Metallized film manufacturing device, metallized film and film capacitor

Abstract

The metallized film manufacturing apparatus includes: a supply unit that supplies a dielectric film in a longitudinal direction; a printing roller having a rotation axis in the width direction of the dielectric film and printing an insulating pattern on the surface of the dielectric film; and a vapor deposition part in which a metal vapor deposition electrode is formed at a position on the surface of the dielectric thin film other than the insulating pattern, the printing roller has a convex part, the convex part is formed on the outer peripheral surface of the printing roller so as to extend in the axial direction, and a reinforcing part is formed at one end of the convex part in the axial direction corresponding to the insulating pattern.

Description

Technical Field

[0001] The invention relates to a metallized film manufacturing device, a metallized film and a film capacitor. Background Art

[0002] Film capacitors formed by laminating or winding dielectric films having vapor-deposited electrodes on their surfaces are known. For example, Patent Document 1 describes a metallized film capacitor in which a first vapor-deposited electrode is disposed on one side of a dielectric film and a second vapor-deposited electrode is disposed on the other side of the dielectric film.

[0003] In the thin film capacitor of Patent Document 1, the first vapor-deposited electrode and the second vapor-deposited electrode are divided by a dividing edge extending in the width direction, and include a first divided electrode and a second divided electrode.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2010-199479 Summary of the invention

[0007] Problems to be solved by the invention

[0008] The metallized film capacitor described in Patent Document 1 still has room for improvement in suppressing variations in electrostatic capacitance.

[0009] The present invention provides a metallized film manufacturing device, a metallized film, and a film capacitor capable of suppressing variations in electrostatic capacitance.

[0010] Means for solving problems

[0011] A metallized thin film manufacturing apparatus according to one embodiment of the present invention includes:

[0012] A supplying portion for supplying a dielectric film along a length direction;

[0013] a printing roller having a rotation axis in the width direction of the dielectric film and printing an insulating pattern on a surface of the dielectric film; and

[0014] a vapor deposition unit for forming a metal vapor deposition electrode at a position other than the insulating pattern on the surface of the dielectric film;

[0015] The printing roller has a convex portion, which is formed on the outer peripheral surface of the printing roller so as to extend in the axial direction and corresponds to the insulating pattern.

[0016] A reinforcement portion is formed at one end of the convex portion in the axial direction of the printing roller.

[0017] A metallized film according to one embodiment of the present invention includes:

[0018] dielectric films; and

[0019] A metal vapor-deposited electrode is formed on the surface of the dielectric film so that an insulating edge is provided at one end in the width direction of the dielectric film.

[0020] The metal vapor-deposited electrode includes a plurality of divided electrodes divided by slits provided along the width direction of the dielectric film.

[0021] Each of the plurality of divided electrodes is provided with a notch at a corner portion on a side facing the insulating edge.

[0022] A film capacitor according to one aspect of the present invention includes:

[0023] The metallized film described above; and

[0024] A pair of end surface electrodes are arranged at both ends of the metallized film.

[0025] Effects of the Invention

[0026] According to the present invention, it is possible to provide a metallized thin film manufacturing apparatus, a metallized thin film, and a thin film capacitor capable of suppressing variations in electrostatic capacitance. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1A This is a schematic diagram showing a metallized film according to Embodiment 1 of the present invention.

[0028] Figure 1B Yes Figure 1A This is an enlarged view of area E1.

[0029] Figure 2 This is a schematic diagram showing a thin film capacitor according to Embodiment 1 of the present invention.

[0030] Figure 3 It is a schematic diagram showing a pair of metallized films included in the wound body.

[0031] Figure 4 This is a schematic diagram showing a metallized thin film manufacturing apparatus according to Embodiment 1 of the present invention.

[0032] Figure 5 It is shown Figure 4 A three-dimensional view of a printing roller of a metallized film manufacturing device.

[0033] Fig. 6A Yes Figure 5 FIG. 1 is a diagram showing a convex portion of a printing roller unfolded into a plane.

