Vapor chamber structure and manufacturing method thereof

Abstract

The invention provides a vapor chamber structure and a manufacturing method thereof. The vapor chamber structure includes a first flexible substrate, a second flexible substrate, a spacer, a flexible seal, and a working fluid. The first flexible substrate comprises a first organic material layer, a first copper foil layer and a first capillary structure layer. The second flexible substrate comprises a second organic material layer, a second copper foil layer and a second capillary structure layer. The first copper foil layer, the first capillary structure layer, the distance piece, the second copper foil layer and the second capillary structure layer shrink inwards relative to the first organic material layer and the second organic material layer to form a space. The first copper foil layer, the second copper foil layer and the flexible sealing member define a closed chamber. The working fluid is arranged in the closed chamber and filled among the first capillary structure layer, the second capillary structure layer and the through groove of the spacer. The vapor chamber structure has the advantages of being bendable and small in thickness.

Description

Technical Field

[0001] The present invention relates to a heat conduction structure and a manufacturing method thereof, and in particular to a heat spreader structure and a manufacturing method thereof. Background Art

[0002] Currently, vapor chambers are mostly used at the outer edge of electronic systems and between electronic components or circuit boards and heat sinks. Since the thickness of vapor chambers is usually more than 1 mm and they are not easy to bend, they are difficult to place in, for example, a mobile phone housing, thus limiting the application scope of vapor chambers. Summary of the invention

[0003] The present invention is directed to a vapor chamber structure which has the advantages of being bendable and thin.

[0004] The present invention is also directed to a method for manufacturing a vapor chamber structure, which is used to manufacture the above-mentioned vapor chamber structure.

[0005] According to an embodiment of the present invention, a heat spreader structure includes a first flexible substrate, a second flexible substrate, a spacer, a flexible seal and a working fluid. The first flexible substrate includes a first organic material layer, a first copper foil layer and a first capillary structure layer. The first copper foil layer is located between the first organic material layer and the first capillary structure layer. The second flexible substrate includes a second organic material layer, a second copper foil layer and a second capillary structure layer. The second copper foil layer is located between the second organic material layer and the second capillary structure layer. At least one of the first organic material layer and the second organic material layer has at least one opening, and at least one opening corresponds to exposing at least one of the first copper foil layer and the second copper foil layer. The spacer is sandwiched between the first capillary structure layer and the second capillary structure layer. The spacer has a top surface and a bottom surface opposite to each other and a plurality of through grooves that penetrate the spacer and connect the top surface and the bottom surface. The first copper foil layer, the first capillary structure layer, the spacer, the second copper foil layer, and the second capillary structure layer are spaced relative to the first organic material layer and the second organic material layer to form a space. The flexible seal seals the space. The first copper foil layer, the second copper foil layer and the flexible seal define a closed chamber, and the first capillary structure layer, the second capillary structure layer and the through groove are located in the closed chamber. The working fluid is arranged in the closed chamber and filled between the first capillary structure layer, the second capillary structure layer and the through groove.

[0006] In the vapor chamber structure according to the embodiment of the present invention, the first capillary structure layer and the second capillary structure layer respectively include a mesh structure layer, and the mesh structure layer is made of metal, alloy, stainless steel, ceramic, glass fiber, carbon or organic plastic.

[0007] In the vapor chamber structure according to the embodiment of the present invention, the materials of the first organic material layer and the second organic material layer include liquid crystal polymer, polyimide or silica gel respectively.

[0008] In the vapor chamber structure according to the embodiment of the present invention, the material of the flexible sealing element includes liquid crystal polymer (LCP), polyimide (PI) or silica gel.

[0009] In the vapor chamber structure according to the embodiment of the present invention, the above-mentioned spacing is between 0.5 cm and 1.5 cm.

[0010] In the vapor chamber structure according to the embodiment of the present invention, the vapor chamber structure further comprises an adhesive layer disposed in the space. The flexible sealing member seals the space through the adhesive layer.

[0011] In the vapor chamber structure according to the embodiment of the present invention, the material of the spacer includes stainless steel.

[0012] In the vapor chamber structure according to the embodiment of the present invention, the working fluid includes water.

