Model parameter optimization method and device of optical model, storage medium and product

Abstract

The invention discloses a model parameter optimization method and device for an optical model, a storage medium and a product. The method comprises the steps that a layout file corresponding to a to-be-tested graph is constructed based on preset model parameters of the optical model; executing optical proximity correction and photoetching rule check based on the layout file to obtain a corresponding check result; under the condition that the inspection result does not meet the detection passing condition, adjusting model parameters of the optical model according to the inspection result to obtain adjusted model parameters; and constructing a layout file corresponding to the to-be-tested graph by utilizing the adjusted model parameters, and returning to execute optical proximity correction and photoetching rule inspection based on the layout file until an inspection result meets a detection passing condition. According to the method and the device, the model parameters can be iteratively optimized based on the inspection results of the OPC and the LRC, the problem that the layout subjected to adaptive adjustment of the optical model is difficult to correct and optimize in the OPC process is solved, and the layout adjustment efficiency, the tape-out efficiency and the yield are improved.

Description

Technical Field

[0001] The present application relates to the field of photolithography technology, and in particular to a method, device, storage medium and product for optimizing model parameters of an optical model. Background Art

[0002] In the integrated circuit design process, the layout designed by EDA software needs to be adapted and adjusted through the optical model, and after the corresponding layout file is generated, OPC (Optical Proximity Correction) and LRC (Lithographic Rule Check) are performed in sequence.

[0003] OPC can adjust the edges of the pattern on the mask or add additional polygons to improve the impact of OPE (Optical Proximity Effect). After completing OPC, the corrected layout can be checked through LRC to find possible layout errors after OPC and reduce the risk of device failure in the later production process.

[0004] In the related art, the layout file adjusted by the optical model may need a lot of adjustments during the OPC process before it can pass the LRC. There is even a problem that OPC is difficult to optimize the layout file, which seriously affects the chip tape-out efficiency. Summary of the invention

[0005] The embodiments of the present application provide a method, device, storage medium and product for optimizing the model parameters of an optical model, which can improve the technical problem in the related art that the layout file adjusted by the optical model is difficult to optimize during the OPC process.

[0006] In a first aspect, an embodiment of the present application provides a method for optimizing model parameters of an optical model, the method comprising:

[0007] Constructing a layout file corresponding to the graphics to be tested based on preset model parameters of the optical model;

[0008] Perform optical proximity correction and lithography rule check based on the layout file to obtain corresponding inspection results;

[0009] When the inspection result does not meet the inspection pass condition, the model parameters of the optical model are adjusted according to the inspection result to obtain adjusted model parameters;

[0010] The adjusted model parameters are used to construct a layout file corresponding to the graphics to be tested, and the process returns to the step of performing optical proximity correction and lithography rule check based on the layout file until the check result meets the test pass condition.

[0011] Optionally, optical proximity correction and lithography rule check are performed based on the layout file to obtain corresponding check results, including:

[0012] Performing optical proximity correction on the layout file to obtain a corrected layout file;

[0013] Perform a lithography rule check on the corrected layout file to obtain corresponding inspection results.

[0014] Optionally, constructing a layout file corresponding to the graphic to be tested based on preset model parameters of the optical model includes:

[0015] Get the graphics to be tested;

[0016] In the case that there are one or more graphics to be tested, a layout file corresponding to each graphic to be tested is constructed based on the model parameters of the optical model.

[0017] Optionally, constructing a layout file corresponding to the graphic to be tested based on preset model parameters of the optical model includes:

[0018] Get the graphics to be tested;

[0019] In the case that there are multiple graphics to be tested, a layout file including at least two graphics to be tested is constructed based on the model parameters of the optical model.

[0020] Optionally, when the inspection result does not meet the inspection pass condition, the model parameters of the optical model are adjusted according to the inspection result to obtain the adjusted model parameters, including:

[0021] Filter out target inspection results that fail the lithography rule inspection from the inspection results corresponding to the layout file;

[0022] Determine a corresponding target graphic based on the target inspection result;

[0023] Based on the target inspection result and the target image, the model parameters of the optical model are adjusted to obtain adjusted model parameters.

[0024] Optionally, based on the target image, adjusting the model parameters of the optical model to obtain the adjusted model parameters includes:

[0025] Iteratively adjusting a portion of model parameters of the optical model based on the target inspection result and the target graphics;

[0026] In response to the adjustment instruction triggered by the user, another part of the model parameters of the optical model is adjusted.

