Panel chip level underfill equipment and wafer operation method thereof

Abstract

The invention discloses panel chip-level bottom filling equipment and a wafer operation method thereof.The panel chip-level bottom filling equipment comprises a feeding and discharging machine body, a preparation station, a dispensing station and a detection station, and a material taking piece used for feeding and discharging wafers is arranged in the feeding and discharging machine body; wafers can be conveyed into the working stations for working through the material taking part, the preparation station is located on one side of the feeding and discharging machine body so that the to-be-machined wafers input by the material taking part can be received, the to-be-machined wafers can be preheated and subjected to code scanning alignment in advance, and the glue dispensing station is located on the side edge of the feeding and discharging machine body and used for dispensing glue on the to-be-machined wafers. The detection station is located on the other side of the feeding and discharging machine body and arranged opposite to the preparation station, and the detection station is suitable for receiving the wafer obtained after dispensing operation on the dispensing station is completed so as to detect the dispensing condition of the wafer. According to the invention, the large-size wafer can be safely leveled, and the large-size wafer processed on each station is ensured to be in a set direction, so that the production efficiency and the yield of products are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to a panel chip-level bottom filling device and a wafer operation method thereof. Background Art

[0002] Panel chip-level bottom filling is a hot research direction in the chip field. Panel-level packaging is an advanced packaging process that realizes fan-out wiring in a large format. With the development of the semiconductor industry, the increase in wiring density and the increase in demand for I / 0 ports have jointly promoted the development of fan-out packaging. Fan-out packaging is divided into fan-out wafer-level packaging (FOWLP) and fan-out panel-level packaging (FOPLP). The difference between the two lies in the carrier. Panel-level packaging reorganizes the carrier from 8-inch / 12-inch wafer carrier to a large-size wafer. Panel-level packaging has the advantages of high area utilization, less waste, more chips packaged at one time, and higher packaging efficiency. With the increase in wafer area, the cost of chip manufacturing can be significantly reduced. The transition from 200mm to 300mm saves about 25% of the cost, and the transition from 300mm to panel level can save 66% of the cost.

[0003] Since the large-sized wafers (e.g. 600mm*600mm) used in board-level packaging are made of glass-like materials, they are more prone to warping than wafers (the warping can reach 10mm). If the dispensing operation is performed directly in a warped state, it is easy to scratch the wafer. At present, the warping of large-sized wafers is handled by hand pressure. After the staff manually flattens the warping, the work platform vacuum absorbs the wafer. This method is not only inefficient, but also easy to damage the wafer.

[0004] In addition, since the orientation of large-size wafers will be deflected during the wafer transportation process, this will lead to inconsistent directions of large-size wafers at different workstations, which in turn affects the normal operation of the wafers.

[0005] In view of this, it is necessary to design a panel chip level bottom filling device to solve the above problems. Summary of the invention

[0006] The present invention aims to solve at least one of the technical problems existing in the prior art.

[0007] To this end, the present invention provides a panel chip-level bottom filling device, which can improve the operating efficiency of the wafer, and through the alignment and leveling of the wafer, can effectively improve the efficiency and yield rate of the final product output.

[0008] According to a first aspect of the present invention, a panel chip level bottom filling device is provided, comprising:

[0009] A loading and unloading machine body, wherein a movable space suitable for carrying wafers is provided in the loading and unloading machine body, wherein a material taking piece for loading and unloading wafers is provided in the movable space, wherein the material taking piece is suitable for conveying the wafers to each operating station, wherein each operating station includes a preparation station, a dispensing station and a testing station; wherein,

[0010] The preparation station is located at one side of the loading and unloading machine body, so as to receive the wafer to be processed input by the material picking part, and preheat the wafer to be processed and scan the code for alignment;

[0011] The glue dispensing station is located at the side of the loading and unloading machine body, and the glue dispensing station is arranged close to the feeding area of ​​the loading and unloading machine body, so as to receive the wafer preheated by the preparation station in the shortest path, and heat and dispense glue to the preheated wafer;

[0012] The inspection station is located at the other side of the loading and unloading machine body and is arranged opposite to the preparation station. The inspection station is suitable for receiving the wafer after the glue dispensing operation is completed at the glue dispensing station to detect the glue dispensing status of the wafer.

[0013] The beneficial effects of the present invention are as follows: by adopting the mutual cooperation among the loading and unloading machine body, the preparation station, the glue dispensing station and the detection station, the wafer can be scanned, aligned, preheated, heated, leveled and glued, and a plurality of glue dispensing stations can be provided, which not only improves the glue dispensing quality, but also improves the utilization rate of the loading and unloading machine body, reduces the waiting time, and by aligning and leveling the wafer, the efficiency and yield rate of the final product output can be effectively improved.

[0014] Preferably, the loading and unloading machine body comprises:

[0015] Base;

[0016] A movable member, the movable member is arranged on the base via a guide rail, and the movable member is suitable for moving between the working stations along the guide rail;

[0017] A material taking component is arranged on the movable component to take and place wafers from the feeding area and each of the working stations.

[0018] Further preferably, the preparation station and the detection station both include:

[0019] Wafer rotation platform;

[0020] A heating module, wherein the heating module is arranged on the wafer carrying platform, and the wafer rotating platform separates the heating module into an inner ring heating plate and an outer ring heating plate, and the inner ring heating plate and the outer ring heating plate are suitable for heating the wafer at the same time;

[0021] The wafer lifting mechanism is suitable for moving in a vertical direction, and the wafer lifting mechanism is suitable for protruding from the heating module and supporting the wafer.

[0022] Preferably, the wafer rotating platform comprises:

[0023] A wafer carrying platform, wherein the wafer carrying platform is used to carry a wafer;

[0024] A wafer support assembly, which moves in a vertical direction and can protrude from the wafer carrying platform to support the wafer;

[0025] A wafer lifting mechanism, the wafer lifting mechanism is connected to the wafer supporting assembly and drives the wafer supporting assembly to move in a vertical direction;

[0026] A wafer rotating mechanism drives the wafer supporting assembly to rotate around a vertical direction and simultaneously drives the wafer to rotate when the wafer supporting assembly protrudes from the wafer carrying platform.

[0027] Further preferably, the wafer lifting mechanism comprises:

[0028] A first screw transmission assembly, wherein the first screw transmission assembly drives the wafer support assembly to move up and down in a vertical direction;

[0029] A first drive motor is connected to the first screw drive assembly through a drive belt to drive the first screw drive assembly to move.

