Probe card and probe station system applied to semiconductor aging test

Abstract

The invention discloses a probe card and probe station system applied to a semiconductor aging test. The probe card and probe station system comprises a PCB clamp, a PCB, a vertical probe card and a probe station, a plurality of spring probes are regularly arranged in the vertical probe card, the vertical probe card is fixed on the lower surface of the PCB, and the PCB is fixed on the lower surface of the PCB clamp, so that a three-layer probe card structure is formed; and the PCB clamp is arranged on the table surface of the probe and covers the opening on the table surface of the probe table, so that the PCB and the vertical probe card are arranged in the inner cavity of the probe table in a sealing manner, thereby forming the probe card and probe table system. According to the invention, through cooperation of the three layers of probe card structures and the probe station, simultaneous probe insertion test work of multiple probes can be realized, synchronous aging test work can be carried out on hundreds of dies at the same time, and the aging test efficiency of semiconductor chips is greatly improved.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit testing, and in particular to a probe card and a probe station system applied to semiconductor aging testing. Background Art

[0002] The overall plan of semiconductor chip aging test is to supply power signals and test signals to the semiconductor chip under test, and let the chip under test work continuously and uninterruptedly for a set time at high or low temperature or room temperature. This process is called burn-in, which accelerates the failure of semiconductor memory and screens out good products.

[0003] As for the wafer being tested, there will be hundreds or even more than 1,000 Dies (chips, also called chips) on a single wafer. To test so many Dies at the same time, 2 to 3 times the number of PogoPins (spring probes) are required depending on the number of pins. The number of probes is large and the spacing is extremely small, and the contact resistance consistency requirement is high. In addition, the aging test is performed under a long-term high temperature, high pressure and high voltage environment. The probe needs to remain stable relative to the entire wafer during the test, and the space for the probe test needs to be relatively closed.

[0004] For these reasons, there are few probe cards for aging tests at the wafer level at home and abroad. Due to the lack of probe cards for aging tests, the chip design cannot be tested in the early testing phase of the wafer, so the chip yield cannot be guaranteed, the production efficiency is low, and the cost remains high. Summary of the invention

[0005] The technical problem solved by the present invention is to provide a probe card and probe station test system for aging test with high reliability, high stability and high efficiency.

[0006] The technical solution adopted by the present invention to solve the technical problem is:

[0007] A probe card and probe station system for semiconductor aging test, comprising a PCB fixture, a PCB board, a vertical needle card and a probe station; a plurality of spring probes are regularly arranged and installed in the vertical needle card, the vertical needle card is fixed to the lower surface of the PCB board, and the PCB board is fixed to the lower surface of the PCB fixture, thereby forming a three-layer probe card structure; the PCB fixture is arranged and installed on the table of the probe and covers the opening on the table of the probe station, so that the PCB board and the vertical needle card are sealed in the inner cavity of the probe station, thereby forming the probe card and probe station system;

[0008] The spring probe includes a needle tube, and a test needle and a connection needle elastically arranged at the front and rear ends of the needle tube, the test needle passes through the lower surface of the vertical needle card to electrically contact the pad on the wafer to be tested; the connection needle passes through the upper surface of the vertical needle card to electrically contact the pad arranged on the PCB board;

[0009] A plurality of connectors are regularly arranged on the PCB board, and the plurality of connectors are electrically connected to the spring probes regularly through the wiring, the pads and the connecting needles arranged on the PCB board.

[0010] Furthermore, the vertical needle card includes a base plate and a needle carrier plate, the base plate is provided with a needle carrier plate slot along the shape of the needle carrier plate, the needle carrier plate is fixed in the needle carrier plate slot by fasteners, and together with the base plate forms a whole.

[0011] Furthermore, a plurality of probe card slots for installing the spring probes are regularly arranged at the same positions on the contact surfaces of the substrate and the needle carrier plate, and upper and lower ends of the probe card slots are respectively provided with upper and lower pinholes for facilitating the passage of the connecting needle and the test needle body.

[0012] Furthermore, the upper pinhole passes through the needle-carrying plate, and its opening is regularly arranged along the shape and diameter of the connecting needle; the lower pinhole passes through the substrate, and its opening is regularly arranged along the shape and diameter of the test needle; the probe card slot is arranged along the shape and diameter of the needle tube.

