Soft package support injection mold with cooling circulation optimization structure

Abstract

The invention provides a soft package support injection mold with a cooling circulation optimization structure. The soft package support injection mold with the cooling circulation optimization structure comprises a lower side supporting plate, the upper side of the lower side supporting plate is fixedly connected with a center supporting rod, the end, away from the lower side supporting plate, of the center supporting rod is fixedly connected with a lower mold plate, and the upper end of the lower mold plate is fixedly connected with a mold rod and an upper mold plate; the upper mold plate is in sliding connection with the mold rod, and mold holes corresponding to the mold rod in position are formed in the upper mold plate. According to the soft package support injection mold with the cooling circulation optimization structure, a plurality of heat dissipation holes are formed in the lower side supporting plate and the upper mold plate, and the cooling pipeline optimization structure is designed, so that the cooling effect is effectively improved, and the problem of cooling pipeline blockage or corrosion is avoided; and it is ensured that the mold can still maintain good cooling efficiency under high-frequency use, and the overheating risk is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of injection molds, and in particular to a soft package bracket injection mold with a cooling cycle optimization structure. Background Art

[0002] A soft-package bracket injection mold with a cooling cycle optimization structure is mainly composed of a mold body, a cooling system, an injection molding system, and a bracket structure. Its basic structure includes the upper and lower parts of the mold. The upper mold is generally used to form the upper half of the bracket, and the lower mold is used to form the lower half. The cooling system of the mold adopts an optimized design to improve the cooling efficiency. It is usually composed of multiple cooling pipes and cooling channels. These cooling pipes are arranged in key areas of the mold, such as injection holes, runners, etc., to ensure uniform temperature distribution during the injection molding process and avoid defects caused by uneven cooling. The principle of the mold is based on injection molding technology, in which the plastic is heated and melted at high temperature and injected into the mold through an injection molding machine to form the shape of the bracket. During the molding process, the mold cools the plastic through the cooling system so that it can be quickly solidified and formed. The cooling cycle optimization design reduces the temperature difference and cooling time by reasonably arranging cooling channels and pipes, thereby improving the mold production efficiency and ensuring the quality of the product.

[0003] Although the soft-package bracket injection mold has an optimized cooling cycle structure, it still has certain defects. After long-term and high-frequency use, the cooling effect of the mold may gradually weaken. This is mainly due to the blockage or corrosion of the cooling pipe, which leads to a decrease in cooling efficiency and may even cause the mold to overheat, thereby shortening the service life of the mold. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides a soft-pack bracket injection mold with a cooling cycle optimization structure, which solves the problem that the cooling effect may gradually weaken after long-term and high-frequency use. This is mainly due to the blockage or corrosion of the cooling pipe, resulting in reduced cooling efficiency and may even cause mold overheating.

[0005] To achieve the above objectives, the present invention is implemented through the following technical solutions: A soft-package bracket injection mold with a cooling cycle optimization structure, comprising:

[0006] A lower support plate, wherein the upper side of the lower support plate is fixedly connected to a central support rod, an end of the central support rod away from the lower support plate is fixedly connected to a lower mold plate, and an upper end of the lower mold plate is fixedly connected to a mold rod;

[0007] An upper mold plate is slidably connected to the mold rod, a mold hole corresponding to the position of the mold rod is arranged on the upper mold plate, a central threaded rod is fixedly connected to the upper mold plate, a spring is fixedly connected to the outer end of the central threaded rod, and an end of the spring away from the central threaded rod is fixedly connected to the upper support plate;

[0008] The transfer device is located on the outer side of the lower support plate, and the transfer device includes a fixed component, a movable component and a driving component.

[0009] Preferably: a plurality of first active heat dissipation holes are arranged on the upper side of the lower support plate, and the number of the mold rods is plural and distributed in a rectangular array.

[0010] Preferably, a plurality of second active heat dissipation holes are arranged on the upper mold plate, and a plurality of lower support points are arranged on the upper side of the upper support plate.

