Method for improving uniformity of ceramic grinding plate

Abstract

The invention discloses a method for improving the uniformity of a ceramic grinding plate, and relates to the technical field of PCB (Printed Circuit Board) processing, comprising the following steps: determining the effective grinding width of a ceramic brush; determining a first boundary and a second boundary of the effective grinding area; all the fed PCBs are controlled to be located in an effective grinding area of the ceramic brush; controlling the side edge of the first PCB to be flush with the first boundary, controlling the distance between the side edge of the subsequent PCB and the first boundary to be gradually increased until the side edge of any PCB is flush with the second boundary, and controlling the distance between the side edge of the subsequent PCB and the second boundary to be gradually increased until the side edge of any PCB is flush with the first boundary; and repeatedly executing the board throwing mode of the previous step. According to the ceramic grinding device, the problem of uneven and abnormal dog bone shape of the grinding brush is effectively solved, the ceramic whole brushing frequency is reduced, and meanwhile, the ceramic grinding uniformity is improved.

Description

Technical Field

[0001] The invention relates to the technical field of PCB board processing, and in particular to a method for improving the uniformity of a ceramic grinding plate. Background Art

[0002] With the digital transformation of PCB manufacturing, robot intelligence gradually replaces manual board placement. The fixed program programming of the manipulator and non-standard automation in the horizontal line placement are defaulted to left, middle and right board placement operations. Figure 1 .

[0003] To improve some horizontal lines and prevent abnormal carding, the plate needs to be automatically centered, which will cause uneven consumption of the ceramic brush and dog-bone abnormalities, which will easily increase the number of brushing times and increase brush consumption. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the disadvantages of the prior art and provide a method for improving the uniformity of a ceramic grinding plate.

[0005] In order to solve the above technical problems, the technical solution of the present invention is as follows: A method for improving the uniformity of a ceramic grinding plate, comprising: Determine the effective grinding width of the ceramic brush; determining a first boundary and a second boundary of an effective grinding area based on an effective grinding width of the ceramic brush; All PCB boards placed under control are located within the effective grinding area of ​​the ceramic brush; Controlling the side of the first PCB board to be flush with the first boundary, and controlling the spacing between the side of the subsequent PCB board adjacent to the first boundary and the first boundary to gradually increase, until the side of any PCB board adjacent to the second boundary is flush with the second boundary, and controlling the spacing between the side of the subsequent PCB board adjacent to the second boundary to gradually increase, until the side of any PCB board adjacent to the first boundary is flush with the first boundary; Repeat the previous step of casting. Among them, in the effective grinding area of ​​the ceramic brush, the number of PCB boards arranged in sequence along the same direction is greater than or equal to six.

[0006] As a preferred solution of the method for improving the uniformity of a ceramic grinding plate of the present invention, wherein: after controlling the side edge of the first PCB board to be flush with the first boundary, and controlling the spacing between the side edges of subsequent PCB boards adjacent to the first boundary and the first boundary to gradually increase until the side edge of any PCB board adjacent to the second boundary is flush with the second boundary, and controlling the spacing between the side edges of subsequent PCB boards adjacent to the second boundary to gradually increase until the side edge of any PCB board adjacent to the first boundary is flush with the first boundary, the method further comprises: Control the horizontal spacing between any two adjacent PCB boards to be equal.

[0007] As a preferred solution of the method for improving the uniformity of the ceramic grinding plate of the present invention, the first boundary is flush with one side of the effective grinding width of the ceramic brush, and the second boundary is flush with the other side of the effective grinding width of the ceramic brush.

[0008] As a preferred solution of the method for improving the uniformity of the ceramic grinding plate of the present invention, wherein: along the conveying direction of the PCB boards, the distance between any two adjacent PCB boards is greater than 0.

[0009] As a preferred solution of the method for improving the uniformity of the ceramic grinding plate of the present invention, the effective grinding width of the ceramic brush is less than or equal to 730 mm.

[0010] The beneficial effects of the present invention are: (1) The present invention effectively improves the problem of dog-bone-shaped unevenness during brushing, reduces the frequency of ceramic brushing, and improves the uniformity of ceramic grinding.

[0011] (2) The present invention improves the first-time yield of the ceramic brush grinding quality and improves the production efficiency of the station.

[0012] (3) The present invention effectively reduces the number of scrapped PCB boards, saves manpower cleaning and maintenance costs, and improves work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0014] Figure 1 It is a schematic diagram of the board placement method of the existing automatic board placing machine; Figure 2 A schematic diagram of the plate casting method in the method for improving the uniformity of ceramic grinding plates provided by the present invention. DETAILED DESCRIPTION

[0015] In order to make the content of the present invention more clearly understood, the present invention is further described in detail below according to specific implementation modes and in combination with the accompanying drawings.