[0034] Figure 6B The figure shows the insulating pattern printed by the convex part of the printing roller.

[0035] Figure 7 It is shown Figure 4 Schematic diagram of the process of forming an insulating pattern in a metallized film manufacturing apparatus.

[0036] Figure 8 TABLE 2 is a table showing the relationship between the slit width, the distance between the ends of the adjacent split electrodes on the insulating edge side, and the occurrence of deformation in the split electrodes.

[0037] Fig. 9 This is a schematic diagram showing a metallized film according to Modification 1 of Embodiment 1.

[0038] Fig.10 This is a schematic diagram showing a metallized film according to Modification 2 of Embodiment 1.

[0039] Fig.11 This is a schematic diagram showing a metallized film according to Modification 3 of Embodiment 1. DETAILED DESCRIPTION

[0040] (Process of realizing the present invention)

[0041] It is known that a thin film capacitor is formed by winding or stacking a dielectric film having a vapor-deposited electrode on the surface. In order to improve safety, a pattern edge is sometimes formed on the vapor-deposited electrode in a thin film capacitor. For example, the vapor-deposited electrode of the thin film capacitor described in Patent Document 1 is divided by a dividing edge extending in the width direction.

[0042] The dividing edge is a portion that does not contribute to the electrostatic capacitance of the film capacitor. Therefore, reducing the width of the dividing edge is effective in increasing the electrostatic capacitance of the film capacitor and achieving miniaturization and cost reduction of the film capacitor.

[0043] The dividing edge is formed by applying oil to the portion where the dividing edge pattern is formed before the metal is evaporated on the dielectric film. In the application of the oil, for example, a printing roller is used, but since the dividing edge is made thinner, the pattern width of the printing roller is also reduced, and sometimes the printing roller is deformed. Due to the deformation of the printing roller, the dividing edge formed on the dielectric film is also deformed, and the area of ​​the evaporated electrode is reduced, which becomes a cause of the decrease in the electrostatic capacitance of the film capacitor.

[0044] The present inventors have studied a metallized film manufacturing apparatus, a metallized film, and a film capacitor capable of reducing deformation of a division edge and suppressing variations in electrostatic capacitance, and have achieved the following invention.

[0045] (Implementation method 1)

[0046] [Overall structure]

[0047] Figure 1A This is a schematic diagram showing metallized film 11 according to Embodiment 1 of the present invention. Figure 1B Yes Figure 1A This is an enlarged view of area E1.

[0048] <Metalized film>

[0049] The metallized film 11 is a film having a metal vapor-deposited electrode 13 formed on the surface of a dielectric film 12. The metallized film 11 is stacked or rolled to form a dielectric film 12. Figure 2 The film capacitor 1 is shown.

[0050] The dielectric film 12 is formed, for example, by a plastic film containing a thermoplastic resin such as polyethylene terephthalate, polypropylene, polyphenylene sulfide, or polyethylene naphthalate, or a plastic film containing a thermosetting resin such as a cured product obtained by reacting a hydroxyl group (OH group) of a first organic material and an isocyanate group (NCO group) of a second organic material. The metal vapor-deposited electrode 13 is formed, for example, of a metal such as aluminum or zinc.

[0051] The metal vapor-deposited electrode 13 is divided into a plurality of divided electrodes 13a by a plurality of slits 14 provided along the width direction W of the dielectric film 12. The metal vapor-deposited electrode 13 includes a connection portion 13b extending along the length direction L of the dielectric film 12 at one end in the width direction W of the dielectric film 12. The plurality of divided electrodes 13a are connected to the connection portion 13b via fuses 15, respectively.

[0052] At the other end of the dielectric film 12 in the width direction W, an insulating edge 16 where no metal vapor-deposited electrode is formed is provided along the length direction L of the dielectric film 12. The insulating edge 16 is connected to each of the slits 14.