[0027] Optionally, the graphics to be tested include general graphics and / or special graphics provided by a user.

[0028] In a second aspect, an embodiment of the present application provides an electronic device, the electronic device comprising:

[0029] a processor and a memory storing computer program instructions;

[0030] When the processor executes the computer program instructions, the steps of the method for optimizing the model parameters of the optical model in the above aspect are implemented.

[0031] In a third aspect, an embodiment of the present application provides a computer-readable storage medium having computer program instructions stored thereon, which, when executed by a processor, implement the steps of the model parameter optimization method of the optical model in the above aspect.

[0032] In a fourth aspect, an embodiment of the present application provides a computer program product, which includes a computer program. When the instructions in the computer program product are executed by a processor, the steps of the model parameter optimization method of the optical model in the above aspect are implemented.

[0033] The model parameter optimization method, device, storage medium and product of the optical model of the embodiment of the present application can construct a layout file corresponding to the graphics to be tested based on the preset model parameters of the optical model, and after performing optical proximity correction and lithography rule check on the layout file, the corresponding inspection result can be obtained. If the inspection result does not meet the detection pass condition, the model parameters are adjusted based on the inspection result, the layout file is reconstructed by the adjusted model parameters, and the steps of optical proximity correction and lithography rule check are continued to be performed on the reconstructed layout file. By simulating the inspection results after optical proximity correction and lithography rule check in the optimization process of the model parameters, the model parameters can be iteratively optimized based on the inspection results, so that the optimization of the model parameters can be realized in a timely and effective manner. After the layout file is adjusted by the optical model optimized in the above manner, it can effectively avoid the situation that the layout file is difficult to optimize in the subsequent optical proximity correction process, improve the adaptation adjustment efficiency of the layout file, and further improve the tape-out efficiency and yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0035] Figure 1 It is a flow chart of a method for optimizing model parameters of an optical model provided in one embodiment of the present application;

[0036] Figure 2is a flow chart of a method for optimizing model parameters of an optical model provided by another embodiment of the present application;

[0037] Figure 3 is a flow chart of a method for optimizing model parameters of an optical model provided by another embodiment of the present application;

[0038] Figure 4 is a flow chart of a method for optimizing model parameters of an optical model provided in yet another embodiment of the present application;

[0039] Figure 5 It is a structural schematic diagram of a model parameter optimization device for an optical model provided in one embodiment of the present application;

[0040] Figure 6 It is a schematic diagram of the structure of an electronic device provided in one embodiment of the present application. DETAILED DESCRIPTION

[0041] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0042] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0043] In the integrated circuit design process, the layout designed by EDA software needs to be adapted and adjusted through the optical model, and after the corresponding layout file is generated, OPC (Optical Proximity Correction) and LRC (Lithographic Rule Check) are performed in sequence.

[0044] OPC can adjust the edges of the pattern on the mask or add additional polygons to improve the impact of OPE (Optical Proximity Effect). After completing OPC, the corrected layout can be checked through LRC to find possible layout errors after OPC and reduce the risk of device failure in the later production process.

[0045] In the related art, during the OPC process, the layout file adjusted by the optical model may have the problem that OPC is difficult to optimize the layout file. Specifically, the reasons why OPC is difficult to optimize the layout file may include insufficient coverage of OPC adaptation, insufficient practical experience of OPC engineers, and insufficient physical properties presented by the model parameters of the optical model, which will eventually lead to a serious impact on the chip tape-out efficiency.

[0046] In order to solve at least one of the above technical problems, the embodiments of the present application provide a method, device, storage medium and product for optimizing model parameters of an optical model. The following first introduces the method for optimizing model parameters of an optical model provided in the embodiments of the present application.

[0047] Figure 1 A schematic flow chart of a method for optimizing model parameters of an optical model provided by an embodiment of the present application is shown. The method may include the following steps:

[0048] S110, constructing a layout file corresponding to the graphic to be tested based on preset model parameters of the optical model;

[0049] S120, performing optical proximity correction and lithography rule check based on the layout file to obtain corresponding check results;

[0050] S130, when the inspection result does not meet the inspection pass condition, adjusting the model parameters of the optical model according to the inspection result to obtain adjusted model parameters;

[0051] S140, constructing a layout file corresponding to the pattern to be tested using the adjusted model parameters, and returning to step: performing optical proximity correction and lithography rule check based on the layout file until the check result meets the test pass condition.

