Server and data center

Abstract

The invention relates to the technical field of servers, and discloses a server and a data center, the server comprises a server case, a first heat dissipation assembly and a refrigeration sheet, the server case is internally provided with a front function module and a rear function module, and the front function module and the rear function module are sequentially arranged along a first direction; the first heat dissipation assembly is arranged in the server case and comprises first heat dissipation fins and a first fan module, and the first heat dissipation fins and the first fan module are sequentially arranged between the front function module and the rear function module in the first direction; the refrigeration sheet is arranged on the side wall, in the second direction, of the server case and comprises a cold end and a hot end, and the cold end abuts against the first cooling fin; the second direction is perpendicular to the first direction, an internal cold source is provided for the server, the temperature in a server case is effectively reduced, and a continuous and stable low-temperature environment is provided for a rear functional module; and the heat dissipation efficiency in the server case is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of servers, and in particular to servers and data centers. Background Art

[0002] In order to improve the maximum specification support, the front and back of the server are filled with various functional modules to facilitate direct front and back maintenance or connection. At present, the server usually adopts a front air intake design. The cold air enters from the front of the server, is accelerated by the internal high-efficiency fan system, passes through the internal components of the server, and the hot air carrying heat is discharged from the rear end of the server, forming an air flow path from front to back. However, the hard disk component of the server is usually installed in the front of the server chassis, and high-performance modules such as the processor (CPU) and graphics processing unit (GPU) are usually set at the rear of the server chassis. This layout causes the cold air to be initially heated when it flows through the hard disk. Then, the heated air continues to flow backward to cool the high-performance modules at the rear. However, the cooling efficiency of the cold air has been significantly reduced in this process. The huge heat generated by the high-performance modules at the rear of the server chassis during high-load operation is difficult to be dissipated in a timely and effective manner, resulting in an increase in the internal temperature of the server, which in turn causes a series of problems such as reduced equipment performance, reduced stability, and even shortened life. Summary of the invention

[0003] In view of this, the present invention provides a server and a data center to solve the problem that the cooling efficiency of cold air is reduced and the huge heat generated by the high-performance module at the rear of the server chassis during high-load operation is difficult to be dissipated promptly and effectively.

[0004] In a first aspect, the present invention provides a server, comprising a server chassis, a first heat dissipation component and a cooling fin: a front functional module and a rear functional module are provided inside the server chassis, and the front functional module and the rear functional module are arranged sequentially along a first direction; the first heat dissipation component is arranged inside the server chassis, comprising a first heat sink and a first fan module, and the first heat sink and the first fan module are arranged sequentially between the front functional module and the rear functional module along the first direction; a cooling fin is arranged on a side wall of the server chassis along a second direction, comprising a cold end and a hot end, and the cold end is abutted against the first heat sink; the second direction is perpendicular to the first direction.

[0005] Beneficial effect: The first heat sink can absorb the heat in the surrounding air by exchanging heat with the surrounding air. The first heat sink is in contact with the cold end of the refrigeration plate, which ensures that the heat of the first heat sink can be efficiently transferred to the refrigeration plate. According to the principle of thermoelectric effect, the refrigeration plate transfers the heat accumulated at the cold end to its hot end. Since the refrigeration plate is arranged on the side wall of the server chassis, the heat can be discharged from the inside of the server chassis, which significantly reduces the heat load inside the server chassis and optimizes the internal thermal environment. Moreover, under the continuous action of the thermoelectric effect, the cold end can be maintained in a stable low-temperature state, thereby constructing an internal cold source for the server. Since the first heat sink is in contact with the refrigeration plate, the heat of the first heat sink is effectively reduced. The direct contact of the cold end of the cold plate can effectively reduce the temperature of the first heat sink through heat conduction; then the first heat sink exchanges heat with the surrounding air to reduce the temperature of the surrounding air; and because the first heat sink and the first fan module are arranged in sequence along the first direction, it is ensured that the cold air after cooling by the first heat sink can flow to the rear functional module in a directed and smooth manner, providing the rear functional module with a continuous cooling air flow with appropriate temperature, thereby ensuring that the rear functional module operates stably and efficiently in a low temperature environment; it not only improves the heat dissipation efficiency inside the server chassis, but also significantly enhances the overall heat dissipation performance, providing a guarantee for the stable operation of the server.

[0006] In an optional embodiment, a second heat dissipation component is further included, which is arranged on the outside of the server chassis and abuts against the hot end, and is suitable for dissipating heat from the hot end.

