Laser drilling control method, system and device, equipment and storage medium

Abstract

The embodiment of the invention discloses a laser drilling control method, system and device, equipment and a storage medium, and the control method comprises the steps that in the process that a workbench is fed to a laser machining area, the current moving position of the workbench is obtained, and the current moving position is used for reflecting the current position of a to-be-machined workpiece; when the current moving position is located in the inlet area of the laser machining area, a deflection instruction used for indicating the scanning galvanometer to deflect towards the direction where the laser machining area is located is sent to the scanning galvanometer; acquiring a current deflection angle of the scanning galvanometer; and when the current deflection angle is located at a preset angle threshold value, an opening instruction is sent to a laser generator, and the opening instruction is used for indicating the laser generator to generate laser beams so that laser drilling can be conducted on the to-be-machined workpiece in the feeding process of the workbench. By means of the mode, laser drilling can be conducted on the workpiece to be machined in the feeding process of the workbench, continuous drilling machining is achieved, the workbench does not need to stop waiting, and the machining efficiency is greatly improved.

Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, and in particular to a control method, system and device, equipment and storage medium for laser drilling. Background Art

[0002] In recent years, with the continuous expansion of HDI (High Density Interconnector) circuit boards and substrate applications, PCB manufacturing technology has rapidly moved towards high precision and high density, and the number of holes in the workpiece has increased significantly. In order to improve processing efficiency, a flying drilling solution for CO2 pulsed laser drilling, which is different from the traditional processing method, has emerged. This processing solution can greatly improve the drilling efficiency.

[0003] Among them, the principle of laser drilling is: a processing light source is generated by a laser generator, which is transmitted to a scanning galvanometer (hereinafter referred to as an electric mirror, Galvano) through a reflector, and then a light beam perpendicular to the workbench is formed through a scanning lens (hereinafter referred to as Fθ scanning mirror), and finally a hole is formed on the workpiece. In this principle, because the processing area of ​​the electric mirror (Galvano) is limited, please refer to Figure 1 (a), Figure 1 (a) is a schematic diagram of the maximum processing area of ​​a scanning galvanometer. Taking Figure 1 (a) as an example, the maximum processing area of ​​the scanning galvanometer shown in Figure 1 (a) is 90mm, and the size of the workpiece to be processed by the end customer is often much larger than the size of the maximum processing area, so it is necessary to divide the coordinate file of the workpiece to be processed, divide the area to complete the overall processing, and move to each position through the platform to achieve the purpose of regional processing (please refer to Figure 1 (b), Figure 1 (b) is a schematic diagram of the partition processing of the workpiece to be processed), and finally complete the drilling of the entire plate surface of the workpiece to be processed.

[0004] The traditional area processing method is: Based on the above laser drilling working principle, the traditional workbench travel method is: first move the segmented area into the working range of the Fθ scanning mirror, and then move to the specified position. At this time, the workbench will stop moving and wait for the laser to act on the workpiece (see Figure 2 , Figure 2 Schematic diagram of a conventional area processing in an embodiment of the present invention), after the area is processed, it moves to the next area, and the whole plate is processed repeatedly. Since the workbench needs to stop and wait for the processing to be completed, the current laser processing efficiency is low. Summary of the invention

[0005] The main purpose of the present invention is to provide a control method, system, device, equipment and storage medium for laser drilling, which can solve the problem in the prior art that the workbench needs to stop and wait for the processing to be completed, resulting in low processing efficiency.

[0006] To achieve the above-mentioned object, the first aspect of the present invention provides a control method for laser drilling, the control method is applied to a control system for laser drilling, the control system comprises a laser generator, a scanning galvanometer and a workbench, the workbench is used to load a workpiece to be processed, the laser beam emitted by the laser generator is emitted to a laser processing area through the scanning galvanometer, the laser processing area is used to perform laser drilling on the workpiece to be processed, the control method comprises:

[0007] During the feeding process of the workbench to the laser processing area, obtaining the current moving position of the workbench, wherein the current moving position is used to reflect the current position of the workpiece to be processed;

[0008] When the current moving position is in the entrance area of ​​the laser processing area, a deflection instruction is sent to the scanning galvanometer, wherein the deflection instruction is used to instruct the scanning galvanometer to deflect toward the direction where the laser processing area is located;

[0009] Obtaining the current deflection angle of the scanning galvanometer;

[0010] When the current deflection angle is within a preset angle threshold, an on instruction is sent to the laser generator, wherein the on instruction is used to instruct the laser generator to generate a laser beam so as to perform laser drilling on the workpiece to be processed during the feeding process of the worktable.