[0052] In the lithography process, after the mask layout of the integrated circuit is generated by the EDA software, it is necessary to adapt and adjust the layout based on the optical model, and perform optical proximity correction OPC and lithography rule check LRC steps after the adjustment. The layout after OPC correction can pass the LRC inspection before subsequent production can be carried out. Therefore, before adapting and adjusting the layout based on the optical model, it is necessary to optimize the various model parameters in the optical model so that the optimized layout can be adjusted to a layout file that can pass the LRC inspection during the OPC correction process, thereby improving the chip tape-out efficiency. Before using the optical model to adapt and adjust the layout file provided by the designer, the model parameters of the optical model can be optimized through the following implementation method. After completing the model parameter optimization, the layout file can be adapted and adjusted through the optimized optical model.

[0053] In this embodiment, based on the preset model parameters of the optical model, a layout file corresponding to the graphics to be tested can be constructed, and after the layout file is subjected to optical proximity correction and lithography rule check, the corresponding inspection result can be obtained. If the inspection result does not meet the detection pass condition, the model parameters are adjusted based on the inspection result, the layout file is reconstructed by the adjusted model parameters, and the steps of optical proximity correction and lithography rule check are continued to be performed on the reconstructed layout file. By simulating the inspection results after optical proximity correction and lithography rule check in the optimization process of the model parameters, the model parameters can be iteratively optimized based on the inspection results, so that the optimization of the model parameters can be realized in a timely and effective manner. After the layout file is adjusted by the optical model optimized in the above manner, it can effectively avoid the situation that the layout file is difficult to optimize in the subsequent optical proximity correction process, improve the adaptation adjustment efficiency of the layout file, and further improve the tape-out efficiency and yield.

[0054] The specific implementation methods of the above steps are introduced below.

[0055] In S110 , before the optical model is optimized, the user may pre-set initial model parameters, and construct a layout file corresponding to the graphics to be tested based on the preset model parameters.

[0056] As an optional implementation, the graphics to be tested may include general graphics or special graphics provided by users. For example, for different designers, the layout files corresponding to the integrated circuits involved may contain the same or similar graphics, which can be used as the general graphics in the graphics to be tested. When designing the layout file, each designer may use its own unique layout graphics, which are the special graphics unique to each designer.

[0057] It is understandable that when optimizing the model parameters of the optical model for the design style and design rules of a certain designer, the general graphics and the special graphics provided by the designer can be used as the graphics to be tested, and the optical model obtained after optimizing the graphics to be tested can be used to adapt the layout file provided by the designer. Similarly, if it is necessary to optimize the model parameters of the optical model for multiple designers, the general graphics and the special graphics provided by multiple designers can be used as the graphics to be tested.

[0058] Please refer to Figure 2 In some embodiments, the above S110 may include:

[0059] S210, obtaining a graphic to be tested;

[0060] S220 , when there are one or more graphics to be tested, construct a layout file corresponding to each graphic to be tested based on the model parameters of the optical model.

[0061] In this embodiment, when there are one or more graphics to be tested, a corresponding layout file can be constructed according to each graphic to be tested. That is, when there is one graphic to be tested, one layout file can be constructed; when there are multiple graphics to be tested, multiple layout files can be constructed.

[0062] In S210 , a graph to be tested required for model optimization may be acquired in advance.

[0063] In S220, when there are one or more graphics to be tested, a layout file corresponding to each graphic to be tested can be constructed based on the model parameters of the optical model. That is, for each graphic to be tested, a corresponding layout file is constructed. When there are multiple graphics to be tested, multiple corresponding layout files can be constructed respectively.

[0064] As an optional implementation, the layout file constructed above may be a GDS (Geometry Data Standard) file, i.e., a layout file of a Figure 2 FAB (Fabrication, chip manufacturing factory) can carry out tape-out production based on GDS files.

[0065] Please refer to Figure 3 In some embodiments, the above S110 may include:

[0066] S310, obtaining a graphic to be tested;

[0067] S320: When there are multiple graphics to be tested, construct a layout file including at least two graphics to be tested based on model parameters of the optical model.

[0068] In this embodiment, when there are multiple graphics to be tested, the layout file constructed based on the optical model may include at least two graphics to be tested. That is, the layout file may include all graphics to be tested, or may include at least two graphics to be tested. By performing optical proximity correction and lithography rule check on the layout file, the optimized optical model can be adapted to the overall layout composed of multiple graphics.

[0069] In S310 , a graph to be tested required for model optimization may be acquired in advance.