[0013] According to an embodiment of the present invention, a method for manufacturing a heat spreader structure includes the following steps. A first flexible substrate and a second flexible substrate are provided. The first flexible substrate includes a first organic material layer and a first copper foil layer. The second flexible substrate includes a second organic material layer and a second copper foil layer. A first capillary structure layer and a second capillary structure layer are formed on the first copper foil layer and the second copper foil layer, respectively. The first copper foil layer is located between the first organic material layer and the first capillary structure layer, and the first organic material layer, the first copper foil layer and the first capillary structure layer define a first flexible substrate. The second copper foil layer is located between the second organic material layer and the second capillary structure layer, and the second organic material layer, the second copper foil layer and the second capillary structure layer define a second flexible substrate. A spacer is sandwiched between the first capillary structure layer and the second capillary structure layer. The first capillary structure layer, the spacer and the second capillary structure layer define a chamber. The spacer has a top surface and a bottom surface opposite to each other and a plurality of through grooves that penetrate the spacer and connect the top surface and the bottom surface. The first copper foil layer, the first capillary structure layer, the spacer, the second copper foil layer, and the second capillary structure layer are spaced relative to the first organic material layer and the second organic material layer to form a space. A working fluid is filled in the chamber and is located between the first capillary structure layer, the second capillary structure layer, and the through groove. The chamber is evacuated and a flexible seal is formed to seal the space. The first copper foil layer, the second copper foil layer, and the flexible seal define a closed chamber, and the first capillary structure layer, the second capillary structure layer, and the through groove are located in the closed chamber. A drilling process is performed on at least one of the first organic material layer and the second organic material layer to form at least one opening, and the at least one opening corresponds to exposing at least one of the first copper foil layer and the second copper foil layer.

[0014] In the method for manufacturing a vapor chamber structure according to an embodiment of the present invention, the method for manufacturing a vapor chamber structure further includes providing an adhesive layer, and the flexible sealing member seals the space through the adhesive layer.

[0015] Based on the above, in the heat spreader structure of the present invention, the first flexible substrate includes a first organic material layer, a first copper foil layer and a first capillary structure layer, and the second flexible substrate includes a second organic material layer, a second copper foil layer and a second capillary structure layer. A spacer for the working fluid to pass through is arranged between the first capillary structure layer and the second capillary structure layer, and at least one of the first organic material layer and the second organic material layer has at least one opening, and the at least one opening correspondingly exposes at least one of the first copper foil layer and the second copper foil layer. Through the above design, the heat spreader structure of the present invention can be bent and have a thinner thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figures 1A to 1D is a cross-sectional schematic diagram of a method for manufacturing a vapor chamber structure according to an embodiment of the present invention;

[0017] Figure 2 yes Figure 1C A three-dimensional schematic diagram of the spacer in FIG.

[0018] Description of Reference Numerals

[0019] 100: heat sink structure;

[0020] 110: a first flexible substrate;

[0021] 110': a first flexible substrate;

[0022] 112: a first organic material layer;

[0023] 114: first copper foil layer;

[0024] 115, 125: opening;

[0025] 116: first capillary structure layer;

[0026] 120: a second flexible substrate;

[0027] 120': a second flexible substrate;

[0028] 122: a second organic material layer;

[0029] 124: second copper foil layer;

[0030] 126: second capillary structure layer;

[0031] 130: spacer;

[0032] 131: top surface;

[0033] 132: annular frame;

[0034] 133: Bottom;

[0035] 134: strip-shaped spacer;

[0036] 135: wear groove;

[0037] 140: flexible sealing element;

[0038] 150: adhesive layer;

[0039] C: chamber;

[0040] D: spacing;

[0041] D1: first distance;

[0042] D2: second distance;

[0043] F: working fluid;

[0044] S: space;

[0045] SC: Closed chamber. DETAILED DESCRIPTION

[0046] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0047] The embodiments of the present invention can be understood in conjunction with the accompanying drawings, which are also considered part of the disclosure. It should be understood that the drawings of the present invention are not drawn to scale, and in fact, the size of the elements may be arbitrarily enlarged or reduced to clearly show the features of the present invention.

[0048] Figures 1A to 1D It is a cross-sectional schematic diagram of a method for manufacturing a vapor chamber structure according to an embodiment of the present invention. Figure 2 yes Figure 1C According to the method for making the heat spreader structure of this embodiment, first, please refer to Figure 1A , providing a first flexible substrate 110 ′ and a second flexible substrate 120 ′, wherein the first flexible substrate 110 ′ and the second flexible substrate 120 ′ are disposed opposite to each other.