[0016] The present invention provides a method for improving the uniformity of a ceramic grinding plate, which method specifically comprises the following steps: Step S101: Determine the effective grinding width of the ceramic brush.

[0017] Specifically, in this embodiment, the effective grinding width of the ceramic brush is less than or equal to 730 mm.

[0018] Step S102: determining a first boundary and a second boundary of the effective grinding area based on the effective grinding width of the ceramic brush.

[0019] For details, see Figure 2 The first boundary is flush with the left side of the effective grinding width of the ceramic brush, and the second boundary is flush with the right side of the effective grinding width of the ceramic brush. That is, the effective grinding area of ​​the ceramic brush is between the first boundary and the second boundary.

[0020] Step S103: Control all the PCB boards put in to be located within the effective grinding area of ​​the ceramic brush.

[0021] Specifically, it is ensured that all PCB boards placed by the automatic board placing machine are located between the first boundary and the second boundary, so that the grinding effect of the ceramic brush on the PCB boards can be guaranteed.

[0022] Step S104: Control the side of the first PCB board to be flush with the first boundary, and control the spacing between the side of the subsequent PCB board adjacent to the first boundary and the first boundary to gradually increase, until the side of any PCB board adjacent to the second boundary is flush with the second boundary, and control the spacing between the side of the subsequent PCB board adjacent to the second boundary to gradually increase, until the side of any PCB board adjacent to the first boundary is flush with the first boundary.

[0023] For details, see Figure 2 , through programming control, add the sequence layout setting program, and set the board mode as follows: The left side of the first PCB board is controlled to be flush with the first boundary, and the distance between the left side of the subsequent PCB board and the first boundary is controlled to gradually increase until the right side of any PCB board is flush with the second boundary, and the distance between the right side of the subsequent PCB board and the second boundary is controlled to gradually increase until the left side of any PCB board is flush with the first boundary.

[0024] It should be noted that within the effective grinding area of ​​the ceramic brush, the number of PCB boards arranged in sequence along the same direction is greater than or equal to six.

[0025] In addition, along the conveying direction of the PCB boards, the spacing between any two adjacent PCB boards is greater than 0. That is, each PCB board is staggered with the subsequent PCB board.

[0026] Step S105: Repeat the board casting method of the previous step.

[0027] Therefore, the technical solution of the present application effectively improves the problem of dog-bone-shaped unevenness in brushing, reduces the frequency of ceramic brushing, and improves the uniformity of ceramic grinding.

[0028] In addition to the above embodiments, the present invention may also have other implementation modes; any technical solutions formed by equivalent replacement or equivalent transformation shall fall within the protection scope required by the present invention.

Claims

1. A method for improving the uniformity of a ceramic grinding plate, characterized in that: include: Determine the effective grinding width of the ceramic brush; determining a first boundary and a second boundary of an effective grinding area based on an effective grinding width of the ceramic brush; All PCB boards placed under control are located within the effective grinding area of ​​the ceramic brush; Controlling the side of the first PCB board to be flush with the first boundary, and controlling the spacing between the side of the subsequent PCB board adjacent to the first boundary and the first boundary to gradually increase, until the side of any PCB board adjacent to the second boundary is flush with the second boundary, and controlling the spacing between the side of the subsequent PCB board adjacent to the second boundary to gradually increase, until the side of any PCB board adjacent to the first boundary is flush with the first boundary; Repeat the previous step of casting. Among them, in the effective grinding area of ​​the ceramic brush, the number of PCB boards arranged in sequence along the same direction is greater than or equal to six.

2. The method for improving the uniformity of a ceramic grinding plate according to claim 1, characterized in that: After controlling the side of the first PCB board to be flush with the first boundary, and controlling the spacing between the side of the subsequent PCB board adjacent to the first boundary and the first boundary to gradually increase until the side of any PCB board adjacent to the second boundary is flush with the second boundary, and controlling the spacing between the side of the subsequent PCB board adjacent to the second boundary to gradually increase until the side of any PCB board adjacent to the first boundary is flush with the first boundary, the method further includes: Control the horizontal spacing between any two adjacent PCB boards to be equal.

3. The method for improving the uniformity of a ceramic grinding plate according to claim 1, characterized in that: The first boundary is flush with one side of the effective grinding width of the ceramic brush, and the second boundary is flush with the other side of the effective grinding width of the ceramic brush.

4. The method for improving the uniformity of a ceramic grinding plate according to claim 1, characterized in that: Along the conveying direction of the PCB boards, the distance between any two adjacent PCB boards is greater than 0.

5. The method for improving the uniformity of a ceramic grinding plate according to claim 1, characterized in that: The effective grinding width of the ceramic brush is less than or equal to 730 mm.

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