[0007] Beneficial effect: By setting up a second heat dissipation component, the rate and efficiency of heat discharge from the hot end of the refrigeration plate are significantly enhanced, ensuring that the hot end of the refrigeration plate can effectively and quickly release the accumulated heat during continuous operation, thereby maintaining the overall cooling efficiency of the refrigeration plate in an optimal state, ensuring that the refrigeration plate can work stably and efficiently for a long time, providing a continuous and reliable low-temperature environment inside the server chassis, and ensuring the efficient operation of the overall heat dissipation structure and the stability of server operation.

[0008] In an optional embodiment, the second heat dissipation assembly includes a second heat sink, which is disposed on the outside of the server chassis and abuts against the hot end.

[0009] Beneficial effect: By setting the second heat sink to abut the hot end of the refrigeration fin, it is ensured that the heat accumulated at the hot end of the refrigeration fin can be quickly and effectively transferred to the second heat sink; the second heat sink uses its large surface area to exchange heat with the external environment, thereby efficiently dissipating the heat, effectively maintaining the temperature of the hot end of the refrigeration fin within a controllable range, thereby ensuring the efficient and stable operation of the entire heat dissipation structure.

[0010] In an optional embodiment, the second heat dissipation assembly further includes a second fan module, and the second fan module is disposed adjacent to the second heat sink along the first direction.

[0011] Beneficial effect: Since the second fan module and the second heat sink are adjacent to each other along the first direction, and the second fan module can generate directional airflow, the heat exchange process between the surface of the second heat sink and the surrounding air is accelerated, thereby significantly improving the heat dissipation efficiency of the second heat sink; it not only promotes the rapid release of heat by the second heat sink, but also ensures the smooth and efficient flow of heat in the entire heat dissipation structure, thereby ensuring the stable operation of the server.

[0012] In an optional implementation, the air inlet of the second fan module is suitable for being arranged on one side of the cabinet opening.

[0013] Beneficial effects: By setting the air inlet of the second fan module on one side of the cabinet opening, cold air is attracted from the front of the cabinet and the heat source is discharged to the back of the cabinet, which is consistent with the airflow direction of the server; the heat generated during the operation of the server is effectively directed to the back of the cabinet, thereby achieving directional discharge of the heat source; it not only complies with the directional principle of the natural flow of airflow inside the server, but also significantly improves the overall heat dissipation efficiency and thermal management capabilities of the cabinet; it also helps to maintain the uniformity of temperature inside the cabinet, reduce the formation of hot spots, and provide a more stable and reliable working environment for the server.

[0014] In an optional embodiment, the refrigeration fin, the first fan module and the second fan module are all suitable for connecting to a control system of a server, and the control system controls the power of the refrigeration fin, the first fan module and the second fan module according to temperature data inside the server.

[0015] Beneficial effects: Since the cooling plate, the first fan module and the second fan module are all connected to the control system of the server, the control system can control the activation status of the cooling plate, the first fan module and the second fan module, and can also automatically adjust the rotation speed of the first fan module and the second fan module and the power of the cooling plate according to the real-time monitoring data of the internal temperature of the server chassis to achieve the best heat dissipation effect; through the automatic adjustment function of the control system, it is ensured that when the server is facing high-load operation, it can respond quickly and provide sufficient cooling support, effectively prevent the temperature from rising, and ensure the stable operation of the server; at the same time, when the server load is low, the intelligent control system can intelligently reduce the power output of the cooling plate, the first fan module and the second fan module, which not only effectively reduces the equipment operation noise, but also reduces unnecessary energy consumption, and achieves while improving the heat dissipation efficiency and ensuring the stability of the system, it also takes into account the environmental protection needs of energy saving and emission reduction.

[0016] In an optional embodiment, the cooling fins are provided with one or more. When the cooling fins are provided with one, the cooling fin is arranged on a side wall of the server chassis along the second direction; the first heat sink is provided with a group and abuts against the cold end of the cooling fin; and the first fan module and the first heat sink are provided in sequence along the first direction; the second heat dissipation assembly is provided with a group and abuts against the hot end of the cooling fin; when the cooling fins are provided with two, the two cooling fins are respectively arranged on two side walls of the server chassis along the second direction opposite to each other; the first heat sink is provided with two groups, the two groups of the first heat sinks are respectively abutted against the cold ends of the two cooling fins; and the two groups of the first heat sinks are spaced apart along the second direction The first fan module and the first heat sink are arranged in sequence along the first direction; the second heat sink assembly is provided with two groups, and the two groups of the second heat sink assemblies are respectively abutted against the hot ends of the two cooling fins; when there are multiple cooling fins, one or more cooling fins are respectively provided on the two side walls of the server chassis along the second direction, and the multiple cooling fins are arranged at intervals along the first direction; the first heat sink is provided with multiple groups, and the cold end of each cooling fin is abutted against a group of the first heat sink; the first fan module is located between two adjacent groups of the first heat sinks arranged along the first direction; the second heat sink assembly is provided with multiple groups, and the hot end of each cooling fin is abutted against a group of the second heat sink assemblies.

