Packaging method of chip packaging structure based on three-dimensional stacking

Abstract

The invention relates to the technical field of chip packaging, and discloses a packaging method of a chip packaging structure based on three-dimensional stacking, which comprises a workbench, a plurality of hexagonal columns are fixedly connected to one side of the top of the workbench, a top table is fixedly connected to the tops of the hexagonal columns, and a plurality of table legs are fixedly connected to the periphery of the bottom of the workbench. A substrate is placed above a bearing flexible plate, meanwhile, a chip is placed at the bottom of a suction hole plate device for adsorption, a forward and reverse motor is started, the forward and reverse motor drives a threaded column to rotate, the threaded column drives a round shell to descend in the rotating process, the round shell drives a filter hole plate to descend, and the filter hole plate presses down the suction hole plate device in the falling process; the suction hole plate device drives the chips to descend, so that the two chips are in butt joint, the suction hole plate device pressurizes the chips through rotation of the positive and negative motors, epoxy resin between the chips is prevented from generating bubbles, the connection effect between the chips is enhanced, and the finished product quality of the stacked chips is improved.

Description

[0001] This application is a divisional application of application filed on July 12, 2024, with application number 202410933170.9 and invention title "A chip packaging structure and packaging method based on three-dimensional stacking". Technical Field

[0002] This invention relates to the field of chip packaging technology, specifically to a packaging method based on a three-dimensional stacked chip packaging structure. Background Technology

[0003] A chip packaging device based on three-dimensional stacking is typically used to vertically stack and package multiple chips together to improve chip density and performance.

[0004] However, in the existing technology, the stacked chips need to be pressed together during the chip stacking process. The epoxy resin used to bond the two chips during pressing cannot be air-dried and hardened, which will affect the hardening efficiency of the device, making subsequent work unsustainable and reducing the working efficiency of the device. Summary of the Invention

[0005] The purpose of this invention is to provide a packaging method based on a three-dimensional stacked chip packaging structure to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution:

[0007] This invention relates to a chip packaging structure based on three-dimensional stacking, comprising a worktable, a plurality of hexagonal pillars fixedly connected to one side of the top of the worktable, a top platform fixedly connected to the top of the hexagonal pillars, a plurality of table legs fixedly connected to the four sides of the bottom of the worktable, a working groove formed on one side of the top of the worktable, and a lifting packaging mechanism, comprising a forward and reverse motor fixedly connected to the top of the top platform, a threaded post fixedly connected to the output end of the forward and reverse motor, one end of the threaded post penetrating the top platform and extending to the outside of the top platform, a circular shell sleeved and threadedly connected to the outer wall of one end of the threaded post, a pressing block fixedly connected to one side of the outer wall of the circular shell, and a hardening component provided on the inner wall of the circular shell.

[0008] Furthermore, the hardening component includes a circular groove formed on the top of the inner wall of the circular shell. A rotating block is fitted and rotatably connected to the inner wall of the circular groove. A main gear is fixedly connected to one end of the rotating block. Several secondary gears are meshed around the outer wall of the main gear. A fixing rod is fitted and contacts the inner wall of the secondary gear. One end of the fixing rod is fixedly connected to the top of the inner wall of the circular shell.

[0009] Furthermore, a rotating sleeve is fixedly connected to the bottom of the secondary gear, an arc-shaped fan is fitted and fixedly connected to the outer wall of the rotating sleeve, an annular heater is fitted and fixedly connected to the inner wall of the circular shell, a filter plate is fitted and fixedly connected to the bottom end of the inner wall of the circular shell, a first telescopic rod is fixedly connected to both sides of the bottom of the top platform, a suction orifice plate is fixedly connected to the output end of the first telescopic rod, and several vertical grooves are opened on the outer wall of the threaded column, a vertical block is fitted and slidably connected to the inner wall of the vertical groove, and one end of the vertical block is fixedly connected to the inner wall of the main gear.

[0010] Furthermore, the inner wall of the working groove is provided with a clamping assembly, which includes a hexagonal rod fixedly connected to both sides of the bottom of the inner wall of the working groove. A square platform is fixedly connected to the top of the hexagonal rod. Sliding grooves are opened on both sides of the top of the square platform. Square holes are opened at the top two ends of the square platform near the sliding grooves. An air bag is fixedly connected to the side of the working table near the hexagonal column. Air pipes are connected to the bottom ends of both sides of the air bag.