[0053] In each of the plurality of segmented electrodes 13a, a notch 17 is provided at a corner portion on the side facing the insulating edge 16. Figure 1B As shown, each notch 17 is formed at the end of the slit 14 in the direction toward the insulating edge 16 so that the width of the slit 14 becomes wider toward the insulating edge 16. In other words, the slit 14 is formed at the end on the insulating edge 16 side so as to become wider from the width d1 to the width d2 toward the insulating edge 16. In addition, in the present embodiment, the notch 17 is formed in a C-surface shape.

[0054] In the present embodiment, the slit width d1 of the slit 14 is formed to be less than 0.2 mm. The slit 14 is a portion of the dielectric film 12 where the metal vapor-deposited electrode 13 is not formed, and does not contribute to the electrostatic capacitance of the film capacitor 1. Therefore, in order to increase the electrostatic capacitance of the film capacitor 1 as much as possible, the slit width d1 is preferably smaller, preferably less than 0.2 mm. By setting the slit width d1 to be less than 0.2 mm, the film capacitor 1 can be miniaturized.

[0055] In addition, if Figure 1B As shown, the ratio of the second slit width d2 of the slit 14, which is wider than the slit width d1, to the first slit width d1 can be greater than 2 times and less than 42 times. The second slit width d2 represents the distance between the ends of the adjacent split electrodes 13a on the insulating edge 16 side. In other words, the ratio of the distance d2 between the ends of the adjacent split electrodes 13a on the insulating edge 16 side relative to the slit width d1 can be greater than 2 times and less than 42 times. The notch 17 is formed so that the ratio of the second slit width d2 to the first slit width d1 becomes greater than 2 times and less than 42 times. By forming the notch 17 in this way, deformation in the slit 14 can be suppressed, and the decrease in the electrostatic capacitance of the film capacitor 1 can be suppressed.

[0056] <Film capacitor>

[0057] Figure 2 This is a schematic diagram showing a thin film capacitor 1 according to the first embodiment of the present invention.

[0058] like Figure 2 As shown, film capacitor 1 includes a wound body 10 obtained by winding a pair of metallized films 11 in an overlapping manner, and a pair of end surface electrodes 20 disposed at both ends of wound body 10 .

[0059] Figure 3 1 is a schematic diagram showing a pair of metallized films 11 included in a wound body 10. The wound body 10 is formed by winding a structure in which a pair of metallized films 11 are overlapped in the thickness direction. Alternatively, the wound body 10 may be formed by stacking a plurality of metallized films 11.

[0060] like Figure 3 As shown in FIG. 1 , a pair of metallized films 11 are overlapped in a state where they are offset by a width As in the width direction W of the dielectric film 12. Furthermore, the connection portions 13b of the metallized films 11 are overlapped so as to be arranged on opposite sides in the width direction W of the dielectric film 12. After the pair of metallized films 11 are wound, the connection portion 13b of one metallized film 11 is connected to one of the pair of end surface electrodes 20, and the connection portion 13b of the other metallized film 11 is connected to the other of the pair of end surface electrodes 20.

[0061] By forming insulating edge 16 at the end of metallized film 11 on the opposite side to connecting portion 13 b , it is possible to prevent a short circuit from occurring between connecting portion 13 b of one metallized film 11 and the other end surface electrode 20 .

[0062] <Metalized film manufacturing equipment>

[0063] Reference Figure 4 to Figure 6B Metallized thin film manufacturing apparatus 100 will be described. Figure 4 1 is a schematic diagram showing metallized thin film manufacturing apparatus 100 according to Embodiment 1 of the present invention. Figure 5 It is shown Figure 4 3D view of the printing roller 40 of the metallized film manufacturing apparatus 100. Fig. 6A Yes Figure 5 FIG. 4 is a diagram showing a convex portion 41 of the printing roller 40 unfolded into a plane. Figure 6B 1 is a diagram showing an insulation pattern printed by the convex portion 41 of the printing roller 40 .