[0013] Furthermore, the diameters of the test needle and the connecting needle are smaller than the diameter of the needle tube.

[0014] Furthermore, the length of the testing needle is greater than the length of the connecting needle.

[0015] Furthermore, a handle is regularly arranged on the upper surface of the PCB fixture for easy extraction.

[0016] Furthermore, a plurality of observation holes are provided at the same positions on the PCB fixture, the PCB board and the vertical needle card in a one-to-one correspondence, and the plurality of observation holes sequentially penetrate the PCB fixture, the PCB board and the vertical needle card, thereby facilitating a microscope to observe and record the needle test conditions in the inner cavity of the probe station through the observation holes, and to realize the alignment of the wafer to be tested and the vertical needle card.

[0017] Furthermore, a transparent baffle is regularly installed and fixed on the upper surface or the lower surface of the PCB fixture, and a cross mark for assisting alignment is regularly arranged at the center position of a certain observation hole on the transparent baffle.

[0018] Preferably, the transparent baffle is a transparent glass baffle.

[0019] The beneficial effects of the present invention are:

[0020] 1. The present invention can realize multi-needle simultaneous piercing test by cooperating with the probe station through the three-layer probe card structure, and can perform synchronous aging test on hundreds of dies at the same time, greatly improving the aging test efficiency of semiconductor chips.

[0021] 2. The present invention forms a rigid mechanical connection by adopting a socket-PCB-PCB fixture three-layer probe card structure and fixing it to the surface of the probe station, so that the entire test system has high reliability and stability.

[0022] 3. The present invention controls the relative position of each needle insertion point by the needle row on the socket, and then controls the relative position between the socket, PCB, fixture, and the center of the probe station, so that each spring needle can accurately test the pad of the corresponding Die, and the needle insertion accuracy is high.

[0023] 4. The spring probe on the socket of the present invention is replaceable. If it is damaged during the test process, only the spring needle at the corresponding position needs to be replaced, which reduces the use cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is the exploded structure diagram of the present invention;

[0025] Figure 2 is a three-dimensional diagram of the probe card of the present invention;

[0026] Figure 3 for Figure 2 Back view of ;

[0027] Figure 4 is a three-dimensional diagram of a ceramic vertical needle clamp in the present invention;

[0028] Figure 5 for Figure 4 Exploded structure diagram;

[0029] Figure 6 for Figure 4 Top view and cutaway view of the

[0030] Figure 7 for Figure 6 A magnified view of part A in FIG.

[0031] Figure 8 It is a structural diagram of the spring probe in the present invention;

[0032] Fig. 9 for Figure 1 Combined view of

[0033] The markings in the figure are:

[0034] 1. PCB fixture, 2. PCB board, 3. Ceramic vertical needle card, 4. Probe table, 5. Spring probe, 6. Observation hole;

[0035] 11. handle, 101. connector slot, 21. connector, 31. substrate, 32. needle carrier board, 33. probe card slot, 3301. upper pinhole, 3302. lower pinhole, 3101. needle carrier board slot;

[0036] 401, PCB fixture installation port;

[0037] 501. needle tube, 502. test needle, 503. connecting needle. DETAILED DESCRIPTION

[0038] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0040] like Figure 1-Figure 9 As shown, the present invention provides a probe card and probe station system for semiconductor aging test, including a PCB fixture 1, a PCB board 2, a ceramic vertical needle card 3, a plurality of spring probes 5 and a probe station. Among them, the plurality of spring probes 5 are regularly installed in the ceramic vertical needle card 3, the ceramic vertical needle card 3 is fixed on the lower surface of the PCB board 2, the PCB board 2 is fixed on the lower surface of the PCB fixture 1, and the PCB fixture 1 is arranged and installed on the table 4 of the probe station and covers the opening on the table 4 of the probe station, so that the PCB board 2 and the ceramic vertical needle card 3 are sealed in the inner cavity of the probe station.