[0011] In a feasible implementation, the laser processing area is divided into at least a left processing area, a middle processing area and a right processing area, and the sending of a deflection instruction to the scanning galvanometer includes:

[0012] If the entrance area is the entrance of the left processing area, a left deflection instruction is sent to the scanning galvanometer, wherein the deflection instruction at least includes the left deflection instruction, and the left deflection instruction is used to instruct the scanning galvanometer to deflect to the left processing area;

[0013] If the entrance area is the entrance of the intermediate processing area, an intermediate deflection instruction is sent to the scanning galvanometer, wherein the deflection instruction at least includes the intermediate deflection instruction, and the intermediate deflection instruction is used to instruct the scanning galvanometer to deflect to the intermediate processing area;

[0014] If the entrance area is the entrance of the right processing area, a right deflection instruction is sent to the scanning galvanometer, and the deflection instruction at least includes the right deflection instruction, and the right deflection instruction is used to instruct the scanning galvanometer to deflect to the right processing area.

[0015] In a feasible implementation, during the feeding process of the workbench to the laser processing area, before obtaining the current moving position of the workbench, the method further includes:

[0016] When receiving the processing instruction of the workpiece to be processed, a feeding instruction is sent to the workbench, wherein the feeding instruction is used to instruct the workbench to feed toward the laser processing area so that the workpiece to be processed moves to the laser processing area.

[0017] In a feasible implementation, the method further includes:

[0018] Obtaining the size of the workpiece to be processed;

[0019] The workpiece to be processed is partitioned according to the size and the maximum processing area of ​​the scanning galvanometer to determine a partition result, and the partition result at least includes the number of areas.

[0020] In a feasible implementation, the sending of the deflection instruction to the scanning galvanometer also includes:

[0021] Obtaining the recorded number of entrances to the laser processing area that the workbench passes through;

[0022] When the number of the entrances is greater than the number of the areas, the step of obtaining the current moving position of the workbench is returned to execute until the current moving position is at the feeding end position, and then a stop feeding instruction is sent to the workbench.

[0023] To achieve the above-mentioned purpose, the second aspect of the present invention provides a control system for laser drilling, the control system comprising a central control unit, a laser generator, a scanning galvanometer and a workbench, the central control unit having communication connections with the laser generator, the scanning galvanometer and the workbench respectively, the workbench being used to load the workpiece to be processed, the laser beam emitted by the laser generator being directed to the laser processing area through the scanning galvanometer, the laser processing area being used to perform laser drilling on the workpiece to be processed, and the central control unit being used to execute the steps shown in the first aspect and any feasible implementation method.

[0024] In a feasible implementation, the control system further includes a scanning lens, and the laser beam passing through the scanning galvanometer is vertically emitted toward the laser processing area through the scanning lens.

[0025] To achieve the above-mentioned purpose, the third aspect of the present invention provides a control device for laser drilling, the control device is applied to a control system for laser drilling, the control system comprises a laser generator, a scanning galvanometer and a workbench, the workbench is used to load a workpiece to be processed, the laser beam emitted by the laser generator is directed to a laser processing area through the scanning galvanometer, the laser processing area is used to perform laser drilling on the workpiece to be processed, and the control device comprises:

[0026] Position acquisition module: used for acquiring the current moving position of the workbench during the feeding process of the workbench to the laser processing area, wherein the current moving position is used for reflecting the current position of the workpiece to be processed;

[0027] A deflection control module: used for sending a deflection instruction to the scanning galvanometer when the current moving position is in the entrance area of ​​the laser processing area, wherein the deflection instruction is used for instructing the scanning galvanometer to deflect in the direction of the laser processing area;

[0028] Angle acquisition module: used to obtain the current deflection angle of the scanning galvanometer;

[0029] Laser processing module: used for sending an on instruction to the laser generator when the current deflection angle is at a preset angle threshold, wherein the on instruction is used to instruct the laser generator to generate a laser beam so as to perform laser drilling on the workpiece to be processed during the feeding process of the worktable.

[0030] To achieve the above-mentioned purpose, the fourth aspect of the present invention provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, the processor executes the steps shown in the first aspect and any feasible implementation method.

[0031] To achieve the above-mentioned purpose, the fourth aspect of the present invention provides a computer device, including a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor executes the steps shown in the first aspect and any feasible implementation method.

[0032] The embodiments of the present invention have the following beneficial effects:

[0033] The present invention provides a control method for laser drilling, which is applied to a control system for laser drilling. The control system includes a laser generator, a scanning galvanometer and a workbench. The workbench is used to load a workpiece to be processed. The laser beam emitted by the laser generator is directed to a laser processing area through the scanning galvanometer. The laser processing area is used to perform laser drilling on the workpiece to be processed. The control method includes: in the process of feeding the workbench to the laser processing area, the current moving position of the workbench is obtained, and the current moving position is used to reflect the current position of the workpiece to be processed; when the current moving position is in the entrance area of ​​the laser processing area, a deflection instruction is sent to the scanning galvanometer, and the deflection instruction is used to instruct the scanning galvanometer to deflect in the direction of the laser processing area; the current deflection angle of the scanning galvanometer is obtained; when the current deflection angle is at a preset angle threshold, a start instruction is sent to the laser generator, and the start instruction is used to instruct the laser generator to generate a laser beam, so as to perform laser drilling on the workpiece to be processed during the feeding process of the workbench. Through the above method, laser drilling can be performed on the workpiece to be processed during the feeding process of the workbench, and uninterrupted drilling processing can be achieved without the need for the workbench to stop and wait, thereby greatly improving the processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] in:

[0036] FIG. 1( a ) is a schematic diagram of the maximum processing area of ​​a scanning galvanometer;

[0037] FIG1( b ) is a schematic diagram of partition processing of a workpiece to be processed;

[0038] Figure 2 A schematic diagram of a conventional area processing in an embodiment of the present invention;

[0039] Figure 3 It is a structural block diagram of a control system for laser drilling in an embodiment of the present invention;

[0040] Figure 4 This is a flow chart of a laser drilling control method according to an embodiment of the present invention;

[0041] Figure 5 A schematic diagram of a region processing of a laser drilling control method according to an embodiment of the present invention;

[0042] Figure 6 This is a structural block diagram of a laser drilling control device according to an embodiment of the present invention;

[0043] Figure 7 4 is a structural block diagram of a computer device in an embodiment of the present invention. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] See also Figure 3 , Figure 3 FIG. 1 is a structural block diagram of a laser drilling control system in an embodiment of the present invention. Figure 3 The laser drilling control system 00 shown includes a central control unit 10, a laser generator 20, a scanning galvanometer 30 and a workbench 40, wherein the laser drilling can be a flying drilling solution applied to CO2 pulse laser drilling, the scanning galvanometer can be an electric mirror (Galvano), and the laser generator can be a Unicom laser, wherein the central control unit 10 is respectively connected to the laser generator 20, the scanning galvanometer 30 and the workbench 40, and the workbench 40 is used to load the workpiece to be processed, and the workpiece to be processed can be fixedly installed on the workbench, and the workpiece to be processed can be a panel product such as PCB, core board, photovoltaic panel, etc., which is carried to the laser by the workbench The optical processing area performs laser drilling processing; the laser beam emitted by the laser generator 20 is directed to the laser processing area through the scanning galvanometer 30, and the laser processing area is used to perform laser drilling on the workpiece to be processed, wherein the central control unit 10 is used to execute the control method of laser drilling shown in the present application, and the central control unit acts as the master control, and respectively exchanges data with the laser generator, the scanning galvanometer and the workbench, and performs real-time monitoring of the status of the laser generator, the scanning galvanometer and the workbench. The above-mentioned laser generator, the scanning galvanometer and the workbench can report their own status data to the central control unit, and the reporting method can be active reporting, or reporting when the central controller requests, which is not limited here.

[0046] Exemplarily, the control system may also include a terminal that provides a human-computer interaction medium, such as a PC segment, and a feasible interaction process may be that after receiving the human-computer interaction signal on the PC side, the central control unit uniformly and simultaneously sends a control signal to the three parties described later (laser generator, electron microscope, and workbench). This method can ensure the timeliness and uniformity of the electrical signal, and can receive the real-time motion state feedback from the three parties, achieve the effect of closed-loop control, and realize the precise linkage control of the three parties. Among them, the closed-loop control includes but is not limited to Galvano monitoring and feedback of its own swing angle, whether it is within the controllable deviation range of the theoretical angle; the workbench monitors and feedbacks its own moving coordinates, whether it is within the controllable deviation range of the theoretical coordinates.

[0047] The main control principle is as follows: first, the PC sends a processing instruction to the central control unit, and then the central control unit will send a moving command to the workbench to move it to the target position (which can be the location of the laser processing area). When the workbench enters 2-3um before the coordinate of the target position (the moving coordinates of the workbench are fed back in real time here), the central control unit immediately sends a command to Galvano and the laser. The movement of the laser relative to Galvano will be postponed by 100us (equivalent to turning on the laser after the electron microscope is deflected to the corresponding direction) to ensure that the laser accurately falls on the target position of the platform.

[0048] Furthermore, the control system 00 may further include a scanning lens, wherein the scanning lens may be an Fθ scanning mirror, wherein the laser beam passing through the scanning galvanometer 30 is vertically directed toward the laser processing area through the scanning lens. A control method for laser drilling in an embodiment of the present invention is described below.

[0049] See also Figure 4 , Figure 4 FIG. 1 is a flow chart of a control method for laser drilling in an embodiment of the present invention. Figure 4 The control method is applied to the control system of laser drilling as shown in FIG1 , and the control method comprises the following steps:

[0050] 401. During the feeding process of the workbench to the laser processing area, a current moving position of the workbench is obtained, where the current moving position is used to reflect the current position of the workpiece to be processed;

[0051] It can be understood that in order to perform laser drilling on the workpiece to be processed, the workpiece to be processed needs to be fixed on a workbench, and the workbench carries the workpiece to be processed to the laser processing area, so that the workpiece to be processed comes to the laser processing area for processing. Among them, in order to realize laser drilling without stopping and waiting, it is necessary to obtain the current moving position of the workbench during the feeding process of the workbench to the laser processing area. Since the workpiece is fixed on the workbench, the current moving position can be used to reflect the current position of the workpiece to be processed, and then the current moving position can be used to determine whether the workpiece to be processed enters the laser processing area, so as to timely perform laser drilling on the workpiece to be processed during the feeding process.