[0070] In S320, when there are multiple graphics to be tested, a layout file including at least two graphics to be tested may be constructed based on the model parameters of the optical model.

[0071] The layout file constructed above may include multiple graphics to be tested. Since there must be multiple graphics in the actual designed layout, when adapting the optical model and OPC correction of the layout, it is also necessary to consider the overall adjustment plan when there are multiple graphics. Therefore, when constructing a layout file, a layout file containing multiple graphics to be tested can be constructed.

[0072] As an optional implementation, in the above embodiment, the layout file constructed can be a layout file including all graphics to be tested, or a layout file including at least two graphics to be tested. It is also possible to construct multiple layout files, and the graphics to be tested contained in each layout file are different, which is not limited here. For example, if the graphics to be tested provided include 10, any 2 graphics to be tested can be combined and a published drawing file can be constructed, and any 3 or more graphics to be tested can be combined and a published drawing file can be constructed.

[0073] In S120, after a corresponding layout file is constructed based on the pattern to be tested by using the model parameters of the optical model, optical proximity correction and lithography rule check may be performed on the layout file respectively, and corresponding check results may be obtained.

[0074] In some embodiments, the above S120 may include:

[0075] S410, performing optical proximity correction on the layout file to obtain a corrected layout file;

[0076] S420, performing a lithography rule check on the corrected layout file to obtain a corresponding check result.

[0077] In this embodiment, after obtaining the layout file, optical proximity correction can be performed on the layout file to obtain a corrected layout file. The corrected layout file can be checked by lithography rules to obtain corresponding inspection results.

[0078] In S410, after the layout file is constructed, optical proximity correction may be performed on the layout file, and the layout file may be adapted and adjusted through the optical proximity correction to obtain a corrected layout file.

[0079] In S420, the corrected layout file can be subjected to a lithography rule check to obtain a check result corresponding to the layout file. After the lithography rule check, the check result obtained includes the check result of each area of ​​the layout file, that is, whether there is a bad pixel in each area.

[0080] In S130, after obtaining the inspection result of the layout file, it can be determined whether the inspection result meets the LRC inspection pass condition. If the LRC inspection pass condition is met, the model parameters can be considered to be optimized. If the LRC inspection pass condition is not met, the various model parameters of the optical model are adjusted according to the inspection result of the layout file to obtain adjusted model parameters.

[0081] It is understandable that the model parameters of the above optical model may include but are not limited to root mean square value RMS, grid dependence and verification result, etc., and some or all of the model parameters can be adjusted specifically according to the inspection results of the layout file.

[0082] Please refer to Figure 4 In some embodiments, the above S130 may include:

[0083] S510, screening out target inspection results that fail to pass the lithography rule inspection from the inspection results corresponding to the layout file;

[0084] S520, determining a corresponding target graphic based on the target inspection result;

[0085] S530, adjusting the model parameters of the optical model based on the target inspection result and the target pattern to obtain adjusted model parameters.

[0086] In this embodiment, after obtaining the inspection results of the layout file, the target inspection results that fail the lithography rules can be screened out, and the model parameters of the optical model can be adjusted based on the target inspection results and their corresponding target graphics to obtain an adjusted model.

[0087] In S510, after obtaining the inspection results corresponding to the layout file, the target inspection results that fail the lithography rule inspection can be screened out from the multiple inspection results. When a single layout file contains a single graphic to be tested, the multiple inspection results can be the inspection results of each layout file. When a single layout file contains multiple graphics to be tested, the multiple inspection results can be the inspection results of each area in the layout file.

[0088] In S520, after the target inspection results are screened out, the corresponding target graphics may be determined according to the target inspection results.

[0089] In S530, after determining the target pattern that affects the lithography rule inspection, the model parameters of the optical model may be adjusted based on the target inspection result and the target pattern to obtain adjusted model parameters.

[0090] In some embodiments, the above S530 may include:

[0091] S610, iteratively adjusting a portion of model parameters of the optical model based on the target inspection result and the target image;

[0092] S620: In response to the adjustment instruction triggered by the user, another part of the model parameters of the optical model is adjusted.

[0093] In this embodiment, when adjusting the model parameters of the optical model, some model parameters can be automatically adjusted iteratively by software, while other model parameters can be manually adjusted by engineers based on the inspection results of the lithography rule inspection, triggering adjustment instructions.