[0011] Preferably: the fixing assembly comprises a longitudinal rod, a central sliding groove, a lower clamping plate and a groove, the lower clamping plate is fixedly connected to the longitudinal rod, the groove is located on the side surface of the lower clamping plate, and the central sliding groove is located on the side surface of the longitudinal rod.

[0012] Preferably, the movable assembly comprises a fan, a moving block, a blowing nozzle, a conduit, an upper clamping plate and a fixing rod, and the output end of the fan is fixedly connected to the conduit.

[0013] Preferably: the end of the duct away from the fan is fixedly connected to the blowing nozzle, the upper end of the fan is fixedly connected to the fixing rod, the end of the fixing rod away from the fan is fixedly connected to the moving block, and the moving block is fixedly connected to the driving assembly.

[0014] Preferably, the driving assembly comprises a motor and a rotating wheel, the output end of the motor is fixedly connected to the rotating wheel, and the number of the driving assemblies is two and they are in contact with the lower support plate and the upper support plate respectively.

[0015] Preferably: the lower mold plate is provided with heat dissipation holes, and the outer side of the lower mold plate is provided with auxiliary heat dissipation holes.

[0016] The present invention provides a soft-package bracket injection mold with a cooling cycle optimization structure. It has the following beneficial effects:

[0017] The soft-pack bracket injection mold with a cooling cycle optimization structure has multiple heat dissipation holes arranged on the lower support plate and the upper mold plate, and designs a cooling pipeline optimization structure. The present invention effectively improves the cooling effect, avoids the problem of cooling pipeline blockage or corrosion, ensures that the mold can still maintain good cooling efficiency under high-frequency use, and reduces the risk of overheating. The cooling cycle structure of the soft-pack bracket injection mold optimizes the flow path of the airflow, and forms a complete transfer device by arranging components such as a fan, a moving block, a blowing nozzle, and a duct, which can more efficiently guide the cold airflow into the interior of the mold, thereby accelerating heat dissipation, improving the cooling efficiency of the entire mold, and preventing mold damage caused by insufficient cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 It is a partial schematic diagram of the present invention;

[0020] Figure 3 It is an exploded view of the present invention;

[0021] Figure 4 It is a schematic diagram of the structure of the transfer device of the present invention;

[0022] Figure 5 It is a schematic diagram of another transfer device structure of the present invention;

[0023] Figure 6 For the present invention Figure 2 A schematic diagram of the enlarged structure in the middle.

[0024] Among them, 1. lower support plate; 2. first active heat dissipation hole; 3. lower mold plate; 4. upper mold plate; 5. upper support plate; 6. spring; 7. center threaded rod; 8. mold hole; 9. second active heat dissipation hole; 10. mold rod; 11. center support rod; 12. lower support point; 13. heat dissipation hole; 14. transfer device; 15. lower clamping plate; 16. groove; 17. motor; 18. rotating wheel; 19. driving assembly; 20. center sliding groove; 21. moving block; 22. fan; 23. duct; 24. blowing nozzle; 25. fixing rod; 26. upper clamping plate; 27. auxiliary heat dissipation hole. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] Embodiment 1

[0027] like Figure 1-6 As shown, an embodiment of the present invention provides a soft-package bracket injection mold with a cooling cycle optimization structure, including a lower support plate 1, a plurality of first active heat dissipation holes 2 are arranged on the upper side of the lower support plate 1, a plurality of mold rods 10 are distributed in a rectangular array, a central support rod 11 is fixedly connected to the upper side of the lower support plate 1, an end of the central support rod 11 away from the lower support plate 1 is fixedly connected to a lower mold plate 3, and the upper end of the lower mold plate 3 is fixedly connected to the mold rod 10.

[0028] The upper mold plate 4 is slidably connected to the mold rod 10, and is provided with a mold hole 8 corresponding to the position of the mold rod 10. The upper mold plate 4 is fixedly connected to a central threaded rod 7, and a spring 6 is fixedly connected to the outer end of the central threaded rod 7. The end of the spring 6 away from the central threaded rod 7 is fixedly connected to an upper support plate 5. The upper mold plate 4 is provided with a plurality of second active heat dissipation holes 9, and a plurality of lower support points 12 are provided on the upper side of the upper support plate 5.