[0052] In a feasible implementation, the central control unit can also have a communication connection with a preset terminal, which can specifically be a desktop terminal or a mobile terminal. The mobile terminal can specifically be at least one of a mobile phone, a tablet computer, a laptop computer, etc. The terminal can exchange data with the central control unit, and the user sends instructions or data to the central control unit through some processing interaction operations performed on the terminal. For example, the user sends processing instructions for the workpiece to be processed to the central control unit on the terminal, or inputs the feed data of the workbench such as feed speed and feed direction, workpiece information of the workpiece to be processed such as size specifications, design information of the pattern to be processed such as hole type and aperture, etc. on the terminal. Then, the central control unit can request the above data information from the terminal to better synchronize the control of each device in the above control system during the workbench feeding process.

[0053] Exemplarily, before step 401, the method further includes: upon receiving a processing instruction for the workpiece to be processed, sending a feed instruction to the workbench, wherein the feed instruction is used to instruct the workbench to feed toward the laser processing area so as to move the workpiece to be processed to the laser processing area.

[0054] The processing instruction may be issued by the user through the above-mentioned terminal, and the processing instruction may carry the feed direction, feed speed, size specifications of the workpiece to be processed, design information of the pattern to be processed, etc., which are not limited here.

[0055] 402. When the current moving position is in the entrance area of ​​the laser processing area, a deflection instruction is sent to the scanning galvanometer, wherein the deflection instruction is used to instruct the scanning galvanometer to deflect toward the direction where the laser processing area is located;

[0056] It should be noted that, the current moving position of the worktable can be used to determine whether the workpiece to be processed enters the laser processing area. Specifically, it can be determined whether the current moving position is in the entrance area of ​​the laser processing area, such as determining whether the current moving position is in the coordinate range corresponding to the entrance area of ​​the laser processing area. If the current moving position is in the coordinate range, it is considered that the current moving position is in the entrance area of ​​the laser processing area. Otherwise, it is considered that it is not in the entrance area of ​​the laser processing area, wherein the coordinate range can be a position coordinate corresponding to the boundary position of the entrance area, or it can be a coordinate area within a preset distance threshold before the boundary position. For example, the preset distance threshold can be 2-3um, and the coordinate range corresponding to the entrance area can be a coordinate area within the range of 2-3um before the boundary position.

[0057] Furthermore, when the current moving position is in the entrance area of ​​the laser processing area, a deflection instruction is sent to the scanning galvanometer, instructing the scanning galvanometer to deflect in the direction of the laser processing area, so as to project the laser beam into the laser processing area, and deflect the laser beam onto the workpiece to be processed entering the laser processing area, thereby realizing drilling processing.

[0058] Furthermore, the scanning galvanometer can deflect left and right, so the laser processing area is divided into at least a left processing area, a middle processing area, a right processing area and other sub-processing areas, each of which has an entrance area, so the laser processing area includes at least three entrance areas. The current position entering different entrance areas will cause the scanning galvanometer to produce different deflections. Specifically, sending a deflection instruction to the scanning galvanometer includes the following steps A01 to A03:

[0059] A01. If the entrance area is the entrance of the left processing area, a left deflection instruction is sent to the scanning galvanometer, wherein the deflection instruction at least includes the left deflection instruction, and the left deflection instruction is used to instruct the scanning galvanometer to deflect to the left processing area;

[0060] A02. If the entrance area is the entrance of the intermediate processing area, an intermediate deflection instruction is sent to the scanning galvanometer, wherein the deflection instruction at least includes the intermediate deflection instruction, and the intermediate deflection instruction is used to instruct the scanning galvanometer to deflect to the intermediate processing area;

[0061] A03. If the entrance area is the entrance of the right processing area, a right deflection instruction is sent to the scanning galvanometer, wherein the deflection instruction at least includes the right deflection instruction, and the right deflection instruction is used to instruct the scanning galvanometer to deflect to the right processing area.

[0062] Through steps A01 to A03, when the workpiece to be processed enters different sub-processing areas of the laser processing area, it can be identified, and then the scanning galvanometer is controlled to deflect in the direction of the sub-processing area, so as to achieve drilling in different position areas of the workpiece to be processed during the feeding process.