[0041] Further, such as Figure 1 As shown, an opening is set on the probe station table 4 to form a PCB fixture installation opening 401. The PCB fixture 1 is regularly arranged and fixed in the PCB fixture installation opening 401, and the PCB fixture installation opening is covered and sealed, thereby maintaining a sealed environment in the inner cavity of the probe station. Figure 1and Fig. 9 As shown, the PCB fixture 1 serves as a cover plate for the opening on the probe station surface.

[0042] Further, such as Figure 3 As shown, a plurality of connectors 21 are regularly arranged and soldered on the PCB board 2. The plurality of connectors 21 are regularly arranged at one end of the PCB board. In one embodiment, the plurality of connectors are arranged at the rear end of the PCB board.

[0043] Further, such as Figure 2 As shown, a plurality of connector slots 101 are regularly provided at the rear end of the PCB fixture 1 at the positions of the plurality of connectors at the rear end of the PCB board, and a plurality of connectors 21 are regularly mounted in the connector slots at the rear end of the PCB fixture.

[0044] Further, such as Figure 8 As shown, the spring probe 5 includes a needle tube 501 , and a test needle 502 and a connecting needle 503 arranged at the front and rear ends of the needle tube 501 .

[0045] Furthermore, the test needle 502 is elastically arranged at the front end of the needle tube 501 by means of a spring arranged inside the needle tube, and the connecting needle 503 can also be elastically arranged at the tail end of the needle tube 502 by means of a spring. Among them, the elastic setting of the test needle body 502 can, on the one hand, cope with the test work of uneven wafers, so that the test needle at the front end of each spring probe can contact the test pad of each Die on the wafer, and realize the synchronous needle aging test of all Dies on the wafer, which greatly improves the test efficiency; on the other hand, it can ensure the stability and accuracy of the test results. Through the leveling of the machine, the test needles of several spring probes can be aligned with the test pad of each Die on the wafer, ensuring the consistency of the contact resistance of the test point. Moreover, because the ceramic vertical probe card can remain stable due to the fixed structure during the test process, the stability of several spring probes inside it is ensured, thereby ensuring the stability of the test results.

[0046] Similarly, by elastically setting the connecting needle 503, it is possible to cope with uneven pads on the PCB board 2, thereby improving the stability and accuracy of the test results.

[0047] Furthermore, the diameters of the test needle 502 and the connecting needle 503 are smaller than the diameter of the needle tube 502 .

[0048] Preferably, in one embodiment, the length of the test needle 502 is greater than that of the connecting needle 503, so as to facilitate the distinction between the test needle and the connecting needle, and also facilitate its subsequent installation in the ceramic vertical needle card 3, thereby improving the installation efficiency and avoiding the reverse installation of the test needle body and the connecting needle.

[0049] Furthermore, the test needle 502 extends out of the lower surface of the ceramic vertical needle card 3 to electrically contact the pad on the wafer, and the connection needle 503 extends out of the upper surface of the ceramic vertical needle card 3 to electrically contact the pad on the PCB board 2 .

[0050] Furthermore, several pads on the PCB board 2 are electrically connected to the pin pads of the connector 21 by setting the traces on the PCB board, thereby realizing the electrical connection between the spring probe, the PCB board and the connector. The subsequent connector communicates with the computer through a signal cable, thereby transmitting the test signal to the computer for the system software to calculate and analyze the test data.

[0051] like Figure 4-Figure 7 , which is a specific structural diagram of a ceramic vertical needle card 3. The ceramic vertical needle card 3 includes a substrate 31 and a needle carrier plate 32. Among them, a needle carrier plate slot 3101 is opened at the upper end of the substrate 31 along the shape of the needle carrier plate 32. The needle carrier plate 32 is regularly installed in the needle carrier plate slot 3101 at the upper end of the substrate, and is fixed together with the substrate 31 by fasteners to form a whole, that is, a ceramic vertical needle card (socket).

[0052] Further, such as Figure 7 As shown, a plurality of probe card slots 33 for installing spring probes 5 are regularly arranged at the same position on the upper end of the substrate 31 and the lower end of the needle carrier plate 32 in a one-to-one correspondence. Figure 7 and Figure 8 As shown, the upper and lower ends of the probe card slot 33 are respectively provided with an upper pinhole 3301 and a lower pinhole 3302 for conveniently passing the connection needle 503 and the test needle 502 .