[0029] The transfer device 14 is located on the outer side of the lower support plate 1 . The transfer device 14 includes a fixed component, a movable component and a driving component 19 .

[0030] Embodiment 1 significantly improves the cooling efficiency of the mold by optimizing the cooling cycle structure and heat dissipation design, and solves the problem that the cooling effect of the traditional mold gradually weakens during long-term and high-frequency use. First, in embodiment 1, a plurality of first active heat dissipation holes 2 are arranged on the upper side of the lower support plate 1. These heat dissipation holes are numerous and evenly distributed, which effectively improves the heat release efficiency, thereby enhancing the heat dissipation capacity of the mold. Secondly, the mold rod 10 is distributed in a plurality of rectangular arrays, with a total of several mold rods 10. Such a design can increase the heat dissipation area and make the heat more evenly distributed, thereby avoiding local overheating. Through such a design, the efficiency of the cooling pipeline is guaranteed, and the risk of reduced cooling efficiency due to pipeline blockage or corrosion is reduced. In terms of structure, a central support rod 11 is fixedly connected to the lower support plate 1, and the support rod is fixedly connected to the lower mold plate 3, and the lower mold plate 3 is connected to the upper mold plate 4 through the mold rod 10 to form a stable structural system. This not only ensures the stability of the mold, but also improves the heat dissipation effect. The upper mold plate 4 is slidably connected to the mold rod 10, so that the mold can flexibly adjust its position during use to adapt to different working conditions, further improving the applicability of the mold. The design of the central threaded rod 7 and the spring 6 ensures the precise support and stability of the upper mold plate 4, and can effectively prevent mold deformation caused by thermal expansion and contraction, especially after long-term use. Through these optimized designs, Example 1 effectively improves the cooling effect, enhances the stability of the mold, and significantly extends the service life of the mold.

[0031] Embodiment 2

[0032] like Figure 1-6 As shown, an embodiment of the present invention provides a soft-package bracket injection mold with a cooling cycle optimization structure, including a lower support plate 1, a plurality of first active heat dissipation holes 2 are arranged on the upper side of the lower support plate 1, a plurality of mold rods 10 are distributed in a rectangular array, a central support rod 11 is fixedly connected to the upper side of the lower support plate 1, an end of the central support rod 11 away from the lower support plate 1 is fixedly connected to a lower mold plate 3, and the upper end of the lower mold plate 3 is fixedly connected to the mold rod 10.

[0033] The upper mold plate 4 is slidably connected to the mold rod 10, and is provided with a mold hole 8 corresponding to the position of the mold rod 10. The upper mold plate 4 is fixedly connected to a central threaded rod 7, and a spring 6 is fixedly connected to the outer end of the central threaded rod 7. The end of the spring 6 away from the central threaded rod 7 is fixedly connected to an upper support plate 5. The upper mold plate 4 is provided with a plurality of second active heat dissipation holes 9, and a plurality of lower support points 12 are provided on the upper side of the upper support plate 5.

[0034] The transfer device 14 is located on the outer side of the lower support plate 1. The transfer device 14 includes a fixed component, a movable component and a driving component 19. The fixed component includes a longitudinal rod, a central sliding groove 20, a lower clamping piece 15 and a groove 16. The lower clamping piece 15 is fixedly connected to the longitudinal rod. The groove 16 is located on the side surface of the lower clamping piece 15. The central sliding groove 20 is located on the side surface of the longitudinal rod. The movable component includes a fan 22, a moving block 21, a blowing nozzle 24, a duct 23, an upper clamping piece 26 and a fixed rod 25. The output end of the fan 22 is fixedly connected to the duct 23. One end of the tube 23 away from the fan 22 is fixedly connected to the blowing nozzle 24, the upper end of the fan 22 is fixedly connected to the fixing rod 25, the end of the fixing rod 25 away from the fan 22 is fixedly connected to the moving block 21, the moving block 21 is fixedly connected to the driving assembly 19, the driving assembly 19 includes a motor 17 and a rotating wheel 18, the output end of the motor 17 is fixedly connected to the rotating wheel 18, there are two driving assemblies 19 and they are in contact with the lower support plate 1 and the upper support plate 5 respectively, the lower mold plate 3 is provided with heat dissipation holes 13, and the outer side of the lower mold plate 3 is provided with auxiliary heat dissipation holes 27.