[0064] The metallized film manufacturing apparatus 100 includes a supply unit 30, a printing roller 40, and a vapor deposition unit 50. The supply unit 30 supplies a dielectric film 12 to the metallized film manufacturing apparatus 100. The printing roller 40 forms an insulating pattern on which metal is not vapor-deposited by applying oil to the surface of the dielectric film 12. The vapor deposition unit 50 vapor-deposit metal on a portion not coated with oil by the printing roller 40.

[0065] In the manufacturing apparatus 100, the dielectric film 12 is supplied from the supply unit 30 in the direction of arrow S1, i.e., the longitudinal direction L of the dielectric film 12, and oil for forming an insulating pattern is applied to the surface of the dielectric film 12 by the printing roller 40. Then, the metal vapor-deposited electrode 13 is formed at a position other than the insulating pattern on the surface of the dielectric film 12 by the vapor deposition unit 50. The metallized film 11 on which the metal vapor-deposited electrode 13 is formed is fed in the direction of arrow S2 and is wound up by the winding unit 60. An intermediate roller 61 is arranged between the supply unit 30 and the winding unit 60.

[0066] like Figure 5 As shown in FIG. 1 , the pattern roller 40 has a rotation axis Ax along the width direction W of the dielectric film 12 fed in the length direction L. That is, the pattern roller 40 has a rotation axis Ax in a direction intersecting the direction in which the dielectric film 12 is fed, and an insulating pattern is formed by applying oil to the surface of the dielectric film 12. The insulating pattern refers to a portion such as the slit 14 and the insulating edge 16 to which oil is applied in order to provide a portion on the surface of the dielectric film 12 where metal is not evaporated.

[0067] like Figure 5As shown in FIG. 1 , the pattern roller 40 is formed in a substantially cylindrical shape. A slit forming portion 41 corresponding to the insulating pattern is provided on the outer peripheral surface of the pattern roller 40. The slit forming portion 41 corresponds to the "convex portion" of the present invention.

[0068] like Fig. 6A As shown in the figure, the slit forming portion 41 is formed extending along the axial direction of the printing roller 40. In the present embodiment, a plurality of slit forming portions 41 are arranged at intervals along the circumferential direction of the printing roller 40. The slit forming portions 41 correspond to the respective slits 14 of the metallized film 11. In addition, in the present embodiment, the slit forming portions 41 are formed in two rows in the axial direction of the printing roller 40. By forming the slit forming portions 41 in two rows, two metallized films can be formed at one time. In addition, the slit forming portions 41 may be formed in one row, or may be formed in three or more rows.

[0069] The slit forming portion 41 is formed to be elongated along the axial direction Ax of the printing roller 40 and the width direction W of the dielectric film 12. In addition, the width is formed small in order to reduce the slit width d1 of the slit 14. Therefore, a reinforcing portion 42 is provided so that deformation does not occur at the end of the slit forming portion 41. The reinforcing portion 42 is formed at one end of the slit forming portion 41 in the axial direction Ax of the printing roller 40. By forming the slit forming portion 41 in such a shape, as shown in FIG. Figure 1A As shown, notches 17 are formed at the corners of split electrodes 13a of metalized film 11. In other words, reinforcing portion 42 corresponds to notches 17 provided in split electrodes 13a.

[0070] In addition, in the present embodiment, an insulating edge forming portion 43 extending in the circumferential direction is formed on the pattern roller 40. The insulating edge forming portion 43 corresponds to the insulating edge 16 of the metalized film 11.

[0071] like Figure 6B As shown in FIG. 1 , when oil 70 is applied to dielectric film 12 by printing roller 40, insulating pattern 14a, insulating pattern 17a, and insulating pattern 16a are formed. Insulating pattern 14a is used to form Figure 1A The insulating pattern 17a is used to form the slit 14. Figure 1A The insulating pattern 16a is used to form the gap 17. Figure 1A The insulating pattern of the insulating edge 16 is shown. In this way, the slit forming portion 41, the reinforcing portion 42, and the insulating edge forming portion 43 are formed in a shape corresponding to the insulating pattern.

