Variable multi-beam laser processing method, device, medium and equipment

Abstract

The invention discloses a variable multi-beam laser processing method, device, medium and equipment, a controller calculates target positions of m processing points on a processing piece according to a processing file, then drives a laser to emit initial laser to a light splitting device based on a light emitting signal, and then controls the light splitting device to load a light splitting signal; the light splitting device splits the initial laser into n beams of sub-laser and emits the n beams of sub-laser to the scanning galvanometer, the scanning galvanometer deflects the n beams of sub-laser, and the focusing mirror focuses the deflected sub-laser and emits the deflected sub-laser to a target position for processing. Compared with the prior art, the method has the advantages that multiple laser beams can be used for machining at the same time by combining the light splitting device, the jumping times of the scanning galvanometer are greatly reduced, the machining efficiency is multiplied, and therefore the problem that a traditional single-laser-beam machining method is low in efficiency is solved.

Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, and in particular to a variable multi-beam laser processing method, device, medium and equipment. Background Art

[0002] Nowadays, the package sizes of integrated circuits (IC), mini light-emitting diodes (MiniLED), and micro light-emitting diodes (MicroLED) are standardized, and all have the characteristics of high density and small pitch. Therefore, in the traditional processing method, when laser processing is performed on IC substrates, circuit boards mounted with MiniLED and MicroLED, or printed circuit boards (Printed Circuit Board, PCB), a beam of laser is incident on the scanning galvanometer each time, and then a beam of laser is emitted to the workpiece through the focusing lens. In this way, when processing multiple processing points, the controller needs to control the scanning galvanometer to jump to the next processing point after the previous processing point is processed. Therefore, the scanning galvanometer needs to jump frequently during processing, and the overall processing efficiency is relatively low. Summary of the invention

[0003] Based on this, it is necessary to provide variable multi-beam laser processing methods, devices, media and equipment to solve the problem of relatively low overall processing efficiency.

[0004] A variable multi-beam laser processing method is applied to a laser processing device, wherein the laser processing device includes a controller, a laser, a light splitting device, a scanning galvanometer and a focusing mirror, and the method includes:

[0005] The controller calculates target processing positions of m processing points on the workpiece according to the acquired processing file; wherein 1≤m;

[0006] The controller drives the laser to emit initial laser light to the light splitting device based on the light output signal;

[0007] The controller controls the light splitting device to load a light splitting signal, and the light splitting device splits the initial laser into n sub-lasers based on the light splitting signal and emits them to the scanning galvanometer; wherein 1≤n≤m, the light splitting signal is used to control the number n, deflection angle and energy of the sub-lasers;

[0008] The scanning galvanometer deflects the incident n sub-beams of laser light, and the focusing mirror focuses the deflected n sub-beams of laser light and then emits them to a target processing position for processing.

[0009] In one embodiment, the light splitting device includes a horizontal control end and a vertical control end, the light splitting signal includes a horizontal signal and a vertical signal, and the method further includes:

[0010] During the period of the light output signal, the controller adjusts the deflection angle of the sub-laser in the horizontal output direction by adjusting the horizontal frequency of the horizontal signal loaded on the horizontal control end, so that the current processing position of the sub-laser moves in the horizontal direction, and / or adjusts the deflection angle of the sub-laser in the vertical output direction by adjusting the vertical frequency of the vertical signal loaded on the vertical control end, so that the current processing position of the sub-laser moves in the vertical direction.

[0011] In one embodiment, the current processing position includes a current horizontal position and a current vertical position, and the adjusting the horizontal frequency of the horizontal signal loaded on the horizontal control terminal includes:

[0012] The controller obtains a current horizontal position and a corresponding current horizontal frequency of a target sub-laser at a current processing point, and obtains a candidate horizontal position of the target sub-laser at a next processing point; wherein the target sub-laser is any one of the n sub-lasers;

[0013] Taking the difference between the candidate horizontal position and the current horizontal position as a horizontal deviation displacement, and calculating a horizontal deviation frequency according to the horizontal deviation displacement; wherein the horizontal deviation displacement is positively correlated with the horizontal deviation frequency in a preset first direction;