[0017] Beneficial effect: By setting one or more cooling fins, and different numbers of cooling fins and the positional relationship between the first heat dissipation component and the second heat dissipation component, the modularity and scalability of the heat dissipation structure are achieved, the flexibility and versatility of the heat dissipation structure are improved, and it is ensured that the heat dissipation structure can effectively serve servers with different specifications, configurations and performance requirements.

[0018] In a second aspect, the present invention further provides a data center, comprising a cabinet and the above-mentioned server, wherein the above-mentioned server is slidably connected in the cabinet.

[0019] Beneficial effect: Since the data center includes a server, it has the same effect as the server and will not be described in detail here.

[0020] In an optional embodiment, it also includes a sliding structure and a heat dissipation rail; the server chassis is slidably connected to the cabinet through the sliding structure; the heat dissipation rail and the sliding structure are arranged in sequence along a third direction and are fixedly connected to the cabinet; the third direction is perpendicular to the first direction and the second direction in pairs; the second heat dissipation component of the server is fixedly connected to the heat dissipation rail.

[0021] Beneficial effects: By arranging a heat dissipation rail above the sliding structure, on the one hand, efficient heat conduction is promoted, effectively alleviating the problem of heat accumulation when the server system is running at high load; on the other hand, the heat dissipation rail is used as the installation base of the second heat dissipation component, thereby achieving a stable installation of the second heat dissipation component and improving the utilization efficiency of the space above the sliding structure, converting the space that may have been idle into a functional heat dissipation area, thereby optimizing the spatial layout.

[0022] In an optional implementation, a spring terminal is further included, and the second heat dissipation component is electrically connected to the server via the spring terminal.

[0023] Beneficial effect: The electrical connection between the second heat dissipation component and the server is achieved through the spring terminal. Due to the elasticity of the spring terminal, it ensures that the electrical connection between the second heat dissipation component and the server can maintain a high degree of stability even during dynamic operations such as moving, pulling out or adjusting the server, effectively avoiding the loosening or disconnection problems that are prone to occur in traditional fixed connection methods in dynamic environments. The continuous effectiveness of the electrical connection can be maintained without complicated disassembly and assembly steps. It not only greatly improves the maintenance convenience and operating efficiency of the server, reduces the workload and time cost of maintenance personnel, but also significantly reduces the risk of faults such as poor electrical connection and short circuit caused by the disassembly and assembly process, further enhancing the overall reliability and stability of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the related technologies, the drawings required for use in the specific embodiments or the related technical descriptions will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 A front view of a server according to an embodiment of the present invention;

[0026] Figure 2 An exploded view of a server according to an embodiment of the present invention;

[0027] Figure 3 for Figure 2 A is a partial enlarged schematic diagram;

[0028] Figure 4 Another structural diagram of a server according to an embodiment of the present invention;

[0029] Figure 5 This is another structural diagram of a server according to an embodiment of the present invention;

[0030] Figure 6The present invention is another structural diagram of a server according to an embodiment of the present invention.

[0031] Description of reference numerals:

[0032] 1. Server chassis; 11. Mounting hole; 2. First heat dissipation component; 21. First heat sink; 22. First fan module; 23. First thermal pad; 3. Refrigeration plate; 4. Second heat dissipation component; 41. Second heat sink; 42. Second fan module; 43. Second thermal pad; 5. Sliding structure; 6. Heat dissipation rail; 61. Mounting plate; 611. Through hole; 62. Connecting plate; 7. First fan power connector; 8. Second fan power connector. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0034] In the server architecture, the hard disk is usually set at the front of the server chassis 1 as a front functional module. The original intention of this layout is to optimize the convenience of data access. However, when the hard disk reaches the full configuration state, it will inevitably block the air inlet, reducing the cold air entering the server chassis 1; on the other hand, the opening at the rear end of the server chassis 1 serves as the main channel for hot air discharge. However, due to the dense layout of rear functional modules such as expansion cards and network interface cards, the effective area of ​​the air outlet is reduced, and the air duct is not smooth, which seriously restricts the natural convection and discharge efficiency of hot air, directly leading to the problem of heat accumulation inside the server, resulting in uneven temperature distribution inside the server, and may also cause system performance degradation, reduced stability and even hardware damage due to local overheating.