[0030] Preferably, the wafer support assembly comprises:

[0031] A chassis, wherein the wafer lifting mechanism is adapted to drive the chassis to move in a vertical direction;

[0032] A fixed outer ring, the fixed outer ring being fixed to the chassis via a plurality of support columns;

[0033] A movable top ring is connected to the fixed outer ring via a bearing, and the movable top ring can protrude from the wafer supporting platform.

[0034] Further preferably, the movable top ring comprises:

[0035] A top support member, the top support member being adapted to protrude from the wafer carrying platform and contact the wafer;

[0036] A bottom mounting member connected to the fixed outer ring via a bearing;

[0037] A middle connecting member is used to connect the bottom mounting member and the top supporting member at the same time.

[0038] Preferably, the wafer rotation mechanism comprises:

[0039] A pulley turntable, wherein the pulley turntable is fixedly sleeved on the bottom mounting member;

[0040] A driving assembly is installed on the chassis, and the driving assembly is connected to the pulley turntable through a transmission belt, so as to drive the pulley turntable to rotate, and drive the movable top ring to rotate synchronously through the pulley turntable.

[0041] Further preferably, the driving assembly comprises:

[0042] a second driving motor, wherein a first gear is mounted on an output end of the second driving motor;

[0043] A speed reduction mechanism, wherein the input end of the speed reduction mechanism is connected to the first gear belt transmission, and the output end of the speed reduction mechanism is connected to the pulley turntable and drives the pulley turntable to rotate.

[0044] Preferably, the deceleration mechanism includes a transmission shaft, and a second gear and a third gear installed at both ends of the transmission shaft, the second gear is connected to the first gear through a transmission belt, the third gear is connected to the pulley turntable through a transmission belt, and the diameter of the second gear is larger than the diameter of the first gear.

[0045] Further preferably, the dispensing station includes:

[0046] Glue dispensing operation platform;

[0047] A glue dispensing platform, wherein the glue dispensing platform is provided with a heating module, and when the wafer is carried on the glue dispensing platform, the heating module heats the wafer;

[0048] There are multiple flattening mechanisms, one of which corresponds to a side of the glue dispensing platform. When the wafer is placed on the glue dispensing platform, the multiple flattening mechanisms simultaneously press down multiple edge portions of the wafer to make the wafer fit onto the glue dispensing platform.

[0049] Preferably, the dispensing operation platform comprises:

[0050] A y-axis driving mechanism, wherein the y-axis driving mechanism is respectively arranged on both sides of the dispensing support platform;

[0051] An x-axis driving mechanism, wherein both ends of the x-axis driving mechanism are mounted on the y-axis driving mechanism;

[0052] Four z-axis operating mechanisms, the four z-axis operating mechanisms are all connected to the x-axis driving mechanism, and the four z-axis operating mechanisms can perform dispensing operations independently or synchronously.

[0053] Further preferably, the detection station also includes:

[0054] A three-axis motion platform, wherein the three-axis motion platform has motion travel in three directions: X, Y, and Z;

[0055] The visual inspection mechanism is arranged on the three-axis motion platform so that the visual inspection mechanism can be driven by the three-axis motion platform to move above the wafer working platform, and the visual inspection mechanism is suitable for visual inspection of the dispensing status of the wafer carried on the wafer working platform.

[0056] The second aspect of the present invention provides a wafer operation method, which is applied to a panel chip-level bottom filling device, and the panel chip-level bottom filling device includes a loading and unloading machine body for transporting wafers to each operation station, a preparation station for preheating the wafer and scanning the code for alignment, a glue dispensing station for heating and dispensing glue on the preheated wafer, and a detection station for detecting the wafer after the glue dispensing is completed;

[0057] The wafer operation method includes the following steps:

[0058] Get the wafer and scan the wafer for alignment;

[0059] Preheat the wafer initially;

[0060] When the temperature of the wafer reaches the first set temperature, performing an anti-warping operation on the wafer;

[0061] When the wafer anti-warping operation is completed, the wafer is rotated to a specified angle and then transported to the dispensing station for further heating;

[0062] When the wafer temperature reaches the second set temperature, the wafer is subjected to a second anti-warping operation and then glue is dispensed;

[0063] When the wafer dispensing is completed, the wafer is transported to the inspection station to inspect the dispensing condition of the wafer and then output.

[0064] Preferably, preheating the wafer comprises the following steps:

[0065] Lift the wafer so that it does not come into direct contact with the heating module at the preparation station;

[0066] Gradually reduce the distance between the wafer and the heating module so that the temperature of the wafer gradually increases;

[0067] When the temperature of the wafer rises to a temperature that allows the wafer to be in direct contact with the heating module, the wafer is placed in the heating module and heated to a first set temperature.

[0068] Further preferably, the anti-warping operation on the wafer includes the following steps:

[0069] Place the wafer directly above the heating module and support the wafer;

[0070] Supporting the wafer to gradually approach the heating module until the wafer is in direct contact with the heating module;

[0071] Multiple edge portions of the wafer are pressed downward simultaneously by multiple flattening mechanisms, so that the wafer is attached to the heating module.

[0072] Preferably, during the process of the flattening mechanism pressing down the edge of the wafer, as the warping amount decreases, the flattening mechanism can adaptively adjust the contact position with the edge of the wafer.

[0073] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0074] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0075] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0076] Figure 1 A three-dimensional diagram of a panel chip-level bottom filling device of the present invention;

[0077] Figure 2 A top view of a panel chip level bottom filling device of the present invention;

[0078] Figure 3 It is a three-dimensional view of the wafer lifting mechanism of the wafer rotating platform of the present invention when it is raised;

[0079] Figure 4 It is a three-dimensional diagram of the wafer lifting mechanism of the wafer rotating platform of the present invention when it is raised;

[0080] Figure 5 It is a three-dimensional diagram of the wafer lifting mechanism and the wafer lifting mechanism of the wafer rotating platform of the present invention;

[0081] Figure 6 A three-dimensional diagram of a wafer lifting mechanism of a wafer rotating platform of the present invention after a wafer support is installed;

[0082] Figure 7It is a three-dimensional diagram of the wafer support assembly and the wafer rotation mechanism of the wafer rotation platform of the present invention after being assembled;

[0083] Figure 8 It is a schematic diagram of the transmission structure for wafer rotation of the present invention;

[0084] Fig. 9 A cross-sectional view of a wafer support assembly of a wafer rotating platform of the present invention;

[0085] Fig.10 A three-dimensional diagram of a preparation station of the present invention;

[0086] Fig.11 A three-dimensional diagram of a dispensing station of the present invention;

[0087] Fig.12 It is an assembly diagram of the heating module and the flattening mechanism in the dispensing station of the present invention;

[0088] Fig.13 is a three-dimensional diagram of a single flattening mechanism of the present invention;

[0089] Fig.14 A structural diagram of a flattening mechanism of the present invention is shown;

[0090] Fig.15 A three-dimensional diagram of the detection station of the present invention;

[0091] Fig.16 It is a structural diagram of the loading and unloading machine body of the present invention;

[0092] Fig.17 It is a schematic diagram of the process of the wafer operation method of the present invention;

[0093] Fig.18 The flowchart of the preliminary preheating process of the present invention;

[0094] Fig.19 The figure is a flowchart of the wafer anti-warping process of the present invention.