[0053] Furthermore, the upper pinhole 3301 passes through the needle carrier plate 32, and its opening is regularly arranged along the shape and diameter of the connecting needle 503; the lower pinhole 3302 passes through the substrate 31, and its opening is regularly arranged along the shape and diameter of the test needle 502; the shape and diameter of the probe card slot 33 are regularly arranged along the needle tube 502, so that the spring probe 5 can be stably installed and fixed in the ceramic vertical needle card 3.

[0054] Furthermore, the diameters of the upper pinhole 3301 and the lower pinhole 3302 are both smaller than the diameter of the probe card slot 33 .

[0055] Furthermore, the needle carrier plate 32 adopts a polygonal design, thereby realizing a fool-proof design, ensuring that the needle carrier plate can be smoothly installed in the card slot at the upper end of the substrate and ensuring that it matches the substrate, so that a plurality of spring probes can be smoothly installed in the probe card slot between the substrate and the needle carrier plate, thereby improving the assembly efficiency of a plurality of spring probes 5 and the ceramic vertical needle card 3.

[0056] like Figure 2As shown, in order to facilitate the removal of the PCB fixture 1, the upper surface of the PCB fixture 1 is also regularly provided with handles 11. In one embodiment, the handles 11 are provided on both sides of the upper surface of the PCB fixture 1, so as to facilitate the experimenter to hold and remove it with both hands.

[0057] like Figure 1-Figure 9 As shown, a plurality of observation holes 6 are provided at the same positions on the PCB fixture 1, the PCB board 2 and the ceramic vertical needle card 3. The observation holes 6 penetrate the PCB fixture, the PCB board and the ceramic vertical needle card 3, so that it is convenient for a microscope to view the needle test in the inner cavity of the probe station through the observation holes 6, and to realize the alignment of the wafer to be tested and the ceramic vertical needle card (i.e., the alignment of the spring probe and the pad).

[0058] Furthermore, a transparent baffle is regularly installed and fixed on the upper surface or the lower surface of the PCB fixture 1. Preferably, the transparent baffle is arranged on the lower side of the PCB fixture. A cross mark for assisting alignment is regularly arranged at the center position of a single observation hole 6 on the transparent baffle. The alignment of the wafer to be tested and the ceramic vertical pin card can be achieved through the microscope and the cross mark on the transparent baffle. The alignment principle is as follows:

[0059] First, position the microscope of the probe station and move the microscope so that the center of the microscope's field of view is focused and aligned with the center of the cross mark. Then, focus the microscope on the sample, clearly observe the test points on the sample surface, and move the cross mark to align with the puncture point (pad) of a certain Die, recorded as point A. Because the relative position of the spring probe corresponding to the cross mark and point A is fixed, move it in the opposite direction from point A to the position corresponding to the cross mark, so that the cross mark corresponds to the corresponding position on the wafer, and the puncture points are aligned at the same time. For example: the spring probe corresponding to point A is 300μm to the east of the cross mark. After aligning the cross mark to the puncture point of point A, move the cross mark 300μm to the west. At this time, the spring needle corresponding to point A is aligned with the puncture point, and the cross mark is aligned with its corresponding position on the wafer. All spring probes correspond to the puncture points of the sample.

[0060] Furthermore, at least two observation holes 6 are provided, one for aligning the spring probe with the pad, and the other for observing and recording the process of the needle piercing test.

[0061] Furthermore, a plurality of observation holes 6 are closed and a plurality of spring probes are provided.

[0062] Preferably, in one embodiment, the transparent baffle is made of transparent glass, preferably high temperature resistant quartz glass. In other embodiments, a plastic baffle with high light transmittance and high temperature resistance can be used.

[0063] like Figure 1 and Fig. 9As shown, the PCB board 2 is fixed to the lower surface of the PCB fixture 1 by screws, the ceramic vertical pin card 3 is fixed to the lower surface of the PCB board 2 by screws, and is electrically connected to several pads on the lower surface of the PCB board 2 by connecting needles at the tail ends of several spring probes, thereby forming a socket-PCB-PCB fixture three-layer probe card structure. The PCB fixture 1 is fixed to the opening of the probe station table 4 by screws, and the opening is covered and sealed, thereby cooperating with the probe station to form the probe card and probe station test system of the present invention.