[0072] Figure 7 It is shown Figure 4Schematic diagram of the process of forming an insulating pattern in the metallized film manufacturing apparatus 100. The dielectric film 12 is supplied in the direction of the arrow A1. At this time, the printing roller 40 is rotated in the direction of the arrow A2 to supply oil 70 to the front end of the slit forming portion 41. The oil 70 attached to the front end of the slit forming portion 41 is transferred to the dielectric film 12, and an insulating pattern is formed on the dielectric film 12. In addition, at this time, the oil 70 is also supplied to the reinforcing portion 42 of the slit forming portion 41, so that the insulating pattern is formed in a shape corresponding to the slit 14. Similarly, oil is also applied to the position corresponding to the insulating edge 16.

[0073] The width of the slit forming portion 41 may be 0.2 mm or less so as to correspond to the slit width d1. In addition, the width of the slit forming portion 41 is formed so that the width gradually increases toward one end of the slit forming portion 41. Therefore, one end side of the slit forming portion 41 is formed so that the width becomes wider toward the outside. The ratio of the width of the end of the reinforcing portion 42 to the width of the slit forming portion 41 may be more than 2 times and less than 42 times. This corresponds to the ratio of the distance between the ends of the adjacent split electrodes 13a to the slit width d1.

[0074] In addition, in the present embodiment, the other end of the slit forming portion 41 is formed with a constant width.

[0075] After the insulating pattern is formed by the printing roller 40, the metal vapor deposition electrode 13 is formed by the vapor deposition unit 50. At this time, the metal is not vapor-deposited on the portion where the insulating pattern is formed, and the slit 14 and the insulating edge 16 are formed. Since the reinforcing portion 42 is provided in the slit forming portion 41, the segmented electrode 13a of the metal vapor deposition electrode 13 is Figure 1A As shown, a notch 17 is formed at the corner.

[0076] By forming the reinforcement portion 42 at one end of the slit forming portion 41 , the end portion of the slit forming portion 41 can be reinforced, thereby reducing deformation of the end portion of the slit forming portion 41 .

[0077] Metallized film 11 on which metal vapor-deposited electrode 13 is formed by vapor deposition unit 50 is taken up by take-up unit 60 .

[0078] [Example]

[0079] In the metallized film described in Embodiment 1, the slit width was changed to investigate whether deformation occurred in the divided electrodes. Figure 8 TABLE 2 is a table showing the relationship between the slit width d1 and the distance between the ends of the adjacent split electrodes on the insulating edge side and the occurrence of deformation in the split electrodes.

[0080] In the metallized film 11 of the first embodiment, the electrode width d3 (see Figure 1A) was fixed at 2 mm, and the slit width d1 was changed to 0.1 mm, 0.2 mm, and 0.05 mm. Furthermore, the distance d2 between the ends of the adjacent split electrodes 13 a on the insulating edge 16 side was changed to Figure 8 , shown by the "end distance d2"). Figure 1A The chamfer dimension d4 shown is changed to change the end distance d2. The chamfer dimension d4 represents the size of the notch 17 in the width direction of the split electrode 13a (the length direction L of the dielectric film 12) at the end of the split electrode 13a on the insulating edge 16 side.

[0081] like Figure 8 As shown, when the slit width d1 is 0.1 mm and the end distance d2 is 1.1 mm, the end distance d2 / slit width d1 is 11 times. That is, the ratio of the distance d2 of the ends on the insulating edge 16 side of adjacent split electrodes 13a to the slit width d1 is 11 times. Similarly, when the slit width d1 is 0.2 mm and the end distance d2 is 0.4 mm, the end distance d2 / slit width d1 is 2 times, when the slit width d1 is 0.05 mm and the end distance d2 is 2.1 mm, the end distance d2 / slit width d1 is 42 times, and when the slit width d1 is 0.1 mm and the end distance d2 is 0.15 mm, the end distance d2 / slit width d1 is 1.5 times. In addition, Figure 8 No. 4 in the table is a comparative example without a reinforcement, and No. 1 to No. 3 and No. 5 are examples with reinforcements. In the example shown in No. 5, the reinforcement is small, so deformation occurs, but the degree of deformation is smaller than that of the case without reinforcement.