[0011] Furthermore, one end of the trachea is connected to a conversion box, the bottom of which is fixedly connected to the top of the workbench. A first return spring is fixedly connected to one side of the inner wall of the conversion box, and a first moving plate is fixedly connected to one end of the first return spring. A first squeezing rod is fixedly connected to the side of the first moving plate away from the first return spring, and one end of the first squeezing rod passes through the conversion box and extends to the outside of the conversion box.

[0012] Furthermore, a telescopic spring is fixedly connected to one side of the inner wall of the sliding groove, a guide rail housing is fixedly connected to one end of the telescopic spring, a compression spring is fixedly connected to the bottom of the inner wall of the guide rail housing, a lifting plate is fixedly connected to one end of the compression spring, the outer wall of the lifting plate is slidably connected to the inner wall of the guide rail housing, a bent rod is fixedly connected to one side of the lifting plate, and a clamping plate is fixedly connected to the end of the bent rod away from the lifting plate.

[0013] Furthermore, the inner wall of the working groove is provided with an auxiliary component, which includes a cylindrical barrel fixedly connected to the center of the bottom of the inner wall of the working groove. A second telescopic rod is fixedly connected to the bottom of the inner wall of the barrel. A circular plate is sleeved on and contacts the top of the inner wall of the barrel. A vertical rod is fixedly connected to the top of the circular plate.

[0014] Furthermore, one end of the vertical rod passes through the cylindrical barrel and extends to the outside of the square platform. A flexible load-bearing plate is fixedly connected to the top of the vertical rod. Vertical boxes are connected to the bottom ends of both sides of the outer wall of the cylindrical barrel. A second return spring is fixedly connected to the bottom of the inner wall of the vertical box. A second moving plate is fixedly connected to one end of the second return spring. A lifting rod is fixedly connected to the top of the second moving plate. One end of the lifting rod passes through the vertical box and extends to the outside of the vertical box. A triangular blade is fixedly connected to the top of the lifting rod.

[0015] Furthermore, the outer wall of the triangular blade contacts the inner wall of the square hole, and an exhaust pipe is connected to one side of the top of the outer wall of the vertical box. One end of the exhaust pipe passes through the square platform and extends to the outside of the square platform. The end of the exhaust pipe away from the vertical box is connected to a diffuser, and the bottom of the diffuser is fixedly connected to the top of the square platform.

[0016] A packaging method based on a three-dimensional stacked chip packaging structure, the chip packaging method includes the following steps:

[0017] Step 1: Start the forward and reverse motors. The forward and reverse motors drive the threaded column to rotate. During the rotation of the threaded column, the circular shell is driven to descend. The circular shell drives the filter plate to descend. During the descent of the filter plate, it presses down on the suction plate device. The suction plate device drives the chip to descend, thus solving the problem of chip bonding during stacking.

[0018] Step 2: During the descent of the hardening component, the annular heater is activated. The vertical groove opened at the threaded column engages with the inner wall of the sleeved vertical block. As the threaded column rotates, it drives the vertical block to rotate, which in turn drives the connected main gear to rotate. The main gear drives the secondary gear to rotate, which in turn drives the rotating sleeve to rotate. The rotating sleeve drives the arc-shaped fan to rotate. Through the setting of the filter plate and suction plate, the problem of slow hardening process during chip stacking is solved.

[0019] Step 3: The round shell drives the extrusion block to descend. As the extrusion block descends, the first moving plate moves through the airbag, air pipe, conversion box, and first reset spring. The first moving plate drives the first extrusion rod to move. During the movement of the first extrusion rod, the guide rail shell is pushed to move. Through the cooperation of the extrusion spring, lifting plate, bending rod, clamping plate and suction orifice plate, the problem of inaccurate alignment during stacking is solved.

[0020] Step 4: During the process of the chip being pressed down, the chip drives the flexible support plate to fall, the flexible support plate drives the vertical rod to fall, the vertical rod drives the circular plate to move down, the circular plate moves down and generates air pressure. The air pressure, through the setting of the cylindrical barrel, vertical box and second reset spring, causes the second moving plate to move up. The second moving plate drives the lifting rod to move up, the lifting rod drives the triangular blade to rise, and when the second moving plate moves to the top of the vertical box, the setting of exhaust pipe and diffuser solves the problem of slow hardening efficiency.