[0064] The above specific embodiments further illustrate the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A probe card and probe station system for semiconductor aging test, characterized in that: The invention comprises a PCB fixture (1), a PCB board (2), a vertical needle card (3) and a probe station; a plurality of spring probes (5) are regularly arranged and installed in the vertical needle card (3); the vertical needle card (3) is fixed on the lower surface of the PCB board (2); the PCB board (2) is fixed on the lower surface of the PCB fixture (1), thereby forming a three-layer probe card structure; the PCB fixture (1) is arranged and installed on the table of the probe and covers the opening on the table of the probe station, so that the PCB board (2) and the vertical needle card (3) are sealed and arranged in the inner cavity of the probe station, thereby forming the probe card and probe station system; The spring probe (5) comprises a needle tube (501), and a test needle (502) and a connection needle (503) elastically arranged at the front and rear ends of the needle tube (501); the test needle (502) passes through the lower surface of the vertical needle card (3) and is used to electrically contact the pad on the wafer to be tested; the connection needle (503) passes through the upper surface of the vertical needle card (3) and is used to electrically contact the pad arranged on the PCB board (2); A plurality of connectors (21) are regularly arranged on the PCB board (2), and the plurality of connectors (21) are regularly electrically connected to the spring probes (5) through wiring, pads and the connecting needles (503) arranged on the PCB board (2).

2. A probe card and probe station system for semiconductor aging test according to claim 1, characterized in that: The vertical needle clamp (3) comprises a base plate (31) and a needle carrier plate (32); a needle carrier plate (32) clamping slot is arranged on the base plate (31) along the shape of the needle carrier plate (32); the needle carrier plate (32) is fixed in the needle carrier plate (32) clamping slot by means of fasteners, and together with the base plate (31) forms a whole.

3. A probe card and probe station system for semiconductor aging test according to claim 2, characterized in that: A plurality of probe card slots for installing the spring probes (5) are regularly arranged at the same positions on the contact surfaces of the substrate (31) and the needle carrier plate (32), and the upper and lower ends of the probe card slots are respectively provided with an upper pinhole and a lower pinhole for facilitating the passage of the connecting needle (503) and the test needle body.

4. A probe card and probe station system for semiconductor aging test according to claim 3, characterized in that: The upper pinhole passes through the needle-carrying plate (32), and its opening is regularly arranged along the shape and diameter of the connecting needle (503); the lower pinhole passes through the base plate (31), and its opening is regularly arranged along the shape and diameter of the test needle (502); and the probe card slot is arranged along the shape and diameter of the needle tube (501).

5. The probe card and probe station system for semiconductor aging test according to claim 1, characterized in that: The diameters of the test needle (502) and the connecting needle (503) are smaller than the diameter of the needle tube (501).

6. The probe card and probe station system for semiconductor aging test according to claim 1, characterized in that: The length of the testing needle (502) is greater than the length of the connecting needle (503).

7. The probe card and probe station system for semiconductor aging test according to claim 1, characterized in that: The upper surface of the PCB clamp (1) is regularly provided with a handle for easy extraction.

8. A probe card and probe station system for semiconductor aging test according to any one of claims 1 to 7, characterized in that: A plurality of observation holes (6) are arranged one by one at the same positions on the PCB fixture (1), the PCB board (2) and the vertical needle card (3), and the plurality of observation holes (6) sequentially penetrate the PCB fixture (1), the PCB board (2) and the vertical needle card (3), so that it is convenient for a microscope to observe and record the needle test conditions in the inner cavity of the probe station through the observation holes (6), and to realize the alignment of the wafer to be tested and the vertical needle card (3).

9. A probe card and probe station system for semiconductor aging test according to claim 8, characterized in that: A transparent baffle is regularly mounted and fixed on the upper surface or the lower surface of the PCB fixture (1), and a cross mark for assisting alignment is regularly arranged at the center position of a certain observation hole (6) on the transparent baffle.

10. The probe card and probe station system for semiconductor aging test according to claim 9, characterized in that: The transparent baffle is a transparent glass baffle.

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