[0082] After forming the metal vapor-deposited electrodes 13 in the above four patterns, it was confirmed whether deformation occurred in the segmented electrodes 13a. Figure 8 As shown in FIG. 1 , when the end distance d2 / slit width d1 is 2 or more and 42 or less, the segmented electrode is not deformed. This means that the end of the slit forming portion 41 of the pattern roller 40 is not deformed.

[0083] Therefore, it is known that if the value of the end distance d2 / slit width d1 is 2 times or more and 42 times or less, the metal vapor-deposited electrode 13 can be formed as designed using the printing roller 40. The metal vapor-deposited electrode 13 can be formed as designed. Therefore, the shape of the segmented electrode 13a can be stabilized, and when the film capacitor 1 is formed using the metallized film 11, the decrease in electrostatic capacitance can be suppressed.

[0084] [Effect]

[0085] According to the above-mentioned embodiment, the following effects can be achieved.

[0086] The metallized film 11 includes a dielectric film 12 and a metal vapor-deposited electrode 13. The metal vapor-deposited electrode 13 is formed on the surface of the dielectric film 12 so that an insulating edge 16 is provided at one end in the width direction of the dielectric film 12, and includes a plurality of segmented electrodes 13a segmented by slits 14 provided along the width direction of the dielectric film 12. The plurality of segmented electrodes 13a are each provided with a notch 17 at a corner portion on the side facing the insulating edge 16.

[0087] With such a structure, it is possible to provide the safety function of the thin film capacitor by dividing metal vapor-deposited electrode 13 into a plurality of divided electrodes 13 a , while suppressing a decrease in electrostatic capacitance due to deformation of divided electrodes 13 a .

[0088] The width d1 of the slit 14 is 0.2 mm or less.

[0089] With such a structure, the slit width can be reduced to increase the electrostatic capacitance of the film capacitor.

[0090] The ratio of the distance between the ends of the adjacent divided electrodes 13 a on the insulating edge 16 side to the width d1 of the slit 14 is 2 times or more and 42 times or less.

[0091] With such a structure, deformation of the divided electrode 13 a can be suppressed, thereby suppressing a decrease in electrostatic capacitance.

[0092] The notch 17 is formed in a C-plane shape.

[0093] With such a structure, it is possible to suppress deformation of the divided electrodes 13 a and suppress a decrease in the electrostatic capacitance of the film capacitor.

[0094] Film capacitor 1 includes metallized film 11 and end surface electrodes 20 . End surface electrodes 20 are disposed at both ends of metallized film 11 .

[0095] With such a configuration, it is possible to provide the film capacitor 1 in which a decrease in electrostatic capacitance is suppressed.

[0096] The metallized film manufacturing apparatus 100 includes a supply unit 30, a printing roller 40, and a vapor deposition unit 50. The supply unit 30 supplies a dielectric film 12 in the longitudinal direction. The printing roller 40 has a rotation axis in the width direction of the dielectric film 12, and prints an insulating pattern on the surface of the dielectric film 12. The vapor deposition unit 50 forms a metal vapor deposition electrode 13 at a position other than the insulating pattern on the surface of the dielectric film 12. The printing roller 40 has a convex portion 41, which is formed on the outer peripheral surface of the printing roller 40 so as to extend in the axial direction and corresponds to the insulating pattern. A reinforcing portion 42 is formed at one end of the convex portion 41 in the width direction of the dielectric film 12.