[0035] Combine the following Figures 1 to 6 , describing an embodiment of the present invention.

[0036] According to an embodiment of the present invention, on the one hand, a server is provided, including a server chassis 1, a first heat dissipation component 2 and a cooling fin 3: a front functional module and a rear functional module are provided inside the server chassis 1, and the front functional module and the rear functional module are arranged in sequence along a first direction; the first heat dissipation component 2 is arranged inside the server chassis 1, including a first heat sink 21 and a first fan module 22, and the first heat sink 21 and the first fan module 22 are arranged in sequence between the front functional module and the rear functional module along the first direction; the cooling fin 3 is arranged on the side wall of the server chassis 1 along the second direction, including a cold end and a hot end, and the cold end is abutted against the first heat sink 21; the second direction is perpendicular to the first direction.

[0037] The first heat sink 21 can absorb the heat in the surrounding air by exchanging heat with the surrounding air. The first heat sink 21 is in contact with the cold end of the cooling plate 3, which ensures that the heat of the first heat sink 21 can be efficiently transferred to the cooling plate 3. According to the principle of thermoelectric effect, the cooling plate 3 transfers the heat accumulated at the cold end to its hot end. Since the cooling plate 3 is arranged on the side wall of the server chassis 1, the heat can be discharged from the inside of the server chassis 1, which significantly reduces the heat load inside the server chassis 1 and optimizes the internal thermal environment. Under the continuous action of the thermoelectric effect, the cold end can be maintained in a stable low-temperature state, thereby constructing an internal cold source for the server. The direct contact of the cold end of the sheet 3 can effectively reduce the temperature of the first heat sink 21 through heat conduction; then the first heat sink 21 exchanges heat with the surrounding air to reduce the temperature of the surrounding air; and because the first heat sink 21 and the first fan module 22 are arranged in sequence along the first direction, it is ensured that the cold air after the cooling treatment by the first heat sink 21 can flow to the rear functional module in a directed and smooth manner, providing the rear functional module with a continuous cooling air flow with appropriate temperature, thereby ensuring that the rear functional module operates stably and efficiently in a low temperature environment; not only the heat dissipation efficiency inside the server chassis 1 is improved, but also the overall heat dissipation performance is significantly enhanced, providing a guarantee for the stable operation of the server.

[0038] Specifically, a first thermal pad 23 is provided between the first heat sink 21 and the cooling fin 3 .

[0039] Specifically, the cooling fins 3 are made of semiconductor materials.

[0040] In one embodiment, a second heat dissipation component 4 is further included. The second heat dissipation component 4 is arranged on the outside of the server chassis 1 and abuts against the hot end, and is suitable for dissipating heat from the hot end.

[0041] By providing the second heat dissipation component 4, the rate and efficiency of heat discharge from the hot end of the refrigeration plate 3 are significantly enhanced, ensuring that the hot end of the refrigeration plate 3 can effectively and quickly release the accumulated heat during continuous operation, thereby maintaining the overall cooling efficiency of the refrigeration plate 3 in an optimal state, ensuring that the refrigeration plate 3 can work stably and efficiently for a long time, providing a continuous and reliable low-temperature environment for the inside of the server chassis 1, and ensuring the efficient operation of the overall heat dissipation structure and the stability of server operation.

[0042] In one embodiment, the second heat dissipation assembly 4 includes a second heat sink 41 , which is disposed on the outside of the server chassis 1 and abuts against the hot end.

[0043] By arranging the second heat sink 41 to abut the hot end of the refrigeration fin 3, it is ensured that the heat accumulated at the hot end of the refrigeration fin 3 can be quickly and effectively transferred to the second heat sink 41; the second heat sink 41 uses its larger surface area to exchange heat with the external environment, thereby efficiently dissipating the heat, effectively maintaining the temperature of the hot end of the refrigeration fin 3 within a controllable range, thereby ensuring the efficient and stable operation of the entire heat dissipation structure.

[0044] Specifically, a second thermal pad 43 is provided between the second heat sink 41 and the cooling fin 3 .

[0045] In one embodiment, the second heat dissipation assembly 4 further includes a second fan module 42 , and the second fan module 42 is disposed adjacent to the second heat dissipation fins 41 along the first direction.