[0035] Embodiment 2 further enhances the cooling effect and heat dissipation capacity on the basis of embodiment 1, and solves the problem of insufficient cooling under high-frequency use by introducing a more complex and efficient cooling cycle design. Embodiment 2 adds a transfer device 14, including a fixed component, a movable component and a drive component 19. The synergistic effect of these components can effectively improve the cooling efficiency. Specifically, the fan 22 in the transfer device 14 guides air to the key parts of the mold through the duct 23, the output end of the fan 22 is fixedly connected to the duct 23, and the end of the duct 23 away from the fan 22 is fixedly connected to the blowing nozzle 24. The blowing nozzle 24 can accurately blow the cooling airflow to various parts of the mold to ensure that the airflow is evenly distributed on the mold surface to avoid local overheating. The movable component also includes a moving block 21 and an upper clamping plate 26. The moving block 21 is fixedly connected to the drive component 19, and the drive component 1 9 is composed of a motor 17 and a rotor 18. The airflow generated by the combination of the motor 17 and the rotor 18 can be accurately transmitted to the inside of the mold through the duct 23 and the blowing nozzle 24, ensuring the maximization of the cooling effect. There are two drive components 19, which are in contact with the lower support plate 1 and the upper support plate 5 respectively, ensuring uniform cooling of the mold at all angles and positions, thereby further improving the cooling efficiency. Different from the first embodiment, the second embodiment is provided with heat dissipation holes 13 and auxiliary heat dissipation holes 27 on the lower mold plate 3, which greatly increases the heat dissipation area and heat exchange capacity of the mold, ensuring that the mold can maintain a low temperature even under long-term and high-frequency production conditions. Through these designs, the second embodiment effectively solves the shortcomings of the traditional mold cooling system, significantly improves the cooling efficiency and the durability of the mold, and reduces the risk of mold damage or performance degradation due to excessive temperature.

[0036] Working principle: The core structure of the mold includes a lower support plate 1 and an upper mold plate 4. A plurality of first active heat dissipation holes 2 are arranged on the upper side of the lower support plate 1, and a plurality of second active heat dissipation holes 9 are arranged on the upper mold plate 4. The design of these heat dissipation holes 13 helps to improve the heat dissipation efficiency of the mold and prevent the surface temperature of the mold from being too high. There are multiple mold rods 10 and they are distributed in a rectangular array. This layout increases the area for heat conduction and dissipation, further improves the cooling effect, and avoids local overheating. The transfer device 14 plays a vital role in Example 2. The transfer device 14 includes a fixed component, a movable component and a driving component 19. Through the coordinated work of these components, the transfer device 14 can effectively improve the cooling efficiency of the mold. The fixed component includes a longitudinal rod, a central sliding groove 20, a lower clamping plate 15 and a groove 16. The lower clamping piece 15 is fixedly connected to the longitudinal rod, the groove 16 is located on the side surface of the lower clamping piece 15, and the central sliding groove 20 is located on the side surface of the longitudinal rod, ensuring the stability of the transfer device 14 and the flexibility of the movable assembly. The movable assembly includes a fan 22, a moving block 21, a blowing nozzle 24, a conduit 23, an upper clamping piece 26 and a fixed rod 25. The output end of the fan 22 is fixedly connected to the conduit 23, and the end of the conduit 23 away from the fan 22 is fixedly connected to the blowing nozzle 24, ensuring that the cooling airflow can be accurately blown to the mold surface to avoid uneven temperature. The fan 22 is not only responsible for the flow of air, but also drives the moving block 21 to move through the connection with the fixed rod 25, thereby controlling the precise distribution of the airflow. The drive assembly 19 includes a motor 17 and a runner 18. The motor 17 drives the runner 18 to generate airflow, further improving the cooling effect. The number of the drive assembly 19 is two, which are respectively in contact with the lower support plate 1 and the upper support plate 5 to ensure that all angles and positions of the mold can be evenly cooled. The runner 18, driven by the motor 17, directs the air flow to the key parts of the mold through the conduit 23, thereby improving the cooling effect and heat dissipation capacity. In addition to these cooling and air flow designs, the second embodiment also provides heat dissipation holes 13 and auxiliary heat dissipation holes 27 on the lower mold plate 3. The design of these heat dissipation holes significantly increases the heat dissipation area of ​​the mold and improves the heat exchange efficiency, so that the mold can effectively dissipate heat and prevent overheating even in the case of high and frequent use. The auxiliary heat dissipation holes 27 of the lower mold plate 3 help to further enhance the overall heat dissipation capacity of the mold, ensuring that the mold can maintain a lower temperature under different production conditions.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A soft-package bracket injection mold with a cooling cycle optimization structure, characterized in that: include: A lower support plate (1), the upper side of the lower support plate (1) being fixedly connected to a central support rod (11), one end of the central support rod (11) away from the lower support plate (1) being fixedly connected to a lower mold plate (3), and the upper end of the lower mold plate (3) being fixedly connected to a mold rod (10); An upper mold plate (4) is slidably connected to the mold rod (10), the upper mold plate (4) is provided with a mold hole (8) corresponding to the position of the mold rod (10), the upper mold plate (4) is fixedly connected to a central threaded rod (7), the outer end of the central threaded rod (7) is fixedly connected to a spring (6), and the end of the spring (6) away from the central threaded rod (7) is fixedly connected to an upper support plate (5); The transfer device (14) is located on the outer side of the lower support plate (1), and the transfer device (14) comprises a fixed component, a movable component and a driving component.

