block (431); the second tooth (432) is used to mesh with the fourth gear (47); a liquid contacting trough (433) is fixedly mounted on the liquid contacting rotating block (431); a second liquid leakage port (434) is arranged inside the liquid contacting trough (433); the second liquid leakage port (434) is connected to the first liquid leakage port (412); and a tilting block (435) is arranged on the liquid contacting trough (433).

10. A welding operation table for welding precision electronic components according to claim 9, characterized in that: A fourth protrusion (266) is fixedly mounted on the first movable toothed plate (261), and the fourth protrusion (266) is used to detect the distance between the first ball (343) and the third gear (46), and to start the first motor (36) according to the distance to adjust the equidistant transmission member (37).

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