[0046] Since the second fan module 42 and the second heat sink 41 are arranged adjacent to each other along the first direction, and the second fan module 42 can generate directional airflow, the heat exchange process between the surface of the second heat sink 41 and the surrounding air is accelerated, thereby significantly improving the heat dissipation efficiency of the second heat sink 41; it not only promotes the rapid release of heat by the second heat sink 41, but also ensures the smooth and efficient flow of heat in the entire heat dissipation structure, thereby ensuring the stable operation of the server.

[0047] In one embodiment, the air inlet of the second fan module 42 is suitable for being arranged at one side of the cabinet opening.

[0048] By setting the air inlet of the second fan module 42 on one side of the cabinet opening, cold air is attracted from the front of the cabinet and the heat source is discharged to the back of the cabinet, which is consistent with the airflow direction of the server; the heat generated during the operation of the server is effectively directed to the back of the cabinet, thereby realizing directional discharge of the heat source; not only does it comply with the directional principle of the natural flow of airflow inside the server, but it also significantly improves the overall heat dissipation efficiency and thermal management capabilities of the cabinet; it also helps to maintain the uniformity of the temperature inside the cabinet, reduces the formation of hot spots, and provides a more stable and reliable working environment for the server.

[0049] In one embodiment, the cooling plate 3, the first fan module 22 and the second fan module 42 are all suitable for being connected to a control system of a server, and the control system controls the power of the cooling plate 3, the first fan module 22 and the second fan module 42 according to the temperature data inside the server.

[0050] Since the cooling plate 3, the first fan module 22 and the second fan module 42 are all connected to the control system of the server, the control system can control the activation status of the cooling plate 3, the first fan module 22 and the second fan module 42, and can also automatically adjust the rotation speed of the first fan module 22 and the second fan module 42 and the power of the cooling plate 3 according to the real-time monitoring data of the internal temperature of the server chassis 1 to achieve the best heat dissipation effect; through the automatic adjustment function of the control system, it is ensured that when the server is facing high-load operation, it can respond quickly and provide sufficient cooling support, effectively prevent the temperature from rising, and ensure the stable operation of the server; at the same time, when the server load is low, the intelligent control system can intelligently reduce the power output of the cooling plate 3, the first fan module 22 and the second fan module 42, which not only effectively reduces the equipment operation noise, but also reduces unnecessary energy consumption, achieving the improvement of heat dissipation efficiency and ensuring system stability while taking into account the environmental protection needs of energy saving and emission reduction.

[0051] In a specific implementation, multiple temperature sensors are provided inside the server, and the multiple temperature sensors are connected to the control system and transmit temperature data to the control system. The control system adjusts the power of the cooling plate 3, the first fan module 22 and the second fan module 42 in real time according to the temperature data.

[0052] Specifically, a temperature sensor is provided at the air inlet in front of the server to detect the inlet air temperature of the server; two temperature sensors are provided in front and behind the central processing unit (CPU); three temperature sensors are distributed on the left, middle and right sides of the motherboard to monitor the internal temperature of the system, and a temperature sensor is provided in front of the power supply (PSU).

[0053] Preferably, two temperature sensors are provided on both sides of the first heat dissipation component 2 along the first direction, respectively, for monitoring the air inlet temperature of the first heat dissipation component 2 and the air flow temperature after cooling.

[0054] In one embodiment, the cooling fins 3 are provided with one or more. When the cooling fins 3 are provided with one, the cooling fins 3 are arranged on a side wall of the server chassis 1 along the second direction; the first heat sink 21 is provided with a group and abuts against the cold end of the cooling fin 3; and the first fan module 22 and the first heat sink 21 are arranged in sequence along the first direction; the second heat dissipation assembly 4 is provided with a group and abuts against the hot end of the cooling fin 3; when the cooling fins 3 are provided with two, the two cooling fins 3 are respectively arranged on the two side walls of the server chassis 1 along the second direction; the first heat sink 21 is provided with two groups, and the two groups of the first heat sink 21 abut against the cold ends of the two cooling fins 3 respectively; and the two groups of the first heat sink 21 are arranged at intervals along the second direction or abut against each other; the first fan module 22 and the first heat sink 21 are arranged in sequence along the first direction; the second heat dissipation component 4 is provided with two groups, and the two groups of the second heat dissipation components 4 are respectively abutted against the hot ends of the two cooling fins 3; when the cooling fins 3 are provided in plurality, the two side walls of the server chassis 1 along the second direction are respectively provided with one or more cooling fins 3, and the plurality of cooling fins 3 are arranged at intervals along the first direction; the first heat sink 21 is provided with a plurality of groups, and the cold end of each cooling fin 3 abuts against a group of the first heat sink 21; the first fan module 22 is located between two adjacent groups of the first heat sink 21 arranged along the first direction; the second heat dissipation component 4 is provided with a plurality of groups, and the hot end of each cooling fin 3 abuts against a group of the second heat sink 4.