2. The soft-package bracket injection mold with a cooling cycle optimization structure according to claim 1, characterized in that: A plurality of first active heat dissipation holes (2) are arranged on the upper side of the lower support plate (1), and the mold rods (10) are multiple in number and distributed in a rectangular array.

3. The soft package bracket injection mold with a cooling cycle optimization structure according to claim 1, characterized in that: The upper mold plate (4) is provided with a plurality of second active heat dissipation holes (9), and the upper side of the upper support plate (5) is provided with a plurality of lower support points (12).

4. The soft-package bracket injection mold with a cooling cycle optimization structure according to claim 1, characterized in that: The fixing assembly comprises a longitudinal rod, a central sliding groove (20), a lower clamping piece (15) and a groove (16); the lower clamping piece (15) is fixedly connected to the longitudinal rod, the groove (16) is located on the side surface of the lower clamping piece (15), and the central sliding groove (20) is located on the side surface of the longitudinal rod.

5. The soft package bracket injection mold with a cooling cycle optimization structure according to claim 1, characterized in that: The movable assembly comprises a fan (22), a moving block (21), a blowing nozzle (24), a conduit (23), an upper clamping sheet (26) and a fixing rod (25), and the output end of the fan (22) is fixedly connected to the conduit (23).

6. The soft-package bracket injection mold with a cooling cycle optimization structure according to claim 5, characterized in that: The end of the duct (23) away from the fan (22) is fixedly connected to the blowing nozzle (24), the upper end of the fan (22) is fixedly connected to the fixing rod (25), the end of the fixing rod (25) away from the fan (22) is fixedly connected to the moving block (21), and the moving block (21) is fixedly connected to the driving assembly (19).

7. The soft-package bracket injection mold with a cooling cycle optimization structure according to claim 1, characterized in that: The driving assembly (19) comprises a motor (17) and a rotating wheel (18), wherein the output end of the motor (17) is fixedly connected to the rotating wheel (18), and the number of the driving assemblies (19) is two and they are in contact with the lower support plate (1) and the upper support plate (5) respectively.

8. The soft package bracket injection mold with a cooling cycle optimization structure according to claim 1, characterized in that: The lower mold plate (3) is provided with heat dissipation holes (13), and the outer side of the lower mold plate (3) is provided with auxiliary heat dissipation holes (27).

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