[0021] The present invention has the following beneficial effects:

[0022] (1) In this invention, the substrate is placed on top of the flexible support plate, and the chip is placed on the bottom of the suction plate for adsorption. The forward and reverse motors are started, and the forward and reverse motors drive the threaded column to rotate. During the rotation of the threaded column, the circular shell is driven to descend. The circular shell drives the filter plate to descend. During the descent of the filter plate, it presses down on the suction plate. The suction plate drives the chip to descend, so that the two chips are connected. Through the rotation of the forward and reverse motors, the suction plate applies pressure to the chip, preventing the epoxy resin between the chips from generating bubbles, strengthening the connection effect between the chips, and improving the quality of the stacked chip product.

[0023] (2) In this invention, during the descent of the hardening component, the annular heater is activated. The annular heater heats the airflow inside the circular shell. The vertical groove opened at the threaded column is engaged with the inner wall of the sleeved vertical block. When the threaded column rotates, it drives the vertical block to rotate. The vertical block drives the connected main gear to rotate. The main gear drives the secondary gear to rotate. The secondary gear drives the rotating sleeve to rotate. The rotating sleeve drives the arc fan to rotate. The arc fan generates airflow. The heated airflow heats the stacked chips during the bonding process through the filter holes of the filter plate and the suction plate, which accelerates the hardening process between the stacked chips and improves the working efficiency of the device.

[0024] (3) In this invention, the round shell drives the extrusion block to descend. During the descent of the extrusion block, the extrusion block extrudes the airbag. The airflow inside the airbag enters the interior of the conversion box through the air pipe. The airflow pushes the first moving plate inside the conversion box. The first moving plate drives the first extrusion rod to move. During the movement of the first extrusion rod, the guide rail shell moves. The two guide rail shells move closer to each other, thereby making the clamping plate in the clamping assembly clamp the chip, which enhances the accuracy of the device when stacking chips. In addition, the suction plate presses down on the clamping plate during the descent of the suction plate. The clamping plate drives the bent rod to descend. The bent rod drives the lifting plate to descend. The lifting plate moves up and down in the groove of the guide rail shell, thereby clamping stacked chips of different layers, which enhances the applicability of the device clamping.

[0025] (4) In this invention, during the pressing process of the chip, the chip drives the flexible support plate to fall, the flexible support plate drives the vertical rod to fall, the vertical rod drives the circular plate to move down, and the circular plate generates air pressure during the downward movement of the circular plate. The airflow in the air pressure enters the interior of the vertical box through the cylindrical barrel. After the airflow enters the interior of the vertical box, the airflow pushes the second moving plate to move up, the second moving plate drives the lifting rod to move up, and the lifting rod drives the triangular blade to rise. During the upward movement of the triangular blade, the epoxy resin leaked out when the chip is squeezed can be cut off, which enhances the aesthetics of the stacked chips. When the second moving plate moves to the top of the vertical box, the airflow enters the interior of the diffuser through the exhaust pipe. The airflow is diffused by the top platform, thereby drying the chip during the stacking process, enhancing the hardening efficiency of the device and improving the working efficiency of the device.

[0026] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the overall side structure of the present invention;

[0029] Figure 2 This is a schematic diagram of the overall side half-section structure of the present invention;

[0030] Figure 3 This is a bottom view of part of the structure of the present invention;

[0031] Figure 4 This is a schematic diagram of a half-section side view of the hardening component of the present invention;

[0032] Figure 5 This is a top view of part of the internal structure of the present invention;

[0033] Figure 6 This is a partial cross-sectional top view of the structure of the present invention;

[0034] Figure 7 For the present invention Figure 2 Enlarged view of A in the middle;

[0035] Figure 8 For the present invention Figure 4 Enlarged view of B in the middle;

[0036] Figure 9 For the present invention Figure 6Enlarged view of C;

[0037] Figure 10 For the present invention Figure 6 Enlarged view of D;

[0038] Figure 11 This is a schematic diagram of the packaging method of the present invention.