[0049] In detail, the first flexible substrate 110' includes a first organic material layer 112 and a first copper foil layer 114. The first copper foil layer 114 is located on the first organic material layer 112, and the first copper foil layer 114 is retracted by a first distance D1 relative to the first organic material layer 112. That is, the size of the first copper foil layer 114 is smaller than the size of the first organic material layer 112. In one embodiment, the first distance D1 is, for example, between 0.5 cm and 1.5 cm. The second flexible substrate 120' includes a second organic material layer 122 and a second copper foil layer 124. The second copper foil layer 124 is located on the second organic material layer 122, and the second copper foil layer 124 is retracted by a second distance D2 relative to the second organic material layer 122. That is, the size of the second copper foil layer 124 is smaller than the size of the second organic material layer 122. In one embodiment, the second distance D2 is, for example, between 0.5 cm and 1.5 cm.

[0050] like Figure 1AAs shown, the first copper foil layer 112 of the first flexible substrate 110' faces the second copper foil layer 122 of the second flexible substrate 120'. In one embodiment, the materials of the first organic material layer 112 and the second organic material layer 122 can be, for example, liquid crystal polymer, polyimide or silicone. The thickness of the first organic material layer 112 and the thickness of the second organic material layer 122 can be, for example, between 15 microns and 100 microns. In one embodiment, the first distance D1 can be equal to the second distance D2.

[0051] Next, please refer to Figure 1B , a first capillary structure layer 116 and a second capillary structure layer 126 are formed on the first copper foil layer 114 and the second copper foil layer 124, respectively. The first copper foil layer 114 is located between the first organic material layer 112 and the first capillary structure layer 116, and the first organic material layer 112, the first copper foil layer 114 and the first capillary structure layer 116 define the first flexible substrate 110. The size of the first capillary structure layer 116 is the same as the size of the first copper foil layer 114, and the thickness of the first capillary structure layer 116 plus the thickness of the first copper foil layer 114 is, for example, between 50 microns and 100 microns. The second copper foil layer 124 is located between the second organic material layer 122 and the second capillary structure layer 126, and the second organic material layer 122, the second copper foil layer 124 and the second capillary structure layer 126 define the second flexible substrate 120. The size of the second capillary structure layer 126 is the same as the size of the second copper foil layer 124, and the thickness of the second capillary structure layer 126 plus the thickness of the second copper foil layer 124 is, for example, between 50 microns and 100 microns. In one embodiment, the first flexible substrate 110 and the second flexible substrate 120 can be, for example, flexible copper clad laminates (FCCL).

[0052] In one embodiment, the first capillary structure layer 116 and the second capillary structure layer 126 can be formed by etching the first copper foil layer 114 and the second copper foil layer 124 respectively. In another embodiment, the first capillary structure layer 116 and the second capillary structure layer 126 can also be formed by electroplating. In one embodiment, the first capillary structure layer 116 and the second capillary structure layer 126 can be, for example, a mesh structure layer, wherein the material of the mesh structure layer can be, for example, metal, alloy, stainless steel, ceramic, glass fiber, carbon or organic plastic. In another embodiment, the first capillary structure layer 116 and the second capillary structure layer 126 can also be made of a porous medium, wherein the pore size of the porous medium is between 5 microns and 50 microns.

[0053] Next, please also refer to Figure 1C and Figure 2, a spacer 130 is sandwiched between the first capillary structure layer 116 and the second capillary structure layer 126, wherein the first capillary structure layer 116, the spacer 130 and the second capillary structure layer 126 define a chamber C. Specifically, the spacer 130 has a top surface 131 and a bottom surface 133 opposite to each other, and a plurality of through grooves 135 penetrating the spacer 130 and connecting the top surface 131 and the bottom surface 133. The first copper foil layer 114, the first capillary structure layer 116, the spacer 130, the second copper foil layer 124, and the second capillary structure layer 126 are retracted relative to the first organic material layer 112 and the second organic material layer 122 by a distance D to form a space S. Here, the distance D is equal to Figure 1A The first distance D1 or the second distance D2, that is, the distance D is between 0.5 cm and 1.5 cm.

[0054] Furthermore, the spacer 130 of this embodiment specifically includes an annular frame 132 and a plurality of strip-shaped spacers 134 located in and connected to the annular frame 132, wherein the strip-shaped spacers 134 and the annular frame 132 define the through grooves 135. In one embodiment, the annular frame 132 and the strip-shaped spacers 134 may be an integrally formed structure. In one embodiment, the material of the spacer 130 is, for example, stainless steel. In one embodiment, the width of the annular frame 132 may be greater than or equal to the width of the strip-shaped spacers 134.

[0055] Next, please refer to Figure 1C , the working fluid F is filled in the chamber C and is located between the first capillary structure layer 116, the second capillary structure layer 126 and the through groove 135. The first capillary structure layer 116 and the second capillary structure layer 126 can transport the working fluid F through the capillary phenomenon, that is, the first capillary structure layer 116 and the second capillary structure layer 126 can provide a capillary channel for the liquid fluid. The through groove 135 of the spacer 130 can provide a channel for the vapor fluid. In one embodiment, the working fluid F is, for example, water.