[0055] By setting one or more cooling fins 3, and the positional relationship between different numbers of cooling fins 3 and the first heat dissipation component 2 and the second heat dissipation component 4, the modularity and scalability of the heat dissipation structure are achieved, the flexibility and versatility of the heat dissipation structure are improved, and it is ensured that the heat dissipation structure can effectively serve servers with different specifications, configurations and performance requirements.

[0056] In a specific embodiment, the two side walls of the server chassis 1 along the second direction are provided with multiple mounting holes 11, and each mounting hole 11 is suitable for installing a cooling fin 3; and the number of mounting holes 11 is greater than or equal to the number of cooling fins 3. The number of cooling fins 3 is adjusted according to the actual needs of the server to achieve instant optimization of the heat dissipation capacity and realize dynamic adjustment capability of the heat dissipation structure.

[0057] In one implementation of this embodiment, Figure 1As shown, a cooling fin 3 is provided, and a cooling fin 3 is provided on a side wall of the server chassis 1 along the second direction, a first heat sink 21 and a second heat sink assembly 4 are each provided with a group and are correspondingly connected to the cooling fin 3; and the first fan module 22 and the first heat sink 21 are sequentially provided along the first direction; the problem of excessively high local temperature inside the server chassis 1 can be solved. Specifically, the first heat sink 21 is provided on the side where the air inlet of the first fan module 22 is located; or the first heat sink 21 is provided on the side where the air outlet of the first fan module 22 is located.

[0058] In the second implementation of this embodiment, Figure 4 As shown, there are two cooling fins 3, which are arranged on two side walls of the server chassis 1 along the second direction, and two first heat sinks 21 connected to the two cooling fins 3 are arranged at intervals, and a sufficient space distance is maintained between the two first heat sinks 21 to ensure that they do not interfere with each other during operation; and the performance degradation problem caused by heat conduction or airflow interference is avoided. Specifically, the first heat sink 21 is arranged on the side where the air inlet of the first fan module 22 is located; or the first heat sink 21 is arranged on the side where the air outlet of the first fan module 22 is located.

[0059] In the third implementation of this embodiment, Figure 5 As shown, there are two cooling fins 3, which are relatively arranged on the two side walls of the server chassis 1 along the second direction, and the two first heat sinks 21 respectively connected to the two cooling fins 3 are mutually abutted. Specifically, the two first heat sinks 21 are an integral structure, and the two relatively arranged cooling fins 3 are connected in series. The two relatively arranged cooling fins 3 operate simultaneously to provide cold sources. The integral structure formed by the two first heat sinks 21 can significantly expand the heat dissipation area, achieve large-area and high-efficiency reduction of the air flow temperature flowing to the rear functional module, and improve the overall heat dissipation efficiency. Specifically, the first heat sink 21 is arranged on the side where the air inlet of the first fan module 22 is located; or the first heat sink 21 is arranged on the side where the air outlet of the first fan module 22 is located.

[0060] In the fourth implementation of this embodiment, Figure 6 As shown, four cooling fins 3 are provided, two of which are located on the side where the air inlet of the first fan module 22 is located, and are relatively arranged on the two side walls of the server chassis 1 along the second direction; the other two cooling fins 3 are located on the side where the air outlet of the first fan module 22 is located, and are relatively arranged on the two side walls of the server chassis 1 along the second direction, achieving a significant effect of significantly cooling the air flow temperature flowing to the rear functional module. Specifically, the air inlet and the air outlet of the first fan module 22 are both provided with a first heat sink 21.

[0061] In a specific implementation, the first fan module 22 extends along the second direction, and two ends thereof are respectively connected to two side walls of the server chassis 1 along the second direction.

[0062] In a specific implementation, for servers of different heights, cooling plates 3, first heat dissipation components 2 and second heat dissipation components 4 of different sizes can be used.

[0063] According to an embodiment of the present invention, on the other hand, a data center is provided, comprising a cabinet and the above-mentioned server, wherein the above-mentioned server is slidably connected in the cabinet.