[0039] The attached diagram lists the components represented by each number as follows:

[0040] In the diagram: 1. Workbench; 2. Hexagonal column; 3. Top platform; 4. Table leg; 5. Working groove; 6. Lifting and sealing mechanism; 61. Forward and reverse motor; 62. Threaded column; 63. Round shell; 64. Extrusion block; 65. Hardening component; 66. Clamping component; 67. Auxiliary component; 651. Round groove; 652. Rotating block; 653. Main gear; 654. Secondary gear; 655. Fixed rod; 656. Rotating sleeve; 657. Arc fan; 658. Annular heater; 659. Filter plate; 6510. First telescopic rod; 6512. Suction orifice plate device; 661. Hexagonal rod; 662. Square platform; 663. Sliding groove; 664. Square hole; 665. Air 666. Bag; 667. Trachea; 668. Conversion box; 669. First return spring; 6610. First moving plate; 6611. First compression rod; 6612. Telescopic spring; 6613. Guide rail housing; 6614. Compression spring; 6615. Lifting plate; 6616. Bent rod; 671. Clamping plate; 672. Cylinder; 673. Second telescopic rod; 674. Circular plate; 675. Vertical rod; 676. Bearing flexible plate; 677. Vertical box; 678. Second return spring; 679. Second moving plate; 6710. Lifting rod; 6711. Triangular blade; 6712. Exhaust pipe; 6713. Diffuser; 6514. Vertical groove; 6515. Vertical block. Detailed Implementation

[0041] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0042] Example 1, please refer to Figures 1-11 As shown, the present invention is a chip packaging structure based on three-dimensional stacking, including a workbench 1, a plurality of hexagonal pillars 2 are fixedly connected to one side of the top of the workbench 1, the purpose of which is to enhance the fixing effect, a top platform 3 is fixedly connected to the top of the hexagonal pillars 2, a plurality of table legs 4 are fixedly connected to the bottom of the workbench 1, and a working groove 5 is opened on one side of the top of the workbench 1, and also includes;

[0043] The lifting and packaging mechanism 6 includes a forward and reverse motor 61 fixedly connected to the top of the top platform 3. The output end of the forward and reverse motor 61 is fixedly connected to a threaded post 62. One end of the threaded post 62 passes through the top platform 3 and extends to the outside of the top platform 3. A circular shell 63 is sleeved on and threadedly connected to the outer wall of one end of the threaded post 62. A pressing block 64 is fixedly connected to one side of the outer wall of the circular shell 63. A hardening component 65 is provided on the inner wall of the circular shell 63.

[0044] The hardening component 65 includes a circular groove 651 formed on the top of the inner wall of the circular shell 63. A rotating block 652 is fitted and rotatably connected to the inner wall of the circular groove 651. This is designed to prevent the main gear 653 from falling off. One end of the rotating block 652 is fixedly connected to the main gear 653. Several secondary gears 654 are meshed around the outer wall of the main gear 653. A fixing rod 655 is fitted and contacts the inner wall of the secondary gears 654. This is designed to prevent the secondary gears 654 from falling off. One end of the fixing rod 655 is fixedly connected to the top of the inner wall of the circular shell 63.

[0045] A rotating sleeve 656 is fixedly connected to the bottom of the secondary gear 654. An arc-shaped fan 657 is fitted and fixedly connected to the outer wall of the rotating sleeve 656. An annular heater 658 is fitted and fixedly connected to the inner wall of the circular shell 63. A filter plate 659 is fitted and fixedly connected to the bottom end of the inner wall of the circular shell 63. First telescopic rods 6510 are fixedly connected to both sides of the bottom of the top platform 3. The purpose of this arrangement is to extend and retract with the lifting and lowering of the suction orifice plate device 6512. The first telescopic rod 6510 itself does not have an automatic extension and retraction function. The output end of the first telescopic rod 6510 is fixedly connected to the suction orifice plate device 6512. The purpose of this arrangement is to adsorb the chip. Several vertical grooves 6514 are opened on the outer wall of the threaded column 62. A vertical block 6515 is fitted and slidably connected to the inner wall of the vertical groove 6514. One end of the vertical block 6515 is fixedly connected to the inner wall of the main gear 653. It should be noted that (see Figure 4 The first telescopic rod 6510 includes a telescopic base and a telescopic core rod, with the telescopic core rod slidably disposed inside the telescopic base.

[0046] The substrate is placed above the flexible support plate 676, and the chip is placed at the bottom of the suction plate 6512 for adsorption. The forward and reverse motor 61 is activated, which drives the threaded column 62 to rotate. During the rotation of the threaded column 62, the circular shell 63 is lowered, and the circular shell 63 drives the filter plate 659 to descend. During the descent of the filter plate 659, it presses down on the suction plate 6512, which in turn drives the chip to descend, allowing the two chips to dock. The rotation of the forward and reverse motor 61 and the pressure applied by the suction plate 6512 to the chip prevent the formation of air bubbles in the epoxy resin between the chips, strengthen the connection between the chips, and improve the quality of the stacked chip product. It should be noted that the suction plate 6512 is an existing device with holes and adsorption force.