[0056] Next, please refer to Figure 1CThe chamber C is evacuated and a flexible seal 140 is formed to seal the space S. The first copper foil layer 114, the second copper foil layer 124 and the flexible seal 140 define a sealed chamber SC, and the first capillary structure layer 116, the second capillary structure layer 126 and the through groove 135 are located in the sealed chamber SC. In one embodiment, before the chamber C is subjected to a vacuum process, an adhesive layer 150 may be provided, wherein the adhesive layer 150 may be adhered to the space S, that is, the adhesive layer 150 may be adhered to the protrusion of the first organic material layer 112 relative to the first copper foil layer 114, the side wall of the first copper foil layer 114, the side wall of the first capillary structure layer 116, the side wall of the annular frame 132 of the spacer 130, the side wall of the second capillary structure layer 126, the side wall of the second copper foil layer 124, and the protrusion of the second organic material layer 122 relative to the second copper foil layer 124, and the flexible sealing member 140 may seal the space S through the adhesive layer 150. In one embodiment, the material of the flexible sealing member 140 may be, for example, liquid crystal polymer (LCP), polyimide (PI) or silicone.

[0057] Finally, please refer to Figure 1D , a drilling process is performed on at least one of the first organic material layer 112 and the second organic material layer 122 to form at least one opening, and the at least one opening correspondingly exposes at least one of the first copper foil layer 122 and the second copper foil layer 124. Here, for example, openings 115 and 125 are formed on the first organic material layer 112 and the second organic material layer 122 respectively by laser ablation, etching or other appropriate methods, and the openings 115 and 125 correspondingly expose part of the first copper foil layer 114 and part of the second copper foil layer 124, which have the function of heat dissipation. In one embodiment, the diameter of the opening 115 may be greater than or equal to the diameter of the opening 125. In one embodiment, a heat source and / or a heat sink may be selectively disposed in the opening 115 and / or the opening 125 to directly contact the first copper foil layer 114 and / or the second copper foil layer 124 exposed by the openings 115 and 125. At this point, the manufacture of the heat spreader structure 100 has been completed.

[0058] In terms of structure, please refer to Figure 1DIn this embodiment, the vapor chamber structure 100 includes a first flexible substrate 110, a second flexible substrate 120, a spacer 130, a flexible seal 140, and a working fluid F. The first flexible substrate 110 includes a first organic material layer 112, a first copper foil layer 114, and a first capillary structure layer 116, wherein the first copper foil layer 114 is located between the first organic material layer 112 and the first capillary structure layer 116. The second flexible substrate 120 includes a second organic material layer 122, a second copper foil layer 124, and a second capillary structure layer 126, wherein the second copper foil layer 124 is located between the second organic material layer 122 and the second capillary structure layer 126. At least one of the first organic material layer 112 and the second organic material layer 122 has at least one opening 115, 125, and the at least one opening 115, 125 correspondingly exposes at least one of the first copper foil layer 114 and the second copper foil layer 124. The spacer 130 is sandwiched between the first capillary structure layer 116 and the second capillary structure layer 126. The spacer 130 has a top surface 131 and a bottom surface 133 opposite to each other, and a through groove 135 that penetrates the spacer 130 and connects the top surface 131 and the bottom surface 133. The first copper foil layer 114, the first capillary structure layer 116, the spacer 130, the second copper foil layer 124, and the second capillary structure layer 126 are indented relative to the first organic material layer 112 and the second organic material layer 122 by a distance D to form a space S. The flexible seal 140 is sealed in the space S. The first copper foil layer 114, the second copper foil layer 124, and the flexible seal 140 define a sealed chamber SC, and the first capillary structure layer 116, the second capillary structure layer 126, and the through groove 135 are located in the sealed chamber SC. The working fluid F is disposed in the sealed chamber SC and filled between the first capillary structure layer 116, the second capillary structure layer 126 and the through groove 135. In addition, the vapor chamber structure 100 of this embodiment further includes an adhesive layer 150 disposed in the space S, wherein the flexible sealing member 140 can seal the space S through the adhesive layer 150.