[0095] Description of reference numerals:

[0096] 1a, loading and unloading machine body; 11, material taking part; 12, movable part; 13, base;

[0097] 2a, preparation station; 20, wafer rotation platform; 21, wafer carrier; 22, wafer support assembly; 221, chassis; 2211, mounting part; 2212, guide column; 222, fixed outer ring; 223, movable top ring; 2231, top support member; 2232, bottom mounting member; 2233, middle connecting member; 23, wafer lifting mechanism; 231, first screw transmission assembly; 232, first drive motor; 24, wafer rotation mechanism; 241, pulley turntable; 242, drive assembly; 2421, second drive motor; 2422, first gear; 2423, second gear; 2424, third gear; 26, wafer lifting mechanism; 261, wafer carrier; 262, second screw transmission assembly; 263, third drive motor; 27, transmission belt; 28, temporary stop rack;

[0098] 3a. Glue dispensing station;

[0099] 31. Glue dispensing operation platform;

[0100] 32. Flattening mechanism; 321. Longitudinal drive assembly; 322. Transverse drive assembly; 323. Pressing plate; 324. Universal pressure head; 3241. Connector; 3242. Ball bearing; 325. Connecting module; 3251. First connecting plate; 3252. Second connecting plate; 3253. Third connecting plate; 3254. Guide rail; 326. Pressure sensor;

[0101] 4a. Inspection station;

[0102] 41. Three-axis motion platform; 42. Visual inspection mechanism;

[0103] 5a, feeding area;

[0104] 6. Heating module; 61. Inner ring heating plate; 62. Outer ring heating plate;

[0105] 7. Wafer. DETAILED DESCRIPTION

[0106] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, and therefore only show the components related to the present invention. In the description of the present invention, it should be understood that, unless otherwise specified, the meaning of "multiple" is two or more.

[0107] First of all, it should be noted that the type of wafer used by the panel chip-level bottom filling equipment and wafer operation method disclosed in this application is preferably a square wafer 7 (i.e., the large-size wafer mentioned above), which mainly targets the problems existing in the manufacturing process of the square wafer 7. However, it should be understood that the solution disclosed in this application can also be applied to the current mainstream wafer shapes and specifications, but due to the differences in wafer shapes and specifications, some functions involved in the solution of this application are not necessary for the current mainstream wafer manufacturing process.

[0108] Here, the following is a detailed description of the structure involved in the manufacturing process of the square wafer 7. As for the current mainstream wafer types, those skilled in the art can operate according to experience, so the wafer manufacturing process of this type will not be described below.

[0109] See also Figure 1 to Figure 2 and Fig.16 A panel chip-level bottom filling device according to a specific embodiment of the present invention includes a loading and unloading machine body 1a, a preparation station 2a, a dispensing station 3a and a detection station 4a, wherein a movable part 12 is provided in the loading and unloading machine body 1a, and a material picking part 11 for loading and unloading is provided in the movable space, and the wafer 7 can be transported to each operation station for operation through the material picking part 11. The dispensing station 3a is located on the opposite sides of the loading and unloading machine body 1a, and the preparation station 2a is located on one side of the loading and unloading machine body 1a and is arranged close to one of the dispensing stations 3a, so that the dispensing station 3a can receive the wafer 7 preheated by the preparation station 2a in the shortest path, and the detection station 4a is located on the other side of the loading and unloading machine body 1a, and the detection station 4a is arranged relative to the preparation station 2a, and the detection station 4a is arranged close to the dispensing station 3a on the same side. Therefore, by symmetrically arranging the glue dispensing station 3a at the feeding area 5a close to the loading and unloading machine body 1a, it is convenient for the operator to operate the glue dispensing equipment in the glue dispensing station 3a on the same side. At the same time, the two symmetrically arranged glue dispensing stations 3a can both receive the wafers 7 preheated by the preparation station 2a, ensuring the smoothness of the glue dispensing operation process, reducing the time for the wafer 7 to wait for glue dispensing, and improving the operation efficiency.

[0110] The preparation station 2a can receive the wafer 7 to be processed input by the material picking part 11. Before the wafer 7 is input, the wafer 7 is first scanned, and then the wafer 7 to be processed is preheated. After the preheating is completed, the wafer 7 is subjected to the initial anti-warping operation to make the surface of the wafer 7 flat. After the wafer 7 is leveled, its orientation is corrected, so that the position of the wafer 7 after being input into each station can be consistent, thereby improving the overall operating efficiency of the equipment.

[0111] The glue dispensing station 3a is arranged near the feeding area 5a of the loading and unloading machine body 1a, and a storage mechanism for storing and retrieving wafers 7 is arranged in the feeding area 5a. The glue dispensing station 3a can receive the wafers 7 pre-processed by the preparation station 2a, and heat the pre-processed wafers 7. After the heating treatment, the softened wafers 7 are subjected to anti-warping treatment. After the anti-warping treatment, the wafers 7 are in a flat state as a whole, and glue is dispensed on the flat wafers 7 at this time. It should be noted that the feeding area 5a can be adapted to the AGV trolley, the PGV trolley and the OHT overhead crane for the initial transmission of the wafers 7.

[0112] Furthermore, the detection station 4a can receive the wafer 7 after the operation on the glue dispensing station 3a, so as to detect the glue condition of the wafer 7 after the glue dispensing is completed, so as to avoid the occurrence of adverse conditions such as glue leakage.

[0113] See also Figure 2 The loading and unloading machine body 1a includes a base 13, a movable part 12 and a material taking part 11, wherein the movable part 12 is arranged on the base 13 via a guide rail 3254, and the movable part 12 is suitable for moving between various working stations along the guide rail 3254. The material taking part 11 is arranged on the movable part 12, and the material taking part 11 can take the wafer 7 from the feeding area 5a and each working station.