[0063] It should be noted that, due to the limited processing range of the scanning galvanometer, if the workpiece to be processed is larger than the maximum processing range of the scanning galvanometer, the workpiece to be processed must be partitioned, and each area of ​​the workpiece to be processed must be processed in turn to complete the processing of the entire piece. Among them, the scanning galvanometer has the ability to deflect in the left and right directions, and the laser processing area can be divided into at least a left processing area, a middle processing area, and a right processing area. Sub-processing areas; when the scanning galvanometer deflects to the left, the laser beam falls on the left processing area; when the scanning galvanometer deflects to the middle, the laser beam falls on the middle processing area; when the scanning galvanometer deflects to the right, the laser beam falls on the right processing area; and during the deflection process, the worktable is still feeding, so that each area of ​​the workpiece to be processed can be processed in turn to complete the processing of the entire piece.

[0064] To make the changes in the improved processing clearer, the following Figure 2 and Figure 5 For a comparison, please continue to see Figure 2 , Figure 2 is a schematic diagram of a traditional area processing in an embodiment of the present invention, Figure 2 In the figure, the workpiece to be processed stops in the laser processing area waiting for processing. Therefore, during laser processing, first, the electronic mirror (Galvano) is controlled to rotate to illuminate the left side of the scanning lens FθLens (left processing area), and then the left side of the workpiece to be processed is processed; then the electronic mirror (Galvano) is controlled to rotate to illuminate the middle area of ​​the scanning lens FθLens (middle processing area), and then the middle area of ​​the workpiece to be processed is processed; finally, the electronic mirror is controlled to rotate to illuminate the right side of FθLens (right processing area), and then the right side of the workpiece to be processed is processed.

[0065] For further information, see Figure 5 , Figure 5 is a schematic diagram of regional processing of a laser drilling control method in an embodiment of the present invention, Figure 5 The figure shows the boundary points C1 to C3 of the three sub-processing areas and the reference point X1 of the current position of the workpiece to be processed. Among them, C1 is the boundary point of the entrance area of ​​the left processing area of ​​the laser processing area, C2 is the boundary point of the entrance area of ​​the middle processing area of ​​the laser processing area, and C3 is the boundary point of the entrance area of ​​the right processing area of ​​the laser processing area. Figure 5It can be seen that the workpiece to be processed enters the laser processing area from left to right, and as the workpiece to be processed is fed, laser processing is performed without stopping during the feeding process: first, the right area X1 of the workpiece to be processed enters the left side C1 of the laser processing area, and at this time the scanning galvanometer rotates to illuminate the left side of the scanning lens FθLens (i.e., the left processing area), and then the right area of ​​the workpiece to be processed is processed; then, the workpiece to be processed X1 will enter the middle C2 of the laser processing area, and at this time the scanning galvanometer rotates to illuminate the middle area of ​​the scanning lens FθLens (i.e., the middle processing area), and then the middle area of ​​the workpiece to be processed is processed; finally, the workpiece to be processed X1 will enter the right side C3 of the laser processing area, and at this time the electronic microscope scanning galvanometer is controlled to rotate to illuminate the right side of the scanning lens FθLens (i.e., the right processing area), and then the left side of the workpiece to be processed is processed, wherein the speed of the linear moving worktable can be 10-50m / min.

[0066] In simple terms, the processing technology shown in this application is: the laser acts on the workpiece synchronously while the worktable moves continuously and uninterruptedly, greatly reducing the platform stop waiting time. The single-area processing method is that the left half of the FθLens first processes the right half of the divided area, and then as the worktable moves, the right half of the FθLens processes the left half of the divided area.

[0067] It should be noted that the maximum moving speed of the workbench can be 60m / min (1um / us), while the propagation speed of the laser in the air is 3*108m / s. The laser speed is much greater than the maximum moving speed of the workbench, and is infinitely close to a relatively static state. The maximum time that the laser acts on the workpiece is 15us, which is equivalent to the workpiece moving at most 15um at this time. In order to ensure the true roundness of the processed hole, after testing, when the workpiece moves less than 30um during the action of the laser, the true roundness can be guaranteed to be more than 90% acceptable, that is, when the platform movement speed is less than 120m / min, the solution has little effect on the processing quality. Therefore, the punching processing of each area can be effectively completed during the feeding process. The above-mentioned linear moving workbench method replaces the traditional inching movement, and the overall processing of the workpiece is completed during the linear feeding process, which effectively improves the processing efficiency.

[0068] In a feasible implementation, the method also includes partitioning the workpiece to be processed, which may be specifically performed before obtaining the current moving position of the worktable: obtaining the size of the workpiece to be processed; partitioning the workpiece to be processed according to the size and the maximum processing area of ​​the scanning galvanometer, and determining the partitioning result, which includes at least the number of areas.

[0069] Among them, in order to determine how many areas to be processed there are in the workpiece to be processed, the size of the workpiece to be processed can be obtained; the workpiece to be processed is partitioned according to the size and the maximum processing area of ​​the scanning galvanometer, and the partitioning result is determined, and the partitioning result includes at least the number of areas, which is the total number of areas to be processed of the workpiece to be processed.