[0014] Adjusting the target horizontal frequency of the horizontal signal corresponding to the target sub-laser according to the horizontal deviation frequency and the current horizontal frequency;

[0015] The step of adjusting the vertical frequency of the vertical signal loaded on the vertical control terminal includes:

[0016] The controller obtains a current vertical position of the target sub-laser at a current processing point and a corresponding current vertical frequency, and obtains a candidate vertical position of the target sub-laser at a next processing point;

[0017] Taking the difference between the candidate vertical position and the current vertical position as a vertical deviation displacement, and calculating a vertical deviation frequency according to the vertical deviation displacement; wherein the vertical deviation displacement is positively correlated with the vertical deviation frequency in a preset second direction;

[0018] The vertical signal corresponding to the target sub-laser is adjusted to a target vertical frequency according to the vertical deviation frequency and the current vertical frequency.

[0019] In one embodiment, the split light signal includes a plurality of unit signals, each unit signal is used to control the emission of a sub-laser, and the method further includes:

[0020] In the period of the outgoing light signal, the controller adjusts the signal quantity of the unit signal loaded on the light splitting device to adjust the size of n.

[0021] In one embodiment, the controller adjusts the number of unit signals loaded on the optical splitting device to adjust the size of n, including:

[0022] The controller obtains the current unprocessed quantity among the m processing points, and compares the unprocessed quantity with N; wherein N represents the upper limit of the number of sub-lasers emitted by the light splitting device;

[0023] If the unprocessed quantity is greater than or equal to N, the signal quantity of the unit signal in the split light signal is set to N;

[0024] If the unprocessed number is less than N, the signal number of the unit signal in the split light signal is set to the unprocessed number.

[0025] In one embodiment, the split light signal includes a plurality of unit signals, the signal width of each unit signal is proportional to the energy of the corresponding sub-laser, and the method further includes:

[0026] In the period of the light output signal, the controller adjusts the signal width of the unit signal loaded on the light splitting device to adjust the energy of the sub-laser.

[0027] In one embodiment, the controller adjusts the width of the unit signal loaded on the light splitting device to adjust the energy of the sub-laser, including:

[0028] The controller acquires the current energy of the target sub-laser, the target energy and the current signal width of the unit signal corresponding to the target sub-laser; wherein the target sub-laser is any one of the n sub-lasers;

[0029] The difference between the current energy and the target energy is used as the deviation energy, the deviation signal width is calculated according to the deviation energy, and the signal width of the unit signal corresponding to the target sub-laser is adjusted to the target signal width according to the deviation signal width and the current signal width.

[0030] A laser processing device, comprising:

[0031] A controller, used for calculating target processing positions of m processing points on a workpiece according to the acquired processing file; wherein 1≤m;

[0032] A laser, used for emitting an initial laser in response to a light output signal sent by the controller;

[0033] A light splitting device, used to load the light splitting signal sent by the controller, and to split the initial laser into n sub-lasers based on the light splitting signal and emit them; wherein 1≤n≤m, the light splitting signal is used to control the number n, deflection angle and energy of the sub-lasers;

[0034] A scanning galvanometer, used to deflect the incident n laser beams;

[0035] The focusing mirror is used to focus the deflected n laser beams and emit them to the target processing position for processing.

[0036] A computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the processor executes the steps of the variable multi-beam laser processing method.

[0037] A terminal device includes a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the steps of the above-mentioned variable multi-beam laser processing method.

[0038] The present invention provides a variable multi-beam laser processing method, device, medium and equipment. The controller first calculates the target positions of m processing points on the workpiece according to the processing file, and then drives the laser to emit the initial laser to the spectrometer based on the light output signal. Then the spectrometer is controlled to load the spectrometer signal. The spectrometer divides the initial laser into n sub-lasers and emits them to the scanning galvanometer. The scanning galvanometer deflects the n sub-lasers, and the focusing mirror focuses the deflected sub-lasers and emits them at the target position for processing. Compared with the prior art, this method can use multiple laser beams for processing at the same time by combining the spectrometer, greatly reducing the number of scanning galvanometer jumps, and multiplying the processing efficiency, thereby overcoming the low efficiency problem of the traditional single-beam laser processing method. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0040] in:

[0041] Figure 1 A schematic diagram of a process of a variable multi-beam laser processing method in one embodiment;

[0042] Figure 2 It is a structural schematic diagram of a laser processing device;

[0043] Figure 3 It is a schematic diagram of the horizontal control terminal and the vertical control terminal in the light splitting device;

[0044] Figure 4 is a schematic diagram of an optical output signal and a split optical signal;

[0045] Figure 5 For Figure 2 Schematic diagram of processing after changing the horizontal frequency and vertical frequency of the signal based on the above;

[0046] Figure 6 For Figure 5 A processing diagram after adjusting the signal quantity of the unit signal based on the above;

[0047] Figure 7 For Figure 5 The processing diagram when no unit signal is loaded on the basis of

[0048] Figure 8 This is a structural block diagram of the terminal equipment. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices.

[0051] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0052] like Figure 1 As shown, Figure 1 FIG. 1 is a flow chart of a variable multi-beam laser processing method in an embodiment. This embodiment is applied to Figure 2 In the laser processing device shown in FIG. 1 , the laser processing device includes a controller 100, a laser 200, a spectrometer 300, a scanning galvanometer 400 and a focusing mirror 500. Figure 2 The schematic diagram also marks the initial laser a, n sub-lasers b, the workpiece c, the target processing position d, and the adjustable area e. The steps provided by the variable multi-beam laser processing method in this embodiment include:

[0053] S101, the controller calculates target processing positions of m processing points on the workpiece according to the acquired processing file.

[0054] Among them, the controller is the core component responsible for overall coordination and control of the laser processing device, and can synchronously control the work of other components (such as lasers, spectrometers, scanning galvanometers and focusing mirrors). The processing file is a file containing various processing parameters, which may include the position information of each processing point on the workpiece, the position information of the reference point, and the size of the workpiece. The workpiece refers to the object or material processed by the laser processing device, which can specifically be an IC substrate, a circuit board and a PCB board mounted with MiniLED and MicroLED. The target processing position refers to the coordinates of the processing point on the workpiece, where 1≤m, for example, m=4 or m=8.

[0055] Optionally, assuming that the relative coordinates of each processing point relative to a reference point (such as the lower left corner of the workpiece) are provided in the processing file, the controller first determines the absolute coordinates of the reference point during processing, and then converts the relative position information of the processing point into absolute position information based on the absolute coordinates.

[0056] S102: The controller drives the laser to emit initial laser light to the light splitting device based on the light output signal.

[0057] The light output signal is a signal generated by the controller and is used to trigger the laser to emit initial laser light. The signal contains parameters such as the time, frequency, and power of the initial laser emission.

[0058] S103, the controller controls the spectrometer to load a spectrometer signal, and the spectrometer splits the initial laser into n sub-lasers based on the spectrometer signal and emits them to the scanning galvanometer.

[0059] The splitting signal is used to control the number n, deflection angle and energy of the sub-lasers. Under the control of the splitting signal, the splitting device can split the laser beam into two, four, eight or more sub-lasers with equal energy, consistent polarization state and uniform incident angle according to the processing needs. Figure 2Among them, n = 4. Excess laser beams can also be turned off at any time according to needs, that is, n = 1. Here, 1 ≤ n ≤ m can be set, so diverse processing requirements can be met. At the same time, since multiple sub-laser beams are used simultaneously, multiple processing points can be processed at the same time, thus improving the processing efficiency.

[0060] In addition, when the deflection angles of the n sub-laser beams change, the n sub-laser beams can move within an adjustable area. Since the n sub-laser beams jump together, the jump time can also be reduced, improving the processing efficiency.

[0061] Optionally, the beam splitting device can use an acousto-optic modulator (AOM: Acoustic optical modulator), or can also use an acousto-optic deflector (AOD: Acousto-optic deflectors).

[0062] S104, the scanning galvanometer deflects the incident n sub-laser beams, and the focusing lens focuses the deflected n sub-laser beams and emits them onto the target processing position for processing.