[0114] See also Figure 3 , Fig.10 and Fig.15 , the preparation station 2a and the inspection station 4a both include a wafer operation platform, the wafer operation platform includes a wafer rotating platform 20, a heating module 6 and a wafer lifting mechanism 26, the wafer rotating platform 20 divides the heating module 6 into an inner ring heating plate 61 and an outer ring heating plate 62, the inner ring heating plate 61 and the outer ring heating plate 62 are suitable for heating the wafer 7 at the same time, the wafer lifting mechanism 26 is suitable for moving in the vertical direction, and the wafer lifting mechanism 26 is suitable for protruding the heating module 6 and supporting the wafer 7. Among them, only the temporary stop frame 28 is provided in the preparation station 2a, and the temporary stop frame 28 is arranged above the wafer rotating platform 20 for emergency parking of the wafer 7. It should be noted that the heating module 6 is provided in the inspection station 4a, the preparation station 2a and the dispensing station 3a, wherein the heating module 6 is divided into the inner ring heating plate 61 and the outer ring heating plate 62 in the inspection station 4a and the preparation station 2a. In the glue dispensing station 3a, the heating module 6 is a whole plate.

[0115] See also Figures 4 to 9Specifically, the wafer rotation platform 20 includes a wafer carrier 21, a wafer support assembly 22, a wafer lifting mechanism 23 and a wafer rotation mechanism 24. The wafer carrier 21 is used to carry the wafer 7. The wafer support assembly 22 moves in a vertical direction and can protrude from the wafer carrier 21 to support the wafer 7. The wafer lifting mechanism 23 is connected to the wafer support assembly 22 and drives the wafer support assembly 22 to move in the vertical direction. When the wafer support assembly 22 protrudes from the wafer carrier 21, the wafer rotation mechanism 24 drives the wafer support assembly 22 to rotate around the vertical direction and synchronously drives the wafer 7 to rotate.

[0116] More specifically, the wafer lifting mechanism 23 includes a first screw transmission assembly 231 and a first drive motor 232. The first screw transmission assembly 231 can drive the wafer support assembly 22 to move up and down in the vertical direction. The first drive motor 232 is connected to the first screw transmission assembly 231 through a transmission belt 27 to drive the first screw transmission assembly 231 to move.

[0117] When the wafer support assembly 22 contacts the wafer 7, since the contact surface of the two is mainly located in the middle area of ​​the wafer 7, in order to provide as stable a support effect as possible on the wafer 7, the contact surface between the wafer support assembly 22 and the wafer 7 is set to be annular to achieve stable support for the wafer 7. The wafer support assembly 22 includes a chassis 221, a fixed outer ring 222 and a movable top ring 223, wherein the fixed outer ring 222 is connected to the chassis 221 through a plurality of support columns, that is, the chassis 221 can drive the wafer support assembly 22 to move synchronously in the vertical direction. A plurality of mounting portions 2211 are also extended from the circumferential side of the chassis 221, and each mounting portion 2211 is provided with a guide column 2212, and the guide column 2212 can ensure that the chassis 221 drives the wafer support assembly 22 to move in the vertical direction without radial deviation.

[0118] In addition, the movable top ring 223 is movably connected to the fixed outer ring 222 via bearings. The setting of the bearings (two bearings are provided here, and both bearings are thin-walled bearings) enables the movable top ring 223 to rotate relative to the fixed outer ring 222, and the rotation direction of the movable top ring 223 is rotation around the vertical direction, thereby achieving that when the movable top ring 223 supports the wafer 7, it can drive the wafer 7 to rotate synchronously.

[0119] Specifically, the movable top ring 223 includes a top support member 2231 and a bottom mounting member 2232, and the bottom mounting member 2232 is fixedly connected to the top support member 2231 through a middle connecting member 2233. The top support member 2231 extends a mounting portion 2211 radially, and the mounting portion 2211 cooperates with the fixed outer ring 222 to form an embedded mounting groove, one end of the middle connecting member 2233 is embedded in the mounting groove, and is fixedly connected to the mounting portion 2211 by bolts, and the other end of the middle connecting member 2233 is connected to the bottom mounting member 2232. The bottom mounting member 2232 is set as a stepped structure, the top end of which is connected to the middle connecting member 2233, and the bottom end is connected to the pulley turntable 241, and then the rotation of the pulley turntable 241 can drive the various structural members connected thereto to rotate synchronously.

[0120] The wafer rotation mechanism 24 includes a pulley turntable 241 and a driving assembly 242. The pulley turntable 241 is fixedly mounted on the bottom mounting member 2232. The driving assembly 242 is mounted on the chassis 221. The driving assembly 242 is connected to the pulley turntable 241 via a transmission belt 27, thereby driving the pulley to rotate, and driving the movable top ring 223 to rotate synchronously through the rotation of the pulley turntable 241.

[0121] Specifically, the driving assembly 242 includes a second driving motor 2421 and a reduction mechanism, the input end of the reduction mechanism is connected to the first gear 2422, and the output end of the reduction mechanism is connected to the pulley turntable 241, so as to drive the pulley turntable 241 to rotate. At the same time, the reduction mechanism also includes a transmission shaft, and a second gear 2423 and a third gear 2424 installed at both ends of the transmission shaft, and the second gear 2423 is connected to the first gear 2422 through a transmission belt 27, and the third gear 2424 is connected to the pulley turntable 241 through a transmission belt 27, and the diameter of the second gear 2423 is greater than the diameter of the first gear 2422.

[0122] That is, after the second drive motor 2421 outputs driving force to the second gear 2423 through the first gear 2422, the second gear 2423 can be driven to rotate, and since the diameter of the third gear 2424 is smaller than the diameter of the second gear 2423, when the second gear 2423 rotates one circle, the third gear 2424 will be driven to rotate multiple circles, and then the third gear 2424 outputs power to the pulley turntable 241 to drive the pulley turntable 241 to rotate.

[0123] However, since the cutting angle of the transmission belt 27 introduced and led out between the third gear 2424 and the pulley turntable 241 is too large, the transmission area between the transmission belt 27 and the third gear 2424 and the pulley turntable 241 is reduced, which in turn affects the stability of the transmission process between the pulley turntable 241 and the third gear 2424. Therefore, in order to increase the transmission area between the transmission belt 27 and the pulley turntable 241 and the third gear 2424, an idler wheel is provided between the third gear 2424 and the pulley turntable 241.