[0070] In a feasible implementation, it is possible to determine whether the workpiece has been processed by the number of regions. If the processing is completed, the scanning galvanometer does not need to be deflected. That is, before sending a deflection instruction to the scanning galvanometer, it is also possible to determine whether the workpiece has been processed. Specifically, steps B01 and B02 are included:

[0071] B01, obtaining the recorded number of entrances to the laser processing area through which the workbench passes;

[0072] It should be noted that each time the workpiece passes through the entrance of each sub-processing area of ​​the laser processing area, a record is made to know the number of entrances that have been passed, so as to determine whether the scanning galvanometer deflection is required.

[0073] B02. When the number of the entrances is greater than the number of the areas, the process returns to the step of obtaining the current moving position of the workbench until the current moving position is at the feeding end position, and then a stop feeding instruction is sent to the workbench.

[0074] When the number of entrances is obtained, the number of entrances and the number of areas of the workpiece to be processed can be used to determine whether the scanning galvanometer needs to continue to deflect with the workpiece to be processed. The sign that the overall processing of the workpiece to be processed is completed should be that the number of entrances is equal to the number of areas. Therefore, if the number of entrances is greater than the number of areas, it means that the overall processing of the workpiece has been completed. Although the workpiece to be processed is about to enter a new sub-processing area, there is no need to punch holes in the workpiece to be processed. At this time, there is no need to send a deflection command to the scanning galvanometer, but return to execute the step of obtaining the current moving position of the worktable until the current moving position is at the feed end position, and then send a stop feed command to the worktable.

[0075] 403. Obtain a current deflection angle of the scanning galvanometer;

[0076] 404. When the current deflection angle is within a preset angle threshold, an on instruction is sent to the laser generator, wherein the on instruction is used to instruct the laser generator to generate a laser beam so as to perform laser drilling on the workpiece to be processed during the feeding process of the worktable.

[0077] Furthermore, the scanning galvanometer will also report its own deflection angle to the central control unit, and then the central control unit can obtain the current deflection angle of the scanning galvanometer, and determine whether it is deflected to the corresponding sub-processing area by monitoring the deflection angle, so as to control the timing of the laser generator to emit the laser beam and reduce the processing error. Specifically, when the current deflection angle is at the preset angle threshold, a start instruction is sent to the laser generator, and the start instruction is used to instruct the laser generator to generate a laser beam to perform laser drilling on the workpiece to be processed during the feeding process of the workbench. Among them, the preset angle threshold varies with different sub-processing areas. For example, if the deflection instruction is to deflect to the left, the preset angle threshold is the ideal deflection angle of the scanning galvanometer corresponding to the left processing area when the laser beam falls; for example, if the deflection instruction is to deflect to the middle, the preset angle threshold is the ideal deflection angle of the scanning galvanometer corresponding to the middle processing area when the laser beam falls; for example, if the deflection instruction is to deflect to the right, the preset angle threshold is the ideal deflection angle of the scanning galvanometer corresponding to the right processing area when the laser beam falls. Then, by comparing the current deflection angle with the preset angle threshold, the start timing of the laser generator is controlled. Among them, an angle threshold list can be pre-set, which includes the correspondence between deflection instructions in different directions and the ideal deflection angle of the scanning galvanometer, and then when deflection is required, the corresponding preset angle threshold is obtained through the correspondence in the list.

[0078] Furthermore, the workpiece can be partitioned by importing the CNC file program corresponding to the graphic style of the workpiece to be processed, and the workpiece can be partitioned and the target hole position can be located. Then, during laser drilling, the target hole position of the workpiece can be visually identified and the specific processing position of the workpiece to be processed can be located for drilling. This will not be elaborated here.

[0079] It should be noted that in order to further improve efficiency, the Galvano electron microscope also pioneered the use of an uninterrupted micro-rotation motion mode, in which the signal for the laser to emit the laser is provided by the Galvano. In the process of Galvano transmitting the signal to the laser, due to the delay effect of the electrical signal, on a traditional laser machine, the two motors on the Galvano will stop and wait for a short time after reaching the target position. At this time, their speed is 0, and they need to re-accelerate when moving to the next target. This process wastes efficiency.

[0080] The principle of the non-stop micro-rotation motion is that after reaching the target position, the Galvano motor repeatedly swings in a very small arc, so that the Galvano is always in a state where the initial velocity is not 0 during the movement of the front and rear target positions. It has been verified that the arc converted into a horizontal distance unit of about 2um is within the allowable error range.