[0059] In summary, in the heat spreader structure of the present invention, the first flexible substrate includes a first organic material layer, a first copper foil layer, and a first capillary structure layer, and the second flexible substrate includes a second organic material layer, a second copper foil layer, and a second capillary structure layer. A spacer for the working fluid to pass through is arranged between the first capillary structure layer and the second capillary structure layer, and at least one of the first organic material layer and the second organic material layer has at least one opening, and the at least one opening correspondingly exposes at least one of the first copper foil layer and the second copper foil layer. Through the above design, the heat spreader structure of the present invention can be bent and have a thinner thickness.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat sink structure, characterized in that: include: A first flexible substrate comprises a first organic material layer, a first copper foil layer and a first capillary structure layer, wherein the first copper foil layer is located between the first organic material layer and the first capillary structure layer; A second flexible substrate, comprising a second organic material layer, a second copper foil layer and a second capillary structure layer, wherein the second copper foil layer is located between the second organic material layer and the second capillary structure layer, wherein at least one of the first organic material layer and the second organic material layer has at least one opening, and the at least one opening correspondingly exposes at least one of the first copper foil layer and the second copper foil layer; A spacer is sandwiched between the first capillary structure layer and the second capillary structure layer, the spacer has a top surface and a bottom surface opposite to each other and a plurality of through grooves penetrating the spacer and connecting the top surface and the bottom surface, wherein the first copper foil layer, the first capillary structure layer, the spacer, the second copper foil layer, and the second capillary structure layer are spaced relative to the first organic material layer and the second organic material layer to form a space; a flexible sealing member sealed in the space, wherein the first copper foil layer, the second copper foil layer and the flexible sealing member define a closed chamber, and the first capillary structure layer, the second capillary structure layer and the plurality of through grooves are located in the closed chamber; and The working fluid is disposed in the sealed chamber and filled between the first capillary structure layer, the second capillary structure layer and the plurality of through grooves.

2. The heat sink structure according to claim 1, characterized in that: The first capillary structure layer and the second capillary structure layer respectively include a mesh structure layer, and the material of the mesh structure layer includes metal, alloy, stainless steel, ceramic, glass fiber, carbon or organic plastic.

3. The heat sink structure according to claim 1, characterized in that: The materials of the first organic material layer and the second organic material layer include liquid crystal polymer, polyimide or silica gel respectively.

4. The heat sink structure according to claim 1, characterized in that: The material of the flexible sealing element includes liquid crystal polymer, polyimide or silicone.

5. The heat sink structure according to claim 1, characterized in that: The spacing is between 0.5 cm and 1.5 cm.

6. The heat sink structure according to claim 1, characterized in that: Also includes: The adhesive layer is disposed in the space, wherein the flexible sealing member seals the space through the adhesive layer.

7. The vapor chamber structure according to claim 1, characterized in that: The material of the spacer includes stainless steel.

8. The vapor chamber structure according to claim 1, characterized in that: The working fluid includes water.

9. A method for manufacturing a heat spreader structure, characterized in that: include: Providing a first flexible substrate and a second flexible substrate, wherein the first flexible substrate comprises a first organic material layer and a first copper foil layer, and the second flexible substrate comprises a second organic material layer and a second copper foil layer; Forming a first capillary structure layer and a second capillary structure layer on the first copper foil layer and the second copper foil layer respectively, wherein the first copper foil layer is located between the first organic material layer and the first capillary structure layer, and the first organic material layer, the first copper foil layer and the first capillary structure layer define a first flexible substrate, and the second copper foil layer is located between the second organic material layer and the second capillary structure layer, and the second organic material layer, the second copper foil layer and the second capillary structure layer define a second flexible substrate; A spacer is sandwiched between the first capillary structure layer and the second capillary structure layer, wherein the first capillary structure layer, the spacer and the second capillary structure layer define a cavity, the spacer has a top surface and a bottom surface opposite to each other and a plurality of through grooves penetrating the spacer and connecting the top surface and the bottom surface, and the first copper foil layer, the first capillary structure layer, the spacer, the second copper foil layer and the second capillary structure layer are spaced relative to the first organic material layer and the second organic material layer to form a space; Filling a working fluid in the chamber and between the first capillary structure layer, the second capillary structure layer and the plurality of through grooves; Performing a vacuum process on the chamber and forming a flexible seal to seal the space, wherein the first copper foil layer, the second copper foil layer and the flexible seal define a closed chamber, and the first capillary structure layer, the second capillary structure layer and the plurality of through grooves are located in the closed chamber; and A drilling process is performed on at least one of the first organic material layer and the second organic material layer to form at least one opening, and the at least one opening correspondingly exposes at least one of the first copper foil layer and the second copper foil layer.

10. The method for manufacturing a vapor chamber structure according to claim 9, characterized in that: Also includes: An adhesive layer is provided, and the flexible sealing member seals the space through the adhesive layer.

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