[0124] By setting the idler wheel, the transmission belt 27 led out from the third gear 2424 can be guided to transmit between the pulley turntable 241 at a smaller cut-in angle, thereby increasing the transmission area between the transmission belt 27 and the pulley turntable 241. At the same time, when the transmission belt 27 is introduced from the pulley turntable 241 into the third gear 2424, the introduced transmission belt 27 is also first adjusted by the idler wheel to increase the transmission area between the transmission belt 27 and the third gear 2424, thereby ensuring the stability of the transmission between the pulley turntable 241 and the third gear 2424.

[0125] See also Fig.15 In addition, the inspection station 4a also includes a three-axis motion platform 41 and a visual inspection mechanism 42. The three-axis motion platform 41 has a motion range in three directions of X, Y, and Z. The visual inspection mechanism 42 is arranged on the three-axis motion platform 41 so that the visual inspection mechanism 42 can be driven by the three-axis motion platform 41 to move above the wafer working platform, and the visual inspection mechanism 42 is suitable for visual inspection of the dispensing state of the wafer 7 carried on the wafer working platform.

[0126] Specifically, the visual inspection mechanism 42 includes at least a 2D inspection module. In addition, a 3D inspection module may be added. After the 3D inspection module is added, it is integrated with the 2D inspection module to achieve synchronous movement. Among them, the inspection module can perform glue shape inspection, which includes product target position positioning, inspection area division, QR code recognition, foolproof inspection, glue point inspection, glue shape measurement, etc. 3D inspection mainly includes the inspection of the glue height of the four sides of the product and the inspection of the glue height of the R angle.

[0127] See also Fig.11 The glue dispensing station 3a includes a glue dispensing operation platform 31, a glue dispensing carrier and a plurality of flattening mechanisms 32. The glue dispensing carrier is provided with a heating module 6. When the wafer 7 is placed on the glue dispensing carrier, the heating module 6 heats the wafer 7. A flattening mechanism 32 is correspondingly arranged on a side of the glue dispensing carrier. When the wafer 7 is placed on the glue dispensing carrier, the plurality of flattening mechanisms 32 simultaneously press downward against the plurality of edge portions of the wafer 7 respectively, so that the wafer 7 fits onto the glue dispensing carrier.

[0128] Specifically, the glue dispensing operation platform 31 includes a y-axis driving mechanism, an x-axis driving mechanism and four z-axis operating mechanisms. The y-axis driving mechanism is respectively arranged on both sides of the glue dispensing support platform, and both ends of the x-axis driving mechanism are mounted on the y-axis driving mechanism. The four z-axis operating mechanisms are all connected to the x-axis driving mechanism, and the four z-axis operating mechanisms can perform glue dispensing operations independently or synchronously.

[0129] More specifically, the dispensing station 3a also includes a wafer lifting mechanism 26, which includes a wafer carrier 261, a second screw transmission assembly 262 and a third drive motor 263. The wafer carrier 261 is suitable for moving in the vertical direction, and the wafer carrier 261 is respectively arranged at the circumferential edge and center of the wafer 7, so that after extending the heating module 6 upward, it can simultaneously support the circumferential edge and center of the wafer 7. The second screw transmission assembly 262 is arranged on the circumferential side of the wafer 7 and is connected to each wafer carrier 261 via a base plate, and each second screw transmission assembly 262 is connected via a transmission belt 27 to enable synchronous movement. The third drive motor 263 is connected to the adjacent second screw transmission assembly 262 via the transmission belt 27 to drive each second screw transmission assembly 262 to move synchronously in the vertical direction.

[0130] See also Figure 12 to Figure 14 In addition, the flattening mechanism 32 includes: a longitudinal drive component 321, a transverse drive component 322, a pressure plate 323 and a universal pressure head 324, the universal pressure head 324 is installed on the pressure plate 323, the pressure plate 323 is connected to the transverse drive component 322, and the transverse drive component 322 is connected to the longitudinal drive component 321. There are multiple universal pressure heads 324 installed on a pressure plate 323, and the multiple universal pressure heads 324 are arranged in a "one" shape. Since the size of the wafer 7 is relatively large, in this embodiment, the number of the transverse drive components 322 is two, and two pressure plates 323 are arranged on each transverse drive component 322. Of course, for wafers 7 of other sizes, the number of the longitudinal drive components 321, the transverse drive components 322, the pressure plates 323, and the universal pressure heads 324 can be changed so that the edge of the wafer 7 can be flattened. The longitudinal drive assembly 321 can drive the transverse drive assembly 322 to move up and down, and the transverse drive assembly 322 can drive the pressing plate 323 to extend or retract in the horizontal direction. When no warpage suppression is performed, the pressing plate 323 is in a retracted state, and the pressing plate 323 is located on the side of the dispensing support platform, and will not affect the rising and falling of the wafer 7.

[0131] For example, the universal pressure head 324 includes a connector 3241 and a ball 3242, wherein a portion of the ball 3242 is located in the receiving groove of the connector 3241, and the connector 3241 is mounted in the mounting hole of the pressure plate 323. When the ball 3242 contacts the warped edge, the ball 3242 can adaptively adjust the contact position with the warped edge as the warping amount of the wafer 7 decreases during the process of the flattening mechanism 32 pressing the edge of the wafer 7 downward. It is understandable that when the edge of the wafer 7 is warped, the cross-section of the wafer 7 is roughly crescent-shaped. The ball 3242 is not stuck in the receiving groove, but can rotate. During the process of the universal pressure head 324 pressing down, the ball 3242 contacts the warped edge. Assuming that the contact position between the ball 3242 and the warped edge is point A at the beginning, as the warped edge gradually flattens, the contact position changes from point A to point B. During the pressing process, the ball 3242 will generate a certain friction force due to the change in contact position, and this friction force may scratch the wafer 7. However, the ball 3242 of this embodiment is freely rotatable. When the contact position changes, this friction force can be offset by the rotation of the ball 3242, thereby preventing the wafer 7 from being scratched. In addition, the ball 3242 of this embodiment is in point contact with the warped edge, and the contact area is smaller. During the pressing process, the risk of damaging the wafer 7 can be further reduced.