[0097] With such a structure, it is possible to suppress deformation of the convex portion 41 of the pattern roller 40 when the oil is applied to the insulation pattern.

[0098] The reinforcing portion 42 is formed so that its width gradually increases toward one end of the convex portion 41 .

[0099] With such a structure, deformation of the convex portion 41 can be further suppressed.

[0100] The width of the portion of the convex portion 41 where the reinforcement portion 42 is not formed is 0.2 mm or less.

[0101] With such a structure, width d1 of slit 14 of metalized film 11 can be reduced, and the electrostatic capacitance of film capacitor 1 can be increased.

[0102] The ratio of the width of the reinforcement portion 42 on the one end side of the convex portion 41 to the width of the convex portion 41 is 2 times or more and 42 times or less.

[0103] With such a structure, it is possible to reduce the width of the convex portion 41 and suppress deformation of the convex portion 41 .

[0104] The other end of the protrusion 41 in the width direction of the dielectric film 12 is formed to have a constant width.

[0105] With such a structure, the area of ​​the divided electrode 13 a can be increased as much as possible, thereby increasing the electrostatic capacitance of the thin film capacitor 1 .

[0106] (Variation)

[0107] Fig. 9 1 is a schematic diagram showing a metallized film according to a first variation of the first embodiment. Fig. 9 As shown, in metallized film 111 , notches 117 may be formed larger than notches 17 of metallized film 11 according to the first embodiment, and the tips of divided electrodes 113 a may be formed into sharp shapes.

[0108] Fig.10 2 is a schematic diagram showing a metallized film according to a second variation of the first embodiment. Fig.10 As shown, the notch 217 may be formed in an R-shaped surface in the metalized film 211. By forming the notch 217 in an R-shaped surface, the corners of the segmented electrode 213a are rounded, and deformation of the segmented electrode 213a can be further suppressed.

[0109] Fig.11 1 is a schematic diagram showing a metallized film according to a third variation of the first embodiment. Fig.11As shown, in the metalized film 311, the notch 317 may be formed in an R-surface shape, and the end of the divided electrode 313a may be formed in an arc shape.

[0110] (Overview of Implementation Methods)

[0111] (1) The metallized film manufacturing apparatus of the present invention comprises: a supply unit for supplying a dielectric film in a longitudinal direction; a printing roller having a rotation axis in a width direction of the dielectric film and printing an insulating pattern on a surface of the dielectric film; and a vapor deposition unit for forming a metal vapor deposition electrode at a position other than the insulating pattern on the surface of the dielectric film, wherein the printing roller has a convex portion formed on an outer peripheral surface of the printing roller so as to extend in an axial direction and a reinforcing portion is formed at one end of the convex portion in the axial direction of the printing roller corresponding to the insulating pattern.

[0112] (2) In the metallized film manufacturing apparatus of (1), the reinforcing portion may be formed so that the width thereof gradually increases toward one end of the convex portion in the axial direction of the printing roller.

[0113] (3) In the metallized thin film manufacturing apparatus of (1) or (2), the width of a portion of the projection where the reinforcement portion is not formed may be 0.2 mm or less.

[0114] (4) In the metallized thin film manufacturing apparatus of any one of (1) to (3), a ratio of a width of the reinforcing portion at one end of the protrusion to a width of the protrusion may be 2 to 42 times.

[0115] (5) In the metallized thin film manufacturing apparatus according to any one of (1) to (4), the other end of the protrusion in the width direction of the dielectric film may be formed to have a constant width.

[0116] (6) The metallized film of the present invention comprises: a dielectric film; and a metal vapor-deposited electrode, which is formed on the surface of the dielectric film so that an insulating edge is provided at one end in the width direction of the dielectric film, the metal vapor-deposited electrode includes a plurality of split electrodes divided by slits provided along the width direction of the dielectric film, and each of the plurality of split electrodes has a notch provided at a corner on the side facing the insulating edge.

[0117] (7) In the metallized film of (6), the width of the slit may be 0.2 mm or less.