[0047] During the descent of the hardening component 65, the annular heater 658 is activated, which heats the airflow inside the circular shell 63. The vertical groove 6514 at the threaded column 62 engages with the inner wall of the sleeved vertical block 6515. As the threaded column 62 rotates, it drives the vertical block 6515 to rotate, which in turn drives the connected main gear 653 to rotate. The main gear 653 drives the secondary gear 654 to rotate, which in turn drives the rotating sleeve 656 to rotate. The rotating sleeve 656 drives the arc fan 657 to rotate, which generates airflow. The heated airflow passes through the filter holes of the filter plate 659 and the suction plate 6512 to heat the stacked chips during the bonding process, accelerating the hardening process between the stacked chips and improving the working efficiency of the device.

[0048] In Example 2, the inner wall of the working groove 5 is provided with a clamping assembly 66. The clamping assembly 66 includes a hexagonal rod 661 fixedly connected to both sides of the bottom of the inner wall of the working groove 5. A square platform 662 is fixedly connected to the top of the hexagonal rod 661. Sliding grooves 663 are respectively opened on both sides of the top of the square platform 662. Square holes 664 are respectively opened at the top two ends of the square platform 662 near the sliding grooves 663. An airbag 665 is fixedly connected to the side of the worktable 1 near the hexagonal column 2. Air pipes 666 are respectively connected to the bottom ends of both sides of the airbag 665.

[0049] One end of the trachea 666 is connected to a conversion box 667. The bottom of the conversion box 667 is fixedly connected to the top of the workbench 1. A first reset spring 668 is fixedly connected to one side of the inner wall of the conversion box 667. The purpose of this arrangement is to facilitate reset. One end of the first reset spring 668 is fixedly connected to a first moving plate 669. A first pressing rod 6610 is fixedly connected to the side of the first moving plate 669 away from the first reset spring 668. One end of the first pressing rod 6610 passes through the conversion box 667 and extends to the outside of the conversion box 667.

[0050] A telescopic spring 6611 is fixedly connected to one side of the inner wall of the sliding groove 663. One end of the telescopic spring 6611 is fixedly connected to the guide rail housing 6612. A compression spring 6613 is fixedly connected to the bottom of the inner wall of the guide rail housing 6612. One end of the compression spring 6613 is fixedly connected to the lifting plate 6614. The outer wall of the lifting plate 6614 is slidably connected to the inner wall of the guide rail housing 6612. A bent rod 6615 is fixedly connected to one side of the lifting plate 6614. A clamping plate 6616 is fixedly connected to the end of the bent rod 6615 away from the lifting plate 6614.

[0051] An auxiliary component 67 is provided on the inner wall of the working groove 5. The auxiliary component 67 includes a cylindrical barrel 671 fixedly connected to the center of the bottom of the inner wall of the working groove 5. A second telescopic rod 672 is fixedly connected to the bottom of the inner wall of the cylindrical barrel 671. It should be noted that, compared with the first telescopic rod 6510, the second telescopic rod 672 also includes a telescopic base and a telescopic core rod. The telescopic core rod is slidably disposed inside the telescopic base. At the same time, a spring is provided between the telescopic base and the telescopic core rod to realize the adjustment of the distance between the telescopic base and the telescopic core rod. A circular plate 6714 is sleeved on and contacts the top of the inner wall of the cylindrical barrel 671. A vertical rod 675 is fixedly connected to the top of the circular plate 6714.

[0052] One end of the vertical rod 675 passes through the cylindrical barrel 671 and extends to the outside of the square platform 662. A flexible support plate 676 is fixedly connected to the top of the vertical rod 675. This is designed to prevent excessive compression from damaging the chip. The bottom ends of the outer walls of the cylindrical barrel 671 are respectively connected to vertical boxes 677. A second reset spring 678 is fixedly connected to the bottom of the inner wall of the vertical box 677. One end of the second reset spring 678 is fixedly connected to a second moving plate 679. A lifting rod 6710 is fixedly connected to the top of the second moving plate 679. One end of the lifting rod 6710 passes through the vertical box 677 and extends to the outside of the vertical box 677. A triangular blade 6711 is fixedly connected to the top of the lifting rod 6710. This is designed to facilitate extension outward from the square hole 664.