[0081] The present invention provides a control method for laser drilling, which is applied to a control system for laser drilling. The control system includes a laser generator, a scanning galvanometer and a workbench. The workbench is used to load a workpiece to be processed. The laser beam emitted by the laser generator is directed to a laser processing area through the scanning galvanometer. The laser processing area is used to perform laser drilling on the workpiece to be processed. The control method includes: in the process of feeding the workbench to the laser processing area, the current moving position of the workbench is obtained, and the current moving position is used to reflect the current position of the workpiece to be processed; when the current moving position is in the entrance area of ​​the laser processing area, a deflection instruction is sent to the scanning galvanometer, and the deflection instruction is used to instruct the scanning galvanometer to deflect in the direction of the laser processing area; the current deflection angle of the scanning galvanometer is obtained; when the current deflection angle is at a preset angle threshold, a start instruction is sent to the laser generator, and the start instruction is used to instruct the laser generator to generate a laser beam, so as to perform laser drilling on the workpiece to be processed during the feeding process of the workbench. Through the above method, laser drilling can be performed on the workpiece to be processed during the feeding process of the workbench, and uninterrupted drilling processing can be achieved without the need for the workbench to stop and wait, thereby greatly improving the processing efficiency.

[0082] See also Figure 6 , Figure 6 FIG. 1 is a structural block diagram of a laser drilling control device according to an embodiment of the present invention. Figure 6 The control device shown is applied to a control system of laser drilling, the control system includes a laser generator, a scanning galvanometer and a workbench, the workbench is used to load the workpiece to be processed, the laser beam emitted by the laser generator is directed to the laser processing area through the scanning galvanometer, the laser processing area is used to perform laser drilling on the workpiece to be processed, and the control device includes:

[0083] Position acquisition module 601: used to acquire the current moving position of the workbench during the feeding process of the workbench to the laser processing area, wherein the current moving position is used to reflect the current position of the workpiece to be processed;

[0084] The deflection control module 602 is used to send a deflection instruction to the scanning galvanometer when the current moving position is in the entrance area of ​​the laser processing area, wherein the deflection instruction is used to instruct the scanning galvanometer to deflect toward the direction where the laser processing area is located;

[0085] Angle acquisition module 603: used to acquire the current deflection angle of the scanning galvanometer;

[0086] Laser processing module 604: is used to send an on instruction to the laser generator when the current deflection angle is at a preset angle threshold, and the on instruction is used to instruct the laser generator to generate a laser beam to perform laser drilling on the workpiece to be processed during the feeding process of the workbench.

[0087] It should be noted that Figure 6 The contents of each module in the device shown are Figure 4 The contents of each step in the method shown are similar, and are not described here to avoid repetition. For details, please refer to Figure 4 The content of each step in the method shown.

[0088] The invention provides a control device for laser drilling. The control device is applied to the control system of laser drilling. The control system comprises a laser generator, a scanning galvanometer and a workbench. The workbench is used to load a workpiece to be processed. The laser beam emitted by the laser generator is emitted to a laser processing area through the scanning galvanometer. The laser processing area is used to perform laser drilling on the workpiece to be processed. The control device comprises: a position acquisition module: used to acquire the current moving position of the workbench during the feeding process of the workbench to the laser processing area, and the current moving position is used to reflect the current position of the workpiece to be processed; a deflection control module: used to send a deflection instruction to the scanning galvanometer when the current moving position is in the entrance area of ​​the laser processing area, and the deflection instruction is used to instruct the scanning galvanometer to deflect in the direction of the laser processing area; an angle acquisition module: used to acquire the current deflection angle of the scanning galvanometer; and a laser processing module: used to send an opening instruction to the laser generator when the current deflection angle is at a preset angle threshold, and the opening instruction is used to instruct the laser generator to generate a laser beam, so as to perform laser drilling on the workpiece to be processed during the feeding process of the workbench. Through the above device, laser drilling can be performed on the workpiece to be processed during the feeding process of the worktable, realizing uninterrupted drilling processing without the need for the worktable to stop and wait, thereby greatly improving the processing efficiency.

[0089] Figure 7 FIG. 1 shows an internal structure diagram of a computer device in an embodiment. The computer device may be a terminal or a server. Figure 7 As shown, the computer device includes a processor, a memory and a network interface connected via a system bus. The memory includes a non-volatile storage medium and an internal memory. The non-volatile storage medium of the computer device stores an operating system and may also store a computer program. When the computer program is executed by the processor, the processor can implement the above method. The internal memory may also store a computer program. When the computer program is executed by the processor, the processor can implement the above method. Those skilled in the art can understand that Figure 7 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0090] In one embodiment, a computer device is provided, comprising a memory and a processor, wherein the memory stores a computer program, and when the computer program is executed by the processor, the processor performs the following steps: Figure 4 The steps of the method are shown.

[0091] In one embodiment, a computer-readable storage medium is provided, which stores a computer program. When the computer program is executed by a processor, the processor performs the following steps: Figure 4 The steps of the method are shown.