[0132] The flattening mechanism 32 further includes a connection module 325, through which the pressing plate 323 is connected to the lateral driving assembly 322, and a pressure sensor 326 is installed on the connection module 325, and the pressure sensor 326 is used to detect the pressure value applied to the edge by the universal pressure head 324. The connection module 325 includes a first connection plate 3251, a second connection plate 3252, a third connection plate 3253 and a guide rail 3254, the first connection plate 3251 and the third connection plate 3253 are slidably connected through the guide rail 3254, the second connection plate 3252 is connected to the first connection plate 3251, the pressing plate 323 is connected to the second connection plate 3252, and one end of the pressure sensor 326 is connected to the third connection plate 3253, and the other end is connected to the second connection plate 3252. That is to say, the pressing plate 323 and the third connecting plate 3253 move together, the second connecting plate 3252 and the first connecting plate 3251 move together, and the third connecting plate 3253 and the first connecting plate 3251 can slide relative to each other through the guide rail 3254. The pressure sensor 326 associates the second connecting plate 3252 and the third connecting plate 3253. When the universal pressing head 324 presses down the warped edge, the warped edge will generate a reaction force on the universal pressing head 324, and this reaction force will cause the pressing plate 323 and the universal pressing head 324 to move upward a small distance. When the pressing plate 323 moves upward, it will drive the third connecting plate 3253 to move upward as well, and when the third connecting plate 3253 moves upward, it will squeeze the pressure sensor 326, that is, the pressure sensor 326 can detect the magnitude of this reaction force, thereby reflecting the downward pressure of the universal pressing head 324 on the warped edge. Since the wafer 7 is made of glass and is relatively brittle, if the pressure of the universal pressure head 324 is too great, the edge of the wafer 7 is easily crushed or cracked. Therefore, the pressure value of the universal pressure head 324 on the edge can be monitored in real time by the pressure sensor 326. If it is found that the real-time pressure value exceeds the preset maximum pressure value, the downward pressure is adjusted by adjusting the descending speed of the universal pressure head 324.

[0133] It should be noted that the number of flattening mechanisms 32 matches the number of sides of the wafer 7. For example, the quadrilateral wafer 7 is equipped with four flattening mechanisms 32, and the four flattening mechanisms 32 are respectively located at the four sides of the quadrilateral wafer 7. When performing the flattening operation, the four flattening mechanisms 32 act on the four edges of the quadrilateral wafer 7 at the same time. This embodiment is mainly aimed at the warping suppression treatment of large-sized wafers 7. For example, the size of the quadrilateral wafer 7 is 600mm*600mm. Due to the material of the wafer 7, the warping amount produced will be much larger than that of the 8-inch / 12-inch wafer 7. The warping amount of the wafer 7 is generally about 3mm, while the warping amount of the wafer 7 can reach 10mm. In the process of the warped edge being gradually flattened, the contact position between the flattening mechanism 32 and the warped edge will change due to the ductility of the product, that is, a relative displacement will occur between the flattening mechanism 32 and the wafer 7. This relative displacement process will produce a certain friction force, and this friction force may scratch the product. Therefore, the present embodiment improves the structure of the flattening mechanism 32 so that during the pressing process, the flattening mechanism 32 is in flexible contact with the warped edge.

[0134] See also Figures 17 to 19 A wafer operation method according to a specific embodiment of the present invention is applied to a panel chip-level bottom filling device, which includes a loading and unloading machine body 1a for conveying wafers 7 to each operation station, a preparation station 2a for preheating and scanning the wafers 7 for alignment, a glue dispensing station 3a for heating and dispensing glue on the preheated wafers 7, and a detection station 4a for detecting the wafers 7 after the dispensing is completed. The wafer operation method includes the following steps:

[0135] Obtain wafer 7 and scan the barcode of wafer 7;

[0136] Preliminarily preheating the wafer 7;

[0137] When the temperature of the wafer 7 reaches the first set temperature, the wafer 7 is subjected to the initial anti-warpage operation;

[0138] After the anti-warping operation of the wafer 7 is completed, the wafer 7 is rotated to a specified angle and then transported to the glue dispensing station 3a for further heating;

[0139] When the temperature of the wafer 7 reaches the second set temperature, the wafer 7 is subjected to a second anti-warping operation and then glue is dispensed;

[0140] After the dispensing of the wafer 7 is completed, the wafer 7 is transported to the inspection station 4 a to inspect the dispensing condition of the wafer 7 and then output.

[0141] Specifically, the wafer 7 is first input into the preparation station 2a via the loading and unloading machine body 1a, and then the wafer 7 is scanned for positioning, preheated, anti-warping, and positioning operations are performed in the preparation station 2a. The wafer 7 is then transported to the glue dispensing station 3a for preheating, heating, anti-warping, and glue dispensing operations. The wafer 7 after glue dispensing is then transported to the inspection station 4a. The inspection station 4a then performs glue shape detection on the wafer 7 after glue dispensing, and adds glue height detection if necessary.

[0142] Specifically, the preliminary preheating of the wafer 7 includes the following steps:

[0143] Lift the wafer 7 so that the wafer 7 does not directly contact the heating module 6 of the preparation station 2a;

[0144] Gradually reduce the distance between the wafer 7 and the heating module 6 so that the temperature of the wafer 7 gradually increases;

[0145] When the temperature of the wafer 7 rises to a temperature at which the wafer 7 can be in direct contact with the heating module 6 , the wafer 7 is placed in the heating module 6 and heated to a first set temperature.

[0146] More specifically, wafer 7 is heated to the first set temperature at the preparation station 2a and then transported to the glue dispensing station 3a. However, since the temperature of wafer 7 still does not reach the temperature required for the operation of glue dispensing station 3a, wafer 7 needs to be heated to the second set temperature. During heating, wafer 7 is first lifted up by the lifting mechanism provided in glue dispensing station 3a, and the heating module 6 provided in glue dispensing station 3a preheats wafer 7 for the second time. Then, the lifting mechanism slowly supports wafer 7 close to heating module 6, and finally wafer 7 is placed on heating module 6. After the temperature of wafer 7 is raised to the second set temperature by the heating module 6 provided in glue dispensing station 3a, subsequent operations such as anti-warping and glue dispensing can be performed on wafer 7.

[0147] Specifically, the anti-warping operation on the wafer 7 includes the following steps:

[0148] Place the wafer 7 directly above the heating module 6 and support the wafer 7;

[0149] The supporting wafer 7 gradually descends until the wafer 7 contacts the surface of the heating module 6;

[0150] The plurality of edge portions of the wafer 7 are pressed downward by the plurality of flattening mechanisms 32 at the same time, so that the wafer 7 is attached to the heating module 6 .