[0053] The outer wall of the triangular blade 6711 contacts the inner wall of the square hole 664. The top side of the outer wall of the vertical box 677 is connected to an exhaust pipe 6712. One end of the exhaust pipe 6712 passes through the square platform 662 and extends to the outside of the square platform 662. The end of the exhaust pipe 6712 away from the vertical box 677 is connected to a diffuser 6713. The purpose of this arrangement is to diffuse the airflow. The bottom of the diffuser 6713 is fixedly connected to the top of the square platform 662.

[0054] In use, the circular shell 63 drives the compression block 64 to descend. During its descent, the compression block 64 compresses the airbag 665. The airflow inside the airbag 665 enters the conversion box 667 through the air pipe 666. The airflow pushes the first moving plate 669 inside the conversion box 667, which in turn moves the first compression rod 6610. During its movement, the first compression rod 6610 pushes the guide rail shell 6612 to move, causing the two guide rail shells 6612 to move closer together. The clamping plate 6616 in the clamping assembly 66 clamps the chip, enhancing the accuracy of the device when stacking chips. During the descent of the suction plate 6512, the clamping plate 6616 is pressed down, and the clamping plate 6616 drives the bent rod 6615 to descend. The bent rod 6615 drives the lifting plate 6614 to descend. The lifting plate 6614 moves up and down in the groove of the guide rail housing 6612, thereby enabling the clamping of stacked chips with different layers and enhancing the applicability of the device.

[0055] During the chip compression process, the chip drives the flexible support plate 676 to fall, which in turn drives the vertical rod 675 to fall. The vertical rod 675 then drives the circular plate 6714 to move downwards. During the downward movement of the circular plate 6714, air pressure is generated. The airflow in the air pressure enters the interior of the vertical box 677 through the cylindrical barrel 671. After entering the interior of the vertical box 677, the airflow pushes the second moving plate 679 to move upwards. The second moving plate 679 drives the lifting rod 6710 to move upwards, which in turn drives the triangular blade 6711 to rise. During the upward movement of the triangular blade 6711, it can cut off the epoxy resin that leaks out during chip compression, enhancing the aesthetics of the stacked chips. When the second moving plate 679 moves to the top of the vertical box 677, the airflow enters the interior of the diffuser 6713 through the exhaust pipe 6712. The airflow is diffused by the top platform 371, thereby drying the chips during the stacking process, enhancing the hardening efficiency of the device, and improving the working efficiency of the device.

[0056] A packaging method based on a three-dimensional stacked chip packaging structure includes the following steps:

[0057] Step 1: Start the forward and reverse motor 61. The forward and reverse motor 61 drives the threaded column 62 to rotate. During the rotation of the threaded column 62, the circular shell 63 is driven to descend. The circular shell 63 drives the filter plate 659 to descend. During the descent of the filter plate 659, it presses down on the suction plate device 6512. The suction plate device 6512 drives the chip to descend, thereby solving the problem of bonding stacked chips.

[0058] Step 2: During the descent of the hardening component 65, the annular heater 658 is activated. The vertical groove 6514 at the threaded column 62 engages with the inner wall of the sleeved vertical block 6515. As the threaded column 62 rotates, it drives the vertical block 6515 to rotate. The vertical block 6515 drives the connected main gear 653 to rotate. The main gear 653 drives the secondary gear 654 to rotate. The secondary gear 654 drives the rotating sleeve 656 to rotate. The rotating sleeve 656 drives the arc-shaped fan 657 to rotate. Through the setting of the filter plate 659 and the suction plate device 6512, the problem of slow hardening process during chip stacking is solved.

[0059] Step 3: The circular shell 63 drives the compression block 64 to descend. As the compression block 64 descends, the first moving plate 669 moves due to the arrangement of the airbag 665, air pipe 666, conversion box 667, and first reset spring 668. The first moving plate 669 drives the first compression rod 6610 to move. During the movement of the first compression rod 6610, it pushes the guide rail shell 6612 to move. Through the cooperation of the compression spring 6613, lifting plate 6614, bending rod 6615, clamping plate 6616 and suction orifice plate device 6512, the problem of inaccurate alignment during stacking is solved.