[0063] Among them, the scanning galvanometer receives the n sub-laser beams and adjusts the deflection angle of each laser beam according to the preset processing path and processing point information, so that the laser beam can accurately point to the target processing position. The deflected n sub-laser beams pass through the focusing lens, and the focusing lens vertically focuses each laser beam onto its respective target position. The energy of the focused laser beam is concentrated, making the processing process efficient and precise.

[0064] In the above embodiment, the controller first calculates the target positions of m processing points on the workpiece according to the processing file, then drives the laser to emit the initial laser to the beam splitting device based on the light output signal, and then controls the beam splitting device to load the beam splitting signal. The beam splitting device divides the initial laser into n sub-laser beams and emits them to the scanning galvanometer. The scanning galvanometer deflects the n sub-laser beams, and the focusing lens focuses the deflected sub-laser beams and emits them onto the target position for processing. Compared with the prior art, this method can process with multiple laser beams simultaneously by combining the beam splitting device, greatly reducing the number of jumps of the scanning galvanometer and doubling the processing efficiency, thus overcoming the low efficiency problem of the traditional single-laser processing method.

[0065] In a specific embodiment, the beam splitting device includes a horizontal control end and a vertical control end, the beam splitting signal includes a horizontal signal and a vertical signal. When n < m, the laser processing device cannot complete the processing of all processing points in one round of processing. At this time, the variable multi-beam laser processing method can also perform the following steps:

[0066] During the period of the light output signal, the controller adjusts the deflection angle of the sub-laser in the horizontal output direction by adjusting the horizontal frequency of the horizontal signal loaded on the horizontal control end, so that the current processing position of the sub-laser moves in the horizontal direction, and / or adjusts the deflection angle of the sub-laser in the vertical output direction by adjusting the vertical frequency of the vertical signal loaded on the vertical control end, so that the current processing position of the sub-laser moves in the vertical direction.

[0067] like Figure 3 As shown, the optical splitter includes horizontal control terminals A+, A- and vertical control terminals B+, B-. The signals loaded at both ends of the horizontal control terminals A+, A- are horizontal signals, and the signals loaded at both ends of the vertical control terminals B+, B- are vertical signals. Figure 4 As shown, signal L is the light output signal, signal A is the horizontal signal, and signal B is the vertical signal. In a cycle of the laser light output signal L, the high-frequency signal loaded at both ends of A+ and A- controls the deflection angle of the light beam in the horizontal output direction, so that the current processing position of the sub-laser moves in the horizontal direction, and the high-frequency signal loaded at both ends of B+ and B- controls the deflection angle of the light beam in the vertical output direction, so that the current processing position of the sub-laser moves in the vertical direction, thereby achieving the simultaneous deflection of the light beam in both the horizontal and vertical directions, as shown in FIG. Figure 5 As shown, Figure 5 For Figure 2 The processing schematic diagram after changing the horizontal frequency and vertical frequency of the signal based on the above is shown, at this time, the purpose of adjusting the position of the laser beam within a certain adjustable area is achieved.

[0068] Furthermore, the current processing position includes a current horizontal position and a current vertical position, and adjusting the horizontal frequency of the horizontal signal loaded on the horizontal control end specifically includes the following steps:

[0069] A1. The controller obtains the current horizontal position of the target sub-laser at the current processing point and the corresponding current horizontal frequency, and obtains the candidate horizontal position of the target sub-laser at the next processing point.

[0070] The target sub-laser is any one of the n sub-laser beams, that is, the position of all sub-laser beams can be adjusted based on the same principle. Figure 2 and Figure 5 As shown, we take the laser beam in the upper right corner as the target sub-laser. Then the current horizontal position is obtained as the center position of the adjustable area, and assuming that the current horizontal frequency is 40MHz, the candidate position is a point in the upper right corner of the adjustable area.

[0071] A2. The difference between the candidate horizontal position and the current horizontal position is used as the horizontal deviation displacement, and the horizontal deviation frequency is calculated according to the horizontal offset displacement.