[0064] In one embodiment, it also includes a sliding structure 5 and a heat dissipation rail 6; the server chassis 1 is slidably connected to the cabinet through the sliding structure 5; the heat dissipation rail 6 and the sliding structure 5 are sequentially arranged along a third direction and are fixedly connected to the cabinet; the third direction is perpendicular to the first direction and the second direction in pairs; the second heat dissipation component 4 of the server is fixedly connected to the heat dissipation rail 6.

[0065] By arranging the heat dissipation rail 6 above the sliding structure 5, on the one hand, efficient heat conduction is promoted, and the heat accumulation problem of the server system when running at high load is effectively alleviated; on the other hand, the heat dissipation rail 6 is used as the installation base of the second heat dissipation component 4, so that the second heat dissipation component 4 is stably installed, and the utilization efficiency of the space above the sliding structure 5 is improved, and the space that may have been idle is converted into a functional heat dissipation area, thereby optimizing the spatial layout.

[0066] In one embodiment, a spring terminal is further included, and the second heat dissipation component 4 is electrically connected to the server through the spring terminal.

[0067] The electrical connection between the second heat dissipation component 4 and the server is achieved through spring terminals. Since the spring terminals are elastic, the electrical connection between the second heat dissipation component 4 and the server can maintain a high degree of stability even during dynamic operations such as moving, pulling out or adjusting the server, effectively avoiding the loosening or disconnection problems that are prone to occur in traditional fixed connection methods in dynamic environments. The continuous effectiveness of the electrical connection can be maintained without complicated disassembly and assembly steps, which not only greatly improves the maintenance convenience and operating efficiency of the server, reduces the workload and time cost of maintenance personnel, but also significantly reduces the risk of failures such as poor electrical connection and short circuit caused by the disassembly and assembly process, further enhancing the overall reliability and stability of the server.

[0068] In a specific embodiment, two columns are respectively provided on both sides of the cabinet along the second direction, and the two columns on each side are spaced apart along the first direction, and the server is fixedly connected to the columns. The heat dissipation rail 6 includes a mounting plate 61 and two connecting plates 62, which are arranged between the two columns on one side of the cabinet along the second direction and are suitable for abutting against the outer wall of the server chassis 1; the two connecting plates 62 are located on the side of the mounting plate 61 away from the server chassis 1, protrudingly arranged on the mounting plate 61, and are respectively fixedly connected to the two columns on one side of the cabinet along the second direction, and the second heat dissipation assembly 4 is arranged on the side of the mounting plate 61 away from the server chassis 1.

[0069] In a specific embodiment, a plurality of through holes 611 are provided on the mounting plate 61, each of the through holes 611 is arranged corresponding to a mounting hole 11, and the second thermal pad 43 can be arranged in the through hole 611, ensuring that when the server is installed in place, the cooling plate 3 can be abutted against the second heat sink 41 through the second thermal pad 43.

[0070] In a specific implementation, a first fan power connector 7 is provided on the side wall of the server chassis, and the first fan power connector 7 is electrically connected to the server mainboard; a second fan power connector 8 is provided on the mounting plate 61, and the second fan module 42 is electrically connected to the second fan power connector 8, and both ends of the spring terminal are respectively connected to the first fan power connector 7 and the second fan power connector 8.

[0071] Preferably, when the server is installed in place in the cabinet, the first fan power connector 7 is located on the side of the second fan power connector 8 close to the cabinet opening. During the process of pulling out the server, the connection stability between the spring terminal and the first fan power connector 7 or the second fan power connector 8 is also ensured, thereby avoiding problems such as poor contact, signal interruption or physical damage that may be caused by rotation of the connection direction.

[0072] Preferably, a first long groove is provided on the outer wall of the server chassis 1, and the first long groove extends along the first direction to the tail of the server chassis 1 and corresponds to the position of the heat dissipation rail 6. The first fan power connector 7 is arranged in the first long groove, providing a smooth movement channel for the spring terminal; during dynamic operations such as moving, pulling out or adjusting the server, the spring terminal can stretch freely in the first long groove without hindrance, avoiding dragging and wear of the spring terminal between the heat dissipation rail 6 and the server chassis 1, thereby ensuring the stability and durability of the connection between the spring terminal and the first fan power connector 7 and the second fan power connector 8.

[0073] In another embodiment, a second long groove may be provided on the mounting plate 61 of the heat dissipation rail 6, the second long groove is arranged on a side of the mounting plate 61 close to the server chassis 1, the second long groove extends along the first direction to the tail of the cabinet, and the second fan power connector 8 is arranged in the second long groove.