[0060] Step 4: During the chip pressing process, the chip drives the flexible support plate 676 to fall, the flexible support plate 676 drives the vertical rod 675 to fall, the vertical rod 675 drives the circular plate 6714 to move downward, the circular plate 6714 moves downward, generating air pressure. The air pressure, through the setting of the circular barrel 671, the vertical box 677, and the second reset spring 678, causes the second moving plate 679 to move upward. The second moving plate 679 drives the lifting rod 6710 to move upward, the lifting rod 6710 drives the triangular blade 6711 to rise, and when the second moving plate 679 moves to the top of the vertical box 677, the problem of slow hardening efficiency is solved by the setting of the exhaust pipe 6712 and the diffuser 6713.

[0061] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A packaging method based on a three-dimensional stacked chip packaging structure, characterized in that: The steps include: Step 1: starting the forward and reverse motor (61), the forward and reverse motor (61) drives the threaded column (62) to rotate, the threaded column (62) drives the round shell (63) to descend during the rotation, the round shell (63) drives the filter plate (659) to descend, the filter plate (659) presses down the suction orifice plate device (6512) during the falling process, and the suction orifice plate device (6512) drives the chip to descend; Step 2: When the hardening assembly (65) descends, the annular heater (658) is started, and the vertical groove (6514) provided at the threaded column (62) is engaged with the inner wall of the sleeved vertical block (6515). When the threaded column (62) rotates, the vertical block (6515) is driven to rotate, and the vertical block (6515) drives the connected main gear (653) to rotate, and the main gear (653) drives the secondary gear (654) to rotate, and the secondary gear (654) drives the rotating sleeve (656) to rotate, and the rotating sleeve (656) drives the arc fan (657) to rotate; Step 3: The round shell (63) drives the extrusion block (64) to descend, and the extrusion block (64) descends. Through the arrangement of the air bag (665), the air pipe (666), the conversion box (667), and the first return spring (668), the first movable plate (669) moves, and the first movable plate (669) drives the first extrusion rod (6610) to move. During the movement of the first extrusion rod (6610), the guide rail shell (6612) is pushed to move; Step 4: When the chip is pressed down, the chip drives the flexible bearing plate (676) to fall, the flexible bearing plate (676) drives the vertical rod (675) to fall, the vertical rod (675) drives the circular plate (6714) to move downward, the circular plate (6714) moves downward, and air pressure is generated. The air pressure passes through the barrel (671), the vertical box (677), and the second return spring (678), and the second movable plate (679) moves upward. The second movable plate (679) drives the lifting rod (6710) to move upward, and the lifting rod (6710) drives the triangular blade (6711) to rise, and the second movable plate (679) moves to the top of the vertical box (677); Device for implementing the above method: A chip packaging structure based on three-dimensional stacking comprises a workbench (1), a plurality of hexagonal columns (2) are fixedly connected to one side of the top of the workbench (1), a top platform (3) is fixedly connected to the top of the hexagonal columns (2), a plurality of table legs (4) are fixedly connected to the four sides of the bottom of the workbench (1), a working groove (5) is provided on one side of the top of the workbench (1), and further comprises: A lifting and packaging mechanism (6), the lifting and packaging mechanism (6) comprises a forward and reverse motor (61) fixedly connected to the top of the top platform (3), the output end of the forward and reverse motor (61) is fixedly connected to a threaded column (62), one end of the threaded column (62) passes through the top platform (3) and extends to the outside of the top platform (3), one end of the threaded column (62) is sleeved on the outer wall and threadedly connected to a round shell (63), one side of the outer wall of the round shell (63) is fixedly connected to an extrusion block (64), and the inner wall of the round shell (63) is provided with a hardening component (65).

2. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 1, characterized in that: The hardening component (65) comprises a circular groove (651) provided on the top of the inner wall of the circular shell (63); a rotating block (652) is sleeved on the inner wall of the circular groove (651) and rotatably connected; one end of the rotating block (652) is fixedly connected to a main gear (653); a plurality of secondary gears (654) are meshedly connected around the outer wall of the main gear (653); a fixing rod (655) is sleeved on the inner wall of the secondary gear (654) and contacts the fixing rod (655); one end of the fixing rod (655) is fixedly connected to the top of the inner wall of the circular shell (63).

3. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 2, characterized in that: The bottom of the secondary gear (654) is fixedly connected with a rotating sleeve (656), the outer wall of the rotating sleeve (656) is sleeved with and fixedly connected with an arc fan (657), the inner wall of the circular shell (63) is sleeved with and fixedly connected with an annular heater (658), the bottom end of the inner wall of the circular shell (63) is sleeved with and fixedly connected with a filter plate (659), the bottom two sides of the bottom of the top platform (3) are respectively fixedly connected with a first telescopic rod (6510), the output end of the first telescopic rod (6510) is fixedly connected with a suction orifice plate (6512), the outer wall of the threaded column (62) is respectively provided with a plurality of vertical grooves (6514), the inner wall of the vertical groove (6514) is sleeved with and slidably connected with a vertical block (6515), one end of the vertical block (6515) is fixedly connected to the inner wall of the main gear (653).

4. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 3, characterized in that: The inner wall of the working groove (5) is provided with a clamping assembly (66), and the clamping assembly (66) comprises a hexagonal rod (661) fixedly connected to both sides of the bottom of the inner wall of the working groove (5); the top of the hexagonal rod (661) is fixedly connected to a square platform (662); the top of the square platform (662) is provided with sliding grooves (663) on both sides; the top ends of the square platform (662) close to the sliding grooves (663) are respectively provided with square holes (664); the side of the working platform (1) close to the hexagonal column (2) is fixedly connected to an air bag (665); the bottom ends of both sides of the air bag (665) are respectively connected to air pipes (666).

5. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 4, characterized in that: One end of the air pipe (666) is connected to a conversion box (667), the bottom of the conversion box (667) is fixedly connected to the top of the workbench (1), one side of the inner wall of the conversion box (667) is fixedly connected to a first return spring (668), one end of the first return spring (668) is fixedly connected to a first movable plate (669), and the side of the first movable plate (669) away from the first return spring (668) is fixedly connected to a first extrusion rod (6610), and one end of the first extrusion rod (6610) passes through the conversion box (667) and extends to the outside of the conversion box (667).

6. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 5, characterized in that: A telescopic spring (6611) is fixedly connected to one side of the inner wall of the sliding groove (663), one end of the telescopic spring (6611) is fixedly connected to the guide rail shell (6612), an extrusion spring (6613) is fixedly connected to the bottom of the inner wall of the guide rail shell (6612), one end of the extrusion spring (6613) is fixedly connected to a lifting plate (6614), the outer wall of the lifting plate (6614) is slidably connected to the inner wall of the guide rail shell (6612), one side of the lifting plate (6614) is fixedly connected to a bent rod (6615), and one end of the bent rod (6615) away from the lifting plate (6614) is fixedly connected to a clamping plate (6616).

7. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 6, characterized in that: The inner wall of the working groove (5) is provided with an auxiliary component (67), and the auxiliary component (67) comprises a round barrel (671) fixedly connected to the center of the bottom of the inner wall of the working groove (5), a second telescopic rod (672) is fixedly connected to the bottom of the inner wall of the round barrel (671), a round plate (6714) is sleeved on and in contact with the top of the inner wall of the round barrel (671), and a vertical rod (675) is fixedly connected to the top of the round plate (6714).

8. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 7, characterized in that: One end of the vertical rod (675) passes through the barrel (671) and extends to the outside of the square platform (662); the top of the vertical rod (675) is fixedly connected to a load-bearing flexible plate (676); the bottom ends of both sides of the outer wall of the barrel (671) are respectively connected to vertical boxes (677); the bottom of the inner wall of the vertical box (677) is fixedly connected to a second return spring (678); one end of the second return spring (678) is fixedly connected to a second movable plate (679); the top of the second movable plate (679) is fixedly connected to a lifting rod (6710); one end of the lifting rod (6710) passes through the vertical box (677) and extends to the outside of the vertical box (677); the top of the lifting rod (6710) is fixedly connected to a triangular blade (6711).

9. The packaging method of a chip packaging structure based on three-dimensional stacking according to claim 8, characterized in that: The outer wall of the triangular blade (6711) contacts the inner wall of the square hole (664); one side of the top end of the outer wall of the vertical box (677) is connected to an exhaust pipe (6712); one end of the exhaust pipe (6712) passes through the square platform (662) and extends to the outside of the square platform (662); one end of the exhaust pipe (6712) away from the vertical box (677) is connected to a diffuser (6713); the bottom of the diffuser (6713) is fixedly connected to the top of the square platform (662).

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