[0092] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a non-volatile computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0093] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0094] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A laser drilling control method, characterized in that: The control method is applied to a control system of laser drilling, the control system includes a laser generator, a scanning galvanometer and a workbench, the workbench is used to load a workpiece to be processed, the laser beam emitted by the laser generator is directed to a laser processing area through the scanning galvanometer, the laser processing area is used to perform laser drilling on the workpiece to be processed, the control method includes: During the feeding process of the workbench to the laser processing area, obtaining the current moving position of the workbench, wherein the current moving position is used to reflect the current position of the workpiece to be processed; When the current moving position is in the entrance area of ​​the laser processing area, a deflection instruction is sent to the scanning galvanometer, wherein the deflection instruction is used to instruct the scanning galvanometer to deflect toward the direction where the laser processing area is located; Obtaining the current deflection angle of the scanning galvanometer; When the current deflection angle is within a preset angle threshold, an on instruction is sent to the laser generator, wherein the on instruction is used to instruct the laser generator to generate a laser beam so as to perform laser drilling on the workpiece to be processed during the feeding process of the worktable.

2. The method according to claim 1, characterized in that: The laser processing area is divided into at least a left processing area, a middle processing area and a right processing area, and the sending of a deflection instruction to the scanning galvanometer includes: If the entrance area is the entrance of the left processing area, a left deflection instruction is sent to the scanning galvanometer, wherein the deflection instruction at least includes the left deflection instruction, and the left deflection instruction is used to instruct the scanning galvanometer to deflect to the left processing area; If the entrance area is the entrance of the intermediate processing area, an intermediate deflection instruction is sent to the scanning galvanometer, wherein the deflection instruction at least includes the intermediate deflection instruction, and the intermediate deflection instruction is used to instruct the scanning galvanometer to deflect to the intermediate processing area; If the entrance area is the entrance of the right processing area, a right deflection instruction is sent to the scanning galvanometer, and the deflection instruction at least includes the right deflection instruction, and the right deflection instruction is used to instruct the scanning galvanometer to deflect to the right processing area.

3. The method according to claim 1 or 2, characterized in that: In the process of feeding the workbench to the laser processing area, before obtaining the current moving position of the workbench, the method further includes: When receiving the processing instruction of the workpiece to be processed, a feeding instruction is sent to the workbench, wherein the feeding instruction is used to instruct the workbench to feed toward the laser processing area so that the workpiece to be processed moves to the laser processing area.

4. The method according to claim 1, characterized in that: The step of obtaining the current moving position of the workbench further includes: Obtaining the size of the workpiece to be processed; The workpiece to be processed is partitioned according to the size and the maximum processing area of ​​the scanning galvanometer to determine a partition result, and the partition result at least includes the number of areas.

5. The method according to claim 4, characterized in that: The step of sending a deflection instruction to the scanning galvanometer also includes: Obtaining the recorded number of entrances to the laser processing area that the workbench passes through; When the number of the entrances is greater than the number of the areas, the step of obtaining the current moving position of the workbench is returned to execute until the current moving position is at the feeding end position, and then a stop feeding instruction is sent to the workbench.

6. A laser drilling control system, characterized in that: The control system includes a central control unit, a laser generator, a scanning galvanometer and a workbench. The central control unit is communicatively connected to the laser generator, the scanning galvanometer and the workbench respectively. The workbench is used to load the workpiece to be processed. The laser beam emitted by the laser generator is directed to the laser processing area through the scanning galvanometer. The laser processing area is used to perform laser drilling on the workpiece to be processed. The central control unit is used to execute the steps of the method as described in any one of claims 1 to 5.

7. The control system according to claim 6, characterized in that: The control system also includes a scanning lens, and the laser beam passing through the scanning galvanometer is vertically projected toward the laser processing area through the scanning lens.

8. A laser drilling control device, characterized in that: The control device is applied to a control system for laser drilling, the control system includes a laser generator, a scanning galvanometer and a workbench, the workbench is used to load a workpiece to be processed, the laser beam emitted by the laser generator is directed to a laser processing area through the scanning galvanometer, the laser processing area is used to perform laser drilling on the workpiece to be processed, and the control device includes: Position acquisition module: used for acquiring the current moving position of the workbench during the feeding process of the workbench to the laser processing area, wherein the current moving position is used for reflecting the current position of the workpiece to be processed; A deflection control module: used for sending a deflection instruction to the scanning galvanometer when the current moving position is in the entrance area of ​​the laser processing area, wherein the deflection instruction is used for instructing the scanning galvanometer to deflect in the direction of the laser processing area; Angle acquisition module: used to obtain the current deflection angle of the scanning galvanometer; Laser processing module: when the current deflection angle is at a preset angle threshold, sending an on instruction to the laser generator, the on instruction is used to instruct the laser generator to generate a laser beam to perform laser drilling on the workpiece to be processed during the feeding process of the workbench.

9. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the processor is caused to perform the steps of the method according to any one of claims 1 to 5.

10. A computer device comprising a memory and a processor, characterized in that: The memory stores a computer program, and when the computer program is executed by the processor, the processor is caused to perform the steps of the method according to any one of claims 1 to 5.

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