[0118] (8) In the metallized film of (6) or (7), a ratio of a distance between ends of adjacent divided electrodes on the insulating edge side to a width of the slit may be 2 to 42 times.

[0119] (9) In the metallized film according to any one of (6) to (8), the notch may be formed in a C-plane shape.

[0120] (10) In the metallized film according to any one of (6) to (8), the notch may be formed in an R-surface shape.

[0121] (11) A film capacitor of the present invention comprises: the metallized film according to any one of (6) to (10); and a pair of end surface electrodes disposed at both ends of the metallized film.

[0122] Industrial Applicability

[0123] The present invention can be widely applied to a metallized film for forming a thin film capacitor and an apparatus for manufacturing the same.

[0124] Description of Reference Numerals

[0125] 1 Film capacitor

[0126] 10 Winding

[0127] 11, 111, 211, 311 metallized film

[0128] 12 Dielectric film

[0129] 13 Metal Vapor Deposition Electrode

[0130] 13a, 113a, 213a, 313a Split electrodes

[0131] 13b Connection

[0132] 14 Slit

[0133] 15 Fuse

[0134] 16 Insulation edge

[0135] 20 End electrode

[0136] 30 Supply Department

[0137] 40 Printing roller

[0138] 41 Slit forming portion (convex portion)

[0139] 42 Strengthening Department

[0140] 50 Vapor Deposition Department

[0141] 100 Manufacturing Equipment

[0142] d1 Slit width

[0143] d2 end distance

[0144] L Length direction

[0145] W Width direction.

Claims

1. A metallized film manufacturing device, comprising: A supplying portion for supplying a dielectric film along a length direction; a printing roller having a rotation axis in the width direction of the dielectric film and printing an insulating pattern on a surface of the dielectric film; and a vapor deposition unit for forming a metal vapor deposition electrode at a position other than the insulating pattern on the surface of the dielectric film; The printing roller has a convex portion, which is formed on the outer peripheral surface of the printing roller so as to extend in the axial direction and corresponds to the insulating pattern. A reinforcement portion is formed at one end of the convex portion in the axial direction of the printing roller.

2. The metallized thin film manufacturing device according to claim 1, wherein: The reinforcing portion is formed such that a width gradually increases toward the one end of the convex portion in the axial direction.

3. The metallized thin film manufacturing device according to claim 1 or 2, wherein: The width of a portion of the convex portion where the reinforcement portion is not formed is 0.2 mm or less.

4. The metallized thin film manufacturing apparatus according to any one of claims 1 to 3, wherein: A ratio of a width of the reinforcing portion at one end side of the convex portion to a width of the convex portion is not less than 2 times and not more than 42 times.

5. The metallized thin film manufacturing apparatus according to any one of claims 1 to 4, wherein: The other end of the protrusion in the width direction of the dielectric film is formed to have a constant width.

6. A metallized film comprising: dielectric films; and A metal vapor-deposited electrode is formed on the surface of the dielectric film so that an insulating edge is provided at one end in the width direction of the dielectric film. The metal vapor-deposited electrode includes a plurality of divided electrodes divided by slits provided along the width direction of the dielectric film. Each of the plurality of divided electrodes is provided with a notch at a corner portion on a side facing the insulating edge.

7. The metallized film according to claim 6, wherein: The width of the slit is 0.2 mm or less.

8. The metallized film according to claim 6 or 7, wherein: A ratio of a distance between ends of the adjacent split electrodes on the insulating edge side to a width of the slit is not less than 2 times and not more than 42 times.

9. The metallized film according to any one of claims 6 to 8, wherein: The notch is formed in a C-plane shape.

10. The metallized film according to any one of claims 6 to 8, wherein: The notch is formed in an R-surface shape.

11. A film capacitor comprising: The metallized film according to any one of claims 6 to 10; and A pair of end surface electrodes are arranged at both ends of the metallized film.

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