[0072] First, calculate the horizontal deviation displacement, which is denoted as dx here. Then, calculate the horizontal deviation frequency. The horizontal deviation displacement is positively correlated with the horizontal deviation frequency in a preset first direction. Here, the first direction can be set as the right direction. Exemplarily, it can also be assumed that the relationship between the horizontal deviation displacement and the horizontal deviation frequency is linear, and the calculated horizontal deviation frequency is 10 MHz.

[0073] A3. Adjust the horizontal signal corresponding to the target sub-laser to the target horizontal frequency according to the horizontal deviation frequency and the current horizontal frequency.

[0074] By adding the current horizontal frequency (40 MHz) to the calculated horizontal deviation frequency (10 MHz), the target horizontal frequency (50 MHz) is obtained. Adjust the horizontal signal to 50 MHz so as to adjust the horizontal position of the target sub-laser to the candidate position.

[0075] Similarly, adjusting the vertical frequency of the vertical signal loaded on the vertical control end specifically includes the following steps:

[0076] A4. The controller obtains the current vertical position and the corresponding current vertical frequency of the target sub-laser at the current processing point, and obtains the candidate vertical position of the target sub-laser at the next processing point.

[0077] A5. Take the difference between the candidate vertical position and the current vertical position as the vertical deviation displacement, and calculate the vertical deviation frequency according to the vertical deviation displacement.

[0078] The vertical deviation displacement is positively correlated with the vertical deviation frequency in a preset second direction.

[0079] A6. Adjust the vertical signal corresponding to the target sub-laser to the target vertical frequency according to the vertical deviation frequency and the current vertical frequency.

[0080] It can be understood that the frequency adjustment principles of the above steps A4 - A6 and steps A1 - A3 are basically the same, and the only difference lies in the horizontal and vertical directions, so it will not be elaborated again.

[0081] Through the above steps, the controller can, within one light emission signal cycle of the laser, adjust the frequency of the horizontal signal according to the current horizontal position, current vertical position, and candidate position, so as to achieve precise adjustment of the horizontal position of the sub-laser.

[0082] In a specific embodiment, when n < m, the laser processing device cannot complete the processing of all processing points in one round of processing. At this time, the variable multi-beam laser processing method can also perform the following steps: within the cycle of the light emission signal, the controller adjusts the number of signal units loaded on the beam splitting device to adjust the value of n.

[0083] Such as Figure 4As shown, the split light signals A and B each include multiple unit signals, where the unit signal is a high-frequency signal, and each unit signal is used to control the emission of a sub-laser. Figure 6 As shown, Figure 6 For Figure 5 The processing diagram after adjusting the signal quantity of the unit signal based on . Figure 5 In , the number of signals per unit signal is 4. Figure 6 In the example, the number of unit signals is 2. Therefore, the number of emitted sub-lasers changes from 4 to 2. Furthermore, when no high-frequency signal is loaded in the horizontal and vertical directions, the light splitting device does not deflect in the horizontal and vertical directions. Figure 7 As shown, Figure 7 For Figure 5 The processing diagram when no unit signal is loaded on the basis of , at this time n = 1. At this time, the processing position of the laser beam is determined by the deflection angle of the scanning galvanometer.

[0084] Furthermore, the controller adjusts the signal quantity of the unit signal loaded on the optical splitting device to adjust the size of n, which specifically includes the following steps:

[0085] B1. The controller obtains the current unprocessed quantity among the m processing points and compares the unprocessed quantity with N. If the unprocessed quantity is greater than or equal to N, B2 is executed; if the unprocessed quantity is less than N, B3 is executed.

[0086] Wherein, N represents the upper limit of the number of sub-lasers emitted by the light splitting device. Figure 5 In the example, N=4.

[0087] B2. Set the signal number of unit signals in the split signal to N.

[0088] B3. Set the signal quantity of the unit signal in the spectral signal to the unprocessed quantity.

[0089] For example, when m=6, during the first round of processing, since the current unprocessed quantity is 6, the signal quantity of the unit signal during the first round of processing is set to 4. Then, during the second round of processing, since the current unprocessed quantity is 2, the signal quantity of the unit signal during the second round of processing is set to 2.