[0074] In another embodiment, a first long groove may be provided on the outer wall of the server chassis 1, the first long groove extends along the first direction to the rear of the server chassis 1 and corresponds to the position of the heat dissipation rail 6; at the same time, a second long groove is provided on the mounting plate 61 of the heat dissipation rail 6, the second long groove is arranged on a side of the mounting plate 61 close to the server chassis 1, and the second long groove extends along the first direction to the rear of the cabinet; the first long groove and the second long groove enclose a receiving space.

[0075] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A server, characterized in that: include: A server chassis (1) is provided with a front function module and a rear function module inside, wherein the front function module and the rear function module are arranged in sequence along a first direction; A first heat dissipation assembly (2) is arranged inside the server chassis (1), comprising a first heat sink (21) and a first fan module (22), wherein the first heat sink (21) and the first fan module (22) are arranged in sequence between the front function module and the rear function module along the first direction; A cooling fin (3) is arranged on a side wall of the server chassis (1) along the second direction, comprising a cold end and a hot end, wherein the cold end abuts against the first heat sink (21); The second direction is perpendicular to the first direction.

2. The server according to claim 1, characterized in that: It also comprises a second heat dissipation component (4), which is arranged on the outside of the server chassis (1) and abuts against the hot end, and is suitable for dissipating heat from the hot end.

3. The server according to claim 2, characterized in that: The second heat dissipation component (4) comprises a second heat sink (41), and the second heat sink (41) is arranged on the outside of the server chassis (1) and abuts against the hot end.

4. The server according to claim 3, characterized in that: The second heat dissipation assembly (4) further comprises a second fan module (42), wherein the second fan module (42) and the second heat dissipation fin (41) are arranged adjacent to each other along the first direction.

5. The server according to claim 4, characterized in that: The air inlet of the second fan module (42) is suitable for being arranged on one side of the cabinet opening.

6. The server according to claim 4, characterized in that: The cooling fin (3), the first fan module (22) and the second fan module (42) are all suitable for being connected to a control system of a server, and the control system controls the power of the cooling fin (3), the first fan module (22) and the second fan module (42) according to temperature data inside the server.

7. The server according to any one of claims 2 to 6, characterized in that: One or more cooling fins (3) are provided. When one cooling fin (3) is provided, the cooling fin (3) is arranged on a side wall of the server chassis (1) along the second direction; a group of first heat sinks (21) are provided and abut against the cold end of the cooling fin (3); and the first fan module (22) and the first heat sink (21) are arranged in sequence along the first direction; a group of second heat dissipation components (4) are provided and abut against the hot end of the cooling fin (3); When two refrigeration fins (3) are provided, the two refrigeration fins (3) are respectively arranged opposite to each other on two side walls of the server chassis (1) along the second direction; two groups of the first heat sink (21) are provided, and the two groups of the first heat sink (21) are respectively abutted against the cold ends of the two refrigeration fins (3); and the two groups of the first heat sink (21) are arranged at intervals or abutted against each other along the second direction; the first fan module (22) and the first heat sink (21) are arranged in sequence along the first direction; two groups of the second heat sink components (4) are provided, and the two groups of the second heat sink components (4) are respectively abutted against the hot ends of the two refrigeration fins (3); When there are multiple cooling fins (3), one or more cooling fins (3) are respectively provided on the two side walls of the server chassis (1) along the second direction, and the multiple cooling fins (3) are arranged at intervals along the first direction; there are multiple groups of first heat sinks (21), and the cold end of each cooling fin (3) abuts against a group of first heat sinks (21); the first fan module (22) is located between two adjacent groups of first heat sinks (21) arranged along the first direction; and there are multiple groups of second heat sink components (4), and the hot end of each cooling fin (3) abuts against a group of second heat sink components (4).

8. A data center, characterized in that: include: Cabinets; The server according to any one of claims 1 to 7 is slidably connected in the cabinet.

9. The data center according to claim 8, characterized in that: Also includes: A sliding structure (5), wherein the server chassis (1) is slidably connected to the cabinet via the sliding structure (5); A heat dissipation rail (6) is arranged in sequence with the sliding structure (5) along a third direction and is fixedly connected to the cabinet; the third direction is perpendicular to the first direction and the second direction in pairs; The second heat dissipation component (4) of the server is fixedly connected to the heat dissipation rail (6).

10. The data center according to claim 9, characterized in that: It also comprises a spring terminal, and the second heat dissipation component (4) is electrically connected to the server via the spring terminal.

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