[0094] In S610, when the model parameters are adjusted based on the target inspection result and the target pattern corresponding to the target inspection result, a part of the model parameters of the optical model can be automatically adjusted iteratively by the software. That is, after the previous adjustment, when the pattern to be tested affected by the part of the model parameters still fails to pass the lithography rule inspection, the part of the model parameters continues to be iteratively adjusted.

[0095] In S620, another part of the model parameters in the optical model needs to be adjusted by the engineer through triggering an adjustment instruction after studying the inspection result and the corresponding graphics to be tested. When the adjustment instruction triggered by the user is received, the part of the model parameters can be adjusted according to the adjustment instruction.

[0096] In S140, after obtaining the adjusted model parameters, the adjusted model parameters can be used to reconstruct the layout file corresponding to the graphic to be tested, and return to the above-mentioned steps of performing optical proximity correction and lithography rule check on the layout file, and perform optical proximity correction and lithography rule check on the layout file generated by the new model parameters in turn.

[0097] In the process of continuously iteratively adjusting the model parameters, if the layout file constructed by the adjusted model parameters at a certain time meets the inspection pass conditions in the lithography rule inspection after optical proximity correction, it can be determined that the model parameter optimization is completed. At this time, the adjusted model parameters are the model parameters of the optimized optical model.

[0098] It is understandable that after obtaining the model parameters after the optical model is optimized, the optimized optical model can be used to make corresponding adaptation adjustments to the actual layout file provided by the designer. The layout file adjusted by the optimized optical model can more easily pass the lithography rule check after the optical proximity correction, thereby improving the adaptation efficiency of the layout file and the final tape-out efficiency.

[0099] Based on the same inventive concept, the present application also provides a model parameter optimization device for an optical model. Figure 5 Provide detailed explanation.

[0100] Figure 5 It is a structural schematic diagram of a model parameter optimization device 500 for an optical model provided in an embodiment of the present application.

[0101] like Figure 5 As shown, the model parameter optimization device 500 of the optical model may include:

[0102] A construction module 501 is used to construct a layout file corresponding to the graphic to be tested based on preset model parameters of the optical model;

[0103] The inspection module 502 is used to perform optical proximity correction and lithography rule inspection based on the layout file to obtain corresponding inspection results;

[0104] An adjustment module 503, used to adjust the model parameters of the optical model according to the inspection result to obtain adjusted model parameters when the inspection result does not meet the inspection pass condition;

[0105] The loop module 504 is used to construct a layout file corresponding to the pattern to be tested by using the adjusted model parameters, and return to the step of performing optical proximity correction and lithography rule check based on the layout file until the check result meets the test pass condition.

[0106] Figure 6 The hardware structure diagram of the electronic device provided in the embodiment of the present application is shown. The electronic device can be at least one of a computer, a server and a document generation dedicated device. The electronic device includes a processor 601 and a memory 602 storing computer program instructions.

[0107] Specifically, the processor 601 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0108] The memory 602 may include a large capacity memory for data or instructions. By way of example and not limitation, the memory 602 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive or a combination of two or more of these. Where appropriate, the memory 602 may include a removable or non-removable (or fixed) medium. Where appropriate, the memory 602 may be inside or outside the electronic device. In a particular embodiment, the memory 602 is a non-volatile solid-state memory.

[0109] The memory 602 may include a read-only memory (ROM), a flash memory device, a random access memory (RAM), a magnetic disk storage medium device, an optical storage medium device, an electrical, optical or other physical / tangible memory storage device. Thus, typically, the memory 602 includes a tangible (non-transitory) computer-readable storage medium (e.g., a memory device) of one or more software that may be encoded with computer-executable instructions and that, when executed (e.g., by one or more processors), is operable to perform the operations described with reference to the methods according to the above aspects of the present disclosure.

[0110] The processor 601 reads and executes computer program instructions stored in the memory 602 to implement any one of the optical model parameter optimization methods in the above embodiments.

[0111] In one example, the electronic device may further include a communication interface 603 and a bus 610. Figure 6 As shown, the processor 601, the memory 602, and the communication interface 603 are connected via a bus 610 and communicate with each other.

[0112] The communication interface 603 is mainly used to implement communication between various modules, devices, units and / or equipment in the embodiments of the present application.