[0090] Through the above steps, the controller can adjust the value of n according to the signal quantity of the unit signal within a laser light output signal cycle, thereby realizing accurate adjustment of the number of sub-lasers.

[0091] In a specific embodiment, when n < m, the laser processing device cannot complete the processing of all processing points in one round of processing. At this time, the variable multi-beam laser processing method can also perform the following steps: within the period of the light output signal, the controller adjusts the signal width of the unit signal loaded on the beam splitting device to adjust the energy of the sub-laser. Among them, the beam splitting signal includes multiple unit signals, and the signal width of each unit signal is proportional to the energy of the corresponding sub-laser.

[0092] Further, the controller adjusts the width of the unit signal loaded on the beam splitting device to adjust the energy of the sub-laser, which specifically includes the following steps:

[0093] C1. The controller obtains the current energy, target energy of the target sub-laser, and the current signal width of the unit signal corresponding to the target sub-laser.

[0094] Among them, the target sub-laser is any one of the n sub-lasers, that is, the energy of all sub-laser beams can be adjusted based on the same principle. The current energy refers to the current energy level of the target sub-laser. The target energy is the desired energy level to which the target sub-laser needs to be adjusted. The current signal width is the current signal width of the unit signal that controls the energy of the sub-laser.

[0095] C2. Take the difference between the current energy and the target energy as the deviation energy, calculate the deviation signal width according to the deviation energy, and adjust the signal width of the unit signal corresponding to the target sub-laser to the target signal width according to the deviation signal width and the current signal width.

[0096] On the premise that the signal width is proportional to the energy, the deviation width can be calculated through the proportional relationship between the deviation energy and the signal width of the unit energy signal. Then add the current signal width and the deviation signal width to obtain the target signal width. The controller adjusts the signal width of the unit signal corresponding to the target sub-laser according to the calculated target signal width to achieve precise control of the energy.

[0097] Exemplarily, the energy of the current sub-laser is 50 units. The energy of the target sub-laser is 70 units. The current signal width is 30 microseconds. The signal width corresponding to each unit of energy is 0.5 microseconds.

[0098] Calculate the deviation energy: Target energy (70 units) - Current energy (50 units) = 20 units.

[0099] Calculate the deviation width: 20 units * 0.5 microseconds / unit = 10 microseconds.

[0100] Calculate the target signal width: Current signal width (30 microseconds) + Deviation width (10 microseconds) = 40 microseconds.

[0101] Through the above steps, the controller can adjust the signal width according to the current energy of the target sub-laser, the target energy and the current signal width within a laser light output signal cycle, thereby achieving precise adjustment of the sub-laser energy.

[0102] In a specific embodiment, Figure 2 As shown, the present invention also proposes a laser processing device, which includes:

[0103] The controller 100 is used to calculate the target processing positions of m processing points on the workpiece according to the acquired processing file; wherein 1≤m;

[0104] The laser 200 is used to emit an initial laser in response to the light output signal sent by the controller 100;

[0105] The light splitting device 300 is used to load the light splitting signal sent by the controller 100, and split the initial laser into n sub-lasers based on the light splitting signal and emit them; wherein 1≤n≤m, the light splitting signal is used to control the number n of lasers, the deflection angle and the energy of the sub-lasers;

[0106] A scanning galvanometer 400 is used to deflect the incident n laser beams;

[0107] The focusing mirror 500 is used to focus the deflected n sub-beams of laser light and emit them to the target processing position for processing.

[0108] In the above laser processing device, the controller first calculates the target positions of m processing points on the workpiece according to the processing file, then drives the laser to emit the initial laser to the spectrometer based on the light output signal, and then controls the spectrometer to load the spectrometer signal. The spectrometer divides the initial laser into n sub-lasers and emits them to the scanning galvanometer. The scanning galvanometer deflects the n sub-lasers, and the focusing mirror focuses the deflected sub-lasers and emits them at the target position for processing. Compared with the prior art, this method can use multiple laser beams for processing at the same time by combining the spectrometer, greatly reducing the number of scanning galvanometer jumps, and multiplying the processing efficiency, thereby overcoming the low efficiency problem of the traditional single-beam laser processing method.