[0151] More specifically, during the process of the flattening mechanism 32 pressing down the edge of the wafer 7 , as the warping amount decreases, the flattening mechanism 32 can adaptively adjust the contact position with the edge of the wafer 7 .

[0152] In summary, the present invention can automatically flatten the warped edge of the wafer 7, which can not only improve work efficiency, but also reduce the risk of damaging the wafer 7. By setting the universal pressure head 324, flexible contact with the warped edge can be achieved during the downward pressing process, which is beneficial to reduce damage to the wafer 7. The pressure value of the universal pressure head 324 on the warped edge of the wafer 7 is detected in real time by the pressure sensor 326, and the pressure change can be monitored and adjusted in time. At the same time, the synchronization of each area of ​​the wafer 7 is guaranteed when the wafer 7 is lifted and supported.

[0153] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0154] The above description is based on the ideal embodiment of the present invention. Through the above description, relevant personnel can make various changes and modifications without departing from the technical concept of the present invention. The technical scope of the present invention is not limited to the content of the specification, and its technical scope must be determined by the scope of the claims.

Claims

1. A panel chip level bottom filling device, characterized in that: include: A loading and unloading machine body (1a), wherein a movable space suitable for carrying wafers (7) is provided in the loading and unloading machine body (1a), wherein a material picking component (11) for loading and unloading wafers (7) is provided in the movable space, wherein the material picking component (11) is suitable for transporting the wafers (7) to various working stations, wherein each of the working stations comprises a preparation station (2a), a dispensing station (3a) and a testing station (4a); wherein, The preparation station (2a) is located on one side of the loading and unloading machine body (1a) so as to receive the wafer (7) to be processed input by the material taking member (11), and preheat the wafer (7) to be processed and scan the code for alignment; The glue dispensing station (3a) is located at the side of the loading and unloading machine body (1a), and the glue dispensing station (3a) is arranged close to the feeding area (5a) of the loading and unloading machine body (1a), so as to be able to receive the wafer (7) preheated by the preparation station (2a) in the shortest path, and heat and dispense glue on the preheated wafer (7); The detection station (4a) is located on the other side of the loading and unloading machine body (1a) and is arranged opposite to the preparation station (2a). The detection station (4a) is suitable for receiving the wafer (7) after the glue dispensing operation is completed on the glue dispensing station (3a) to detect the glue dispensing status of the wafer (7).

2. The panel chip level bottom filling device according to claim 1, characterized in that: The loading and unloading machine body (1a) comprises: Base (13); A movable part (12), the movable part (12) being arranged on the base (13) via a guide rail (3254), and the movable part (12) being suitable for moving between the working stations along the guide rail (3254); A material taking component (11), wherein the material taking component (11) is arranged on the movable component (12) to take and place wafers (7) from the feed area (5a) and each of the operating stations.

3. The panel chip level bottom filling device according to claim 1, characterized in that: The preparation station (2a) and the inspection station (4a) both include a wafer operation platform, and the wafer operation platform includes: Wafer rotating platform (20); A heating module (6), wherein the wafer rotating platform (20) divides the heating module (6) into an inner ring heating plate (61) and an outer ring heating plate (62), and the inner ring heating plate (61) and the outer ring heating plate (62) are suitable for heating the wafer (7) at the same time; A wafer lifting mechanism (26), wherein the wafer lifting mechanism (26) is suitable for moving in a vertical direction, and the wafer lifting mechanism (26) is suitable for protruding from the heating module (6) and supporting the wafer (7).

4. The panel chip level bottom filling device according to claim 3, characterized in that: The wafer rotating platform (20) comprises: A wafer carrying platform (21), wherein the wafer carrying platform (21) is used to carry a wafer (7); A wafer support assembly (22), the wafer support assembly (22) moves in a vertical direction and can protrude from the wafer carrier platform (21) to support the wafer (7); A wafer lifting mechanism (23), the wafer lifting mechanism (23) is connected to the wafer supporting assembly (22) and drives the wafer supporting assembly (22) to move in a vertical direction; A wafer rotating mechanism (24), wherein when the wafer supporting assembly (22) protrudes from the wafer carrying platform (21), the wafer rotating mechanism (24) drives the wafer supporting assembly (22) to rotate around a vertical direction and simultaneously drives the wafer (7) to rotate.

5. The panel chip level bottom filling device according to claim 4, characterized in that: The wafer lifting mechanism (23) comprises: A first screw transmission assembly (231), wherein the first screw transmission assembly (231) drives the wafer support assembly (22) to move up and down in a vertical direction; A first drive motor (232), wherein the first drive motor (232) is connected to the first screw drive assembly (231) via a drive belt (27) to drive the first screw drive assembly (231) to move.

6. The panel chip level bottom filling device according to claim 4, characterized in that: The wafer support assembly (22) comprises: A chassis (221), wherein the wafer lifting mechanism (23) is suitable for driving the chassis (221) to move in a vertical direction; A fixed outer ring (222), wherein the fixed outer ring (222) is fixed to the chassis (221) via a plurality of support columns; A movable top ring (223), wherein the movable top ring (223) is connected to the fixed outer ring (222) via a bearing, and the movable top ring (223) can protrude from the wafer supporting platform (21).

7. The panel chip level bottom filling device according to claim 6, characterized in that: The movable top ring (223) comprises: A top support member (2231), the top support member (2231) being adapted to protrude from the wafer carrier platform (21) and to contact the wafer (7); A bottom mounting member (2232), wherein the bottom mounting member (2232) is connected to the fixed outer ring (222) via a bearing; A middle connecting member (2233), wherein the middle connecting member (2233) simultaneously connects the bottom mounting member (2232) and the top supporting member (2231).

8. The panel chip level bottom filling device according to claim 7, characterized in that: The wafer rotating mechanism (24) comprises: A pulley turntable (241), wherein the pulley turntable (241) is fixedly sleeved on the bottom mounting member (2232); A driving assembly (242), wherein the driving assembly (242) is mounted on the chassis (221), and the driving assembly (242) is connected to the pulley turntable (241) via a transmission belt (27) so as to drive the pulley turntable (241) to rotate, and drive the movable top ring (223) to rotate synchronously via the pulley turntable (241).

9. The panel chip level bottom filling device according to claim 8, characterized in that: The drive assembly (242) comprises: A second driving motor (2421), wherein a first gear (2422) is installed at an output end of the second driving motor (2421); A speed reduction mechanism, wherein the input end of the speed reduction mechanism is connected to the first gear (2422) by belt transmission, and the output end of the speed reduction mechanism is connected to the pulley turntable (241) and drives the pulley turntable (241) to rotate.