[0113] Bus 610 includes hardware, software or both, and the parts of electronic equipment are coupled to each other. For example, but not limitation, bus may include accelerated graphics port (AGP) or other graphics bus, enhanced industrial standard architecture (EISA) bus, front side bus (FSB), hypertransport (HT) interconnection, industrial standard architecture (ISA) bus, infinite bandwidth interconnection, low pin count (LPC) bus, memory bus, micro channel architecture (MCA) bus, peripheral component interconnection (PCI) bus, PCI-Express (PCI-X) bus, serial advanced technology attachment (SATA) bus, video electronics standard association local (VLB) bus or other suitable bus or two or more of these combinations. In appropriate cases, bus 610 may include one or more buses. Although the present application embodiment describes and shows a specific bus, the application considers any suitable bus or interconnection.

[0114] The electronic device can be based on the model parameter optimization method of the optical model to achieve the combination Figures 1 to 5 A method and apparatus for optimizing model parameters of an optical model are described.

[0115] In addition, in combination with the model parameter optimization method of the optical model in the above embodiment, the embodiment of the present application can provide a computer storage medium for implementation. The computer storage medium stores computer program instructions; when the computer program instructions are executed by the processor, the model parameter optimization method of any optical model in the above embodiment is implemented.

[0116] In addition, an embodiment of the present application further provides a computer program product, including a computer program, which can implement the steps and corresponding contents of the aforementioned method embodiment when executed by a processor.

[0117] In addition, the term "and / or" in this article is only a description of the association relationship between the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0118] It should be understood that in the embodiment of the present application, "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0119] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A method for optimizing model parameters of an optical model, characterized in that: include: Constructing a layout file corresponding to the graphics to be tested based on preset model parameters of the optical model; Perform optical proximity correction and lithography rule check based on the layout file to obtain corresponding inspection results; In the case where the inspection result does not satisfy the inspection pass condition, adjusting the model parameters of the optical model according to the inspection result to obtain adjusted model parameters; The adjusted model parameters are used to construct a layout file corresponding to the pattern to be tested, and the process returns to the step of performing optical proximity correction and lithography rule check based on the layout file until the check result meets the detection pass condition.

2. The method for optimizing model parameters of an optical model according to claim 1, characterized in that: The performing of optical proximity correction and lithography rule checking based on the layout file to obtain corresponding inspection results includes: Performing optical proximity correction on the layout file to obtain a corrected layout file; Perform a lithography rule check on the corrected layout file to obtain corresponding inspection results.

3. The method for optimizing model parameters of an optical model according to claim 2, characterized in that: The method of constructing a layout file corresponding to the graphics to be tested based on preset model parameters of the optical model includes: Get the graphics to be tested; In the case that there are one or more graphics to be tested, a layout file corresponding to each graphic to be tested is constructed based on the model parameters of the optical model.

4. The method for optimizing model parameters of an optical model according to claim 2, characterized in that: The method of constructing a layout file corresponding to the graphics to be tested based on preset model parameters of the optical model includes: Get the graphics to be tested; In the case that there are multiple graphics to be tested, a layout file including at least two graphics to be tested is constructed based on the model parameters of the optical model.

5. The method for optimizing model parameters of an optical model according to claim 3 or 4, characterized in that: When the inspection result does not meet the inspection pass condition, adjusting the model parameters of the optical model according to the inspection result to obtain the adjusted model parameters includes: Filter out target inspection results that fail the lithography rule inspection from the inspection results corresponding to the layout file; Determine a corresponding target graphic based on the target inspection result; Based on the target inspection result and the target pattern, model parameters of the optical model are adjusted to obtain adjusted model parameters.

6. The method for optimizing model parameters of an optical model according to claim 5, characterized in that: The step of adjusting the model parameters of the optical model based on the target pattern to obtain the adjusted model parameters comprises: Iteratively adjusting a portion of model parameters of the optical model based on the target inspection result and the target pattern; In response to an adjustment instruction triggered by a user, another part of model parameters of the optical model is adjusted.

7. The method for optimizing model parameters of an optical model according to claim 1, characterized in that: The graphics to be tested include general graphics and / or special graphics provided by users.

8. An electronic device, characterized in that: include: a processor and a memory storing computer program instructions; When the processor executes the computer program instructions, the processor implements the steps of the model parameter optimization method of the optical model as described in any one of claims 1-7.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer program instructions, which, when executed by a processor, implement the steps of the method for optimizing model parameters of an optical model as described in any one of claims 1 to 7.

10. A computer program product, characterized in that When the instructions in the computer program product are executed by a processor, the steps of the method for optimizing the model parameters of the optical model as described in any one of claims 1 to 7 are implemented.

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