[0109] Figure 8 FIG. 2 shows an internal structure diagram of a terminal device in an embodiment. Figure 8As shown, the terminal device includes a processor, a memory and a network interface connected via a system bus. The memory includes a non-volatile storage medium and an internal memory. The non-volatile storage medium of the terminal device stores an operating system and may also store a computer program. When the computer program is executed by the processor, the processor can implement a variable multi-beam laser processing method. The internal memory may also store a computer program. When the computer program is executed by the processor, the processor can implement a variable multi-beam laser processing method. Those skilled in the art can understand that Figure 8 The structure shown in the figure is only a block diagram of a partial structure related to the scheme of the present application, and does not constitute a limitation on the terminal device to which the scheme of the present application is applied. The specific terminal device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0110] A computer-readable storage medium stores a computer program, and the following steps are implemented when the computer program is executed by a processor: a controller calculates target processing positions of m processing points on a workpiece according to an acquired processing file; wherein 1≤m; the controller drives a laser to emit an initial laser to a spectrometer based on a light output signal; the controller controls the spectrometer to load a spectrometer signal, and the spectrometer divides the initial laser into n sub-lasers based on the spectrometer signal and emits them to a scanning galvanometer; wherein 1≤n≤m, and the spectrometer signal is used to control the laser quantity n, deflection angle and energy of the sub-lasers; the scanning galvanometer deflects the incident n sub-lasers, and a focusing mirror focuses the deflected n sub-lasers and emits them to a target processing position for processing.

[0111] A terminal device comprises a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the processor implements the following steps when executing the computer program: a controller calculates target processing positions of m processing points on a workpiece according to an acquired processing file; wherein 1≤m; the controller drives a laser to emit an initial laser to a spectrometer based on an output light signal; the controller controls the spectrometer to load a spectrometer signal, and the spectrometer divides the initial laser into n sub-lasers based on the spectrometer signal and emits them to a scanning galvanometer; wherein 1≤n≤m, and the spectrometer signal is used to control the laser quantity n, deflection angle and energy of the sub-lasers; the scanning galvanometer deflects the incident n sub-lasers, and the focusing mirror focuses the deflected n sub-lasers and emits them at the target processing position for processing.

[0112] It should be noted that the above-mentioned variable multi-beam laser processing method, device, equipment and computer-readable storage medium belong to a general inventive concept, and the contents in the embodiments of the variable multi-beam laser processing method, device, equipment and computer-readable storage medium are applicable to each other.

[0113] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a non-volatile computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0114] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0115] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A variable multi-beam laser processing method, characterized in that: Applied to a laser processing device, the laser processing device includes a controller, a laser, a spectrometer, a scanning galvanometer and a focusing mirror, and the method includes: The controller calculates target processing positions of m processing points on the workpiece according to the acquired processing file; wherein 1≤m; The controller drives the laser to emit initial laser light to the light splitting device based on the light output signal; The controller controls the light splitting device to load a light splitting signal, and the light splitting device splits the initial laser into n sub-lasers based on the light splitting signal and emits them to the scanning galvanometer; wherein 1≤n≤m, the light splitting signal is used to control the number n, deflection angle and energy of the sub-lasers; The scanning galvanometer deflects the incident n sub-beams of laser light, and the focusing mirror focuses the deflected n sub-beams of laser light and then emits them to a target processing position for processing.

2. The method according to claim 1, characterized in that The light splitting device includes a horizontal control end and a vertical control end, the light splitting signal includes a horizontal signal and a vertical signal, and the method further includes: During the period of the light output signal, the controller adjusts the deflection angle of the sub-laser in the horizontal output direction by adjusting the horizontal frequency of the horizontal signal loaded on the horizontal control end, so that the current processing position of the sub-laser moves in the horizontal direction, and / or adjusts the deflection angle of the sub-laser in the vertical output direction by adjusting the vertical frequency of the vertical signal loaded on the vertical control end, so that the current processing position of the sub-laser moves in the vertical direction.