10. The panel chip level bottom filling device according to claim 9, characterized in that: The speed reduction mechanism comprises a transmission shaft, and a second gear (2423) and a third gear (2424) installed at both ends of the transmission shaft, the second gear (2423) is connected to the first gear (2422) through a transmission belt (27), the third gear (2424) is connected to the pulley turntable (241) through a transmission belt (27), and the diameter of the second gear (2423) is greater than the diameter of the first gear (2422).

11. The panel chip level bottom filling device according to claim 1, characterized in that: The glue dispensing station (3a) comprises: Glue dispensing operation platform (31); A glue dispensing platform, wherein the glue dispensing platform is provided with a heating module (6), and when the wafer (7) is carried on the glue dispensing platform, the heating module (6) heats the wafer (7); A plurality of flattening mechanisms (32), one of the flattening mechanisms (32) corresponding to a side edge of the glue dispensing support platform, and when the wafer (7) is placed on the glue dispensing support platform, the plurality of flattening mechanisms (32) simultaneously press downwardly against the plurality of edge portions of the wafer (7) respectively, so that the wafer (7) is attached to the glue dispensing support platform.

12. The panel chip level bottom filling device according to claim 11, characterized in that: The dispensing operation platform (31) comprises: A y-axis driving mechanism, wherein the y-axis driving mechanism is respectively arranged on both sides of the dispensing support platform; An x-axis driving mechanism, wherein both ends of the x-axis driving mechanism are mounted on the y-axis driving mechanism; Four z-axis operating mechanisms, the four z-axis operating mechanisms are all connected to the x-axis driving mechanism, and the four z-axis operating mechanisms can perform dispensing operations independently or synchronously.

13. The panel chip level bottom filling device according to claim 11, characterized in that: The glue dispensing station (3a) further comprises a wafer lifting mechanism (26), wherein the wafer lifting mechanism (26) comprises: a wafer carrier (261), the wafer carrier (261) being suitable for moving in a vertical direction, and the wafer carrier (261) being respectively arranged at the peripheral edge and the center of the wafer (7), so as to simultaneously support the peripheral edge and the center of the wafer (7) after extending upward from the heating module (6); A second screw drive assembly (262), the second screw drive assembly (262) being arranged on the peripheral side of the wafer (7) and connected to each of the wafer carriers (261) via a bottom plate, and each of the second screw drive assemblies (262) being connected via a transmission belt (27) so as to be able to move synchronously; A third drive motor (263), wherein the third drive motor (263) is connected to the adjacent second screw drive assembly (262) via a drive belt (27) to drive each of the second screw drive assemblies (262) to move synchronously in a vertical direction.

14. The panel chip level bottom filling device according to claim 11, characterized in that: The flattening mechanism (32) comprises: a longitudinal drive assembly (321), a transverse drive assembly (322), a pressing plate (323) and a universal pressing head (324); the universal pressing head (324) is mounted on the pressing plate (323); the pressing plate (323) is connected to the transverse drive assembly (322); and the transverse drive assembly (322) is connected to the longitudinal drive assembly (321).

15. The panel chip level bottom filling device according to claim 14, characterized in that: The universal pressure head (324) comprises a connector (3241) and a ball (3242), wherein the ball (3242) is partially mounted in a receiving groove of the connector (3241), and the connector (3241) is inserted in a mounting hole of the pressure plate (323). When the ball (3242) contacts the edge of the wafer (7), as the amount of warping decreases, the ball (3242) can adaptively adjust the contact position with the edge of the wafer (7).

16. The panel chip level bottom filling device according to claim 3, characterized in that: The detection station (4a) also includes: A three-axis motion platform (41), wherein the three-axis motion platform (41) has motion travels in three directions: X, Y, and Z; A visual inspection mechanism (42), wherein the visual inspection mechanism (42) is arranged on the three-axis motion platform (41) so as to be able to drive the visual inspection mechanism (42) to move above the wafer working platform via the three-axis motion platform (41), and the visual inspection mechanism (42) is suitable for visually inspecting the dispensing state of the wafer (7) carried on the wafer working platform.

17. A wafer operation method, characterized in that: Applicable to panel chip-level bottom filling equipment, the panel chip-level bottom filling equipment comprises a loading and unloading machine body (1a) for conveying wafers (7) to various operation stations, a preparation station (2a) for scanning codes, aligning and preheating the wafers (7), a glue dispensing station (3a) for heating and dispensing glue on the preheated wafers (7), and a detection station (4a) for detecting the wafers (7) after the glue dispensing is completed; The wafer operation method comprises the following steps: Obtaining a wafer (7), and scanning and aligning the wafer (7); Preliminarily preheating the wafer (7); When the temperature of the wafer (7) reaches a first set temperature, performing a primary anti-warping operation on the wafer (7); When the anti-warping operation of the wafer (7) is completed, the wafer (7) is rotated to a specified angle and then transported to the glue dispensing station (3a) for further heating; When the temperature of the wafer (7) reaches the second set temperature, the wafer (7) is subjected to a secondary anti-warping operation and then glue is dispensed; When the dispensing of the wafer (7) is completed, the wafer (7) is transported to the inspection station (4a) to inspect the dispensing condition of the wafer (7) and then the wafer (7) is output.

18. The wafer operation method according to claim 17, characterized in that: Preliminary preheating of the wafer (7) includes the following steps: Lifting the wafer (7) so that the wafer (7) does not directly contact the heating module (6) of the preparation station (2a); Gradually reducing the distance between the wafer (7) and the heating module (6) so that the temperature of the wafer (7) gradually increases; When the temperature of the wafer (7) rises to a temperature capable of directly contacting the heating module (6), the wafer (7) is placed on the heating module (6) and heated to a first set temperature.

19. The wafer operation method according to claim 17, characterized in that: The anti-warping operation for the wafer (7) comprises the following steps: Placing the wafer (7) directly above the heating module (6) and supporting the wafer (7); Supporting the wafer (7) to gradually descend until the wafer (7) contacts the surface of the heating module (6); Multiple edge portions of the wafer (7) are pressed downward simultaneously by multiple flattening mechanisms (32), so that the wafer (7) is attached to the heating module (6).

20. The wafer operation method according to claim 19, wherein: During the process of the flattening mechanism (32) pressing down the edge of the wafer (7), as the amount of warping decreases, the flattening mechanism (32) can adaptively adjust the contact position with the edge of the wafer (7).

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