3. The method according to claim 2, characterized in that The current processing position includes a current horizontal position and a current vertical position, and the adjusting the horizontal frequency of the horizontal signal loaded on the horizontal control end includes: The controller obtains a current horizontal position and a corresponding current horizontal frequency of a target sub-laser at a current processing point, and obtains a candidate horizontal position of the target sub-laser at a next processing point; wherein the target sub-laser is any one of the n sub-lasers; Taking the difference between the candidate horizontal position and the current horizontal position as a horizontal deviation displacement, and calculating a horizontal deviation frequency according to the horizontal deviation displacement; wherein the horizontal deviation displacement is positively correlated with the horizontal deviation frequency in a preset first direction; Adjusting the target horizontal frequency of the horizontal signal corresponding to the target sub-laser according to the horizontal deviation frequency and the current horizontal frequency; The step of adjusting the vertical frequency of the vertical signal loaded on the vertical control terminal includes: The controller obtains a current vertical position of the target sub-laser at a current processing point and a corresponding current vertical frequency, and obtains a candidate vertical position of the target sub-laser at a next processing point; Taking the difference between the candidate vertical position and the current vertical position as a vertical deviation displacement, and calculating a vertical deviation frequency according to the vertical deviation displacement; wherein the vertical deviation displacement is positively correlated with the vertical deviation frequency in a preset second direction; The vertical signal corresponding to the target sub-laser is adjusted to a target vertical frequency according to the vertical deviation frequency and the current vertical frequency.

4. The method according to claim 1, characterized in that: The split light signal includes a plurality of unit signals, each unit signal is used to control the emission of a sub-laser, and the method further includes: In the period of the outgoing light signal, the controller adjusts the signal quantity of the unit signal loaded on the light splitting device to adjust the size of n.

5. The method according to claim 4, characterized in that The controller adjusts the signal quantity of the unit signal loaded on the optical splitting device to adjust the size of n, including: The controller obtains the current unprocessed quantity among the m processing points, and compares the unprocessed quantity with N; wherein N represents the upper limit of the number of sub-lasers emitted by the light splitting device; If the unprocessed quantity is greater than or equal to N, the signal quantity of the unit signal in the split light signal is set to N; If the unprocessed number is less than N, the signal number of the unit signal in the split light signal is set to the unprocessed number.

6. The method according to claim 1, characterized in that The split light signal includes a plurality of unit signals, and the signal width of each unit signal is proportional to the energy of the corresponding sub-laser. The method further includes: In the period of the light output signal, the controller adjusts the signal width of the unit signal loaded on the light splitting device to adjust the energy of the sub-laser.

7. The method according to claim 6, characterized in that The controller adjusts the width of the unit signal loaded on the light splitting device to adjust the energy of the sub-laser, including: The controller acquires the current energy of the target sub-laser, the target energy and the current signal width of the unit signal corresponding to the target sub-laser; wherein the target sub-laser is any one of the n sub-lasers; The difference between the current energy and the target energy is used as the deviation energy, the deviation signal width is calculated according to the deviation energy, and the signal width of the unit signal corresponding to the target sub-laser is adjusted to the target signal width according to the deviation signal width and the current signal width.

8. A laser processing device, characterized in that: The laser processing device comprises: A controller, used for calculating target processing positions of m processing points on a workpiece according to the acquired processing file; wherein 1≤m; A laser, used for emitting an initial laser in response to a light output signal sent by the controller; A light splitting device, used to load the light splitting signal sent by the controller, and to split the initial laser into n sub-lasers based on the light splitting signal and emit them; wherein 1≤n≤m, the light splitting signal is used to control the number n, deflection angle and energy of the sub-lasers; A scanning galvanometer, used to deflect the incident n laser beams; The focusing mirror is used to focus the deflected n laser beams and emit them to the target processing position for processing.

9. A computer-readable storage medium, characterized in that: A computer program is stored, and when the computer program is executed by a processor, the processor is caused to perform the steps of the method according to any one of claims 1 to 7.

10. A terminal device, characterized in that: The method comprises a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the steps of the method according to any one of claims 1 to 7.

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